WO2011102535A1 - Substrat céramique ainsi que module de circuit électrique, et procédé de fabrication de ceux-ci - Google Patents

Substrat céramique ainsi que module de circuit électrique, et procédé de fabrication de ceux-ci Download PDF

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Publication number
WO2011102535A1
WO2011102535A1 PCT/JP2011/053885 JP2011053885W WO2011102535A1 WO 2011102535 A1 WO2011102535 A1 WO 2011102535A1 JP 2011053885 W JP2011053885 W JP 2011053885W WO 2011102535 A1 WO2011102535 A1 WO 2011102535A1
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WIPO (PCT)
Prior art keywords
via hole
ceramic substrate
green sheet
machining
laminate
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PCT/JP2011/053885
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English (en)
Japanese (ja)
Inventor
絵美 森田
森田　敏文
元紀 庄田
裕史 岡田
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パナソニック株式会社
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Publication of WO2011102535A1 publication Critical patent/WO2011102535A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • the present invention relates to a ceramic substrate, an electric circuit module using the ceramic substrate, and a manufacturing method thereof. More specifically, the present invention relates to a ceramic substrate composed of a laminated fired body of green sheets and an electric circuit module using the same, and also relates to a method of manufacturing the ceramic substrate and the electric circuit module.
  • the ceramic substrate is excellent in heat resistance and moisture resistance, and may have good frequency characteristics in a high frequency circuit. Accordingly, the ceramic substrate is used as an RF (Radio Frequency) module of a mobile device, a substrate for a power LED (Light Emitting Diode) utilizing heat dissipation, and a substrate for an LED for a liquid crystal backlight. It is also used as a substrate for electronic equipment on which electronic components are mounted with high density.
  • RF Radio Frequency
  • Such a ceramic substrate can be obtained by laminating and firing a plurality of green sheets.
  • the ceramic substrate is provided with a via, and the via is formed by filling a via hole formed in a green sheet forming a laminated body with a conductive paste.
  • the via hole is a hole formed using a laser. That is, the conventional via hole is formed by irradiating the green sheet with laser light and melting and burning the green sheet component by the heat generated at that time (see International Publication No. 2008/111408).
  • the conventional via hole is formed by irradiating the green sheet with laser light and melting and burning the green sheet component by the heat generated at that time (see International Publication No. 2008/111408).
  • vias have become denser with the downsizing and higher performance of electronic equipment and can be processed finely at high speed without contact, so the use of laser light is the mainstream for forming via holes. .
  • the main object of the present invention is to provide a ceramic substrate that can suitably cope with the problem of the above-mentioned connection failure, thereby improving the yield at the time of manufacturing an electric circuit module including the ceramic substrate. is there.
  • At least one has a fired body formed by firing a laminate of a plurality of green sheets having via holes, and a via formed by filling a via hole with a conductive material,
  • a ceramic substrate is provided in which the via hole in the outermost green sheet on which the mounting electrode is provided is a “via hole formed by machining” with respect to the laminate.
  • a via hole is formed by machining in the outermost green sheet on which the mounting electrode is provided among the plurality of green sheets of the laminate forming the fired body.
  • via holes formed by machining are also referred to as “machined via holes” or “machined holes”).
  • the via located in the outermost layer is “a via formed by filling a machining hole with a conductive material”.
  • the “outermost layer green sheet” substantially means the outermost green sheet in a laminate obtained by stacking a plurality of green sheets.
  • the green sheet corresponding to the uppermost layer and / or the lowermost layer corresponds to the “outermost layer”.
  • the ceramic substrate of the present invention further includes an electrode provided on the fired body so as to be in contact with the via located in the outermost layer.
  • the via hole formed by machining has a constant width dimension along the thickness direction. That is, the cross section of the machined hole (hole cross section cut by a plane parallel to the thickness direction of the via hole) has a rectangular shape or a square shape. This means that the width dimension of a via formed by filling a machined hole with a conductive material is constant along the thickness direction, and therefore the cross-section of such via (via The via cross-section cut by a plane parallel to the thickness direction also means having a rectangular shape or a square shape.
  • the via hole in the green sheet other than the outermost layer green sheet is a via hole formed by laser processing (hereinafter referred to as “laser processed via hole” or Also called “laser machining hole”. That is, via holes of green sheets other than the corresponding green sheets of the uppermost layer and / or the lowermost layer (that is, green sheets located inside the laminate) are formed by laser processing. For example, only the via hole of the green sheet corresponding to the uppermost layer may be a machined hole, and all other via holes may be laser processed holes.
  • the via hole formed by laser processing can have a taper shape in the thickness direction. That is, the cross section of the laser processed via hole (the hole cross section cut by a plane parallel to the thickness direction of the via hole) has a trapezoidal shape. This means that the via formed in the laser processed via hole has a taper shape in the thickness direction, and therefore, the cross-section of the via (in a plane parallel to the via thickness direction). The cut via cross-section) also has a trapezoidal shape.
  • the present invention also provides an electric circuit module using the above-described ceramic substrate.
  • Such an electric circuit module is A mounting electrode provided on the fired body so as to be in contact with the via of the ceramic substrate, and an electronic component mounted on the mounting electrode via solder.
  • the electric circuit module of the present invention is A fired body formed by firing a laminate of a plurality of green sheets having via holes in at least one sheet; A via formed by filling a via hole with a conductive material, Electrodes provided on the fired body so as to be in contact with the vias, and electronic components mounted on the electrodes (particularly electronic components mounted on the electrodes via solder) Comprising In the laminate, the via hole of the green sheet corresponding to the outermost layer on which the electrode is provided is a via hole formed by machining.
  • One of the features of the electric circuit module according to the present invention is that a via hole is formed by machining in the outermost green sheet on which the mounting electrodes are provided, among the green sheets of the laminate forming the fired body of the ceramic substrate. It is that.
  • the present invention also provides a method for manufacturing the above-described ceramic substrate.
  • a method for producing a ceramic substrate of the present invention comprises: (I) forming a via hole in at least one of the plurality of green sheets; (Ii) filling a via hole with a conductive material, and (iii) forming a laminate by laminating a plurality of green sheets, and subjecting the laminate to firing to obtain a fired body.
  • step (i) a via hole of “a green sheet that is used as the outermost layer of the laminate and is provided with a mounting electrode” is formed by machining.
  • a via hole is formed by machining on the “outermost surface green sheet on which mounting electrodes are provided” among a plurality of green sheets constituting the laminate. It is to be.
  • the mounting electrode is formed on a via hole formed by machining (more specifically, a via formed by filling the machining hole with a conductive material).
  • a punch press is performed as machining. That is, the via hole of the outermost layer green sheet of the laminate is formed by performing punch press processing.
  • the via hole in the green sheet other than the green sheet provided as the outermost layer of the laminate is formed by laser processing. That is, via holes of green sheets other than the corresponding green sheets in the uppermost layer and / or the lowermost layer (green sheets located inside the laminate) are formed by laser processing.
  • the manufacturing method of the electrical circuit module using the ceramic substrate obtained by the above-mentioned manufacturing method is also provided.
  • Such a method of manufacturing an electric circuit module of the present invention includes: (I) forming a mounting electrode on the ceramic fired body so as to be in contact with the via of the ceramic substrate; (II) a step of providing solder on the electrodes of the ceramic substrate, and placing electronic components on the solder; and (III) reflow soldering integrally with the ceramic substrate, the electrical components and the solder interposed therebetween. (Ie, a process of subjecting the ceramic substrate, the electronic component, and the solder interposed therebetween to heat treatment) Comprising.
  • the manufacturing method of the electric circuit module of the present invention is: (I) forming a via hole in at least one of the plurality of green sheets; (Ii) filling a via hole with a conductive material, and (iii) forming a laminated body by laminating a plurality of green sheets, and then subjecting the laminated body to firing to obtain a fired body.
  • step (I) A step of forming an electrode on the fired body so as to be electrically connected to the via
  • step (II) A step of placing an electronic component on the solder after providing the solder on the electrode
  • step (III) In order to perform reflow soldering, the method further includes a step of subjecting the ceramic substrate, the electronic component, and the solder interposed therebetween to a heat treatment, In step (i), a via hole of a green sheet provided as the outermost layer of the laminate is formed by machining, and in step (I), an electrode is formed on the via hole formed by machining (more specifically, The electrode is formed so as to be in contact with “a via formed by filling a machining hole with a conductive material”).
  • One of the features of the method of manufacturing an electric circuit module according to the present invention is that “the outermost green sheet on which mounting electrodes are provided” among a plurality of green sheets constituting a laminate for forming a ceramic substrate.
  • a via hole is formed by machining, and solder is disposed on the via of the machined via hole to perform reflow soldering.
  • a via hole (especially a via hole formed for a via connected to a mounting electrode) in the outermost green sheet of a “laminated body composed of a plurality of green sheets” is a machine. Since it is obtained by machining, “residue generation during via hole formation” due to heat is avoided, and as a result, “all the spaces in the machined via hole are sufficiently filled with the conductive material. A “via” will be obtained. This effectively prevents “voids that can occur inside the solder during the solder reflow process” and, as a result, improves the yield when manufacturing electronic circuit modules by mounting electronic components on a ceramic substrate. To do.
  • the present invention can improve the process yield in the production of a ceramic substrate and, in the production of an electric circuit module using the ceramic substrate, without substantially adversely affecting the tact time in the production of the ceramic substrate. Very beneficial.
  • FIG. 1 is a photographic diagram showing residues (melted residue / combustion residue) generated when a via hole is formed by irradiating a green sheet with laser light.
  • FIG. 2 (FIG. 2) is a photograph showing a phenomenon in which voids are generated in the solder and the solder explodes and scatters.
  • FIG. 3 (FIG. 3) is a schematic cross-sectional view of a laminate for explaining the “outermost layer green sheet”.
  • 4 (FIG. 4) is a perspective view schematically showing an aspect of the ceramic substrate of the present invention.
  • 5 (FIG. 5) is a cross-sectional view schematically showing an aspect of the ceramic substrate of the present invention.
  • Fig. 6 (Fig.
  • FIG. 6 is a schematic view showing a mode of a laser processed via hole (Fig. 6 (a): plan view, Fig. 6 (b): cross section taken along line aa in Fig. 6 (a)).
  • Fig. 7 (Fig. 7) is a schematic diagram showing a mode of a machined via hole (Fig. 7 (a): plan view, Fig. 7 (b): cross section taken along line bb in Fig. 7 (a)).
  • Figure) 8 (FIG. 8) is a schematic cross-sectional view of a green sheet for explaining the via hole dimensions.
  • FIG. 9 (FIG. 9) is a perspective developed view schematically showing an aspect of the green sheet laminate. 10 (FIG.
  • FIG. 11 is a cross-sectional view schematically showing an aspect of the electric circuit module of the present invention.
  • 12 is a photograph showing the form of via holes formed in the green sheet (FIG. 12 (a): laser processed via hole, FIG. 12 (b): machined via hole).
  • 13 is a perspective view and a cross-sectional view schematically showing an aspect of the method for producing a ceramic substrate of the present invention.
  • 14 is a cross-sectional view schematically showing an aspect of the method for manufacturing the electric circuit module of the present invention.
  • 15 (FIG.
  • FIG. 15 is a cross-sectional view schematically showing an aspect of the ceramic substrate (substrate for double-sided mounting) of the present invention.
  • 16 is a perspective view schematically showing only the entire shape of a typical via / via hole of the ceramic substrate of the present invention (FIG. 16 (a): via / via hole in a single-sided mounting substrate.
  • FIG. 16B Overall shape of vias and via holes in a double-sided mounting board).
  • Fig. 17 (Fig. 17) is a photograph showing the results of the effect confirmation test of the present invention (Fig. 17 (a): Comparative Example 1, Fig. 17 (b): Example 1).
  • the ceramic substrate 100 of the present invention includes a fired body 4 and vias 6 formed in the fired body.
  • the fired body 4 of the ceramic substrate is formed by firing a laminate of a plurality of green sheets each having a via hole.
  • the via 6 provided in the fired body 4 is formed by filling the via hole 2 (2A, 2B) of the green sheet with a conductive material.
  • the “green sheet 1B in which via holes 2B are formed by machining” is used on the side on which the mounting electrodes 7 are formed.
  • “green sheet 1A in which via hole 2A is formed by irradiating laser light” is used, and “ceramic sheet 1C having no via hole” is also used as necessary. That is, in the ceramic substrate 100 of the present invention, among the plurality of green sheets (1A, 1B, 1C,...) Of the laminate forming the fired body 4, the outermost layer green sheet (1B) on which the mounting electrode 7 is provided.
  • the via hole (2B) in (1) forms a hole formed by machining.
  • the plurality of green sheets constituting the green sheet laminate are “the outermost layer green sheet 1B having the machined via hole 2B” and “the laser processed via hole 2A”. And at least a combination with the provided internal green sheet 1A ”.
  • FIG. 5 there is one “green sheet 1C without via holes”, six “green sheets 1A with via holes 2A formed by irradiating laser light” thereon, and further, “Green sheet 1B having via hole 2B as a top layer by machining” is formed by sequentially laminating one sheet.
  • the via holes 2A and 2B of each green sheet are filled with a conductive paste, and then the via hole 2B formed by machining is formed on the side where the mounting electrode 7 is formed.
  • a plurality of green sheets (1A, 1B, 1C) are laminated and fired so that "" is positioned.
  • FIG. 6 shows the configuration of a green sheet 1A provided with via holes 2A formed by laser light irradiation
  • FIG. 7 shows the configuration of a green sheet 1B provided with via holes 2B formed by machining.
  • the via hole 2 ⁇ / b> A formed by laser processing can have a taper shape in the hole thickness direction due to the spread angle of the laser beam.
  • the taper angle ⁇ of the via hole 2A having such a tapered shape is approximately 45 ° to 80 °, for example, 50 ° to 70 ° (see FIG. 6). Due to such a taper shape, the cross section of the via hole 2A formed by laser processing (hole cross section cut along a plane parallel to the thickness direction of the via hole) is substantially as shown in FIG. It can have a trapezoidal shape.
  • the via hole 2A has a “tapered shape” / “substantially trapezoidal shape” means that the via 6A formed in the via hole also has a tapered shape in the thickness direction. This means that the cross section of the via (via cross section cut by a plane parallel to the thickness direction of the via) also has a trapezoidal shape.
  • the “via hole 2A formed by laser processing”, that is, the “via 6A” has the following width dimensions (w A1 , w A2 ) and height dimensions (h A ).
  • ⁇ Via hole and via width and height due to laser processing ⁇ w A1 : 80 to 170 ⁇ m (for example, 100 to 150 ⁇ m)
  • ⁇ W A2 110 to 200 ⁇ m (for example, 130 to 180 ⁇ m)
  • ⁇ H A 60 to 350 ⁇ m (for example, 150 to 300 ⁇ m)
  • the via hole 2B formed by machining can have a substantially constant width along the hole thickness direction due to the machining (the inner wall of the via hole and the surface of the green sheet).
  • the angle ⁇ formed by is substantially a right angle ⁇ 90 °). That is, the cross section of the via hole 2B formed by machining (hole cross section cut along a plane parallel to the thickness direction of the via hole) has a substantially rectangular shape or a substantially square shape as shown in FIG. is doing.
  • the via hole 2B having “constant width direction dimension” / “substantially rectangular shape / substantially square shape” means that the width dimension of the via 6B formed in the via hole is also in the via thickness direction.
  • the cross-section of the via via cross-section cut by a plane parallel to the thickness direction of the via
  • the “via hole 2B formed by machining”, that is, the “via 6B” has the following width dimension (w B ) and height dimension (h B ) ranges.
  • w B width dimension
  • h B height dimension
  • FIG. 8B ⁇ Via hole and via width and height due to machining
  • ⁇ w B 80 ⁇ 170 ⁇ m (eg 100 ⁇ 150 ⁇ m)
  • ⁇ H B 60 to 350 ⁇ m (for example, 150 to 300 ⁇ m)
  • the green sheet itself may be a sheet-like member including a ceramic component, a glass component, and an organic binder component.
  • the ceramic component may be alumina powder (average particle size: about 0.5 to 10 ⁇ m)
  • the glass component may be borosilicate glass powder (average particle size: about 1 to 20 ⁇ m).
  • the organic binder component may be at least one component selected from the group consisting of polyvinyl butyral resin, acrylic resin, vinyl acetate copolymer, polyvinyl alcohol and vinyl chloride resin, for example.
  • the green sheets (1A, 1B, and 1C) may be 40 to 50 wt% alumina powder, 30 to 40 wt% glass powder, and 10 to 30 wt% organic binder components, which are merely examples. Based on total weight). From another viewpoint, the green sheets (1A, 1B, 1C) are composed of a solid component (alumina powder 50-60 wt% and glass powder 40-50 wt%: based on the weight of the solid component) and an organic binder component. The weight ratio, that is, the solid component weight: organic binder component weight may be about 80 to 90:10 to 20.
  • the green sheet component other components may be included as necessary, and for example, a dispersant of ketones such as phthalate ester and glycol, an organic solvent, and the like may be included.
  • the thickness of the green sheets (1A, 1B, 1C) may be about 60 to 350 ⁇ m, for example, about 150 to 300 ⁇ m.
  • the vias 6A and 6B are formed by filling the via holes 2A and 2B with a conductive material. Specifically, the vias 6A and 6B are obtained by filling the via holes 2A and 2B with a conductive paste by a printing method or the like and subjecting to heat treatment or the like.
  • the conductive paste may include, for example, Ag powder, glass frit for obtaining adhesive strength, and an organic vehicle (for example, an organic mixture of ethyl cellulose and terpineol).
  • the heat treatment may be performed when the green sheet laminate is fired. Prior to firing the green sheet laminate, the conductive paste filled in the via holes 2A and 2B may be subjected to a drying process.
  • the fired body 4 constituting the ceramic substrate 100 of the present invention is obtained by laminating and firing a plurality of green sheets (1A, 1B, 1C).
  • the green sheet laminate 4 ′ before firing has “green sheet 1 ⁇ / b> A in which via hole 2 ⁇ / b> A is formed by irradiating laser light” and “via hole 2 ⁇ / b> B is formed by machining.
  • a predetermined number of “green sheets 1B” and “ceramic sheets 1C without via holes” provided as necessary are formed by thermocompression bonding (each green sheet has via filling and internal electrodes as necessary. Layer, wiring layer, etc. are provided by the printing method).
  • the fired body 4 is obtained by subjecting the green sheet laminate to firing.
  • the ceramic substrate 100 of the present invention may be provided with mounting electrodes 7 in advance.
  • the mounting electrode 7 may be provided on the fired body 4 so as to be in contact with the via 6 ⁇ / b> B (via hole 2 ⁇ / b> B) located in the outermost layer of the stacked body.
  • the electric circuit module of the present invention comprises an electronic component mounted on the ceramic substrate.
  • the electric circuit module 200 of the present invention as shown in FIG.
  • a fired body 4 formed by firing a laminate of a plurality of green sheets having via holes in at least one sheet;
  • a via 6 formed by filling a via hole with a conductive material;
  • Mounting electrode 7 provided on fired body 4 so as to be in contact with via 6 (particularly via 6B), and electronic component 10 mounted on mounting electrode 7 via solder 9 It has.
  • the mounting electrode 7 provided on the fired body 4 is provided so as to be electrically connected to the uppermost via 6B.
  • the mounting electrode 7 is provided on the via 6B so as to be in contact with the via 6B of the via hole 2B formed by machining.
  • the thickness of the electrode 7 may be about 2 to 150 ⁇ m.
  • Such an electrode 7 can be obtained by printing the conductive paste on the fired body 4 by screen printing or the like and subjecting it to a heat treatment.
  • the conductive paste for forming the mounting electrode 7 may be one that is conventionally used in forming a mounting electrode or an internal electrode of a general ceramic substrate. For example, Ag paste may be used.
  • the heat treatment may be performed during reflow soldering described later. Prior to the reflow soldering, the conductive paste printed for forming the electrode 7 may be subjected to a drying process.
  • the via 6 ⁇ / b> B located on the outermost layer on which the mounting electrode 7 is provided was formed by filling the machining hole with a conductive material. “Beer”.
  • the electric circuit module 200 of the present invention is obtained through a reflow soldering process. Specifically, the ceramic substrate 100 with the solder 9 interposed therebetween and the electronic component 10 are integrally subjected to heat treatment. Can be obtained.
  • the material of the solder 9 is not particularly limited as long as it can join the ceramic substrate 100 and the electronic component 10, for example, Sn—Ag system, Sn—Bi system, Sn—Cu system, Sn—In system, Binary alloy materials such as Sn-Pb or Sn-Sb, or Sn-Ag-Cu, Sn-Ag-Bi, Sn-Ag-Pb, Sn-Bi-In, Sn-Bi- It may be a ternary alloy material such as Pb, Sn—Zn—Bi, or Sn—Zn—Pb.
  • the electronic component 10 mounted on the electrode 7 of the ceramic substrate 100 is not particularly limited, but includes a semiconductor, a semiconductor IC, a circuit board (for example, a printed wiring board), a module component or a passive component. Can do.
  • a residue due to the heat due to the laser beam irradiation may be generated in the via hole 1A.
  • the ceramic substrate is configured by laminating only the green sheet 1A having the laser processed via hole 2A, if the amount of the residue is large, the “void in the via” generated due to the residue causes In the manufacturing process, moisture or bubbles can enter. Therefore, when the ceramic substrate and the solder are heated, vaporized moisture, bubbles, etc. rise in the vias and are generated as voids in the solder on the ceramic substrate, which may cause poor connection of electronic components. .
  • the green sheet 1B having the via hole 2B formed by machining does not generate a residue as shown in FIG. That is, by using the green sheet 1B provided with the machined via hole 2B as the outermost layer green sheet on which the mounting electrode is provided, the “green sheet having the laser processed via hole 2A” is formed in a layer other than the layer where the mounting electrode is disposed. Even when “1A” is used, the “via formed in the machined via hole” at the time of reflow soldering prevents “a phenomenon in which voids are generated in the solder”.
  • the “via 6B formed in the machined via hole” does not include voids due to residue, and therefore, substantially all the space in the machined via hole is made of a conductive material. Filled with. Therefore, even if the “via 6A formed in the laser processed via hole” exists on the inner side of the “via 6B formed in the machined via hole” and the moisture or the bubble is included therein, the moisture / bubble is generated. Is prevented by the outermost via 6B. In other words, during reflow soldering, “via 6B formed in a machined via hole” prevents transmission and movement of moisture and bubbles contained in “via 6A formed in a laser processed via hole”. As a result, they are prevented from moving to the solder 9.
  • step (i) is performed. That is, a via hole is formed in at least one of the plurality of green sheets.
  • the via hole 2B of the green sheet 1B provided as the outermost layer of the laminate is formed by machining (“a1” in FIG. P (a)), the other A via hole 2A of the green sheet 1A provided as a layer is formed by laser processing (“a2” in FIG. 13A).
  • the punch press may be of any type as long as it can punch a hole with a pin member (ie, can be punched).
  • NC punch press (Numerical Control) is performed by numerical control. Punch press), or a punch press that punches a plurality of via holes as a die-shaped press.
  • the via hole 2B has a substantially cylindrical shape, that is, the width dimension of the via hole 2B is substantially constant along the direction of the hole thickness.
  • a carbon dioxide (CO 2 ) laser, a YAG laser, an excimer laser, or the like may be used.
  • the laser processing conditions are not particularly limited as long as they are conventionally used for forming via holes in green sheets.
  • the shape of the via hole 2A becomes a truncated cone due to the spread angle of the laser beam, that is, the via hole 2A can have a taper shape in the direction of the hole thickness.
  • step (ii) is performed. That is, the via hole (2A, 2B) is filled with a conductive material. Specifically, as shown in FIG. 13B, conductive paste is supplied to the via holes (2A, 2B) formed in the green sheets 1A, 1B, and the inside of the holes (2A, 2B) is electrically conductive paste. Fill with.
  • various printing methods such as screen printing can be used. It is preferable to dry after filling the conductive paste into the via holes (2A, 2B).
  • necessary wiring layers and internal electrodes may be formed by various printing methods in the same manner. It is preferable to perform a treatment, for example, a drying treatment of 20 to 50 minutes may be performed under a temperature condition of 40 to 80 ° C.).
  • step (iii) is performed. That is, a laminated body is formed by laminating a plurality of green sheets, and the laminated body is subjected to firing to obtain a fired body. Specifically, as shown in FIG. 13C, “green sheet 1A in which via holes are formed by laser irradiation”, “green sheet 1B in which via holes are formed by machining”, and as necessary. A predetermined number of “ceramic sheets 1C without via holes” are stacked and thermocompression bonded to obtain a green sheet laminate 4 ′ (for example, at a temperature of 70 ° C. to 90 ° C. and a pressure of 100 kg / cm 2 to 300 kg / cm 2 .
  • green sheet 1B in which via hole 2B is formed by machining is used as the green sheet positioned on the outermost layer (that is, the green sheet positioned on the uppermost side as shown).
  • the number of stacked green sheets (1A, 1B, 1C) is not particularly limited, and may be, for example, about 3 to 50 in total, preferably about 3 to 15 sheets.
  • the green sheet laminate 4 ′ is preferably subjected to a drying process such as a binder removal step prior to firing.
  • a drying process such as a binder removal step
  • heat treatment may be performed for 20 to 50 hours under a temperature condition of 500 ° C. to 700 ° C.
  • the green sheet laminate 4 ′ is preferably heat-treated at a temperature of 800 ° C. to 1000 ° C. (preferably 850 ° C. to 950 ° C.) for about 0.1 hour to 3 hours.
  • Such heat treatment may be performed by subjecting the green sheet laminate 4 ′ to a firing furnace such as a mesh belt furnace.
  • the firing method as described above is disclosed in Japanese Patent Laid-Open No. 5-102666, and should be referred to as necessary.
  • the ceramic substrate 100 provided with the fired body 4 and vias 6 (6A, 6B) therein can be obtained.
  • step (I) is carried out. That is, the mounting electrode is formed on the fired body so as to be in contact with the via of the obtained ceramic substrate.
  • the electrode 7 is formed by providing a conductive paste as an electrode material on the fired body 4 by screen printing or the like.
  • the conductive paste for forming the mounting electrode 7 may be an Ag paste, for example.
  • step (II) is performed. That is, solder is provided on the mounting electrode, and an electronic component is disposed on the solder.
  • a solder ball 9 may be provided on the mounting electrode 7 and a semiconductor IC may be provided as the electronic component 10 on the solder ball 9.
  • step (III) is performed. That is, a reflow soldering process is performed. Specifically, as shown in FIG. 14E, the ceramic substrate 100, the electrical component 10, and the solder balls 9 and the electrodes 7 interposed therebetween are integrally subjected to a heat treatment. As a result, the ceramic substrate 100 and the electrical component 10 are electrically connected to each other via the solder material, and the electrical circuit module 200 is obtained.
  • the “via 6B formed in the machined via hole” is changed from the transmission of moisture and bubbles caused by the “via 6A formed in the laser processed via hole”. Since the movement is prevented, such moisture and bubbles do not move to the solder ball 9, and as a result, generation of voids in the solder is prevented.
  • a “green sheet having a via hole formed by laser light irradiation” can be used for a layer other than the layer for forming the electrode.
  • the via hole formation time (process tact time) by laser irradiation is about one-sixth of the via hole formation time (process tact time) by machining (for example, NC punch press). it can. That is, according to the present invention, the manufacturing yield of the ceramic substrate itself and, consequently, the process yield in the electrical circuit module manufacturing using the ceramic substrate can be improved without substantially adversely affecting the tact time in the ceramic substrate manufacturing. As a result, the ceramic substrate and the electric circuit module using the ceramic substrate can be provided to the market at a low cost).
  • the via located in the outermost layer on which the mounting electrode is provided may be a via formed by filling a machining hole with a conductive material. Accordingly, as shown in FIG. 15, not only the via hole in the uppermost green sheet provided with the mounting electrode 7 is formed by machining, but also the via hole in the lowermost green sheet provided with the mounting electrode 7 is machined. May be formed.
  • the vias located in both the uppermost layer and the lowermost layer may be “vias formed by filling a machining hole with a conductive material”. Even in such an embodiment, the above-described effects of the present invention are similarly obtained.
  • This aspect is useful in that electronic components can be mounted on both sides of the substrate.
  • FIG. 16A shows the overall shape of vias and via holes in a single-sided mounting board
  • FIG. 16B shows the overall shape of vias and via holes in a double-sided mounting board.
  • at least the outermost green sheet of the green sheet laminate need only be formed by machining.
  • At least one green sheet via hole corresponding to the lower layer of the outermost surface green sheet may also be formed by machining. Even in such a case, the above-described effects of the present invention are similarly obtained. ⁇ In view of the essential features of the present invention, not only the mode of mounting through electrodes, but also the mode of mounting electronic components directly on a ceramic substrate with solder without using such electrodes, The effects of the present invention are also exhibited.
  • the present invention is not only effective in the “solder reflow method”, but can also be effective in other mounting methods resulting from heat treatment. .
  • GGI Gold-to-Gold
  • First embodiment At least one sheet is a fired body (or sintered body) formed by firing (or sintering) a laminate of a plurality of green sheets having via holes, and the via hole is filled with a conductive material.
  • Second aspect The ceramic substrate according to the first aspect, wherein the hole width dimension of the via hole formed by machining is constant along the hole thickness direction.
  • Third aspect The ceramic substrate according to the first or second aspect, wherein the “via hole in the green sheet other than the outermost green sheet” is a via hole formed by laser processing.
  • Fourth aspect The ceramic substrate according to the third aspect, wherein the hole width dimension of the via hole formed by laser processing is not constant along the hole thickness direction but gradually decreases or gradually increases. .
  • Fifth aspect The ceramic substrate according to any one of the first to fourth aspects, further comprising an electrode provided on the fired body so as to be in contact with the via.
  • An electric circuit module comprising the ceramic substrate according to any one of the first to fourth aspects, An electrical circuit module (electronic circuit module) comprising a mounting electrode provided on a fired body so as to be in contact with a via, and an electronic component mounted on the mounting electrode.
  • a method for producing a ceramic substrate comprising: (I) forming a via hole in at least one of the plurality of green sheets; (Ii) filling a via hole with a conductive material, and (iii) forming a laminate by laminating a plurality of green sheets, and subjecting the laminate to firing to obtain a fired body.
  • a method of manufacturing a ceramic substrate wherein via holes are formed by machining in the “outermost layer green sheet used as an outermost layer of a green sheet laminate and provided with a mounting electrode”.
  • Eighth aspect A method for producing a ceramic substrate according to the seventh aspect, wherein a punch press is performed as the machining.
  • Ninth aspect In the seventh aspect or the eighth aspect, in the step (i), the via hole in the “green sheet other than the outermost layer green sheet” is formed by laser processing.
  • Tenth aspect A method of manufacturing an electric circuit module (electronic circuit module) using the ceramic substrate according to any one of the first to fourth aspects, (I) forming a mounting electrode on the fired body so as to be in contact with the via of the ceramic substrate; (II) a step of providing solder on the mounting electrode and arranging electronic components on the solder; and (III) reflow soldering the “ceramic substrate, electrical component and solder interposed between them and mounting electrode” A method of manufacturing an electric circuit module (electronic circuit module) comprising a step of attaching.
  • the ceramic substrate according to the present invention is suitably used as an RF module of a mobile device, a power LED substrate using heat dissipation, or an LED substrate for a liquid crystal backlight, and an electronic component mounted with high density. It is also suitably used as a substrate for equipment.
  • the present invention provides a void inside the solder even when the electronic component is obtained by mounting electronic components on a ceramic substrate by solder reflow due to the machined via hole in the outermost green sheet of the laminate. Since generation

Abstract

L'invention concerne un substrat céramique (100) possédant : un corps cuit (4) formé par cuisson d'un corps stratifié d'une pluralité de feuilles vertes qui possède un trou d'interconnexion dans au moins une feuille; et des interconnexions (6) (6A, 6B) formées par remplissage du trou d'interconnexion avec un matériau conducteur. Plus précisément, l'invention concerne un substrat céramique (100) dans lequel un trou d'interconnexion (2B) est constitué, au niveau du corps stratifié de feuilles vertes, formé par usinage mécanique dans la feuille verte (1B) de la couche la plus à l'extérieur sur laquelle est agencée une électrode de montage (7).
PCT/JP2011/053885 2010-02-18 2011-02-16 Substrat céramique ainsi que module de circuit électrique, et procédé de fabrication de ceux-ci WO2011102535A1 (fr)

Applications Claiming Priority (2)

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JP2010-033128 2010-02-18
JP2010033128A JP2013084636A (ja) 2010-02-18 2010-02-18 セラミック基板、および電気回路モジュール

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WO2011102535A1 true WO2011102535A1 (fr) 2011-08-25

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08169776A (ja) * 1994-12-19 1996-07-02 Sumitomo Metal Ind Ltd セラミックス多層基板
JP2001068852A (ja) * 1999-08-30 2001-03-16 Kyocera Corp 多層配線基板およびその製造方法
JP2003198129A (ja) * 2001-12-27 2003-07-11 Murata Mfg Co Ltd 積層型セラミック電子部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08169776A (ja) * 1994-12-19 1996-07-02 Sumitomo Metal Ind Ltd セラミックス多層基板
JP2001068852A (ja) * 1999-08-30 2001-03-16 Kyocera Corp 多層配線基板およびその製造方法
JP2003198129A (ja) * 2001-12-27 2003-07-11 Murata Mfg Co Ltd 積層型セラミック電子部品の製造方法

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