WO2011091651A1

WO2011091651A1 - Precision positioning sputtering apparatus and positioning method thereof

Info

Publication number: WO2011091651A1
Application number: PCT/CN2010/074936
Authority: WO
Inventors: 杨明生; 朱富强
Original assignee: 东莞宏威数码机械有限公司
Priority date: 2010-01-29
Filing date: 2010-07-02
Publication date: 2011-08-04
Also published as: CN101831612A; CN101831612B

Abstract

A precision positioning sputtering apparatus including a positioning fixture. The positioning fixture has a central hole matching with the positioning axis core of a sputtering rotary plate, and is coaxially mounted on a connecting ring. The connecting ring and the positioning fixture are moved to wear the central hole of the positioning fixture onto the axis core of the sputtering rotary plate. The connecting ring is fixed on the cover board for the mainbody of the precision positioning sputtering apparatus, so as to achieve the positioning of a cathode in which a target material is provided and the disc to be sputtered on sputtering rotary plate. Also disclosed is a precise and quick positioning method.

Description

Precise positioning sputtering device and positioning method thereof

The present invention relates to an apparatus and method for improving an optical disc production line, and more particularly to an accurate positioning sputtering apparatus and positioning method thereof. Background technique

Optical storage media from CD to DVD, now developed to BD Blu-ray Disc, in order to increase the storage capacity of information, it is necessary to continuously reduce the size of the information record, which requires that the wavelength of the read and record light waves used must be gradually shortened. ^The numerical aperture (NA) value of the reading objective lens is constantly increasing, so the wavelength of the optical storage medium (optical disc) is from 780 nm of the CD to 650 nm of the DVD, and the development of the BD Blu-ray disc is a blue laser having a wavelength of 405 nm. The numerical aperture NA value of the objective lens is from 0.45 for CD to 0,6 for DVD, and to BD Blu-ray disc objective to achieve an NA value of 0.85.

From the above optical storage media, we can see that as the information storage capacity of optical storage media continues to expand, the production technology for producing optical storage media is also booming. Taking the production system of BD50 and the optical disk production system of DVD9 as an example, BD50 is produced. Optical disc system: The L imm thick substrate is injection molded by the injection molding machine and cooled by a cooling belt. The total reflection layer is sputtered, then the layer of the 23 um space layer is sprayed, UV cured, and then 2 g of glue is applied. Layer, enter the molding device, copy the information layer, then perform semi-reflective layer sputtering, then spin coating 75um cover iayer, UV curing, then spin coating 2um hardcoat protective layer, UV curing, anti-disc, sputtering SiN waterproof layer , online detection and tiered storage. Another typical production of the DVD9 disc system consists of: L0 substrate made of DVD9 by one injection molding machine, and L1 substrate of DVD9 by another injection molding machine. In two sputtering stations, L0 is splashed in a sputtering station. The semi-reflective layer is plated, L1 is sputtered with a total reflection layer in another sputtering station, and the LI disc is coated with a layer of adhesive in the adhesive coating station, which is then sent to the bonding device, L0 and L1 The discs are bonded together, the bonding device comprises an adhesive component with an automatic adjustment eccentric function and a high-voltage electrostatic device, followed by a thousand glue, UV curing, bonding to a complete DVD disc, and finally through on-line inspection and finished product Sputtering is used in almost every format of disc production in many disc formats. It is well known that in sputtering methods, ions are generally generated by collisions between gas atoms and electrons in a glow discharge. These ions are accelerated into the cathode and cause atoms of the target to be ejected from the surface of the cathode. The disc is placed in position to intercept a portion of the ejected atoms. Therefore, the target plating film is deposited on the surface of the optical disk.

It can be seen from this that the positional relationship between the optical disc and the cathode is quite important. If the position of the disc to be plated and the cathode are not suitable, the problem of the sputter layer of the disc may be caused. For example, the sputter layer is eccentric, and the ring-shaped annular region on the surface of the disc is not concentric with the circular disc; All hooks, etc., will directly affect the yield of the entire optical disc production line.

At present, the existing installation and debugging method is to perform the sputtering experiment after the cathode, the connecting ring and the main body are installed. If the disc is eccentric, adjust it. This repeated disassembly-and-replacement method prolongs mechanical assembly time in a disguised manner, affecting production efficiency. In addition, the visual inspection relies entirely on the skill level of the operator, and there is a large positional deviation, which is also disadvantageous for the improvement of the automation level. The most important thing is that the adjustment method can easily cause problems in the sputter layer of the disc, which further leads to a decrease in the yield of the disc. An effective and accurate adjustment device and adjustment method for the relative positions of the cathode and the main body are also not found in the prior art.

Therefore, it is necessary to improve the precise positioning sputtering device on the optical disc production line to overcome the above shortcomings.

Summary of the invention

One of the objects of the present invention is to provide a precise positioning sputtering apparatus which is accurate in positioning, high in assembly speed, can effectively prevent eccentricity or unevenness of the sputtering layer, and improves the yield of the optical disk.

Another object of the present invention is to provide a positioning method for a precise positioning sputtering apparatus which is accurate in positioning, high in assembly speed, can effectively prevent eccentricity or unevenness of the sputtering layer, and improve the yield of the optical disk.

In order to achieve the above object, the technical solution of the present invention is: providing a precise positioning sputtering device, comprising a main body, a main body cover, a sputtering turntable, a cathode, a connecting ring, a robot, and a turntable driving mechanism, The main body is provided with a cavity, the cavity comprises a sputtering chamber and a conveying cavity which are connected to each other, and the main body cover is fixed on the main body and is provided with a conveying open corresponding to the sputtering cavity and the conveying cavity respectively. And a sputter driving mechanism, wherein the turntable driving mechanism is mounted on the main body and connected to the sputtering turntable, and the sputtering turntable is provided with a bearing cavity matched with the optical disc, and the center of the sputtering turntable is disposed a positioning core extending into the carrying cavity for fixing the optical disc, the robot is disposed directly above the conveying cavity, and the connecting ring is connected to the main cover and is received by the main cover In the opening, the cathode is mounted on the connecting ring, and a sputtering target is disposed in the cathode, and the robot places or removes the optical disc to the sputter disk located in the conveying cavity, and the target is placed a cathode for coating an optical disc on a sputter disk in the sputtering chamber, the turntable driving mechanism driving the sputter disk to rotate in the cavity to load and sputter the unsputtered disk After the disc carries the splash a plated cavity, wherein the precision positioning sputtering device further includes a positioning fixture having a center hole matching the positioning axis of the sputtering disk, the positioning fixture being coaxially mounted on the Attaching the connecting ring, moving the connecting ring and the positioning fixture to fit the central hole of the positioning fixture on the core of the sputtering turntable, and fixing the connecting ring on the main body cover to realize the connection between the cathode and the optical disc Positioning.

Preferably, the positioning shaft has a diameter of i5 mm, and the tolerance between the center hole and the positioning core is between 0 mm and 0,05 mm, due to the standard aperture of the hole at the center of the disc. For 15 mm, the positioning axis is matched with the aperture of the ball at the center of the disc, which is advantageous for firmly fixing the disc to be plated, and the deviation between the center hole of the positioning jig and the positioning core is controlled to be 0 mm to 0.05 mm. Between the positioning, the center hole of the positioning fixture can be accurately placed on the shaft core to achieve rapid positioning while ensuring that the error is not within the range of the eccentricity of the sputter layer.

The positioning fixture is a disc that matches the contour of the connecting ring, and the disc protrudes from the upper edge by an engaging portion, and the engaging portion is engaged with the connecting ring. The disc is used as a positioning fixture, and has a simple structure and strong versatility. The positioning disc is symmetrically opened with two auxiliary holes. Through the two auxiliary holes, the precision positioning jig is assembled on the connecting ring and detached from the connecting ring. The disc is made of aluminum alloy. The aluminum alloy positioning fixture is made of aluminum alloy plate for precision machining. It has high strength, is easy to process and has good workability, and has excellent interface characteristics.

Preferably, the sputter disk is provided with a groove, and the groove is provided with a sealing ring, the dense A sealing ring is located between the sputter disk and the connecting ring, and the sealing ring enhances the sealing degree of the sputtering chamber.

Accordingly, the present invention provides a positioning method for a precise positioning sputtering apparatus as described above, comprising the following steps: (1) driving a turntable driving mechanism to rotate the sputtering turntable to a sputtering chamber in the main body and fix it (2) locating the positioning fixture on the connecting ring; (3) moving the connecting ring and the clamp so that the center hole of the clamp is sleeved on the positioning core; (4) fixing the connecting ring On the main body cover, the clamp is removed; (5) the cathode is mounted on the connecting ring to complete the positioning process.

Compared with the prior art, the precise positioning sputtering device of the present invention further includes a positioning fixture having a central hole matching the positioning axis of the sputtering turntable, the positioning fixture being coaxially mounted Moving the connecting ring and the positioning fixture on the connecting ring, so that the center hole of the positioning fixture is sleeved on the positioning core of the sputter disk, and the connecting ring is fixed on the main body cover, accurately and quickly The positioning between the cathode and the optical disc is realized, and the assembly speed is improved. The positioning clamp is used to keep the connecting ring and the positioning shaft core concentric, ensuring that the optical disc and the cathode are in the proper position as desired, thereby ensuring the sputtering effect of the sputter layer, in particular, ensuring that the sputter layer is not eccentric, thereby improving production efficiency and The yield of the disc. Description

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a precise positioning sputtering apparatus of the present invention.

2 is a schematic view of the positioning jig of the present invention mated with a connecting ring.

3 is a schematic view of the connecting ring of the present invention being positioned with the optical disc by a positioning jig.

Figure 4 is a schematic view showing the structure of the positioning jig of the present invention.

Figure 5 is a flow chart of a positioning method using the precision positioning sputtering apparatus of the present invention. detailed description

In the following, in order to explain the technical components and structural features of the present invention, the same reference numerals are used to refer to the same components in the different figures. The invention discloses a precise positioning sputtering device, which comprises a positioning fixture, which improves the positional relationship between the cathode of the precise positioning sputtering device and the optical disk to be plated in the optical disk production line by the positioning fixture, The step improves the positional relationship between the connecting ring of the cathode and the optical disc, and solves the problem of positional deviation of the connecting ring of the cathode of the disc cartridge to be plated on the turntable disposed in the main body of the precise positioning sputtering apparatus. The adjustment result of the positioning jig can ensure that the cathode of the optical disc case is in a proper position therewith. Thereby ensuring the sputtering effect of the sputter layer, in particular, ensuring that the sputter layer is not eccentric, and improving the yield of the optical disc.

Referring to FIG. 1, a precise positioning sputtering apparatus according to an embodiment of the present invention includes: a main body i00, a main body cover 200, a sputtering turntable 300, a cathode 400, a connecting ring 500, a robot 210, and a turntable driving mechanism 600. The cavity 110 includes a sputtering chamber 114 and a conveying cavity 112 that communicate with each other. The main body cover 200 is fixed on the main body 100 and is respectively provided with the sputtering chamber 114 and the conveying chamber 112. Corresponding to the communicating conveying opening 222 and the sputtering opening 224, the turntable driving mechanism 600 is mounted on the main body 100 and connected to the sputtering turntable 300, and the sputtering turntable 300 is opened to match the optical disc 700. a bearing cavity 305, a center of the sputter disk 300 is disposed at a center of the mounting cavity 305 for fixing the optical disc 700, and the robot 210 is disposed directly above the conveying cavity 112, and the connection is The ring 500 is connected to the main body cover 200 and is received in the sputtered opening 224 of the main body cover 200. The connecting ring 500 is provided with a mounting hole 510, and the main body cover 200 is opened and a screw hole corresponding to the screw hole 510, the connecting ring 500-end The screw is fixedly mounted on the main body cover 200. The cathode 400 is mounted on the connecting ring 500, and a sputtering target is disposed in the cathode 400, and the pair of robots 210 are located The sputter disk 300 in the transport chamber 112 places or removes the optical disc 700, and the cathode 400 on which the target is placed performs 'coating' on the optical disc 700 located on the sputter disk 300 in the sputtering chamber 114. 600 driving the sputter disk 300 to rotate within the cavity 110 to load an unsprayed disk and to carry the sputtered disk out of the sputtering chamber 114. Preferably, the sputtering wheel 300 The groove is provided with a groove 320, and the groove is provided with a sealing ring 330. The sealing ring 330 is located between the sputter disk 300 and the connecting ring 500, and the connecting ring 400 is strengthened by the sealing ring 330. Specifically, the turntable driving mechanism 600 includes a motor 610, an output shaft 620, and a rotating 'arm 630. The output shaft 620 is connected to the motor 610 and pivoted with the main body 100. The middle of the rotating arm 630 is fixedly connected to the output shaft 620, and the rotation Two sputter trays 300 are fixedly connected to the two ends of the arm 630. The sputter robot 210 grabs the unsprayed disc 700 from the last process of the disc production line, and the robot 210 moves and The optical disc 700 is transferred to the sputter disk 300 by the air gripper 212, and the drive motor 610 rotates the sputter disc 300 to rotate the sputter disc 300 into a designated area of the sputtering chamber 114. The sputter disk 300 may be a plurality of, preferably two, two sputter disks on the same line, and the number of the rotating arms 630 is corresponding to the sputter disk 300. The precise positioning sputtering apparatus of the present invention further includes a positioning fixture 800. Specifically, as shown in FIG. 2, the positioning fixture 800 is a disc that matches the contour of the connecting ring 500, and the positioning fixture 800 is along the upper edge. The engaging portion 810 is protruded, and the engaging portion 810 is engaged with the connecting ring 500. The positioning jig 800 has a center hole 820 that matches the positioning shaft 310 of the sputter disk 300. The disc is used as a positioning fixture, and has a simple structure and strong versatility. The disc is made of aluminum alloy material for the AA6061 sheet. The aluminum alloy positioning fixture is made of aluminum alloy plate for precision processing, high strength, easy processing and good workability. The interface features are excellent, and its processability and strength can be guaranteed. Two positioning holes 830 are symmetrically opened on the positioning fixture 800. Through the two auxiliary holes 830, the precision positioning fixture 800 is assembled to and detached from the connecting ring 500. Referring to FIG. 3 and FIG. 4, the positioning fixture 800 is coaxially mounted on the connecting ring 500, and the connecting ring 500 and the positioning fixture 800 are moved to cover the center hole 820 of the positioning fixture 800 to the sputtering. On the core 310 of the turntable 300, the connecting ring 500 is fixed to the main body cover 200 to realize positioning between the cathode 400 and the optical disc 700.

Preferably, the positioning core 310 is a three-bead positioning core with a diameter of 15 mm, and the center 820 of the positioning fixture 800 is substantially equal to the size of the positioning core 310, and the positioning axis 310 The tolerance is between 0 mm and 0.05 mm. Since the standard aperture of the hole at the center of the optical disc 700 is 15 mm, the positioning core 310 matches the aperture of the hole at the center of the optical disc 700, which is advantageous for firmly fixing the disc to be plated. 700, and the deviation between the center hole 820 of the positioning jig 800 and the positioning shaft core 310 is controlled between 0 mm and 0.05 mm, so that the center hole 820 of the positioning jig 800 can be accurately fitted to the shaft during positioning. On the core 310, rapid positioning is achieved while ensuring that the error is not within the eccentricity of the sputtered layer. The mechanical hand 210 is disposed directly above the transporting cavity i I2 , and the connecting ring 500 is connected to the main body cover 200 and received in the sputter opening 224 of the main body cover 200 , and the cathode 400 is installed. On the connecting ring 500, a sputtering target is disposed in the cathode 400, and the robot 210 places or removes the optical disk 700 on the sputtering turntable 300 located in the conveying cavity 112, and places the target. Yin The pole 400 performs a 'coating' of the optical disc 700 on the sputter disk 300 in the sputtering chamber 114, and the turntable driving mechanism 600 drives the sputter disk 300 to rotate in the cavity 110 to be unsputtered. The disc is loaded and the sputtered disc is carried out of the sputtering chamber 114.

In the sputtering process, it is necessary to install or adjust the positional relationship between the cathode 400, the connecting ring 500, the main body cover 200, the main body 100 and the like of the precise positioning sputtering device to ensure the proper position of the cathode 400 target and the optical disc 700. Prior to sputtering, referring to Figure 5, the positioning method using the precise positioning sputtering apparatus of the present invention comprises the following steps:

(10!) driving the turntable driving mechanism to rotate the sputter disk to the sputtering cavity in the main body and fix it;

(102) sleeve the positioning fixture on the connecting ring;

(103) moving the connecting ring and the clamp so that the central hole of the clamp is sleeved on the positioning core;

(104) fixing the connecting ring on the main body cover, and removing the clamp;

( !05 ) The cathode is mounted on the connecting ring to complete the positioning process.

After the positioning is performed, when the optical disc is produced, the optical disc substrate which is injection molded by the injection molding machine is transported by the transport optical disc device (cooling during the transfer process), and the sputter robot 210 picks up the optical disc 700 of the transport optical disc device. The turntable driving mechanism 600 drives the sputter disk 300 to place the sputter disk 300 in the transport cavity 112 in the main body 100, moves the robot 210 and places the unsputtered disc in the transport cavity 112 through the action of the air gripper 212. In the upper carrying cavity 305, the center of the unsprayed optical disk is sleeved on the positioning core 310. The turntable driving mechanism 600 is driven to rotate the sputter disk 300 from the conveying cavity i I2 of the main body 100 into the sputtering cavity 114. The sputtering turntable 300 and the connecting ring are seamlessly connected by the sealing ring 330. The cathode 400 mounted on the connecting ring 500 is sputtered by an internal target to an unsputtered optical disc located directly under the cathode 400 and in the carrying cavity 305 of the sputter disk 300. After the sputtering is completed, the turntable is driven. The mechanism 600 drives the sputter disk 300 to rotate 180 degrees again to send the optical disc 700 out of the sputtering chamber 114, where it is picked up by the robot in the transport chamber and transferred to the next process step.

Compared with the prior art, the precise positioning sputtering device of the present invention further includes a positioning fixture 800 having a central hole 820 matching the positioning axis 310 of the sputtering disk 300, the positioning fixture 800 is coaxially mounted on the connecting ring 500, moving the connecting ring 500 and positioning The clamp 800 is disposed on the shaft core 310 of the sputter disk 300, and the connecting ring 500 is fixed on the main body cover 200 to accurately and quickly realize the cathode 400 and the optical disc 700. Positioning between them to improve assembly speed. The positioning fixture 800 is simple in structure and low in cost, and the connecting ring 400 is kept concentric with the positioning shaft core 310 by the positioning fixture 800, thereby ensuring that the optical disc 700 and the cathode 400 are in a proper position as expected, thereby ensuring splashing of the sputter layer. The plating effect, especially to ensure that the sputtering layer is not eccentric, and improve the yield of the optical disc.

The above are only the preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the claims of the present invention are still within the scope of the present invention.

Claims

A precise positioning sputtering device, comprising a main body, a main body cover plate, a sputtering turntable, a cathode, a connecting ring, a robot, and a turntable driving mechanism, wherein the main body is provided with a cavity, and the cavity comprises a sputtering plate which communicates with each other The main body cover plate is fixed on the main body and has a conveying opening and a sputtering opening respectively corresponding to the sputtering chamber and the conveying chamber, and the rotating disc drive mechanism is mounted on the main body cover The main body is connected to the sputter disk, and the sputter disk is provided with a bearing cavity matched with the optical disk. The center of the sputter disk is provided with a positioning core extending into the bearing cavity for fixing the optical disk. The connecting arm is disposed directly above the transporting cavity, the connecting ring is connected to the main body cover and is received in the sputter open of the main body cover, and the cathode is mounted on the connecting ring, a sputtering target is disposed in the cathode, the robot places or removes the optical disc to the sputter disk located in the conveying cavity, and the cathode of the target is placed on the sputter disk in the sputtering chamber. Light The disk is coated, and the turntable driving mechanism drives the sputter disk to rotate in the cavity to load the unsputtered disk and carry the sputtered disk out of the sputtering cavity, wherein A positioning fixture is included, the positioning fixture has a center hole matching the positioning shaft core of the sputter disk, the positioning fixture is coaxially mounted on the connecting ring, and the connecting ring and the positioning fixture are moved The center of the positioning fixture is sleeved on the core of the sputtering turntable, and the connecting ring is fixed on the main body cover to realize positioning between the cathode and the optical disc.

2. The precision positioning sputtering apparatus according to claim 1, wherein the positioning shaft core has a diameter of 15 mm, and a tolerance between the center hole and the positioning shaft core is between 0 mm and 0. , between 05 mm.

3. The precision positioning sputtering device according to claim 1, wherein the positioning fixture is a disc that matches the contour of the connecting ring, and the disc protrudes from the upper edge to the engaging portion. The engaging portion is engaged with the connecting ring.

4. The precise positioning sputtering apparatus according to claim 3, wherein said disc is symmetrical Two auxiliary holes are provided.

5. The precise positioning sputtering apparatus according to claim 4, wherein the disk is made of an aluminum alloy.

The precise positioning sputtering apparatus according to claim 1 , wherein the sputtering turntable is provided with a groove, the groove content is provided with a sealing ring, and the sealing ring is located on the sputtering turntable Between the connecting rings.

7. A positioning method using the precision positioning sputtering apparatus according to claim 1, characterized by comprising the steps of:

(1) driving the turntable driving mechanism to rotate the sputter disk to the sputtering cavity in the main body and fix it;

(2) locating the positioning fixture on the connecting ring;

(3) moving the connecting ring and the clamp so that the center hole of the clamp is sleeved on the positioning shaft core;

(4) fixing the connection to the main cover, and removing the clamp;

(5) Mounting the cathode to the connecting ring to complete the positioning process.