CN201626979U - Sputtering device with accurate positioning - Google Patents

Sputtering device with accurate positioning Download PDF

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Publication number
CN201626979U
CN201626979U CN2010201088515U CN201020108851U CN201626979U CN 201626979 U CN201626979 U CN 201626979U CN 2010201088515 U CN2010201088515 U CN 2010201088515U CN 201020108851 U CN201020108851 U CN 201020108851U CN 201626979 U CN201626979 U CN 201626979U
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CN
China
Prior art keywords
sputter
rotating disk
shack
main body
positioning
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Expired - Lifetime
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CN2010201088515U
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Chinese (zh)
Inventor
杨明生
朱富强
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Dongguan Anwell Digital Machinery Co Ltd
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Dongguan Anwell Digital Machinery Co Ltd
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Priority to CN2010201088515U priority Critical patent/CN201626979U/en
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Abstract

The utility model discloses a sputtering device with accurate positioning, which comprises a positioning clamp. The positioning clamp is provided with a center hole matching with a positioning shaft core of a sputtering rotary disc; the positioning clamp is coaxially assembled on a connecting ring; the connecting ring and the positioning clamp are moved to lead the center hole of the positioning clamp to be sleeved on the shaft core of the sputtering rotary disc; the connecting ring is fixed on a body cover plate of the sputtering device with accurate positioning; positioning between a negative pole provided with an internal target and a optical disc to be sputtered can be precisely and rapidly realized, and assembling speed can be increased. The connecting ring and the positioning shaft core can be kept concentric by the positioning clamp, and the optical disc and the negative pole can be ensured to be positioned at expected proper positions, thereby ensuring sputtering effect of a sputtering layer, particularly ensuring no eccentricity of the sputtering layer, and increasing yield of optical discs.

Description

Precise positioning sputtering device
Technical field
The utility model relates to a kind of device that improves compact disc production line, relates more specifically to a kind of precise positioning sputtering device.
Background technology
Optical storage medium is from CD to DVD, develop into the BD Blu-ray Disc now, in order to increase the canned data capacity, will constantly reduce the size of information record symbol, this just requires the employed wavelength that reads and write down light wave to shorten gradually, and numerical aperture (NA) value that reads object lens continues to increase, so the 650nm of the wavelength that optical storage medium (CD) uses from the 780nm of CD to DVD, developing into the BD Blu-ray Disc, then to have adopted wavelength be the blue laser of 405nm, and the numerical aperture NA value of object lens from CD 0.45 to DVD 0.6, then reached 0.85 NA value to BD Blu-ray Disc object lens.
We can see the continuous expansion along with the optical storage medium information content from above-mentioned optical storage medium; its production technology of producing optical storage medium is also flourish; with the light disk producing system of production BD50 and the light disk producing system of DVD9 is example; produce the BD50 optical disk system: inject the thick substrate of 1.1mm after the cooling of cooling belt by injection moulding machine; carry out the total reflection layer sputter; the glue layer of the space layer of spin coating 23um then; UV solidifies; the glue duplicating layer of spin coating 2um enters die arrangement then, the Copy Info layer; carry out the semi-reflective layer sputter then; the cover layer of spin coating 75um then, UV solidifies, then the hardcoat protective layer of spin coating 2um; UV solidifies; anti-dish, sputter SiN waterproof layer, online detection and classification store.And the another kind of typical DVD9 of production optical disk system comprises: the L0 substrate of being made DVD9 by an injection moulding machine, another injection moulding machine is made the L1 substrate of DVD9, in two sputter stations, L0 is the sputter semi-reflective layer in a sputter station, L1 is the sputter total reflection layer in another sputter station, the applied layer of adhesive of LI CD in the adhesive coated station, be sent to bonder subsequently, L0 and L1 CD are bonded together, this bonder comprises the bonded assemblies that has the eccentric function of automatic adjustment and apply high voltage electrostatic device, dries glue then, and UV solidifies, be bonded as complete DVD CD, store by online detection and finished product classification at last.
Almost every kind of format disc is produced and all can be used the sputter technology in many disk formats.As everyone knows, in sputtering method, ion is generally produced by gas atom in the glow discharge and the collision between the electronics.These ions are owing to accelerating among the negative electrode and causing the atom of described target to eject from described cathode surface.CD places in position so that the part of the atom that its intercepting is ejected.Therefore, the target plated film just is deposited on the surface of described CD.
This shows that the position relation between CD and the negative electrode is quite important.If the improper sputtered layer of CD that will cause in position of CD to be plated and negative electrode goes wrong, for example make sputtered layer off-centre, annular region of being come out by sputter on the optical disc surface and circular CD decentraction; For another making sputtered layer inhomogeneous etc., the yield rate of whole piece compact disc production line will be influenced directly.
Present existing Installation and Debugging method is negative electrode, after shack and main body etc. installs, carries out the sputter experiment, if find optical disc eccentricity, goes to adjust again.This reassembling type is repeatedly adjusted mode and has in a disguised form been prolonged the mechanical assembly time, has influenced production efficiency.In addition, range estimation relies on operator's state of the art fully, has bigger position deviation, also is unfavorable for the raising of automatization level.The most important thing is because can adjust mode causes the sputtered layer of CD video disc to go wrong easily, further cause the good article rate of CD video disc to descend.Do not find in the prior art a kind of effectively, the whole setting device that connects the relative position of the negative electrode also gone up and main body accurately.
Therefore, be necessary the precise positioning sputtering device on the compact disc production line is improved to overcome above-mentioned defective.
The utility model content
The purpose of this utility model provides that a kind of accurate positioning is quick, assembling speed is high, can prevent effectively that sputtered layer is eccentric or inhomogeneous, improve the precise positioning sputtering device of CD yield rate.
For achieving the above object, the technical solution of the utility model is: a kind of precise positioning sputtering device is provided, comprise main body, main body cover plate, the sputter rotating disk, negative electrode, shack, mechanical manipulator, the rotating disk driving mechanism, described main body offers cavity, described cavity comprises sputter chamber and the conveyor chamber that is interconnected, described main body cover plate is fixed on the described main body and offers uncovered with the conveying of described sputter chamber and the corresponding connection of conveyor chamber respectively and sputter is uncovered, described rotating disk driving mechanism is installed on the described main body and with described sputter rotating disk and is connected, described sputter rotating disk offers the bearing cavity that is complementary with CD, described sputter center of turntable place is provided with and stretches into the locating shaft core that described bearing cavity is used for fixing CD, described mechanical manipulator is arranged at directly over the described conveyor chamber, described shack be connected with described main body cover plate and be contained in the sputter of described main body cover plate uncovered in, described negative electrode is installed on the described shack, be provided with the sputter target in the described negative electrode, CD is placed or taken away to described mechanical manipulator to the sputter rotating disk that is positioned at described conveyor chamber, the negative electrode that is placed with target carries out plated film to the CD on the sputter rotating disk that is positioned at described sputter chamber, the described sputter rotating disk of described rotating disk drive mechanism is incited somebody to action not at described cavity internal rotation, and the CD of sputter is written into and the CD behind the sputter is carried out described sputter chamber, wherein, described precise positioning sputtering device also includes positioning fixture, described positioning fixture has the centre hole that the locating shaft core with described sputter rotating disk is complementary, described positioning fixture is assemblied on the described shack coaxially, moving described shack and positioning fixture is placed on the axle core of described sputter rotating disk the centre hole of described positioning fixture, shack is fixed on the described main body cover plate, realizes the location between negative electrode and the CD.
Preferably, the diameter of described locating shaft core is 15 millimeters, tolerance between described centre hole and the described locating shaft core is between 0 millimeter to 0.05 millimeter, because the standard aperture in the hole at cd centre place is 15 millimeters, the aperture coupling in the hole at locating shaft core and cd centre place, help firmly fixing CD to be plated, and the deviation control between the centre hole of described positioning fixture and the locating shaft core is between 0 millimeter to 0.05 millimeter, the centre hole of positioning fixture in the position fixing process can be placed on the described axle core accurately, realize location fast, guarantee that simultaneously error is in the uninfluenced scope of sputtered layer.
Described positioning fixture is and the disk of described shack outline, and described disk protrudes out the engagement part along upper limb, and described engagement part engages with described shack.This disk is as positioning fixture, and is simple in structure, highly versatile, and symmetry offers two satellite holes on the described positioning disc, and by two described satellite holes, precisely positioning fixture is assembled on the shack and from shack and disassembles.Described disk is an aluminum alloy material, and this aluminium alloy positioning fixture adopts the precision sizing aluminium alloy plate, the intensity height, and it is good to be easy to processing and workability, and interface characteristic is good.
Preferably, offer groove on the described sputter rotating disk, described groove content is provided with sealing-ring, and described sealing-ring is strengthened the seal degree in sputter chamber by described sealing-ring between described sputter rotating disk and described shack.
Compared with prior art, because the utility model precise positioning sputtering device also includes positioning fixture, described positioning fixture has the centre hole with the locating shaft core of described sputter rotating disk coupling, described positioning fixture is assemblied on the described shack coaxially, moving described shack and positioning fixture is placed on the locating shaft core of described sputter rotating disk the centre hole of described positioning fixture, shack is fixed on the described main body cover plate, precisely realize the location between negative electrode and the CD apace, improve assembling speed.Make shack and locating shaft core keep concentric by described positioning fixture, ensure that CD and negative electrode all are in the suitable position of expection, thereby guarantee the sputter effect of sputtered layer, guarantee that particularly sputtered layer is not eccentric, improved the yield rate of production efficiency and CD.
Description of drawings
Fig. 1 is the structural representation of the utility model precise positioning sputtering device.
Fig. 2 is the synoptic diagram that positioning fixture of the present utility model cooperates with shack.
Fig. 3 is that shack of the present utility model is realized and the localized synoptic diagram of CD by positioning fixture.
Fig. 4 is the structural representation of positioning fixture of the present utility model.
Embodiment
In order to describe technology contents of the present utility model, structural attitude in detail, be described further below in conjunction with embodiment and conjunction with figs., label identical among the wherein different figure is represented identical parts.The utility model discloses a kind of precise positioning sputtering device, described precise positioning sputtering device includes positioning fixture, improve the position relation of the negative electrode and the CD to be plated of precise positioning sputtering device in the compact disc production line by described positioning fixture, further improve shack and the relation of the position between the CD that negative electrode is installed, solved the position deviation problem of the shack of the optical disk cartridge negative electrode to be plated on the intravital rotating disk of the master who is located at precise positioning sputtering device.The adjustment result of described positioning fixture can ensure that the optical disk cartridge negative electrode all is in and its suitable position.Thereby guarantee the sputter effect of sputtered layer, guarantee that particularly sputtered layer is not eccentric, improve the CD yield rate.
With reference to figure 1, the precise positioning sputtering device of the utility model embodiment comprises: main body 100, main body cover plate 200, sputter rotating disk 300, negative electrode 400, shack 500, mechanical manipulator 210, rotating disk driving mechanism 600, described main body 100 offers cavity 110, described cavity 110 comprises sputter chamber 114 and the conveyor chamber 112 that is interconnected, described main body cover plate 200 is fixed on the described main body 100 and offers respectively conveying uncovered 222 and sputter uncovered 224 with described sputter chamber 114 and conveyor chamber 112 corresponding connections, described rotating disk driving mechanism 600 is installed on the described main body 100 and with described sputter rotating disk 300 and is connected, described sputter rotating disk 300 offers the bearing cavity 305 that is complementary with CD 700, described sputter rotating disk 300 centers are provided with stretches into the locating shaft core 310 that described bearing cavity 305 is used for fixing CD 700, described mechanical manipulator 210 is arranged at directly over the described conveyor chamber 112, described shack 500 is connected with described main body cover plate 200 and is contained in the sputter uncovered 224 of described main body cover plate 200, offer open holes 510 on the described shack 500, described main body cover plate 200 offers the screw corresponding with described screw 510, and described shack 500 1 ends can be installed on the described main body cover plate 200 by screw retention.Described negative electrode 400 is installed on the described shack 500, be provided with the sputter target in the described negative electrode 400,210 pairs on described mechanical manipulator is positioned at the sputter rotating disk 300 of described conveyor chamber 112 and places or take away CD 700, the CD 700 that 400 pairs on the negative electrode that is placed with target is positioned on the sputter rotating disk 300 in described sputter chamber 114 carries out plated film, the described sputter rotating disk 300 of described rotating disk driving mechanism 600 drivings is incited somebody to action not at described cavity 110 internal rotation, and the CD of sputter is written into and the CD behind the sputter is carried out described sputter chamber 114, preferably, offer groove 320 on the described sputter rotating disk 300, described groove content is provided with sealing-ring 330, described sealing-ring 330 is between described sputter rotating disk 300 and described shack 500, by the seal degree that is connected between described sealing-ring 330 reinforced company's T-Rings 400 and the sputter rotating disk 300.Particularly, described rotating disk driving mechanism 600 comprises motor 610, output shaft 620 and pivot arm 630, described output shaft 620 links to each other with described motor 610 and articulates with described main body 100, fixedly connected with described output shaft 620 in described pivot arm 630 middle parts, the two ends of described pivot arm 630 are fixedly connected with two sputter rotating disks 300 respectively, sputtering-coating mechanical arm 210 grasps not sputter light-plated dish 700 from the last process procedure of compact disc production line, mechanical manipulator 210 moves and by gas pawl 212 described CD 700 is sent on the sputter rotating disk 300, drive-motor 610 rotation sputter rotating disks 300, described sputter rotating disk 300 is threaded in the designated area in sputter chamber 114, be appreciated that ground, described sputter rotating disk 300 can be for a plurality of, be preferably two, two sputter rotating disks are located along the same line, and the corresponding described sputter rotating disk 300 of the quantity of described pivot arm 630 is provided with.Precise positioning sputtering device of the present utility model also includes positioning fixture 800, particularly, as shown in Figure 2, described positioning fixture 800 is the disk with described shack 500 outline, described positioning fixture 800 protrudes out engagement part 810 along upper limb, described engagement part 810 engages with described shack 500, and described positioning fixture 800 has the centre hole 820 that the locating shaft core 310 with described sputter rotating disk 300 is complementary.This disk is as positioning fixture, simple in structure, highly versatile, described disk is aluminum alloy material for AA6061 sheet material, this aluminium alloy positioning fixture adopts the precision sizing aluminium alloy plate, the intensity height, and it is good to be easy to processing and workability, interface characteristic is good, and its processibility and intensity can be guaranteed.Symmetry offers two satellite holes 830 on the described positioning fixture 800, and by two described satellite holes 830, precisely positioning fixture 800 is assembled on the shack 500 and from shack 500 and disassembles.With reference to figure 3 and Fig. 4, described positioning fixture 800 is assemblied on the described shack 500 coaxially, moving described shack 500 is placed on the axle core 310 of described sputter rotating disk 300 centre hole 820 of described positioning fixture 800 with positioning fixture 800, shack 500 is fixed on the described main body cover plate 200, realizes the location between negative electrode 400 and the CD 700.
Preferably, described locating shaft core 310 is 15 millimeters three pearl locating shaft cores for diameter, the centre hole 820 of described positioning fixture 800 is substantially equal to the size of locating shaft core 310, tolerance between itself and the described locating shaft core 310 is between 0 millimeter to 0.05 millimeter, because the standard aperture in the hole of CD 700 centers is 15 millimeters, locating shaft core 310 mates with the aperture in the hole of CD 700 centers, help firmly fixing CD to be plated 700, and the centre hole 820 of described positioning fixture 800 and the deviation control between the locating shaft core 310 are between 0 millimeter to 0.05 millimeter, the centre hole 820 of positioning fixture 800 in the position fixing process can be placed on the described axle core 310 accurately, realize location fast, guarantee that simultaneously error is in the uninfluenced scope of sputtered layer.Described mechanical manipulator 210 is arranged at directly over the described conveyor chamber 112, described shack 500 is connected with described main body cover plate 200 and is contained in the sputter uncovered 224 of described main body cover plate 200, described negative electrode 400 is installed on the described shack 500, be provided with the sputter target in the described negative electrode 400,210 pairs on described mechanical manipulator is positioned at the sputter rotating disk 300 of described conveyor chamber 112 and places or take away CD 700, the CD 700 that 400 pairs on the negative electrode that is placed with target is positioned on the sputter rotating disk 300 in described sputter chamber 114 carries out plated film, described rotating disk driving mechanism 600 drive described sputter rotating disk 300 described cavity 110 internal rotation not the CD of sputter be written into and the CD behind the sputter carried out described sputter chamber 114.
In the sputtering process link, need to install or adjust position relation between the negative electrode 400, shack 500, main body cover plate 200, main body 100 etc. of precise positioning sputtering device, to ensure the position suitable of negative electrode 400 targets and CD 700.Before sputter, use the localization method of precise positioning sputtering device of the present utility model, may further comprise the steps:
(1) drives the rotating disk driving mechanism described sputter rotating disk is rotated to place, main intravital sputter chamber and fixing;
(2) described positioning fixture is set on the described shack;
(3) mobile shack and anchor clamps are enclosed within on the described locating shaft core centre hole of anchor clamps;
(4) described shack is fixed on the main body cover plate, unloads described anchor clamps;
(5) described negative electrode is installed on the shack, finishes position fixing process.
After realizing the location, when producing CD, inject the thick compact disc substrate of 1.1mm (meeting cooling in the transport process) after the transmission optical disc apparatus sends by injection moulding machine, sputtering-coating mechanical arm 210 can pick up the CD 700 that transmits optical disc apparatus.Rotating disk driving mechanism 600 drives sputter rotating disks 300 is in the conveyor chamber 112 in the main body 100 sputter rotating disk 300, mobile manipulator 210 and the effect by gas the pawl 212 not CD of sputter are positioned in the conveyor chamber 112 in the bearing cavity 305 on the sputter rotating disks 300, and this moment, the center of the CD of sputter was not located on the locating shaft core 310.Drive rotating disk driving mechanism 600, sputter rotating disk 300 Rotate 180 degree are moved in the sputter chamber 114 from the conveyor chamber 112 of main body 100, realize seamless link by sealing-ring 330 between sputter rotating disk 300 and the described shack, the negative electrode 400 that is installed on the shack 500 is realized the not sputter CD that is positioned under the negative electrode 400 and be in the bearing cavity 305 of sputter rotating disk 300 is carried out sputter by the interior target established, after sputter is finished, rotating disk driving mechanism 600 driving sputter rotating disks 300 Rotate 180 degree are once more sent sputter chamber 114 with CD 700, are sent in the next process procedure by the mechanical manipulator extracting in conveyor chamber.
Compared with prior art, because the utility model precise positioning sputtering device also includes positioning fixture 800, described positioning fixture 800 has the centre hole 820 with locating shaft core 310 coupling of described sputter rotating disk 300, described positioning fixture 800 is assemblied on the described shack 500 coaxially, moving described shack 500 is placed on the axle core 310 of described sputter rotating disk 300 centre hole 820 of described positioning fixture 800 with positioning fixture 800, shack 500 is fixed on the described main body cover plate 200, precisely realize the location between negative electrode 400 and the CD 700 apace, improve assembling speed.Described positioning fixture 800 is simple in structure, with low cost, make shack 400 and locating shaft core 310 keep concentric by described positioning fixture 800, ensure that CD 700 and negative electrode 400 all are in the suitable position of expection, thereby guarantee the sputter effect of sputtered layer, guarantee that particularly sputtered layer is not eccentric, improve the CD yield rate.
Above disclosed only is preferred embodiments of the present utility model, can not limit the interest field of the utility model certainly with this, and therefore the equivalent variations of being done according to the utility model claim still belongs to the scope that the utility model is contained.

Claims (6)

1. precise positioning sputtering device, comprise main body, main body cover plate, the sputter rotating disk, negative electrode, shack, mechanical manipulator, the rotating disk driving mechanism, described main body offers cavity, described cavity comprises sputter chamber and the conveyor chamber that is interconnected, described main body cover plate is fixed on the described main body and offers uncovered with the conveying of described sputter chamber and the corresponding connection of conveyor chamber respectively and sputter is uncovered, described rotating disk driving mechanism is installed on the described main body and with described sputter rotating disk and is connected, described sputter rotating disk offers the bearing cavity that is complementary with CD, described sputter center of turntable place is provided with and stretches into the locating shaft core that described bearing cavity is used for fixing CD, described mechanical manipulator is arranged at directly over the described conveyor chamber, described shack be connected with described main body cover plate and be contained in the sputter of described main body cover plate uncovered in, described negative electrode is installed on the described shack, be provided with the sputter target in the described negative electrode, CD is placed or taken away to described mechanical manipulator to the sputter rotating disk that is positioned at described conveyor chamber, the negative electrode that is placed with target carries out plated film to the CD on the sputter rotating disk that is positioned at described sputter chamber, the described sputter rotating disk of described rotating disk drive mechanism is incited somebody to action not at described cavity internal rotation, and the CD of sputter is written into and the CD behind the sputter is carried out described sputter chamber, it is characterized in that, also include positioning fixture, described positioning fixture has the centre hole that the locating shaft core with described sputter rotating disk is complementary, described positioning fixture is assemblied on the described shack coaxially, moving described shack and positioning fixture is placed on the axle core of described sputter rotating disk the centre hole of described positioning fixture, shack is fixed on the described main body cover plate, realizes the location between negative electrode and the CD.
2. precise positioning sputtering device as claimed in claim 1 is characterized in that, the diameter of described locating shaft core is 15 millimeters, and the tolerance between described centre hole and the described locating shaft core is between 0 millimeter to 0.05 millimeter.
3. precise positioning sputtering device as claimed in claim 1 is characterized in that, described positioning fixture is and the disk of described shack outline, and described disk protrudes out the engagement part along upper limb, and described engagement part engages with described shack.
4. precise positioning sputtering device as claimed in claim 3 is characterized in that symmetry offers two satellite holes on the described disk.
5. precise positioning sputtering device as claimed in claim 4 is characterized in that, described disk is an aluminum alloy material.
6. precise positioning sputtering device as claimed in claim 1 is characterized in that, offers groove on the described sputter rotating disk, and described groove content is provided with sealing-ring, and described sealing-ring is between described sputter rotating disk and described shack.
CN2010201088515U 2010-01-29 2010-01-29 Sputtering device with accurate positioning Expired - Lifetime CN201626979U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105458486A (en) * 2014-09-05 2016-04-06 宁波江丰电子材料股份有限公司 Welding method and welding device
CN107815652A (en) * 2017-09-28 2018-03-20 南京宝丽晶电子科技有限公司 A kind of rotatable target clamping device
CN113564542A (en) * 2021-07-06 2021-10-29 赫得纳米科技(昆山)有限公司 Positioning device and positioning method for sputtering machine convenient to position

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105458486A (en) * 2014-09-05 2016-04-06 宁波江丰电子材料股份有限公司 Welding method and welding device
CN107815652A (en) * 2017-09-28 2018-03-20 南京宝丽晶电子科技有限公司 A kind of rotatable target clamping device
CN113564542A (en) * 2021-07-06 2021-10-29 赫得纳米科技(昆山)有限公司 Positioning device and positioning method for sputtering machine convenient to position

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Granted publication date: 20101110

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