WO2011071784A1 - Fabrication of touch sensor panel using laser ablation - Google Patents

Fabrication of touch sensor panel using laser ablation Download PDF

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Publication number
WO2011071784A1
WO2011071784A1 PCT/US2010/058988 US2010058988W WO2011071784A1 WO 2011071784 A1 WO2011071784 A1 WO 2011071784A1 US 2010058988 W US2010058988 W US 2010058988W WO 2011071784 A1 WO2011071784 A1 WO 2011071784A1
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WO
WIPO (PCT)
Prior art keywords
conductive
substrate
depositing
ablating
conductive layer
Prior art date
Application number
PCT/US2010/058988
Other languages
English (en)
French (fr)
Inventor
Jonah A. Harley
Original Assignee
Apple Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apple Inc. filed Critical Apple Inc.
Publication of WO2011071784A1 publication Critical patent/WO2011071784A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Definitions

  • This relates generally to touch sensor panels and, more particularly, to fabrication of a touch sensor panel using laser ablation.
  • Touch sensor panels are increasingly used as input devices to a computing system.
  • a touch sensor panel can include a cover substrate (formed from glass, polymer, or the like) to input information via touch and a sensor substrate (also formed from glass, polymer, or the like) with touch sensors to sense the touch on the cover substrate.
  • a cover substrate formed from glass, polymer, or the like
  • a sensor substrate also formed from glass, polymer, or the like
  • successfully providing a touch sensor panel without the sensor substrate has not been easy.
  • the cover substrate is glass cut and shaped from a motherglass sheet. Then, for strength and durability, the cover glass is typically chemically strengthened with a strong ionic solution to strengthen all the glass surfaces, including the cut, shaped edges.
  • a fabrication method can include depositing a conductive layer onto a substrate, depositing a dielectric material onto the conductive layer, ablating the conductive layer to define different regions for touch sensors, and depositing a conductive material on the dielectric material.
  • Another fabrication method can include sputtering a conductive material onto a substrate at discrete locations on the substrate, printing a dielectric material on the conductive material at the discrete locations, depositing a conductive layer over the substrate, and selectively ablating the conductive layer at the discrete locations to define different regions for touch sensors.
  • FIGs. la and lb illustrate a plan view and a cross-sectional view, respectively, of an exemplary touch sensor panel fabricated using laser ablation according to various embodiments.
  • FIG. 2 illustrates an exemplary method for fabricating a touch sensor panel using laser ablation according to various embodiments.
  • FIGs. 3a through 3f illustrate an exemplary touch sensor panel fabricated using laser ablation according to various embodiments.
  • FIG. 4 illustrates another exemplary method for fabricating a touch sensor panel using laser ablation according to various embodiments.
  • FIGs. 5a through 5g illustrate another exemplary touch sensor panel fabricated using laser ablation according to various embodiments.
  • FIG. 6 illustrates an exemplary mobile telephone having a touch sensor panel fabricated using laser ablation according to various embodiments.
  • FIG. 7 illustrates an exemplary digital media player having a touch sensor panel fabricated using laser ablation according to various embodiments.
  • FIG. 8 illustrates an exemplary personal computer having a touch sensitive display and a touchpad fabricated using laser ablation according to various embodiments.
  • the fabricated touch sensor panel can have touch sensors disposed on an under surface of a cover substrate.
  • a fabrication method can include depositing a conductive layer onto a substrate, depositing a dielectric material onto the conductive layer, ablating the conductive layer to define different regions for the touch sensors, and depositing a conductive material on the dielectric material.
  • Another fabrication method can include sputtering a conductive material onto a substrate at discrete locations on the substrate, printing a dielectric material on the conductive material at the discrete locations, depositing a conductive layer over the substrate, and selectively ablating the conductive layer at the discrete locations to define different regions for the touch sensors.
  • These fabrication methods can advantageously provide touch sensors on an under surface of a cover substrate of a touch sensor panel, thereby resulting in a thinner panel.
  • FIGs. la and l b illustrate a plan view and a cross-sectional view, respectively, of an exemplary touch sensor panel fabricated using laser ablation according to various embodiments.
  • touch sensor panel 100 can include cover substrate 140 having touch surface 142 for touching by an object, such as a user's finger, a stylus, and the like.
  • the touch sensor panel 100 can also include touch sensors 120 disposed on under surface 144 of the cover substrate 140 (a surface opposite the touch surface 142) for sensing a touch on the touch surface 142.
  • Rows 102 and columns 104 of conductive traces can form the touch sensors 120 around crossover regions 110 of the traces.
  • the touch sensor panel 100 can also include opaque mask 130 disposed on the under surface 144 of the cover substrate 140 for providing an aesthetic border to hide underlying circuitry.
  • the opaque mask 130 can be conductive and can form row connections 1 12 and column connections 1 14 for electrically connecting the touch sensors 120 to other sensing circuitry (not shown).
  • the opaque mask 130 can be non-conductive and can have conductive traces forming the row connections 1 12 and column connections 1 14 disposed thereon.
  • the touch sensors 120, opaque mask 130, and connectors 1 12 and 1 14 can be formed on the cover substrate 140 using laser ablation and printing, such as ink- jet printing or screen printing, for example, which will be described in more detail below.
  • touch sensors 120 are not limited to a row-column arrangement illustrated here, but can include radial, circular, diamond, and other arrangements capable of sensing a touch.
  • FIG. 2 illustrates an exemplary method for fabricating a touch sensor panel using laser ablation according to various embodiments.
  • a cover substrate having been strengthened and formed into a desired shape for a touch sensor panel can be provided (205).
  • the cover substrate can be glass, polymer, or some other suitable substrate, for example.
  • a transparent conductive layer can be deposited on the under surface of the cover substrate to blanket the under surface, where the under surface can be opposite the cover substrate touch surface (210).
  • the conductive layer can be deposited using a sputtering technique, for example.
  • the conductive layer can be indium-tin-oxide (ITO) or some other suitable conductive material, for example.
  • ITO indium-tin-oxide
  • An opaque dielectric material can be printed onto the conductive layer around the border of the cover substrate to form an opaque mask and can be printed onto the conductive layer at crossover regions in a center portion of the cover substrate to form discrete opaque dots (215).
  • the crossover regions can refer to regions on the cover substrate where touch sensor rows and columns can be formed to cross over each other and remain electrically isolated from each other.
  • the opaque material can be printed at the border and the crossover regions either in a single operation or in separate sequential operations.
  • a laser can ablate the conductive layer in the center portion to define rows and columns for touch sensors (220).
  • the laser can remove some of the conductive layer to create gaps separating and electrically isolating the rows and columns from each other.
  • the laser can also remove portions of the opaque dots printed at the conductive layer removal locations.
  • the gaps can be patterned to divide the conductive layer into essentially horizontal discontinuous regions (forming rows) and essentially vertical continuous regions (forming columns), where the horizontal row regions are bisected by the vertical column regions.
  • the locations where the horizontal row regions are bisected by the vertical column regions can be the crossover regions at which touch sensors can form.
  • the discontinuous row regions can be electrically connected together at the crossover regions to form electrically continuous rows, as will be described below.
  • Other patterns of the conductive layer are also possible according to the desired touch sensor arrangement.
  • the row regions can be continuous and the column regions can be discontinuous and bisected by the row regions.
  • the laser can also ablate the conductive layer around the inside perimeter of the opaque mask at the border (220).
  • the laser can remove some of the conductive layer to create a perimeter gap separating and electrically isolating the rows and columns from the conductive layer at the border.
  • a print device can print dots of a second conductive material on the conductive layer and the opaque dots at the crossover regions to bridge the discontinuous row regions, thereby electrically connecting these regions in rows (225).
  • the print device can also print traces of the second conductive material onto the opaque mask at the border to define connections to the rows and columns (225).
  • the second conductive material can be printed at the border and the crossover regions either in a single operation or in separate sequential operations.
  • the second conductive material can be silver ink, ITO, or some other suitable conductive material, for example.
  • the print device can utilize ink-jet printing, screen printing, or other suitable printing techniques.
  • the touch sensors in the crossover regions can now be considered formed, with conductive column regions, conductive row regions connected together with conductive dots and crossing over the conductive column regions, and opaque dielectric dots between the row and column regions to ensure that they are electrically isolated from each other.
  • the print device can be imprecise, resulting in dots that are larger than needed and that are also visible through the cover substrate.
  • the conductive and opaque dots' sizes can be adjusted (230). The laser can ablate the opaque dots and the conductive dots in the crossover regions to remove portions thereof, thereby reducing the size and visibility of the dots.
  • a passivation layer can optionally be deposited to cover all the components on the cover substrate under surface, including the touch sensors and the opaque mask, except a small portion of the opaque mask at the border (235).
  • the passivation layer can be a transparent dielectric or some other suitable material, for example.
  • the small portion of the mask at the border can expose the ends of the row and column connections for connecting to other sensing circuitry, such as a flex circuit, for example.
  • the passivation layer can protect the cover substrate components from corrosion.
  • FIGs. 3a through 3f illustrate an exemplary touch sensor panel fabricated according to the method of FIG. 2. In the example of FIG.
  • touch sensor panel 300 can include cover substrate 340 having transparent conductive layer 360 covering an under surface of the substrate opposite the touch surface.
  • Crossover region 310 can include the transparent conductive layer 360.
  • opaque dielectric material can be printed on the conductive layer 360 around the border of the cover substrate to form opaque mask 330.
  • the opaque dielectric material can also be printed on the conductive layer 360 at crossover regions to form opaque dots 330.
  • the crossover region 310 illustrates the opaque dielectric dot 330 disposed on the conductive layer 360.
  • the dot 330 can have a size of about 100 ⁇ by 150 urn.
  • FIG. 3b touch sensor panel 300 can include cover substrate 340 having transparent conductive layer 360 covering an under surface of the substrate opposite the touch surface.
  • Crossover region 310 can include the transparent conductive layer 360.
  • opaque dielectric material can be printed on the conductive layer 360 around the border of the cover substrate to form opaque mask 330.
  • the opaque dielectric material can also be printed on the conductive layer 360 at crossover regions to form opaque dots 330
  • the conductive layer 360 in a center portion of the cover substrate can be ablated to define rows 302 and columns 304 of touch sensors, where the rows and columns are separated and electrically isolated by gaps 306.
  • the crossover region 310 illustrates the column 304, which forms a continuous vertical region of the conductive layer with the ablated opaque dot 330 disposed thereon, the row 302, which forms two adjacent discontinuous horizontal regions of the conductive layer, and the gap 306, which electrically isolates the row and column from each other.
  • the conductive layer 360 at the inside perimeter of the opaque mask 330 in a border portion of the cover substrate can also be ablated to form border gap 376.
  • dots of conductive material 309 can be printed in the crossover regions 310.
  • the crossover region 310 illustrates the conductive dot 309 covering portions of the opaque dot 330 and contacting the two adjacent regions forming the row 302.
  • the conductive dot 309 can bridge the two regions to electrically connect them together to form the row 302 crossing over the column 304, with the ablated opaque dot 330 separating the row and column.
  • the conductive dot 309 can have a size of about 100 ⁇ by 150 ⁇ . Traces of the conductive material can also be printed on the opaque mask at the border to define row connections 312 and column connections 314.
  • the row connections 312 can connect the rows 302 and the column connections 314 can connect the columns 304 to other sensing circuitry.
  • the conductive dots 309 and the opaque dots 330 in the crossover regions 310 can be ablated to remove any regions 388 that are too large and/or visible through the cover substrate, while still providing the electrical connection between the row regions and the separation between the row and column.
  • the dots 309 and 330 can be reduced in width to about 25 ⁇ . In the example of FIG.
  • passivation layer 390 can cover the components, except for a portion of the border that can be used for connecting to other sensing circuitry, e.g., the portion can be used as a bonding area 395 to bond the row and column connections 312 and 314 to a flex circuit (not shown).
  • FIG. 4 illustrates another exemplary method for fabricating a touch sensor panel using laser ablation according to various embodiments.
  • a cover substrate having been strengthened and formed into a desired shape for a touch sensor panel can be provided (405).
  • the cover substrate can be glass, polymer, or some other suitable substrate, for example.
  • a first conductive material can be sputtered onto an under surface of the cover substrate around the border of the cover substrate and at crossover regions in a center portion of the cover substrate to form discrete conductive dots (410).
  • the first conductive material can be an opaque material such as black chrome or some other suitable opaque conductive material or stack of materials, for example.
  • the first conductive material can be a transparent material such as ITO or some other suitable transparent conductive material or stack of materials, for example.
  • the crossover regions as described previously can be regions where rows and columns of conductive traces cross to form touch sensors.
  • a shadow mask or a print screen can be used during the sputtering to cover a center portion of the cover substrate, except discrete areas corresponding to the crossover regions, and to expose a border portion of the cover substrate and the discrete areas to the sputtered conductive material. If the conductive material is opaque, the conductive material can serve as a mask at the border.
  • Sputtering can result in a deposition with coarsely defined edges, sizes, and/or shapes.
  • a laser can ablate the sputtered conductive material to sharpen the edges at the border (if opaque) and to reduce the size of the discrete conductive dots (if opaque) to make them less visible through the cover substrate (415).
  • a print device can print dots of a transparent dielectric material on the conductive dots at the crossover regions (420).
  • the print device can utilize ink- jet printing, screen printing, or some other suitable printing techniques.
  • the dielectric dots can be printed to cover part but not all of the conductive dots. The uncovered portions of the conductive dots can be used as will be described in more detail below.
  • a second conductive material can be deposited over the under surface of the cover substrate to blanket the under surface, including covering the first conductive material and the transparent dielectric material (425).
  • the second conductive material can be ITO or some other suitable conductive material, for example.
  • a laser can ablate the second conductive material in the center portion to define rows and columns for touch sensors by removing some of the conductive material to create gaps separating and electrically isolating the rows and columns (430).
  • the gaps can be patterned to create the rows and columns, as previously described.
  • the rows can be continuous horizontal regions and the columns can be discontinuous vertical regions bisected by the horizontal row regions.
  • the laser wavelength, pulse duration, power, and the like can be tuned so that it selectively ablates the second conductive material, but stops on either the underlying dielectric dots or the underlying conductive dots.
  • the touch sensors in the crossover regions can now be considered formed, with conductive column regions connected together with the uncovered portions of the conductive dots on the cover substrate, conductive row regions crossing over the conductive column regions, and transparent dielectric between the row and column regions to ensure that they are electrically isolated from each other.
  • the laser can also ablate the second conductive material and the first conductive material in the border portion to define connections to the rows and columns (430).
  • the laser can remove some of the first and second conductive material to create gaps separating and electrically isolating the connections (415).
  • the gaps can be patterned so that the defined connections can be aligned with corresponding rows and columns in the center portion.
  • the print device can print opaque ink on the gaps between the connections in the border region to prevent light underneath the cover substrate from leaking through (435). If the first conductive material is transparent, the print device can print the opaque ink on the entire border portion to form an opaque mask.
  • a passivation layer can be deposited to cover all the components on the cover substrate, including the touch sensors and the connections, except a small portion at the border (440).
  • the small portion can expose the ends of the row and column connections for connecting to other sensing circuitry, such as a flex circuit, for example.
  • the passivation layer can protect the cover substrate components from corrosion.
  • FIGs. 5a through 5g illustrate an exemplary touch sensor panel fabricated according to the method of FIG. 4.
  • touch sensor panel 500 can include cover substrate 540 having opaque conductive material 530 sputtered on an under surface around a border of the cover substrate to form an opaque mask and at crossover regions 510 on the cover substrate to form discrete dots.
  • the crossover region 510 can include a dot of the opaque conductive material 530.
  • the opaque conductive dots 530 in the crossover regions 510 can be ablated to be thinner and less visible through the cover substrate 540.
  • the dots 530 can have an ablated size of about 20 ⁇ by 200 ⁇ .
  • dots of transparent dielectric material 508 can be printed on the opaque conductive dots 530 in the crossover regions 510.
  • conductive layer 560 can be deposited over the entire cover substrate 540, including the opaque conductive dots 530, the opaque mask 530, and the transparent dielectric dots 508.
  • the conductive layer 560 in a center portion of the cover substrate 540 can be ablated to define rows 502 and columns 504 of touch sensors, where the rows and columns are separated and electrically isolated by gaps 506.
  • the crossover region 510 illustrates the row 502, which forms a continuous horizontal region of the conductive layer, the column 504, which forms two adjacent discontinuous vertical regions of the conductive layer, and the gap 506, which electrically isolates the row and column from each other.
  • the opaque conductive dot 530 can bridge the two vertical regions to electrically connect them together to form the column 504 crossing under the row 502, with the dielectric dot 508 separating the row and column.
  • the opaque mask 530 and the conductive layer 560 in a border portion of the cover substrate 540 can also be ablated to define row connections 512 and column connections 514 to the rows 502 and columns 504, where the connections are separated and electrically isolated by respective gaps 572 and 574.
  • opaque ink 596 can be printed on the gaps 572 and 574 in the border portion of the cover substrate 540.
  • passivation layer 590 can cover the cover substrate components, except for a portion of the border that can be used for connecting to other sensing circuitry, e.g., the portion can be used as a bonding area 595 for a flex circuit (not shown).
  • a transparent conductive material can be used.
  • the conductive dots 530 need not be ablated to make them less visible through the cover substrate (as in FIG. 5b) and the opaque ink 596 can be deposited around the entire border to form the opaque mask (as in FIG. 5f).
  • FIG. 6 illustrates an exemplary mobile telephone 600 that can include a display 636 and a touch sensor panel 624 fabricated using laser ablation according to various embodiments.
  • FIG. 7 illustrates an exemplary digital media player 700 that can include a display 736 and a touch sensor panel 724 fabricated using laser ablation according to various embodiments.
  • FIG. 8 illustrates an exemplary personal computer 800 that can include a touch sensitive display 836 and a touch sensor panel (trackpad) 824, where the touch sensitive display and the trackpad can be fabricated using laser ablation according to various embodiments.
  • 6 through 8 can be thinner with a touch sensor panel fabricated according to various embodiments.
  • touch sensors being formed on a single side of a strengthened, formed cover substrate, it is to be understood that the touch sensors or portions thereof can be formed on multiple sides of the cover substrate or some other suitable substrate ready for use in a touch sensor panel.
PCT/US2010/058988 2009-12-07 2010-12-03 Fabrication of touch sensor panel using laser ablation WO2011071784A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US26734609P 2009-12-07 2009-12-07
US61/267,346 2009-12-07
US12/642,466 US20110134050A1 (en) 2009-12-07 2009-12-18 Fabrication of touch sensor panel using laser ablation
US12/642,466 2009-12-18

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WO2011071784A1 true WO2011071784A1 (en) 2011-06-16

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US (1) US20110134050A1 (zh)
CN (1) CN102141855B (zh)
TW (1) TWI444864B (zh)
WO (1) WO2011071784A1 (zh)

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