WO2011068359A2 - Rfid 태그 내장형 인레이와, 이를 포함하는 카드, 및 rfid 태그 내장형 인레이의 제조 방법 - Google Patents

Rfid 태그 내장형 인레이와, 이를 포함하는 카드, 및 rfid 태그 내장형 인레이의 제조 방법 Download PDF

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Publication number
WO2011068359A2
WO2011068359A2 PCT/KR2010/008562 KR2010008562W WO2011068359A2 WO 2011068359 A2 WO2011068359 A2 WO 2011068359A2 KR 2010008562 W KR2010008562 W KR 2010008562W WO 2011068359 A2 WO2011068359 A2 WO 2011068359A2
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WO
WIPO (PCT)
Prior art keywords
pattern circuit
pad
pattern
film layer
rfid tag
Prior art date
Application number
PCT/KR2010/008562
Other languages
English (en)
French (fr)
Korean (ko)
Other versions
WO2011068359A3 (ko
Inventor
이종기
나경록
Original Assignee
삼원에프에이 주식회사
주식회사 이모트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼원에프에이 주식회사, 주식회사 이모트 filed Critical 삼원에프에이 주식회사
Priority to CN201080054992.6A priority Critical patent/CN102918549B/zh
Priority to JP2012541943A priority patent/JP5527674B2/ja
Publication of WO2011068359A2 publication Critical patent/WO2011068359A2/ko
Publication of WO2011068359A3 publication Critical patent/WO2011068359A3/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • the present invention relates to an RFID tag embedded inlay, and a method for manufacturing a card and an RFID tag embedded inlay including the same, and more particularly, an RFID tag embedded inlay that can be easily manufactured through a plating process using a master, and the same.
  • a card and a method for manufacturing an RFID tag embedded inlay.
  • RFID Radio Frequency IDentification
  • combination smart card systems are being used in various fields, ranging from postpaid high pass cards to transportation cards and bank cards.
  • the combi smart card system refers to a system using a smart card in which the IC chip is exposed on the card surface.
  • the RFID system basically consists of an RFID tag and an RFID reader.
  • the RFID tag incorporates an antenna circuit pattern.
  • the 13.5 MHz circuit pattern may be manufactured in the form of a coil to induce electrical energy by external electromagnetic waves or to radiate a signal to be transmitted from an RFID IC chip to the outside. Therefore, in manufacturing the RFID tag embedded inlay, the manufacturing process of the circuit pattern and the formation of the pad portion, which is the circuit connection portion of the IC chip, play an important part.
  • a coil may be wound directly on a substrate several times to be fixed to the core film layer, or an etching circuit pattern may be fabricated on a substrate in which the core film and copper foil are incorporated. The process was carried out.
  • the method of integrating the coil directly on the substrate has a problem in process and is inadequate for mass production.
  • connection part of the circuit pattern that is, the pad part
  • the connection part of the circuit pattern is implemented in a separate process, thereby resulting in poor productivity. Therefore, there is a need for development of a manufacturing method capable of manufacturing an RFID tag embedded inlay having a more precise structure in a more convenient manner.
  • an object of the present invention is to manufacture a circuit pattern of the RFID tag by a plating method using a master including a resin region and a non-resin region, RFID tag embedded inlay conveniently To provide a RFID tag embedded inlay manufacturing method and a RFID tag embedded inlay manufactured by the method and a card comprising the same.
  • an RFID tag embedded inlay manufacturing method is plated on a non-resin region by plating a master surface on which a resin region filled with resin and a non-resin region forming a predetermined pattern are formed.
  • the plurality of pattern circuits may include a first conductive portion wound along an edge of the core film layer surface and a second conductive portion formed inside the first conductive portion on the core film layer surface.
  • a first outer pad and a first inner pad may be formed at both ends of the first conductive part, respectively, and a second outer pad and a second inner pad may be formed at both ends of the second conductive part.
  • the RFID tag embedded inlay manufacturing method forming a coverlay layer for exposing at least a portion of each of the first inner pad and the second inner pad on the plurality of pattern circuit portion and the exposure of the coverlay layer
  • the method may further include disposing an RFID chip electrically connected to each of the first inner pad and the second inner pad.
  • the insulating part may be formed in a space between the first external pad and the second external pads.
  • the forming of the jump line may include forming at least a portion of each of the first outer pad and the second outer pad and a mask exposing at least a portion of the insulating portion, and printing a conductive material on the exposed portion.
  • the method may include forming a jump line connecting the first external pad and the second external pad to each other and removing the mask.
  • the method may further include releasing the non-resin area of the master.
  • the resin may be Teflon.
  • the RFID tag may be an RFID tag for 13.56 MHz.
  • RFID tag embedded inlay the core film layer, the first conductive portion of the form wound along the edge of the surface of the core film layer, the first conductive portion on the surface of the core film layer A second inner portion formed inside, a first inner pad formed at one end of the first conductive portion, a first outer pad formed at the other end of the first conductive portion, a second inner pad formed at one end of the second conductive portion, A second external pad formed at the other end of the second conductive part, an insulating part formed in a space between the first external pad and the second external pad, and formed on the insulating part to form the first external pad and the second external pad; And a jump line for electrically connecting the pads.
  • the card according to an embodiment of the present invention the core film layer, the first conductive portion of the form wound along the edge of the surface of the core film layer, formed on the inside of the first conductive portion on the surface of the core film layer A second conductive part, a first inner pad formed at one end of the first conductive part, a first outer pad formed at the other end of the first conductive part, a second inner pad formed at one end of the second conductive part, and the second A second outer pad formed at the other end of the conductive part, an insulating part formed in a space between the first outer pad and the second outer pad, and formed between the first outer pad and the second outer pad.
  • Key may comprise an RFID chip electrically connected to the first internal pad and the second internal pad, respectively in the coverlay layer and the exposed portion.
  • the first conductive portion and the second conductive portion connected by the jump line may constitute a circuit pattern used for an RFID tag for 13.56 MHz.
  • an RFID tag-embedded inlay and a card including the same may be conveniently and quickly manufactured using a master.
  • the surface of the master is provided with a resin region and a non-resin region, the plating is performed only in the non-resin region, it is possible to precisely manufacture the RFID circuit pattern.
  • the master can be used repeatedly.
  • FIG. 1 is a plan view showing an example of a master configuration for manufacturing an RFID tag embedded inlay according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing a cross section of the master of FIG. 1;
  • 3 to 5 are cross-sectional views illustrating a process of manufacturing an RFID tag embedded inlay using the master of FIG. 1;
  • FIG. 6 is a plan view corresponding to the cross-sectional view of FIG. 5;
  • FIG. 7 is a plan view illustrating a process of forming an insulation part in a space between a plurality of pattern circuit parts
  • FIGS. 8 and 9 are plan views illustrating a process of manufacturing a jump line connecting a plurality of pattern circuit units
  • 10 and 11 are plan views illustrating a process of completing an RFID tag embedded inlay by mounting a coverlay layer and an RFID chip on an RFID tag circuit pattern.
  • FIG. 1 is a schematic diagram showing the configuration of a master used in the RFID tag manufacturing method according to an embodiment of the present invention.
  • the resin region 110 and the non-resin regions 120 and 130 are provided on the surface of the master 100.
  • the resin region 110 refers to a portion in which a resin is filled in a groove formed on the surface of the master 100.
  • the non-resin regions 120 and 130 refer to portions of the master 100 that are not filled with resin.
  • the non-resin regions 120 and 130 are divided into a first region 120 provided to form the first conductive portion and a second region 130 provided to form the second conductive portion.
  • the master 100 is a kind of mold for manufacturing a circuit pattern of the RFID tag, that is, a part serving as a mold. That is, a conductive material is formed on the non-resin regions 120 and 130 to form a pattern circuit part. Therefore, the non-resin regions 120 and 130 are manufactured in a shape corresponding to the circuit pattern embedded in the RFID tag.
  • the master 100 of FIG. 1 may be manufactured in various ways.
  • the master 100 may be a metal etching master manufactured by a photolit-etching method.
  • the master 100 When the master 100 is implemented in a form containing a metal, it may be referred to as a metal master.
  • the resin to be filled in the resin region 110 may be used any material having a property of excellent chemical resistance or excellent non-tackiness after a specific treatment (for example, heat treatment, etc.).
  • a fluorine-based polymer resin in particular, a fluoro ethylene resin can be used.
  • poly tetra fluoro ethylene resin can be used.
  • a silicone-based polymer resin may be used.
  • Teflon (trademark) registered by the US DuPont Poly Tetra Fluoro Ethylene (P.T.F.E) resin
  • Teflon is excellent in heat resistance, chemical resistance, abrasiveness, low temperature resistance, electrical insulation, and high frequency characteristics compared to general plastics, and is suitable for use in fabricating the present pattern structure because of its unique non-tackiness and low friction characteristics.
  • the master 100 has grooves of a predetermined shape formed on the surface thereof, and the resin is filled in the grooves to form the resin region 110, and the remaining portions except the resin region 110 are non-resin. Area 120 is formed.
  • the depth and area of the resin region 110 may be variously changed according to the manufacturing process conditions of the master 100.
  • 3 to 5 are cross-sectional views illustrating a method of manufacturing an RFID tag according to an embodiment of the present invention.
  • the surface of the master 100 provided with the resin region 110 and the non-resin regions 120 and 130 is plated to form the pattern circuit portions 141 and 142.
  • the plating operation may be made of metal such as nickel, silver or copper.
  • the pattern circuit portions 141 and 142 may be formed by plating the copper plating bath at about 30 ° C. for about 5 to 15 minutes using a copper plating solution such as a copper sulfate plating solution.
  • the plating power source may use a direct current or pulse power supply.
  • the thickness of the pattern circuits 141 and 142 can be adjusted through plating time or plating power supply control. That is, the thickness of the pattern circuit portions 141 and 142 can be appropriately adjusted by controlling the application time of the DC or pulse power supply, pulse width modulation, current density, and the like.
  • the first pattern circuit part 141 of the plurality of pattern circuit parts 141 and 142 means a plating material formed on a portion of the non-resin area corresponding to the first area 120, and the second pattern circuit part 142 is a non-resin resin.
  • the plating material is formed on a portion of the region corresponding to the second region 130.
  • the first pattern circuit part 141 is formed to be wound along the edge of the master 100, and the second pattern circuit part 142 is formed on the inner side of the first pattern circuit part 141 to form a first pattern.
  • the circuit unit 141 may be spaced apart from the predetermined distance.
  • the surface of the non-resin regions 120 and 130 may be released before plating. That is, after the pattern circuit portions 141 and 142 are formed due to the plating, they must be transferred to the core film layer (not shown) in a subsequent process, so that the separation must be easy. To this end, the surface of the non-resin regions 120 and 130 may be released in advance.
  • the core film layer 200 is bonded to the master 100 as shown in FIG. 4.
  • the core film layer 200 includes a binder layer 210 and a support layer 220.
  • the binder layer 210 is formed. Accordingly, the core film layer 200 and the master 100 are bonded to each other so that the formed binder layer 210 faces the master 100 surface.
  • the bonding process may be performed by bonding a polyester film or a polyvinyl chloride film coated with a binder having physical properties such as a pressure-sensitive adhesive to the pattern circuit portions 141 and 142.
  • polyester-based hot melt liquid or hot melt film may be used as the binder.
  • a binder may be implemented in the form of a bonding film through a process such as coating, drying, curing, or laminating on the surface of the material layer, thereby bonding the core film layer 200 to the master 100 side.
  • the support layer 220 of the core film layer 200 may be a plastic material commonly used for RFID tags or cards, that is, a polyester film or a polyvinyl chloride film. Various materials such as may be used. However, when using a conductive support layer 220 such as metal, an insulation treatment may be performed on the surface of the support layer 220 so that RF reception and radiation operations in the pattern circuits 141 and 142 may be normally performed.
  • the bonding process may also be made through a laminating facility.
  • Laminating refers to a process of sandwiching the contents between a thin film such as polyester or a sheet such as glass and then attaching the contents.
  • a hot laminating process of applying heat and pressure using a roller, a hot plate, a roller with a built-in hot plate, or the like may be used.
  • the bonding process may be performed at room temperature in the case of a binder exhibiting physical properties such as an adhesive.
  • the binder layer 210 and the support layer 220 portions are separated from the master 100 together with the pattern circuit portions 141 and 142 in a subsequent process to support the pattern circuit portions 141 and 142.
  • the binder layer 210 may contact the resin region 110 during the bonding process.
  • the core film layer 200 is bonded to the master 100 as shown in FIG. 4, when a predetermined time elapses, the core film layer 200 is separated into the master 100. In this process, the pattern circuit portions 141 and 142 formed on the surface of the master 100 are transferred onto the core film layer 200.
  • FIG. 5 is a schematic diagram showing the configuration of the core film layer 200 to which the pattern circuit portions 141 and 142 are transferred.
  • the pattern circuit portions 141 and 142 are illustrated as being partially inserted into the binder layer 210, but this is an example, and the pattern circuit portions 141 and 142 are formed on the surface of the binder layer 210. May be fixed, or the pattern circuit parts 141 and 142 may be inserted to reach the surface of the support layer 220.
  • FIG. 6 is a plan view corresponding to the cross-sectional view of FIG. 5.
  • the first pattern circuit part 141 is formed in the form of a plurality of windings along the edge of the core film layer 200, and the second pattern circuit part 142 is formed inside the first pattern circuit part 141. Placed in space.
  • the second pattern circuit unit 142 is illustrated as one line in FIG. 6, the second pattern circuit unit 142 may also be implemented in the form of a coil. That is, the second pattern circuit unit 142 may be implemented to be wound at least once along the inner surface of the first pattern circuit unit 141.
  • two pattern circuit parts need not be formed, and three or more pattern circuit parts may be formed according to embodiments.
  • a first inner pad 141-a is formed at one end of both ends of the first pattern circuit unit 141 of FIG. 6, and a first outer pad 141-b is formed at the other end thereof.
  • a second inner pad 142-a is formed at one end of both ends of the second pattern circuit unit 142, and a second outer pad 142-b is formed at the other end thereof. That is, each pattern circuit part consists of the line part which comprises a pattern, and the pad provided in the both ends of the line.
  • the pattern circuit unit may be manufactured in a batch using the master 100. That is, the line portion and the pad portion constituting the pattern can be produced at once. Therefore, the trouble of separately manufacturing the coil and the pad is eliminated.
  • the first and second inner pads 141-a and 142-a are arranged side by side with each other, but the pads 141-a, 142-a, 141-b, and 142-b are respectively disposed.
  • the position and shape of may be changed in various ways.
  • the plating process By performing the plating process using the master 100 as described above, it is possible to collectively take a plurality of the pattern circuit portion, it is possible to easily manufacture the RFID circuit pattern.
  • the resin region 110 and the non-resin regions 120 and 130 are precisely manufactured on the master 100 and can be repeatedly used, the number of defect patterns generated in the manufacturing process can be reduced.
  • the RFID circuit pattern can be manufactured economically.
  • the circuit pattern manufactured in this manner may be a circuit pattern used for an RFID tag for 13.56 MHz, and the final RFID tag manufactured according to this may be an RFID tag for 13.56 MHz.
  • the first and second external pads 141-b provided at one end of each of the pattern circuit parts 141 and 142 are formed.
  • 142-b is carried out for electrically connecting.
  • an insulating part is formed in a region between the first external pad and the second external pads 141-b and 142-b so as not to short with the lines constituting the first pattern circuit part 141.
  • FIG. 7 illustrates a configuration above the core film layer 200 in which the insulation 150 is formed.
  • the insulating part 150 may be made of a conventional insulating material.
  • the insulating part 150 may be implemented in the form of a sticker, and may be formed in a manner of being attached between the first outer pad and the second outer pads 141-b and 142-b.
  • the insulating liquid may be formed by dropping the insulating liquid into a space between the first outer pad and the second outer pads 141-b and 142-b and then solidifying the insulating liquid.
  • the insulating part 150 is illustrated as being formed only on a part of the entire core film layer 200, but is not necessarily limited thereto. That is, the insulation may be formed on the front surface of the core film layer 200 except for each of the outer pads and the inner pads. Specifically, after the mask is placed on the positions of each of the outer pads and the inner pads, the insulating part may be coated using an insulating solution, or the method of bonding the insulating part using an adhesive to a part except the corresponding parts. Can be formed.
  • FIGS. 8 and 9 show an example of a process for manufacturing a jump line for electrically connecting the plurality of pattern circuit units 141 and 142.
  • the mask 160 is covered on the entire surface of the core film layer 200.
  • An exposed portion 161 is formed in one region of the mask 160.
  • the exposed portion 161 exposes at least a portion of each of the first and second outer pads 141-b and 142-b and at least a portion of the insulating portion 150.
  • the conductive material is coated. Coating of the conductive material may be performed by a process such as printing using a roller, stamping.
  • a jump line 170 is formed as shown in FIG. 9.
  • the jump line 170 may be made of a conductive paste.
  • the jump line 170 is manufactured in the form of electrically connecting the first external pad and the second external pads 141-b and 142-b through the insulating unit 150.
  • the insulating part 150 is prevented from being electrically connected to other parts of the first pattern circuit part 141 except for the first external pads 141-b.
  • the coverlay layer 300 is stacked on the pattern circuit units 141 and 142.
  • the coverlay layer 200 may be made of a plastic or paper material such as a polyester film or a polyvinyl chloride film. Since the coverlay layer 300 is a portion corresponding to the inlay appearance of the RFID tag, the material of the coverlay layer 300 may be made of a material that does not cause a problem in a subsequent process of the card.
  • the coverlay layer 300 may be bonded to the core film layer 200 above the pattern circuit parts 141 and 142 using an adhesive.
  • the type of adhesive may be the same as that of the binder layer 210 described above, or a different adhesive may be used.
  • An exposed portion 310 is formed in one region of the coverlay layer 300.
  • the exposed portion 310 is formed in an appropriate size and position so that at least a portion of each of the lower first inner pad 141-a and the second inner pad 142-a may be exposed.
  • the RFID chip is disposed in the exposed part 310.
  • the RFID chip is electrically connected to each of the first inner pad 141-a and the second inner pad 142-a exposed through the exposed part 310. Accordingly, the production of the RFID tag 400 is completed.
  • the RFID chip is disposed, it is also possible to perform a surface treatment such as coating a transparent film.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PCT/KR2010/008562 2009-12-03 2010-12-01 Rfid 태그 내장형 인레이와, 이를 포함하는 카드, 및 rfid 태그 내장형 인레이의 제조 방법 WO2011068359A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201080054992.6A CN102918549B (zh) 2009-12-03 2010-12-01 Rfid标签内置型嵌体与包括其的卡及rfid标签内置型嵌体的制造方法
JP2012541943A JP5527674B2 (ja) 2009-12-03 2010-12-01 Ｒｆｉｄタグ内蔵型インレイ、これを含むカード、及びｒｆｉｄタグ内蔵型インレイの製造方法

Applications Claiming Priority (2)

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KR10-2009-0119227 2009-12-03
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KR20110062486A (ko) 2011-06-10
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JP5527674B2 (ja) 2014-06-18
CN102918549B (zh) 2015-10-21
CN102918549A (zh) 2013-02-06

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