WO2011068259A1 - 히트싱크 - Google Patents

히트싱크 Download PDF

Info

Publication number
WO2011068259A1
WO2011068259A1 PCT/KR2009/007159 KR2009007159W WO2011068259A1 WO 2011068259 A1 WO2011068259 A1 WO 2011068259A1 KR 2009007159 W KR2009007159 W KR 2009007159W WO 2011068259 A1 WO2011068259 A1 WO 2011068259A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
flange
centrifugal fan
heat dissipation
Prior art date
Application number
PCT/KR2009/007159
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
김성진
김주완
김동권
Original Assignee
한국과학기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Priority to CN2009801627544A priority Critical patent/CN102713486A/zh
Priority to PCT/KR2009/007159 priority patent/WO2011068259A1/ko
Priority to US13/513,507 priority patent/US20120305224A1/en
Publication of WO2011068259A1 publication Critical patent/WO2011068259A1/ko

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/10—Centrifugal pumps for compressing or evacuating
    • F04D17/12—Multi-stage pumps
    • F04D17/127—Multi-stage pumps with radially spaced stages, e.g. for contrarotating type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/26—Rotors specially for elastic fluids
    • F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/281—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/26—Rotors specially for elastic fluids
    • F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
    • F04D29/30—Vanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink, more specifically, to arrange the heat dissipation fin and the blade in a multi-stage concentric circle, and then divide the area of the heat dissipation fin composed of the multi-stage concentric circles by mutual coupling to improve the flow of air to improve the cooling efficiency. It is about a heatsink which makes it possible.
  • cooling means have been provided to stably provide the functions of electronic products.
  • the electronic chip cooling apparatus disclosed in Korean Patent Laid-Open Publication No. 10-2004-52010 includes a terminal base which directly contacts a heating element such as a CPU and conducts heat, a heat pipe soldered on the upper end of the terminal base, A heat dissipation block soldered to the end of the heat pipe, a fan motor positioned at the center thereof to supply cooling fluid to the heat dissipation block, a base frame to which the fan motor and the terminal base are fixed, and a fan motor of the base frame.
  • the electronic chip cooling device consisting of a fan cover for blocking the most of the installation unit except the top center so that the cooling fluid can be efficiently introduced and discharged, by soldering the fan cover formed under the installation line of the heat pipe to the heat pipe
  • the heat pipe conducts heat to the room It is configured to be used as a heat sink to.
  • the electronic chip cooling device conducts heat generated from a heating element such as a CPU to the heat pipes 120 and 130 through the terminal base 110 and is moved to the heat dissipation blocks 140 and 150 formed at each end of the heat pipes 120 and 130.
  • the heat moved to the heat dissipation blocks 140 and 150 is cooled by causing forced convection by driving the fan motor 160.
  • the cooling device for computer parts presented in the Republic of Korea Patent No. 10-600448 is a device for cooling the heat generating parts that generate heat during operation of the components built into the computer, can receive the heat generated from the heat generating parts.
  • a heat transfer block which is tightly coupled to the heat generating parts;
  • At least one heat pipe including a heat transfer block coupling portion coupled to the heat transfer block so as to receive heat from the heat transfer block, and a heat radiation fin coupling portion bent to form a curved shape;
  • a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling portion.
  • the cooling device for a computer component configured as described above serves to cool the heat by dissipating heat into the air from the part of the portion coupled to the heat block 10 through the heat pipe when heat is transferred from the heat-generating electronic component to the heat block.
  • the plurality of heat dissipation fins are configured to cool the computer components by allowing the air flow generated by the cooling fan to pass through the heat dissipation fins to allow the air flow to be discharged to the outside in a spiral manner with respect to the rotation axis of the cooling fan.
  • the cooling device of the prior art as described above is made by applying an axial fan to flow the outside air along the rotational axis of the fan to pass through the heat radiating fins and then flow out in the axial direction. There was a problem falling.
  • the temperature of the heat dissipation fin is cooled through an axial fan installed on the upper part of the heat dissipation fin through which heat of a heat generating component such as a CPU is transferred.
  • the upper part of the heat dissipation fin is first touched by the wind by the wind generated by the axial fan. As it cools, it is allowed to cool in turn through a plurality of lower heat radiation fins.
  • the wind generated from the axial fan has a problem that the cooling intensity is lowered due to the low wind strength by the interference of the heat radiation fins.
  • an object of the present invention is to form a heat sink by combining the heat sink with a centrifugal fan arranged in concentric circles of multiple stages, and then rotate the centrifugal fan so that each stage of the fin is repeatedly divided in and out of the air. To improve the flow.
  • the heat sink of the present invention is provided with a plurality of heat dissipation fins spaced at equal intervals, and then arranged in concentric circles of multiple stages to form a channel between each single layer and a passage between the heat dissipation fins sequentially spaced at each end.
  • a plurality of heat sinks and a plurality of blades arranged in concentric circles of the plurality of stages so as to be disposed between the channels, the channel and the passages of each stage are alternately blocked by rotation, so that the difference between the internal and external air pressures by coupling with the heat sinks It is composed of a centrifugal fan that generates and introduces external air to the inside to release it to the outside.
  • the heat dissipation plate is provided with a second flange for mounting the heat dissipation fins vertically upwards, and is configured by mounting the motor vertically upwards on the second flanges upper surface.
  • the centrifugal fan provides a first flange for mounting the blade vertically downward on the bottom surface to form an inlet hole in the center of the first flange, the coupling block supported by the rib on the top surface is the center of the inlet hole It is positioned so as to be fixed to the rotating shaft of the motor by the coupling hole formed in the coupling block is configured to rotate the centrifugal fan.
  • the passage has a space between the radiating fins sequentially spaced at equal intervals in a state in which the radiating fins are arranged in concentric circles in a plurality of stages, and the space is radially formed outwardly from the center of the second flange in a virtual arc shape.
  • the blade is configured to be arranged to cross between the channel and the passage of each stage of the heat sink.
  • the heat dissipation fin and the blade is formed so that one side has an inclined surface, the inclined surface is formed to have an angle from the outside to the inclined surface in the rotational direction of the centrifugal fan.
  • a heat sink is formed by combining a heat sink with a centrifugal fan having concentric fins arranged in multiple stages, and then rotating the centrifugal fan so that each end of the fin is repeatedly divided.
  • the heat sink of the present invention can minimize the volume by the overlapping combination of the centrifugal fan and the heat sink is effective in miniaturizing the product.
  • FIG. 1 is an exploded perspective view showing a heat sink of the present invention.
  • Figure 2 is a perspective view of the heat sink of the present invention.
  • Figure 3 is a front sectional view showing a heat sink of the present invention.
  • Figure 4 is a front view showing a heat sink of the heat sink of the present invention.
  • Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention.
  • Figure 6 is a plan sectional view showing a heat sink of the present invention.
  • Figure 7 is a photograph showing the experimental state of the heat sink of the present invention.
  • second flange 220 motor
  • Figure 1 is an exploded perspective view showing a heat sink of the present invention
  • Figure 2 is a perspective view showing a heat sink of the present invention
  • Figure 3 is a front sectional view showing a heat sink of the present invention
  • Figure 4 is a heat sink of the present invention
  • Figure 5 is a front view showing a heat sink
  • Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention
  • Figure 6 is a cross-sectional view showing a heat sink of the present invention
  • Figure 7 is a photograph showing an experimental state of the heat sink of the present invention to be.
  • the heat sink 10 of the present invention is composed of a heat sink 200 and a centrifugal fan 100.
  • the heat sink generates a difference in air pressure inside and outside the 10 so that the outside air is introduced into the heat sink 10 and then discharged to the outside so as to perform heat exchange.
  • the heat sink 200 is provided with a plate-shaped second flange 210, the motor 220 is fixed vertically upward in the center of the upper surface of the second flange 210 to position the rotating shaft 221 of the motor 220 upward.
  • the heat radiation fin 230 having a surface on the upper surface of the second flange 210 is installed upright.
  • a plurality of heat dissipation fins 230 are provided so that the heat dissipation fins 230 are spaced at a predetermined interval and are arranged in a circular shape so that a passage 250 for inducing the flow of air in the space between the heat dissipation fins 230 is formed.
  • the passage 250 allows the space between the heat dissipation fins 230 to be sequentially spaced at equal intervals in a state in which the heat dissipation fins 230 are arranged in the concentric circles of the plurality of stages so that the space between the heat dissipation fins 230 is substantially arc-shaped in a radial direction from the center of the second flange 210.
  • a plurality of heat dissipation fins 230 having a circular structure are arranged in concentric circles in multiple stages to stagnate the flow of air between the stages, thereby forming a channel 240 for heat exchange to the heat dissipation fins 230.
  • the channel 240 is formed of at least one, and in the present invention, four channels having four channels 240 are formed.
  • centrifugal fan 100 is provided with a plate-shaped first flange 110, and installs a plurality of blades 140 having a surface in a vertical downward direction on the lower surface of the first flange 110.
  • the blades 140 are arranged in concentric circles of multiple stages so as to be located between the channels 240, and the blades 140 alternately block the channels 240 and the passages 250 of each stage by intersecting the positions of the blades 140 of each stage.
  • the heat dissipation fin 230 and the blade 140 to have one side has an inclined surface, the inclined surface is formed to have an angle from the outside of the inclined surface in the rotational direction of the centrifugal fan 100 so that the air can flow smoothly step by step of each channel 240. do.
  • the centrifugal fan 100 forms an inlet hole 111 in the center of the first flange 110, and the coupling block 130 supported by the ribs 120 on the upper surface thereof is positioned in the center of the inlet hole 111 to form the coupling block 130.
  • the rotation shaft 221 of the motor 220 is fixed to the ball 131 to rotate the centrifugal fan 100 on the heat sink 200.
  • the heat sink 10 of the present invention configured as described above is mounted in close contact with the electronic product to be cooled.
  • the blister and the heat dissipation fin 230 arranged in concentric circles of the multi-stage assume the first innermost channel 240, and the channels arranged outward will be referred to as second and third stages.
  • the first flange 110 is interlocked by the coupling block 130 fixedly integrated with the rotation shaft 221 to rotate the blade 140.
  • the blade 140 rotates in each channel 240 of the heat sink 200.
  • Outside air flows into the inlet hole 111 of the centrifugal fan 100 and air flows into the channel side of the second stage through the passage 250 of the first stage, and the introduced air is introduced into the second stage channel 240 by the blade 140 of the second stage. It flows into the channel between the front and rear surfaces of the two heat sink fins 230.
  • the heat conduction to the heat dissipation fin 230 and then flows through the passage 250 to the third stage channel 240 is repeatedly performed to discharge the air to the outside through the passage 250 located on the outermost side.
  • the heat dissipation plate 200 when the air flows through the heat dissipation fin 230, the heat dissipation plate 200, which is transferred through the second flange 210 of the heat dissipation plate 200 in close contact with the cooling target electronic product, may be cooled by inflow of external air.
  • the thermal resistance is measured by dividing the difference between the temperature of the highest point and the external fluid by the amount of heat applied to the heat sink 10.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/KR2009/007159 2009-12-02 2009-12-02 히트싱크 WO2011068259A1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801627544A CN102713486A (zh) 2009-12-02 2009-12-02 热沉
PCT/KR2009/007159 WO2011068259A1 (ko) 2009-12-02 2009-12-02 히트싱크
US13/513,507 US20120305224A1 (en) 2009-12-02 2009-12-02 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/007159 WO2011068259A1 (ko) 2009-12-02 2009-12-02 히트싱크

Publications (1)

Publication Number Publication Date
WO2011068259A1 true WO2011068259A1 (ko) 2011-06-09

Family

ID=44115090

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007159 WO2011068259A1 (ko) 2009-12-02 2009-12-02 히트싱크

Country Status (3)

Country Link
US (1) US20120305224A1 (zh)
CN (1) CN102713486A (zh)
WO (1) WO2011068259A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106574625A (zh) * 2014-09-16 2017-04-19 飞利浦照明控股有限公司 冷却风扇
CN112503993A (zh) * 2020-11-27 2021-03-16 岳绍斌 一种化工产品生产制造用节能环保型换热器

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3039368A4 (en) * 2013-08-21 2017-05-24 Coolchip Technologies Inc. Kinetic heat-sink with interdigitated heat-transfer fins
US9969023B2 (en) * 2014-02-28 2018-05-15 Fuji Machine Mfg. Co., Ltd. Viscous fluid coating device
US9326424B2 (en) * 2014-09-10 2016-04-26 Opentv, Inc. Heat sink assembly and method of utilizing a heat sink assembly
US10371161B2 (en) * 2016-04-15 2019-08-06 Delta Electronics, Inc Impeller and centrifugal fan with same
US10749308B2 (en) 2016-10-17 2020-08-18 Waymo Llc Thermal rotary link
US11280996B2 (en) 2016-10-19 2022-03-22 Sony Corporation Light source unit and projection display apparatus
CN108401402B (zh) * 2018-03-30 2020-02-21 上海斐讯数据通信技术有限公司 一种多级风冷散热装置
CN109505803B (zh) * 2018-11-30 2023-10-27 江苏维尔特泵业有限公司 一种热水泵轴承体风冷却装置
CN114543056B (zh) * 2022-01-24 2023-12-08 桂林智神信息技术股份有限公司 一种散热装置及散热灯具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254670A (ja) * 1994-03-16 1995-10-03 Nec Corp 半導体装置用ヒートシンク
KR19980028595A (ko) * 1996-10-23 1998-07-15 김광호 마이크로 프로세서의 방열장치
KR20010066771A (ko) * 1999-12-06 2001-07-11 이형도 전자부품 냉각장치
KR20030048661A (ko) * 2001-12-12 2003-06-25 엘지이노텍 주식회사 반도체 칩의 냉각 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1715880A (en) * 1925-06-02 1929-06-04 Herman J Willhagen Variable-arc fin condenser
US3844341A (en) * 1972-05-22 1974-10-29 Us Navy Rotatable finned heat transfer device
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
US5794687A (en) * 1997-08-04 1998-08-18 International Business Machine Corp. Forced air cooling apparatus for semiconductor chips
US6457955B1 (en) * 2001-01-10 2002-10-01 Yen Sun Technology Corp. Composite heat dissipation fan
US7021894B2 (en) * 2002-02-13 2006-04-04 Rotys Inc. Apparatus for cooling of electronic components
US7836939B2 (en) * 2007-08-01 2010-11-23 Harris Corporation Non-contacting thermal rotary joint
CN201327002Y (zh) * 2008-12-26 2009-10-14 倪亮 发光二极管照明装置散热器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254670A (ja) * 1994-03-16 1995-10-03 Nec Corp 半導体装置用ヒートシンク
KR19980028595A (ko) * 1996-10-23 1998-07-15 김광호 마이크로 프로세서의 방열장치
KR20010066771A (ko) * 1999-12-06 2001-07-11 이형도 전자부품 냉각장치
KR20030048661A (ko) * 2001-12-12 2003-06-25 엘지이노텍 주식회사 반도체 칩의 냉각 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106574625A (zh) * 2014-09-16 2017-04-19 飞利浦照明控股有限公司 冷却风扇
CN106574625B (zh) * 2014-09-16 2018-06-15 飞利浦照明控股有限公司 冷却风扇
CN112503993A (zh) * 2020-11-27 2021-03-16 岳绍斌 一种化工产品生产制造用节能环保型换热器

Also Published As

Publication number Publication date
US20120305224A1 (en) 2012-12-06
CN102713486A (zh) 2012-10-03

Similar Documents

Publication Publication Date Title
WO2011068259A1 (ko) 히트싱크
TWI636724B (zh) 具有散熱功能的電子設備及其水冷排總成
US7120019B2 (en) Coaxial air ducts and fans for cooling and electronic component
US5781411A (en) Heat sink utilizing the chimney effect
TWI463939B (zh) 電子裝置
TWI229583B (en) Liquid-cooled heat sink device
US20090044927A1 (en) Thermal module and fin unit thereof
CN1875238A (zh) 流量分配装置和冷却单元
US6892800B2 (en) Omnidirectional fan-heatsinks
US20070246195A1 (en) Orientation insensitive thermosiphon with squirrel cage configuration
TWI363956B (en) A heat sink with a centrifugal fan
JP2005116815A5 (zh)
US20060104024A1 (en) Minimization of cooling air preheat for maximum packaging density
CN104812222B (zh) 散热结构及具有该散热结构的电子装置
TW201508174A (zh) 風扇模組及應用於該風扇模組中之基座
CA2348618A1 (en) Apparatus for cooling a box with heat generating elements received therein and a method for cooling same
TWI334529B (en) Heat dissipation device
US20110042043A1 (en) Heat dissipation module
CN101146425A (zh) 散热装置
WO2011105800A2 (ko) 진동 가능한 방열핀을 구비한 히트 싱크
JP3403012B2 (ja) 発熱体冷却装置
US20220330414A1 (en) Heat sinks with beyond-board fins
US10921062B2 (en) Cooling fan and heat dissipating module including the same
KR101000020B1 (ko) 히트싱크
CN103874398B (zh) 散热器

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980162754.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09851876

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13513507

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 09851876

Country of ref document: EP

Kind code of ref document: A1