WO2011064221A3 - Sensormodul und herstellungsverfahren eines sensormoduls - Google Patents

Sensormodul und herstellungsverfahren eines sensormoduls Download PDF

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Publication number
WO2011064221A3
WO2011064221A3 PCT/EP2010/068053 EP2010068053W WO2011064221A3 WO 2011064221 A3 WO2011064221 A3 WO 2011064221A3 EP 2010068053 W EP2010068053 W EP 2010068053W WO 2011064221 A3 WO2011064221 A3 WO 2011064221A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor module
production method
recess
sensor
chip
Prior art date
Application number
PCT/EP2010/068053
Other languages
English (en)
French (fr)
Other versions
WO2011064221A2 (de
Inventor
Jan-Erik Hauschel
Thorsten Knittel
Stefan Pesahl
Willibald Reitmeier
Andreas Wildgen
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Priority to RU2012126539/28A priority Critical patent/RU2012126539A/ru
Priority to BR112012012671A priority patent/BR112012012671A2/pt
Priority to US13/512,304 priority patent/US20130145844A1/en
Priority to CN201080053818XA priority patent/CN102741664A/zh
Priority to JP2012540406A priority patent/JP2013512422A/ja
Priority to EP10793180A priority patent/EP2504669A2/de
Publication of WO2011064221A2 publication Critical patent/WO2011064221A2/de
Publication of WO2011064221A3 publication Critical patent/WO2011064221A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measuring Volume Flow (AREA)
  • Pressure Sensors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

Ein Sensormodul umfasst einen Chipträger und einen darauf angeordneten Sensorchip. Das Sensormodul weist an einer zweiten Seite des Chipträgers mindestens eine teilweise Abdeckung mit einer Aussparung auf, so dass Wärme von dem Chipträger und/oder Sensorchip an der Aussparung abführbar ist. Weiterhin ist ein Herstellungsverfahren eines abgedeckten Sensormoduls beschrieben, wobei die Abdeckung eine Aussparung aufweist.
PCT/EP2010/068053 2009-11-26 2010-11-23 Sensormodul und herstellungsverfahren eines sensormoduls WO2011064221A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
RU2012126539/28A RU2012126539A (ru) 2009-11-26 2010-11-23 Сенсорный модуль и способ изготовления сенсорного модуля
BR112012012671A BR112012012671A2 (pt) 2009-11-26 2010-11-23 "módulo de sensor e método de produção de um módulo de sensor"
US13/512,304 US20130145844A1 (en) 2009-11-26 2010-11-23 Sensor module and production method of a sensor module
CN201080053818XA CN102741664A (zh) 2009-11-26 2010-11-23 传感器模块以及传感器模块的制造方法
JP2012540406A JP2013512422A (ja) 2009-11-26 2010-11-23 センサモジュールおよびセンサモジュールの製造方法
EP10793180A EP2504669A2 (de) 2009-11-26 2010-11-23 Sensormodul und herstellungsverfahren eines sensormoduls

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009055717.2 2009-11-26
DE102009055717A DE102009055717A1 (de) 2009-11-26 2009-11-26 Sensormodul und Herstellungsverfahren eines Sensormoduls

Publications (2)

Publication Number Publication Date
WO2011064221A2 WO2011064221A2 (de) 2011-06-03
WO2011064221A3 true WO2011064221A3 (de) 2012-01-26

Family

ID=43927069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/068053 WO2011064221A2 (de) 2009-11-26 2010-11-23 Sensormodul und herstellungsverfahren eines sensormoduls

Country Status (9)

Country Link
US (1) US20130145844A1 (de)
EP (1) EP2504669A2 (de)
JP (1) JP2013512422A (de)
KR (1) KR20120098743A (de)
CN (1) CN102741664A (de)
BR (1) BR112012012671A2 (de)
DE (1) DE102009055717A1 (de)
RU (1) RU2012126539A (de)
WO (1) WO2011064221A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5640892B2 (ja) * 2011-05-23 2014-12-17 三菱電機株式会社 半導体装置
DE112013007328B4 (de) * 2013-08-09 2020-06-18 Therm-O-Disc, Incorporated Drahtlose Temperatur- und/oder Feuchtigkeitssensoranordnung
DE102014218702A1 (de) * 2014-09-17 2016-03-17 Continental Teves Ag & Co. Ohg Sensor mit Wärmeableitflächen am Leadframe
FR3040833B1 (fr) * 2015-09-04 2017-09-08 Delphi France Sas Systeme de distribution de courant electrique pour vehicule
BE1025973B1 (nl) * 2018-02-01 2019-09-03 Niko Nv Sensor module en behuizing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5369550A (en) * 1992-09-02 1994-11-29 Vlsi Technology, Inc. Method and apparatus for cooling a molded-plastic integrated-circuit package
US6670692B1 (en) * 2002-10-09 2003-12-30 Silicon Integrated Systems Corp. Semiconductor chip with partially embedded decoupling capacitors
DE102007057903A1 (de) * 2007-11-29 2009-06-04 Continental Automotive Gmbh Sensormodul und Verfahren zur Herstellung des Sensormoduls

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817421B2 (ja) * 1979-02-02 1983-04-07 日産自動車株式会社 半導体圧力センサ
CN1006562B (zh) * 1986-04-14 1990-01-24 德商福兰克及凯尔西纳股份有限公司及电动机与电器装置厂分公司 电动变速及控制传动装置
JPS62197036U (de) * 1986-06-06 1987-12-15
JPH0428258A (ja) * 1990-05-23 1992-01-30 Sumitomo Metal Ind Ltd 半導体装置
JP2616587B2 (ja) * 1991-01-25 1997-06-04 日本電気株式会社 半導体装置の樹脂ばり除去方法
JPH0617245U (ja) * 1992-07-30 1994-03-04 沖電気工業株式会社 半導体デバイス
JPH07221234A (ja) * 1994-02-02 1995-08-18 Canon Inc 半導体装置
TW278225B (de) * 1994-10-31 1996-06-11 At & T Corp
JPH0926371A (ja) * 1995-07-12 1997-01-28 Hitachi Ltd 半導体式圧力センサ
JPH11326089A (ja) * 1999-01-18 1999-11-26 Hokuriku Electric Ind Co Ltd 半導体圧力センサ―とその製造方法
JP2000356561A (ja) * 1999-04-14 2000-12-26 Denso Corp 半導体歪みセンサ
DE19929026B4 (de) * 1999-06-25 2011-02-24 Robert Bosch Gmbh Verfahren zur Herstellung eines Drucksensors
JP2001033328A (ja) * 1999-07-27 2001-02-09 Matsushita Electric Works Ltd 半導体圧力センサ
JP2001124646A (ja) * 1999-10-27 2001-05-11 Matsushita Electric Works Ltd 半導体圧力検出器及びその製造方法
JP4127396B2 (ja) * 2001-10-18 2008-07-30 株式会社日立製作所 センサ装置
DE102005016008B4 (de) * 2005-04-07 2020-06-18 Robert Bosch Gmbh Bauelementemodul zur Anbringung auf einem Substrat
DE102006044442A1 (de) * 2006-09-21 2008-03-27 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung
CN100552941C (zh) * 2006-12-27 2009-10-21 日月光半导体制造股份有限公司 影像感测模块
US7880347B2 (en) * 2007-08-02 2011-02-01 Remy Technologies, Inc. Airflow cooling pattern for belt-driven vehicle electrical power generator
DE102007057902A1 (de) * 2007-11-29 2009-06-04 Continental Automotive Gmbh Sensormodul und Verfahren zu seiner Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5369550A (en) * 1992-09-02 1994-11-29 Vlsi Technology, Inc. Method and apparatus for cooling a molded-plastic integrated-circuit package
US6670692B1 (en) * 2002-10-09 2003-12-30 Silicon Integrated Systems Corp. Semiconductor chip with partially embedded decoupling capacitors
DE102007057903A1 (de) * 2007-11-29 2009-06-04 Continental Automotive Gmbh Sensormodul und Verfahren zur Herstellung des Sensormoduls

Also Published As

Publication number Publication date
RU2012126539A (ru) 2014-01-10
EP2504669A2 (de) 2012-10-03
BR112012012671A2 (pt) 2019-09-24
CN102741664A (zh) 2012-10-17
US20130145844A1 (en) 2013-06-13
DE102009055717A1 (de) 2011-06-01
JP2013512422A (ja) 2013-04-11
KR20120098743A (ko) 2012-09-05
WO2011064221A2 (de) 2011-06-03

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