WO2011061910A1 - Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell - Google Patents

Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell Download PDF

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Publication number
WO2011061910A1
WO2011061910A1 PCT/JP2010/006651 JP2010006651W WO2011061910A1 WO 2011061910 A1 WO2011061910 A1 WO 2011061910A1 JP 2010006651 W JP2010006651 W JP 2010006651W WO 2011061910 A1 WO2011061910 A1 WO 2011061910A1
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liquid crystal
group
hydrogen atom
general formula
epoxy resin
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PCT/JP2010/006651
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French (fr)
Japanese (ja)
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昌典 橋本
常俊 坂野
直美 荷見
真規恵 曽根
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日本化薬株式会社
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Priority to KR1020127013344A priority Critical patent/KR101806152B1/en
Priority to CN201080051849.1A priority patent/CN102612521B/en
Priority to JP2011541804A priority patent/JP5783606B2/en
Publication of WO2011061910A1 publication Critical patent/WO2011061910A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds

Definitions

  • the present invention relates to a novel silylbenzopinacol, its use as a thermal radical generator, a liquid crystal sealing agent containing the same, and a liquid crystal display cell using the same.
  • azo compounds organic peroxides, benzoins, benzoin ethers, acetophenones, benzopinacols, etc. are known as radical generators for curing radically polymerizable compounds by radical polymerization by heating. in use.
  • Azo compounds and organic peroxides which are most likely to generate radicals by thermal cleavage, are used as radical generators in products such as adhesives, sealants, gap forming agents and molding materials.
  • the radical generator is accompanied by the generation of a gas such as nitrogen or carbon dioxide when the radical is generated, there is a concern that the characteristics of the product may be greatly impaired by the gas.
  • the characteristics that may be damaged include a decrease in adhesive strength, a decrease in heat resistance strength, a shape defect of a molded product, and the like.
  • Other radical generators include benzoins, benzoin ethers, acetophenones, benzopinacols, and the like. In these, foaming at the time of heating is small, but radical generation ability is inferior, and there is a problem that desired performance (reactivity and curability) cannot be obtained.
  • Patent Document 1 discloses that benzopinacol is used as a thermal radical generator in a system that is cured using both ultraviolet rays and heat in order to cure a shadow portion that is not exposed to light.
  • Patent Document 2 discloses that an iniferter type radical generator is effective in producing molded products such as contact lenses, various lenses, and dental materials, and benzopinacol is mentioned as an example.
  • Patent Document 3 mentions benzopinacol as a thermal radical generator used in a sealant for flat panel displays.
  • Patent Documents 1 and 3 further mention compounds in which benzopinacol is chemically modified. The compounds are further described as exhibiting the desired effect.
  • benzopinacol is a tertiary alcohol, and no suitable one has been reported for obtaining a stable derivative having a poor hydroxyl group due to the steric hindrance of the phenyl group.
  • the liquid crystal dropping method is to apply a liquid crystal sealing agent weir on the liquid crystal substrate (main seal), and then apply the sealing agent to the outermost circumference, apply the sealing agent (dummy seal), drop the liquid crystal inside the internal seal, and then
  • This is a manufacturing method in which the liquid crystal display cell is completed by bonding the other liquid crystal substrate facing each other in a vacuum, sealing the liquid crystal by releasing it to atmospheric pressure, and curing the seal portion by UV irradiation and heating.
  • a liquid crystal sealing material used for sealing liquid crystal in this manufacturing method not a conventional thermosetting liquid crystal sealing agent but a photothermosetting combined type liquid crystal sealing agent is generally used.
  • thermosetting liquid crystal sealant also called a thermosetting liquid crystal sealant
  • thermosetting liquid crystal sealant when the liquid crystal dropping method is performed with the conventional thermosetting liquid crystal sealing agent, heating is performed under vacuum and reduced pressure. This is because the thermal expansion of the liquid crystal during heating and the viscosity decrease due to the heating of the liquid crystal sealant occur, the seal punctures and the liquid crystal cannot be sealed.
  • the photo-curing combined type liquid crystal sealant is used by applying a liquid crystal sealant weir to the liquid crystal substrate with a dispenser, etc., then dropping the liquid crystal inside the weir and attaching the other substrate facing in vacuum. After the alignment, the liquid crystal cell is manufactured by irradiating the seal portion with light such as ultraviolet rays and temporarily curing, and then thermally curing the liquid crystal sealant at about 120 ° C. for about 1 hour.
  • the liquid crystal sealant must be irradiated with light such as ultraviolet rays.
  • the following problems occur with the narrowing of the frame of the liquid crystal cell in recent years. That is, the liquid crystal seal portion is shielded from light by the wiring or the black matrix, and a portion where the liquid crystal sealant is not irradiated with light is formed, so that an uncured portion is generated. There has been a problem that the uncured portion is inserted by the liquid crystal during the heat curing process or liquid crystal contamination occurs. Therefore, in designing the liquid crystal cell, there has been a restriction that the sealant must be designed so that as much light as possible is irradiated.
  • the ultraviolet irradiation apparatus is increased in size, and the running cost of the ultraviolet irradiation apparatus is increasing.
  • thermosetting liquid crystal sealing agent thermosetting liquid crystal sealing agent for liquid crystal dropping method
  • thermosetting liquid crystal sealing agent for liquid crystal dropping method thermosetting liquid crystal sealing agent for liquid crystal dropping method
  • 3 to 40 thermosetting agents are added to 100 parts by weight of a curable resin having a value obtained by dividing the number of hydrogen bonding functional groups in one molecule by molecular weight of 3.5 ⁇ 10 ⁇ 4 or more.
  • a thermosetting liquid crystal sealing agent for liquid crystal dropping method containing parts by weight has been proposed. It has been disclosed that the use of this liquid crystal sealant results in low liquid crystal contamination.
  • thermosetting liquid crystal sealing agent there is a problem that the liquid crystal leaks because the weir of the liquid crystal sealing agent in the middle of curing, whose viscosity has been lowered by heating, is broken (seal puncture problem)
  • the liquid crystal sealant component whose viscosity has been reduced by heating is heated more than the NI point (temperature at which the isotropic phase transitions to the liquid crystal phase) or more, so that the liquid crystal becomes more fluid than usual. It is difficult to say that the serious problem of leaching out and contaminating the liquid crystal has been sufficiently solved.
  • Patent Document 6 the liquid crystal sealant to which the gelling agent is added can prevent the seal puncture and keep the seal shape by the liquid crystal dropping method only by thermosetting.
  • Patent Document 7 proposes a manufacturing method in which a liquid crystal sealant made of a thermosetting resin is applied, pre-baked, and thereafter liquid crystal dropping and vacuum bonding are performed.
  • the specific resin composition of the liquid crystal sealant is not specified.
  • Patent Documents 8 and 9 propose a thermosetting liquid crystal sealing method for a liquid crystal dropping method in which a pre-baking process is performed as a B-stage (semi-cured state) process. Since this method requires a B-stage treatment for 20 minutes at 80 ° C., there is a drawback that the process time becomes long. Further, if the processing temperature is increased to, for example, 100 ° C. or higher in order to shorten the B-stage processing time for 20 minutes, the described liquid crystal sealant is not preferable because the curing reaction proceeds.
  • Patent Document 7 proposes a liquid crystal sealing agent characterized by containing a thermal cleavage type radical generator, a thermosetting compound containing a compound having an unsaturated double bond, and a polyaddition type thermosetting agent. Yes. And, there is described production of a liquid crystal display element that is partially UV-irradiated by bonding a liquid crystal substrate at atmospheric pressure. However, there is no description about the production of a liquid crystal display element only by thermosetting without UV irradiation by vacuum decompression bonding of a liquid crystal substrate. As mentioned above, there is no thermosetting liquid crystal dropping sealant that solves all the problems with the thermosetting sealant in the liquid crystal dropping method, and the liquid crystal dropping method only by thermosetting has not been realized yet.
  • liquid crystal cells have been designed such as narrowing the outer periphery of the liquid crystal seal and narrowing the liquid crystal seal width.
  • a liquid crystal sealant that can be formed with a narrow seal width and has a uniform seal shape that is not easily disturbed, and a liquid crystal sealant that has high adhesive strength even if the seal width is narrow.
  • a liquid crystal sealant having a long pot life in which the change in the application condition of the liquid crystal sealant is small within the working time.
  • thermosetting type liquid crystal dropping method As described above, the thermosetting type liquid crystal dropping method is realized, the substrate is vacuum-bonded, does not seal puncture by heating, and there is no liquid crystal contamination, and the adhesive strength after the moisture resistance test is strong. There is a need for a thermosetting liquid crystal sealant for liquid crystal dropping method that has excellent seal coatability, has a long pot life at room temperature, and is easy to narrow the cell gap.
  • JP-A-57-53508 Japanese Patent Laid-Open No. 11-21304 JP 2006-10870 A Japanese Patent Publication No. 8-20627 Japanese Patent No. 3955038 Japanese Patent No. 3976749 JP 2005-92043 A JP 2007-199710 A JP 2007-224117 A
  • thermosetting liquid crystal sealing agent for a liquid crystal dropping method which does not require ultraviolet irradiation. Furthermore, thermosetting liquid crystal seal for liquid crystal dripping method with low liquid crystal contamination, high adhesive strength and high adhesive strength after moisture resistance test, excellent seal linearity, long pot life at room temperature, and easy narrowing of cell gap
  • the present invention provides an agent (hereinafter also referred to as a thermosetting liquid crystal sealing agent for a liquid crystal dropping method).
  • the present inventors have made at least one hydroxyl group of benzopinacol optionally having a substituent on the benzene ring into a foam during heating.
  • a more highly active novel thermal radical generator can be obtained, and that the thermosetting liquid crystal sealing agent for liquid crystal dropping method can be obtained by using the thermal radical generator.
  • the invention has been completed. That is, the present invention relates to the following (1) to (20).
  • R 1 ⁇ R 3, or R 4 ⁇ R 6 is not present if Y 1 'or Y 2' is a hydrogen atom, and unless Y 1 'and Y 2' is a hydrogen atom, further, Y 1 A tetraphenylethane derivative represented by the formula: “and Y 2 ′ are silicon atoms, all of R 1 to R 6 are methyl groups, and all of X 1 to X 4 are hydrogen atoms”.
  • one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — R 4 R 5 R 6 Y 2 ′ — is a di (C 1-4 straight or branched alkyl) silyl group or a tri (C 1-4 straight or branched alkyl) silyl group, and X 1
  • one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — R 4 R 5 R 6 Y 2 '-is trimethylsilyl, triethylsilyl, or t-butyldimethylsilyl, and all of X 1 to X 4 are hydrogen atoms, and the tetraphenyl according to (1) or (2) above Ethane derivative.
  • Y 1 or Y 2 each independently represents a hydrogen atom, phenyl or silicon atom
  • R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms
  • X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen atom, provided that R is bonded to Y 1 or Y 2 , respectively.
  • a liquid crystal dropping method comprising a derivative, (b) one or both of an epoxy resin or an epoxy resin (meth) acrylic acid adduct, (c) a thermosetting agent, and (d) an inorganic filler.
  • Thermosetting liquid crystal sealant (a)
  • the tetraphenylethane derivative of the general formula (1) is the tetraphenylethane derivative according to any one of the above (1) to (4) or the following (20), Liquid crystal sealant.
  • (d) the inorganic filler is alumina and / or silica.
  • (13) (a) 0.1 to 10% by mass of the tetraphenylethane derivative of the general formula (1) with respect to the total amount of the liquid crystal sealant, (b) (meth) acrylic acid of epoxy resin and / or epoxy resin The adduct is 30 to 75% by mass with respect to the total amount of the liquid crystal sealant, (c) the thermosetting agent is 5 to 60 parts by mass with respect to 100 parts by mass of the component (b), and (d) the inorganic filler.
  • (16) A radical generator containing the tetraphenylethane derivative of the general formula (1) described in (5) as an active ingredient.
  • (17) Use of the tetraphenylethane derivative of the general formula (1) described in the above (5) as the radical generator described in the above (16) for producing a thermosetting liquid crystal sealant.
  • R 1 to R 3 or R 4 to R 6 are not present when Y 1 ′ or Y 2 ′ is a hydrogen atom, and each of Y 1 ′ and Y 2 ′ is a hydrogen atom)
  • one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 to R 3 or R 4 to R 6
  • the tetraphenylethane derivative (also referred to as a benzopinacol derivative) represented by the general formula (1) used in the present invention is useful as a thermal radical generator, has no foaming during heating, and can increase the reaction rate. Is possible. Therefore, it can be used as a thermal radical generator that has no fear of deterioration of physical properties due to foaming, for a wide variety of uses such as the production of adhesives, sealants, gap forming agents, molding materials, etc. Products with excellent cured properties, adhesive strength, shape stability, etc. can be obtained. In particular, it is excellent as a thermal radical generator for a thermosetting liquid crystal sealing agent used in a liquid crystal dropping method.
  • thermosetting liquid crystal sealing agent using the tetraphenylethane derivative represented by the general formula (1) used in the present invention as a thermal radical generator is for a liquid crystal dropping method that does not require ultraviolet irradiation to the liquid crystal sealing portion. It is optimal as a thermosetting liquid crystal sealant (hereinafter also referred to as the liquid crystal sealant of the present invention).
  • the liquid crystal sealant has excellent properties such as low liquid crystal contamination, high adhesive strength and adhesive strength after moisture resistance test, excellent seal linearity, and long pot life at room temperature.
  • the liquid crystal cell can be easily manufactured. As a result, a high yield, high reliability, and high quality liquid crystal display cell can be manufactured.
  • liquid crystal display cell of the present invention sealed with a cured product of the liquid crystal sealant of the present invention has no display failure due to liquid crystal contamination, and has excellent adhesion and moisture resistance reliability.
  • the tetraphenylethane derivative represented by the general formula (1 ′) is a novel compound synthesized by the present inventors.
  • Y 1 and Y 2 each independently represent a hydrogen atom, a phenyl group or a silicon atom, and at least one of them is a group other than a hydrogen atom. Preferred is when one is a hydrogen atom and the other is a silicon atom.
  • examples of the linear or branched alkyl group having 1 to 4 carbon atoms (hereinafter also simply referred to as C1 to C4 alkyl group) in R 1 to R 6 include, for example, methyl, ethyl, n-propyl , I-propyl, t-butyl and the like.
  • halogen in X 1 to X 4 examples include a fluorine atom, a chlorine atom, and a bromine atom.
  • R 1 R 2 R 3 Y 1 — or R 4 R 5 R 6 Y 2 — represents a phenyl group or 1 to 3 C1 A phenyl group substituted with a -C4 alkyl group, or a di-C1-C4 alkylsilyl group or a tri-C1-C4 alkylsilyl group, more preferably a di-C1-C4 alkylsilyl group or a tri-C1-C4 alkylsilyl group And more preferably a tri-C1 to C4 alkylsilyl group.
  • silyl group examples include di-C1 to C4 alkylsilyl groups such as dimethylsilyl, diethylsilyl, and methylethylsilyl: or trimethylsilyl, triethylsilyl, dimethylethylsilyl And tri-C1 to C4 alkylsilyl groups such as t-butyldimethylsilyl; Of these, a tri-C1 to C4 alkylsilyl group is preferable, and a trimethylsilyl group is more preferable.
  • X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, and preferably all of X 1 to X 4 are hydrogen atoms. Is the case.
  • Preferred compounds in the tetraphenylethane derivative represented by the general formula (1) include 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane or 1, 2-bis ⁇ di or tri (C1-C4 alkyl) siloxy ⁇ -1,1,2,2-tetraphenylethane can be mentioned, such as 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy- 1,1,2,2-tetraphenylethane is more preferable, and 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane is more preferable.
  • tri (C1-C4 alkyl) siloxy in di- or tri- (C1-C4 alkyl) siloxy in the above tetraphenylethane, 2 or 3 alkyl groups on the silyl group may be the same or different.
  • tri (C1-C4 alkyl) siloxy includes trimethylsiloxy, triethylsiloxy, t-butyldimethylsiloxy and the like.
  • preferable tetraphenylethane derivatives include 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane and 1,2-bis (triethylsiloxy)- 1,1,2,2-tetraphenylethane, 1,2-bis (t-butyldimethylsiloxy) -1,1,2,2-tetraphenylethane, 1-hydroxy-2-trimethylsiloxy-1,1, 2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetra Phenylethane.
  • 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenyl More preferred is ethane or 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetraphenylethane, and 1-hydroxy-2-trimethylsiloxy-1,1, represented by the formula (2) 2,2-tetraphenylethane is more preferred.
  • the tetraphenylethane derivative represented by the general formula (1) of the present invention is characterized by a structure in which the benzopinacol represented by the general formula (3) is silylated with various silylating agents.
  • the tetraphenylethane derivative represented by the general formula (1) of the present invention is obtained by synthesizing by a method in which the benzopinacol represented by the general formula (3) and various silylating agents are heated under a basic catalyst such as pyridine.
  • the silylating agent may be any as long as it can be di-C1-C4 alkylsilylated, tri-C1-C4 alkylsilylated or phenyldi-C1-C4 alkylsilylated, and a tri (C1-C4 alkyl) silylating agent is preferred. .
  • Preferable examples include trimethylchlorosilane (TMCS), hexamethyldisilazane (HMDS), N, O-bis (trimethylsilyl) trifluoroacetamide (BSTFA), which are generally known trimethylsilylating agents, and triethylsilylating agent.
  • TMCS trimethylchlorosilane
  • HMDS hexamethyldisilazane
  • BSTFA O-bis (trimethylsilyl) trifluoroacetamide
  • Examples of chlorosilane (TECS) and t-butyldimethylsilylating agent include t-butyldimethylsilane (TBMS). These reagents can be easily obtained from markets such as silicon derivative manufacturers.
  • the reaction amount (silylation equivalent) of the silylating agent is preferably 1.0 to 5.0 times equivalent to 1 equivalent of hydroxyl group of benzopinacol represented by the formula (3).
  • the amount is 1.5 to 3.0 times equivalent. If the amount is too small, the reaction efficiency is poor, and the reaction time becomes long, so that thermal decomposition is promoted. On the other hand, when the amount is too large, the separation becomes worse during the recovery or the purification becomes difficult.
  • Examples of the basic catalyst include pyridine and triethylamine.
  • the basic catalyst has an effect of trapping hydrogen chloride generated during the reaction and keeping the reaction system basic, or drawing out a hydrogen atom of a hydroxyl group to further promote the reaction.
  • the amount used may be 0.5 equivalents or more of the basic group equivalent to 1 equivalent of the hydroxyl group of the target compound, and may be used as a solvent.
  • the equivalent amount of the basic group of the basic catalyst is 1 to 5 times equivalent to 1 equivalent of the hydroxyl group of the target compound.
  • the solvent nonpolar organic solvents such as hexane, ether and toluene are excellent because they do not participate in the reaction.
  • polar solvents such as pyridine, dimethylformaldehyde (DMF), dimethyl sulfoxide (DMSO), tetrahydrofuran (THF) and acetonitrile.
  • the amount used is preferably such that the weight concentration of the solute is 5 to 40% by mass. More preferably, it is 10 to 30% by mass. If the amount is too small, the reaction is slow, decomposition by heat is accelerated, and the yield is lowered. Moreover, when there are too many, a by-product will increase and a yield will fall.
  • the reaction temperature is preferably 80 ° C.
  • the reaction time is within 2.5 hours, preferably within 2 hours.
  • the benzopinacol derivative for example, the benzopinacol of the general formula (3) or the produced target compound is preferably reacted at a low temperature because it causes thermal decomposition by heating. By reacting with time, the target product is obtained in high yield. Considering reaction efficiency, etc., about 50 to 80 ° C. is preferable.
  • the reaction time is about 30 minutes to 2.5 hours, preferably about 30 minutes to 2 hours.
  • a higher temperature for example, a temperature of about 75 to 100 ° C. is preferable, but the yield is considered to decrease.
  • the tetraphenylethane derivative represented by the general formula (1) of the present invention can be used as a radical generator. Specifically, it can be used in various fields as a thermal radical generator or a photo radical generator, and is particularly preferably used as a thermal radical generator in the present invention.
  • the thermal radical generator of the present invention can be used for applications that are difficult to achieve with other photoradical generators. For example, it can be used for curing a portion that is not exposed to light or curing a portion having a problem when irradiated with strong energy.
  • thermal radical generators in sealants for precision equipment as thermal radical generators for curing areas where low-molecular substances that are subject to decomposition may coexist, and for organic synthesis by thermal reaction, etc.
  • the thermal radical generator of the present invention can be used as a thermal radical generator for Furthermore, since the thermal radical generator of the present invention does not cause foaming when radicals are generated and does not impair the curing rate even with a small amount, it can be expected to maintain the form of the cured product and improve physical properties.
  • the amount of the tetraphenylethane derivative of the general formula (1) used as a radical generator may vary depending on the type of polymerization monomer to be cured and the field of use, and the amount added may be appropriately selected.
  • One of the preferred fields of use of the thermal radical generator of the present invention is the use as a thermal radical generator in a radical curable resin composition.
  • the content of the thermal radical generator of the present invention (tetraphenylethane derivative of the general formula (1)) with respect to the total amount of the composition is not particularly limited, but is usually about 0.1 to 10% by mass.
  • the balance is a radically polymerizable resin and additives that may be included as necessary.
  • a cured product of the resin composition can be obtained by thermosetting the resin composition, and the cured product has good transparency because it does not cause turbidity due to foaming, and has adhesiveness, moisture-resistant adhesion, etc. Excellent.
  • a radical curable resin an epoxy resin or a (meth) acrylic resin is mentioned.
  • a thermosetting sealant can be exemplified, and among them, a thermosetting liquid crystal sealant for a liquid crystal dropping method is optimal.
  • thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention comprises (a) a tetraphenylethane derivative represented by the general formula (1), (b) an epoxy resin, and / or a (meth) acrylic epoxy resin.
  • An acid adduct, (c) a thermosetting agent, and (d) an inorganic filler are contained as essential components.
  • thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention contains (a) a tetraphenylethane derivative represented by the general formula (1) as a thermal radical generator in order to improve curability.
  • the tetraphenylethane derivative represented by the general formula (1) is also referred to as a component (a) or a thermal radical generator (a) for simplification.
  • a thermal radical generator refers to a compound that dissociates and generates radicals upon heating, and examples thereof include azo compounds, organic peroxides, benzoins, benzoin ethers, acetophenones, and benzopinacols.
  • azo compounds and organic peroxides foam when nitrogen and carbon dioxide are generated at the same time when radicals are generated by heating. Therefore, bubbles are included in the cured product, which causes a decrease in cured property and adhesive strength.
  • benzoin derivatives and benzopinacol do not foam when heated, but the desired curing degree does not occur at the thermal curing temperature of 90 to 130 ° C of the sealant, which is used when manufacturing liquid crystal panels. There was a problem that could not be obtained.
  • the present inventors have found that a thermal radical generator with higher activity and less liquid crystal contamination can be obtained by chemical modification to benzopinacol. And it discovered that the benzopinacol derivative in which at least one of the hydroxyl group of pinacol became an ether bond from the ease of a synthesis method was more preferable.
  • the ether bond include methyl ether, ethyl ether, propyl ether, isopropyl ether, butyl ether, phenyl ether group, silyl ether group, and the like.
  • a phenyl ether group or a silyl ether group is preferable from the viewpoint of activity and the like, and a tetraphenylethane derivative represented by the general formula (1) is more preferable.
  • Preferred tetraphenylethane derivatives (a) represented by the general formula (1) used in the present invention include 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy-1,1, 2,2- Mention may be made of tetraphenylethane or 1, 2-bis ⁇ di or tri (C1-C4 alkyl) siloxy ⁇ -1,1, 2,2-tetraphenylethane, such as 1-hydroxy-2-di or tri (C1 -C4 alkyl) siloxy-1,1, 2,2-tetraphenylethane is more preferable, and 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1, 2,2-tetraphenyl is more preferable. It is ethane. Specific compound examples are as described above.
  • the thermal radical generator (a) (tetraphenylethane derivative (a) represented by the general formula (1)) is finely dispersed and uniformly dispersed.
  • the average particle diameter is preferably 5 ⁇ m or less, and more preferably 3 ⁇ m or less, because if the average particle size is too large, it becomes a cause of defects such as poor gap formation when the upper and lower glass substrates are bonded together during the production of a narrow gap liquid crystal cell.
  • the particle size of the component (a) can be made infinitely fine, but the lower limit is usually about 0.1 ⁇ m as the average particle size.
  • the content of (a) the thermal radical generator in the liquid crystal sealing agent of the present invention is usually 0.1 to 10% by mass, preferably 0.3 to 7% by mass, based on the total amount of the liquid crystal sealing agent. More preferably, it is 0.5 to 5% by mass.
  • a radical generator other than the component (a) may be used in combination, but usually the component (a) is used alone as a radical generator. Is preferred.
  • the epoxy resin and / or (meth) acrylic acid adduct (b) of epoxy resin contained in the thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention is used as a curable resin.
  • “(meth) acryl” means “acryl” and / or “methacryl”.
  • the epoxy resin and / or the (meth) acrylic acid adduct (b) of the epoxy resin are preferably low in contamination and solubility in the liquid crystal and low in resin viscosity.
  • the epoxy resin is preferably bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, ethylene oxide-added bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A, for example.
  • Novolac type epoxy resin bisphenol F novolac type epoxy resin, resorcin diglycidyl ether, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, isocyanurate type Epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, phenol novolac type with triphenolmethane skeleton Epoxy resins, diglycidyl ethers of other bifunctional phenols, diglycidyl etherified products such as other difunctional alcohols. These epoxy resins may be used alone or in combination of two or more.
  • bisphenol A type epoxy resin bisphenol F type epoxy resin, ethylene oxide-added bisphenol S type epoxy resin, and resorcin diglycidyl ether are more preferable from the viewpoint of liquid crystal contamination and viscosity. preferable.
  • the (meth) acrylic acid adduct of the epoxy resin (hereinafter also referred to as “(meth) acrylated epoxy resin” for convenience) is a compound obtained by the reaction of an epoxy resin and (meth) acrylic acid, and the epoxy group of the epoxy resin.
  • a compound in which (meth) acrylic acid is added to all or an epoxy group of an epoxy resin is reacted with less than an equivalent amount of (meth) acrylic acid to leave an epoxy group intentionally (hereinafter referred to as partial (meth) acrylated epoxy resin Or any of them).
  • the (meth) acrylated epoxy resin a compound having a bifunctional or higher (meth) acryloyl group is preferable.
  • the ratio of the epoxy group to the (meth) acryloyl group in the partially (meth) acrylated epoxy resin is not limited, and is appropriately selected from the viewpoint of process compatibility and liquid crystal contamination.
  • (meth) acrylic acid is usually added at a ratio of 50 to 100%, preferably 70 to 100%, more preferably 80 to 100% with respect to all epoxy groups contained in the epoxy resin.
  • a (meth) acrylated epoxy resin is preferred.
  • (meth) acrylic acid is often used because of its low cost. Therefore, it is preferable to use a compound in which acrylic acid is added to the epoxy group of the epoxy resin.
  • the epoxy resin more than bifunctional is preferable.
  • the (meth) acrylated epoxy resin can be obtained by the reaction of at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and resorcin diglycidyl ether with (meth) acrylic acid (meta).
  • An acrylated epoxy resin is preferred, and a (meth) acrylated epoxy resin obtained by reaction of resorcin diglycidyl ether and (meth) acrylic acid is more preferred.
  • an acrylated epoxy resin obtained by a reaction between the epoxy resin and acrylic acid is preferable from the viewpoint of curability. More preferably, it is at least one selected from the group consisting of an acrylic acid adduct of bisphenol A type epoxy resin, an acrylic acid adduct of bisphenol F type epoxy resin, and an acrylic acid adduct of resorcin diglycidyl ether.
  • the above (meth) acrylated epoxy resins may be used alone or in combination of two or more.
  • the preferred (meth) acrylated epoxy resin occupies the entire amount of the (meth) acrylated epoxy resin in the liquid crystal sealant.
  • the content of the epoxy resin and / or (meth) acrylated epoxy resin (b) (hereinafter also simply referred to as curable resin (b)) in the liquid crystal sealant of the present invention is usually relative to the total amount of the liquid crystal sealant. 30 to 75% by mass, preferably 40 to 65% by mass. If the content is too small, the reaction at the time of thermosetting becomes slow, and the weir of the sealing agent becomes sealed due to thermal expansion of the liquid crystal and the lowering of the viscosity of the sealing agent when a liquid crystal cell is produced by the liquid crystal dropping method. If the content is too large, sufficient adhesive strength cannot be obtained.
  • an embodiment in which both an epoxy resin and a (meth) acrylated epoxy resin are used in combination as the curable resin (b) is one of the preferred embodiments in the sealing agent of the present invention.
  • the content of the epoxy resin in the curable resin (b) is usually 3 to 3% relative to the total amount of the curable resin (b). It is 40% by mass, preferably 3 to 30% by mass, more preferably about 5 to 30% by mass, and still more preferably 8 to 30% by mass. In some cases, 5 to 20% by mass is preferable, and 8 to 15% by mass may be more preferable.
  • the balance is (meth) acrylated epoxy resin.
  • the content of the (meth) acrylated epoxy is 60 to 97% by mass, preferably 70 to 95% by mass, more preferably 70 to 92% by mass, based on the total amount of the curable resin (b). It is. If the epoxy resin content is too low, the adhesive strength is weakened, and if the epoxy resin content is too high, curing may be delayed and seal puncture may occur easily.
  • thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention contains a thermosetting agent (c).
  • a thermosetting agent Any thermosetting agent conventionally used can be used as the thermosetting agent (c), but in the present invention, a latent thermosetting agent (hereinafter also referred to as a latent curing agent) is preferable.
  • a latent curing agent is a compound having a melting point or softening point of a solid at room temperature of 100 ° C. or higher, does not react with a resin component at room temperature, and does not act as a curing agent, but is heated at 100 ° C. or higher, usually 100 to 150.
  • the melting point or softening point in the present invention was measured by thermal analysis using a differential scanning calorimeter (DSC). Specifically, a differential scanning calorimeter (EXSTAR6000 manufactured by Seiko Instruments Inc.) was used, and measurement was performed at a temperature increase of 5 ° C./min.
  • the latent curing agent include polyhydrazide compounds, polyamine compounds, imidazole derivatives, urea derivatives, and the like. A polyhydrazide compound is preferred, and a compound having two or more hydrazide groups in the molecule.
  • Di-tetrahydrazide compounds are preferred, and di- or trihydrazide compounds are more preferred.
  • the polyhydrazide compound include oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecandiodihydrazodihydride, Dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4-bisbenzenedihydrazide, 1,4-naphthoic acid dihydrazide, 2,6-
  • Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate may be used alone or in combination of two or more.
  • Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate is one of the preferred di- or trihydrazide compounds.
  • di- or trihydrazides of di- or tricarboxylic acids are preferred, and more specifically, C4 to C8 aliphatic or aromatic dicarboxylic dihydrazides, excluding carbon of carboxylic acid, or Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate and the like. More preferably, it is at least one selected from the group consisting of dihydrazide of C4 to C8 alkylene dicarboxylic acid, dihydrazide of phthalic acid, and tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate.
  • preferred polyhydrazides include adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide, 1,3-bis (hydrazinocarbonoethyl) -5-isopropylhydrantoin, and tris (1-hydrazinocarbonylmethyl) isocyanate.
  • examples thereof include nurate, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, and bis (2-hydrazinocarbonylethyl) isocyanurate. More preferred are adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide, and tris (2-hydrazinocarbonylethyl) isocyanurate.
  • the thermosetting agent (c) is preferably dispersed uniformly with a fine particle size in order to make it a rapid curing latent curing agent. If the average particle size is too large, it becomes a cause of defects such as inability to form a gap when the upper and lower glass substrates are bonded together when manufacturing a narrow gap liquid crystal cell. Therefore, the particle size is preferably 4 ⁇ m or less, more preferably 3 ⁇ m or less.
  • the particle size was measured with a laser diffraction / scattering type particle size distribution analyzer (dry type) (manufactured by Seishin Enterprise Co., Ltd .: LMS-30). In addition, since it will become easy to raise
  • the content of the thermosetting agent (c) is usually 5 parts by mass to 100 parts by mass of the curable resin (b) which is an epoxy resin and / or a (meth) acrylated epoxy resin.
  • the amount is about 60 parts by mass, preferably 10 to 40 parts by mass.
  • the thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention contains an inorganic filler (d).
  • the inorganic filler (d) include alumina, silica (such as spherical silica or fumed silica), talc, clay, bentonite, organic bentonite, barium titanate, titanium oxide, cobalt oxide, magnesium oxide, nickel oxide, and zirconium oxide.
  • Metal oxides such as calcium carbonate and magnesium carbonate, sulfates such as barium sulfate and calcium sulfate, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, calcium silicate, aluminum silicate, silicic acid Examples thereof include silicates such as zirconium. These may be used alone or in combination of two or more. Of these inorganic fillers, alumina and / or silica are particularly preferable.
  • the average particle diameter of the inorganic filler (d) is preferably 3 ⁇ m or less. If the average particle size is too large, it will hinder the gap formation when the upper and lower glass substrates are bonded together during the production of the liquid crystal cell.
  • the lower limit of the average particle size of the inorganic filler (d) is usually about 0.01 ⁇ m.
  • the content of the inorganic filler (d) in the liquid crystal sealing agent of the present invention is usually 1 to 30% by mass, preferably 2 to 20% by mass, more preferably 3 to 15% by mass. When there is too little content, the adhesive strength with respect to a glass substrate will fall. Moreover, when there is too much filler content, a viscosity will be too high and applicability
  • the liquid crystal sealant of the present invention contains a curing accelerator (e) in order to accelerate the curability of the thermosetting reaction.
  • the curing accelerator (e) is not particularly limited as long as it has a high thermosetting reaction accelerating property during heating, low contamination to liquid crystals, and does not deteriorate the pot life of the liquid crystal sealant during normal temperature storage. Examples thereof include polyvalent carboxylic acids having an isocyanuric ring skeleton, epoxy resin amine adducts, imidazole derivatives, urea derivatives, and the like. These may be used alone or in combination of two or more.
  • Preferred examples of the curing accelerator include urea compound curing accelerators and isocyanuric ring skeleton-containing polycarboxylic acid curing accelerators.
  • aliphatic dimethylurea (trade name: UCAT3503N manufactured by Sun Apro Co., Ltd.) (a compound in which a methyl group and two dimethylurea groups are substituted on the cyclohexane ring), aromatic dimethylurea (trade name) : UCAT3502T manufactured by San Apro Co., Ltd. (a compound in which two dimethylurea groups are substituted at the 2- and 3-positions of toluene) and tris (carboxy C1-C3 alkyl) isocyanurate.
  • tris (carboxy C1-C3 alkyl) isocyanurate examples include tris (1-carboxymethyl) isocyanurate, tris (2-carboxyethyl) isocyanurate, tris (3-carboxypropyl) isocyanurate, bis (2-carboxyethyl). ) Isocyanurate. Of these, tris (3-carboxypropyl) isocyanurate is preferable.
  • the curing accelerator (e) is uniformly dispersed with a fine particle size so as to be a rapid curing latent curing accelerator. If the average particle size is too large, it becomes a cause of defects such as inability to form a gap when the upper and lower glass substrates are bonded together when manufacturing a narrow gap liquid crystal cell. Therefore, the average particle size is preferably 4 ⁇ m or less, more preferably 3 ⁇ m or less. The lower limit as the average particle size is usually about 0.1 ⁇ m.
  • the content of the curing accelerator (e) in the liquid crystal sealant of the present invention is preferably 0.5 to 15% by mass, more preferably 1 to 8% by mass, based on the total amount of the liquid crystal seal. If the content is too small, the curability is deteriorated and seal puncture occurs, and if the content is too large, the room temperature storage stability and the linearity of the seal are deteriorated.
  • a coupling agent (f) may be added to the liquid crystal sealant of the present invention in order to improve the adhesive strength.
  • the coupling agent (f) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxy) (Cyclohexyl) ethyltrimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxysilane , 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vin
  • a silane coupling agent is preferable, and an aminosilane coupling agent or an epoxy silane coupling agent is more preferable.
  • the coupling agent it is possible to obtain a liquid crystal sealing agent having excellent moisture resistance reliability and little decrease in adhesive strength after moisture absorption.
  • the content thereof is about 0.05 to 3% by mass.
  • the liquid crystal sealant of the present invention may contain a polythiol compound (g) for further improving curability.
  • the polythiol compound is preferably a compound having two or more thiol groups in the molecule, such as methanedithiol, 1,2-dimercaptoethane, 1,2-dimercaptopropane, 2,2-dimercaptopropane, , 3-dimercaptopropane, 1,2,3-trimercaptopropane, 1,4-dimercaptobutane, 1,6-dimercaptohexane, bis (2-mercaptoethyl) sulfide, 1,2-bis (2- Mercaptoethylthio) ethane, 1,5-dimercapto-3-oxapentane, 1,8-dimercapto-3,6-dioxaoctane, 2,2-dimethylpropane-1,3-dithiol, 3,4-dimethoxybutane -1
  • trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), 1, 3, 5-tris [2- (3-mercaptopropionyloxy) ethyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris (3-mercapto (Butyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, pentaerythritol tetrakis (3-mercaptobutyrate) are preferred, and liquid crystal contamination and room temperature are more preferred.
  • 1,3,5-tris (3-merca having a secondary thiol structure DOO butyl oxy) -1,3,5-triazine-2,4,6 (IH, 3H, 5H) - trione, pentaerythritol tetrakis (3-mercapto butyrate) is particularly preferred.
  • the content thereof is usually 0.1 to 10% by mass, preferably 0.3 to 5% by mass. . If the content is too small, the curability is poor and seal puncture is likely to occur, and if the content is too large, the room temperature storage stability tends to be poor.
  • the organic filler (h) may be added to the thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention within a range that does not affect the properties of the liquid crystal sealant.
  • examples of the organic filler (h) include silicone rubber fine particles, acrylic rubber fine particles, and core-shell type acrylic fine particles. These organic fillers may be used alone or in combination of two or more.
  • the average particle diameter of the organic filler that may be added is usually 5 ⁇ m or less, preferably 2 ⁇ m or less. When the average particle size is too large, it becomes difficult to form a cell gap. However, when the organic filler is a silicone rubber powder, a cell gap can be formed even if the average particle size is large. Therefore, the preferable average particle size of the silicone rubber powder is 15 ⁇ m or less.
  • the organic filler is contained in the liquid crystal sealing agent of the present invention, the content thereof is preferably 40% by mass or less, and more preferably 30% by mass or less with respect to the total amount of the liquid crystal sealing agent.
  • the lower limit may be 0% by mass. Usually, it is preferably 1% by mass or more, more preferably 5% by mass or more.
  • the aspect which contains this organic filler in the liquid-crystal sealing compound of this invention is one of the preferable aspects.
  • an aspect in which silicone rubber fine particles and other organic fillers such as (meth) acrylic resin fine particles, preferably core-shell type (meth) acrylic fine particles are used in combination as the organic filler is also one of the preferable embodiments of the present invention.
  • the liquid crystal sealing agent of the present invention may further contain additives such as a photo radical polymerization initiator, an organic solvent, a pigment, a leveling agent, and an antifoaming agent.
  • additives such as a photo radical polymerization initiator, an organic solvent, a pigment, a leveling agent, and an antifoaming agent.
  • the content of the curing accelerator Is 0.5 to 15% by mass, preferably 1 to 8% by mass, based on the total amount of the sealing agent of the present invention. 4).
  • the curing accelerator (e) is an isocyanuric ring skeleton-containing polyvalent carboxylic acid curing accelerator. 5.
  • the curing accelerator (e) is tris (carboxy C1-C3 alkyl) isocyanurate. 6).
  • the above-mentioned epoxy resin and / or (meth) acrylated epoxy resin (b) and, if necessary, a coupling agent or additive are dissolved and mixed, and the above-mentioned heat is added thereto.
  • a curing agent (c), the thermal radical generator (a), the inorganic filler (d), the curing accelerator (e) and other optional components as appropriate, a normal mixing device, for example, What is necessary is just to mix uniformly by a 3 roll, a sand mill, a ball mill, etc. It is preferable to perform a filtration treatment to remove foreign substances after mixing is completed.
  • the liquid crystal display cell of the present invention a pair of substrates on which predetermined electrodes are formed are arranged to face each other at a predetermined interval, the periphery is sealed with the liquid crystal sealant of the present invention, and the liquid crystal is sealed in the gap.
  • the kind of liquid crystal to be sealed is not particularly limited.
  • the substrate is made of glass, quartz, plastic, silicon or the like.
  • a spacer such as glass fiber is added to and mixed with the liquid crystal sealing agent of the present invention. Examples of the spacer include glass fiber, silica beads, polymer beads and the like.
  • the diameter varies depending on the purpose, but is usually 2 to 8 ⁇ m, preferably 3 to 6 ⁇ m, and the amount used is usually 0.1 to 4 parts by weight, preferably 0.5 to 4 parts per 100 parts by weight of the liquid crystal sealant.
  • the amount is about 2 parts by mass, more preferably about 0.9 to 1.5 parts by mass.
  • a liquid crystal sealant containing a spacer to one side of the substrate with a dispenser or the like to form a weir (main seal)
  • the sealant is further applied to the outermost circumference.
  • Apply (dummy seal) Thereafter, the liquid crystal is dropped inside the weir of the internal seal, and the other glass substrate is overlaid in a vacuum, and then opened to the atmospheric pressure to release the gap.
  • the dummy sealant for holding the liquid crystal sealing substrate in a vacuum does not come into contact with the liquid crystal and is cut off after completion of the liquid crystal cell. Even if the same liquid crystal sealant is used, another UV curable type is used.
  • a sealant, a visible light curable sealant, or a thermosetting sealant may be used.
  • UV curable sealant or visible light curable sealant which is a light curable sealant
  • UV or visible light is applied to the dummy seal part by an ultraviolet irradiator or visible light irradiator. Irradiate to cure the dummy seal. If no photo-curing sealant is used for the dummy seal, the light irradiation step is omitted.
  • the substrate with the gap formed is heated at 90 to 130 ° C. for 1 to 2 hours, and then the dummy seal portion is cut off, whereby the liquid crystal display cell of the present invention can be obtained.
  • the liquid crystal display cell of the present invention thus obtained has no display defects due to liquid crystal contamination, and has excellent adhesion and moisture resistance reliability.
  • a part means a mass part and% means the mass%.
  • Example A Synthesis of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane] (silylated benzopinacol) 100 parts (0.28 mol) of commercially available benzopinacol (manufactured by Tokyo Chemical Industry) was dissolved in 350 parts of dimethylformaldehyde. To this was added 32 parts (0.4 mol) of pyridine as a base catalyst and 150 parts (0.58 mol) of BSTFA (manufactured by Shin-Etsu Chemical Co., Ltd.) as a silylating agent, and the mixture was heated to 70 ° C. and stirred for 2 hours.
  • silylating agent manufactured by Shin-Etsu Chemical Co., Ltd.
  • benzopinacol derivative is considered to have selectively introduced a silyl group on one side in the above reaction because the reactivity of the other hydroxyl group further decreases due to a large steric hindrance when one of the two tertiary alcohols reacts.
  • the evaluation criteria for turbidity due to foaming are as follows. Evaluation of presence or absence of turbidity due to foaming ⁇ : The cured product is transparent without turbidity due to foaming. (Triangle
  • Test Example 1 Test Example 2
  • Test Example 3 Gel time 7sec 23sec 4sec Turbidity ⁇ ⁇ ⁇
  • the thermal radical generator of the present invention (Test Example 1) has a high curing rate, no foaming, and no turbidity, so that it can be applied to various applications that require transparency. .
  • Test Example 2 to be compared there is no problem with transparency, but the curing time is long and there is a problem with workability.
  • Test Example 3 is excellent in terms of the curing time, turbidity due to foaming occurs, so it is transparent. Since the properties are inferior, it is unsuitable for uses requiring transparency, and there is a concern that the physical properties of the cured product may be reduced due to foaming.
  • Examples 1 and 2 and Comparative Examples 1 and 2 A resin liquid was obtained by mixing an acrylated epoxy resin, an epoxy resin, and a silane coupling agent described in Table 1 below.
  • Table 1 shows the inorganic filler, thermosetting agent, curing accelerator, silylated benzopinacol, polythiol compound, silicone rubber powder (organic filler) and core-shell acrylic fine particles (organic filler) in the obtained resin liquid.
  • the liquid crystal sealants of Examples 1 and 2 were obtained by blending with the three blending amounts and kneading with three rolls.
  • Example 1 a liquid crystal sealant of Comparative Example 1 was obtained in the same manner as in Example 1 except that benzopinacol was used in the amount shown in Table 1 instead of silylated benzopinacol. Further, in the composition of Example 1, a liquid crystal sealant of Comparative Example 2 was obtained in the same manner as in Example 1 except that organic peroxide was used in the amount shown in Table 1 instead of silylated benzopinacol. It was.
  • JC-5015LA manufactured by Chisso Corporation
  • JC-5015LA manufactured by Chisso Corporation
  • an in-plane spacer (trade name: NATCO SPACER KSEB-525F, manufactured by NATCO, gap width of 5 ⁇ m after bonding) is sprayed on another glass substrate that has been rubbed, heat-fixed, and a vacuum bonding apparatus is used. Then, it was bonded to the previous liquid crystal dripped substrate in a vacuum. Then, after opening to the atmosphere and forming a gap, it was put into an oven at 120 ° C. and cured by heating for 1 hour to prepare a liquid crystal test cell for evaluation.
  • Table 2 shows the results of observing the seal shape and liquid crystal alignment disorder of the prepared liquid crystal cell for evaluation with a polarizing microscope. Further, Table 2 shows the results of measuring the gap of the prepared liquid crystal cell using a liquid crystal characteristic evaluation apparatus (trade name: OMS-NK3, manufactured by Chuo Seiki Co., Ltd.). Evaluation of the seal shape, liquid crystal alignment disorder, and the gap of the liquid crystal cell was made into the following four stages.
  • Example 1 Example 2 Comparative Example 1 Comparative Example 2 Seal shape ⁇ ⁇ ⁇ ⁇ Liquid crystal cell gap ⁇ ⁇ ⁇ ⁇ Liquid crystal alignment ⁇ ⁇ ⁇ ⁇
  • Liquid Crystal Sealant Adhesive Strength Test 1 g of 5 ⁇ m glass fiber as a spacer is added to 100 g of each liquid crystal sealant of Examples 1 and 2 or Comparative Examples 1 and 2 and mixed and stirred. This liquid crystal sealant was applied onto a 50 mm ⁇ 50 mm glass substrate, a 1.5 mm ⁇ 1.5 mm glass piece was bonded onto the liquid crystal sealant, and cured by placing in a 120 ° C. oven for 1 hour. The shear adhesive strength of the glass piece was measured using a bond tester (trade name: SS-30WD, manufactured by Seishin Shoji Co., Ltd.). The results are shown in Table 3 below.
  • Liquid crystal sealant moisture-resistant adhesive strength test The same measurement sample as the liquid crystal sealant adhesive strength test is prepared. The test sample was placed in a pressure cooker tester (trade name: TPC-411, manufactured by Tabai Espec Co., Ltd.) for 20 hours under the conditions of 121 ° C., 2 atm, and humidity 100%, and a bond tester (trade name: SS- 30WD: manufactured by Seishin Shoji Co., Ltd.). The results are shown in Table 3 below.
  • the liquid crystal sealant of the example of the present invention using silylated benzopinacol as a radical generator is compared with the liquid crystal sealant of Comparative Example 1 using benzopinacol as a radical generator.
  • liquid crystal alignment, adhesive strength, and post-humidity adhesive strength all are remarkably excellent.
  • the tetraphenylethane derivative of the present invention is useful as a thermal radical generator having a short gel time and no foaming in the radical curable resin composition because it has high radical generation performance due to heat and no foaming.
  • a resin cured product having high transparency and good physical properties can be obtained.
  • the tetraphenylethane derivative is used as a thermal radical generator in a liquid crystal sealant, the sealant has little liquid crystal contamination, a long pot life, seal formation, and cell gap formation. Since it is good, the workability is also good, and furthermore, it has the characteristics that both the adhesive strength and the adhesive strength after moisture resistance are excellent. Therefore, it is particularly suitable as a thermosetting liquid crystal sealing agent for a liquid crystal dropping method.

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Abstract

Provided are a tetraphenylethane derivative represented by general formula (1), a method for producing the same, the use of the tetraphenylethane derivative as a radical generator, a liquid crystal sealing agent containing the tetraphenylethane derivative, and a thermosetting liquid crystal sealing agent for the one-drop fill process in particular. The radical generator does not foam and has excellent thermal radical generating performance, and, when used with a liquid crystal sealing agent, the resulting liquid crystal sealing agent does not contaminate liquid crystals, has a long pot life, and performs well in terms of forming a seal and forming a cell gap. (1) Y1 and Y2 in general formula (1) are each independently a hydrogen atom, phenyl, or silicon atom, R1 through R6 are each independently a hydrogen atom or C1-4 linear or branched alkyl group, and X1 through X4 are each independently a hydrogen atom, methyl group, ethyl group, methoxy group, ethoxy group, phenoxy group, or halogen group. R1 through R3 or R4 through R6 that bond with Y1 or Y2, respectively, are not present when Y1 or Y2 is a hydrogen atom, and Y1 and Y2 are not both hydrogen atoms.

Description

新規熱ラジカル発生剤、その製造方法、液晶シール剤及び液晶表示セルNovel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell
 本発明は、新規シリルベンゾピナコール、その熱ラジカル発生剤としての用途、それを含む液晶シール剤及びそれを用いた液晶表示セルに関する。 The present invention relates to a novel silylbenzopinacol, its use as a thermal radical generator, a liquid crystal sealing agent containing the same, and a liquid crystal display cell using the same.
 従来、加熱によりラジカル重合性化合物をラジカル重合により硬化させるためのラジカル発生剤としてはアゾ化合物、有機過酸化物、ベンゾイン類、ベンゾインエーテル類、アセトフェノン類、ベンゾピナコール類等が知られており、広く使用されている。 Conventionally, azo compounds, organic peroxides, benzoins, benzoin ethers, acetophenones, benzopinacols, etc. are known as radical generators for curing radically polymerizable compounds by radical polymerization by heating. in use.
 熱開裂により最もラジカルを発生するとされるアゾ化合物や有機過酸化物は、接着剤、封止剤およびギャップ形成剤、成型材料などの製品にラジカル発生剤として使用される。しかしながら、上記ラジカル発生剤はラジカル発生時に窒素または二酸化炭素などのガスの発生を伴うことから、そのガスにより上記の製品の特性が大きく損なわれることが懸念されている。例えば損なわれるおそれのある特性としては、接着強度の低下、耐熱強度の低下、成型物の形状不良などが挙げられる。その他のラジカル発生剤として、ベンゾイン類、ベンゾインエーテル類、アセトフェノン類、ベンゾピナコール類等が挙げられる。これらにおいては加熱時の発泡は少ないが、ラジカル発生能が劣り、所望の性能(反応性及び硬化性)が得られない問題があった。 Azo compounds and organic peroxides, which are most likely to generate radicals by thermal cleavage, are used as radical generators in products such as adhesives, sealants, gap forming agents and molding materials. However, since the radical generator is accompanied by the generation of a gas such as nitrogen or carbon dioxide when the radical is generated, there is a concern that the characteristics of the product may be greatly impaired by the gas. For example, the characteristics that may be damaged include a decrease in adhesive strength, a decrease in heat resistance strength, a shape defect of a molded product, and the like. Other radical generators include benzoins, benzoin ethers, acetophenones, benzopinacols, and the like. In these, foaming at the time of heating is small, but radical generation ability is inferior, and there is a problem that desired performance (reactivity and curability) cannot be obtained.
 特許文献1では紫外線と熱の両者を用いて硬化させる系において、光の当たらない陰影部を硬化させるために、熱ラジカル発生剤としてベンゾピナコールを使用することが開示されている。また特許文献2ではコンタクトレンズ、各種レンズや歯科材料のような成型物の作成においてイニファータータイプのラジカル発生剤が有効であることが開示され、その例としてベンゾピナコールが挙げられている。さらに特許文献3ではフラットパネルディスプレイ用の封止剤に使用される熱ラジカル発生剤としてベンゾピナコールが挙げられている。
 特許文献1及び3ではさらにベンゾピナコールを化学修飾させた化合物が挙げられている。該化合物はさらに所望の効果を発揮すると記載されている。しかし、ベンゾピナコールは三級アルコールであり、且つ水酸基がフェニル基の立体障害の影響で反応性に乏しく安定な誘導体を得るうえで適切なものは報告されていない。
Patent Document 1 discloses that benzopinacol is used as a thermal radical generator in a system that is cured using both ultraviolet rays and heat in order to cure a shadow portion that is not exposed to light. Patent Document 2 discloses that an iniferter type radical generator is effective in producing molded products such as contact lenses, various lenses, and dental materials, and benzopinacol is mentioned as an example. Further, Patent Document 3 mentions benzopinacol as a thermal radical generator used in a sealant for flat panel displays.
Patent Documents 1 and 3 further mention compounds in which benzopinacol is chemically modified. The compounds are further described as exhibiting the desired effect. However, benzopinacol is a tertiary alcohol, and no suitable one has been reported for obtaining a stable derivative having a poor hydroxyl group due to the steric hindrance of the phenyl group.
 また、熱ラジカル発生剤の使用分野の1つとして、液晶表示セル用の液晶シール剤が挙げられる。
 液晶表示セルの大型化に伴い、近年、液晶表示セルの製造法として、従来の液晶真空注入方式による液晶表示セルの製造方法よりも量産性の高い液晶滴下工法が導入され、大型の液晶表示セルの製造が行われてきている(特許文献4参照)。液晶滴下工法とは、液晶基板に液晶シール剤の堰を塗布形成し(メインシール)、さらに最外周に一周、シール剤を塗布後(ダミーシール)、内部シールの内側に液晶を滴下し、その後、真空中で対向するもう一方の液晶基板を貼り合わせ、大気圧に開放することにより液晶が封止され、シール部をUV照射及び加熱により硬化させることにより液晶表示セルを完成させる製造方法である。この製造法で液晶の封止に使用される液晶シール材は、従来の熱硬化型液晶シール剤ではなく、光熱硬化併用タイプの液晶シール剤が一般的に使用されている。従来の熱硬化型液晶シール剤(熱硬化性液晶シール剤とも言う)が液晶滴下工法に使用されない理由は、従来の熱硬化型液晶シール剤で液晶滴下工法を行うと、真空減圧下において加熱が行われるため、加熱時の液晶の熱膨張と液晶シール剤の加熱による粘度低下が起き、シールがパンクし、液晶を封止することができないためである。
In addition, as one of the fields of use of the thermal radical generator, there is a liquid crystal sealing agent for a liquid crystal display cell.
With the increase in size of liquid crystal display cells, in recent years, a liquid crystal dripping method has been introduced as a method of manufacturing liquid crystal display cells, which is more mass-productive than conventional liquid crystal vacuum injection liquid crystal display cell manufacturing methods. Has been manufactured (see Patent Document 4). The liquid crystal dropping method is to apply a liquid crystal sealing agent weir on the liquid crystal substrate (main seal), and then apply the sealing agent to the outermost circumference, apply the sealing agent (dummy seal), drop the liquid crystal inside the internal seal, and then This is a manufacturing method in which the liquid crystal display cell is completed by bonding the other liquid crystal substrate facing each other in a vacuum, sealing the liquid crystal by releasing it to atmospheric pressure, and curing the seal portion by UV irradiation and heating. . As a liquid crystal sealing material used for sealing liquid crystal in this manufacturing method, not a conventional thermosetting liquid crystal sealing agent but a photothermosetting combined type liquid crystal sealing agent is generally used. The reason why a conventional thermosetting liquid crystal sealant (also called a thermosetting liquid crystal sealant) is not used in the liquid crystal dropping method is that when the liquid crystal dropping method is performed with the conventional thermosetting liquid crystal sealing agent, heating is performed under vacuum and reduced pressure. This is because the thermal expansion of the liquid crystal during heating and the viscosity decrease due to the heating of the liquid crystal sealant occur, the seal punctures and the liquid crystal cannot be sealed.
 光熱硬化併用タイプの液晶シール剤の使用方法は、液晶基板にディスペンサー等で液晶シール剤の堰を塗布形成後、その堰の内側に液晶を滴下し、真空中で対向するもう一方の基板を貼り合わせた後、シール部に紫外線等の光を照射し、仮硬化させ、その後、約120℃約1時間で液晶シール剤を熱硬化させることにより、液晶セルを製造するものである。 The photo-curing combined type liquid crystal sealant is used by applying a liquid crystal sealant weir to the liquid crystal substrate with a dispenser, etc., then dropping the liquid crystal inside the weir and attaching the other substrate facing in vacuum. After the alignment, the liquid crystal cell is manufactured by irradiating the seal portion with light such as ultraviolet rays and temporarily curing, and then thermally curing the liquid crystal sealant at about 120 ° C. for about 1 hour.
 しかし、光熱硬化併用タイプの場合、液晶シール剤に紫外線等の光を照射しなくてはいけないが、近年の液晶セルの狭額縁化に伴い、下記のような問題が発生している。
 即ち、液晶シール部が配線又はブラックマトリックスによって遮光され、液晶シール剤に光が照射されない部分ができるため、未硬化部分が発生する。その未硬化部分が加熱硬化工程時に液晶によって差し込まれたり、又は、液晶汚染が生じたりする問題が出てきた。そのため、液晶セルの設計にあたっては、シール剤に光がなるべく多く照射されるような設計にしなくてはならないという制限が生じてきた。また、紫外線照射による液晶や配向膜の劣化が問題となるため、紫外線が液晶に当たらないように、紫外線照射工程時に遮光マスクにより液晶部を遮光する必要が生じている。さらに、液晶ガラス基板サイズの大型化に伴い、紫外線照射装置が大型化し、紫外線照射装置のランニングコストが増大化する等が問題になってきている。
However, in the case of the photothermographic combination type, the liquid crystal sealant must be irradiated with light such as ultraviolet rays. However, the following problems occur with the narrowing of the frame of the liquid crystal cell in recent years.
That is, the liquid crystal seal portion is shielded from light by the wiring or the black matrix, and a portion where the liquid crystal sealant is not irradiated with light is formed, so that an uncured portion is generated. There has been a problem that the uncured portion is inserted by the liquid crystal during the heat curing process or liquid crystal contamination occurs. Therefore, in designing the liquid crystal cell, there has been a restriction that the sealant must be designed so that as much light as possible is irradiated. Further, since deterioration of the liquid crystal and the alignment film due to ultraviolet irradiation becomes a problem, it is necessary to shield the liquid crystal portion with a light shielding mask during the ultraviolet irradiation process so that the ultraviolet rays do not hit the liquid crystal. Furthermore, along with the increase in the size of the liquid crystal glass substrate, the ultraviolet irradiation apparatus is increased in size, and the running cost of the ultraviolet irradiation apparatus is increasing.
 以上のことから、近年、液晶滴下工法において、紫外線照射を必要とせず、かつ、熱硬化のみで液晶表示セルを作成できる熱硬化型液晶シール剤(液晶滴下工法用熱硬化型液晶シール剤)の実現が望まれてきている。
 現在までに、液晶滴下工法用の熱硬化型液晶シール剤の提案は、既に行われていた。例えば、特許文献5には、1分子中の水素結合性官能基数を分子量で除した値が3.5×10-4以上である硬化性樹脂100重量部に対して熱硬化剤を3~40重量部含有する液晶滴下工法用熱硬化液晶シール剤が提案されている。この液晶シール剤を使用することにより、低液晶汚染になることが開示されている。しかし、該熱硬化型液晶シール剤を用いた液晶滴下工法では、前記した加熱により低粘度化した硬化途中の液晶シール剤の堰が破られて液晶が漏れてしまうという問題(シールパンクの問題)と、加熱により低粘度化した液晶シール剤の成分が、やはりNI点(等方相から液晶相へ転移する温度)以上に加熱されることにより、通常よりもさらに流動しやすくなっている液晶中に溶出し、液晶を汚染してしまうという重大な問題が、十分に解決されているとは言い難い。
From the above, in recent years, in the liquid crystal dropping method, a thermosetting liquid crystal sealing agent (thermosetting liquid crystal sealing agent for liquid crystal dropping method) that does not require ultraviolet irradiation and can produce a liquid crystal display cell only by thermosetting Realization is desired.
To date, proposals have been made for thermosetting liquid crystal sealing agents for the liquid crystal dropping method. For example, in Patent Document 5, 3 to 40 thermosetting agents are added to 100 parts by weight of a curable resin having a value obtained by dividing the number of hydrogen bonding functional groups in one molecule by molecular weight of 3.5 × 10 −4 or more. A thermosetting liquid crystal sealing agent for liquid crystal dropping method containing parts by weight has been proposed. It has been disclosed that the use of this liquid crystal sealant results in low liquid crystal contamination. However, in the liquid crystal dropping method using the thermosetting liquid crystal sealing agent, there is a problem that the liquid crystal leaks because the weir of the liquid crystal sealing agent in the middle of curing, whose viscosity has been lowered by heating, is broken (seal puncture problem) In addition, the liquid crystal sealant component whose viscosity has been reduced by heating is heated more than the NI point (temperature at which the isotropic phase transitions to the liquid crystal phase) or more, so that the liquid crystal becomes more fluid than usual. It is difficult to say that the serious problem of leaching out and contaminating the liquid crystal has been sufficiently solved.
 また、特許文献6では、ゲル化剤が添加された液晶シール剤により、熱硬化のみの液晶滴下工法で、耐シールパンク、シール形状保持ができるとしている。しかし、熱硬化の液晶滴下工法の問題点である加熱硬化時の液晶シール剤の液晶への汚染について、解決されていない。
 特許文献7には熱硬化性樹脂からなる液晶シール剤を塗布後、プレベークをし、その後、液晶滴下、真空貼り合わせを行う製造方法が提案されている。しかし、具体的な液晶シール剤の樹脂組成について明示されていない。
Further, in Patent Document 6, the liquid crystal sealant to which the gelling agent is added can prevent the seal puncture and keep the seal shape by the liquid crystal dropping method only by thermosetting. However, it has not been solved about the contamination of the liquid crystal sealant to the liquid crystal at the time of heat curing, which is a problem of the thermosetting liquid crystal dropping method.
Patent Document 7 proposes a manufacturing method in which a liquid crystal sealant made of a thermosetting resin is applied, pre-baked, and thereafter liquid crystal dropping and vacuum bonding are performed. However, the specific resin composition of the liquid crystal sealant is not specified.
 特許文献8及び9には、Bステージ化(半硬化状態)処理としてプレベーク工程を行う熱硬化性の液晶滴下工法用液晶シール剤が提案されている。この方法は80℃で20分間のBステージ化処理を必要とするため、工程時間が長くなってしまう欠点がある。また、20分間のBステージ化処理時間を短くするため、処理温度を例えば100℃以上に上げると、記載の液晶シール剤では、硬化反応が進んでしまうため好ましくない。
 特許文献7には、熱開裂型ラジカル発生剤、不飽和二重結合を有する化合物を含む熱硬化性化合物及び重付加型の熱硬化剤を含有することを特徴とする液晶シール剤が提案されている。そして、そこには、液晶基板の大気圧貼り合わせで、一部UV照射する液晶表示素子の作製について記載されている。しかしながら、液晶基板の真空減圧貼り合わせでUV照射することなく熱硬化のみによる液晶表示素子の作製については記載が無い。
 以上、挙げたように、液晶滴下工法における熱硬化性シール剤での全て問題を解決する加熱硬化型の液晶滴下シール剤はなく、未だ、熱硬化のみでの液晶滴下工法は実現されていない。
Patent Documents 8 and 9 propose a thermosetting liquid crystal sealing method for a liquid crystal dropping method in which a pre-baking process is performed as a B-stage (semi-cured state) process. Since this method requires a B-stage treatment for 20 minutes at 80 ° C., there is a drawback that the process time becomes long. Further, if the processing temperature is increased to, for example, 100 ° C. or higher in order to shorten the B-stage processing time for 20 minutes, the described liquid crystal sealant is not preferable because the curing reaction proceeds.
Patent Document 7 proposes a liquid crystal sealing agent characterized by containing a thermal cleavage type radical generator, a thermosetting compound containing a compound having an unsaturated double bond, and a polyaddition type thermosetting agent. Yes. And, there is described production of a liquid crystal display element that is partially UV-irradiated by bonding a liquid crystal substrate at atmospheric pressure. However, there is no description about the production of a liquid crystal display element only by thermosetting without UV irradiation by vacuum decompression bonding of a liquid crystal substrate.
As mentioned above, there is no thermosetting liquid crystal dropping sealant that solves all the problems with the thermosetting sealant in the liquid crystal dropping method, and the liquid crystal dropping method only by thermosetting has not been realized yet.
 その他、近年、基板の外形サイズを大きくしないで、より表示領域を大きくしたいという要望が強くなってきている。そのため、液晶シール外周部を狭くする狭額縁化や液晶シール幅を細くする等の液晶セルの設計がなされるようになってきている。その結果、シール幅が細く形成でき、かつ、シール形状が均一で乱れにくい液晶シール剤、更には、シール幅が細くても接着強度が強い液晶シール剤が求められてきている。また、作業時間内で液晶シール剤の塗布条件の変化が小さいポットライフが長い液晶シール剤が求められている。
 また、近年、液晶テレビ等の普及にともなって、動画の再生に対して、液晶の高速応答性を高めるために、液晶のセルギャップ(液晶が充填される2枚の基板の隙間)が狭くなってきている。液晶基板の真空貼り合わせ時に狭セルギャップ化が容易な液晶シール剤が求められてきている。
In addition, in recent years, there has been a strong demand to increase the display area without increasing the external size of the substrate. For this reason, liquid crystal cells have been designed such as narrowing the outer periphery of the liquid crystal seal and narrowing the liquid crystal seal width. As a result, there has been a demand for a liquid crystal sealant that can be formed with a narrow seal width and has a uniform seal shape that is not easily disturbed, and a liquid crystal sealant that has high adhesive strength even if the seal width is narrow. Further, there is a demand for a liquid crystal sealant having a long pot life in which the change in the application condition of the liquid crystal sealant is small within the working time.
In recent years, with the spread of liquid crystal televisions and the like, the cell gap of the liquid crystal (the gap between the two substrates filled with liquid crystal) is narrowed in order to increase the high-speed response of the liquid crystal when playing back moving images. It is coming. There has been a demand for a liquid crystal sealant that can easily narrow the cell gap when the liquid crystal substrate is vacuum-bonded.
 そして、液晶セルの高寿命化要望に対して、液晶シールの高湿条件化での劣化が問題となってきている。高温高湿試験後の液晶シールの接着強度の劣化が小さい液晶シール剤が求められてきている。
 以上述べてきたように、熱硬化型の液晶滴下工法を実現し、基板の真空貼り合わせで、加熱により、シールパンクせず、そして液晶汚染がなく、接着強度及び耐湿試験後の接着強度が強く、シール塗布性に優れ、室温でのポットライフが長く、狭セルギャップ化が容易な液晶滴下工法用熱硬化性液晶シール剤が求められている。
And in response to the demand for a long life of the liquid crystal cell, deterioration of the liquid crystal seal under high humidity conditions has become a problem. There has been a demand for a liquid crystal sealant with a small deterioration of the adhesive strength of the liquid crystal seal after the high temperature and high humidity test.
As described above, the thermosetting type liquid crystal dropping method is realized, the substrate is vacuum-bonded, does not seal puncture by heating, and there is no liquid crystal contamination, and the adhesive strength after the moisture resistance test is strong. There is a need for a thermosetting liquid crystal sealant for liquid crystal dropping method that has excellent seal coatability, has a long pot life at room temperature, and is easy to narrow the cell gap.
特開昭57-53508号公報JP-A-57-53508 特開平11-21304号公報Japanese Patent Laid-Open No. 11-21304 特開2006-10870号公報JP 2006-10870 A 特公平8-20627号公報Japanese Patent Publication No. 8-20627 特許第3955038号公報Japanese Patent No. 3955038 特許第3976749号公報Japanese Patent No. 3976749 特開2005-92043号公報JP 2005-92043 A 特開2007-199710号公報JP 2007-199710 A 特開2007-224117号公報JP 2007-224117 A
 本発明は前記背景技術に鑑みてなされたものであり、本発明の第1の目的は、加熱時に発泡せず、より高活性な新規熱ラジカル発生剤を開発することである。
 また、本発明の第2の目的は、紫外線照射を必要としない液晶滴下工法用の熱硬化性液晶シール剤を提供することにある。さらに、液晶汚染性が低く、接着強度及び耐湿試験後の接着強度が強く、シール直線性に優れ、室温でのポットライフが長く、狭セルギャップ化が容易な液晶滴下工法用熱硬化型液晶シール剤(以下液晶滴下工法用熱硬化性液晶シール剤ともいう)を提供することにある。
The present invention has been made in view of the above-described background art, and a first object of the present invention is to develop a novel thermal radical generator that does not foam during heating and has a higher activity.
A second object of the present invention is to provide a thermosetting liquid crystal sealing agent for a liquid crystal dropping method which does not require ultraviolet irradiation. Furthermore, thermosetting liquid crystal seal for liquid crystal dripping method with low liquid crystal contamination, high adhesive strength and high adhesive strength after moisture resistance test, excellent seal linearity, long pot life at room temperature, and easy narrowing of cell gap The present invention provides an agent (hereinafter also referred to as a thermosetting liquid crystal sealing agent for a liquid crystal dropping method).
 本発明者らは前記した課題を解決すべく鋭意研究を重ねた結果、ベンゼン環上に置換基を有しても良いベンゾピナコールの水酸基の少なくとも1つをシリル化させることにより、加熱時に発泡せず、より高活性な新規熱ラジカル発生剤が得られること、更に、該熱ラジカル発生剤を利用することにより、前記目的の液晶滴下工法用熱硬化性液晶シール剤が得られることを見出し、本発明を完成させたものである。
 即ち、本発明は、次の(1)~(20)に関するものである。
As a result of intensive studies to solve the above-mentioned problems, the present inventors have made at least one hydroxyl group of benzopinacol optionally having a substituent on the benzene ring into a foam during heating. In addition, it has been found that a more highly active novel thermal radical generator can be obtained, and that the thermosetting liquid crystal sealing agent for liquid crystal dropping method can be obtained by using the thermal radical generator. The invention has been completed.
That is, the present invention relates to the following (1) to (20).
(1)下記一般式(1’)
Figure JPOXMLDOC01-appb-I000001

(式中、Y’又はY’は各々独立して水素原子、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す。但し、Y’又はY’にそれぞれ結合するR~R又はR~RはY’又はY’が水素原子の場合は存在せず、且つY’及びY’が水素原子の場合を除き、更に、Y’及びY’が珪素原子で、R~Rの全てがメチル基であり、X~Xの全てが水素原子である場合を除く)で表されるテトラフェニルエタン誘導体。
(2) 一般式(1’)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R’-又はR’-はジ(炭素数1~4の直鎖又は分岐アルキル)シリル基、若しくはトリ(炭素数1~4の直鎖又は分岐アルキル)シリル基であり、X~Xのいずれもが水素原子である上記(1)に記載のテトラフェニルエタン誘導体。
(3) 一般式(1’)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R Y’-又はR Y’-はトリメチルシリル、トリエチルシリル又はt-ブチルジメチルシリルであり、X~Xのいずれもが水素原子である上記(1)又は(2)に記載のテトラフェニルエタン誘導体。            
(4) 下記式(2)
Figure JPOXMLDOC01-appb-I000002

で表される1-ヒドロキシ-2-トリメチルシロキシ-1,1,2,2-テトラフェニルエタンである上記(1)~(3)のいずれか一項に記載のテトラフェニルエタン誘導体。
(1) The following general formula (1 ')
Figure JPOXMLDOC01-appb-I000001

(Wherein Y 1 ′ and Y 2 ′ each independently represent a hydrogen atom or a silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms) X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, provided that they are bonded to Y 1 ′ or Y 2 ′, respectively. to R 1 ~ R 3, or R 4 ~ R 6 is not present if Y 1 'or Y 2' is a hydrogen atom, and unless Y 1 'and Y 2' is a hydrogen atom, further, Y 1 A tetraphenylethane derivative represented by the formula: “and Y 2 ′ are silicon atoms, all of R 1 to R 6 are methyl groups, and all of X 1 to X 4 are hydrogen atoms”.
(2) In the general formula (1 ′), one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — R 4 R 5 R 6 Y 2 ′ — is a di (C 1-4 straight or branched alkyl) silyl group or a tri (C 1-4 straight or branched alkyl) silyl group, and X 1 The tetraphenylethane derivative according to the above (1), wherein all of .about.X 4 are hydrogen atoms.
(3) In the general formula (1 ′), one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — R 4 R 5 R 6 Y 2 '-is trimethylsilyl, triethylsilyl, or t-butyldimethylsilyl, and all of X 1 to X 4 are hydrogen atoms, and the tetraphenyl according to (1) or (2) above Ethane derivative.
(4) Following formula (2)
Figure JPOXMLDOC01-appb-I000002

The tetraphenylethane derivative according to any one of the above (1) to (3), which is 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane represented by the formula:
(5)(a)下記一般式(1)
Figure JPOXMLDOC01-appb-I000003

(式中、Y又はYは各々独立して水素原子、フェニル、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン原子を示す。但し、Y又はYにそれぞれ結合するR~R又はR~RはY又はYが水素原子の場合は存在せず、且つY及びYのいずれもが水素原子の場合を除く)で表されるテトラフェニルエタン誘導体、(b)エポキシ樹脂又はエポキシ樹脂の(メタ)アクリル酸付加物の何れか一方若しくは両者、(c)熱硬化剤、および(d)無機充填剤を含有することを特徴とする液晶滴下工法用熱硬化性液晶シール剤。
(6) (a)一般式(1)のテトラフェニルエタン誘導体が上記(1)~(4)又は後記(20)のいずれか一項に記載のテトラフェニルエタン誘導体である上記(5)に記載の液晶シール剤。
(7) (a)一般式(1)のテトラフェニルエタン誘導体が平均粒径5μm以下の固体粉末である上記(5)又は(6)に記載の液晶シール剤。
(8) (c)熱硬化剤の融点又は軟化点が100℃以上である潜在性硬化剤である上記(5)~(7)の何れか一項に記載の液晶シール剤。
(9) (d)無機充填剤がアルミナ及び/又はシリカである上記(5)~(8)の何れか一項に記載の液晶シール剤。
(10) (d)無機充填剤の平均粒径が10~2000nmである上記(5)~(9)の何れか一項に記載の液晶シール剤。
(11) (e)硬化促進剤を含有することを特徴とする上記(5)~(10)の何れか一項に記載の液晶シール剤。
(12)(f)カップリング剤を含有することを特徴とする上記(5)~(11)の何れか一項に記載の液晶シール剤。
(13)(a)一般式(1)のテトラフェニルエタン誘導体を、液晶シール剤の総量に対して0.1~10質量%、(b)エポキシ樹脂及び/又はエポキシ樹脂の(メタ)アクリル酸付加物を、液晶シール剤の総量に対して、30~75質量%、(c)熱硬化剤を(b)成分100質量部に対して、5~60質量部、および(d)無機充填剤を、液晶シール剤の総量に対して、1~30質量%の範囲で含有する上記(5)~(12)の何れか一項に記載の液晶シール剤。
(14) (a)一般式(1)において、Y又はYのいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R-又はR-はジ(炭素数1~4の直鎖又は分岐アルキル)シリル基、若しくはトリ(炭素数1~4の直鎖又は分岐アルキル)シリル基であり、X~Xのいずれもが水素原子であるテトラフェニルエタン誘導体、(b)エポキシ樹脂又はエポキシ樹脂の(メタ)アクリル酸付加物の何れか一方若しくは両者、(c)熱硬化剤として融点又は軟化点が100℃以上である潜在性硬化剤、(d)無機充填剤及び、(e)硬化促進剤又は(f)カップリング剤のいずれか一方若しくは両者を含有することを特徴とする上記(5)~(13)の何れか一項に記載の液晶シール剤。
(5) (a) The following general formula (1)
Figure JPOXMLDOC01-appb-I000003

Wherein Y 1 or Y 2 each independently represents a hydrogen atom, phenyl or silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen atom, provided that R is bonded to Y 1 or Y 2 , respectively. 1 to R 3 or R 4 to R 6 are not present when Y 1 or Y 2 is a hydrogen atom, and each of Y 1 and Y 2 is a hydrogen atom. A liquid crystal dropping method comprising a derivative, (b) one or both of an epoxy resin or an epoxy resin (meth) acrylic acid adduct, (c) a thermosetting agent, and (d) an inorganic filler. Thermosetting liquid crystal sealant.
(6) (a) The tetraphenylethane derivative of the general formula (1) is the tetraphenylethane derivative according to any one of the above (1) to (4) or the following (20), Liquid crystal sealant.
(7) The liquid crystal sealing agent according to the above (5) or (6), wherein the tetraphenylethane derivative of the general formula (1) is a solid powder having an average particle size of 5 μm or less.
(8) (c) The liquid crystal sealant according to any one of the above (5) to (7), which is a latent curing agent having a melting point or softening point of 100 ° C. or higher.
(9) The liquid crystal sealing agent according to any one of (5) to (8), wherein (d) the inorganic filler is alumina and / or silica.
(10) The liquid crystal sealing agent according to any one of (5) to (9), wherein (d) the inorganic filler has an average particle size of 10 to 2000 nm.
(11) The liquid crystal sealant as described in any one of (5) to (10) above, which comprises (e) a curing accelerator.
(12) The liquid crystal sealing agent according to any one of (5) to (11) above, which contains a coupling agent (f).
(13) (a) 0.1 to 10% by mass of the tetraphenylethane derivative of the general formula (1) with respect to the total amount of the liquid crystal sealant, (b) (meth) acrylic acid of epoxy resin and / or epoxy resin The adduct is 30 to 75% by mass with respect to the total amount of the liquid crystal sealant, (c) the thermosetting agent is 5 to 60 parts by mass with respect to 100 parts by mass of the component (b), and (d) the inorganic filler. The liquid crystal sealant according to any one of the above (5) to (12), which is contained in a range of 1 to 30% by mass with respect to the total amount of the liquid crystal sealant.
(14) (a) In the general formula (1), when either Y 1 or Y 2 is a hydrogen atom and the other is a silicon atom, R 1 R 2 R 3 Y 1 — or R 4 R 5 R 6 Y 2 — represents a di (linear or branched alkyl having 1 to 4 carbon atoms) silyl group or a tri (linear or branched alkyl having 1 to 4 carbon atoms) silyl group, and X 1 to X A tetraphenylethane derivative in which all 4 are hydrogen atoms, (b) one or both of an epoxy resin and an (meth) acrylic acid adduct of an epoxy resin, or (c) a melting point or a softening point of 100 as a thermosetting agent. (5) to (5) above, which contains a latent curing agent having a temperature of not lower than ° C., (d) an inorganic filler, and (e) a curing accelerator or (f) a coupling agent. 13) Liquid crystal sealing agent as described in any one of
(15) 上記(5)~(14)の何れか一項に記載の液晶シール剤の硬化物でシールされた液晶表示セル。
(16) 上記(5)に記載された一般式(1)のテトラフェニルエタン誘導体を有効成分として含むラジカル発生剤。
(17) 上記(5)に記載された一般式(1)のテトラフェニルエタン誘導体の、熱硬化性液晶シール剤製造のための上記(16)に記載のラジカル発生剤としての用途。
(18) 上記(5)に記載された一般式(1)のテトラフェニルエタン誘導体を含むラジカル硬化性樹脂組成物を熱硬化させた硬化物。
(19) 下記一般式(3)
Figure JPOXMLDOC01-appb-I000004

(式中、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す)
で表されるベンゾピナコールとシリル化剤を反応させる下記式(1’)
Figure JPOXMLDOC01-appb-I000005

(式中、Y’又はY’は各々独立して水素原子、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す。但し、Y’又はY’にそれぞれ結合するR~R又はR~RはY’又はY’が水素原子の場合は存在せず、且つY’及びY’のいずれもが水素原子の場合を除く)で表されるテトラフェニルエタン誘導体の製造方法。
(20) 一般式(1’)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子であり、珪素原子の場合、R~R又はR~Rは各々独立して炭素数1~4の直鎖又は分岐アルキル基である上記(1)に記載のテトラフェニルエタン誘導体。         
(15) A liquid crystal display cell sealed with a cured product of the liquid crystal sealant according to any one of (5) to (14) above.
(16) A radical generator containing the tetraphenylethane derivative of the general formula (1) described in (5) as an active ingredient.
(17) Use of the tetraphenylethane derivative of the general formula (1) described in the above (5) as the radical generator described in the above (16) for producing a thermosetting liquid crystal sealant.
(18) A cured product obtained by thermally curing a radical curable resin composition containing the tetraphenylethane derivative of the general formula (1) described in (5) above.
(19) The following general formula (3)
Figure JPOXMLDOC01-appb-I000004

(Wherein X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group)
The following formula (1 ′) for reacting a benzopinacol represented by the formula:
Figure JPOXMLDOC01-appb-I000005

(Wherein Y 1 ′ and Y 2 ′ each independently represent a hydrogen atom or a silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms) X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, provided that they are bonded to Y 1 ′ or Y 2 ′, respectively. R 1 to R 3 or R 4 to R 6 are not present when Y 1 ′ or Y 2 ′ is a hydrogen atom, and each of Y 1 ′ and Y 2 ′ is a hydrogen atom) The manufacturing method of the tetraphenylethane derivative represented.
(20) In the general formula (1 ′), one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 to R 3 or R 4 to R 6 The tetraphenylethane derivative according to the above (1), wherein each is independently a linear or branched alkyl group having 1 to 4 carbon atoms.
 本発明で使用する一般式(1)で表されるテトラフェニルエタン誘導体(ベンゾピナコール誘導体ともいう)は、熱ラジカル発生剤として有用であり、加熱時の発泡がなく、且つ反応速度を速めることが可能である。従って、発泡による物性の劣化のおそれがない熱ラジカル発生剤として、幅広く種々の用途、例えば接着剤、封止剤、及びギャップ形成剤、成型材料などの製造に用いることが可能であり、物性(硬化物性、接着強度、形状安定性等)の優れた製品を得ることができる。特に、液晶滴下工法で使用する熱硬化性液晶シール剤用の熱ラジカル発生剤として優れている。
 上記本発明で使用する一般式(1)で表されるテトラフェニルエタン誘導体を熱ラジカル発生剤として用いる熱硬化性液晶シール剤は、液晶シール部への紫外線照射を必要としない液晶滴下工法用の熱硬化性の液晶シール剤(以下本発明の液晶シール剤ともいう)として最適である。該液晶シール剤は、液晶汚染性が低く、接着強度及び耐湿試験後の接着強度が強く、シール直線性に優れ、室温でのポットライフが長い等の優れた性質を有することから、狭セルギャップの液晶セルの製造が容易である。その結果、歩留まり高く、高信頼性、高品質の液晶表示セルの製造が可能になる。又、本発明の液晶シール剤の硬化物でシールされた本発明の液晶表示セルは、液晶汚染による表示不良が無く、接着性、耐湿信頼性に優れたものである。
 また、前記一般式(1’)で表されるテトラフェニルエタン誘導体は本発明者らにより合成された新規な化合物である。
The tetraphenylethane derivative (also referred to as a benzopinacol derivative) represented by the general formula (1) used in the present invention is useful as a thermal radical generator, has no foaming during heating, and can increase the reaction rate. Is possible. Therefore, it can be used as a thermal radical generator that has no fear of deterioration of physical properties due to foaming, for a wide variety of uses such as the production of adhesives, sealants, gap forming agents, molding materials, etc. Products with excellent cured properties, adhesive strength, shape stability, etc. can be obtained. In particular, it is excellent as a thermal radical generator for a thermosetting liquid crystal sealing agent used in a liquid crystal dropping method.
The thermosetting liquid crystal sealing agent using the tetraphenylethane derivative represented by the general formula (1) used in the present invention as a thermal radical generator is for a liquid crystal dropping method that does not require ultraviolet irradiation to the liquid crystal sealing portion. It is optimal as a thermosetting liquid crystal sealant (hereinafter also referred to as the liquid crystal sealant of the present invention). The liquid crystal sealant has excellent properties such as low liquid crystal contamination, high adhesive strength and adhesive strength after moisture resistance test, excellent seal linearity, and long pot life at room temperature. The liquid crystal cell can be easily manufactured. As a result, a high yield, high reliability, and high quality liquid crystal display cell can be manufactured. Further, the liquid crystal display cell of the present invention sealed with a cured product of the liquid crystal sealant of the present invention has no display failure due to liquid crystal contamination, and has excellent adhesion and moisture resistance reliability.
The tetraphenylethane derivative represented by the general formula (1 ′) is a novel compound synthesized by the present inventors.
本発明の1-ヒドロキシ-2-トリメチルシロキシ-1,1,2,2-テトラフェニルエタンのNMR(プロトン)スペクトル(溶媒:DMSO-d6)である。1 is an NMR (proton) spectrum (solvent: DMSO-d6) of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane of the present invention.
 以下、本発明を詳細に説明する。
 以下の説明においては、便宜上、一般式(1)で説明するが、一般式(1’)の範囲に入らない場合の説明を除き、いずれの説明も、一般式(1)を一般式(1’)と読み替えることにより、同様に一般式(1’)に対しても適用されるものとする。また、Y及びYの説明に付いても、それぞれをY’及びY’と読み替え、Y’及びY’の範囲に含まれないものを除くことで、同様に適用されるものとする。
 本発明の一般式(1)において、Y及びYはそれぞれ独立に、水素原子、フェニル基またはたは珪素原子を示し、少なくとも何れか一方は水素原子以外の基である。好ましいのは一方が水素原子で、他方が珪素原子の場合である。
 本発明の一般式(1)において、R~Rにおける炭素数1~4の直鎖又は分岐アルキル基(以下単にC1~C4アルキル基ともいう)としては、例えばメチル、エチル、n-プロピル、i-プロピル、t-ブチル等を挙げることができる。また、X~Xにおけるハロゲンとしてはフッ素原子、塩素原子、臭素原子等を挙げることができる。
 一般式(1)のY又はYが水素原子以外の基の場合、R-又はR-は、フェニル基又は1~3個のC1~C4アルキル基で置換されたフェニル基、又は、ジC1~C4アルキルシリル基又はトリC1~C4アルキルシリル基が好ましく、より好ましくは、ジC1~C4アルキルシリル基又はトリC1~C4アルキルシリル基であり、更に好ましくはトリC1~C4アルキルシリル基である。
 一般式(1)のR-、R-におけるジ又はトリ炭素数1~4の直鎖又は分岐アルキルシリル基において、2個又は3個の炭素数1~4アルキル基は同一でも異なってもよく、該シリル基としては例えばジメチルシリル、ジエチルシリル、メチルエチルシリル等のジC1~C4アルキルシリル基:又は、トリメチルシリル、トリエチルシリル、ジメチルエチルシリル、t-ブチルジメチルシリル等のトリC1~C4アルキルシリル基;が挙げられる。これらの中で、トリC1~C4アルキルシリル基が好ましく、より好ましくはトリメチルシリル基である。
 X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を表し、好ましいのは、X~Xの全てが水素原子の場合である。
Hereinafter, the present invention will be described in detail.
In the following description, for the sake of convenience, the general formula (1) will be described. However, except for the case where it does not fall within the range of the general formula (1 ′), the general formula (1) is replaced by the general formula (1). By replacing with “)”, the same applies to the general formula (1 ′). Moreover, even with the description of Y 1 and Y 2, replaced respectively with Y 1 'and Y 2', by excluding those not included in the scope of the Y 1 'and Y 2', is similarly applicable Shall.
In the general formula (1) of the present invention, Y 1 and Y 2 each independently represent a hydrogen atom, a phenyl group or a silicon atom, and at least one of them is a group other than a hydrogen atom. Preferred is when one is a hydrogen atom and the other is a silicon atom.
In the general formula (1) of the present invention, examples of the linear or branched alkyl group having 1 to 4 carbon atoms (hereinafter also simply referred to as C1 to C4 alkyl group) in R 1 to R 6 include, for example, methyl, ethyl, n-propyl , I-propyl, t-butyl and the like. Examples of the halogen in X 1 to X 4 include a fluorine atom, a chlorine atom, and a bromine atom.
When Y 1 or Y 2 in the general formula (1) is a group other than a hydrogen atom, R 1 R 2 R 3 Y 1 — or R 4 R 5 R 6 Y 2 — represents a phenyl group or 1 to 3 C1 A phenyl group substituted with a -C4 alkyl group, or a di-C1-C4 alkylsilyl group or a tri-C1-C4 alkylsilyl group, more preferably a di-C1-C4 alkylsilyl group or a tri-C1-C4 alkylsilyl group And more preferably a tri-C1 to C4 alkylsilyl group.
In the di- or tri-C 1-4 linear or branched alkylsilyl group in R 1 R 2 R 3 Y 1 —, R 4 R 5 R 6 Y 2 — in the general formula (1), 2 or 3 The alkyl group having 1 to 4 carbon atoms may be the same or different. Examples of the silyl group include di-C1 to C4 alkylsilyl groups such as dimethylsilyl, diethylsilyl, and methylethylsilyl: or trimethylsilyl, triethylsilyl, dimethylethylsilyl And tri-C1 to C4 alkylsilyl groups such as t-butyldimethylsilyl; Of these, a tri-C1 to C4 alkylsilyl group is preferable, and a trimethylsilyl group is more preferable.
X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, and preferably all of X 1 to X 4 are hydrogen atoms. Is the case.
 一般式(1)で表されるテトラフェニルエタン誘導体における好ましい化合物としては、1-ヒドロキシ-2-ジ又はトリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタン又は1, 2-ビス{ジ又はトリ(C1~C4アルキル)シロキシ}-1,1, 2,2-テトラフェニルエタンを挙げることができ、1-ヒドロキシ-2-ジ又はトリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタンがより好ましく、より好ましくは、1-ヒドロキシ-2-トリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタンである。
 なお、上記テトラフェニルエタンにおけるジ又はトリ(C1~C4アルキル)シロキシは、シリル基上の2又は3個のアルキル基が、同じでも、異なっても良い。例えば、トリ(C1~C4アルキル)シロキシとしては、トリメチルシロキシ、トリエチルシロキシ又はt-ブチルジメチルシロキシ等を含む。
 該テトラフェニルエタン誘導体の好ましい化合物としては、具体的には、例えば、1, 2-ビス(トリメチルシロキシ)-1,1, 2,2-テトラフェニルエタン、1, 2-ビス(トリエチルシロキシ)-1,1, 2,2-テトラフェニルエタン、1, 2-ビス(t-ブチルジメチルシロキシ)-1,1, 2,2-テトラフェニルエタン、1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタン、1-ヒドロキシ-2-トリエチルシロキシ-1,1, 2,2-テトラフェニルエタン、1-ヒドロキシ-2-t-ブチルジメチルシロキシ-1,1, 2,2-テトラフェニルエタン、が挙げられる。好ましくは1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタン、1-ヒドロキシ-2-トリエチルシロキシ-1,1, 2,2-テトラフェニルエタン、1-ヒドロキシ-2-t-ブチルジメチルシロキシ-1,1, 2,2-テトラフェニルエタンが挙げられる。
 これらの中で、本発明においては、1-ヒドロキシ-2-トリメチルシロキシ-1,1,2,2-テトラフェニルエタン、1-ヒドロキシ-2-トリエチルシロキシ-1,1, 2,2-テトラフェニルエタン又は1-ヒドロキシ-2-t-ブチルジメチルシロキシ-1,1, 2,2-テトラフェニルエタンがより好ましく、式(2)で表される1-ヒドロキシ-2-トリメチルシロキシ-1,1,2,2-テトラフェニルエタンが更に好ましい。
 本発明の一般式(1)で表されるテトラフェニルエタン誘導体は一般式(3)で表されるベンゾピナコールを各種シリル化剤によりシリル化した構造を特徴としている。
Preferred compounds in the tetraphenylethane derivative represented by the general formula (1) include 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane or 1, 2-bis {di or tri (C1-C4 alkyl) siloxy} -1,1,2,2-tetraphenylethane can be mentioned, such as 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy- 1,1,2,2-tetraphenylethane is more preferable, and 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane is more preferable.
In di- or tri- (C1-C4 alkyl) siloxy in the above tetraphenylethane, 2 or 3 alkyl groups on the silyl group may be the same or different. For example, tri (C1-C4 alkyl) siloxy includes trimethylsiloxy, triethylsiloxy, t-butyldimethylsiloxy and the like.
Specific examples of preferable tetraphenylethane derivatives include 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane and 1,2-bis (triethylsiloxy)- 1,1,2,2-tetraphenylethane, 1,2-bis (t-butyldimethylsiloxy) -1,1,2,2-tetraphenylethane, 1-hydroxy-2-trimethylsiloxy-1,1, 2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetra Phenylethane. Preferably 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2- t-Butyldimethylsiloxy-1,1,2,2-tetraphenylethane.
Among these, in the present invention, 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenyl More preferred is ethane or 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetraphenylethane, and 1-hydroxy-2-trimethylsiloxy-1,1, represented by the formula (2) 2,2-tetraphenylethane is more preferred.
The tetraphenylethane derivative represented by the general formula (1) of the present invention is characterized by a structure in which the benzopinacol represented by the general formula (3) is silylated with various silylating agents.
 本発明の一般式(1)で表されるテトラフェニルエタン誘導体は一般式(3)で表されるベンゾピナコールと各種シリル化剤をピリジンなどの塩基性触媒下に加熱させる方法により合成して得ることができる。
 シリル化剤としては、ジC1~C4アルキルシリル化又はトリC1~C4アルキルシリル化、フェニルジC1~C4アルキルシリル化できるものであれば何れでも良く、トリ(C1~C4アルキル)シリル化剤が好ましい。好ましいものとしては、一般に知られているトリメチルシリル化剤であるトリメチルクロロシラン(TMCS)、ヘキサメチルジシラザン(HMDS)、N,O-ビス(トリメチルシリル)トリフルオロアセトアミド(BSTFA)やトリエチルシリル化剤としてトリエチルクロロシラン(TECS)、t-ブチルジメチルシリル化剤としてt-ブチルジメチルシラン(TBMS)などが挙げられる。
 これらの試薬はシリコン誘導体メーカー等の市場から容易に入手することが出来る。シリル化剤の反応量(シリル化当量)としては式(3)で表されるベンゾピナコールの水酸基1当量に対して1.0~5.0倍当量が好ましい。さらに好ましくは1.5~3.0倍当量である。少な過ぎると反応効率が悪く、反応時間が長くなるため熱分解を促進してしまう。また、多過ぎると回収の際に分離が悪くなったり、精製が困難になってしまう。
The tetraphenylethane derivative represented by the general formula (1) of the present invention is obtained by synthesizing by a method in which the benzopinacol represented by the general formula (3) and various silylating agents are heated under a basic catalyst such as pyridine. be able to.
The silylating agent may be any as long as it can be di-C1-C4 alkylsilylated, tri-C1-C4 alkylsilylated or phenyldi-C1-C4 alkylsilylated, and a tri (C1-C4 alkyl) silylating agent is preferred. . Preferable examples include trimethylchlorosilane (TMCS), hexamethyldisilazane (HMDS), N, O-bis (trimethylsilyl) trifluoroacetamide (BSTFA), which are generally known trimethylsilylating agents, and triethylsilylating agent. Examples of chlorosilane (TECS) and t-butyldimethylsilylating agent include t-butyldimethylsilane (TBMS).
These reagents can be easily obtained from markets such as silicon derivative manufacturers. The reaction amount (silylation equivalent) of the silylating agent is preferably 1.0 to 5.0 times equivalent to 1 equivalent of hydroxyl group of benzopinacol represented by the formula (3). More preferably, it is 1.5 to 3.0 times equivalent. If the amount is too small, the reaction efficiency is poor, and the reaction time becomes long, so that thermal decomposition is promoted. On the other hand, when the amount is too large, the separation becomes worse during the recovery or the purification becomes difficult.
 塩基性触媒としてはピリジン、トリエチルアミンなどが挙げられる。塩基性触媒は反応時に発生する塩化水素をトラップし、反応系を塩基性下に保ったり、水酸基の水素原子を引き抜き、より反応を促進させる効果がある。使用量としては対象化合物の水酸基1当量に対して、塩基性基の当量で、0.5倍当量以上あればよく、溶媒として用いてもよい。通常は、対象化合物の水酸基1当量に対して塩基性触媒の塩基性基の当量で、1~5倍当量である。
 溶媒としてはヘキサン、エーテル、トルエンなどの非極性有機溶媒は反応に関与しないため優れている。またピリジン、ジメチルホルムアルデヒド(DMF)、ジメチルスルホキシド(DMSO)、テトラヒドロフラン(THF)及びアセトニトリルなどの極性溶媒も好ましい。使用量としては溶質の重量濃度が5~40質量%になる程度が好ましい。さらに好ましくは10~30質量%が好ましい。少な過ぎると反応が遅く、熱による分解が促進され収率が落ちてしまう。また、多過ぎると副生成物が多くなり、収率が落ちてしまう。
 反応温度は、シリル基を一般式(3)のベンゾピナコールの水酸基の一つに導入する場合、80℃以下が好ましく、反応時間は2.5時間以内、好ましくは2時間以内が好ましい。ベンゾピナコール誘導体、例えば一般式(3)のベンゾピナコール又は生成した目的化合物は加熱により熱分解を起こすため低温で反応させるのが好ましいが三級アルコールのため反応性に乏しいことから80℃以下で短時間に反応させることにより高収率で目的物が得られる。反応効率なども考慮すると、50~80℃程度が好ましい。反応時間は30分~2.5時間程度であり、好ましくは30分~2時間程度である。
 シリル基を一般式(3)のベンゾピナコールの水酸基の両方に導入する場合は、より高温、例えば75~100℃程度の温度が好ましいが、収率は低下すると考えられる。
Examples of the basic catalyst include pyridine and triethylamine. The basic catalyst has an effect of trapping hydrogen chloride generated during the reaction and keeping the reaction system basic, or drawing out a hydrogen atom of a hydroxyl group to further promote the reaction. The amount used may be 0.5 equivalents or more of the basic group equivalent to 1 equivalent of the hydroxyl group of the target compound, and may be used as a solvent. Usually, the equivalent amount of the basic group of the basic catalyst is 1 to 5 times equivalent to 1 equivalent of the hydroxyl group of the target compound.
As the solvent, nonpolar organic solvents such as hexane, ether and toluene are excellent because they do not participate in the reaction. Also preferred are polar solvents such as pyridine, dimethylformaldehyde (DMF), dimethyl sulfoxide (DMSO), tetrahydrofuran (THF) and acetonitrile. The amount used is preferably such that the weight concentration of the solute is 5 to 40% by mass. More preferably, it is 10 to 30% by mass. If the amount is too small, the reaction is slow, decomposition by heat is accelerated, and the yield is lowered. Moreover, when there are too many, a by-product will increase and a yield will fall.
When the silyl group is introduced into one of the hydroxyl groups of benzopinacol of the general formula (3), the reaction temperature is preferably 80 ° C. or less, and the reaction time is within 2.5 hours, preferably within 2 hours. The benzopinacol derivative, for example, the benzopinacol of the general formula (3) or the produced target compound is preferably reacted at a low temperature because it causes thermal decomposition by heating. By reacting with time, the target product is obtained in high yield. Considering reaction efficiency, etc., about 50 to 80 ° C. is preferable. The reaction time is about 30 minutes to 2.5 hours, preferably about 30 minutes to 2 hours.
When the silyl group is introduced into both of the hydroxyl groups of the benzopinacol of the general formula (3), a higher temperature, for example, a temperature of about 75 to 100 ° C. is preferable, but the yield is considered to decrease.
 本発明の一般式(1)で表されるテトラフェニルエタン誘導体はラジカル発生剤として使用できる。具体的には、熱ラジカル発生剤や光ラジカル発生剤として種々の分野で使用でき、本発明において特に熱ラジカル発生剤として用いるのが好ましい。
 本発明の熱ラジカル発生剤は他の光ラジカル発生剤では達成困難な用途にも用いることができる。例えば、光の当たらない部分の硬化や強いエネルギーを照射すると問題のある部分の硬化に使用することが出来る。具体的には、精密機器の封止剤における熱ラジカル発生剤として、分解の懸念される低分子物質の共存するエリアの硬化のための熱ラジカル発生剤として、更には、熱反応による有機合成などのための熱ラジカル発生剤として使用出来る。更に、本発明の熱ラジカル発生剤はラジカル発生時に発泡を伴わず、少量でも硬化速度を損なわないため硬化物の形態の保持や物性の向上が期待できる。本発明における、上記一般式(1)のテトラフェニルエタン誘導体のラジカル発生剤としての使用量は硬化対象の重合モノマー等の種類や使用分野によって異なってよく、添加量は適宜選択して差し支えない。
 本発明の熱ラジカル発生剤の好ましい使用分野の1つは、ラジカル硬化性樹脂組成物における熱ラジカル発生剤としての使用である。この場合における、該組成物の総量に対する本発明の熱ラジカル発生剤(一般式(1)のテトラフェニルエタン誘導体)の含量は、特に限定されないが、通常0.1~10質量%程度である。残部はラジカル重合性樹脂及び必要に応じて含んでも良い添加物である。該樹脂組成物を熱硬化することにより、該樹脂組成物の硬化物を得ることが出来、該硬化物は、発泡による濁りが生じないことから透明性が良く、かつ接着性、耐湿接着性などに優れる。なお、ラジカル硬化性樹脂としては、エポキシ樹脂又は(メタ)アクリル樹脂などが挙げられる。特に、有用なラジカル硬化性樹脂組成物の1つとして、熱硬化性シール剤を挙げることが出来、その中でも、液晶滴下工法用熱硬化性液晶シール剤が最適である。
The tetraphenylethane derivative represented by the general formula (1) of the present invention can be used as a radical generator. Specifically, it can be used in various fields as a thermal radical generator or a photo radical generator, and is particularly preferably used as a thermal radical generator in the present invention.
The thermal radical generator of the present invention can be used for applications that are difficult to achieve with other photoradical generators. For example, it can be used for curing a portion that is not exposed to light or curing a portion having a problem when irradiated with strong energy. Specifically, as thermal radical generators in sealants for precision equipment, as thermal radical generators for curing areas where low-molecular substances that are subject to decomposition may coexist, and for organic synthesis by thermal reaction, etc. It can be used as a thermal radical generator for Furthermore, since the thermal radical generator of the present invention does not cause foaming when radicals are generated and does not impair the curing rate even with a small amount, it can be expected to maintain the form of the cured product and improve physical properties. In the present invention, the amount of the tetraphenylethane derivative of the general formula (1) used as a radical generator may vary depending on the type of polymerization monomer to be cured and the field of use, and the amount added may be appropriately selected.
One of the preferred fields of use of the thermal radical generator of the present invention is the use as a thermal radical generator in a radical curable resin composition. In this case, the content of the thermal radical generator of the present invention (tetraphenylethane derivative of the general formula (1)) with respect to the total amount of the composition is not particularly limited, but is usually about 0.1 to 10% by mass. The balance is a radically polymerizable resin and additives that may be included as necessary. A cured product of the resin composition can be obtained by thermosetting the resin composition, and the cured product has good transparency because it does not cause turbidity due to foaming, and has adhesiveness, moisture-resistant adhesion, etc. Excellent. In addition, as a radical curable resin, an epoxy resin or a (meth) acrylic resin is mentioned. In particular, as one of useful radical curable resin compositions, a thermosetting sealant can be exemplified, and among them, a thermosetting liquid crystal sealant for a liquid crystal dropping method is optimal.
 本発明の液晶滴下工法用熱硬化性液晶シール剤は、(a)前記一般式(1)で表されるテトラフェニルエタン誘導体、(b)エポキシ樹脂、及び/又は、エポキシ樹脂の(メタ)アクリル酸付加物、(c)熱硬化剤、および(d)無機充填剤を必須成分として含有する。 The thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention comprises (a) a tetraphenylethane derivative represented by the general formula (1), (b) an epoxy resin, and / or a (meth) acrylic epoxy resin. An acid adduct, (c) a thermosetting agent, and (d) an inorganic filler are contained as essential components.
 本発明の液晶滴下工法用熱硬化性液晶シール剤は、硬化性を向上させるために(a)一般式(1)で表されるテトラフェニルエタン誘導体を熱ラジカル発生剤として含有する。以下一般式(1)で表されるテトラフェニルエタン誘導体を簡略化のため、(a)成分又は熱ラジカル発生剤(a)とも記載する。
 一般に熱ラジカル発生剤とは、加熱によりラジカルを解離発生する化合物を指し、例えば、アゾ化合物、有機過酸化物、ベンゾイン類、ベンゾインエーテル類、アセトフェノン類、ベンゾピナコール類等が挙げられる。しかし、アゾ化合物や有機過酸化物は加熱によりラジカル発生する際に同時に窒素や二酸化炭素などが発生し、発泡する。そのため硬化物中に気泡が含まれ、それが硬化物性、接着強度を低下させる原因となる。またベンゾイン誘導体、ベンゾピナコールなどは加熱時に発泡することはないが、液晶パネル製造時に用いられる、シール剤の熱硬化温度90~130℃程度の温度においては十分に熱開裂が起こらず所望の硬化度が得られない問題があった。
The thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention contains (a) a tetraphenylethane derivative represented by the general formula (1) as a thermal radical generator in order to improve curability. Hereinafter, the tetraphenylethane derivative represented by the general formula (1) is also referred to as a component (a) or a thermal radical generator (a) for simplification.
In general, a thermal radical generator refers to a compound that dissociates and generates radicals upon heating, and examples thereof include azo compounds, organic peroxides, benzoins, benzoin ethers, acetophenones, and benzopinacols. However, azo compounds and organic peroxides foam when nitrogen and carbon dioxide are generated at the same time when radicals are generated by heating. Therefore, bubbles are included in the cured product, which causes a decrease in cured property and adhesive strength. In addition, benzoin derivatives and benzopinacol do not foam when heated, but the desired curing degree does not occur at the thermal curing temperature of 90 to 130 ° C of the sealant, which is used when manufacturing liquid crystal panels. There was a problem that could not be obtained.
 そこで、本発明者らは種々検討の結果、ベンゾピナコールに化学修飾することでより高活性で液晶汚染の少ない熱ラジカル発生剤が得られることを見出した。そして、合成法の容易さからピナコールの水酸基の少なくとも一つがエーテル結合となったベンゾピナコール誘導体がより好ましいことを見出した。エーテル結合としては、例えばメチルエーテル、エチルエーテル、プロピルエーテル、イソプロピルエーテル、ブチルエーテル、フェニルエーテル基、シリルエーテル基等が挙げられる。これらの中で、活性などの点からフェニルエーテル基又はシリルエーテル基が好ましく、前記一般式(1)で表されるテトラフェニルエタン誘導体がより好ましい。 Therefore, as a result of various studies, the present inventors have found that a thermal radical generator with higher activity and less liquid crystal contamination can be obtained by chemical modification to benzopinacol. And it discovered that the benzopinacol derivative in which at least one of the hydroxyl group of pinacol became an ether bond from the ease of a synthesis method was more preferable. Examples of the ether bond include methyl ether, ethyl ether, propyl ether, isopropyl ether, butyl ether, phenyl ether group, silyl ether group, and the like. Among these, a phenyl ether group or a silyl ether group is preferable from the viewpoint of activity and the like, and a tetraphenylethane derivative represented by the general formula (1) is more preferable.
 本発明に用いられる好ましい一般式(1)で表されるテトラフェニルエタン誘導体(a)としては、1-ヒドロキシ-2-ジ又はトリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタン又は1, 2-ビス{ジ又はトリ(C1~C4アルキル)シロキシ}-1,1, 2,2-テトラフェニルエタンを挙げることができ、1-ヒドロキシ-2-ジ又はトリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタンがより好ましく、更に好ましくは、1-ヒドロキシ-2-トリ(C1~C4アルキル)シロキシ-1,1, 2,2-テトラフェニルエタンである。具体的な化合物例は前記した通りである。 Preferred tetraphenylethane derivatives (a) represented by the general formula (1) used in the present invention include 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy-1,1, 2,2- Mention may be made of tetraphenylethane or 1, 2-bis {di or tri (C1-C4 alkyl) siloxy} -1,1, 2,2-tetraphenylethane, such as 1-hydroxy-2-di or tri (C1 -C4 alkyl) siloxy-1,1, 2,2-tetraphenylethane is more preferable, and 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1, 2,2-tetraphenyl is more preferable. It is ethane. Specific compound examples are as described above.
 該熱ラジカル発生剤(a)(一般式(1)で表されるテトラフェニルエタン誘導体(a))は、粒径を細かくして均一に分散することが好ましい。その平均粒径は、大きすぎると狭ギャップの液晶セル製造時に上下ガラス基板を貼り合わせる時のギャップ形成がうまくできない等の不良要因となるため、5μm以下が好ましく、より好ましくは3μm以下である。また、(a)成分の粒径は際限なく細かくしても差し支えないが、通常その下限は平均粒径として0.1μm程度である。 It is preferable that the thermal radical generator (a) (tetraphenylethane derivative (a) represented by the general formula (1)) is finely dispersed and uniformly dispersed. The average particle diameter is preferably 5 μm or less, and more preferably 3 μm or less, because if the average particle size is too large, it becomes a cause of defects such as poor gap formation when the upper and lower glass substrates are bonded together during the production of a narrow gap liquid crystal cell. Further, the particle size of the component (a) can be made infinitely fine, but the lower limit is usually about 0.1 μm as the average particle size.
 本発明の液晶シール剤中における(a)熱ラジカル発生剤の含有量は該液晶シール剤の総量に対して、通常0.1~10質量%、好ましくは0.3~7質量%であり、さらに好ましくは0.5~5質量%である。含有量が少な過ぎると硬化性が悪くなりシールパンクが発生し、含有量が多すぎると液晶汚染性が強くなる傾向にある。
 本発明において、本発明の効果が達成される限り、上記(a)成分以外のラジカル発生剤を併用しても良いが、通常、ラジカル発生剤として、上記(a)成分を単独で使用するのが好ましい。
The content of (a) the thermal radical generator in the liquid crystal sealing agent of the present invention is usually 0.1 to 10% by mass, preferably 0.3 to 7% by mass, based on the total amount of the liquid crystal sealing agent. More preferably, it is 0.5 to 5% by mass. When the content is too small, the curability is deteriorated and seal puncture occurs, and when the content is too large, the liquid crystal contamination tends to be strong.
In the present invention, as long as the effect of the present invention is achieved, a radical generator other than the component (a) may be used in combination, but usually the component (a) is used alone as a radical generator. Is preferred.
 本発明の液晶滴下工法用熱硬化性液晶シール剤に含有される、エポキシ樹脂及び/又はエポキシ樹脂の(メタ)アクリル酸付加物(b)は硬化性樹脂として用いる。ここで「(メタ)アクリル」とは「アクリル」及び/又は「メタクリル」を意味する。エポキシ樹脂及び/又はエポキシ樹脂の(メタ)アクリル酸付加物(b)は、いずれも液晶に対する汚染性、溶解性が低く、樹脂粘度が低いものが好ましい。 The epoxy resin and / or (meth) acrylic acid adduct (b) of epoxy resin contained in the thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention is used as a curable resin. Here, “(meth) acryl” means “acryl” and / or “methacryl”. The epoxy resin and / or the (meth) acrylic acid adduct (b) of the epoxy resin are preferably low in contamination and solubility in the liquid crystal and low in resin viscosity.
 該エポキシ樹脂として好ましくは、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、エチレンオキサイド付加ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、レゾルシンジグリシジルエーテル、脂環式エポキシ樹脂、脂肪族鎖状エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ樹脂、その他の二官能フェノール類のジグリシジルエーテル化物、その他の二官能アルコール類のジグリシジルエーテル化物等が挙げられる。これらのエポキシ樹脂は単独で用いても2種以上混合して用いても良い。これらのうち液晶汚染性及び粘度の観点から、より好ましいものはビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、エチレンオキサイド付加ビスフェノールS型エポキシ樹脂、レゾルシンジグリシジルエーテルであり、中でもレゾルシンジグリシジルエーテルが好ましい。 The epoxy resin is preferably bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, ethylene oxide-added bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A, for example. Novolac type epoxy resin, bisphenol F novolac type epoxy resin, resorcin diglycidyl ether, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, isocyanurate type Epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, phenol novolac type with triphenolmethane skeleton Epoxy resins, diglycidyl ethers of other bifunctional phenols, diglycidyl etherified products such as other difunctional alcohols. These epoxy resins may be used alone or in combination of two or more. Of these, bisphenol A type epoxy resin, bisphenol F type epoxy resin, ethylene oxide-added bisphenol S type epoxy resin, and resorcin diglycidyl ether are more preferable from the viewpoint of liquid crystal contamination and viscosity. preferable.
 該エポキシ樹脂の(メタ)アクリル酸付加物{以下便宜上「(メタ)アクリル化エポキシ樹脂」ともいう)は、エポキシ樹脂と(メタ)アクリル酸の反応により得られる化合物であり、エポキシ樹脂のエポキシ基の全てに(メタ)アクリル酸を付加した化合物又はエポキシ樹脂のエポキシ基に当量未満の(メタ)アクリル酸を反応させ、意図的にエポキシ基を残した化合物(以下部分(メタ)アクリル化エポキシ樹脂ともいう)の何れであってもよい。
 (メタ)アクリル化エポキシ樹脂としては二官能以上の(メタ)アクリロイル基をもつ化合物が好ましい。また、部分(メタ)アクリル化エポキシ樹脂におけるエポキシ基と(メタ)アクリロイル基との比率は限定されるものではなく、工程適合性および液晶汚染性の観点から適切に選択される。
 本発明においては、通常、エポキシ樹脂に含まれる全エポキシ基に対して、50~100%、好ましくは70~100%、より好ましくは80~100%の割合で、(メタ)アクリル酸を付加した(メタ)アクリル化エポキシ樹脂が好ましい。通常、(メタ)アクリル酸の中では、安価である点等から、アクリル酸が使用されることが多い。そのため、エポキシ樹脂のエポキシ基にアクリル酸を付加した化合物を用いるのが好ましい。
The (meth) acrylic acid adduct of the epoxy resin (hereinafter also referred to as “(meth) acrylated epoxy resin” for convenience) is a compound obtained by the reaction of an epoxy resin and (meth) acrylic acid, and the epoxy group of the epoxy resin. A compound in which (meth) acrylic acid is added to all or an epoxy group of an epoxy resin is reacted with less than an equivalent amount of (meth) acrylic acid to leave an epoxy group intentionally (hereinafter referred to as partial (meth) acrylated epoxy resin Or any of them).
As the (meth) acrylated epoxy resin, a compound having a bifunctional or higher (meth) acryloyl group is preferable. Further, the ratio of the epoxy group to the (meth) acryloyl group in the partially (meth) acrylated epoxy resin is not limited, and is appropriately selected from the viewpoint of process compatibility and liquid crystal contamination.
In the present invention, (meth) acrylic acid is usually added at a ratio of 50 to 100%, preferably 70 to 100%, more preferably 80 to 100% with respect to all epoxy groups contained in the epoxy resin. A (meth) acrylated epoxy resin is preferred. Usually, (meth) acrylic acid is often used because of its low cost. Therefore, it is preferable to use a compound in which acrylic acid is added to the epoxy group of the epoxy resin.
 該(メタ)アクリル化エポキシ樹脂の原料となるエポキシ樹脂としては特に限定されるものではないが、二官能以上のエポキシ樹脂が好ましい。
 例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、エチレンオキサイド付加ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、レゾルシンジグリシジルエーテル、脂環式エポキシ樹脂、脂肪族鎖状エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ樹脂、その他の二官能フェノール類のジグリシジルエーテル化物、その他の二官能アルコール類のジグリシジルエーテル化物等が挙げられる。
 好ましくはビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂又はレゾルシンジグリシジルエーテルであり、中でもレゾルシンジグリシジルエーテルが好ましい。
 従って、(メタ)アクリル化エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂及びレゾルシンジグリシジルエーテルからなる群から選ばれる少なくとも一種と(メタ)アクリル酸との反応で得られる(メタ)アクリル化エポキシ樹脂が好ましく、レゾルシンジグリシジルエーテルと(メタ)アクリル酸との反応で得られる(メタ)アクリル化エポキシ樹脂が更に好ましい。
 (メタ)アクリル化エポキシ樹脂としては、硬化性の観点からエポキシ樹脂とアクリル酸の反応により得られるアクリル化エポキシ樹脂が好ましい。さらに好ましくは、ビスフェノールA型エポキシ樹脂のアクリル酸付加物、ビスフェノールF型エポキシ樹脂のアクリル酸付加物及びレゾルシンジグリシジルエーテルのアクリル酸付加物からなる群から選ばれる少なくとも一種である。
 上記した(メタ)アクリル化エポキシ樹脂は単独で用いても2種以上混合して用いても良い。
 好ましい態様においては上記好ましい(メタ)アクリル化エポキシ樹脂が、前記液晶シール剤中における(メタ)アクリル化エポキシ樹脂の全量を占める場合である。
Although it does not specifically limit as an epoxy resin used as a raw material of this (meth) acrylated epoxy resin, The epoxy resin more than bifunctional is preferable.
For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, ethylene oxide addition bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F Novolac type epoxy resin, resorcin diglycidyl ether, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type epoxy resin, isocyanurate type epoxy resin, dicyclopentadiene type Epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin having triphenolmethane skeleton, other bifunctional phenols Diglycidyl ethers of Le ethers, diglycidyl etherified products such as other difunctional alcohols.
Bisphenol A type epoxy resin, bisphenol F type epoxy resin or resorcin diglycidyl ether is preferable, and resorcin diglycidyl ether is particularly preferable.
Accordingly, the (meth) acrylated epoxy resin can be obtained by the reaction of at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and resorcin diglycidyl ether with (meth) acrylic acid (meta). ) An acrylated epoxy resin is preferred, and a (meth) acrylated epoxy resin obtained by reaction of resorcin diglycidyl ether and (meth) acrylic acid is more preferred.
As the (meth) acrylated epoxy resin, an acrylated epoxy resin obtained by a reaction between the epoxy resin and acrylic acid is preferable from the viewpoint of curability. More preferably, it is at least one selected from the group consisting of an acrylic acid adduct of bisphenol A type epoxy resin, an acrylic acid adduct of bisphenol F type epoxy resin, and an acrylic acid adduct of resorcin diglycidyl ether.
The above (meth) acrylated epoxy resins may be used alone or in combination of two or more.
In a preferred embodiment, the preferred (meth) acrylated epoxy resin occupies the entire amount of the (meth) acrylated epoxy resin in the liquid crystal sealant.
 本発明の液晶シール剤中におけるエポキシ樹脂及び/又は(メタ)アクリル化エポキシ樹脂(b)(以下単に硬化性樹脂(b)ともいう)の含有量は、液晶シール剤の総量に対して、通常30~75質量%、好ましくは40~65質量%である。含有量が少なすぎると熱硬化時の反応が遅くなり、液晶滴下工法で液晶セル作成時にシール剤の堰が液晶の熱膨張とシール剤の加熱低粘度化によりシールパンクしてしまう。含有量が多すぎると、十分な接着強度が得られない。
 硬化性樹脂(b)として、エポキシ樹脂と(メタ)アクリル化エポキシ樹脂の両者を併用する態様は、本発明のシール剤における好ましい態様の一つである。
 また、特にエポキシ樹脂と(メタ)アクリル化エポキシ樹脂を併用する場合において、硬化性樹脂(b)中のエポキシ樹脂の含有量は、硬化性樹脂(b)の総量に対して、通常、3~40質量%、好ましくは3~30質量%、より好ましくは5~30質量%程度、更に好ましくは8~30質量%である。また、場合により、5~20質量%も好ましく、8~15質量%が更に好ましい場合もある。残部は(メタ)アクリル化エポキシ樹脂である。具体的に記載すると、(メタ)アクリル化エポキシの含量は、硬化性樹脂(b)の総量に対して、60~97質量%、好ましくは70~95質量%、更に好ましくは70~92質量%である。エポキシ樹脂含有量が少な過ぎると接着強度が弱くなり、エポキシ樹脂含有量が多すぎると硬化が遅くなりシールパンクが発生しやすくなる恐れがある。
The content of the epoxy resin and / or (meth) acrylated epoxy resin (b) (hereinafter also simply referred to as curable resin (b)) in the liquid crystal sealant of the present invention is usually relative to the total amount of the liquid crystal sealant. 30 to 75% by mass, preferably 40 to 65% by mass. If the content is too small, the reaction at the time of thermosetting becomes slow, and the weir of the sealing agent becomes sealed due to thermal expansion of the liquid crystal and the lowering of the viscosity of the sealing agent when a liquid crystal cell is produced by the liquid crystal dropping method. If the content is too large, sufficient adhesive strength cannot be obtained.
An embodiment in which both an epoxy resin and a (meth) acrylated epoxy resin are used in combination as the curable resin (b) is one of the preferred embodiments in the sealing agent of the present invention.
In particular, when the epoxy resin and the (meth) acrylated epoxy resin are used in combination, the content of the epoxy resin in the curable resin (b) is usually 3 to 3% relative to the total amount of the curable resin (b). It is 40% by mass, preferably 3 to 30% by mass, more preferably about 5 to 30% by mass, and still more preferably 8 to 30% by mass. In some cases, 5 to 20% by mass is preferable, and 8 to 15% by mass may be more preferable. The balance is (meth) acrylated epoxy resin. Specifically, the content of the (meth) acrylated epoxy is 60 to 97% by mass, preferably 70 to 95% by mass, more preferably 70 to 92% by mass, based on the total amount of the curable resin (b). It is. If the epoxy resin content is too low, the adhesive strength is weakened, and if the epoxy resin content is too high, curing may be delayed and seal puncture may occur easily.
 本発明の液晶滴下工法用熱硬化性液晶シール剤は熱硬化剤(c)を含有する。熱硬化剤(c)としては、従来使用されている熱硬化剤が何れも使用出来るが、本発明においては潜在性を有する熱硬化剤(以下潜在性硬化剤ともいう)が好ましい。潜在性硬化剤とは常温固体の融点又は軟化点が100℃以上の化合物で、室温では樹脂成分と反応せず、硬化剤としての作用を示さないが、100℃以上の加熱、通常100~150℃程度、好ましくは110~130℃程度により徐々に溶解又は融解することにより樹脂成分と反応し、硬化剤としての作用を示すものをいう。
 なお、本発明における融点又は軟化点は、示差走査熱量計(DSC)を用いた熱分析により測定した。具体的には、示差走査熱量計(EXSTAR6000 セイコーインスツル株式会社製)を使用し、昇温5℃/分で測定した。
 上記潜在性硬化剤としてはポリヒドラジド化合物、ポリアミン化合物、イミダゾール誘導体、尿素誘導体などが挙げられる。好ましくはポリヒドラジド化合物であり、分子中に2個以上のヒドラジド基を有する化合物である。ジ~テトラヒドラジド化合物が好ましく、より好ましくはジ又はトリヒドラジド化合物である。
 ポリヒドラジド化合物としては、例えば、シュウ酸ジヒドラジド、マロン酸ジヒドラジド、コハク酸ジヒドラジド、アジピン酸ジヒドラジド、ピメリン酸ジヒドラジド、スベリン酸ジヒドラジド、アゼライン酸ジヒドラジド、セバシン酸ジヒドラジド、ドデカンジオジヒドラジド、ヘキサデカンジオヒドラジド、マレイン酸ジヒドラジド、フマル酸ジヒドラジド、ジグリコール酸ジヒドラジド、酒石酸ジヒドラジド、リンゴ酸ジヒドラジド、イソフタル酸ジヒドラジド、テレフタル酸ジヒドラジド、2,6-ナフトエ酸ジヒドラジド、4,4-ビスベンゼンジヒドラジド、1,4-ナフトエ酸ジヒドラジド、2,6-ピリジンジヒドラジド、1,2,4-ベンゼントリヒドラジド、ピロメリット酸テトラヒドラジド、1,4,5,8-ナフトエ酸テトラヒドラジド;1,3-ビス(ヒドラジノカルボノエチル)-5-イソプロピルヒダントイン等のヒダントイン骨格、好ましくはバリンヒダントイン骨格(ヒダントイン環の炭素原子がイソプロピル基で置換された骨格)を有するヒドラジド化合物;トリス(1-ヒドラジノカルボニルメチル)イソシアネヌレート、トリス(2-ヒドラジノカルボニルエチル)イソシアヌレート、トリス(3-ヒドラジノカルボニルプロピル)イソシアヌレート、ビス(2-ヒドラジノカルボニルエチル)イソシアヌレート等のビス又はトリス(ヒドラジノカルボニルC1~C3アルキル)イソシアヌレートが挙げられ、これらを単独で用いても2種以上混合して用いても良い。ビス又はトリス(ヒドラジノカルボニルC1~C3アルキル)イソシアヌレートはジ又はトリヒドラジド化合物として好ましいものの1つである。
The thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention contains a thermosetting agent (c). Any thermosetting agent conventionally used can be used as the thermosetting agent (c), but in the present invention, a latent thermosetting agent (hereinafter also referred to as a latent curing agent) is preferable. A latent curing agent is a compound having a melting point or softening point of a solid at room temperature of 100 ° C. or higher, does not react with a resin component at room temperature, and does not act as a curing agent, but is heated at 100 ° C. or higher, usually 100 to 150. A substance that reacts with a resin component by being gradually dissolved or melted at about 110 ° C., preferably about 110 to 130 ° C., and exhibits a function as a curing agent.
The melting point or softening point in the present invention was measured by thermal analysis using a differential scanning calorimeter (DSC). Specifically, a differential scanning calorimeter (EXSTAR6000 manufactured by Seiko Instruments Inc.) was used, and measurement was performed at a temperature increase of 5 ° C./min.
Examples of the latent curing agent include polyhydrazide compounds, polyamine compounds, imidazole derivatives, urea derivatives, and the like. A polyhydrazide compound is preferred, and a compound having two or more hydrazide groups in the molecule. Di-tetrahydrazide compounds are preferred, and di- or trihydrazide compounds are more preferred.
Examples of the polyhydrazide compound include oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecandiodihydrazodihydride, Dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4-bisbenzenedihydrazide, 1,4-naphthoic acid dihydrazide, 2,6-pyridinedihydrazide, 1,2,4-benzenetrihydrazide, pyromellitic acid tetrahydrazide, 1,4,5,8-naphtho Acid tetrahydrazide; a hydrazide compound having a hydantoin skeleton such as 1,3-bis (hydrazinocarbonoethyl) -5-isopropylhydantoin, preferably a valine hydantoin skeleton (a skeleton in which the carbon atom of the hydantoin ring is substituted with an isopropyl group) Tris (1-hydrazinocarbonylmethyl) isocyanurate, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, bis (2-hydrazinocarbonylethyl) isocyanurate, etc. Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate, and these may be used alone or in combination of two or more. Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate is one of the preferred di- or trihydrazide compounds.
 これらのポリヒドラジド化合物のうち好ましくは、ジ又はトリカルボン酸のジ又はトリヒドラジドであり、より具体的には、カルボン酸の炭素を除いて、C4~C8脂肪族又は芳香族ジカルボン酸のジヒドラジド、又は、ビス又はトリス(ヒドラジノカルボニルC1~C3アルキル)イソシアヌレート等が挙げられる。より好ましくは、C4~C8アルキレンジカルボン酸のジヒドラジド、フタル酸ジヒドラジド、トリス(ヒドラジノカルボニルC1~C3アルキル)イソシアヌレートからなる群から選択される少なくとも1つである。
 好ましいポリヒドラジドとして、具体的には、アジピン酸ジヒドラジド、セバシン酸ジヒドラジド、イソフタル酸ジヒドラジド、1,3-ビス(ヒドラジノカルボノエチル)-5-イソプロピルヒダントイン、トリス(1-ヒドラジノカルボニルメチル)イソシアヌレート、トリス(2-ヒドラジノカルボニルエチル)イソシアヌレート、トリス(3-ヒドラジノカルボニルプロピル)イソシアヌレート、ビス(2-ヒドラジノカルボニルエチル)イソシアヌレートが挙げられる。
 より好ましくはアジピン酸ジヒドラジド、セバシン酸ジヒドラジド、イソフタル酸ジヒドラジド、トリス(2-ヒドラジノカルボニルエチル)イソシアヌレートが挙げられる。
Among these polyhydrazide compounds, di- or trihydrazides of di- or tricarboxylic acids are preferred, and more specifically, C4 to C8 aliphatic or aromatic dicarboxylic dihydrazides, excluding carbon of carboxylic acid, or Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate and the like. More preferably, it is at least one selected from the group consisting of dihydrazide of C4 to C8 alkylene dicarboxylic acid, dihydrazide of phthalic acid, and tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate.
Specific examples of preferred polyhydrazides include adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide, 1,3-bis (hydrazinocarbonoethyl) -5-isopropylhydrantoin, and tris (1-hydrazinocarbonylmethyl) isocyanate. Examples thereof include nurate, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, and bis (2-hydrazinocarbonylethyl) isocyanurate.
More preferred are adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide, and tris (2-hydrazinocarbonylethyl) isocyanurate.
 該熱硬化剤(c)は、速硬化の潜在性硬化剤とするために粒径を細かくして均一に分散することが好ましい。その平均粒径は、大きすぎると狭ギャップの液晶セル製造時に上下ガラス基板を貼り合わせる時のギャップ形成がうまくできない等の不良要因となる。そのため該粒径は4μm以下が好ましく、より好ましくは3μm以下である。その粒径はレーザー回折・散乱式粒度分布測定器(乾式)(株式会社セイシン企業製:LMS-30)により測定した。なお、平均粒径は小さすぎると凝集を起こしやすくなるため、極端に小さく(例えば、0.1μm以下に)ならないように調製するのが好ましい。 The thermosetting agent (c) is preferably dispersed uniformly with a fine particle size in order to make it a rapid curing latent curing agent. If the average particle size is too large, it becomes a cause of defects such as inability to form a gap when the upper and lower glass substrates are bonded together when manufacturing a narrow gap liquid crystal cell. Therefore, the particle size is preferably 4 μm or less, more preferably 3 μm or less. The particle size was measured with a laser diffraction / scattering type particle size distribution analyzer (dry type) (manufactured by Seishin Enterprise Co., Ltd .: LMS-30). In addition, since it will become easy to raise | generate aggregation if an average particle diameter is too small, it is preferable to prepare so that it may not become extremely small (for example, 0.1 micrometer or less).
 本発明の液晶シール剤中、熱硬化剤(c)の含有量は、エポキシ樹脂及び/又は(メタ)アクリル化エポキシ樹脂である硬化性樹脂(b)100質量部に対して通常5質量部~60質量部程度であり、好ましくは10質量部~40質量部である。熱硬化剤(c)が5質量部より少ないと熱硬化反応が不十分となり、接着力、ガラス転移点が低くなる。一方、熱硬化剤(c)が60質量部より多いと硬化剤が残留して接着力が低下し、また、ポットライフも悪化する。 In the liquid crystal sealing agent of the present invention, the content of the thermosetting agent (c) is usually 5 parts by mass to 100 parts by mass of the curable resin (b) which is an epoxy resin and / or a (meth) acrylated epoxy resin. The amount is about 60 parts by mass, preferably 10 to 40 parts by mass. When there are few thermosetting agents (c) than 5 mass parts, thermosetting reaction will become inadequate and adhesive force and a glass transition point will become low. On the other hand, when there are more thermosetting agents (c) than 60 mass parts, a hardening | curing agent will remain, adhesive force will fall, and pot life will also deteriorate.
 本発明の液晶滴下工法用熱硬化性液晶シール剤は無機充填剤(d)を含有する。該無機充填剤(d)としては、アルミナ、シリカ(球状シリカ又はヒュームドシリカなど)、タルク、クレー、ベントナイト、有機ベントナイト、チタン酸バリウム、酸化チタン、酸化コバルト、酸化マグネシウム、酸化ニッケル、酸化ジルコニウム等の金属酸化物、炭酸カルシウム、炭酸マグネシウム等の炭酸塩、硫酸バリウム、硫酸カルシウム等の硫酸塩、水酸化アルミニウム、水酸化マグネシウム等の金属水酸化物、ケイ酸カルシウム、ケイ酸アルミニウム、ケイ酸ジルコニウム等のケイ酸塩等が挙げられる。これらを単独で用いても2種以上を混合して用いても良い。これらの無機充填剤のうち、特に好ましいのはアルミナ及び/又はシリカである。 The thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention contains an inorganic filler (d). Examples of the inorganic filler (d) include alumina, silica (such as spherical silica or fumed silica), talc, clay, bentonite, organic bentonite, barium titanate, titanium oxide, cobalt oxide, magnesium oxide, nickel oxide, and zirconium oxide. Metal oxides such as calcium carbonate and magnesium carbonate, sulfates such as barium sulfate and calcium sulfate, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, calcium silicate, aluminum silicate, silicic acid Examples thereof include silicates such as zirconium. These may be used alone or in combination of two or more. Of these inorganic fillers, alumina and / or silica are particularly preferable.
 該無機充填剤(d)の平均粒径は3μm以下が好ましい。
平均粒径が大きすぎると、液晶セル製造時の上下ガラス基板の貼り合わせ時のギャップ形成に支障が出る。無機充填剤(d)の平均粒径の下限は通常0.01μm程度である。
 本発明の液晶シール剤中における無機充填剤(d)の含有量は、通常1~30質量%、好ましくは2~20質量%、より好ましくは3~15質量%である。含有量が少なすぎる場合、ガラス基板に対する接着強度が低下してしまう。又、充填剤含有量が多すぎる場合、粘度が高すぎて塗布性が悪くなってしまう。
The average particle diameter of the inorganic filler (d) is preferably 3 μm or less.
If the average particle size is too large, it will hinder the gap formation when the upper and lower glass substrates are bonded together during the production of the liquid crystal cell. The lower limit of the average particle size of the inorganic filler (d) is usually about 0.01 μm.
The content of the inorganic filler (d) in the liquid crystal sealing agent of the present invention is usually 1 to 30% by mass, preferably 2 to 20% by mass, more preferably 3 to 15% by mass. When there is too little content, the adhesive strength with respect to a glass substrate will fall. Moreover, when there is too much filler content, a viscosity will be too high and applicability | paintability will worsen.
 本発明の液晶シール剤には熱硬化反応の硬化性を促進するために、硬化促進剤(e)を含有する。
 硬化促進剤(e)としては、加熱時の熱硬化反応促進性が高いこと、液晶に対する汚染性が低いこと、常温保管時に液晶シール剤のポットライフを悪化させないものであれば特に限定されない。
 例えば、イソシアヌル環骨格を有する多価カルボン酸や、エポキシ樹脂アミンアダクト物、イミダゾール誘導体、尿素誘導体などが挙げられる。これらは、単独で用いても2種以上を併用しても良い。好ましい硬化促進剤として尿素化合物硬化促進剤又はイソシアヌル環骨格含有多価カルボン酸硬化促進剤を挙げることが出来る。具体的には、脂肪族ジメチルウレア(商品名:UCAT3503N サンアプロ株式会社製)(シクロヘキサン環上にメチル基及び2個のジメチルウレア基が連続した位置に置換した化合物)、芳香族ジメチルウレア(商品名:UCAT3502T サンアプロ株式会社製)(トルエンの2及び3位に2個のジメチルウレア基が置換した化合物)、トリス(カルボキシC1-C3アルキル)イソシアヌレートが挙げられる。トリス(カルボキシC1-C3アルキル)イソシアヌレートとしては例えば、トリス(1-カルボキシメチル)イソシアヌレート、トリス(2-カルボキシエチル)イソシアヌレート、トリス(3-カルボキシプロピル)イソシアヌレート、ビス(2-カルボキシエチル)イソシアヌレートが挙げられる。中でもトリス(3-カルボキシプロピル)イソシアヌレートが好ましい。
The liquid crystal sealant of the present invention contains a curing accelerator (e) in order to accelerate the curability of the thermosetting reaction.
The curing accelerator (e) is not particularly limited as long as it has a high thermosetting reaction accelerating property during heating, low contamination to liquid crystals, and does not deteriorate the pot life of the liquid crystal sealant during normal temperature storage.
Examples thereof include polyvalent carboxylic acids having an isocyanuric ring skeleton, epoxy resin amine adducts, imidazole derivatives, urea derivatives, and the like. These may be used alone or in combination of two or more. Preferred examples of the curing accelerator include urea compound curing accelerators and isocyanuric ring skeleton-containing polycarboxylic acid curing accelerators. Specifically, aliphatic dimethylurea (trade name: UCAT3503N manufactured by Sun Apro Co., Ltd.) (a compound in which a methyl group and two dimethylurea groups are substituted on the cyclohexane ring), aromatic dimethylurea (trade name) : UCAT3502T manufactured by San Apro Co., Ltd. (a compound in which two dimethylurea groups are substituted at the 2- and 3-positions of toluene) and tris (carboxy C1-C3 alkyl) isocyanurate. Examples of tris (carboxy C1-C3 alkyl) isocyanurate include tris (1-carboxymethyl) isocyanurate, tris (2-carboxyethyl) isocyanurate, tris (3-carboxypropyl) isocyanurate, bis (2-carboxyethyl). ) Isocyanurate. Of these, tris (3-carboxypropyl) isocyanurate is preferable.
 該硬化促進剤(e)は、速硬化の潜在性硬化促進剤とするために、粒径を細かくして均一に分散することが好ましい。その平均粒径は、大きすぎると狭ギャップの液晶セル製造時に上下ガラス基板を貼り合わせる時のギャップ形成がうまくできない等の不良要因となる。そのため平均粒径は、4μm以下が好ましく、より好ましくは3μm以下である。平均粒径としての下限は通常0.1μm程度である。 It is preferable that the curing accelerator (e) is uniformly dispersed with a fine particle size so as to be a rapid curing latent curing accelerator. If the average particle size is too large, it becomes a cause of defects such as inability to form a gap when the upper and lower glass substrates are bonded together when manufacturing a narrow gap liquid crystal cell. Therefore, the average particle size is preferably 4 μm or less, more preferably 3 μm or less. The lower limit as the average particle size is usually about 0.1 μm.
 本発明の液晶シール剤中における硬化促進剤(e)の含有量は、該液晶シールの総量に対して、0.5~15質量%が好ましく、より好ましくは1~8質量%である。
含有量が少なすぎると硬化性が悪くなりシールパンクが発生し、含有量が多すぎると室温保存安定性及びシールの直線性が悪くなる。
The content of the curing accelerator (e) in the liquid crystal sealant of the present invention is preferably 0.5 to 15% by mass, more preferably 1 to 8% by mass, based on the total amount of the liquid crystal seal.
If the content is too small, the curability is deteriorated and seal puncture occurs, and if the content is too large, the room temperature storage stability and the linearity of the seal are deteriorated.
 本発明の液晶シール剤には接着強度を向上させるためにカップリング剤(f)を添加しても良い。該カップリング剤(f)に特段の限定はない。
 該カップリング剤(f)としては、例えば、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルメチルジメトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、N-フェニル-γ-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)3-アミノプロピルメチルジメトキシシラン、N-(2-アミノエチル)3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-メルカプトプロピルトリメトキシシラン、ビニルトリメトキシシラン、N-(2-(ビニルベンジルアミノ)エチル)3-アミノプロピルトリメトキシシラン塩酸塩、3-メタクリロキシプロピルトリメトキシシラン、3-クロロプロピルメチルジメトキシシラン、3-クロロプロピルトリメトキシシラン等のシランカップリング剤;イソプロピル(N-エチルアミノエチルアミノ)チタネート、イソプロピルトリイソステアロイルチタネート、チタニウムジ(ジオクチルピロホスフェート)オキシアセテート、テトライソプロピルジ(ジオクチルホスファイト)チタネート、ネオアルコキシトリ(p-N-(β-アミノエチル)アミノフェニル)チタネート等のチタン系カップリング剤;Zr-アセチルアセトネート、Zr-メタクリレート、Zr-プロピオネート、ネオアルコキシジルコネート、ネオアルコキシトリスネオデカノイルジルコネート、ネオアルコキシトリス(ドデカノイル)ベンゼンスルホニルジルコネート、ネオアルコキシトリス(エチレンジアミノエチル)ジルコネート、ネオアルコキシトリス(m-アミノフェニル)ジルコネート、アンモニウムジルコニウムカーボネート等のジルコニウム系カップリング剤;Al-アセチルアセトネート、Al-メタクリレート、Al-プロピオネート等のアルミニウム系カップリング剤;が挙げられ、これらを単独で用いても2種以上混合して用いても良い。
 これらのカップリング剤のうち、好ましくはシランカップリング剤であり、更に好ましくはアミノシランカップリング剤又はエポキシシランカップリング剤である。
 該カップリング剤を使用する事により耐湿信頼性が優れ、吸湿後の接着強度の低下が少ない液晶シール剤が得られる。本発明の液晶シール剤中に該カップリング剤を含有する場合、その含有量は0.05~3質量%程度である。
A coupling agent (f) may be added to the liquid crystal sealant of the present invention in order to improve the adhesive strength. There is no particular limitation on the coupling agent (f).
Examples of the coupling agent (f) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxy) (Cyclohexyl) ethyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxysilane , 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltri Methoxysilane, 3- Silane coupling agents such as rolopropylmethyldimethoxysilane and 3-chloropropyltrimethoxysilane; isopropyl (N-ethylaminoethylamino) titanate, isopropyl triisostearoyl titanate, titanium di (dioctyl pyrophosphate) oxyacetate, tetraisopropyl di Titanium coupling agents such as (dioctyl phosphite) titanate and neoalkoxytri (pN- (β-aminoethyl) aminophenyl) titanate; Zr-acetylacetonate, Zr-methacrylate, Zr-propionate, neoalkoxyzirco , Neoalkoxy tris neodecanoyl zirconate, neoalkoxy tris (dodecanoyl) benzenesulfonyl zirconate, neoalkoxy tris (ethylene di) Minoethyl) zirconate, neoalkoxytris (m-aminophenyl) zirconate, zirconium-based coupling agents such as ammonium zirconium carbonate; aluminum-based coupling agents such as Al-acetylacetonate, Al-methacrylate, Al-propionate; These may be used alone or in admixture of two or more.
Of these coupling agents, a silane coupling agent is preferable, and an aminosilane coupling agent or an epoxy silane coupling agent is more preferable.
By using the coupling agent, it is possible to obtain a liquid crystal sealing agent having excellent moisture resistance reliability and little decrease in adhesive strength after moisture absorption. When the coupling agent is contained in the liquid crystal sealing agent of the present invention, the content thereof is about 0.05 to 3% by mass.
 本発明の液晶シール剤には、硬化性の更なる向上のためにポリチオール化合物(g)を含有しても良い。該ポリチオール化合物としては分子中に2個以上のチオール基を有する化合物が好ましく、例えば、メタンジチオール、1,2-ジメルカプトエタン、1,2-ジメルカプトプロパン、2,2-ジメルカプトプロパン、1,3-ジメルカプトプロパン、1,2,3-トリメルカプトプロパン、1,4-ジメルカプトブタン、1,6-ジメルカプトヘキサン、ビス(2-メルカプトエチル)スルフィド、1,2-ビス(2-メルカプトエチルチオ)エタン、1,5-ジメルカプト-3-オキサペンタン、1,8-ジメルカプト-3,6-ジオキサオクタン、2,2-ジメチルプロパン-1,3-ジチオール、3,4-ジメトキシブタン-1,2-ジチオール、2-メルカプトメチル-1,3-ジメルカプトプロパン、2-メルカプトメチル-1,4-ジメルカプトブタン、2-(2-メルカプトエチルチオ)-1,3-ジメルカプトプロパン、1,2-ビス(2-メルカプトエチルチオ)-3-メルカプトプロパン、1,1,1-トリス(メルカプトメチル)プロパン、テトラキス(メルカプトメチル)メタン、エチレングリコールビス(2-メルカプトアセテート)、エチレングリコールビス(3-メルカプトプロピオネート)、1,4-ブタンジオールビス(2-メルカプトアセテート)、1,4-ブタンジオールビス(3-メルカプトプロピオネート)、トリメチロールプロパントリス(2-メルカプトアセテート)、トリメチロールプロパントリス(3-メルカプトプロピオネート)、ペンタエリスリトールテトラキス(2-メルカプトアセテート)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)、1,1-ジメルカプトシクロヘキサン、1,4-ジメルカプトシクロヘキサン、1,3-ジメルカプトシクロヘキサン、1,2-ジメルカプトシクロヘキサン、ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)、ジペンタエリスリトールヘキサキス(2-メルカプトアセテート)、1,2-ジメルカプトベンゼン、1,3-ジメルカプト-2-プロパノール、2,3-ジメルカプト-1-プロパノール、1,2-ジメルカプト-1,3-ブタンジオール、ヒドロキシメチル-トリス(メルカプトエチルチオメチル)メタン、ヒドロキシエチルチオメチルートリス(メルカプトエチルチオ)メタン、エチレングリコールビス(3-メルカプトプロピオネート)、プロピレングリコールビス(3-メルカプトプロピオネート)、ブタンジオールビス(3-メルカプトプロピオネート)、オクタンジオールビス(3-メルカプトプロピオネート)、テトラエチレングリコールビス(3-メルカプトプロピオネート)、エチレングリコールビス(4-メルカプトブチレート)、プロピレングリコールビス(4-メルカプトブチレート)、ブタンジオールビス(4-メルカプトブチレート)、オクタンジオールビス(4-メルカプトブチレート)、トリメチロールプロパントリス(4-メルカプトブチレート)、ペンタエリスリトールテトラキス(4-メルカプトブチレート)、エチレングリコールビス(6-メルカプトバレレート)、プロピレングリコールビス(6-メルカプトバレレート)、ブタンジオールビス(6-メルカプトバレレート)、オクタンジオールビス(6-メルカプトバレレート)、トリメチロールプロパントリス(6-メルカプトバレレート)、ペンタエリスリトールテトラキス(6-メルカプトバレレート)、1,6-ヘキサンジチオール、1,9-ノナンジチオール、1,10-デカンジチオール、4,4’-ビス(メルカプトメチル)フェニルスルフィド、2,4’-ビス(メルカプトメチル)フェニルスルフィド、2,4,4’-トリ(メルカプトメチル)フェニルスルフィド、2,2’,4,4’-テトラ(メルカプトメチル)フェニルスルフィド、1,3,5-トリス[2-(3-メルカプトプロピオニルオキシ)エチル]-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、ペンタエリスリトールテトラキス(3-メルカプトブチレート)、1,4-ビス(3-メルカプトブチリルオキシ)ブタン等が挙げられ、これらを単独で用いても2種以上混合して用いても良い。 The liquid crystal sealant of the present invention may contain a polythiol compound (g) for further improving curability. The polythiol compound is preferably a compound having two or more thiol groups in the molecule, such as methanedithiol, 1,2-dimercaptoethane, 1,2-dimercaptopropane, 2,2-dimercaptopropane, , 3-dimercaptopropane, 1,2,3-trimercaptopropane, 1,4-dimercaptobutane, 1,6-dimercaptohexane, bis (2-mercaptoethyl) sulfide, 1,2-bis (2- Mercaptoethylthio) ethane, 1,5-dimercapto-3-oxapentane, 1,8-dimercapto-3,6-dioxaoctane, 2,2-dimethylpropane-1,3-dithiol, 3,4-dimethoxybutane -1,2-dithiol, 2-mercaptomethyl-1,3-dimercaptopropane, 2-mercaptomethyl-1 4-dimercaptobutane, 2- (2-mercaptoethylthio) -1,3-dimercaptopropane, 1,2-bis (2-mercaptoethylthio) -3-mercaptopropane, 1,1,1-tris ( Mercaptomethyl) propane, tetrakis (mercaptomethyl) methane, ethylene glycol bis (2-mercaptoacetate), ethylene glycol bis (3-mercaptopropionate), 1,4-butanediol bis (2-mercaptoacetate), 1, 4-butanediol bis (3-mercaptopropionate), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (2-mercaptoacetate), pentaerythritol Trakis (3-mercaptopropionate), 1,1-dimercaptocyclohexane, 1,4-dimercaptocyclohexane, 1,3-dimercaptocyclohexane, 1,2-dimercaptocyclohexane, dipentaerythritol hexakis (3- Mercaptopropionate), dipentaerythritol hexakis (2-mercaptoacetate), 1,2-dimercaptobenzene, 1,3-dimercapto-2-propanol, 2,3-dimercapto-1-propanol, 1,2- Dimercapto-1,3-butanediol, hydroxymethyl-tris (mercaptoethylthiomethyl) methane, hydroxyethylthiomethyltris (mercaptoethylthio) methane, ethylene glycol bis (3-mercaptopropionate), propylene group Recall bis (3-mercaptopropionate), butanediol bis (3-mercaptopropionate), octanediol bis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), ethylene glycol Bis (4-mercaptobutyrate), propylene glycol bis (4-mercaptobutyrate), butanediol bis (4-mercaptobutyrate), octanediol bis (4-mercaptobutyrate), trimethylolpropane tris (4-mercapto) Butyrate), pentaerythritol tetrakis (4-mercaptobutyrate), ethylene glycol bis (6-mercaptovalerate), propylene glycol bis (6-mercaptovalerate), butanediol bis (6- Luccaptovalerate), octanediol bis (6-mercaptovalerate), trimethylolpropane tris (6-mercaptovalerate), pentaerythritol tetrakis (6-mercaptovalerate), 1,6-hexanedithiol, 1,9 -Nonanedithiol, 1,10-decanedithiol, 4,4'-bis (mercaptomethyl) phenyl sulfide, 2,4'-bis (mercaptomethyl) phenyl sulfide, 2,4,4'-tri (mercaptomethyl) phenyl Sulfide, 2,2 ′, 4,4′-tetra (mercaptomethyl) phenyl sulfide, 1,3,5-tris [2- (3-mercaptopropionyloxy) ethyl] -1,3,5-triazine-2, 4,6 (1H, 3H, 5H) -trione, 1,3,5-tris (3- Lucaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, pentaerythritol tetrakis (3-mercaptobutyrate), 1,4-bis (3-mercapto Butyryloxy) butane and the like. These may be used alone or in combination of two or more.
 これらのポリチオール化合物のうち、トリメチロールプロパントリス(3-メルカプトプロピオネート)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)、ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)、1,3,5-トリス[2-(3-メルカプトプロピオニルオキシ)エチル]-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、ペンタエリスリトールテトラキス(3-メルカプトブチレート)が好ましく、さらに好ましくは、液晶汚染性及び室温保存安定性の観点から、2級チオール構造を持つ1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、ペンタエリスリトールテトラキス(3-メルカプトブチレート)が特に好ましい。 Among these polythiol compounds, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), 1, 3, 5-tris [2- (3-mercaptopropionyloxy) ethyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris (3-mercapto (Butyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, pentaerythritol tetrakis (3-mercaptobutyrate) are preferred, and liquid crystal contamination and room temperature are more preferred. From the viewpoint of storage stability, 1,3,5-tris (3-merca having a secondary thiol structure DOO butyl oxy) -1,3,5-triazine-2,4,6 (IH, 3H, 5H) - trione, pentaerythritol tetrakis (3-mercapto butyrate) is particularly preferred.
 本発明の液晶滴下工法用熱硬化性液晶シール剤中に該ポリチオール化合物(g)を含有する場合、その含有量は通常0.1~10質量%、好ましくは0.3~5質量%である。含有量が少なすぎると硬化性が悪くなりシールパンクが発生しやすくなり、含有量が多すぎると室温保存安定性が悪くなりやすい。 When the polythiol compound (g) is contained in the thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention, the content thereof is usually 0.1 to 10% by mass, preferably 0.3 to 5% by mass. . If the content is too small, the curability is poor and seal puncture is likely to occur, and if the content is too large, the room temperature storage stability tends to be poor.
 本発明の液晶滴下工法用熱硬化性液晶シール剤には、液晶シール剤の特性に影響を与えない範囲で有機充填剤(h)を添加しても良い。該有機充填剤(h)としては、例えば、シリコーンゴム微粒子、アクリルゴム微粒子、コアシェルタイプのアクリル微粒子等が挙げられる。これら有機充填剤は単独で用いても2種以上を混合して用いても良い。 The organic filler (h) may be added to the thermosetting liquid crystal sealant for the liquid crystal dropping method of the present invention within a range that does not affect the properties of the liquid crystal sealant. Examples of the organic filler (h) include silicone rubber fine particles, acrylic rubber fine particles, and core-shell type acrylic fine particles. These organic fillers may be used alone or in combination of two or more.
 添加してもよい有機充填剤の平均粒径は、通常5μm以下であり、好ましくは2μm以下である。平均粒径が大きすぎる場合はセルギャップの形成が難しくなる。ただし、有機充填剤がシリコーンゴム粉末の場合には平均粒径が大きくてもセルギャップ形成ができるため、シリコーンゴム粉末の好ましい平均粒径は15μm以下である。
 また、本発明の液晶シール剤中に該有機充填剤を含有する場合、その含有量は該液晶シール剤の総量に対して、40質量%以下が好ましく、30質量%以下がより好ましい。下限は0質量%でも良い。通常、好ましくは1質量%以上、より好ましくは5質量%以上含む方が好ましい。多すぎる場合、粘度が高くなりセルギャップの形成が難しくなる。本発明の液晶シール剤中に該有機充填剤を含有する態様は好ましい態様の一つである。
 また、有機充填剤として、シリコーンゴム微粒子と他の有機充填剤、例えば(メタ)アクリル樹脂微粒子、好ましくはコアシェルタイプの(メタ)アクリル微粒子を併用する態様も本発明の好ましい態様の1つである。その場合、シリコーンゴム微粒子を、他の有機充填剤1質量部に対して、通常1~10質量部の割合、好ましくは3~7質量部の割合で使用するのが好ましい。
The average particle diameter of the organic filler that may be added is usually 5 μm or less, preferably 2 μm or less. When the average particle size is too large, it becomes difficult to form a cell gap. However, when the organic filler is a silicone rubber powder, a cell gap can be formed even if the average particle size is large. Therefore, the preferable average particle size of the silicone rubber powder is 15 μm or less.
In addition, when the organic filler is contained in the liquid crystal sealing agent of the present invention, the content thereof is preferably 40% by mass or less, and more preferably 30% by mass or less with respect to the total amount of the liquid crystal sealing agent. The lower limit may be 0% by mass. Usually, it is preferably 1% by mass or more, more preferably 5% by mass or more. When the amount is too large, the viscosity becomes high and it becomes difficult to form a cell gap. The aspect which contains this organic filler in the liquid-crystal sealing compound of this invention is one of the preferable aspects.
In addition, an aspect in which silicone rubber fine particles and other organic fillers such as (meth) acrylic resin fine particles, preferably core-shell type (meth) acrylic fine particles are used in combination as the organic filler is also one of the preferable embodiments of the present invention. . In that case, it is preferable to use the silicone rubber fine particles in a proportion of usually 1 to 10 parts by mass, preferably 3 to 7 parts by mass with respect to 1 part by mass of the other organic filler.
 本発明の液晶シール剤には、さらに必要に応じて、光ラジカル重合開始剤、有機溶媒、顔料、レベリング剤、消泡剤などの添加剤を配合することができる。
 次ぎに本発明のシール剤に付いての好ましい態様のいくつかを記載する。
1.前記「課題を解決するための手段」に記載した(5)~(14)の何れか一項に記載した発明において、硬化性樹脂(b)が、エポキシ樹脂及び(メタ)アクリル化エポキシ樹脂の併用である態様。
2.硬化性樹脂(b)の総量に対して、エポキシ樹脂の含量が3~40質量%であり、(メタ)アクリル化エポキシ樹脂の含量が60~97質量%である上記1に記載の態様。
3.上記1又は2において、硬化促進剤(e)を含む態様(上記1における(5)~(14)のうちの(11)~(14)に記載した発明)の場合において、硬化促進剤の含量が、本発明のシール剤の総量に対して、0.5~15質量%、好ましくは1~8質量%である態様。
4.硬化促進剤(e)がイソシアヌル環骨格含有多価カルボン酸硬化促進剤である上記3に記載の態様。
5.硬化促進剤(e)がトリス(カルボキシC1-C3アルキル)イソシアヌレートである上記4に記載の態様。
6.上記1~5の何れか一項に記載のカップリング剤(f)を含む態様(上記1における(5)~(14)のうちの(12)~(14)に記載した発明)の場合において、カップリング剤(f)の含量が、本発明のシール剤の総量に対して、0.05~3質量%である上記1~5の何れか一項に記載の態様。
7.カップリング剤(f)がシランカップリング剤である上記6に記載の態様。
8.更に、ポリチオール化合物(g)を、本発明のシール剤の総量に対して、0.1~10質量%含有する上記1~7の何れか一項に記載の態様。
9.更に、有機充填剤(h)を、本発明のシール剤の総量に対して、1~40質量%の範囲内で含有する上記1~8の何れか一項に記載の態様。
If necessary, the liquid crystal sealing agent of the present invention may further contain additives such as a photo radical polymerization initiator, an organic solvent, a pigment, a leveling agent, and an antifoaming agent.
Next, some preferred embodiments for the sealant of the present invention will be described.
1. In the invention described in any one of (5) to (14) described in the above “Means for Solving the Problems”, the curable resin (b) is an epoxy resin and a (meth) acrylated epoxy resin. The aspect which is combined use.
2. 2. The embodiment according to 1 above, wherein the content of the epoxy resin is 3 to 40% by mass and the content of the (meth) acrylated epoxy resin is 60 to 97% by mass with respect to the total amount of the curable resin (b).
3. In the above 1 or 2, in the case of the embodiment containing the curing accelerator (e) (the invention described in (11) to (14) of (5) to (14) in the above 1), the content of the curing accelerator Is 0.5 to 15% by mass, preferably 1 to 8% by mass, based on the total amount of the sealing agent of the present invention.
4). 4. The aspect according to 3 above, wherein the curing accelerator (e) is an isocyanuric ring skeleton-containing polyvalent carboxylic acid curing accelerator.
5. 5. The embodiment according to 4 above, wherein the curing accelerator (e) is tris (carboxy C1-C3 alkyl) isocyanurate.
6). In the case of the embodiment (the invention described in (12) to (14) of (5) to (14) in 1) including the coupling agent (f) described in any one of 1 to 5 above The embodiment according to any one of 1 to 5 above, wherein the content of the coupling agent (f) is 0.05 to 3% by mass relative to the total amount of the sealing agent of the present invention.
7). The aspect of said 6 whose coupling agent (f) is a silane coupling agent.
8). The embodiment according to any one of the above 1 to 7, further comprising 0.1 to 10% by mass of the polythiol compound (g) based on the total amount of the sealing agent of the present invention.
9. The embodiment according to any one of 1 to 8 above, further comprising the organic filler (h) in a range of 1 to 40% by mass with respect to the total amount of the sealing agent of the present invention.
 本発明の液晶シール剤を得るには、前記のエポキシ樹脂及び/又は(メタ)アクリル化エポキシ樹脂(b)、必要に応じてカップリング剤や添加剤等を溶解混合し、そこに前記の熱硬化剤(c)、前記の熱ラジカル発生剤(a)、前記の無機充填剤(d)、前記の硬化促進剤(e)及びその他の任意成分を適宜加えて、通常の混合装置、例えば、3本ロール、サンドミル、ボールミル等により均一に混合すれば良い。混合が終わったあと異物を除くためにろ過処理を施すことが好ましい。 In order to obtain the liquid crystal sealing agent of the present invention, the above-mentioned epoxy resin and / or (meth) acrylated epoxy resin (b) and, if necessary, a coupling agent or additive are dissolved and mixed, and the above-mentioned heat is added thereto. Adding a curing agent (c), the thermal radical generator (a), the inorganic filler (d), the curing accelerator (e) and other optional components as appropriate, a normal mixing device, for example, What is necessary is just to mix uniformly by a 3 roll, a sand mill, a ball mill, etc. It is preferable to perform a filtration treatment to remove foreign substances after mixing is completed.
 本発明の液晶表示セルは、所定の電極を形成した一対の基板を所定の間隔に対向配置し、周囲を本発明の液晶シール剤でシールし、その間隙に液晶が封入されたものである。封入される液晶の種類は特に限定されない。
 ここで、基板とはガラス、石英、プラスチック、シリコン等から構成される。熱硬化型液晶滴下工法での液晶表示セルの製造方法は、まず、本発明の液晶シール剤に、グラスファイバー等のスペーサー(間隙制御材)を添加、混合する。スペーサーとしては、例えば、グラスファイバー、シリカビーズ、ポリマービーズ等が挙げられる。その径は目的に応じ異なるが、通常2~8μm、好ましくは3~6μmであり、その使用量は、液晶シール剤100質量部に対し通常0.1~4質量部、好ましくは0.5~2質量部、更に好ましくは0.9~1.5質量部程度である。
In the liquid crystal display cell of the present invention, a pair of substrates on which predetermined electrodes are formed are arranged to face each other at a predetermined interval, the periphery is sealed with the liquid crystal sealant of the present invention, and the liquid crystal is sealed in the gap. The kind of liquid crystal to be sealed is not particularly limited.
Here, the substrate is made of glass, quartz, plastic, silicon or the like. In the method for producing a liquid crystal display cell by the thermosetting liquid crystal dropping method, first, a spacer (gap control material) such as glass fiber is added to and mixed with the liquid crystal sealing agent of the present invention. Examples of the spacer include glass fiber, silica beads, polymer beads and the like. The diameter varies depending on the purpose, but is usually 2 to 8 μm, preferably 3 to 6 μm, and the amount used is usually 0.1 to 4 parts by weight, preferably 0.5 to 4 parts per 100 parts by weight of the liquid crystal sealant. The amount is about 2 parts by mass, more preferably about 0.9 to 1.5 parts by mass.
 スペーサーを配合した液晶シール剤を、基板の一方にディスペンサー等により塗布して堰を形成した後(メインシール)、液晶封止基板を真空に保持するために、さらに最外周に一周、シール剤を塗布する(ダミーシール)。その後、内部シールの堰の内側に液晶を滴下し、真空中にてもう一方のガラス基板を重ね合わせた後、大気圧に開放することにより、ギャップ出しを行う。液晶封止基板を真空に保持するためのダミーシール剤は、液晶と接触せず、かつ、液晶セル完成後は切り落とされるため、液晶シール剤と同じものを使用しても、別のUV硬化型シール剤、可視光硬化型シール剤又は熱硬化型シール剤を使用しても良い。真空ギャップ形成後、ダミーシールに光硬化型シール剤であるUV硬化型シール剤又は可視光硬化型シール剤を使用した場合、紫外線照射機又は可視光照射装置により紫外線又は可視光をダミーシール部に照射してダミーシール部を硬化させる。ダミーシールに光硬化型シール剤を使用しなかった場合は、光照射工程は省かれる。ギャップ形成した基板を、90~130℃で1~2時間加熱させ、その後ダミーシール部を切り落とすことにより本発明の液晶表示セルを得ることができる。
 このようにして得られた本発明の液晶表示セルは、液晶汚染による表示不良が無く、接着性、耐湿信頼性に優れたものである。
After applying a liquid crystal sealant containing a spacer to one side of the substrate with a dispenser or the like to form a weir (main seal), in order to keep the liquid crystal sealing substrate in a vacuum, the sealant is further applied to the outermost circumference. Apply (dummy seal). Thereafter, the liquid crystal is dropped inside the weir of the internal seal, and the other glass substrate is overlaid in a vacuum, and then opened to the atmospheric pressure to release the gap. The dummy sealant for holding the liquid crystal sealing substrate in a vacuum does not come into contact with the liquid crystal and is cut off after completion of the liquid crystal cell. Even if the same liquid crystal sealant is used, another UV curable type is used. A sealant, a visible light curable sealant, or a thermosetting sealant may be used. After the vacuum gap is formed, when UV curable sealant or visible light curable sealant, which is a light curable sealant, is used for the dummy seal, UV or visible light is applied to the dummy seal part by an ultraviolet irradiator or visible light irradiator. Irradiate to cure the dummy seal. If no photo-curing sealant is used for the dummy seal, the light irradiation step is omitted. The substrate with the gap formed is heated at 90 to 130 ° C. for 1 to 2 hours, and then the dummy seal portion is cut off, whereby the liquid crystal display cell of the present invention can be obtained.
The liquid crystal display cell of the present invention thus obtained has no display defects due to liquid crystal contamination, and has excellent adhesion and moisture resistance reliability.
 以下に実施例により本発明を更に詳しく説明する。
 なお、本発明は、以下の実施例によって何ら限定されるものではない。
 また実施例中において特に断りの無い限り、部は質量部、%は質量%を意味する。
Hereinafter, the present invention will be described in more detail with reference to examples.
In addition, this invention is not limited at all by the following examples.
Moreover, unless otherwise indicated in an Example, a part means a mass part and% means the mass%.
 実施例A
〔1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタンの合成〕(シリル化ベンゾピナコール)
 市販ベンゾピナコール(東京化成製)100部(0.28モル)をジメチルホルムアルデヒド350部に溶解させた。これに塩基触媒としてピリジン32部(0.4モル)、シリル化剤としてBSTFA(信越化学工業製)150部(0.58モル)を加え70℃まで昇温し、2時間攪拌した。得られた反応液を冷却し、攪拌しながら、水200部を入れ、生成物を沈殿させると共に未反応シリル化剤を失活させた。沈殿した生成物をろ別分離した後十分に水洗した。次いで得られた生成物をアセトンに溶解し、水を加えて再結晶させ、精製した。目的の1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタンを105.6部(収率88.3%)得た。
 HPLC(高速液体クロマトグラフィー)で分析した結果、純度は99.0%(面積百分率)であった。
 HPLC-MASS(高速液体クロマトグラフィー質量分析)にて438の分子イオンピークを得た。さらにNMRスペクトル(溶媒DMSO-d6)から化学シフト値として、水酸基プロトン5.8ppm(1H)、シロキシメチルプロトン0.0ppm(9H)、フェニルプロトン7.1ppm(16H)、7.4ppm(4H)が得られ、目的物と同定した。該NMRスペクトルを図1に示した。
Example A
[Synthesis of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane] (silylated benzopinacol)
100 parts (0.28 mol) of commercially available benzopinacol (manufactured by Tokyo Chemical Industry) was dissolved in 350 parts of dimethylformaldehyde. To this was added 32 parts (0.4 mol) of pyridine as a base catalyst and 150 parts (0.58 mol) of BSTFA (manufactured by Shin-Etsu Chemical Co., Ltd.) as a silylating agent, and the mixture was heated to 70 ° C. and stirred for 2 hours. The obtained reaction solution was cooled and stirred while adding 200 parts of water to precipitate the product and deactivate the unreacted silylating agent. The precipitated product was separated by filtration and thoroughly washed with water. Subsequently, the obtained product was dissolved in acetone, recrystallized by adding water and purified. 105.6 parts (yield: 88.3%) of the target 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane were obtained.
As a result of analysis by HPLC (high performance liquid chromatography), the purity was 99.0% (area percentage).
438 molecular ion peaks were obtained by HPLC-MASS (high performance liquid chromatography mass spectrometry). Further, as a chemical shift value from the NMR spectrum (solvent DMSO-d6), hydroxyl proton 5.8 ppm (1H), siloxymethyl proton 0.0 ppm (9H), phenyl proton 7.1 ppm (16H), 7.4 ppm (4H) Obtained and identified as the desired product. The NMR spectrum is shown in FIG.
 なお、ベンゾピナコール誘導体は二つの三級アルコールのうち一つが反応すると大きな立体障害によりもう一方の水酸基の反応性がさらに落ちるため、上記反応で選択的に片方にシリル基が導入されたと考えられる。 It should be noted that the benzopinacol derivative is considered to have selectively introduced a silyl group on one side in the above reaction because the reactivity of the other hydroxyl group further decreases due to a large steric hindrance when one of the two tertiary alcohols reacts.
実験例1
 本発明の熱ラジカル発生剤の効果を見る目的でサンプルの120℃におけるゲル化タイム(120℃のホットプレート上で硬化する時間)と発泡試験を実施した。
(試験方法)
 ビスフェノールA型エポキシ樹脂のアクリル酸付加体(日本化薬株式会社製:R93100)10部に対して、熱ラジカル発生剤として試験例1(本発明)では本発明の1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタン、試験例2(比較用)ではベンゾピナコール、試験例3(比較用)ではt-ブチルペルオキシ-2-エチルヘキサノエート(化薬アクゾ株式会社製:カヤエステルO)をそれぞれ0.1部混合したものを三本ロールにて混練し、それぞれのサンプルを調整した。
 得られたサンプルを120℃のホットプレート上に置き硬化する時間(120℃におけるゲル化タイム)及び硬化物の発泡による濁りの有無を目視で観察した。その結果を表Aに示す。なお、硬化時間は、ガラス棒をサンプルに接触させ、サンプルが糸を引かなくなるまでの時間を測定した。    
Experimental example 1
In order to see the effect of the thermal radical generator of the present invention, the gelation time at 120 ° C. of the sample (the time for curing on a 120 ° C. hot plate) and a foaming test were performed.
(Test method)
For 10 parts of acrylic acid adduct of bisphenol A type epoxy resin (manufactured by Nippon Kayaku Co., Ltd .: R93100), in Test Example 1 (the present invention) as a thermal radical generator, 1-hydroxy-2-trimethylsiloxy of the present invention is used. -1,1,2,2-tetraphenylethane, benzopinacol in Test Example 2 (for comparison), t-butylperoxy-2-ethylhexanoate in Test Example 3 (for comparison) (manufactured by Kayaku Akzo Corporation) : Kaya ester O) mixed in 0.1 part each was kneaded with three rolls to prepare each sample.
The obtained sample was placed on a 120 ° C. hot plate and cured (gelation time at 120 ° C.) and the presence or absence of turbidity due to foaming of the cured product was visually observed. The results are shown in Table A. The curing time was measured by bringing a glass rod into contact with the sample and measuring the time until the sample stopped pulling the yarn.
 なお発泡による濁りの有無の評価基準は下記の通りである。
 発泡による濁りの有無の評価
○:硬化物には発泡による濁りもなく透明である。
△:硬化物が発泡によりやや白濁が感じられ透明度もやや低下している。
×:硬化物全体に発泡による白濁が明らかに認められ、透明度も明らかに低下している。
The evaluation criteria for turbidity due to foaming are as follows.
Evaluation of presence or absence of turbidity due to foaming ○: The cured product is transparent without turbidity due to foaming.
(Triangle | delta): Hardened | cured material is slightly cloudy by foaming and transparency is also falling a little.
X: White turbidity due to foaming is clearly observed in the entire cured product, and the transparency is also clearly lowered.
表A
          試験例1   試験例2   試験例3  
ゲルタイム    7sec   23sec   4sec    
濁りの有無      ○      ○      ×    
Table A
Test Example 1 Test Example 2 Test Example 3
Gel time 7sec 23sec 4sec
Turbidity ○ ○ ×
 表Aに示されるように、本発明の熱ラジカル発生剤(試験例1)は、硬化速度が速く、発泡が無く、濁りを生じないので、透明性を必要とする様々な用途にも適用できる。
一方、比較対象とした試験例2においては、透明性では問題は無いが硬化時間が長く作業性に問題があり、試験例3は硬化時間の点では優れるが、発泡による濁りが生じるため、透明性が劣るため、透明性を必要とする用途には不適であり、更に、発泡による硬化物の物性の低下が懸念される。
As shown in Table A, the thermal radical generator of the present invention (Test Example 1) has a high curing rate, no foaming, and no turbidity, so that it can be applied to various applications that require transparency. .
On the other hand, in Test Example 2 to be compared, there is no problem with transparency, but the curing time is long and there is a problem with workability. Although Test Example 3 is excellent in terms of the curing time, turbidity due to foaming occurs, so it is transparent. Since the properties are inferior, it is unsuitable for uses requiring transparency, and there is a concern that the physical properties of the cured product may be reduced due to foaming.
 実施例1、2、比較例1、2
 後記表1に記載のアクリル化エポキシ樹脂、エポキシ樹脂、シランカップリング剤を混合して樹脂液を得た。
 得られた樹脂液に無機充填剤、熱硬化剤、硬化促進剤、シリル化ベンゾピナコール、ポリチオール化合物、シリコーンゴム粉末(有機充填剤)及びコアシェルアクリル微粒子(有機充填剤)を、それぞれ表1に記載の配合量で配合して、3本ロールにより混練し、実施例1及び2の液晶シール剤を得た。
 上記実施例1の組成において、シリル化ベンゾピナコールの代わりに、ベンゾピナコールを表1に記載の量で用いる以外は、実施例1と同様にして、比較例1の液晶シール剤を得た。
 また、実施例1の組成において、シリル化ベンゾピナコールの代わりに、有機過酸化物を表1に記載の量で用いる以外は、実施例1と同様にして、比較例2の液晶シール剤を得た。 
Examples 1 and 2 and Comparative Examples 1 and 2
A resin liquid was obtained by mixing an acrylated epoxy resin, an epoxy resin, and a silane coupling agent described in Table 1 below.
Table 1 shows the inorganic filler, thermosetting agent, curing accelerator, silylated benzopinacol, polythiol compound, silicone rubber powder (organic filler) and core-shell acrylic fine particles (organic filler) in the obtained resin liquid. The liquid crystal sealants of Examples 1 and 2 were obtained by blending with the three blending amounts and kneading with three rolls.
In the composition of Example 1, a liquid crystal sealant of Comparative Example 1 was obtained in the same manner as in Example 1 except that benzopinacol was used in the amount shown in Table 1 instead of silylated benzopinacol.
Further, in the composition of Example 1, a liquid crystal sealant of Comparative Example 2 was obtained in the same manner as in Example 1 except that organic peroxide was used in the amount shown in Table 1 instead of silylated benzopinacol. It was.
 参考合成例1〔レゾルシンジグリシジルエーテルの全アクリル化物の合成〕
 レゾルシンジグリシジルエーテル樹脂140部をトルエン160部に溶解させた。これに重合禁止剤としてジブチルヒドロキシトルエン0.48部を加え、60℃まで昇温した。その後、アクリル酸100部(レゾルシンジグリシジルエーテル樹脂のエポキシ基の100%当量)を加えて更に80℃まで昇温し、これに反応触媒であるトリメチルアンモニウムクロライド0.96部を添加して、98℃で約50時間攪拌した。得られた反応液を水洗し、トルエンを留去することにより、レゾルシンのエポキシアクリレート241部を得た。
Reference Synthesis Example 1 [Synthesis of All Acrylate of Resorcin Diglycidyl Ether]
140 parts of resorcin diglycidyl ether resin was dissolved in 160 parts of toluene. To this, 0.48 part of dibutylhydroxytoluene was added as a polymerization inhibitor, and the temperature was raised to 60 ° C. Thereafter, 100 parts of acrylic acid (100% equivalent of the epoxy group of resorcin diglycidyl ether resin) was added, and the temperature was further raised to 80 ° C., and 0.96 part of trimethylammonium chloride as a reaction catalyst was added thereto. Stir at 50 ° C. for about 50 hours. The obtained reaction solution was washed with water and toluene was distilled off to obtain 241 parts of an epoxy acrylate of resorcinol.
表1
            実施例1  実施例2  比較例1  比較例2
アクリル化エポキシ樹脂 *1 16    16    16   16
エポキシ樹脂      *2  4    4     4     4
無機充填剤       *3  1.25   1.25    1.25    1.25
シリコーンゴム粉末   *4  9    9     9     9
シランカップリング剤  *5  0.3    0.3    0.3     0.3
シランカップリング剤  *6  0.05   0.05    0.05    0.05
熱硬化剤        *7  2.8    2.8    2.8     2.8
シリル化ベンゾピナコール*8  0.5    0.5     -     -
ベンゾピナコール    *9  -     -     0.5     -
有機過酸化物      *10 -     -      -     0.5
ポリチオール化合物   *11 0.2    0.2    0.2     0.2
硬化促進剤       *12 1    0.5     1      1
アクリル微粒子     *13 2    2     2      2
Table 1
Example 1 Example 2 Comparative Example 1 Comparative Example 2
Acrylic epoxy resin * 1 16 16 16 16
Epoxy resin * 2 4 4 4 4
Inorganic filler * 3 1.25 1.25 1.25 1.25
Silicone rubber powder * 4 9 9 9 9
Silane coupling agent * 5 0.3 0.3 0.3 0.3
Silane coupling agent * 6 0.05 0.05 0.05 0.05
Thermosetting agent * 7 2.8 2.8 2.8 2.8
Silylated benzopinacol * 8 0.5 0.5--
Benzopinacol * 9--0.5-
Organic peroxide * 10---0.5
Polythiol compound * 11 0.2 0.2 0.2 0.2
Curing accelerator * 12 1 0.5 1 1
Acrylic fine particles * 13 2 2 2 2
 表1中の数値は重量部である。
*1:レゾルシンジグリシジルエーテルの全アクリル化物(参考合成例1で得られた化合物)
*2:レゾルシンジグリシジルエーテル(日本化薬株式会社製、商品名:RGE-HH)
*3:球状シリカ(信越化学工業株式会社製、商品名:X-24-9163A;一次平均粒径110nm)
*4:シリコーンゴム粉末(信越化学工業株式会社製、商品名:KMP-598;一次平均粒径13μm)
*5:3-グリシドキシプロピルトリメトキシシラン(チッソ株式会社製、商品名:サイラエースRTMS-510)
*6:N-2(アミノエチル)3-アミノプロピルトリエトキシシラン(信越化学工業株式会社製、商品名:KBM603)
*7:トリス(2-ヒドラジノカルボニルエチル)イソシアヌレート微粉砕品(株式会社日本ファインケム製、商品名:HCICをジェットミルで平均粒径1.5μmに微粉砕したもの)
*8:1-ヒドロキシ-2-トリメチルシロキシ-1,1, 2,2-テトラフェニルエタン(実施例Aと同様にして得た化合物(シリル化ベンゾピナコール)をジェットミルで平均粒径1.9μmに微粉砕したもの)
*9:ベンゾピナコール微粉砕品(東京化成工業株式会社製ベンゾピナコールをジェットミルで平均粒径1.9μmに微粉砕したもの)
*10:t-ブチルペルオキシ-2-エチルヘキサノエート(化薬アクゾ株式会社製、商品名:カヤエステルRTMO)
*11:ペンタエリスリトールテトラキス(3-メルカプトブチレート)(昭和電工株式会社製、商品名:カレンズRTMMT PE1)
*12:トリス(3-カルボキシプロピル)イソシアヌレート粉砕品(四国化成工業株式会社製、商品名:C3-CIC酸をジェットミルで平均粒径1.5μmに微粉砕したもの)
*13:コアシェルアクリル微粒子(ガンツ化成株式会社製、商品名:F351S;平均粒径0.3μm)
The numerical values in Table 1 are parts by weight.
* 1: Total acrylate of resorcin diglycidyl ether (compound obtained in Reference Synthesis Example 1)
* 2: Resorcin diglycidyl ether (manufactured by Nippon Kayaku Co., Ltd., trade name: RGE-HH)
* 3: Spherical silica (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: X-24-9163A; primary average particle size 110 nm)
* 4: Silicone rubber powder (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KMP-598; primary average particle size 13 μm)
* 5: 3-Glycidoxypropyltrimethoxysilane (manufactured by Chisso Corporation, trade name: Silaace RTM S-510)
* 6: N-2 (aminoethyl) 3-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM603)
* 7: Tris (2-hydrazinocarbonylethyl) isocyanurate finely pulverized product (manufactured by Nippon Finechem Co., Ltd., trade name: HCIC finely pulverized with jet mill to an average particle size of 1.5 μm)
* 8: 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane (compound obtained in the same manner as in Example A (silylated benzopinacol) was averaged in a diameter of 1.9 μm using a jet mill. Finely ground)
* 9: Finely pulverized benzopinacol (Benzopinacol manufactured by Tokyo Chemical Industry Co., Ltd., pulverized to an average particle size of 1.9 μm with a jet mill)
* 10: t-Butylperoxy-2-ethylhexanoate (manufactured by Kayaku Akzo Co., Ltd., trade name: Kayaester RTM O)
* 11: Pentaerythritol tetrakis (3-mercaptobutyrate) (manufactured by Showa Denko KK, trade name: Karenz RTM MT PE1)
* 12: Tris (3-carboxypropyl) isocyanurate pulverized product (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name: C3-CIC acid finely pulverized with a jet mill to an average particle size of 1.5 μm)
* 13: Core-shell acrylic fine particles (manufactured by Ganz Kasei Co., Ltd., trade name: F351S; average particle size 0.3 μm)
 評価用液晶セルの作成
 実施例1、2又は比較例1、2の液晶シール剤各100gにスペーサーとして5μmのグラスファイバー1gを添加して混合撹拌脱泡を行い、シリンジに充填する。ITO透明電極付きガラス基板に配向膜液(商品名:PIA-5540-05A、チッソ株式会社製)を塗布、焼成し、ラビング処理を施した。この基板に先にシリンジに充填した実施例及び比較例の各液晶シール剤をディスペンサー(SHOTMASTER300:武蔵エンジニアリング株式会社製)を使って、シールパターン及びダミーシールパターンの塗布を行い、次いで液晶(商品名:JC-5015LA、チッソ株式会社製)の微小滴をシールパターンの枠内に滴下した。更にもう一枚のラビング処理済みガラス基板に面内スペーサ(商品名:ナトコスペーサKSEB-525F、ナトコ株式会社製、貼り合せ後のギャップ幅5μm)を散布、熱固着し、真空貼り合せ装置を用いて真空中で先の液晶滴下済み基板と貼り合せた。その後、大気開放してギャップ形成した後、120℃オーブンに投入して1時間加熱硬化させ評価用液晶テストセルを作成した。
Preparation of liquid crystal cell for evaluation 1 g of 5 μm glass fiber is added as a spacer to 100 g of each of the liquid crystal sealants of Examples 1 and 2 or Comparative Examples 1 and 2, and the mixture is stirred and degassed and filled into a syringe. An alignment film solution (trade name: PIA-5540-05A, manufactured by Chisso Corporation) was applied to a glass substrate with an ITO transparent electrode, fired, and rubbed. Using this dispenser (SHOTMASTER 300: manufactured by Musashi Engineering Co., Ltd.), the liquid crystal sealant of Example and Comparative Example previously filled in the syringe on this substrate was applied with a seal pattern and a dummy seal pattern. : JC-5015LA, manufactured by Chisso Corporation) was dropped into the frame of the seal pattern. Furthermore, an in-plane spacer (trade name: NATCO SPACER KSEB-525F, manufactured by NATCO, gap width of 5 μm after bonding) is sprayed on another glass substrate that has been rubbed, heat-fixed, and a vacuum bonding apparatus is used. Then, it was bonded to the previous liquid crystal dripped substrate in a vacuum. Then, after opening to the atmosphere and forming a gap, it was put into an oven at 120 ° C. and cured by heating for 1 hour to prepare a liquid crystal test cell for evaluation.
 作成した評価用液晶セルのシール形状および液晶配向乱れを偏光顕微鏡にて観察した結果を表2に示す。また、作成した液晶セルのギャップは、液晶特性評価装置(商品名:OMS-NK3、中央精機株式会社製)を用いて測定した結果を表2に示す。シール形状、液晶配向乱れ及び液晶セルのギャップの評価は下記の4段階とした。 Table 2 shows the results of observing the seal shape and liquid crystal alignment disorder of the prepared liquid crystal cell for evaluation with a polarizing microscope. Further, Table 2 shows the results of measuring the gap of the prepared liquid crystal cell using a liquid crystal characteristic evaluation apparatus (trade name: OMS-NK3, manufactured by Chuo Seiki Co., Ltd.). Evaluation of the seal shape, liquid crystal alignment disorder, and the gap of the liquid crystal cell was made into the following four stages.
 シール形状の評価
○:シールの直線性に乱れが無い。
△:シールの変形が認められるが、液晶の封止には問題が無いレベルである。
×:シールに液晶が差し込み、液晶の封止に問題が発生しうるレベルである。
××:シールが決壊しセルが形成できない。
Evaluation of seal shape ○: There is no disturbance in the linearity of the seal.
[Delta]: Deformation of the seal is recognized, but there is no problem in sealing the liquid crystal.
X: A level at which liquid crystal is inserted into the seal and a problem may occur in sealing the liquid crystal.
XX: The seal is broken and a cell cannot be formed.
 液晶セルギャップの評価
○:セル内が均一に5μmのセルギャップとなっている。
△:セル内に5.5μm程度のセルギャップとなっている場所がある。
×:セル内に6μm以上のセルギャップとなっている場所がある。
××:シールが決壊しセルが形成出来ない。
Evaluation of liquid crystal cell gap ○: The inside of the cell is uniformly 5 μm.
Δ: There is a cell gap of about 5.5 μm in the cell.
X: There is a place where a cell gap of 6 μm or more exists in the cell.
XX: The seal is broken and a cell cannot be formed.
 液晶配向の評価
○:シール近傍に液晶の配向乱れがない。
△:シール近傍に僅かに領域に配向乱れがある。
×:シール近傍から幅広い領域にかけて配向乱れがある。
××:シールが決壊しセルが形成出来ない。
Evaluation of liquid crystal alignment (circle): There is no disorder of liquid crystal alignment in the vicinity of the seal.
(Triangle | delta): There exists orientation disorder in the area | region slightly in the seal | sticker vicinity.
X: There is orientation disorder from the vicinity of the seal to a wide area.
XX: The seal is broken and a cell cannot be formed.
表2
         実施例1   実施例2   比較例1   比較例2
シール形状     ○      ○      ○      ××
液晶セルギャップ  ○      ○      ○      ××
液晶配向      ○      △      ×      ××
Table 2
Example 1 Example 2 Comparative Example 1 Comparative Example 2
Seal shape ○ ○ ○ ××
Liquid crystal cell gap ○ ○ ○ ××
Liquid crystal alignment ○ △ × ××
 液晶シール剤接着強度テスト
 実施例1、2又は比較例1、2の各液晶シール剤100gにスペーサーとして5μmのグラスファイバー1gを添加して混合撹拌を行う。この液晶シール剤を50mm×50mmのガラス基板上に塗布し、その液晶シール剤上に1.5mm×1.5mmのガラス片を貼り合わせ、120℃オーブンに1時間投入して硬化させた。そのガラス片のせん断接着強度をボンドテスター(商品名:SS-30WD、西進商事株式会社製)を使用して測定した。その結果を下記表3に示す。
Liquid Crystal Sealant Adhesive Strength Test 1 g of 5 μm glass fiber as a spacer is added to 100 g of each liquid crystal sealant of Examples 1 and 2 or Comparative Examples 1 and 2 and mixed and stirred. This liquid crystal sealant was applied onto a 50 mm × 50 mm glass substrate, a 1.5 mm × 1.5 mm glass piece was bonded onto the liquid crystal sealant, and cured by placing in a 120 ° C. oven for 1 hour. The shear adhesive strength of the glass piece was measured using a bond tester (trade name: SS-30WD, manufactured by Seishin Shoji Co., Ltd.). The results are shown in Table 3 below.
 液晶シール剤耐湿接着強度テスト
 前記の液晶シール剤接着強度テストと同一の測定サンプルを作成する。その測定サンプルを121℃、2気圧、湿度100%の条件で、プレッシャークッカー試験機(商品名:TPC-411、タバイエスペック株式会社製)に20時間投入したサンプルをボンドテスター(商品名:SS-30WD:西進商事株式会社製)を使用して測定した。その結果を下記表3に示す。
Liquid crystal sealant moisture-resistant adhesive strength test The same measurement sample as the liquid crystal sealant adhesive strength test is prepared. The test sample was placed in a pressure cooker tester (trade name: TPC-411, manufactured by Tabai Espec Co., Ltd.) for 20 hours under the conditions of 121 ° C., 2 atm, and humidity 100%, and a bond tester (trade name: SS- 30WD: manufactured by Seishin Shoji Co., Ltd.). The results are shown in Table 3 below.
 ポットライフ
 R型粘度計(東機産業株式会社製)を使用して、得られた液晶シール剤の25℃における粘度変化を測定した。初期粘度に対する粘度増加率(%)を下記表3に示す。
Using a pot life R-type viscometer (manufactured by Toki Sangyo Co., Ltd.), the viscosity change at 25 ° C. of the obtained liquid crystal sealant was measured. The viscosity increase rate (%) with respect to the initial viscosity is shown in Table 3 below.
表3
            実施例1  実施例2  比較例1  比較例2
初期粘度Pa・s(25℃) 185  165   180   150
ポットライフ
(対初期値粘度増)
25℃保管1日後     3%    3%    3%    8%
接着強度(MPa)    78    62    58    38
耐湿後接着強度(MPa) 58    45    40    15
Table 3
Example 1 Example 2 Comparative Example 1 Comparative Example 2
Initial viscosity Pa · s (25 ° C.) 185 165 180 150
Pot life (vs. initial viscosity increase)
1 day after storage at 25 ° C 3% 3% 3% 8%
Adhesive strength (MPa) 78 62 58 38
Adhesive strength after moisture resistance (MPa) 58 45 40 15
 表2、3に示されるように、シリル化ベンゾピナコールをラジカル発生剤として使用する本発明の実施例の液晶シール剤は、比較例1のベンゾピナコールをラジカル発生剤として使用したものに比しても、液晶配向の点、接着強度及び耐湿後接着強度の点何れにおいても、顕著に優れている。 As shown in Tables 2 and 3, the liquid crystal sealant of the example of the present invention using silylated benzopinacol as a radical generator is compared with the liquid crystal sealant of Comparative Example 1 using benzopinacol as a radical generator. In terms of liquid crystal alignment, adhesive strength, and post-humidity adhesive strength, all are remarkably excellent.
 以上から、本発明のテトラフェニルエタン誘導体は、熱によるラジカル発生性能が高く、発泡も無いことから、ラジカル硬化性樹脂組成物における、ゲルタイムの短い、発泡のない熱ラジカル発生剤として有用である。また、発泡による透明性の低下やその他の硬化物の物性の低下等も無いことから、透明度が高く、物性の良好な樹脂硬化物を得ることが出来る。また、該テトラフェニルエタン誘導体を、液晶シール剤における熱ラジカル発生剤として使用した場合、該シール剤は、液晶の汚染性も少なく、ポットライフが長く、シールの形成性、セルギャップの形成性も良いことから作業性も良好であり、更に、接着強度及び耐湿後接着強度共に優れているという特徴を有する。従って、特に、液晶滴下工法用熱硬化性液晶シール剤として適している。 From the above, the tetraphenylethane derivative of the present invention is useful as a thermal radical generator having a short gel time and no foaming in the radical curable resin composition because it has high radical generation performance due to heat and no foaming. In addition, since there is no decrease in transparency due to foaming or a decrease in physical properties of other cured products, a resin cured product having high transparency and good physical properties can be obtained. In addition, when the tetraphenylethane derivative is used as a thermal radical generator in a liquid crystal sealant, the sealant has little liquid crystal contamination, a long pot life, seal formation, and cell gap formation. Since it is good, the workability is also good, and furthermore, it has the characteristics that both the adhesive strength and the adhesive strength after moisture resistance are excellent. Therefore, it is particularly suitable as a thermosetting liquid crystal sealing agent for a liquid crystal dropping method.

Claims (20)

  1. 下記一般式(1’)
    Figure JPOXMLDOC01-appb-I000006

    (式中、Y’又はY’は各々独立して水素原子、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す。但し、Y’又はY’にそれぞれ結合するR~R又はR~RはY’又はY’が水素原子の場合は存在せず、且つY’及びY’が水素原子の場合を除き、更に、Y’及びY’が珪素原子で、R~Rの全てがメチル基であり、X~Xの全てが水素原子である場合を除く)で表されるテトラフェニルエタン誘導体。
    The following general formula (1 ')
    Figure JPOXMLDOC01-appb-I000006

    (Wherein Y 1 ′ and Y 2 ′ each independently represent a hydrogen atom or a silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms) X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, provided that they are bonded to Y 1 ′ or Y 2 ′, respectively. to R 1 ~ R 3, or R 4 ~ R 6 is not present if Y 1 'or Y 2' is a hydrogen atom, and unless Y 1 'and Y 2' is a hydrogen atom, further, Y 1 A tetraphenylethane derivative represented by the formula: “and Y 2 ′ are silicon atoms, all of R 1 to R 6 are methyl groups, and all of X 1 to X 4 are hydrogen atoms”.
  2.  一般式(1’)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R’-又はR’-はジ(炭素数1~4の直鎖又は分岐アルキル)シリル基、若しくはトリ(炭素数1~4の直鎖又は分岐アルキル)シリル基であり、X~Xのいずれもが水素原子である請求項1に記載のテトラフェニルエタン誘導体。 In the general formula (1 ′), one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — or R 4 R 5 R 6 Y 2 ′ — represents a di (C 1-4 straight or branched alkyl) silyl group or a tri (C 1-4 straight or branched alkyl) silyl group, and X 1 to X 4 Any of these is a hydrogen atom, The tetraphenylethane derivative of Claim 1.
  3.  一般式(1)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R’-又はR’-はトリメチルシリル、トリエチルシリル又はt-ブチルジメチルシリルであり、X~Xのいずれもが水素原子である請求項1に記載のテトラフェニルエタン誘導体。 In the general formula (1), either Y 1 ′ or Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 R 2 R 3 Y 1 ′ — or R 4 R 5 The tetraphenylethane derivative according to claim 1, wherein R 6 Y 2 '-is trimethylsilyl, triethylsilyl or t-butyldimethylsilyl, and any of X 1 to X 4 is a hydrogen atom.
  4.  下記式(2)
    Figure JPOXMLDOC01-appb-I000007

    で表される1-ヒドロキシ-2-トリメチルシロキシ-1,1,2,2-テトラフェニルエタンである請求項1に記載のテトラフェニルエタン誘導体。
    Following formula (2)
    Figure JPOXMLDOC01-appb-I000007

    The tetraphenylethane derivative according to claim 1, which is 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane represented by the formula:
  5. (a)下記一般式(1)
    Figure JPOXMLDOC01-appb-I000008

    (式中、Y又はYは各々独立して水素原子、フェニル、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン原子を示す。但し、Y又はYにそれぞれ結合するR~R又はR~RはY又はYが水素原子の場合は存在せず、且つY及びYのいずれもが水素原子の場合を除く)で表されるテトラフェニルエタン誘導体、(b)エポキシ樹脂又はエポキシ樹脂の(メタ)アクリル酸付加物の何れか一方若しくは両者、(c)熱硬化剤、および(d)無機充填剤を含有することを特徴とする液晶滴下工法用熱硬化性液晶シール剤。
    (A) The following general formula (1)
    Figure JPOXMLDOC01-appb-I000008

    Wherein Y 1 or Y 2 each independently represents a hydrogen atom, phenyl or silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen atom, provided that R is bonded to Y 1 or Y 2 , respectively. 1 to R 3 or R 4 to R 6 are not present when Y 1 or Y 2 is a hydrogen atom, and each of Y 1 and Y 2 is a hydrogen atom. A liquid crystal dropping method comprising a derivative, (b) one or both of an epoxy resin or an epoxy resin (meth) acrylic acid adduct, (c) a thermosetting agent, and (d) an inorganic filler. Thermosetting liquid crystal sealant.
  6.  (a)一般式(1)のテトラフェニルエタン誘導体が請求項1~4の何れか一項に記載のテトラフェニルエタン誘導体である請求項5に記載の液晶シール剤。 (A) The liquid crystal sealant according to claim 5, wherein the tetraphenylethane derivative of the general formula (1) is the tetraphenylethane derivative according to any one of claims 1 to 4.
  7.  (a)一般式(1)のテトラフェニルエタン誘導体が平均粒径5μm以下の固体粉末である請求項5に記載の液晶シール剤。 (A) The liquid crystal sealant according to claim 5, wherein the tetraphenylethane derivative of the general formula (1) is a solid powder having an average particle size of 5 μm or less.
  8.  (c)熱硬化剤の融点又は軟化点が100℃以上である潜在性硬化剤である請求項5に記載の液晶シール剤。 (C) The liquid crystal sealant according to claim 5, which is a latent curing agent having a melting point or a softening point of 100 ° C or higher.
  9.  (d)無機充填剤がアルミナ及び/又はシリカである請求項5に記載の液晶シール剤。 (D) The liquid crystal sealant according to claim 5, wherein the inorganic filler is alumina and / or silica.
  10.  (d)無機充填剤の平均粒径が10~2000nmである請求項5に記載の液晶シール剤。 (D) The liquid crystal sealant according to claim 5, wherein the inorganic filler has an average particle size of 10 to 2000 nm.
  11.  (e)硬化促進剤を含有することを特徴とする請求項5に記載の液晶シール剤。 (E) The liquid crystal sealant according to claim 5, further comprising a curing accelerator.
  12. (f)カップリング剤を含有することを特徴とする請求項5に記載の液晶シール剤。 (F) A liquid crystal sealing agent according to claim 5, which contains a coupling agent.
  13. (a)一般式(1)のテトラフェニルエタン誘導体を、液晶シール剤の総量に対して0.1~10質量%、(b)エポキシ樹脂及び/又はエポキシ樹脂の(メタ)アクリル酸付加物を、液晶シール剤の総量に対して、30~75質量%、(c)熱硬化剤を(b)成分100質量部に対して、5~60質量部、および(d)無機充填剤を、液晶シール剤の総量に対して、1~30質量%の範囲で含有する請求項5に記載の液晶シール剤。 (A) A tetraphenylethane derivative of the general formula (1) is 0.1 to 10% by mass with respect to the total amount of the liquid crystal sealant, and (b) an epoxy resin and / or a (meth) acrylic acid adduct of the epoxy resin. 30 to 75% by mass with respect to the total amount of the liquid crystal sealing agent, (c) 5 to 60 parts by mass of the thermosetting agent with respect to 100 parts by mass of the component (b), and (d) an inorganic filler, The liquid crystal sealant according to claim 5, which is contained in the range of 1 to 30% by mass with respect to the total amount of the sealant.
  14.  (a)一般式(1)において、Y又はYのいずれか一方は水素原子で、他方が珪素原子を示し、珪素原子の場合、R-又はR-はジ(炭素数1~4の直鎖又は分岐アルキル)シリル基、若しくはトリ(炭素数1~4の直鎖又は分岐アルキル)シリル基であり、X~Xのいずれもが水素原子であるテトラフェニルエタン誘導体、(b)エポキシ樹脂又はエポキシ樹脂の(メタ)アクリル酸付加物の何れか一方若しくは両者、(c)熱硬化剤として融点又は軟化点が100℃以上である潜在性硬化剤、(d)無機充填剤及び、(e)硬化促進剤又は(f)カップリング剤のいずれか一方若しくは両者を含有することを特徴とする請求項5に記載の液晶シール剤。 (A) In the general formula (1), when either Y 1 or Y 2 is a hydrogen atom and the other is a silicon atom and is a silicon atom, R 1 R 2 R 3 Y 1 — or R 4 R 5 R 6 Y 2 — is a di (C 1-4 straight or branched alkyl) silyl group or a tri (C 1-4 straight or branched alkyl) silyl group, and any of X 1 to X 4 A tetraphenylethane derivative which is a hydrogen atom, (b) either one or both of an epoxy resin or an (meth) acrylic acid adduct of an epoxy resin, and (c) a melting point or softening point of 100 ° C. or more as a thermosetting agent. 6. A liquid crystal sealant according to claim 5, comprising a latent curing agent, (d) an inorganic filler, and (e) a curing accelerator or (f) a coupling agent or both. .
  15.  請求項5に記載の液晶シール剤の硬化物でシールされた液晶表示セル。 A liquid crystal display cell sealed with a cured product of the liquid crystal sealant according to claim 5.
  16.  請求項5に記載された一般式(1)のテトラフェニルエタン誘導体を有効成分として含むラジカル発生剤。 A radical generator containing the tetraphenylethane derivative of the general formula (1) described in claim 5 as an active ingredient.
  17.  一般式(1)のテトラフェニルエタン誘導体の、熱硬化性液晶シール剤製造のための請求項16に記載のラジカル発生剤としての用途。 Use of the tetraphenylethane derivative of the general formula (1) as a radical generator according to claim 16 for producing a thermosetting liquid crystal sealant.
  18.  請求項5に記載された一般式(1)のテトラフェニルエタン誘導体を含むラジカル硬化性樹脂組成物を熱硬化させた硬化物。 Hardened | cured material which heat-cured the radical curable resin composition containing the tetraphenylethane derivative of General formula (1) described in Claim 5.
  19.  下記一般式(3)
    Figure JPOXMLDOC01-appb-I000009

    (式中、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す)
    で表されるベンゾピナコールとシリル化剤を反応させる下記式(1’)
    Figure JPOXMLDOC01-appb-I000010

    (式中、Y’又はY’は各々独立して水素原子、又は珪素原子を示し、R~Rは各々独立して水素原子又は炭素数1~4の直鎖又は分岐アルキル基を示し、X~Xは各々独立して、水素原子、メチル基、エチル基、メトキシ基、エトキシ基、フェノキシ基、又はハロゲン基を示す。但し、Y’又はY’にそれぞれ結合するR~R又はR~RはY’又はY’が水素原子の場合は存在せず、且つY’及びY’のいずれもが水素原子の場合を除く)で表されるテトラフェニルエタン誘導体の製造方法。
    The following general formula (3)
    Figure JPOXMLDOC01-appb-I000009

    (Wherein X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group)
    The following formula (1 ′) for reacting a benzopinacol represented by the formula:
    Figure JPOXMLDOC01-appb-I000010

    (Wherein Y 1 ′ and Y 2 ′ each independently represent a hydrogen atom or a silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms) X 1 to X 4 each independently represents a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group, or a halogen group, provided that they are bonded to Y 1 ′ or Y 2 ′, respectively. R 1 to R 3 or R 4 to R 6 are not present when Y 1 ′ or Y 2 ′ is a hydrogen atom, and each of Y 1 ′ and Y 2 ′ is a hydrogen atom) The manufacturing method of the tetraphenylethane derivative represented.
  20.  一般式(1’)において、Y’又はY’のいずれか一方は水素原子で、他方が珪素原子であり、珪素原子の場合、R~R又はR~Rは各々独立して炭素数1~4の直鎖又は分岐アルキル基である請求項1に記載のテトラフェニルエタン誘導体。          In the general formula (1 ′), one of Y 1 ′ and Y 2 ′ is a hydrogen atom and the other is a silicon atom, and in the case of a silicon atom, R 1 to R 3 or R 4 to R 6 are each independently The tetraphenylethane derivative according to claim 1, which is a linear or branched alkyl group having 1 to 4 carbon atoms.
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