KR101806152B1 - Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell - Google Patents
Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell Download PDFInfo
- Publication number
- KR101806152B1 KR101806152B1 KR1020127013344A KR20127013344A KR101806152B1 KR 101806152 B1 KR101806152 B1 KR 101806152B1 KR 1020127013344 A KR1020127013344 A KR 1020127013344A KR 20127013344 A KR20127013344 A KR 20127013344A KR 101806152 B1 KR101806152 B1 KR 101806152B1
- Authority
- KR
- South Korea
- Prior art keywords
- liquid crystal
- group
- sealing agent
- hydrogen atom
- crystal sealing
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 258
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 212
- 238000007789 sealing Methods 0.000 title claims abstract description 205
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 54
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 48
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical class C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 20
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims abstract description 8
- 125000005843 halogen group Chemical group 0.000 claims abstract description 8
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims abstract description 8
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims description 106
- 229920000647 polyepoxide Polymers 0.000 claims description 106
- 238000001723 curing Methods 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 41
- -1 triethylsilyl Chemical group 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 32
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 17
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000007822 coupling agent Substances 0.000 claims description 16
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 12
- 125000005103 alkyl silyl group Chemical group 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- FZFFWZJDHRTEMQ-UHFFFAOYSA-N 1,1,2,2-tetraphenyl-2-trimethylsilyloxyethanol Chemical compound OC(C(C1=CC=CC=C1)(C1=CC=CC=C1)O[Si](C)(C)C)(C1=CC=CC=C1)C1=CC=CC=C1 FZFFWZJDHRTEMQ-UHFFFAOYSA-N 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 238000013007 heat curing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- ILMRJRBKQSSXGY-UHFFFAOYSA-N tert-butyl(dimethyl)silicon Chemical group C[Si](C)C(C)(C)C ILMRJRBKQSSXGY-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 4
- KYNSBQPICQTCGU-UHFFFAOYSA-N Benzopyrane Chemical compound C1=CC=C2C=CCOC2=C1 KYNSBQPICQTCGU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004480 active ingredient Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 8
- 238000011109 contamination Methods 0.000 abstract description 8
- 150000003254 radicals Chemical class 0.000 description 61
- 210000004027 cell Anatomy 0.000 description 32
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 29
- 239000000758 substrate Substances 0.000 description 28
- 239000000047 product Substances 0.000 description 24
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 23
- 239000007983 Tris buffer Substances 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 22
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 20
- 238000005187 foaming Methods 0.000 description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 16
- 210000002858 crystal cell Anatomy 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000012766 organic filler Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 238000001029 thermal curing Methods 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 244000028419 Styrax benzoin Species 0.000 description 6
- 235000000126 Styrax benzoin Nutrition 0.000 description 6
- 235000008411 Sumatra benzointree Nutrition 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 235000019382 gum benzoic Nutrition 0.000 description 6
- 229920006295 polythiol Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000001451 organic peroxides Chemical class 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 229960002130 benzoin Drugs 0.000 description 4
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- TWDFSQNRBYNLAA-UHFFFAOYSA-N 1,1,2,2-tetraphenyl-2-triethylsilyloxyethanol Chemical compound OC(C(C1=CC=CC=C1)(C1=CC=CC=C1)O[Si](CC)(CC)CC)(C1=CC=CC=C1)C1=CC=CC=C1 TWDFSQNRBYNLAA-UHFFFAOYSA-N 0.000 description 3
- KCCIQVUYNPMYSL-UHFFFAOYSA-N 2-[tert-butyl(dimethyl)silyl]oxy-1,1,2,2-tetraphenylethanol Chemical compound OC(C(C1=CC=CC=C1)(C1=CC=CC=C1)O[Si](C)(C)C(C)(C)C)(C1=CC=CC=C1)C1=CC=CC=C1 KCCIQVUYNPMYSL-UHFFFAOYSA-N 0.000 description 3
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 150000008062 acetophenones Chemical class 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 3
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- IWWVYHZXNXEUPB-UHFFFAOYSA-N phenylsulfanylmethanethiol Chemical compound SCSC1=CC=CC=C1 IWWVYHZXNXEUPB-UHFFFAOYSA-N 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- 150000003509 tertiary alcohols Chemical class 0.000 description 3
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 3
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 2
- RUGHUJBHQWALKM-UHFFFAOYSA-N 1,2,2-triphenylethylbenzene Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C(C=1C=CC=CC=1)C1=CC=CC=C1 RUGHUJBHQWALKM-UHFFFAOYSA-N 0.000 description 2
- SRZXCOWFGPICGA-UHFFFAOYSA-N 1,6-Hexanedithiol Chemical compound SCCCCCCS SRZXCOWFGPICGA-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- HENCHDCLZDQGIQ-UHFFFAOYSA-N 3-[3,5-bis(2-carboxyethyl)-2,4,6-trioxo-1,3,5-triazinan-1-yl]propanoic acid Chemical compound OC(=O)CCN1C(=O)N(CCC(O)=O)C(=O)N(CCC(O)=O)C1=O HENCHDCLZDQGIQ-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 238000007718 adhesive strength test Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- VSARMWHOISBCGR-UHFFFAOYSA-N cyclohexane-1,1-dithiol Chemical compound SC1(S)CCCCC1 VSARMWHOISBCGR-UHFFFAOYSA-N 0.000 description 2
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
- 238000000589 high-performance liquid chromatography-mass spectrometry Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- INBDPOJZYZJUDA-UHFFFAOYSA-N methanedithiol Chemical compound SCS INBDPOJZYZJUDA-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- IVDFJHOHABJVEH-UHFFFAOYSA-N pinacol Chemical compound CC(C)(O)C(C)(C)O IVDFJHOHABJVEH-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 238000006884 silylation reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 1
- MDJZGXRFYKPSIM-JCYAYHJZSA-N (2r,3r)-2,3-dihydroxybutanedihydrazide Chemical compound NNC(=O)[C@H](O)[C@@H](O)C(=O)NN MDJZGXRFYKPSIM-JCYAYHJZSA-N 0.000 description 1
- SNVRDQORMVVQBI-OWOJBTEDSA-N (e)-but-2-enedihydrazide Chemical compound NNC(=O)\C=C\C(=O)NN SNVRDQORMVVQBI-OWOJBTEDSA-N 0.000 description 1
- SNVRDQORMVVQBI-UPHRSURJSA-N (z)-but-2-enedihydrazide Chemical compound NNC(=O)\C=C/C(=O)NN SNVRDQORMVVQBI-UPHRSURJSA-N 0.000 description 1
- JRNVQLOKVMWBFR-UHFFFAOYSA-N 1,2-benzenedithiol Chemical compound SC1=CC=CC=C1S JRNVQLOKVMWBFR-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- YGKHJWTVMIMEPQ-UHFFFAOYSA-N 1,2-propanedithiol Chemical compound CC(S)CS YGKHJWTVMIMEPQ-UHFFFAOYSA-N 0.000 description 1
- WNPSAOYKQQUALV-UHFFFAOYSA-N 1,3-bis(sulfanyl)propan-2-ol Chemical compound SCC(O)CS WNPSAOYKQQUALV-UHFFFAOYSA-N 0.000 description 1
- GJRCLMJHPWCJEI-UHFFFAOYSA-N 1,9-Nonanedithiol Chemical compound SCCCCCCCCCS GJRCLMJHPWCJEI-UHFFFAOYSA-N 0.000 description 1
- ZMSKAQFWYOSTQX-UHFFFAOYSA-N 1-(3-sulfanylpropanoyloxy)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OC(CCC)OC(=O)CCS ZMSKAQFWYOSTQX-UHFFFAOYSA-N 0.000 description 1
- SKQOQJDREXWDEM-UHFFFAOYSA-N 1-(4-sulfanylbutanoyloxy)butyl 4-sulfanylbutanoate Chemical compound SCCCC(=O)OC(CCC)OC(=O)CCCS SKQOQJDREXWDEM-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- MTZVWTOVHGKLOX-UHFFFAOYSA-N 2,2-bis(sulfanylmethyl)propane-1,3-dithiol Chemical compound SCC(CS)(CS)CS MTZVWTOVHGKLOX-UHFFFAOYSA-N 0.000 description 1
- CEUQYYYUSUCFKP-UHFFFAOYSA-N 2,3-bis(2-sulfanylethylsulfanyl)propane-1-thiol Chemical compound SCCSCC(CS)SCCS CEUQYYYUSUCFKP-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- QYIYANZNXOSBBC-UHFFFAOYSA-N 2,3-dimethyl-5-phenylpentane-2,3-diol Chemical compound C(C1=CC=CC=C1)CC(O)(C)C(C)(C)O QYIYANZNXOSBBC-UHFFFAOYSA-N 0.000 description 1
- CNDCQWGRLNGNNO-UHFFFAOYSA-N 2-(2-sulfanylethoxy)ethanethiol Chemical compound SCCOCCS CNDCQWGRLNGNNO-UHFFFAOYSA-N 0.000 description 1
- NQLQMVQEQFIDQB-UHFFFAOYSA-N 2-(2-sulfanylethylsulfanyl)propane-1,3-dithiol Chemical compound SCCSC(CS)CS NQLQMVQEQFIDQB-UHFFFAOYSA-N 0.000 description 1
- DUCKYHSGDZYUPR-UHFFFAOYSA-N 2-(3-sulfanylpropanoyloxy)propyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OC(C)COC(=O)CCS DUCKYHSGDZYUPR-UHFFFAOYSA-N 0.000 description 1
- XRIOAPXNYGNTTM-UHFFFAOYSA-N 2-(4-sulfanylbutanoyloxy)ethyl 4-sulfanylbutanoate Chemical compound SCCCC(=O)OCCOC(=O)CCCS XRIOAPXNYGNTTM-UHFFFAOYSA-N 0.000 description 1
- IPWRUHASOUARAB-UHFFFAOYSA-N 2-(4-sulfanylbutanoyloxy)propyl 4-sulfanylbutanoate Chemical compound SCCCC(=O)OC(C)COC(=O)CCCS IPWRUHASOUARAB-UHFFFAOYSA-N 0.000 description 1
- IYQVQZXLTJHEKZ-UHFFFAOYSA-N 2-(ethylsulfanyl)ethanethiol Chemical compound CCSCCS IYQVQZXLTJHEKZ-UHFFFAOYSA-N 0.000 description 1
- VGEOIVXAFNNZKM-UHFFFAOYSA-N 2-(sulfanylmethyl)butane-1,4-dithiol Chemical compound SCCC(CS)CS VGEOIVXAFNNZKM-UHFFFAOYSA-N 0.000 description 1
- FOBHCEPKFIUKPH-UHFFFAOYSA-N 2-(sulfanylmethyl)propane-1,3-dithiol Chemical compound SCC(CS)CS FOBHCEPKFIUKPH-UHFFFAOYSA-N 0.000 description 1
- HCZMHWVFVZAHCR-UHFFFAOYSA-N 2-[2-(2-sulfanylethoxy)ethoxy]ethanethiol Chemical compound SCCOCCOCCS HCZMHWVFVZAHCR-UHFFFAOYSA-N 0.000 description 1
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 1
- MPNXSZJPSVBLHP-UHFFFAOYSA-N 2-chloro-n-phenylpyridine-3-carboxamide Chemical compound ClC1=NC=CC=C1C(=O)NC1=CC=CC=C1 MPNXSZJPSVBLHP-UHFFFAOYSA-N 0.000 description 1
- OMSHWUNQZORMEX-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol 4-sulfanylbutanoic acid Chemical compound OC(=O)CCCS.OC(=O)CCCS.OC(=O)CCCS.CCC(CO)(CO)CO OMSHWUNQZORMEX-UHFFFAOYSA-N 0.000 description 1
- LGWROMGRXCZCLA-UHFFFAOYSA-N 2-hydroxybutanedihydrazide Chemical compound NNC(=O)CC(O)C(=O)NN LGWROMGRXCZCLA-UHFFFAOYSA-N 0.000 description 1
- QPLWSUVVJFODFD-UHFFFAOYSA-N 3-(2-sulfanylethylsulfanyl)-2,2-bis(2-sulfanylethylsulfanylmethyl)propan-1-ol Chemical compound SCCSCC(CO)(CSCCS)CSCCS QPLWSUVVJFODFD-UHFFFAOYSA-N 0.000 description 1
- OWFXTUSFOMXVRD-UHFFFAOYSA-N 3-(disilanylsilyl)propan-1-amine Chemical compound NCCC[SiH2][SiH2][SiH3] OWFXTUSFOMXVRD-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- JSOVZQSFWPMPKN-UHFFFAOYSA-N 4-(3-sulfanylpropanoyloxy)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCCCOC(=O)CCS JSOVZQSFWPMPKN-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- WRAGBEWQGHCDDU-UHFFFAOYSA-M C([O-])([O-])=O.[NH4+].[Zr+] Chemical compound C([O-])([O-])=O.[NH4+].[Zr+] WRAGBEWQGHCDDU-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FMNNNYUWMGNAMU-UHFFFAOYSA-N Cl.CO[SiH3] Chemical compound Cl.CO[SiH3] FMNNNYUWMGNAMU-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical group C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWGOWIIEVDAYTC-UHFFFAOYSA-N ICR-170 Chemical compound Cl.Cl.C1=C(OC)C=C2C(NCCCN(CCCl)CC)=C(C=CC(Cl)=C3)C3=NC2=C1 PWGOWIIEVDAYTC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XCOBLONWWXQEBS-KPKJPENVSA-N N,O-bis(trimethylsilyl)trifluoroacetamide Chemical compound C[Si](C)(C)O\C(C(F)(F)F)=N\[Si](C)(C)C XCOBLONWWXQEBS-KPKJPENVSA-N 0.000 description 1
- HLBSPMXWORQBOE-UHFFFAOYSA-N N1=CN=CN=C1.SC(CCOCCN1CN(CN(C1)CCOCCC(C)S)CCOCCC(C)S)C Chemical compound N1=CN=CN=C1.SC(CCOCCN1CN(CN(C1)CCOCCC(C)S)CCOCCC(C)S)C HLBSPMXWORQBOE-UHFFFAOYSA-N 0.000 description 1
- QSQDUDOOIZJPHE-UHFFFAOYSA-N OC(c1ccccc1)(c1ccccc1)C(O)(c1ccccc1)c1ccccc1[SiH3] Chemical compound OC(c1ccccc1)(c1ccccc1)C(O)(c1ccccc1)c1ccccc1[SiH3] QSQDUDOOIZJPHE-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- CCVNYLLUSONJOL-UHFFFAOYSA-N [3-(4-sulfanylbutanoyloxy)-2,2-bis(4-sulfanylbutanoyloxymethyl)propyl] 4-sulfanylbutanoate Chemical compound SCCCC(=O)OCC(COC(=O)CCCS)(COC(=O)CCCS)COC(=O)CCCS CCVNYLLUSONJOL-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- IKWQWOFXRCUIFT-UHFFFAOYSA-N benzene-1,2-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC=C1C(=O)NN IKWQWOFXRCUIFT-UHFFFAOYSA-N 0.000 description 1
- ALHNLFMSAXZKRC-UHFFFAOYSA-N benzene-1,4-dicarbohydrazide Chemical compound NNC(=O)C1=CC=C(C(=O)NN)C=C1 ALHNLFMSAXZKRC-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001793 charged compounds Chemical class 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- UOQACRNTVQWTFF-UHFFFAOYSA-N decane-1,10-dithiol Chemical compound SCCCCCCCCCCS UOQACRNTVQWTFF-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000005548 dental material Substances 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- WQABCVAJNWAXTE-UHFFFAOYSA-N dimercaprol Chemical compound OCC(S)CS WQABCVAJNWAXTE-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- SWRGUMCEJHQWEE-UHFFFAOYSA-N ethanedihydrazide Chemical compound NNC(=O)C(=O)NN SWRGUMCEJHQWEE-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003349 gelling agent Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- VXXXAHHGVZECCR-UHFFFAOYSA-N heptane-1,1-dithiol Chemical compound CCCCCCC(S)S VXXXAHHGVZECCR-UHFFFAOYSA-N 0.000 description 1
- OXAGUPFRAIIDLT-UHFFFAOYSA-N heptanedihydrazide Chemical compound NNC(=O)CCCCCC(=O)NN OXAGUPFRAIIDLT-UHFFFAOYSA-N 0.000 description 1
- PJPRFQPMDKJMRW-UHFFFAOYSA-N hexadecanedihydrazide Chemical compound NNC(=O)CCCCCCCCCCCCCCC(=O)NN PJPRFQPMDKJMRW-UHFFFAOYSA-N 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical group O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010902 jet-milling Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 235000012243 magnesium silicates Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- BVWUEIUNONATML-UHFFFAOYSA-N n-benzylethenamine Chemical compound C=CNCC1=CC=CC=C1 BVWUEIUNONATML-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- ZWLFGLCGZUVIEA-UHFFFAOYSA-N nonanedihydrazide Chemical compound NNC(=O)CCCCCCCC(=O)NN ZWLFGLCGZUVIEA-UHFFFAOYSA-N 0.000 description 1
- HATIEXJZXOLRAO-UHFFFAOYSA-N octanedihydrazide Chemical compound NNC(=O)CCCCCCC(=O)NN HATIEXJZXOLRAO-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- NVLRFXKSQQPKAD-UHFFFAOYSA-N tricarbon Chemical group [C]=C=[C] NVLRFXKSQQPKAD-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- WTKVMIIQXATOJO-UHFFFAOYSA-N trimethyl-(1,1,2,2-tetraphenyl-2-trimethylsilyloxyethoxy)silane Chemical compound C=1C=CC=CC=1C(C(O[Si](C)(C)C)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O[Si](C)(C)C)C1=CC=CC=C1 WTKVMIIQXATOJO-UHFFFAOYSA-N 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Sealing Material Composition (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a tetraphenyl ethane derivative represented by the following formula (1), a process for producing the same, a use of the tetraphenyl ethane derivative as a radical generator, a liquid crystal sealing agent comprising the tetraphenyl ethane derivative, and a thermosetting liquid crystal sealing When used in a liquid crystal sealing agent, the liquid crystal sealing agent obtained is free from liquid crystal contamination, has a long pot life, and is excellent in the formability of sealing, And the formation of the cell gap is also good. In formula (1), Y 1 or Y 2 each independently represents a hydrogen atom, a phenyl or a silicon atom, R 1 to R 6 each independently represent a hydrogen atom or a straight or branched alkyl group having 1 to 4 carbon atoms X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group. However, R 1 ~R 3 or R 4 ~R 6, which respectively coupled to the Y 1 or Y 2 is a Y 1 or Y 2 is not present in the case of a hydrogen atom, and all of Y 1, Y 2 a hydrogen atom, Except the case.
Description
The present invention relates to a novel silylbenzopinacol, its use as a thermal radical generator, a liquid crystal sealing agent containing the same, and a liquid crystal display cell using the same.
Conventionally, azo compounds, organic peroxides, benzoins, benzoin ethers, acetophenones, benzophenones, etc. have been known and widely used as radical generating agents for curing radical polymerizable compounds by heating by heating .
An azo compound or an organic peroxide which is most likely to generate radicals due to thermal cleavage is used as a radical generating agent in products such as adhesives, sealants, gap formers and molding materials. However, since the radical generator accompanies generation of gas such as nitrogen or carbon dioxide at the time of generation of radicals, there is a concern that the characteristics of the above-mentioned product may be significantly impaired by the gas. For example, properties that may be damaged include a decrease in adhesive strength, a decrease in heat resistance, and a defective shape of a molded article. Other radical generators include benzoin, benzoin ethers, acetophenones, and benzophenol. In these cases, foaming at the time of heating is small, but there is a problem that the ability to generate radicals is poor and the desired performance (reactivity and curability) is not obtained.
Patent Document 1 discloses the use of benzopine coke as a thermal radical generator in order to cure a shaded portion not exposed to light in a system which is cured using both ultraviolet rays and heat. In Patent Document 2, it is disclosed that an initial putter type radical generator is effective in forming a molded article such as a contact lens, various lenses and dental materials, and examples thereof include benzopinacol. In
In
As a field of use of a thermal radical generator, there is a liquid crystal sealing agent for a liquid crystal display cell.
In accordance with the enlargement of the liquid crystal display cell, the liquid crystal dropping method having higher mass productivity than that of the conventional method of manufacturing liquid crystal display cells by the liquid crystal vacuum injection method is introduced as a method of manufacturing liquid crystal display cells, (See Patent Document 4). The liquid crystal dripping method is a method in which a bank of a liquid crystal sealing agent is applied to a liquid crystal substrate (dummy sealing), and then a liquid sealing agent is applied on the outermost periphery (dummy sealing) The other liquid crystal substrate facing the other in the vacuum is laminated, the liquid crystal is sealed by opening to the atmospheric pressure, and the sealing portion is cured by UV irradiation and heating to complete the liquid crystal display cell. The liquid crystal sealing material used for sealing the liquid crystal in this manufacturing method is generally used as a liquid crystal sealing material for a photo thermosetting combination type, instead of a conventional thermosetting liquid crystal sealing material. The reason why the conventional thermosetting liquid crystal sealing agent (also referred to as a thermosetting liquid crystal sealing agent) is not used in the liquid dropping method is that when the liquid crystal dropping method is carried out using a conventional thermosetting liquid crystal sealing agent, heating is performed under vacuum decompression, The reason is that the thermal expansion of the liquid crystal at the time of heating and the viscosity decrease due to the heating of the liquid crystal sealing agent occur and the sealing is punctured and the liquid crystal can not be sealed.
A method of using a photo-thermal curing type liquid crystal sealing agent is a method in which a liquid crystal sealing agent is applied to a liquid crystal substrate by a dispenser or the like, a liquid crystal is dropped inside the bank and the other substrate facing the other in vacuum is stacked , The sealing part is irradiated with light such as ultraviolet light to make it harder and then the liquid crystal sealing agent is thermally cured at about 120 DEG C for about 1 hour to produce a liquid crystal cell.
However, in the case of the photo-thermal curing combination type, it is necessary to irradiate the liquid crystal sealing agent with light such as ultraviolet rays, but the following problems have been caused by the recent narrow frame of the liquid crystal cell.
That is, the liquid crystal sealing portion is shielded by the wiring or the black matrix, and the portion where the liquid crystal sealing agent is not irradiated with light is generated, and thus an uncured portion is generated. There is a problem that the uncured portion is inserted by the liquid crystal during the heat curing process or liquid crystal contamination occurs. For this reason, in designing the liquid crystal cell, there has been a restriction that the sealing agent should be designed so as to irradiate as much light as possible. In addition, since deterioration of the liquid crystal or the alignment layer due to ultraviolet irradiation is a problem, it is necessary to shield the liquid crystal portion with a light shielding mask during the ultraviolet irradiation process so that ultraviolet rays do not touch the liquid crystal. In addition, as the size of the liquid crystal glass substrate becomes larger, the size of the ultraviolet irradiating apparatus becomes larger, and the running cost of the ultraviolet irradiator is increased.
In view of the above, realization of a thermosetting liquid crystal sealing agent (thermosetting liquid crystal sealing agent for liquid crystal dropping process) capable of forming a liquid crystal display cell by thermal curing without requiring ultraviolet irradiation in the liquid crystal dropping method .
Up to now, a thermal curing type liquid crystal sealing agent for a liquid crystal dropping method has already been proposed. For example,
Further, in
As described above, there is no heat curing type liquid crystal drop sealing agent which solves all problems in the thermosetting sealing agent in the liquid crystal dropping method, and the liquid dropping method using only thermal curing is not yet realized.
In addition, in recent years, there has been a strong demand to increase the display area without increasing the external size of the substrate. For this purpose, a liquid crystal cell is designed such that a narrow frame for narrowing the outer periphery of the liquid crystal sealing portion and a liquid crystal sealing width is narrowed. As a result, a liquid crystal sealing agent which can form a narrow sealing width and is unlikely to be disturbed by a uniform sealing shape, and a liquid crystal sealing agent which exhibits a high bonding strength even if the sealing width is small. In addition, there is a demand for a liquid crystal sealing agent having a long pot life with little change in the application conditions of the liquid crystal sealing agent within the working time.
In recent years, in accordance with the spread of liquid crystal televisions and the like, the cell gap of the liquid crystal (the gap between the two substrates on which the liquid crystal is filled) is narrowed in order to improve the high-speed responsiveness of the liquid crystal to the reproduction of moving images. A liquid crystal sealing material which is easy to narrow cell gap upon vacuum bonding of a liquid crystal substrate is required.
In addition, with respect to the demand for the longevity of the liquid crystal cell, deterioration in the high-humidity conditioning of the liquid crystal sealing becomes a problem. A liquid crystal sealing agent having a small deterioration of the bonding strength of the liquid crystal sealing after the high temperature and high humidity test is required.
As described above, the liquid crystal dropping method of the thermosetting type is realized, the substrate is vacuum bonded, the sealing is not performed by heating, the liquid crystal is not contaminated, the bonding strength after bonding strength and humidity resistance test is strong, There is a demand for a thermosetting liquid crystal sealing agent for a liquid crystal dropping method which is excellent in properties, has a long pot life at room temperature, and is easily formed into a narrow cell gap.
SUMMARY OF THE INVENTION The present invention has been made in view of the above background, and a first object of the present invention is to develop a new thermal radical generating agent which is not foaming at the time of heating but is more highly active.
A second object of the present invention is to provide a thermosetting liquid crystal sealing agent for a liquid crystal dropping method which does not require ultraviolet irradiation. In addition, a thermosetting liquid crystal sealing agent for a liquid crystal dropping method which has low stain on liquid crystal contamination, strong adhesive strength after adhesion and humidity resistance test, excellent sealing linearity, long pot life at room temperature, and easy narrow cell gap (Also referred to as a thermosetting liquid crystal sealing agent for public methods).
DISCLOSURE OF THE INVENTION The inventors of the present invention have made intensive studies to solve the above problems and found that by silylating at least one hydroxyl group of benzopinacol which may have a substituent on a benzene ring, The present inventors have found that a thermosetting liquid crystal sealing agent for a liquid crystal dropping method as described above is obtained by using a heat radical generating agent and a thermal radical generating agent.
That is, the present invention relates to the following (1) to (20).
(1) a tetraphenyl ethane derivative of the formula (1 '):
Wherein each of Y 1 ' and Y 2' independently represents a hydrogen atom or a silicon atom, each of R 1 to R 6 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group. Stage, Y 1 'or Y 2' each bonded R 1 ~R 3 or R 4 ~R 6 is Y 1 'or Y 2' is a hydrogen atom, is absent, and Y 1 'and Y 2' to the Except that the case where Y 1 ' and Y 2' are silicon atoms, all of R 1 to R 6 are methyl groups, and all of X 1 to X 4 are hydrogen atoms, except when hydrogen is a hydrogen atom.
(2) In the above-mentioned (1), when any one of Y 1 ' and Y 2' in the formula (1 ') is a hydrogen atom and the other is a silicon atom and a silicon atom, R 1 R 2 R 3 Y 1 '-, or R 4 R 5 R 6 Y 2 ' - di silyl group and, X (straight chain or branched alkyl having 1 to 4 carbon atoms) silyl group, or a tri (straight chain or branched alkyl having 1 to 4 carbon atoms) Tetraphenyl ethane derivatives in which the tannin of 1 to X 4 is a hydrogen atom.
(3) In (1) or (2), when any one of Y 1 ' and Y 2' is a hydrogen atom and the other is a silicon atom in the formula (1 ' 1 R 2 R 3 Y 1 ' - or R 4 R 5 R 6 Y 2' - is trimethylsilyl, triethylsilyl or t-butyldimethylsilyl, and all of X 1 to X 4 are hydrogen atoms. .
(4) In any one of (1) to (3) above,
A tetraphenyl ethane derivative of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenyl ethane represented by the following formula (2).
(5) A process for producing a tetraphenyl ethane derivative represented by the following formula (1): (a) a tetraphenyl ethane derivative represented by the following formula (1); (b) one or both of an epoxy resin or (meth) acrylic acid adduct of an epoxy resin; A thermosetting liquid crystal sealing agent for a liquid crystal dropping method comprising:
Wherein each of Y 1 and Y 2 independently represents a hydrogen atom, a phenyl group, or a silicon atom, R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen atom. However, in the case of Y 1, or R 1 ~R 3 or R 4 ~R 6 is Y 1 or Y 2 are hydrogen atoms bonded to each Y 2 is absent, and all of Y 1 and Y 2 a hydrogen atom, Except the case.
(6) The liquid crystal composition according to the above (5), wherein (a) the tetraphenyl ethane derivative of the formula (1) is a tetraphenyl ethane derivative described in any one of (1) to (4) .
(7) The liquid crystal sealing agent according to (5) or (6) above, wherein (a) the tetraphenylethane derivative of the formula (1) is a solid powder having an average particle size of 5 탆 or less.
(8) The liquid crystal sealing agent according to any one of (5) to (7), wherein the curing agent is a latent curing agent having a melting point or softening point of 100 ° C or higher.
(9) The liquid crystal sealing agent according to any one of (5) to (8), wherein (d) the inorganic filler is alumina and / or silica.
(10) The liquid crystal sealing agent according to any one of (5) to (9) above, wherein (d) the inorganic filler has an average particle diameter of 10 to 2000 nm.
(11) The liquid crystal sealing agent according to any one of (5) to (10), further comprising (e) a curing accelerator.
(12) The liquid crystal sealing agent according to any one of (5) to (11), further comprising (f) a coupling agent.
(13) The liquid crystal composition according to any one of (5) to (12) above, wherein (a) the tetraphenylethane derivative of the formula (1) is contained in an amount of 0.1 to 10% by mass based on the total amount of the liquid crystal sealing agent, (b) (Meth) acrylic acid adduct of an epoxy resin in an amount of 30 to 75 mass% based on the total amount of the liquid crystal sealing agent, (c) 5 to 60 parts by mass of the thermosetting agent relative to 100 parts by mass of the component (b) and d) an inorganic filler in an amount of 1 to 30% by mass based on the total amount of the liquid crystal sealing agent.
(14) In any one of (5) to (13) above, (a) in formula (1), one of Y 1 and Y 2 is a hydrogen atom and the other is a silicon atom, , R 1 R 2 R 3 Y 1 - or R 4 R 5 R 6 Y 2 - is a divalent (straight-chain or branched alkyl) silyl group having 1 to 4 carbon atoms, or tri (linear or branched alkyl having 1 to 4 carbon atoms) a silyl group, both of X 1 ~X 4 is a hydrogen atom, a tetraphenyl ethane derivative, (b) an epoxy resin or an epoxy resin (meth) acrylic add any water one or a combination of the two, (c) a melting point or softening point as a thermal curing agent (D) an inorganic filler, (e) a curing accelerator, or (f) a coupling agent, wherein the liquid crystal sealing agent is a liquid crystal sealing agent.
(15) A liquid crystal display cell sealed with a cured product of the liquid crystal sealing agent according to any one of (5) to (14).
(16) A radical generator comprising a tetraphenyl ethane derivative of the formula (1) as described in (5) as an active ingredient.
(17) Use of the tetraphenyl ethane derivative of the formula (1) as the radical generator according to the above (5) for producing a thermosetting liquid crystal sealing agent as described in (16) above.
(18) A cured product obtained by thermally curing a radical curable resin composition comprising the tetraphenyl ethane derivative of the formula (1) described in (5) above.
(19) A process for producing a tetraphenyl ethane derivative of the following formula (1 ') for reacting a benzopyran of formula (3) with a silylating agent:
X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group,
Y 1 ' or Y 2' each independently represents a hydrogen atom or a silicon atom, and R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. Stage, Y 1 R 1, which respectively coupled to the 'or Y 2' ~R 3 or R 4 ~R 6 is Y 1 'or Y 2' is Y 1, Y 2, and further when the hydrogen atoms is not present, "in all cases except a hydrogen atom.
(20) In (1), when any one of Y 1 ' and Y 2' in the formula (1 ') is a hydrogen atom and the other is a silicon atom, R 1 to R 3 or R 4 to R 6 each independently represent a straight-chain or branched alkyl group having 1 to 4 carbon atoms.
The tetraphenyl ethane derivative (also referred to as a benzopinacole derivative) of the formula (1) used in the present invention is useful as a thermal radical generator, and it is possible to accelerate the reaction speed without foaming at the time of heating. Therefore, it can be widely used for various uses such as adhesives, sealants, gap formers, molding materials and the like as a thermal radical generating agent which does not cause deterioration of physical properties due to foaming, , Adhesive strength, shape stability, etc.) can be obtained. In particular, it is excellent as a thermal radical generator for a thermosetting liquid crystal sealing agent used in a liquid dropping method.
The thermosetting liquid crystal sealing agent using the tetraphenyl ethane derivative of the formula (1) used in the present invention as a thermal radical generating agent is a thermosetting liquid crystal sealing agent for liquid crystal dripping method which does not require ultraviolet irradiation to the liquid crystal sealing part Hereinafter also referred to as the liquid crystal sealing agent of the present invention). Since the liquid crystal sealing agent is low in stain on liquid crystal, has strong adhesive strength after the bonding strength test and humidity resistance test, has excellent sealing linearity, and has excellent properties such as long life at room temperature, . As a result, a liquid crystal display cell with high yield, high reliability, and high quality can be manufactured. The liquid crystal display cell of the present invention sealed with a cured product of the liquid crystal sealing agent of the present invention is free from display defects due to liquid crystal contamination, and is excellent in adhesiveness and moisture resistance reliability.
The tetraphenyl ethane derivative of the above formula (1 ') is a novel compound synthesized by the present inventors.
1 is an NMR (proton) spectrum (solvent: DMSO-d6) of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane of the present invention.
Hereinafter, the present invention will be described in detail.
In the following description, for convenience, the formula (1) is described, but any explanation except for the case where the compound does not fall within the range of the formula (1 ') substitutes the formula (1) , The same applies to the formula (1 '). In addition, it is assumed to be equally applicable, except that, by also in the description of Y 1 and Y 2, and replacing each with a Y 1 'and Y 2', that are outside the scope of Y 1 'and Y 2'.
In the formula (1) of the present invention, Y 1 and Y 2 each independently represent a hydrogen atom, a phenyl group or a silicon atom, and at least one of them is a group other than a hydrogen atom. Preferred is a case where one side is a hydrogen atom and the other side is a silicon atom.
Examples of the straight chain or branched alkyl group having 1 to 4 carbon atoms (hereinafter simply referred to as C1 to C4 alkyl group) in R 1 to R 6 in the formula (1) of the present invention include methyl, ethyl, n- Propyl, i-propyl, t-butyl and the like. Examples of the halogen in X 1 to X 4 include a fluorine atom, a chlorine atom and a bromine atom.
When Y 1 or Y 2 in the formula (1) is a group other than a hydrogen atom, R 1 R 2 R 3 Y 1 - or R 4 R 5 R 6 Y 2 - is a phenyl group or a phenyl group substituted with 1 to 3 C1- More preferably a di C1 to C4 alkylsilyl group or a tri-C1 to C4 alkylsilyl group, more preferably a di C1 to C4 alkylsilyl group or a tri-C1 to C4 alkylsilyl group, to be.
In the straight or branched alkylsilyl group having 1 to 4 carbon atoms in the di or tri carbon atom in R 1 R 2 R 3 Y 1 - and R 4 R 5 R 6 Y 2 - in the formula (1), two or three carbon atoms C4 alkyl groups may be the same or different from each other, and examples of the silyl group include di-C1-C4 alkylsilyl groups such as dimethylsilyl, diethylsilyl and methylethylsilyl, or trimethylsilyl, triethylsilyl, dimethylethyl Silyl, and t-butyldimethylsilyl; . Of these, a tri-C alkylsilyl group is preferable, and a trimethylsilyl group is more preferable.
X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group, and preferably all of X 1 to X 4 are hydrogen atoms.
Preferred compounds in the tetraphenyl ethane derivatives of formula (1) include 1-hydroxy-2-di or tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane or 1,2- Bis (di- or tri- (C1-C4 alkyl) siloxy} -1,1,2,2-tetraphenyl ethane and 1-hydroxy-2-di or tri More preferably 1,1,2,2-tetraphenylethane, and more preferably 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1,2,2-tetraphenylethane.
The di or tri (C1-C4 alkyl) siloxy in the tetraphenyl ethane may have the same or different 2 or 3 alkyl groups on the silyl group. Examples of the tri (C1-C4 alkyl) siloxy include trimethylsiloxy, triethylsiloxy, t-butyldimethylsiloxy, and the like.
Specific examples of the tetraphenyl ethane derivative include 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane, 1,2-bis (triethylsiloxy) Bis (t-butyldimethylsiloxy) -1,1,2,2-tetraphenylethane, 1 -hydroxy-2-trimethylsiloxy- 1,1,2,2-tetraphenyl ethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, 1 -hydroxy-2-t-butyldimethylsiloxy- 1,1,2,2-tetraphenyl ethane. Preferably 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetraphenylethane.
Among them, in the present invention, 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1 -hydroxy-2-triethylsiloxy- Tetraphenyl ethane or 1-hydroxy-2-t-butyldimethylsiloxy-1,1,2,2-tetraphenylethane is more preferable and 1-hydroxy-2-trimethylsiloxy- More preferred are 1,1,2,2-tetraphenyl ethane.
The tetraphenyl ethane derivative of the formula (1) of the present invention is characterized by a structure in which benzopinacol of the formula (3) is silylated with various silylating agents.
The tetraphenyl ethane derivative of the formula (1) of the present invention can be obtained by synthesizing a benzopinacol derivative of the formula (3) and various silylating agents by heating in a basic catalyst such as pyridine.
The silylating agent may be any one as long as it can di-C1-C4 alkylsilylation or tri-C1-C4 alkylsilylation or phenyldi C1-C4 alkylsilylation, and tri (C1-C4 alkyl) silylation agent is preferable. Preferred are trimethylsiloxane (TMCS), hexamethyldisilazane (HMDS), N, O-bis (trimethylsilyl) trifluoroacetamide (BSTFA), triethylsilylating agent , Triethylchlorosilane (TECS) as t-butyldimethylsilylating agent and t-butyldimethylsilane (TBMS) as t-butyldimethylsilylating agent.
These reagents are readily available from markets such as silicone derivatives manufacturers. The reaction amount (silylation equivalent) of the silylating agent is preferably 1.0 to 5.0 times equivalent to 1 equivalent of the hydroxyl group of the benzopinacol of the formula (3). More preferably 1.5 to 3.0 times equivalent. If the amount is too small, the reaction efficiency is poor, and the reaction time is prolonged, thereby promoting pyrolysis. If it is too much, separation becomes worse when it is collected, or purification becomes difficult.
Examples of the basic catalyst include pyridine, triethylamine, and the like. The basic catalyst has an effect of trapping hydrogen chloride generated in the reaction and keeping the reaction system basic, or removing hydrogen atoms in the hydroxyl group to further promote the reaction. The amount to be used may be equal to or more than 0.5 times equivalent to the equivalent amount of the basic group with respect to 1 equivalent of the hydroxyl group of the target compound and may be used as a solvent. Usually, the equivalent of the basic group of the basic catalyst is 1 to 5 times equivalent to 1 equivalent of the hydroxyl group of the target compound.
As the solvent, non-polar organic solvents such as hexane, ether, and toluene are excellent because they are not involved in the reaction. Also preferred are polar solvents such as pyridine, dimethylformaldehyde (DMF), dimethylsulfoxide (DMSO), tetrahydrofuran (THF) and acetonitrile. It is preferable that the weight concentration of the solute is 5 to 40 mass%. More preferably 10 to 30% by mass. If the amount is too small, the reaction is delayed and the decomposition by heat is promoted, and the yield is reduced. If too much, the number of by-products increases and the yield decreases.
When the silyl group is introduced into one of the hydroxyl groups of the benzopyran of formula (3), the reaction temperature is preferably 80 ° C or lower, and the reaction time is preferably 2.5 hours or less, preferably 2 hours or less. Benzopinacol derivatives such as benzopinacol of the formula (3) or the desired compound produced are preferably reacted at a low temperature in order to cause thermal decomposition by heating, but because of the lack of reactivity due to the tertiary alcohol, In a short period of time to obtain a target product at a high yield. Considering the reaction efficiency and the like, about 50 to 80 캜 is preferable. The reaction time is about 30 minutes to 2.5 hours, preferably about 30 minutes to 2 hours.
When a silyl group is introduced into both of the hydroxyl groups of the benzopinacol of the formula (3), a higher temperature, for example, a temperature of about 75 to 100 캜 is preferable, but the yield is considered to be lowered.
The tetraphenyl ethane derivative of the formula (1) of the present invention can be used as a radical generating agent. Specifically, it can be used in various fields as a heat radical generator and a photo radical generator, and it is particularly preferable to use it as a heat radical generator in the present invention.
The thermal radical generator of the present invention can also be used for applications that are difficult to achieve with other photoradical generators. For example, irradiation with hardening or strong energy of a portion not exposed to light can be used for hardening of a problematic portion. Specifically, as a thermal radical generating agent in a sealing agent for precision instruments, as a thermal radical generating agent for curing an area in which a low-molecular substance concerned about decomposition coexists, and as a thermal radical generating agent for organic synthesis by a thermal reaction It can be used as a generator. In addition, since the thermal radical generating agent of the present invention does not accompany foaming at the time of radical generation and does not impair the curing rate even in a small amount, it is expected that the cured product is maintained in shape and improved in physical properties. In the present invention, the amount of the tetraphenyl ethane derivative of the above formula (1) used as the radical generator may vary depending on the kind of the polymerized monomer to be cured and the field of use, and the amount of the tetraphenylethane derivative may be appropriately selected.
One preferred field of use of the thermal radical generator of the present invention is its use as a thermal radical generator in a radical curable resin composition. In this case, the content of the thermal radical generator (tetraphenylethane derivative of the formula (1)) of the present invention relative to the total amount of the composition is not particularly limited, but is usually about 0.1 to 10 mass%. The remainder is a radical polymerizable resin and an additive that can be included if necessary. The resin composition is thermally cured to obtain a cured product of the resin composition. The cured product is excellent in transparency since it does not cause haze due to foaming, and is excellent in adhesiveness, moisture resistance adhesion, and the like . Examples of the radical curable resin include an epoxy resin and a (meth) acrylic resin. Particularly, as a useful radical curable resin composition, a thermosetting sealing agent can be exemplified, and among these, a thermosetting liquid crystal sealing agent for a liquid crystal dropping method is most suitable.
(B) an epoxy resin and / or a (meth) acrylic acid adduct of an epoxy resin; (c) a thermosetting liquid crystal sealing agent of a liquid crystal dropping method; A hardening agent, and (d) an inorganic filler.
The thermosetting liquid crystal sealing agent for a liquid crystal dropping method of the present invention contains (a) a tetraphenyl ethane derivative of the formula (1) as a thermal radical generator in order to improve curability. In order to simplify the tetraphenyl ethane derivative of the formula (1) below, the component (a) or the thermal radical generator (a) is also described.
Generally, a thermal radical generator refers to a compound which generates dissociation of radicals by heating, and examples thereof include azo compounds, organic peroxides, benzoins, benzoin ethers, acetophenones, and benzopinacols. However, when an azo compound or an organic peroxide is generated by heating, nitrogen, carbon dioxide, or the like is generated and foamed. As a result, bubbles are contained in the cured product, which causes deterioration of the cured properties and the bonding strength. In addition, benzoin derivatives, benzopinacol, and the like do not foam during heating. However, when the temperature of the heat curing temperature of the sealing agent usable in the production of the liquid crystal panel is about 90 to 130 占 폚, There is a problem that the desired degree of curing is not obtained.
Therefore, the inventors of the present invention have conducted various investigations and found that by chemically modifying benzopinacol, a more active and less liquid-contaminated thermal radical generator is obtained. Further, it has been found that a benzopinacol derivative in which at least one of the hydroxyl groups of pinacol is an ether bond is more preferable from the viewpoint of ease of synthesis. Examples of the ether linkage include methyl ether, ethyl ether, propyl ether, isopropyl ether, butyl ether, phenyl ether group and silyl ether group. Of these, a phenyl ether group or a silyl ether group is preferable from the standpoint of activity and the tetraphenyl ethane derivative of the above formula (1) is more preferable.
Preferred tetraphenyl ethane derivatives (a) of formula (1) for use in the present invention include 1-hydroxy-2-di or tri (C 1 -C 4 alkyl) siloxy-1,1,2,2- Di (C1 to C4 alkyl) siloxy} -1,1,2,2-tetraphenyl ethane, and 1-hydroxy-2-di or tri Siloxyl-1,1,2,2-tetraphenyl ethane is more preferable, and more preferable is 1-hydroxy-2-tri (C1-C4 alkyl) siloxy-1,1,2,2-tetra Phenyl ethane. Specific examples of the compound are as described above.
It is preferable that the thermal radical generator (a) (tetraphenyl ethane derivative (a) of formula (1)) is uniformly dispersed with a narrow particle size. If the average particle diameter is too large, it becomes a cause of defects such as a failure to form a gap when the upper and lower glass substrates are laminated during the production of the liquid crystal cell with a narrow gap. Therefore, the thickness is preferably 5 탆 or less, more preferably 3 탆 Or less. The particle diameter of the component (a) may be made thinner without limitation, but the lower limit thereof is usually about 0.1 탆 in average particle diameter.
The content of the heat radical generating agent (a) in the liquid crystal sealing agent of the present invention is usually 0.1 to 10 mass%, preferably 0.3 to 7 mass%, more preferably 0.5 (mass%) based on the total amount of the liquid crystal sealing agent To 5% by mass. If the content is too small, the curing property deteriorates and a sealing puncture occurs. When the content is too large, the liquid crystal staining property tends to become strong.
In the present invention, as long as the effect of the present invention is achieved, a radical generating agent other than the component (a) may be used in combination. In general, it is preferable to use the component (a) alone as the radical generating agent.
The epoxy resin and / or the (meth) acrylic acid adduct (b) of the epoxy resin contained in the thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention is used as a curable resin. Herein, "(meth) acryl" means "acryl" and / or "methacryl". (B) of the epoxy resin and / or the (meth) acrylic acid adduct of the epoxy resin are all preferably low in stainability and solubility in liquid crystals, and low in resin viscosity.
Preferable examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, ethylene oxide addition bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy Resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, resorcinidiglycidyl ether, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy Resin, epoxy resin of Hai Danto dolman type, epoxy resin of isocyanurate type, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin having triphenol methane skeleton, diglycidyl And diglycidyl ether compounds of other bifunctional alcohols. These epoxy resins may be used alone or in combination of two or more. Among them, more preferred are bisphenol A type epoxy resin, bisphenol F type epoxy resin, ethylene oxide addition bisphenol S type epoxy resin and resorcin sodium glycidyl ether from the viewpoint of liquid crystal staininess and viscosity, Diesters are preferred.
(Meth) acrylic acid adduct of the epoxy resin (hereinafter, also referred to as "(meth) acrylated epoxy resin" for convenience) is a compound obtained by the reaction of an epoxy resin with (meth) acrylic acid, (Meth) acrylic acid, or a compound in which an epoxy group of less than the equivalent amount is reacted with (meth) acrylic acid to intentionally leave an epoxy group (hereinafter also referred to as a partial (meth) acrylated epoxy resin).
As the (meth) acrylated epoxy resin, a compound having two or more functional (meth) acryloyl groups is preferable. The ratio of the epoxy group to the (meth) acryloyl group in the part (meth) acrylated epoxy resin is not limited, and is appropriately selected from the viewpoints of process suitability and liquid crystal stain resistance.
In the present invention, usually, the amount of (meth) acrylic acid added with (meth) acrylic acid in a proportion of 50 to 100%, preferably 70 to 100%, and more preferably 80 to 100% based on the total epoxy groups contained in the epoxy resin ) Acrylated epoxy resin is preferable. In general, acrylic acid is often used because of its low cost in (meth) acrylic acid. Therefore, it is preferable to use a compound obtained by adding acrylic acid to the epoxy group of the epoxy resin.
The epoxy resin to be used as a raw material of the (meth) acrylated epoxy resin is not particularly limited, but an epoxy resin having two or more functionalities is preferable.
Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, ethylene oxide addition bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type Epoxy resin, bisphenol F novolak type epoxy resin, resorcinidiglycidyl ether, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, , Isocyanurate type epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin having triphenol methane skeleton, diglycidyl ether compound of other bifunctional phenols, other 2 And diglycidyl ether compounds of functional alcohols.
Preferred are bisphenol A type epoxy resins, bisphenol F type epoxy resins and resorcinediglycidyl ethers, among which resorcinediglycidyl ether is preferable.
Accordingly, the (meth) acrylated epoxy resin is preferably a (meth) acrylated epoxy resin obtained by the reaction of (meth) acrylic acid with at least one member selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and resorcin diglycidyl ether. ) Acrylate epoxy resin is preferable, and a (meth) acrylated epoxy resin obtained by the reaction of resorcine diglycidyl ether with (meth) acrylic acid is more preferable.
As the (meth) acrylated epoxy resin, an acrylated epoxy resin obtained by reaction of an epoxy resin with acrylic acid is preferable from the viewpoint of curability. More preferably at least one member selected from the group consisting of an acrylic acid adduct of a bisphenol A type epoxy resin, an acrylic acid adduct of a bisphenol F type epoxy resin, and an acrylic acid adduct of a resorcinidiglycidyl ether.
The above-mentioned (meth) acrylated epoxy resins may be used alone or in combination of two or more.
In a preferred embodiment, the preferred (meth) acrylated epoxy resin occupies the entire amount of the (meth) acrylated epoxy resin in the liquid crystal sealing agent.
The content of the epoxy resin and / or the (meth) acrylated epoxy resin (b) (hereinafter also simply referred to as the curable resin (b)) in the liquid crystal sealing agent of the present invention is usually from 30 to 75 Mass%, preferably 40 to 65 mass%. When the content is too small, the reaction at the time of thermal curing is delayed, and the bank of the sealing agent at the time of making the liquid crystal cell by the liquid crystal dropping method causes a sealing puncture by the thermal expansion of the liquid crystal and the heating low viscosity of the sealing agent. If the content is too large, sufficient adhesive strength is not obtained.
As the curing resin (b), a mode in which both an epoxy resin and a (meth) acrylated epoxy resin are used is one of preferable forms in the sealing agent of the present invention.
When the epoxy resin and the (meth) acrylated epoxy resin are used in combination, the content of the epoxy resin in the curable resin (b) is usually 3 to 40 mass%, preferably 3 to 40 mass%, based on the total amount of the curable resin (b) More preferably about 3 to 30 mass%, more preferably about 5 to 30 mass%, and still more preferably 8 to 30 mass%. In some cases, the amount is preferably 5 to 20% by mass, and more preferably 8 to 15% by mass. The remainder is a (meth) acrylated epoxy resin. Specifically, the content of the (meth) acrylated epoxy is 60-97 mass%, preferably 70-95 mass%, and more preferably 70-92 mass% with respect to the total amount of the curable resin (b). If the content of the epoxy resin is too small, the bonding strength becomes weak. If the content of the epoxy resin is too large, the curing will be delayed and the sealing puncture tends to occur easily.
The thermosetting liquid crystal sealing agent for a liquid crystal dropping method of the present invention contains a thermosetting agent (c). As the thermosetting agent (c), all conventionally used thermosetting agents may be used, but in the present invention, a thermosetting agent having a potential (hereinafter also referred to as a latent curing agent) is preferable. The latent curing agent is a compound having a melting point or a softening point of 100 占 폚 or more at room temperature and does not react with the resin component at room temperature and does not exhibit the function as a curing agent but is usually heated to 100 to 150 占 폚, Refers to a resin that reacts with the resin component by slowly dissolving or melting by about 130 ° C to exhibit an action as a curing agent.
The melting point or softening point in the present invention was measured by thermal analysis using a differential scanning calorimeter (DSC). Specifically, a differential scanning calorimeter (EXSTAR6000, manufactured by Seiko Instruments Inc.) was used and the temperature was measured at a rate of 5 DEG C / min.
Examples of the latent curing agent include polyhydrazide compounds, polyamine compounds, imidazole derivatives, urea derivatives, and the like. Preferably a polyhydrazide compound, and is a compound having two or more hydrazide groups in the molecule. Di-tetrahydrazide compounds are preferable, and di- or trihydrazide compounds are more preferable.
Examples of the polyhydrazide compound include oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, And examples thereof include dihydrazide, dodecanedioididazide, hexadecanediohydrazide, maleic acid dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid Dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4-bisbenzene dihydrazide, 1,4-naphthoic acid dihydrazide, 2,6-pyridine dihydrazide, Dihydrazide such as trihydrazide, pyromellitic acid tetrahydrazide, 1,4,5,8-naphthoic acid tetrahydrazide and 1,3-bis (hydrazinocarbonoethyl) -5-isopropyl hydantoin The skeleton, preferably A hydrazide compound having a valine hydantoin skeleton (a skeleton in which a carbon atom of a hydantoin ring is replaced with an isopropyl group); Tris (3-hydrazinocarbonylmethyl) isocyanurate, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinobonylpropyl) isocyanurate, bis (Hydrazinocarbonyl C1-C3 alkyl) isocyanurate, and these may be used alone or in combination of two or more. Bis or tris (hydrazinocarbonyl C1 to C3 alkyl) isocyanurate is one of the preferred di- or trihydrazide compounds.
Among these polyhydrazide compounds, preferred are di- or trihydrazides of di- or tricarboxylic acids, and more specifically, dihydrazides of C4-C8 aliphatic or aromatic dicarboxylic acids, other than carbon of carboxylic acids, Bis or tris (hydrazinocarbonyl C1-C3 alkyl) isocyanurate, and the like. More preferably at least one selected from the group consisting of dihydrazide of C4 to C8 alkylenedicarboxylic acid, phthalic acid dihydrazide, and tris (hydrazinocarbonyl C1 to C3 alkyl) isocyanurate.
Preferred examples of the polyhydrazide include adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide, 1,3-bis (hydrazinocarbonoethyl) -5-isopropyl hydantoin, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, bis (2-hydrazinocarbonylmethyl) isocyanurate, tris Ethyl) isocyanurate.
More preferred are adipic acid dihydrazide, sebacic acid dihydrazide, isophthalic acid dihydrazide and tris (2-hydrazinocarbonylethyl) isocyanurate.
It is preferable that the heat curing agent (c) is uniformly dispersed with a narrow particle size in order to obtain a fast curing latent curing agent. If the average particle diameter is too large, a gap can not be formed well when the upper and lower glass substrates are laminated in manufacturing a liquid crystal cell having a narrow gap. Therefore, the particle diameter is preferably 4 탆 or less, and more preferably 3 탆 or less. The particle size was measured by a laser diffraction / scattering type particle size distribution analyzer (dry type) (LMS-30 manufactured by Seishin KK). Furthermore, since the average particle diameter is too small, aggregation tends to occur. Therefore, it is preferable to prepare the particles so as not to be extremely small (for example, 0.1 탆 or less).
The content of the thermosetting agent (c) in the liquid crystal sealing agent of the present invention is usually about 5 parts by mass to 60 parts by mass with respect to 100 parts by mass of the curable resin (b) which is an epoxy resin and / or a (meth) Is from 10 parts by mass to 40 parts by mass. When the amount of the thermosetting agent (c) is less than 5 parts by mass, the thermosetting reaction becomes insufficient and the adhesive force and the glass transition point are lowered. On the other hand, if the amount of the thermosetting agent (c) is more than 60 parts by mass, the curing agent remains and the adhesive strength is deteriorated, and the pot life also deteriorates.
The thermosetting liquid crystal sealing agent for a liquid crystal dropping method of the present invention contains an inorganic filler (d). Examples of the inorganic filler (d) include metal oxides such as alumina, silica (spherical silica or fumed silica), talc, clay, bentonite, organic bentonite, barium titanate, titanium oxide, cobalt oxide, magnesium oxide, , Carbonates such as calcium carbonate and magnesium carbonate, sulphates such as barium sulfate and calcium sulfate, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, and silicates such as calcium silicate, aluminum silicate and zirconium silicate. These may be used alone or in combination of two or more. Among these inorganic fillers, alumina and / or silica is particularly preferable.
The average particle diameter of the inorganic filler (d) is preferably 3 탆 or less.
If the average particle diameter is too large, there is a problem in forming a gap at the time of bonding the upper and lower glass substrates at the time of manufacturing the liquid crystal cell. The lower limit of the average particle diameter of the inorganic filler (d) is usually about 0.01 mu m.
The content of the inorganic filler (d) in the liquid crystal sealing agent of the present invention is usually 1 to 30 mass%, preferably 2 to 20 mass%, and more preferably 3 to 15 mass%. When the content is too small, the adhesive strength to the glass substrate is lowered. When the content of the filler is too large, the viscosity is too high and the coating property is deteriorated.
The liquid crystal sealing agent of the present invention contains a curing accelerator (e) in order to accelerate the curing property of the thermosetting reaction.
The curing accelerator (e) is not particularly limited as long as it can accelerate the thermal curing reaction at the time of heating, has low staining property to the liquid crystal, and does not deteriorate the pot life of the liquid crystal sealing agent at room temperature storage.
Examples thereof include polyvalent carboxylic acids having an isocyanurate skeleton, epoxy resin amine adduct water, imidazole derivatives, urea derivatives and the like. These may be used alone or in combination of two or more. Preferred curing accelerators include urea curing accelerators or polyacarboxylic acid curing accelerators containing an isocyanurate skeleton. Concretely, an aliphatic dimethylurea (trade name: UCAT3503N San-Apro Ltd.) (a compound in which a methyl group and two dimethylurea groups are successively substituted on a cyclohexane ring), aromatic dimethylurea (trade name: UCAT3502T San-Apro Ltd .) (A compound in which two dimethylurea groups are substituted at
The curing accelerator (e) is preferably uniformly dispersed with a narrow particle size in order to make it a latent curing accelerator for rapid curing. If the average particle diameter is too large, it becomes a factor of defects such that gap formation is not performed well when the upper and lower glass substrates are laminated in manufacturing a liquid crystal cell of a narrow gap. Therefore, the average particle diameter is preferably 4 탆 or less, and more preferably 3 탆 or less. The lower limit of the average particle diameter is usually about 0.1 mu m.
The content of the curing accelerator (e) in the liquid crystal sealing agent of the present invention is preferably 0.5 to 15 mass%, more preferably 1 to 8 mass%, based on the total amount of the liquid crystal sealing.
If the content is too small, the curing property is deteriorated to cause a sealing puncture. If the content is too large, the storage stability at room temperature and the linearity of sealing are deteriorated.
To the liquid crystal sealing agent of the present invention, a coupling agent (f) may be added to improve the bonding strength. There is no particular limitation on the coupling agent (f).
Examples of the coupling agent (f) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4 Aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) Aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamine) ethyl) 3-aminopropyltri Silane coupling agents such as methoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane and 3-chloropropyltrimethoxysilane; (Dioctyl pyrophosphate) oxyacetate, tetraisopropyl di (dioctyl phosphite) titanate, neo alkoxy tri (meth) acrylate, (pN- (beta -aminoethyl) aminophenyl) titanate; Zr-acetylacetonate, Zr-methacrylate, Zr-propionate, neoalkoxyzirconate, neoalkoxytris neodecanoyl zirconate, neoalkoxytris (dodecanoyl) benzenesulfonyl zirconate, neo Zirconium-based coupling agents such as alkoxytris (ethylenediaminoethyl) zirconate, neoalkoxytris (m-aminophenyl) zirconate, and ammonium zirconium carbonate; Aluminum-based coupling agents such as Al-acetylacetonate, Al-methacrylate, and Al-propionate; These may be used alone or in combination of two or more.
Of these coupling agents, silane coupling agents are preferable, and amino silane coupling agents or epoxy silane coupling agents are more preferable.
By using the coupling agent, a liquid crystal sealing agent having excellent moisture and moisture reliability and less decrease in adhesive strength after moisture absorption is obtained. When the liquid crystal sealing agent of the present invention contains the coupling agent, the content thereof is about 0.05 to 3% by mass.
The liquid crystal sealing agent of the present invention may contain a polythiol compound (g) in order to improve the hardenability. The polythiol compound is preferably a compound having two or more thiol groups in the molecule, and examples thereof include methanedithiol, 1,2-dimercaptoethane, 1,2-dimercaptopropane, 2,2-dimer (Mercaptoethanol) sulfone, 1,6-dimercaptohexane, 1,6-dimercaptohexane, 1,1-dimercaptoheptane, (2-mercaptoethylthio) ethane, 1,5-dimercapto-3-oxapentane, 1,8-dimercapto-3,6-dioxaoctane, 2,2- Dimethoxybutane-1,2-dithiol, 2-mercaptomethyl-1,3-dimercaptopropane, 2-mercaptomethyl-1,4- Dimercaptobutane, 2- (2-mercaptoethylthio) -1,3-dimercaptopropane, 1,2-bis (2-mercaptoethylthio) -3-mercaptopropane, -Tris (mercaptomethyl) propane, tetrakis (mercaptomethyl) methane, ethylene glycol bis (2-mercaptoacetate), ethylene glycol bis (2-mercaptoacetate), 1,4-butanediol bis (3-mercaptopropionate), trimethylolpropane tris (2-mercaptoacetate), trimethylol (3-mercaptopropionate), pentaerythritol tetrakis (2-mercaptoacetate), pentaerythritol tetrakis (3-mercaptopropionate), 1,1-dimercaptocyclohexane, Dimercaptocyclohexane, dipentaerythritol hexacis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), dipentaerythritol tetra (2-mercaptoacetate), 1,2-dimercaptobenzene, 1,3-dimercapto-2-propanol, 2,3-dimercapto-1-propanol, , 3-butanediol, hydroxymethyl-tris (mercaptoethylthiomethyl) methane, hydroxyethylthiomethyl-tris (mercaptoethylthio (3-mercaptopropionate), propylene glycol bis (3-mercaptopropionate), butanediol bis (3-mercaptopropionate), octanediol bis (3-mercaptopropionate) (4-mercaptopropionate), ethylene glycol bis (4-mercaptobutyrate), propylene glycol bis (4-mercaptobutyrate), butanediol bis (4-mercaptobutyrate) , Trimethylolpropane tris (4-mercaptobutyrate), pentaerythritol tetrakis (4-mercaptobutyrate), ethylene glycol bis (6-mercaptovalerate), propylene glycol But are not limited to, bis (6-mercaptovalerate), butanediol bis (6-mercaptovalerate), octanediol bis (6-mercaptovalerate), trimethylolpropane tris 1,6-hexanedithiol, 1,9-nonanedithiol, 1,10-decanedithiol, 4,4'-bis (mercaptomethyl) phenyl sulfide, 2 , 2,4'-tri (mercaptomethyl) phenyl sulfide, 2,2 ', 4,4'-tetra (mercaptomethyl) phenyl sulfide, , 1,3,5-tris [2- (3-mercaptopropionyloxy) ethyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) (1H, 3H, 5H) -triene, pentaerythritol tetrakis (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 ) And 1,4-bis (3-mercaptobutyryloxy) butane. These may be used alone or in combination of two or more.
Of these polythiol compounds, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate) 1,3,5-tris [2- (3-mercaptopropionyloxy) ethyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) , 5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -thione, pentaerythritol tetrakis (3-mercaptobutyrate) More preferably 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-1,3,5-triazine having a secondary thiol structure from the viewpoint of liquid crystal staining property and storage stability at room temperature, 2,4,6 (1H, 3H, 5H) -thione and pentaerythritol tetrakis (3-mercaptobutyrate) are particularly preferable.
When the polythiol compound (g) is contained in the thermosetting liquid crystal sealing agent for a liquid crystal dropping method of the present invention, its content is usually 0.1 to 10% by mass, preferably 0.3 to 5% by mass. If the content is too small, the curing property is deteriorated and the sealing puncture tends to occur. If the content is too large, the storage stability at room temperature tends to deteriorate.
The organic filler (h) may be added to the thermosetting liquid crystal sealing agent for liquid crystal dropping method of the present invention within a range not affecting the properties of the liquid crystal sealing agent. Examples of the organic filler (h) include silicone rubber fine particles, acrylic rubber fine particles, core shell type acrylic fine particles, and the like. These organic fillers may be used alone or in combination of two or more.
The average particle diameter of the organic filler which can be added is usually not more than 5 mu m, preferably not more than 2 mu m. When the average particle diameter is too large, it is difficult to form a cell gap. However, in the case of the silicone rubber powder as the organic filler, since the cell gap can be formed even when the average particle diameter is large, the preferable average particle diameter of the silicone rubber powder is 15 占 퐉 or less.
When the liquid crystal sealing agent of the present invention contains the organic filler, the content thereof is preferably 40 mass% or less, more preferably 30 mass% or less, based on the total amount of the liquid crystal sealing agent. The lower limit may be 0 mass%. But it is usually preferably 1% by mass or more, and more preferably 5% by mass or more. If it is excessively large, viscosity becomes high and formation of a cell gap becomes difficult. The form containing the organic filler in the liquid crystal sealing agent of the present invention is one of the preferred forms.
It is also a preferred embodiment of the present invention that a silicone rubber fine particle and an organic filler such as a (meth) acrylic resin fine particle, preferably a core shell type (meth) acrylic fine particle are used in combination as an organic filler. In that case, it is preferable to use the silicone rubber fine particles in a proportion of usually 1 to 10 parts by mass, preferably 3 to 7 parts by mass, relative to 1 part by mass of the other organic filler.
In the liquid crystal sealing agent of the present invention, additives such as a photo radical polymerization initiator, an organic solvent, a pigment, a leveling agent, and an antifoaming agent may be added, if necessary.
Next, some of the preferable forms of the sealing agent of the present invention will be described.
1. In the invention described in any one of (5) to (14) described in the "means for solving the problems", the curable resin (b) is in the form of a combination of an epoxy resin and a (meth) .
2. The epoxy resin composition according to 1 above, wherein the content of the epoxy resin is 3 to 40 mass% and the content of the (meth) acrylated epoxy resin is 60 to 97 mass% with respect to the total amount of the curable resin (b).
3. In the case where the curing accelerator (e) is included in the above 1 or 2 (the invention described in (11) to (14) of (5) to (14) Is in the range of 0.5 to 15 mass%, preferably 1 to 8 mass%, based on the total amount of the sealing agent of the present invention.
4. In the
5. In the above-mentioned 4, the curing accelerator (e) is tris (carboxy C1-C3 alkyl) isocyanurate.
(6) The positive electrode active material according to any one of (1) to (5) above, which contains the coupling agent (f) , The content of the coupling agent (f) is 0.05 to 3% by mass relative to the total amount of the sealing agent of the present invention.
7. The method according to
8. The form according to any one of 1 to 7, wherein the polythiol compound (g) is contained in an amount of 0.1 to 10% by mass based on the total amount of the sealing agent of the present invention.
9. The foam according to any one of 1 to 8, wherein the organic filler (h) is contained in an amount of 1 to 40% by mass based on the total amount of the sealing agent of the present invention.
In order to obtain the liquid crystal sealing agent of the present invention, the above epoxy resin and / or (meth) acrylated epoxy resin (b) and, if necessary, a coupling agent and additives are dissolved and mixed, The heat radical generating agent (a), the inorganic filler (d), the curing accelerator (e) and other optional components are suitably added and mixed with a conventional mixing apparatus such as three rolls, The mixture can be uniformly mixed by a mill, a ball mill, or the like. After mixing, it is preferable to carry out filtration treatment to remove foreign matter.
In the liquid crystal display cell of the present invention, a pair of substrates on which predetermined electrodes are formed are arranged opposite to each other at a predetermined interval, the periphery is sealed with the liquid crystal sealing agent of the present invention, and liquid crystal is sealed in the gap. The type of liquid crystal enclosed is not particularly limited.
Here, the substrate is made of glass, quartz, plastic, silicon, or the like. In the method for producing a liquid crystal display cell in the thermosetting liquid crystal dropping method, first, a spacer (gap control material) such as glass fiber is added to the liquid crystal sealing agent of the present invention and mixed. Examples of the spacer include glass fibers, silica beads, polymer beads, and the like. The amount thereof is usually from 0.1 to 4 parts by mass, preferably from 0.5 to 2 parts by mass, more preferably from 0.5 to 2 parts by mass, per 100 parts by mass of the liquid crystal sealing agent, More preferably about 0.9 to 1.5 parts by mass.
A liquid sealing agent containing a spacer is applied to one side of the substrate by a dispenser or the like to form a bank (dummy sealing), and then the liquid sealing substrate is further coated with a sealing agent for one week at the outermost periphery (Pile sealing). After that, liquid crystal is dropped inside the bank of the inner sealing, and the other glass substrate is covered with each other in vacuum, and then the gap formation is performed by opening to the atmospheric pressure. Since the dummy sealing agent for keeping the liquid crystal sealing substrate in vacuum is not in contact with the liquid crystal and is removed after the completion of the liquid crystal cell, the same liquid sealing agent as that of the liquid crystal sealing agent can also be used as another UV curable sealing agent, visible light curable sealing agent, A thermosetting sealing agent can be used. When a UV curable sealing agent or a visible light curable sealing agent, which is a photo-curable sealing agent, is used for dummy sealing after forming a vacuum gap, the dummy sealing portion is cured by irradiating ultraviolet rays or visible light to the dummy sealing portion by an ultraviolet ray irradiator or a visible light irradiating device. When the photo-curable sealant is not used for dummy sealing, the light irradiation step is omitted. The liquid crystal display cell of the present invention can be obtained by heating the gap-formed substrate at 90 to 130 DEG C for 1 to 2 hours, and then removing the dummy sealing portion.
The liquid crystal display cell of the present invention thus obtained is free of display defects due to liquid crystal contamination, and is excellent in adhesiveness and humidity resistance reliability.
Example
Hereinafter, the present invention will be described in more detail with reference to Examples.
The present invention is not limited at all by the following examples.
Unless otherwise stated in the examples, "parts" means "parts by mass" and "%" means% by mass.
Example A
[Synthesis of 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane] (Silylated benzopinacol)
100 parts (0.28 mol) of a commercially available benzopinacol (TOKYO CHEMICAL INDUSTRY CO., LTD.) Were dissolved in 350 parts of dimethyl formaldehyde. To this was added 32 parts (0.4 mol) of pyridine as a base catalyst and 150 parts (0.58 mol) of BSTFA (Shin-Etsu Chemical Co., Ltd.) as a silylating agent, and the mixture was heated to 70 占 폚 and stirred for 2 hours. The resulting reaction solution was cooled, and 200 parts of water was added while stirring to precipitate the product and inactivate the unreacted silylating agent. The precipitated product was separated by filtration and sufficiently washed with water. Then, the obtained product was dissolved in acetone, recrystallized by adding water, and purified. 105.6 parts (yield: 88.3%) of the desired 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane was obtained.
Analysis by HPLC (high performance liquid chromatography) showed that the purity was 99.0% (area percent).
And a molecular ion peak of 438 was obtained by HPLC-MASS (high performance liquid chromatography mass spectrometry). Further, a hydroxyl group proton 5.8 ppm (1H), siloxymethyl proton 0.0 ppm (9H), phenyl protons 7.1 ppm (16H) and 7.4 ppm (4H) were obtained as chemical shift values from the NMR spectrum (solvent DMSO-d6) It was identified as a target. The NMR spectrum thereof is shown in Fig.
Further, it is considered that the benzopinacol derivative has a higher steric hindrance when one of the two tertiary alcohols reacts, and the reactivity of the other hydroxyl group is further lowered, so that the silyl group is selectively introduced to one side in the above reaction.
Experimental Example One
For the purpose of examining the effect of the thermal radical generator of the present invention, the gelation time (time for curing on a hot plate at 120 캜) and the foaming test at 120 캜 of the sample were carried out.
(Test Methods)
10 parts of acrylic acid adduct of bisphenol A type epoxy resin (NIPPON KAYAKU Co., Ltd. .: R93100), 1 part of 1-hydroxy-2-trimethylsiloxane of the present invention as a thermal radical generator in Test Example 1 Tetra-phenylethane, benzopinacol in Test Example 2 (for comparison) and t-butylperoxy-2-ethylhexanoate (KAYAKU AKUZO CO ., TLD .: Kayaester O) were mixed in a three-roll mill, and the respective samples were adjusted.
The obtained sample was placed on a hot plate at 120 占 폚 and visually observed for curing time (gelation time at 120 占 폚) and turbidity due to foaming of the cured product. The results are shown in Table 1. The curing time was measured by bringing the glass rod into contact with the sample and measuring the time until the sample was not pulled out of the thread.
The evaluation criteria for the presence or absence of turbidity due to foaming are as follows.
Evaluation of turbidity caused by foaming
?: The cured product is transparent without clouding due to foaming.
?: The cured product was slightly cloudy due to foaming, and the transparency was slightly lowered.
X: White turbidity due to foaming was clearly recognized throughout the cured product, and transparency was clearly lowered.
As shown in Table 1, the thermal radical generating agent of the present invention (Test Example 1) is applicable to various uses requiring transparency since the curing rate is fast, there is no foaming, and no turbidity occurs.
On the other hand, in Test Example 2 as a comparative object, there is no problem in transparency, but there is a problem in workability because of a long curing time, and Test Example 3 is superior in terms of curing time, but turbidity due to foaming occurs, It is not suitable for applications requiring transparency, and there is concern about deterioration of the physical properties of the cured product due to foaming.
Example 1, 2, Comparative Example 1, 2
The resin solution was obtained by mixing the acrylated epoxy resin, the epoxy resin and the silane coupling agent described in Table 1 below.
The inorganic filler, the thermosetting agent, the curing accelerator, the silylated benzopinacol, the polythiol compound, the silicone rubber powder (organic filler) and the core shell acrylic fine particles (organic filler) were compounded in the amounts shown in Table 1 , And kneaded by three rolls to obtain the liquid crystal sealing agents of Examples 1 and 2.
A liquid crystal sealing agent of Comparative Example 1 was obtained in the same manner as in Example 1 except that benzopinacol was used in the composition of Example 1 in place of benzylpinacol in place of silylated benzopinacol.
A liquid crystal sealing agent of Comparative Example 2 was obtained in the same manner as in Example 1 except that organic peroxides were used in the composition of Example 1 in place of the silylated benzopinacol in the amounts shown in Table 2 .
Reference Synthetic example One [ Of resorcine diglycidyl ether Synthesis of whole acrylate]
140 parts of resorcine diglycidyl ether resin were dissolved in 160 parts of toluene. To this was added 0.48 part of dibutylhydroxytoluene as a polymerization inhibitor, and the temperature was raised to 60 占 폚. Thereafter, 100 parts of acrylic acid (equivalent to 100% of the epoxy group of the resorcine diglycidyl ether resin) was added and the temperature was further raised to 80 DEG C, 0.96 part of trimethylammonium chloride as a reaction catalyst was added thereto, Lt; / RTI > The obtained reaction solution was washed with water and toluene was distilled off to obtain 241 parts of epoxy acrylate of resorcinol.
The values in Table 2 are parts by weight.
* 1: The total acrylate of the resorcine diglycidyl ether (the compound obtained in Reference Synthesis Example 1)
* 2: Resorcine diglycidyl ether (NIPPON KAYAKU Co., Ltd., trade name: RGE-HH)
* 3: spherical silica (Shin-Etsu Chemical Co., Ltd., trade name: X-24-9163A; primary average particle size: 110 nm)
* 4: Silicone rubber powder (Shin-Etsu Chemical Co., Ltd., trade name: KMP-598;
* 5: 3-glycidoxypropyltrimethoxysilane (CHISSO CORPORATION, trade name: Sila-ace RTM S-510)
* 6: N-2 (aminoethyl) 3-aminopropyltriethoxysilane (Shin-Etsu Chemical Co., Ltd., trade name: KBM603)
* 7: Tris (2-hydrazinocarbonylethyl) isocyanurate finely pulverized product (trade name: JAPAN FINECHEM COMPANY, INC., Trade name: HCIC, finely ground with a jet mill at an average particle size of 1.5 μm)
* 8: 1-Hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane (Compound obtained in the same manner as in Example A (silylated benzopinacol) was jet milled to an average particle diameter of 1.9 mu m Finely pulverized)
* 9: Benzopinacol micronized product (obtained by finely milling benzopinacol from Tokyo Chemical Industry Co., Ltd. with a jet mill to an average particle size of 1.9 mu m)
* 10: t-Butyl peroxy-2-ethylhexanoate ((KAYAKU AKUZO CO., TLD., Trade name: Kayaester RTM O)
* 11: Pentaerythritol tetrakis (3-mercaptobutyrate) (SHOWA DENKO KK, trade name: Karenz RTM MT PE1)
* 12: Tris (3-carboxypropyl) isocyanurate pulverized product (product of SHIKOKU CHEMICALS CORPORATION, trade name: C3-CIC acid was finely pulverized with a jet mill to an average particle size of 1.5 탆)
* 13: core shell acrylic fine particles (GANZ CHEMICAL CO., LTD., Trade name: F351S; average particle diameter 0.3 탆)
Preparation of liquid crystal cell for evaluation
1 g of a glass fiber having a thickness of 5 탆 was added as a spacer to 100 g of each of the liquid crystal sealing agents of Examples 1 and 2 or Comparative Examples 1 and 2, mixed and defoamed, and filled in a syringe. An alignment film solution (trade name: PIA-5540-05A, CHISSO CORPORATION) was applied to a glass substrate provided with an ITO transparent electrode, followed by baking and rubbing treatment. A sealing pattern and a dummy sealing pattern were applied to each of the liquid crystal sealing agents in the examples and comparative examples packed in a syringe on this substrate using a dispenser (SHOTMASTER 300, manufactured by Musashi Engineering Inc.), and then a liquid crystal (trade name: JC- 5015LA, CHISSO CORPORATION) was dropped in the range of the sealing pattern. In addition, an in-plane spacer (trade name: Natoco spacer KSEB-525F, Natoco Co., ltd., Gap width after bonding: 5 μm) was sprayed on the glass substrate which had been subjected to one rubbing treatment and was hot- And adhered to the substrate on which the previous liquid drop was completed. Thereafter, a gap was formed in the atmosphere to form a gap, and the mixture was placed in an oven at 120 ° C and cured by heating for 1 hour to prepare a liquid crystal test cell for evaluation.
Table 2 shows the results of observing the sealing shape and the liquid crystal alignment dizziness of the prepared liquid crystal cell for evaluation by a polarizing microscope. The gaps of the prepared liquid crystal cells were measured using a liquid crystal property evaluation apparatus (trade name: OMS-NK3, CHUO PRECISION INDUSTRIAL CO., LTD.). The sealing shape, the liquid crystal alignment disturbance and the gap of the liquid crystal cell were evaluated in the following four steps.
Evaluation of sealing shape
○: There is no disturbance in the linearity of sealing.
DELTA: Deformation of the sealing is recognized, but it is a level at which the sealing of the liquid crystal is not problematic.
X: A level at which a liquid crystal is plugged into the sealing and a problem may occur in sealing the liquid crystal.
XX: The sealing is broken and the cell can not be formed.
Evaluation of Liquid Crystal Cell Gap
?: The cell gap was uniformly 5 占 퐉.
DELTA: There is a cell gap of about 5.5 mu m in the cell.
X: There is a cell gap of 6 mu m or more in the cell.
XX: The sealing is broken and the cell can not be formed.
Evaluation of Liquid Crystal Orientation
?: No alignment disturbance of the liquid crystal in the vicinity of the sealing.
?: There is alignment disturbance in a slight region in the vicinity of the sealing.
X: There is orientation disturbance from the vicinity of the sealing to the wide area.
XX: The sealing is broken and the cell can not be formed.
Liquid Crystal Sealing Adhesive Strength Test
1 g of a glass fiber having a thickness of 5 탆 was added as a spacer to 100 g of the liquid sealing agent of Examples 1 and 2 or Comparative Examples 1 and 2, followed by mixing and stirring. This liquid crystal sealing agent was applied on a glass substrate of 50 mm x 50 mm, and a glass piece of 1.5 mm x 1.5 mm was laminated on the liquid crystal sealing agent and placed in an oven at 120 deg. C for 1 hour to cure. The shear bond strength of the glass piece was measured using a bond tester (trade name: SS-30WD, SEISHIN TRADING CO. LTD.). The results are shown in Table 3 below.
Liquid crystal sealing agent anti-moisture adhesive strength test
The measurement sample was subjected to a pressure cooker test machine (trade name: TPC-411, manufactured by Davis ESPEX Co., Ltd.) under the conditions of 121 캜, 2 atm, and a humidity of 100% The sample charged for 20 hours was measured using a bond tester (trade name: SS-30WD: SEISHIN TRADING CO, LTD.). The results are shown in Table 4 below.
Portlife
Using a R-type viscometer (Toki Sangyo co., Ltd.), the viscosity change of the obtained liquid crystal sealing agent at 25 캜 was measured. Table 4 shows the viscosity increase rate (%) with respect to the initial viscosity.
As shown in Tables 3 and 4, the liquid crystal sealing agent of the embodiment of the present invention using silylated benzopinacol as a radical generating agent is superior in liquid crystal alignment as compared with the liquid crystal sealing agent of Comparative Example 1 in which benzopinacol is used as a radical generating agent. But also remarkably excellent in points, adhesive strength, and adhesion strength after humidity resistance.
(Industrial availability)
From the above, the tetraphenyl ethane derivative of the present invention is useful as a thermal radical generating agent having a short gel time and no foaming in the radical curable resin composition, since the radical-generating ability of heat is high and there is no foaming. In addition, since there is no decrease in transparency due to foaming or lowering of physical properties of other cured products, a resin cured product having high transparency and good physical properties can be obtained. When the tetraphenyl ethane derivative is used as a heat radical generating agent in a liquid crystal sealing agent, the sealing agent has low contamination of the liquid crystal, has a long pot life, and can form a sealing film and a cell gap. Therefore, Workability is also good, and further, the adhesive strength after bonding and the adhesion strength after humidity resistance are excellent. Therefore, it is particularly suitable as a thermosetting liquid crystal sealing agent for a liquid crystal dropping method.
Claims (20)
In this formula,
One of Y 1 ' and Y 2' is a hydrogen atom and the other is a silicon atom,
R 1 to R 6 each independently represent a hydrogen atom or a straight or branched alkyl group having 1 to 4 carbon atoms,
X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group,
only,
Y 1 R 1 ~R 3 or R 4 ~R 6, which respectively coupled to the 'or Y 2' is Y 1 'or Y 2' is a hydrogen atom do not exist.
In this formula,
Y 1 or Y 2 each independently represents a hydrogen atom, a phenyl group, or a silicon atom,
R 1 to R 6 each independently represent a hydrogen atom or a straight or branched alkyl group having 1 to 4 carbon atoms,
X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen atom,
only,
Y 1 or R 1 ~R 3 or R 4 ~R 6, which respectively coupled to the Y 2 when Y 1 or Y 2 is a hydrogen atom is not present,
And the case where all of Y 1 and Y 2 are hydrogen atoms is excluded.
In this formula,
X 1 to X 4 each independently represent a hydrogen atom, a methyl group, an ethyl group, a methoxy group, an ethoxy group, a phenoxy group or a halogen group,
One of Y 1 ' and Y 2' is a hydrogen atom and the other is a silicon atom,
R 1 to R 6 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms,
Stage, Y 1 R 1 ~R 3 or R 4 ~R 6, which respectively coupled to the 'or Y 2' is Y 1 'or Y 2' is not present in the case of a hydrogen atom.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009261421 | 2009-11-17 | ||
JPJP-P-2009-261421 | 2009-11-17 | ||
JP2009269727 | 2009-11-27 | ||
JPJP-P-2009-269727 | 2009-11-27 | ||
PCT/JP2010/006651 WO2011061910A1 (en) | 2009-11-17 | 2010-11-12 | Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120085855A KR20120085855A (en) | 2012-08-01 |
KR101806152B1 true KR101806152B1 (en) | 2017-12-07 |
Family
ID=44059397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127013344A KR101806152B1 (en) | 2009-11-17 | 2010-11-12 | Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5783606B2 (en) |
KR (1) | KR101806152B1 (en) |
CN (2) | CN102612521B (en) |
TW (2) | TWI482777B (en) |
WO (1) | WO2011061910A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011050035A1 (en) * | 2011-05-02 | 2012-11-08 | Byk-Chemie Gmbh | Low-emission, by free-radical polymerization thermally curable fiber-matrix semifinished product |
TWI543992B (en) * | 2011-07-13 | 2016-08-01 | Nippon Kayaku Kk | A liquid crystal sealant and a liquid crystal display unit using the liquid crystal sealant |
TW201420736A (en) * | 2012-07-17 | 2014-06-01 | Nippon Kayaku Kk | Liquid-crystal sealant and LCD cell using same |
TWI576360B (en) * | 2012-08-27 | 2017-04-01 | Nippon Kayaku Kk | A liquid crystal sealant and a liquid crystal display cell using the liquid crystal sealant |
CN105242459A (en) * | 2013-03-07 | 2016-01-13 | 日本化药株式会社 | Method for manufacturing liquid-crystal display cells and liquid-crystal display cells obtained via said method |
JP5531166B1 (en) * | 2013-03-07 | 2014-06-25 | 日本化薬株式会社 | Manufacturing method of liquid crystal display cell and liquid crystal display cell obtained by the method |
JP6144961B2 (en) * | 2013-05-09 | 2017-06-07 | 積水化学工業株式会社 | Liquid crystal dropping method sealing agent, vertical conduction material, and liquid crystal display element |
JP6182999B2 (en) * | 2013-06-25 | 2017-08-23 | 日油株式会社 | Thermosetting resin composition for color filter protective film, and color filter provided with the cured film |
JP6288756B2 (en) * | 2013-07-16 | 2018-03-07 | 日本化薬株式会社 | Manufacturing method of liquid crystal display cell and liquid crystal display cell obtained by the method |
JP6235297B2 (en) * | 2013-10-16 | 2017-11-22 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
JP6238761B2 (en) * | 2014-01-20 | 2017-11-29 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
JP2015215514A (en) * | 2014-05-12 | 2015-12-03 | 協立化学産業株式会社 | Sealant for liquid crystal display |
JP6370382B2 (en) * | 2014-07-24 | 2018-08-08 | 三井化学株式会社 | Liquid crystal sealant and liquid crystal display panel manufacturing method |
JP2016038507A (en) | 2014-08-08 | 2016-03-22 | 日本化薬株式会社 | Liquid crystal sealing agent and liquid crystal display cell having the same |
JP6465740B2 (en) * | 2015-05-11 | 2019-02-06 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
JP6465741B2 (en) * | 2015-05-11 | 2019-02-06 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
JP6482371B2 (en) * | 2015-05-11 | 2019-03-13 | 日本化薬株式会社 | Method for producing resin composition |
WO2019098028A1 (en) | 2017-11-16 | 2019-05-23 | 三菱ケミカル株式会社 | Thermosetting resin composition, prepreg, and fiber-reinforced composite material and production method therefor |
WO2019221027A1 (en) * | 2018-05-17 | 2019-11-21 | 積水化学工業株式会社 | Liquid crystal display element sealing agent, vertical conduction material, and liquid crystal display element |
JP7432492B2 (en) | 2020-12-11 | 2024-02-16 | 日本化薬株式会社 | Liquid crystal sealant for liquid crystal dripping method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006010870A (en) | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | Sealing material for liquid crystal display element, vertically conducting material, and the liquid crystal display element |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3931355A (en) * | 1971-12-24 | 1976-01-06 | Bayer Aktiengesellschaft | Radical-initiated polymerization reactions and mixture |
DE2164482C3 (en) * | 1971-12-24 | 1980-07-31 | Bayer Ag, 5090 Leverkusen | Initiators for radical polymerization reactions |
JPS57142990A (en) * | 1981-02-27 | 1982-09-03 | Yuki Gosei Yakuhin Kogyo Kk | Silylating reagent |
US4393185A (en) * | 1981-06-02 | 1983-07-12 | Ciba-Geigy Corporation | Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds |
JPH0311083A (en) * | 1989-06-08 | 1991-01-18 | Toray Dow Corning Silicone Co Ltd | Silylating agent |
MXPA97008152A (en) * | 1997-10-23 | 2003-12-11 | Ct De Investigacion En Quimica | Method for the preparation of nanocomposites composed of dienic and thermoplastic elastomers. |
JP3874073B2 (en) * | 2001-04-06 | 2007-01-31 | 信越化学工業株式会社 | Method for producing chlorosilane compound having texyl group |
-
2010
- 2010-11-12 KR KR1020127013344A patent/KR101806152B1/en active IP Right Grant
- 2010-11-12 CN CN201080051849.1A patent/CN102612521B/en active Active
- 2010-11-12 WO PCT/JP2010/006651 patent/WO2011061910A1/en active Application Filing
- 2010-11-12 CN CN201410239409.9A patent/CN104031082A/en active Pending
- 2010-11-12 JP JP2011541804A patent/JP5783606B2/en active Active
- 2010-11-16 TW TW099139293A patent/TWI482777B/en active
- 2010-11-16 TW TW103121871A patent/TWI511974B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006010870A (en) | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | Sealing material for liquid crystal display element, vertically conducting material, and the liquid crystal display element |
Also Published As
Publication number | Publication date |
---|---|
TWI482777B (en) | 2015-05-01 |
JP5783606B2 (en) | 2015-09-24 |
CN102612521B (en) | 2015-10-07 |
JPWO2011061910A1 (en) | 2013-04-04 |
CN104031082A (en) | 2014-09-10 |
CN102612521A (en) | 2012-07-25 |
TW201129574A (en) | 2011-09-01 |
TW201437220A (en) | 2014-10-01 |
TWI511974B (en) | 2015-12-11 |
WO2011061910A1 (en) | 2011-05-26 |
KR20120085855A (en) | 2012-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101806152B1 (en) | Novel thermal radical generator, method for producing the same, liquid crystal sealing agent, and liquid crystal display cell | |
KR101618397B1 (en) | Liquid crystal sealing agent for liquid crystal dropping method and liquid crystal display cell using same | |
EP2236539B1 (en) | Polymerizable epoxy composition, and sealing material composition comprising the same | |
KR101064344B1 (en) | Liquid crystal sealing agent and liquid crystalline display cell using the same | |
JP5905014B2 (en) | Radiation curable composition | |
CN105700252B (en) | Liquid crystal sealing agent and liquid crystal display cell using the same | |
TWI826714B (en) | Epoxy resin composition | |
KR20100084162A (en) | Liquid crystal sealing agent and liquid crystal display cell using the same | |
JP6603004B1 (en) | Epoxy resin composition | |
WO2021033327A1 (en) | Epoxy resin composition | |
JP2019156965A (en) | Epoxy resin composition | |
JP6058890B2 (en) | Curable resin composition | |
KR20140047081A (en) | Liquid crystal sealant and liquid crystal display cell using same | |
JP2021031666A (en) | Epoxy resin composition | |
KR102187518B1 (en) | Epoxy resin composition | |
KR102129331B1 (en) | Epoxy resin composition | |
JPWO2021033327A1 (en) | Epoxy resin composition | |
WO2023286701A1 (en) | Curable resin composition | |
JP2023039242A (en) | Liquid crystal sealant for liquid crystal dropping method, and liquid crystal display panel using the same | |
KR20240032947A (en) | Curable Resin Composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |