TW201900836A - Curable composition for drip sealant applications - Google Patents

Curable composition for drip sealant applications Download PDF

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TW201900836A
TW201900836A TW107116867A TW107116867A TW201900836A TW 201900836 A TW201900836 A TW 201900836A TW 107116867 A TW107116867 A TW 107116867A TW 107116867 A TW107116867 A TW 107116867A TW 201900836 A TW201900836 A TW 201900836A
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aryl
cycloalkyl
alkylene
cycloalkylene
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雷司米沙 斯利達
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德商漢高智慧財產控股公司
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
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    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1483—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing sulfur
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    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
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    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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    • C07C2603/68—Dicyclopentadienes; Hydrogenated dicyclopentadienes
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    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/1339—Gaskets; Spacers; Sealing of cells

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  • Sealing Material Composition (AREA)

Abstract

The present invention relates to resins useful in adhesive and sealant compositions and particularly as one drop fill sealants for liquid crystal applications. In particular, the present invention permits assembly of LCD panels without migration of the sealant resin into the liquid crystal or vice versa during LCD assembly and/or curing of the resin.

Description

用於滴下式密封劑應用之可固化組合物Curable composition for drip sealant applications

本發明係關於適用於黏著劑及密封劑組合物中，且尤其適用作用於液晶應用之滴下式注入密封劑之樹脂。特定言之，本發明准許在LCD組合及/或樹脂固化期間在不使密封劑樹脂遷移至液晶中(或反之亦然)的情況下組合LCD面板。The present invention relates to resins for drop-injection sealants that are suitable for use in adhesive and sealant compositions, and particularly for liquid crystal applications. In particular, the present invention allows the LCD panel to be assembled without the sealant resin migrating into the liquid crystal (or vice versa) during LCD assembly and / or resin curing.

滴下式注入(「ODF」)方法正變成顯示器應用中LCD面板之組合中的主流方法，其替代了習知的真空注入技術，從而滿足了更快的製造方法需求。在ODF方法中，首先將密封劑分配於裝備電極之基板上以形成顯示器元件之框架，且將液晶滴入所描述框架內部。在組合之下一步驟中，將另一裝備電極之基板在真空下結合至其中。接著，密封劑藉由UV與熱方法之組合或僅藉由熱方法經歷固化過程。The drip injection ("ODF") method is becoming the mainstream method in the assembly of LCD panels in display applications, which has replaced the conventional vacuum injection technology, thereby meeting the demand for faster manufacturing methods. In the ODF method, a sealant is first dispensed on an electrode-equipped substrate to form a frame of a display element, and a liquid crystal is dropped inside the described frame. In the next step of the assembly, another electrode-equipped substrate is bonded thereto under vacuum. The sealant then undergoes a curing process by a combination of UV and thermal methods or only by thermal methods.

ODF方法之幾個問題為未固化狀態之密封劑材料在組合方法期間會與液晶(「LC」)接觸。由此可藉由將樹脂遷移至LC中或反之亦然或遷移離子型雜質而降低LC之電光特性。因此，用於密封劑材料之展示良好液晶抵抗性(較少污染)以及良好黏著性及防濕層特性之樹脂系統設計一直充滿挑戰性。Several problems with the ODF method are that the sealant material in the uncured state comes into contact with liquid crystal ("LC") during the combined method. The electro-optical characteristics of the LC can thus be reduced by migrating the resin into the LC or vice versa or migrating ionic impurities. Therefore, the design of resin systems for sealant materials that exhibit good liquid crystal resistance (less pollution), as well as good adhesion and moisture barrier properties has been challenging.

另外，因為通常使用與填充容積所需相比過量5%之LC，所以在真空組合方法期間，在密封劑經歷固化之前，在密封劑樹脂上存在LC之正壓。若樹脂不穩固，則在總成暴露時間期間LC可滲透至密封劑中。樹脂需要展現使LC污染或滲透降至最低之足夠LC抵抗性之結構特徵。通常，需要極性官能基，諸如羥基、脲、胺基甲酸酯、醯亞胺及芳基以達良好LC抵抗性。因此，用於密封劑材料之展示良好液晶抵抗性(較少污染)以及良好黏著性及防濕層特性之樹脂系統設計一直充滿挑戰性。In addition, because LC is generally used in excess of 5% compared to what is required to fill the volume, there is a positive pressure of LC on the sealant resin during the vacuum combination process before the sealant undergoes curing. If the resin is not stable, the LC can penetrate into the sealant during the assembly exposure time. Resins need to exhibit structural characteristics that are sufficiently LC resistant to minimize LC contamination or penetration. In general, polar functional groups such as hydroxyl, urea, carbamate, amidine, and aryl groups are required to achieve good LC resistance. Therefore, the design of resin systems for sealant materials that exhibit good liquid crystal resistance (less pollution), as well as good adhesion and moisture barrier properties has been challenging.

儘管過去已確定此等問題之某些解決方案(參見例如國際專利申請案第PCT/US2016/04611號、第PCT/CN2015/083966號及第PCT/CN2015/083963號)，但最終用戶需要替代技術以提供更廣泛的可能解決方案之選擇。Although some solutions to these issues have been identified in the past (see, e.g., International Patent Application Nos. PCT / US2016 / 04611, PCT / CN2015 / 083966, and PCT / CN2015 / 083963), end users need alternative technologies To provide a wider selection of possible solutions.

本發明係關於特有的樹脂及自其製得之ODF組合物。The present invention relates to a unique resin and an ODF composition prepared therefrom.

在本發明之一個態樣中，包括具有結構I之樹脂：其中Q可選自：R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基； R1 為H或甲基； X係選自CH2 、； n1 及n3 各自獨立地為0至10； n2 為1至10； Y為伸芳基、伸烷基、伸烯基、伸芳烷基、伸環烷基、伸二環烷基或伸三環烷基； Z為使芳基連接至氧之共價鍵、羰基或伸烴基連接基團；及 R2 為芳環上之取代基，其選自烷基、烷氧基、芳基氧基、鹵基、脂族基及芳族基。In one aspect of the present invention, a resin having a structure I is included: Where Q can be selected from: R is a polyvalent hydrocarbon-based linker selected from the group consisting of a linear or branched alkyl group, a linear or branched cycloalkyl group, an alkylene group, a cycloalkylene group, a bicycloalkyl group, a tricycloalkyl group, a straight chain Chain or branched chain alkylene, linear or branched chain cycloalkylene, linear or branched chain alkylene, arylene, aralkylene, arylbicycloalkyl, aryltricycloalkyl, Bicycloalkyl aryl, tricycloalkyl aryl, biphenyl benzene, cycloalkyl aryl, cycloheteroalkyl, or cycloheteroaryl; such alkyl, cycloalkyl, alkylene, Cycloalkylene, alkenyl, arylene, aralkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylaryl, biphenyl , Cycloalkyl extended aryl, extended heteroalkyl and extended heteroaryl may optionally contain O or S or hydroxyl; R 1 is H or methyl; X is selected from CH 2 , ; N 1 and n 3 are each independently 0 to 10; n 2 is 1 to 10; Y is an arylene, an alkylene, an alkenyl, an aralkyl, a cycloalkyl, a dicycloalkyl or extending tricycloalkyl; Z is an aryl group is attached to make a covalent bond of oxygen, a carbonyl group or a hydrocarbon extending linking group; and R 2 is a substituent on the aromatic ring selected from alkyl, alkoxy, aryl Oxy, halo, aliphatic and aromatic.

在本發明之另一態樣中，包括具有結構II之樹脂：其中Q可選自：R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基； R1 為H或甲基； X係選自CH2 、； n1 及n3 各自獨立地為0至10； n2 為1至10； Y為伸芳基、伸烷基、伸烯基、伸芳烷基、伸環烷基、伸二環烷基或伸三環烷基； Z為使芳基連接至硫之共價鍵或伸烴基；及 R2 為芳環上之取代基，其選自烷基、烷氧基、芳基氧基、鹵基、脂族基及芳族基。In another aspect of the present invention, a resin having a structure II is included: Where Q can be selected from: R is a polyvalent hydrocarbon-based linker selected from the group consisting of a linear or branched alkyl group, a linear or branched cycloalkyl group, an alkylene group, a cycloalkylene group, a bicycloalkyl group, a tricycloalkyl group, a straight chain Chain or branched chain alkylene, linear or branched chain cycloalkylene, linear or branched chain alkylene, arylene, aralkylene, arylbicycloalkyl, aryltricycloalkyl, Bicycloalkyl aryl, tricycloalkyl aryl, biphenyl benzene, cycloalkyl aryl, cycloheteroalkyl, or cycloheteroaryl; such alkyl, cycloalkyl, alkylene, Cycloalkylene, alkenyl, arylene, aralkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylaryl, biphenyl , Cycloalkyl extended aryl, extended heteroalkyl and extended heteroaryl may optionally contain O or S or hydroxyl; R 1 is H or methyl; X is selected from CH 2 , ; N 1 and n 3 are each independently 0 to 10; n 2 is 1 to 10; Y is an arylene, an alkylene, an alkenyl, an aralkyl, a cycloalkyl, a dicycloalkyl or Tricycloalkyl; Z is a covalent bond or a hydrocarbyl that connects aryl to sulfur; and R 2 is a substituent on the aromatic ring, which is selected from alkyl, alkoxy, aryloxy, halo , Aliphatic and aromatic groups.

在本發明之另一態樣中，包括具有結構III之樹脂：其中Y1 及Y2 可相同或不同，且為選自以下之可聚合官能基：乙烯基苯甲基、乙烯基芳基、(甲基)丙烯酸酯基、烯丙基、苯烯丙基及縮水甘油基； X1 及X2 為使Y1 及Y2 基團連接至氮之共價鍵，或可選自伸烷基或伸環烷基中之一或多者，其各自可視情況含有一或多個雜原子諸如氧、硫或氮； R1 為環狀脲環上之取代基，其選自烷基、環烷基、芳基、芳烷基；及 n = 1-10。In another aspect of the present invention, a resin having a structure III is included: Wherein Y 1 and Y 2 may be the same or different, and are polymerizable functional groups selected from the group consisting of vinylbenzyl, vinylaryl, (meth) acrylate, allyl, phenallyl, and Glycidyl; X 1 and X 2 are covalent bonds connecting Y 1 and Y 2 groups to nitrogen, or may be selected from one or more of alkylene or cycloalkylene, each of which may contain one or more heteroatoms, such as oxygen, sulfur or nitrogen; R 1 is a substituent on the ring of the cyclic urea group selected from alkyl, cycloalkyl, aryl, aralkyl; and n = 1-10.

在本發明之另一態樣中，包括具有結構IV之樹脂：其中X為選自O、S或N之雜原子；或選自酯、胺基甲酸酯、脲、醯亞胺、碳酸酯之官能基；或選自以下之基團：視情況在任何位置含有羥基官能基或在任何位置含有一或多個選自O、S、N之原子的伸烷基、伸環烷基、氧基伸烷基；及 R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基；或R亦可為聚矽氧或矽氧烷以及以上提及之多價連接子中之一或多者。In another aspect of the present invention, a resin having a structure IV is included: Where X is a heteroatom selected from O, S or N; or a functional group selected from the group consisting of an ester, a urethane, urea, amidine, carbonate; or a group selected from the group consisting of: An alkylene group, a cycloalkylene group, an oxyalkylene group containing a hydroxyl functional group or containing one or more atoms selected from O, S, N at any position; and R is a polyvalent hydrocarbon group linker selected from: Linear or branched alkyl, linear or branched cycloalkyl, extended alkyl, extended cycloalkyl, extended bicycloalkyl, extended tricycloalkyl, linear or branched extended alkyl, straight or branched Chain cycloalkyl, straight or branched chain alkylene, arylene, aralkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkyl aryl, tricycloalkyl aryl Base, biphenyl, cycloalkyl, arylene, heterocycloalkyl, or heterocycloaryl; these alkyl, cycloalkyl, cycloalkyl, cycloalkyl, cycloalkylene, cycloalkylene , Aralkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylaryl, biphenylene, cycloalkylaryl, heterocycloalkyl Span Aryl group optionally containing O or S, or hydroxyl; or R may also be a poly silicon or silicon oxide, and the above mentioned one alumoxane as much or more divalent linkers.

本發明之樹脂適用於多種應用，包括黏著劑及密封劑。本發明樹脂之一種特定有效的用途為作為ODF密封劑用於組合LCD面板。The resin of the present invention is suitable for a variety of applications, including adhesives and sealants. A particularly effective use of the resin of the present invention is as an ODF sealant for a combined LCD panel.

本發明提供適用於製備可用於ODF密封劑之可固化組合物的樹脂(其亦包括寡聚物及聚合物)。The present invention provides resins (which also include oligomers and polymers) suitable for use in preparing curable compositions useful in ODF sealants.

適用於合成本文中所描述之本發明混合樹脂的縮水甘油醚/酯化合物不受特定限制，且市場中可獲得之環氧化合物之實例包括：雙酚A類型環氧樹脂，諸如Epikote 828EL及Epikote 1004 (均由Japan Epoxy Resin Co., Ltd.製造)；雙酚F類型環氧樹脂，諸如Epikote 806及Epikote 4004 (均由Japan Epoxy Resin Co., Ltd.製造)；雙酚S類型環氧樹脂，諸如Epiclon EXA1514 (由Dainippon Ink and Chemicals Inc.製造)及由Shin A T&C製造之SE 650；2,2'-二烯丙基雙酚A類型環氧樹脂，諸如RE-81 ONM (由Nippon Kayaku Co., Ltd.製造)；氫化之雙酚類型環氧樹脂，諸如Epiclon EXA7015 (由Dainippon Ink and Chemicals Inc.製造)；環氧丙烷加成之雙酚A類型環氧樹脂，諸如EP-4000S (由ADEKA Corporation製造)；間苯二酚類型環氧樹脂，諸如EX-201 (由Nagase ChemteX Corporation製造)；聯苯類型環氧樹脂，諸如Epikote YX-4000H (由Japan Epoxy Resin Co., Ltd.製造)；硫化物類型環氧樹脂，諸如YSLV 50TE (由Tohto Kasei Co., Ltd.製造)；醚類型環氧樹脂，諸如YSLV 80DE (由Tohto Kasei Co., Ltd.製造)；二環戊二烯類型環氧樹脂，諸如EP-4088S及EP4088L (由ADEKA Corporation製造)；萘類型環氧樹脂，諸如SE-80、SE-90，其由Shin A T&C製造；縮水甘油基胺類型環氧樹脂，諸如Epikote 630 (由Japan Epoxy Resin Co., Ltd.製造)、Epiclon 430 (由Dainippon Ink and Chemicals Inc.製造)及TETRAD-X (由Mitsubishi Gas Chemical Company Inc.製造)；烷基多元醇類型環氧樹脂，諸如ZX-1542 (由Tohto Kasei Co., Ltd.製造)、Epiclon 726 (由Dainippon Ink and Chemicals Inc.製造)、Epolight 8OMFA (由Kyoeisha Chemical Co., Ltd.製造)及Denacol EX-611 (由Nagase ChemteX Corporation製造)；橡膠改質類型環氧樹脂，諸如YR-450、YR-207 (均由Tohto Kasei Co., Ltd.製造)及Epolead PB (由Daicel Chemical Industries, Ltd.製造)；縮水甘油酯化合物，諸如Denacol EX-147 (由Nagase ChemteX Corporation製造)；雙酚A類型環氧硫化物樹脂，諸如Epikote YL-7000 (由Japan Epoxy Resin Co., Ltd.製造)；及其他化合物，諸如YDC-1312、YSLV-BOXY、YSLV-90CR (均由Tohto Kasei Co., Ltd.製造)、XAC4151 (由Asahi Kasei Corporation製造)、Epikote 1031、Epikote 1032 (均由Japan Epoxy Resin Co., Ltd.製造)、EXA-7120 (由Dainippon Ink and Chemicals Inc.製造)、TEPIC (由Nissan Chemical Industries, Ltd.製造)。市售酚清漆型酚醛樹脂類型環氧化合物之實例包括Epiclon N-740、N-770、N-775 (均由Dainippon Ink and Chemicals Inc.製造)、Epikote 152、Epikote 154 (均由Japan Epoxy Resin Co., Ltd.製造)及其類似物。市售甲酚清漆型酚醛樹脂類型環氧化合物之實例包括Epiclon N-660、N-665、N-670、N-673、N-680、N-695、N-665-EXP及N-672-EXP (均由Dainippon Ink and Chemicals Inc.製造)；市售聯苯清漆型酚醛樹脂類型環氧化合物之實例為NC-3000P (由Nippon Kayaku Co., Ltd.製造)；市售三酚清漆型酚醛樹脂類型環氧化合物之實例包括EP1032S50及EP1032H60 (均由Japan Epoxy Resin Co., Ltd.製造)；市售二環戊二烯清漆型酚醛樹脂類型環氧化合物之實例包括XD-1000-L (由Nippon Kayaku Co., Ltd.製造)及HP-7200 (由Dainippon Ink and Chemicals Inc.製造)；市售雙酚A類型環氧化合物之實例包括Epikote 828、Epikote 834、Epikote 1001、Epikote 1004 (均由Japan Epoxy Resin Co., Ltd.製造)、Epiclon 850、Epiclon 860及Epiclon 4055 (均由Dainippon Ink and Chemicals Inc.製造)；市售雙酚F類型環氧化合物之實例包括Epikote 807 (由Japan Epoxy Resin Co., Ltd.製造)及Epiclon 830 (由Dainippon Ink and Chemicals Inc.製造)；市售2,2'-二烯丙基雙酚A類型環氧化合物之實例為RE-81ONM (由Nippon Kayaku Co., Ltd.製造)；市售氫化之雙酚型環氧化合物之實例為ST-5080 (由Tohto Kasei Co., Ltd.製造)；市售聚氧丙烯雙酚A類型環氧化合物之實例包括EP-4000及EP-4005 (均由ADEKA Corporation製造)；及其類似物。HP4032及Epiclon EXA-4700 (均由Dainippon Ink and Chemicals Inc.製造)；酚清漆型酚醛樹脂類型環氧樹脂，諸如Epiclon N-770 (由Dainippon Ink and Chemicals Inc.製造)；鄰甲酚清漆型酚醛樹脂類型環氧樹脂，諸如Epiclon N-670-EXP-S (由Dainippon Ink and Chemicals Inc.製造)；二環戊二烯清漆型酚醛樹脂類型環氧樹脂，諸如Epiclon HP7200 (由Dainippon Ink and Chemicals Inc.製造)；聯苯清漆型酚醛樹脂類型環氧樹脂，諸如NC-3000P (由Nippon Kayaku Co., Ltd.製造)；萘酚清漆型酚醛樹脂類型環氧樹脂，諸如ESN-165S (由Tohto Kasei Co.製造)。The glycidyl ether / ester compound suitable for synthesizing the mixed resin of the present invention described herein is not particularly limited, and examples of epoxy compounds available in the market include: bisphenol A type epoxy resins such as Epikote 828EL and Epikote 1004 (both manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol F type epoxy resins, such as Epikote 806 and Epikote 4004 (both manufactured by Japan Epoxy Resin Co., Ltd.); bisphenol S type epoxy resin , Such as Epiclon EXA1514 (manufactured by Dainippon Ink and Chemicals Inc.) and SE 650 manufactured by Shin A T &C; 2,2'-diallyl bisphenol A type epoxy resin, such as RE-81 ONM (manufactured by Nippon Kayaku Co., Ltd.); hydrogenated bisphenol type epoxy resins, such as Epiclon EXA7015 (manufactured by Dainippon Ink and Chemicals Inc.); propylene oxide-added bisphenol A type epoxy resins, such as EP-4000S ( (Manufactured by ADEKA Corporation); Resorcinol-type epoxy resin, such as EX-201 (manufactured by Nagase ChemteX Corporation); Biphenyl-type epoxy resin, such as Epikote YX-4000H (manufactured by Japan Epoxy Resin Co., Ltd.) ); Sulfide type epoxy Resin, such as YSLV 50TE (manufactured by Tohto Kasei Co., Ltd.); ether type epoxy resin, such as YSLV 80DE (manufactured by Tohto Kasei Co., Ltd.); dicyclopentadiene type epoxy resin, such as EP -4088S and EP4088L (manufactured by ADEKA Corporation); naphthalene type epoxy resins, such as SE-80, SE-90, manufactured by Shin A T &C; glycidylamine type epoxy resins, such as Epikote 630 (manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 430 (manufactured by Dainippon Ink and Chemicals Inc.), and TETRAD-X (manufactured by Mitsubishi Gas Chemical Company Inc.); alkyl polyol type epoxy resins, such as ZX-1542 (manufactured by Tohto Kasei Co., Ltd.), Epiclon 726 (manufactured by Dainippon Ink and Chemicals Inc.), Epolight 8OMFA (manufactured by Kyoeisha Chemical Co., Ltd.), and Denacol EX-611 (manufactured by Nagase ChemteX Corporation); rubber Modified epoxy resins such as YR-450, YR-207 (all manufactured by Tohto Kasei Co., Ltd.) and Epolead PB (made by Daicel Chemical Industries, Ltd.); glycidyl ester compounds such as Denacol EX- 147 (manufactured by Nagase ChemteX Corporation ); Bisphenol A type epoxy sulfide resins such as Epikote YL-7000 (manufactured by Japan Epoxy Resin Co., Ltd.); and other compounds such as YDC-1312, YSLV-BOXY, YSLV-90CR (all by Tohto Kasei Co., Ltd.), XAC4151 (manufactured by Asahi Kasei Corporation), Epikote 1031, Epikote 1032 (all manufactured by Japan Epoxy Resin Co., Ltd.), EXA-7120 (manufactured by Dainippon Ink and Chemicals Inc.) TEPIC (manufactured by Nissan Chemical Industries, Ltd.). Examples of commercially available novolac-type phenol resin-type epoxy compounds include Epiclon N-740, N-770, N-775 (all manufactured by Dainippon Ink and Chemicals Inc.), Epikote 152, Epikote 154 (all manufactured by Japan Epoxy Resin Co. ., Ltd.) and the like. Examples of commercially available cresol novolac type epoxy compounds include Epiclon N-660, N-665, N-670, N-673, N-680, N-695, N-665-EXP, and N-672- EXP (both manufactured by Dainippon Ink and Chemicals Inc.); an example of a commercially available biphenyl varnish type phenol resin type epoxy compound is NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); a commercially available triphenol varnish type phenol Examples of the resin type epoxy compound include EP1032S50 and EP1032H60 (both manufactured by Japan Epoxy Resin Co., Ltd.); examples of commercially available dicyclopentadiene varnish type phenol resin type epoxy compounds include XD-1000-L (by Nippon Kayaku Co., Ltd.) and HP-7200 (manufactured by Dainippon Ink and Chemicals Inc.); examples of commercially available bisphenol A type epoxy compounds include Epikote 828, Epikote 834, Epikote 1001, Epikote 1004 (all manufactured by Japan Epoxy Resin Co., Ltd.), Epiclon 850, Epiclon 860, and Epiclon 4055 (all manufactured by Dainippon Ink and Chemicals Inc.); Examples of commercially available bisphenol F type epoxy compounds include Epikote 807 (manufactured by Japan Epoxy Resin Co., Ltd.) and Epiclon 830 (by Dainippon Ink and Che micals Inc.); an example of a commercially available 2,2'-diallyl bisphenol A type epoxy compound is RE-81ONM (manufactured by Nippon Kayaku Co., Ltd.); a commercially available hydrogenated bisphenol type ring Examples of oxygen compounds are ST-5080 (manufactured by Tohto Kasei Co., Ltd.); examples of commercially available polyoxypropylene bisphenol A type epoxy compounds include EP-4000 and EP-4005 (both are manufactured by ADEKA Corporation); And its analogs. HP4032 and Epiclon EXA-4700 (both manufactured by Dainippon Ink and Chemicals Inc.); novolac-type phenol resin epoxy resins, such as Epiclon N-770 (manufactured by Dainippon Ink and Chemicals Inc.); o-cresol novolac phenol Resin type epoxy resin such as Epiclon N-670-EXP-S (manufactured by Dainippon Ink and Chemicals Inc.); dicyclopentadiene varnish type phenol resin epoxy resin such as Epiclon HP7200 (manufactured by Dainippon Ink and Chemicals Inc. .Manufactured); Biphenyl varnish type phenol resin type epoxy resin, such as NC-3000P (manufactured by Nippon Kayaku Co., Ltd.); Naphthol type phenol resin type epoxy resin, such as ESN-165S (manufactured by Tohto Kasei Co.).

適用於合成本發明樹脂之脂環族環氧化合物之實例包括具有至少一個脂環之多元醇之聚縮水甘油醚及藉由對含環己烯環或環戊烯環化合物進行環氧化獲得之含環氧環己烯或環氧環戊烯化合物。特定實例包括氫化雙酚A二縮水甘油醚、3,4-環氧基環己烷甲酸3,4-環氧環己基甲酯、環己基-3,4-環氧基-1-甲基環己烷甲酸3,4-環氧基-1-甲酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧基-環己烷甲酸酯、3,4-環氧基-3-甲基環己烷甲酸3,4-環氧基-3-甲基環己基甲酯、3,4-環氧基-5-甲基環己烷甲酸3,4-環氧基-5-甲基環己基甲酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧基)環己烷-間二噁烷、己二酸雙(3,4-環氧環己基甲基)酯、甲酸3,4-環氧基-6-甲基環己酯、亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷甲酸酯)、二辛基環氧基六氫鄰苯二甲酸酯及環氧六氫鄰苯二甲酸二2-乙基己酯。Examples of the alicyclic epoxy compound suitable for synthesizing the resin of the present invention include a polyglycidyl ether of a polyhydric alcohol having at least one alicyclic ring and a compound obtained by epoxidizing a cyclohexene ring-containing or cyclopentene ring-containing compound. Epoxy cyclohexene or epoxy cyclopentene compound. Specific examples include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester, cyclohexyl-3,4-epoxy-1-methyl ring Hexanoic acid 3,4-epoxy-1-methyl ester, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxy-cyclohexanecarboxylic acid Ester, 3,4-epoxy-3-methylcyclohexanecarboxylic acid, 3,4-epoxy-3-methylcyclohexyl methyl ester, 3,4-epoxy-5-methylcyclohexane Formic acid 3,4-epoxy-5-methylcyclohexyl methyl ester, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-m-bis Oxane, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl formate, methylene bis (3,4-epoxy ring) Hexane), dicyclopentadiene diepoxide, ethylidene bis (3,4-epoxycyclohexane formate), dioctyl epoxy hexahydrophthalate, and cyclic Di-2-ethylhexyl hexahydrophthalate.

一些此等脂環族環氧樹脂可以以下商品名稱購得：UVR-6100、UVR-6105、UVR-6110、UVR-6128及UVR-6200 (Union Carbide Corporation之產品)；CELLOXIDE 2021、 CELLOXIDE 2021P、CELLOXIDE 2081、CELLOXIDE 2083、CELLOXIDE 2085、CELLOXIDE 2000、CELLOXIDE 3000、CYCLMER A200、CYCLMER M100、CYCLMER M101、EPOLEAD GT-301、EPOLEAD GT-302、EPOLEAD 401、EPOLEAD 403、ETHB及EPOLEADHD 300 (來自Daicel Chemical Industries, Ltd.)；KRM-2110及KRM-2199 (來自ADEKA Corporation)。Some of these alicyclic epoxy resins are available under the following trade names: UVR-6100, UVR-6105, UVR-6110, UVR-6128, and UVR-6200 (products of Union Carbide Corporation); CELLOXIDE 2021, CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, CELLOXIDE 2000, CELLOXIDE 3000, CYCLMER A200, CYCLMER M100, CYCLMER M101, EPOLEAD GT-301, EPOLEAD GT-302, EPOLEAD 401, EPOLEAD 403, ETHB, and EPOLEADHD 300 (from Daicel Chemical Industries, Ltd. .); KRM-2110 and KRM-2199 (from ADEKA Corporation).

除本發明之可固化聚合物以外，ODF密封劑組合物亦可包括自由基引發劑(其可藉由暴露於高溫條件或電磁波譜輻射觸發)及固化劑。在存在環氧化物環之實施例中，亦可採用潛在環氧基固化劑。In addition to the curable polymer of the present invention, the ODF sealant composition may also include a free radical initiator (which can be triggered by exposure to high temperature conditions or electromagnetic spectrum radiation) and a curing agent. In embodiments where an epoxide ring is present, a latent epoxy curing agent may also be used.

適用的熱自由基引發劑包括有機過氧化物及偶氮化合物，其實例包括：偶氮自由基引發劑，諸如AIBN (偶氮二異丁腈)、2,2'-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2-丙酸乙二甲酯)、2,2'-偶氮雙(2-甲基丁腈)、1,1,1-偶氮雙(環己烷-1-甲腈)、2,2'-偶氮雙[N-(2-丙烯基)-2-甲基丙醯胺]；過氧化二烷基自由基引發劑，諸如1,1-二(丁基過氧基-3,3,5-三甲基環己烷)；過酸烷基酯自由基引發劑，諸如TBPEH (過-2-乙基己酸第三丁鹽)；過氧化二醯基自由基引發劑，諸如過氧化苯甲醯；過氧二碳酸酯自由基引發劑，諸如過碳酸乙酯己酯；過氧化酮引發劑，諸如過氧化甲基乙基酮、雙(過氧化第三丁基)二異丙基苯、第三丁基過苯甲酸酯、第三丁基過氧新癸酸及其組合。Suitable thermal radical initiators include organic peroxides and azo compounds, examples of which include: azo radical initiators such as AIBN (azobisisobutyronitrile), 2,2'-azobis (4- Methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (ethylene 2-propionate Methyl ester), 2,2'-azobis (2-methylbutyronitrile), 1,1,1-azobis (cyclohexane-1-carbonitrile), 2,2'-azobis [ N- (2-propenyl) -2-methylpropanamide]; dialkyl peroxide initiators such as 1,1-bis (butylperoxy-3,3,5-trimethyl Cyclohexane); alkyl peracid radical initiators, such as TBPHE (tert-butyl per-2-ethylhexanoate); difluorenyl peroxide radical initiators, such as benzamidine peroxide; Oxydicarbonate free radical initiators, such as ethyl percarbonate hexyl ester; ketone peroxide initiators, such as methyl ethyl ketone peroxide, bis (third butyl peroxide) diisopropylbenzene, third butyl Methyl perbenzoate, third butyl peroxyneodecanoic acid, and combinations thereof.

有機過氧化物自由基引發劑之其他實例包括過氧化二月桂醯基、2,2-二(4,4-二(第三丁基過氧基)環己基)丙烷、二(第三丁基過氧基異丙基)苯、過氧二碳酸二(4-第三丁基環己酯)、過氧二碳酸三十二烷酯、過氧二碳酸二肉豆蔻酯、2,3-二甲基-2,3-二苯基丁烷、過氧化二異丙苯、過氧化二苯甲醯、過氧二碳酸二異丙酯、單過氧順丁烯二酸第三丁酯、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、碳酸第三丁基過氧基2-乙基己酯、過氧基-2-乙基己酸第三戊酯、過氧特戊酸第三戊酯、碳酸第三戊基過氧基2-乙基己酯、2,5-二甲基-2,5-二(2-乙基己醯基過氧基)己烷2,5-二甲基-2,5-二(第三丁基過氧基)己-3、過氧二碳酸二(3-甲氧基丁酯)、過氧化二異丁醯基、過氧基-2-乙基己酸第三丁酯(TRIGONOX 21 S)、1,1-二(第三丁基過氧基)環己烷、過氧新癸酸第三丁酯、過氧特戊酸第三丁酯、過氧新庚酸第三丁酯、過氧基二乙基乙酸第三丁酯、1,1-二(第三丁基過氧基)-3,3,5-三甲基環己烷、3,6,9-三乙基-3,6,9-三甲基-1,4,7-三過氧壬烷、二(3,5,5-三甲基己醯基)過氧化物、己酸第三丁基過氧基-3,5,5-三甲酯、過氧基-2-乙基己酸1,1,3,3-四甲基丁酯、過氧新癸酸1,1,3,3-四甲基丁酯、己酸第三丁基過氧基-3,5,5-三甲酯、過氧新癸酸異丙苯酯、過氧化二第三丁基、碳酸第三丁基過氧基異丙酯、過氧苯甲酸第三丁酯、過氧二碳酸二(2-乙基己酯)、過氧基乙酸第三丁酯、氫過氧化異丙基異丙苯基、過氧化第三丁基異丙苯及其組合。Other examples of organic peroxide radical initiators include dilauryl peroxide, 2,2-bis (4,4-bis (third butylperoxy) cyclohexyl) propane, bis (third butyl) Peroxyisopropyl) benzene, bis (4-tert-butylcyclohexyl) peroxydicarbonate, dodecyl peroxydicarbonate, dimyristyl peroxydicarbonate, 2,3-di Methyl-2,3-diphenylbutane, dicumyl peroxide, dibenzoylperoxide, diisopropyl peroxydicarbonate, tert-butyl monoperoxymaleate, 2 , 5-dimethyl-2,5-bis (third butylperoxy) hexane, third butylperoxy carbonate 2-ethylhexyl, peroxy-2-ethylhexanoic acid Tripentyl ester, tripentyl peroxypivalate, tertiary amyl peroxy 2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis (2-ethylhexyl) Peroxy) hexane 2,5-dimethyl-2,5-di (third butylperoxy) hex-3, bis (3-methoxybutyl) peroxydicarbonate, diperoxide Isobutylamyl, tert-butyl peroxy-2-ethylhexanoate (TRIGONOX 21 S), 1,1-bis (tert-butylperoxy) cyclohexane, tert-butyl peroxyneodecanoate , Tert-butyl pervalproate, neoheptyl peroxy Third butyl ester, third butyl peroxydiethylacetate, 1,1-bis (third butylperoxy) -3,3,5-trimethylcyclohexane, 3,6,9 -Triethyl-3,6,9-trimethyl-1,4,7-triperoxynonane, bis (3,5,5-trimethylhexyl) peroxide, hexanoic acid third Butylperoxy-3,5,5-trimethyl ester, peroxy-2-ethylhexanoic acid 1,1,3,3-tetramethylbutyl ester, peroxyneodecanoic acid 1,1,3 , 3-tetramethylbutyl ester, tert-butylperoxy-3,5,5-trimethyl hexanoate, cumene peroxyneodecanoate, tertiary butyl peroxide, tertiary carbonic acid Butylperoxy isopropyl ester, third butyl peroxybenzoate, bis (2-ethylhexyl) peroxydicarbonate, third butyl peroxyacetate, cumene hydroperoxide Base, third butyl cumene peroxide, and combinations thereof.

通常需要分解速率較高之熱自由基引發劑，因為由此可在常見固化溫度(諸如在80至130℃之範圍內)下更易於產生自由基，且得到較快固化速度，其可降低液態樹脂與液晶之間的接觸時間，且減少液晶污染。另一方面，若引發劑之分解速率過高，則室溫下之黏度穩定性將受到影響，且因此減小密封劑之使用期限。Thermal free radical initiators with higher decomposition rates are usually required, as they can more easily generate free radicals at common curing temperatures, such as in the range of 80 to 130 ° C, and result in faster curing rates, which can reduce liquidity Contact time between resin and liquid crystal, and reduce liquid crystal pollution. On the other hand, if the decomposition rate of the initiator is too high, the viscosity stability at room temperature will be affected, and thus the life of the sealant will be reduced.

表現指定溫度下引發劑之分解速率的適宜方式係關於其半衰期，亦即分解一半初始存在之過氧化物所要的時間。為比較不同引發劑之反應性，使用具有10小時半衰期(「T1/2 」)之各引發劑所處的溫度。最具反應性(最快)引發劑應為具有最低10 h T1/2 溫度之引發劑。A suitable way to represent the decomposition rate of an initiator at a given temperature is with regard to its half-life, that is, the time required to decompose half of the peroxide originally present. To compare the reactivity of different initiators, the temperature at which each initiator has a 10-hour half-life ("T1 / 2 ") is used. The most reactive (fastest) initiator should be the one with the lowest 10 h T 1/2 temperature.

在本發明中，具有30至80℃之10 h T1/2 溫度的熱自由基引發劑較佳，且具有40至70℃之10 h T1/2 溫度的熱自由基引發劑更佳。In the present invention, a thermal radical initiator having a 10 h T 1/2 temperature of 30 to 80 ° C is preferred, and a thermal radical initiator having a 10 h T 1/2 temperature of 40 to 70 ° C is more preferred.

為平衡組合物之反應性及黏度穩定性，用於樹脂組合物之熱自由基引發劑以本發明之可固化組合物中100重量份本發明樹脂計通常呈0.01至3重量份，且較佳0.5至2重量份之量。In order to balance the reactivity and viscosity stability of the composition, the thermal radical initiator used in the resin composition is usually 0.01 to 3 parts by weight based on 100 parts by weight of the curable composition of the invention, and preferably An amount of 0.5 to 2 parts by weight.

適用的UV自由基引發劑包括可購自CIBA及BASF之Norrish I型分裂光引發劑。此等光引發劑在調配物中係以0.1-5重量%，更佳以約0.2至3重量%之量使用。Suitable UV free radical initiators include Norrish Type I split photoinitiators available from CIBA and BASF. These photoinitiators are used in the formulation in an amount of 0.1 to 5% by weight, more preferably in an amount of about 0.2 to 3% by weight.

適用的環氧基固化劑之實例包括(但不限於)獲自Ajinomoto Fine-Techno Co., Inc.之Ajicure系列硬化劑；獲自Air產品之Amicure系列固化劑及獲自Mitsubushi Chemical之JERCURE™產品。此等固化劑或硬化劑或促進劑係按總組合物之重量計以約1%至約50%，更佳按總組合物之重量計以約5%至約20%之量使用。Examples of suitable epoxy-based curing agents include, but are not limited to, Ajicure series hardeners obtained from Ajinomoto Fine-Techno Co., Inc .; Amicure series hardeners obtained from Air products; and JERCURE ™ products obtained from Mitsubushi Chemical . These curing agents or hardeners or accelerators are used in an amount of about 1% to about 50% by weight of the total composition, and more preferably in an amount of about 5% to about 20% by weight of the total composition.

可固化組合物可視情況按需要含有能夠光聚合反應之另一組分，諸如乙烯基醚化合物。另外，可固化組合物可進一步包含添加劑、樹脂組分及其類似物以在固化之後改良或改質諸如以下特性：流動性、分配或列印特性、儲存特性、固化特性及物理特性。The curable composition may optionally contain another component capable of photopolymerization, such as a vinyl ether compound, as necessary. In addition, the curable composition may further include additives, resin components, and the like to improve or modify properties such as flowability, distribution or printing characteristics, storage characteristics, curing characteristics, and physical characteristics after curing.

組合物按需要可含有多種添加劑，例如有機或無機填充劑、搖變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑(諸如顏料及染料)、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、調平劑及其類似物；然而不限於此等添加劑。特定言之，組合物較佳包含選自由以下組成之群的添加劑：有機或無機填充劑、搖變劑及矽烷偶合劑。此等添加劑可按總組合物之重量計以約0.1%至約50%，更佳按總組合物之重量以約2%至約10%之量存在。The composition may contain various additives as needed, such as organic or inorganic fillers, shakers, silane coupling agents, diluents, modifiers, colorants (such as pigments and dyes), surfactants, preservatives, stabilizers, Plasticizers, lubricants, defoamers, levelers, and the like; however, they are not limited to these additives. In particular, the composition preferably contains an additive selected from the group consisting of an organic or inorganic filler, a shaker, and a silane coupling agent. These additives may be present in an amount of about 0.1% to about 50% by weight of the total composition, and more preferably in an amount of about 2% to about 10% by weight of the total composition.

填充劑可包括無機填充劑，諸如二氧化矽、矽藻土、氧化鋁、氧化鋅、氧化鐵、氧化鎂、氧化錫、氧化鈦、氫氧化鎂、氫氧化鋁、碳酸鎂、硫酸鋇、石膏、矽酸鈣、滑石、玻璃珠粒、絹雲母活化之白土、膨潤土、氮化鋁、氮化矽及其類似物；同時有機填充劑，諸如甲基丙烯酸聚(甲基)酯、甲基丙烯酸聚(乙基)酯、甲基丙烯酸聚(丙基)酯、甲基丙烯酸聚(丁基)酯、丁基丙烯酸酯-甲基丙烯酸-甲基丙烯酸(甲基)酯共聚物、聚丙烯腈、聚苯乙烯、聚丁二烯、聚戊二烯、聚異戊二烯、聚異丙烯及其類似物。可單獨或組合使用此等填充劑。此等填充劑可按總組合物之重量計以約1%至約80%，更佳約5%至約30%之量存在。The filler may include an inorganic filler such as silica, diatomaceous earth, alumina, zinc oxide, iron oxide, magnesium oxide, tin oxide, titanium oxide, magnesium hydroxide, aluminum hydroxide, magnesium carbonate, barium sulfate, gypsum , Calcium silicate, talc, glass beads, sericite activated clay, bentonite, aluminum nitride, silicon nitride and the like; and organic fillers such as poly (meth) methacrylate, methacrylic acid Poly (ethyl) ester, poly (propyl) methacrylate, poly (butyl) methacrylate, butyl acrylate-methacrylic acid- (meth) acrylate copolymer, polyacrylonitrile , Polystyrene, polybutadiene, polyprene, polyisoprene, polyisopropylene, and the like. These fillers may be used alone or in combination. These fillers may be present in an amount of from about 1% to about 80%, more preferably from about 5% to about 30% by weight of the total composition.

搖變劑可包括(但不限於)滑石、煙霧狀二氧化矽、超細表面處理之碳酸鈣、細粒氧化鋁、板狀氧化鋁；層狀化合物，諸如蒙脫石，針狀化合物，諸如硼酸鋁鬚晶，及其類似物。其中，特別需要滑石、煙霧狀二氧化矽及精細氧化鋁。此等藥劑可按總組合物之重量計以約1%至約50%，更佳約1%至約30%之量存在。Shaking agents may include, but are not limited to, talc, fumed silica, ultra-fine surface-treated calcium carbonate, fine-grained alumina, and plate-shaped alumina; layered compounds such as montmorillonite, acicular compounds such as Aluminum borate whiskers, and the like. Among them, talc, fumed silica and fine alumina are particularly needed. These agents may be present in an amount of about 1% to about 50%, more preferably about 1% to about 30%, by weight of the total composition.

矽烷偶合劑可包括(但不限於)γ-胺基丙基三乙氧基矽烷、γ-巰基丙基三甲氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷及其類似物。Silane coupling agents may include, but are not limited to, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-shrink Glyceryloxypropyltrimethoxysilane and its analogs.

根據本發明之可固化組合物可藉由藉助於例如混合器(諸如具有攪拌葉片之攪拌器及三輥研磨機)混合前述各組分而獲得。組成物在環境下為液體，其在1.5 s-1剪切速率下的黏度為200-400 Pa.S(在25℃下)。The curable composition according to the present invention can be obtained by mixing the aforementioned components by means of, for example, a mixer such as a mixer with a stirring blade and a three-roll mill. The composition is a liquid under the environment and has a viscosity of 200-400 Pa.S (at 25 ° C) at a shear rate of 1.5 s-1.

本發明亦係關於一種用於藉助於液晶滴下式注入方法製造在第一基板與第二基板之間具有液晶層之液晶顯示器之方法。該方法包含以下步驟： (a)將本發明中所描述之可固化組合物塗覆於該第一基板之表面周邊的密封區域上； (b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上； (c)將該第二基板覆蓋於該第一基板上； (d)藉由UV照射該可固化組合物進行部分固化，及 (e)藉由加熱該可固化組合物進行最終固化。The present invention also relates to a method for manufacturing a liquid crystal display having a liquid crystal layer between a first substrate and a second substrate by means of a liquid crystal dropping injection method. The method includes the following steps: (a) coating the curable composition described in the present invention on a sealed area around the surface of the first substrate; (b) dropping liquid crystals on the surface of the first substrate On the central area surrounded by the sealing area; (c) covering the second substrate on the first substrate; (d) partially curing the curable composition by UV irradiation, and (e) heating the The cured composition undergoes final curing.

本發明中所用之第一基板及第二基板通常為透明玻璃基板。一般而言，在兩個基板之相反表面中之至少一者上形成透明電極、主動矩陣元件(諸如TFT)、配向膜、彩色過濾器及其類似物。此等構造可根據LCD之類型進行修改。根據本發明之製造方法可認為可應用於任何類型的LCD。The first substrate and the second substrate used in the present invention are usually transparent glass substrates. Generally, a transparent electrode, an active matrix element (such as a TFT), an alignment film, a color filter, and the like are formed on at least one of opposite surfaces of two substrates. These structures can be modified according to the type of LCD. The manufacturing method according to the present invention can be considered to be applicable to any type of LCD.

在步驟(a)中，將可固化組合物塗覆於第一基板之表面之周邊，以使呈框架形狀包圍住基板外周。可固化組合物呈框架形狀塗覆之部分稱為密封區域。可固化組合物可利用已知方法，諸如網板印刷及分配塗覆。In step (a), the curable composition is applied to the periphery of the surface of the first substrate so as to surround the periphery of the substrate in a frame shape. The portion of the curable composition that is coated in the shape of a frame is called the sealed area. The curable composition can utilize known methods such as screen printing and dispensing coating.

在步驟(b)中，接著將液晶滴落至由第一基板之表面上呈框架形狀之密封區域包圍的中心區域上。此步驟較佳在減壓下進行。In step (b), the liquid crystal is then dropped onto a central area surrounded by a frame-shaped sealing area on the surface of the first substrate. This step is preferably performed under reduced pressure.

在步驟(c)中，接著將該第二基板置放在該第一基板上方，及在步驟(d)中進行UV照射。藉由UV照射，可固化組合物部分固化，且展示出經處理不會出現移位之水準的強度，由此兩個基板暫時經固定。一般而言，輻射時間較佳較短，例如不長於5分鐘，較佳不長於3分鐘，更佳不長於1分鐘。In step (c), the second substrate is then placed over the first substrate, and UV irradiation is performed in step (d). By UV irradiation, the curable composition is partially cured and exhibits a level of strength that does not cause displacement upon processing, whereby the two substrates are temporarily fixed. Generally speaking, the irradiation time is preferably shorter, for example, not longer than 5 minutes, preferably not longer than 3 minutes, and more preferably not longer than 1 minute.

在步驟(e)中，加熱可固化組合物使其達成最終固化強度，由此兩個基板最終黏結在一起。步驟(e)中之熱固化一般在80至130℃及較佳100至120℃之溫度下，在30分鐘至3小時、通常1小時之加熱時間下加熱。In step (e), the curable composition is heated to its final curing strength, whereby the two substrates are finally bonded together. The heat curing in step (e) is generally performed at a temperature of 80 to 130 ° C and preferably 100 to 120 ° C, and a heating time of 30 minutes to 3 hours, usually 1 hour.

藉由前述方法，完成LCD面板之主要零件。實例 實例 1 ： 實例1 實例3 By the foregoing method, the main parts of the LCD panel are completed. Example Example 1 : Example 1 Example 3

向配備有機械攪拌器之250 mL 3頸燒瓶中添加Epiclon 850CRP (23.49 g，69 mmol)、硫代乙酸4-乙烯基苯甲酯(17.25 g，89 mmol)、苯氧化鉀(0.4 g，3 mmol)及18-冠-6 (0.8 g，3 mmol)且在60℃下攪拌混合物3小時。紅外(IR)光譜分析指出在1730 cm-1 處出現乙酸酯之新穎羰基帶，且1688 cm-1 處之硫代乙酸酯帶消失。在混合物冷卻之後，添加於150 ml甲醇中之碳酸鉀(12.4 g，89 mmol)且在室溫下攪拌混合物30分鐘。過濾混合物且接著用乙酸乙酯洗滌。收集有機層，用去離子水洗滌四次且經無水Na2 SO4 乾燥。在過濾之後，將有機層與5 g矽膠及4 g矽麗粉(sillitin)一起攪拌1小時，且接著過濾且用50 mL乙酸乙酯洗滌。添加2000 ppm第三丁基兒茶酚且蒸發溶劑，得到呈油狀之BPA苯乙烯基-環氧樹脂(40 g，89%)實例 2 ： 實例2 實例4 To a 250 mL 3-neck flask equipped with a mechanical stirrer, add Epiclon 850CRP (23.49 g, 69 mmol), 4-vinylbenzyl thioacetate (17.25 g, 89 mmol), and potassium phenoxide (0.4 g, 3 mmol) and 18-crown-6 (0.8 g, 3 mmol) and the mixture was stirred at 60 ° C. for 3 hours. Infrared (IR) spectral analysis indicated that a novel carbonyl band of acetate appeared at 1730 cm -1 and the thioacetate band disappeared at 1688 cm -1 . After the mixture was cooled, potassium carbonate (12.4 g, 89 mmol) in 150 ml of methanol was added and the mixture was stirred at room temperature for 30 minutes. The mixture was filtered and then washed with ethyl acetate. The organic layer was collected, washed with deionized water four times and dried over anhydrous Na 2 SO 4. After filtration, the organic layer was stirred with 5 g of silicone and 4 g of silitin for 1 hour, and then filtered and washed with 50 mL of ethyl acetate. Add 2000 ppm third butyl catechol and evaporate the solvent to obtain BPA styryl-epoxy resin (40 g, 89%) as an oil Example 2 : Example 2 Example 4

向配備有機械攪拌器之250 mL 3頸燒瓶中添加Epiclon 850CRP (26.17 g，76 mmol)、4-乙醯氧基苯乙烯(16.2 g，99 mmol)、溴化四丁基銨(1.24 g，3 mmol)且在90℃下攪拌混合物6小時。IR光譜分析指出在1743 cm-1 處出現乙酸酯之新穎羰基帶，且1759 cm-1 處之苯基乙酸酯帶消失。冷卻之後，添加於150 ml甲醇中之碳酸鉀(12.4 g，89 mmol)且在室溫下攪拌混合物1小時。過濾固體且用乙酸乙酯洗滌。用去離子水洗滌有機層若干次，且經無水Na2 SO4 乾燥。在過濾之後，添加5 g矽膠及4 g矽麗粉且攪拌1小時。過濾固體且用50 mL乙酸乙酯洗滌。添加2000 ppm第三丁基兒茶酚且蒸發溶劑，得到呈黏稠液體狀之BPA苯乙烯基環氧樹脂(32 g，76%)實例 3 ： 實例3 實例5 To a 250 mL 3-necked flask equipped with a mechanical stirrer was added Epiclon 850CRP (26.17 g, 76 mmol), 4-ethoxyloxystyrene (16.2 g, 99 mmol), tetrabutylammonium bromide (1.24 g, 3 mmol) and the mixture was stirred at 90 ° C for 6 hours. IR spectral analysis indicated that a novel carbonyl band of acetate appeared at 1743 cm -1 and the phenyl acetate band disappeared at 1759 cm -1 . After cooling, potassium carbonate (12.4 g, 89 mmol) in 150 ml of methanol was added and the mixture was stirred at room temperature for 1 hour. The solid was filtered and washed with ethyl acetate. The organic layer was washed with deionized water several times, and dried over anhydrous Na 2 SO 4. After filtering, add 5 g of silicone and 4 g of silicone powder and stir for 1 hour. The solid was filtered and washed with 50 mL of ethyl acetate. 2000 ppm of tertiary butyl catechol was added and the solvent was evaporated to obtain a BPA styrene-based epoxy resin (32 g, 76%) as a viscous liquid. Example 3 : Example 3 Example 5

在氮氣氛圍下向配備有磁性攪拌器之250 mL 3頸燒瓶中添加氫化鈉(3.58 g於油中之60%分散液，89 mmol)。將庚烷(50 mL)添加至燒瓶中且持續攪拌15分鐘，其後移除庚烷且添加100 mL THF作為替代。用冰水冷卻混合物。添加於THF (10 mL)中之4-乙烯基苯甲基醇(10 g，74 mmol)且在相同溫度下持續攪拌1小時。將於THF (25 mL)中之Epiclon 850CRP (25.34 g，74 mmol)添加至混合物中且在室溫下持續攪拌5小時。任何過量NaH藉由緩慢添加水淬滅。混合物用乙酸乙酯(300 mL)萃取，且有機層用去離子水洗滌4次且經無水Na2 SO4 乾燥。在過濾之後，添加5 g矽膠及4 g矽麗粉，且攪拌洗滌且乾燥之混合物1小時。過濾混合物且用50 mL乙酸乙酯洗滌。添加2000 ppm第三丁基兒茶酚且蒸發溶劑，得到呈黏稠液體狀之苯乙烯基環氧樹脂。實例 4 ： 實例4 實例7 To a 250 mL 3-necked flask equipped with a magnetic stirrer was added sodium hydride (3.58 g of a 60% dispersion in oil, 89 mmol) under a nitrogen atmosphere. Heptane (50 mL) was added to the flask and stirring was continued for 15 minutes, after which heptane was removed and 100 mL of THF was added as a replacement. The mixture was cooled with ice water. 4-vinylbenzyl alcohol (10 g, 74 mmol) in THF (10 mL) was added and stirring was continued for 1 hour at the same temperature. Epiclon 850CRP (25.34 g, 74 mmol) in THF (25 mL) was added to the mixture and stirring was continued at room temperature for 5 hours. Any excess NaH was quenched by slowly adding water. The mixture was extracted with ethyl acetate (300 mL), and the organic layer was washed 4 times with deionized water and dried over anhydrous Na 2 SO 4 . After filtration, 5 g of silicone and 4 g of silica powder were added, and the washed and dried mixture was stirred for 1 hour. The mixture was filtered and washed with 50 mL of ethyl acetate. 2000 ppm of tert-butylcatechol was added and the solvent was evaporated to obtain a styrene-based epoxy resin as a viscous liquid. Example 4 : Example 4 Example 7

在攪拌下向配備有氮氣入口管道、溫度計、冷凝器及滴液漏斗之3頸50 mL燒瓶中添加烯丙基丁二酸酐(13.95 g，99 mmol)及鉑-1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷錯合物(13 mg)，且將混合物加熱至100℃。經一小時時段將1,1,3,3,5,5-六甲基三矽氧烷(10.38 g，49 mmol)逐滴添加至反應混合物中。控制反應溫度以保持在90至110℃之溫度範圍內持續30分鐘。因此產生中間物矽氫化雙官能酸酐。Under stirring, add allyl succinic anhydride (13.95 g, 99 mmol) and platinum-1,3-divinyl- to a 3-necked 50 mL flask equipped with a nitrogen inlet pipe, thermometer, condenser, and dropping funnel. 1,1,3,3-Tetramethyldisilaxane complex (13 mg), and the mixture was heated to 100 ° C. 1,1,3,3,5,5-hexamethyltrisiloxane (10.38 g, 49 mmol) was added dropwise to the reaction mixture over a one hour period. The reaction temperature was controlled to be maintained within a temperature range of 90 to 110 ° C for 30 minutes. As a result, a hydrosilicated bifunctional acid anhydride is produced.

將於甲苯(20 mL)中之4-胺基苯乙烯(5.07 g，42 mmol)添加至配備有溫度控制器、冷凝器及磁性攪拌棒之100 mL 3頸燒瓶。將來自上文之中間物酸酐(10.4 g，21 mmol)逐份添加至燒瓶中且在室溫下攪拌所得混合物30分鐘。將乙酸酐(8.7 g，85 mmol)及吡啶(6.9 mL，85 mmol)添加至混合物中，且在60℃下持續攪拌2小時。IR光譜分析指出在1710 cm-1 處出現新穎羰基帶。使混合物冷卻至室溫之後，添加250 mL乙酸乙酯且有機層用水洗滌兩次，用5% HCl水溶液、水、5% NaOH溶液及水洗滌兩次。在經無水Na2 SO4 乾燥之後，將500 ppm BHT添加至有機層中且蒸發溶劑，得到呈固體狀之產物(12 g，81%)。實例 5 ： 實例5 實例8 4-Aminostyrene (5.07 g, 42 mmol) in toluene (20 mL) was added to a 100 mL 3-necked flask equipped with a temperature controller, a condenser, and a magnetic stir bar. The intermediate anhydride (10.4 g, 21 mmol) from above was added portionwise to the flask and the resulting mixture was stirred at room temperature for 30 minutes. Acetic anhydride (8.7 g, 85 mmol) and pyridine (6.9 mL, 85 mmol) were added to the mixture, and stirring was continued at 60 ° C for 2 hours. IR spectral analysis indicated that a novel carbonyl band appeared at 1710 cm -1 . After the mixture was cooled to room temperature, 250 mL of ethyl acetate was added and the organic layer was washed twice with water and twice with a 5% aqueous HCl solution, water, a 5% NaOH solution, and water. After drying over anhydrous Na 2 SO 4 , 500 ppm BHT was added to the organic layer and the solvent was evaporated to give the product as a solid (12 g, 81%). Example 5 : Example 5 Example 8

向配備有冷凝器、氮氣入口及磁性攪拌棒之500 mL 3頸燒瓶中依序添加於油中之60%氫化鈉分散液(10 g，248 mmol)、60 mL庚烷。在氮氣下攪拌混合物10分鐘，且使氫化鈉漿料沈降，因此可自燒瓶移除庚烷。作為替代，將120 mL DMF添加至燒瓶中且用冰水混合物冷卻漿料。在攪拌下經15分鐘之時段逐份添加2-咪唑啉酮(9.8 g，113 mmol)。在相同溫度下攪拌1小時之後，經15分鐘逐滴添加4-乙烯基苯甲基氯(34.7 g，227 mmol)且在室溫下使反應混合物持續攪拌24小時。用冰冷卻反應混合物，用水淬滅，用500 mL乙酸乙酯萃取，用水洗滌4次且經無水Na2 SO4 乾燥。添加1000 ppm第三丁基兒茶酚且真空蒸發溶劑。得到呈固體狀之N,N'-(4-乙烯基苯甲基)乙烯脲(31 g，86%)實例 6 ： 實例6 實例9 A 500 mL 3-necked flask equipped with a condenser, a nitrogen inlet, and a magnetic stir bar was sequentially added 60% sodium hydride dispersion (10 g, 248 mmol) in oil, and 60 mL of heptane. The mixture was stirred under nitrogen for 10 minutes and the sodium hydride slurry was allowed to settle, so heptane could be removed from the flask. Instead, 120 mL of DMF was added to the flask and the slurry was cooled with an ice-water mixture. With stirring, 2-imidazolinone (9.8 g, 113 mmol) was added in portions over a period of 15 minutes. After stirring at the same temperature for 1 hour, 4-vinylbenzyl chloride (34.7 g, 227 mmol) was added dropwise over 15 minutes and the reaction mixture was continuously stirred at room temperature for 24 hours. The reaction mixture was cooled with ice, quenched with water, extracted with 500 mL of ethyl acetate, washed 4 times with water and dried over anhydrous Na 2 SO 4 . 1000 ppm of tert-butylcatechol was added and the solvent was evaporated in vacuo. N, N '-(4-vinylbenzyl) ethyleneurea (31 g, 86%) was obtained as a solid Example 6 : Example 6 Example 9

在60℃下在1500 ppm第三丁基兒茶酚存在下攪拌間苯二甲酸(15 g，90 mmol)及碳酸鉀(24.96 g，180 mmol)於DMF (150 mL)中之混合物1小時。添加4-乙烯基苯甲基氯(24.96 g，180 mmol)於DMF (50 mL)中之溶液。可見略微放熱(溫度增加約10至15℃)。在約30分鐘中，4-乙烯基苯甲基氯之顏色(暗黃色)消失且形成白色混濁液。在60℃下攪拌反應物24小時。在冷卻至室溫之後，過濾出固體且用400 mL乙酸乙酯洗滌。有機層用水洗滌4次以移除所有DMF且經無水Na2 SO4 乾燥。在過濾之後，在旋轉蒸發器中真空蒸發溶劑，得到呈低熔點淺黃色固體狀之對應4-乙烯基苯甲基酯(27.8 g，77%)。實例 7 ： 實例1 A mixture of isophthalic acid (15 g, 90 mmol) and potassium carbonate (24.96 g, 180 mmol) in DMF (150 mL) was stirred at 60 ° C. in the presence of 1500 ppm third butyl catechol for 1 hour. A solution of 4-vinylbenzyl chloride (24.96 g, 180 mmol) in DMF (50 mL) was added. A slight exotherm is seen (temperature increase of about 10 to 15 ° C). In about 30 minutes, the color (dark yellow) of 4-vinylbenzyl chloride disappeared and a white turbid liquid formed. The reaction was stirred at 60 ° C for 24 hours. After cooling to room temperature, the solid was filtered off and washed with 400 mL of ethyl acetate. The organic layer was washed with water 4 times to remove all the DMF and dried over anhydrous Na 2 SO 4. After filtration, the solvent was evaporated in vacuo on a rotary evaporator to obtain the corresponding 4-vinylbenzyl ester (27.8 g, 77%) as a light yellow solid with a low melting point. Example 7 : Example 1

向配備有機械攪拌器之1L 4頸燒瓶中添加於甲苯(78 mL)中之EP 4088S環氧樹脂(36.7 g，118 mmol)、4-乙烯基苯甲酸(37 g，249 mmol)、Hycat 2000S (720 mg，1 wt%)及第三丁基兒茶酚(360 mg，5000 ppm)。在65℃下攪拌混合物約36小時。在冷卻至室溫之後，添加500 mL乙酸乙酯，且有機層用NaHCO3 水溶液(2×150 mL)洗滌兩次，用0.1N NaOH溶液洗滌兩次且用去離子水洗滌若干次。將約3000 ppm之第三丁基兒茶酚添加至有機層中，接著經無水Na2 SO4 乾燥。在過濾掉乾燥劑之後，將有機層進一步與矽麗粉(10 g)及矽膠(10 g)一起攪拌1小時，且接著過濾掉。蒸發溶劑，得到呈黏稠油狀之羥基酯。To a 1L 4-neck flask equipped with a mechanical stirrer was added EP 4088S epoxy resin (36.7 g, 118 mmol), 4-vinylbenzoic acid (37 g, 249 mmol), Hycat 2000S in toluene (78 mL). (720 mg, 1 wt%) and tert-butylcatechol (360 mg, 5000 ppm). The mixture was stirred at 65 ° C for about 36 hours. After cooling to room temperature, 500 mL of ethyl acetate was added, and the organic layer was washed twice with aqueous NaHCO 3 solution (2 × 150 mL), twice with a 0.1 N NaOH solution, and several times with deionized water. About 3000 ppm of tert-butylcatechol was added to the organic layer, followed by drying over anhydrous Na 2 SO 4 . After filtering off the desiccant, the organic layer was further stirred with silica powder (10 g) and silica gel (10 g) for 1 hour, and then filtered off. The solvent was evaporated to give the hydroxy ester as a viscous oil.

Claims (13)

一種樹脂，其包含以下結構：其中Q可選自：其中R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯(bisphenylene)、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基； R1 為H或甲基； X係選自CH2 、； n1 及n3 各自獨立地為0至10； n2 為1至10； Y為伸芳基、伸烷基、伸烯基、伸芳烷基、伸環烷基、伸二環烷基或伸三環烷基； Z為使芳基連接至氧之共價鍵、羰基或伸烴基連接基團；及 R2 為芳環上之取代基，其選自由以下組成之群：烷基、烷氧基、芳基氧基、鹵基、脂族基及芳族基。A resin containing the following structure: Where Q can be selected from: Wherein R is a polyvalent hydrocarbon-based linker selected from the group consisting of a straight or branched chain alkyl group, a straight or branched chain cycloalkyl group, an alkylene group, a cycloalkylene group, a bicycloalkylene group, a tricycloalkylene group, Linear or branched chain alkylene, linear or branched chain cycloalkylene, linear or branched chain alkylene, arylene, aralkylene, arylbicycloalkyl, aryltricycloalkyl , Bicycloalkyl aryl, tricycloalkyl aryl, bisphenylene, cycloalkyl aryl, heterocycloalkyl or heterocycloaryl; these alkyl, cycloalkyl, Alkylene, cycloalkylene, alkylene, aryl, arylalkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylaryl, Biphenyl, cycloalkyl, aryl, heterocycloalkyl and heterocycloaryl may optionally contain O or S or hydroxyl; R 1 is H or methyl; X is selected from CH 2 , ; N 1 and n 3 are each independently 0 to 10; n 2 is 1 to 10; Y is an arylene, an alkylene, an alkenyl, an aralkyl, a cycloalkyl, a dicycloalkyl or extending tricycloalkyl; Z is an aryl group is attached to make a covalent bond of oxygen, a carbonyl group or a hydrocarbon extending linking group; and R 2 is a substituent on the aromatic ring, selected from the group consisting of: alkyl, alkoxy Oxy, aryloxy, halo, aliphatic and aromatic. 一種樹脂，其包含以下結構：其中Q可選自：R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基； R1 為H或甲基； X係選自CH2 、； n1 及n3 各自獨立地為0至10； n2 為1至10； Y為伸芳基、伸烷基、伸烯基、伸芳烷基、伸環烷基、伸二環烷基或伸三環烷基； Z為使芳基連接至硫之共價鍵或伸烴基；及 R2 為芳環上之取代基，其選自由以下組成之群：烷基、烷氧基、芳基氧基、鹵基、脂族基及芳族基。A resin containing the following structure: Where Q can be selected from: R is a polyvalent hydrocarbon-based linker selected from the group consisting of a linear or branched alkyl group, a linear or branched cycloalkyl group, an alkylene group, a cycloalkylene group, a bicycloalkyl group, a tricycloalkyl group, a straight chain Chain or branched chain alkylene, linear or branched chain cycloalkylene, linear or branched chain alkylene, arylene, aralkylene, arylbicycloalkyl, aryltricycloalkyl, Bicycloalkyl aryl, tricycloalkyl aryl, biphenyl benzene, cycloalkyl aryl, cycloheteroalkyl, or cycloheteroaryl; such alkyl, cycloalkyl, alkylene, Cycloalkylene, alkenyl, arylene, aralkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylaryl, biphenyl , Cycloalkyl extended aryl, extended heteroalkyl and extended heteroaryl may optionally contain O or S or hydroxyl; R 1 is H or methyl; X is selected from CH 2 , ; N 1 and n 3 are each independently 0 to 10; n 2 is 1 to 10; Y is an arylene, an alkylene, an alkenyl, an aralkyl, a cycloalkyl, a dicycloalkyl or extending tricycloalkyl; Z is an aryl sulfur covalently coupled to the extension or hydrocarbyl group; and R 2 is a substituent on the aromatic ring, selected from the group consisting of: alkyl, alkoxy, aryl Oxy, halo, aliphatic and aromatic. 一種樹脂，其包含以下結構：其中Y1 及Y2 可相同或不同，且為選自以下之可聚合官能基：乙烯基苯甲基、乙烯基芳基、(甲基)丙烯酸酯基、烯丙基、苯烯丙基及縮水甘油基； X1 及X2 為使該等Y1 及Y2 基團連接至氮之共價鍵，或可選自伸烷基或伸環烷基中之一或多者，其各自可視情況含有一或多個雜原子諸如氧、硫或氮； R1 為環狀脲環上之取代基，其選自烷基、環烷基、芳基、芳烷基；及 n = 1-10。A resin containing the following structure: Wherein Y 1 and Y 2 may be the same or different, and are polymerizable functional groups selected from the group consisting of vinylbenzyl, vinylaryl, (meth) acrylate, allyl, phenallyl, and Glycidyl; X 1 and X 2 are covalent bonds connecting these Y 1 and Y 2 groups to nitrogen, or may be selected from one or more of alkylene or cycloalkylene, each of which is visible Cases containing one or more heteroatoms such as oxygen, sulfur or nitrogen; R 1 is a substituent on a cyclic urea ring selected from alkyl, cycloalkyl, aryl, aralkyl; and n = 1-10 . 一種樹脂，其包含以下結構：其中X為選自O、S或N之雜原子；或選自酯基、胺基甲酸酯基、脲基、醯亞胺基、碳酸酯基之官能基；或選自以下之基團：視情況在任何位置含有羥基官能基或在任何位置含有一或多個選自O、S、N之原子的伸烷基、伸環烷基、氧基伸烷基； R為選自以下之多價烴基連接子：直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基或伸雜環芳基；該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、聯伸雙苯、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基；或R亦可為聚矽氧或矽氧烷以及該等以上提及之多價連接子中之一或多者。A resin containing the following structure: Wherein X is a heteroatom selected from O, S or N; or a functional group selected from an ester group, a urethane group, a urea group, a fluorenimine group, and a carbonate group; or a group selected from the group consisting of: Optionally contain a hydroxyl functional group at any position or one or more alkylene, cycloalkylene, or oxyalkylene groups selected from O, S, and N atoms at any position; R is a polyvalent group selected from Hydrocarbyl linker: straight or branched chain alkyl, straight or branched chain cycloalkyl, extended alkyl, extended cycloalkyl, extended bicycloalkyl, extended tricycloalkyl, linear or branched extended alkyl, Linear or branched cycloalkylene, linear or branched alkylene, aryl, arylalkyl, arylbicycloalkyl, aryltricycloalkyl, bicycloalkylaryl, tricycloalkylene Cycloalkylene, biphenyl, cycloalkylene, cycloalkylene or heterocycloaryl; these alkyl, cycloalkyl, alkylene, cycloalkylene, alkylene , Aryl, aralkyl, aryl bicycloalkyl, aryl tricycloalkyl, bicycloalkyl aryl, tricycloalkyl aryl, biphenyl benzene, cycloalkyl aryl, aryl Heterocycloalkane And extending heterocyclic aryl may optionally contain O or S, or hydroxyl; or R may also be a poly silicon or silicon oxide alumoxane and many of these above-mentioned one or more divalent linkers. 一種ODF密封劑組合物，其包含如請求項1之樹脂及選自由光引發劑、自由基引發劑、固化劑、填充劑及其組合組成之群的材料。An ODF sealant composition comprising the resin as claimed in claim 1 and a material selected from the group consisting of a photoinitiator, a radical initiator, a curing agent, a filler, and a combination thereof. 如請求項5之ODF密封劑組合物，其進一步包含選自由以下組成之群的材料：光可聚合化合物、熱固性樹脂、搖變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、調平劑及其組合。The ODF sealant composition according to claim 5, further comprising a material selected from the group consisting of a photopolymerizable compound, a thermosetting resin, a shaker, a silane coupling agent, a diluent, a modifier, a colorant, an interface Active agents, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and combinations thereof. 一種ODF密封劑組合物，其包含如請求項2之樹脂及選自由光引發劑、自由基引發劑、固化劑、填充劑及其組合組成之群的材料。An ODF sealant composition comprising the resin as claimed in claim 2 and a material selected from the group consisting of a photoinitiator, a radical initiator, a curing agent, a filler, and a combination thereof. 如請求項7之ODF密封劑組合物，其進一步包含選自由以下組成之群的材料：光可聚合化合物、熱固性樹脂、搖變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、調平劑及其組合。The ODF sealant composition of claim 7, further comprising a material selected from the group consisting of a photopolymerizable compound, a thermosetting resin, a shaker, a silane coupling agent, a diluent, a modifier, a colorant, an interface Active agents, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and combinations thereof. 一種ODF密封劑組合物，其包含如請求項3之樹脂及選自由光引發劑、自由基引發劑、固化劑、填充劑及其組合組成之群的材料。An ODF sealant composition comprising the resin as claimed in claim 3 and a material selected from the group consisting of a photoinitiator, a radical initiator, a curing agent, a filler, and a combination thereof. 如請求項9之ODF密封劑組合物，其進一步包含選自由以下組成之群的材料：光可聚合化合物、熱固性樹脂、搖變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、調平劑及其組合。The ODF sealant composition of claim 9, further comprising a material selected from the group consisting of a photopolymerizable compound, a thermosetting resin, a shaker, a silane coupling agent, a diluent, a modifier, a colorant, an interface Active agents, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and combinations thereof. 一種ODF密封劑組合物，其包含如請求項4之樹脂及選自由光引發劑、自由基引發劑、固化劑、填充劑及其組合組成之群的材料。An ODF sealant composition comprising the resin as claimed in claim 4 and a material selected from the group consisting of a photoinitiator, a radical initiator, a curing agent, a filler, and a combination thereof. 如請求項11之ODF密封劑組合物，其進一步包含選自由以下組成之群的材料：光可聚合化合物、熱固性樹脂、搖變劑、矽烷偶合劑、稀釋劑、改質劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、調平劑及其組合。The ODF sealant composition according to claim 11, further comprising a material selected from the group consisting of a photopolymerizable compound, a thermosetting resin, a shaker, a silane coupling agent, a diluent, a modifier, a colorant, an interface Active agents, preservatives, stabilizers, plasticizers, lubricants, defoamers, leveling agents and combinations thereof. 一種化合物，其選自 實例3實例4實例5實例7實例8實例9實例1。A compound selected from Example 3 Example 4 Example 5 Example 7 Example 8 Example 9 Example 1 .
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