WO2011055441A1 - 液体吐出ヘッド用基板及び液体吐出ヘッド - Google Patents
液体吐出ヘッド用基板及び液体吐出ヘッド Download PDFInfo
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- WO2011055441A1 WO2011055441A1 PCT/JP2009/068931 JP2009068931W WO2011055441A1 WO 2011055441 A1 WO2011055441 A1 WO 2011055441A1 JP 2009068931 W JP2009068931 W JP 2009068931W WO 2011055441 A1 WO2011055441 A1 WO 2011055441A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14403—Structure thereof only for on-demand ink jet heads including a filter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14467—Multiple feed channels per ink chamber
Definitions
- the present invention relates to a liquid discharge head substrate and a liquid discharge head using the same.
- a liquid ejecting apparatus that performs recording by ejecting a liquid such as ink from an ejection port
- a liquid discharge head for example, ink jet recording
- a liquid discharge apparatus mounted on a liquid discharge apparatus such as an ink jet recording apparatus is effective. It is necessary to miniaturize the droplets ejected from the head.
- the liquid discharge ports and the energy generating elements that generate the energy used to discharge the corresponding liquid are arranged in high density. It is important to use a liquid discharge head provided with the head substrate.
- Patent Document 1 A configuration in which a plurality of supply ports are provided for one energy generating element is disclosed in Patent Document 1.
- FIG. 1A is a cross-sectional view of the liquid discharge head, and a resin layer 14 having a wall of a flow path 9 communicating with the discharge port 15 is provided on the substrate 10.
- the ink supplied from the first supply port 20 and the second supply port 21 is discharged from the discharge port 15 by being heated by the energy generating element 11 provided on the beam 16 through the flow path 9.
- FIG. 1B is a top view of the liquid discharge head of FIG. 1A, and a plurality of supply ports 21 and energy generating elements 11 are provided.
- the energy generating element 11 is connected to a wiring 13 for supplying power, and the wiring 13 is folded and provided on a beam 16 between adjacent energy generating elements 11.
- the present invention has been made in view of the above problems, and a liquid discharge head substrate and a liquid that can arrange energy generating elements with high density in the arrangement direction and can improve the supply characteristics of the liquid to the energy generating elements.
- An object is to provide a discharge head.
- the substrate for a liquid discharge head includes an element array in which a plurality of elements that generate energy for discharging a liquid are arranged, and a plurality of first individual wirings respectively connected to the plurality of elements.
- the first common wiring commonly connected to the plurality of first individual wirings, the plurality of second individual wirings respectively connected to the plurality of elements, and the plurality of second individual wirings
- a second common wiring connected to the device, the element row, the plurality of first individual wirings, the first common wiring, the plurality of second individual wirings, and the second common wiring.
- a current flows through the element through the first individual wiring and the second individual wiring due to a potential difference between the first common wiring and the second common wiring.
- the element is a liquid discharge head substrate that generates the energy
- the element row is provided in a region between the first common wire and the second common wire
- the plurality of first individual wires are the element row and the first common wire.
- a plurality of second individual wirings are provided in a region between the element row and the second common wiring, and a region between the adjacent elements,
- a supply port for supplying liquid to the plurality of elements is provided in at least one of a region between the adjacent first individual wires and a region between the adjacent second individual wires. Each is provided.
- the energy generating elements can be arranged with high density in the arrangement direction.
- the liquid supply port is arranged in the vicinity of the energy generator (a region between adjacent energy generating elements and a region between adjacent individual wires), the liquid supply characteristics to the energy generating elements Can be improved.
- a liquid discharge head substrate and a liquid discharge head in which energy generating elements can be arranged with high density in the arrangement direction and liquid supply characteristics to the energy generating elements can be improved. can do.
- FIG. 1 is a perspective view of an ink jet recording apparatus that can use the head of the present invention.
- FIG. 3 is a perspective view showing an ink cartridge and a head cartridge. It is a perspective view of the head of a 1st embodiment of the present invention. It is a top surface schematic diagram of the head of the 1st embodiment of the present invention. It is sectional drawing of the head of the 1st Embodiment of this invention. It is a perspective view of the head of the 2nd Embodiment of this invention. It is sectional drawing of the head of the 2nd Embodiment of this invention. It is a perspective view of the head of the 3rd Embodiment of this invention.
- FIG. 6 is a schematic top view of a head according to a third embodiment of the present invention. It is sectional drawing of the head of the 4th Embodiment of this invention. It is a top surface schematic diagram of the head of the 5th Embodiment of this invention.
- an ink jet recording head will be described as an example of a liquid discharge head
- an ink jet recording head substrate will be described as an example of a liquid discharge head substrate provided in the liquid discharge head.
- the present invention is not limited to them, and the liquid discharge head according to the present invention is an industry that combines a printer, a copier, a facsimile, a device such as a word processor having a printer unit, and various processing devices. It can be mounted on a recording device.
- an industrial recording apparatus it can be used for applications such as biochip creation and electronic circuit printing.
- FIG. 2 is a perspective view showing an ink jet recording apparatus on which an ink jet recording head (hereinafter also referred to as a head) according to an embodiment of the present invention can be mounted.
- the ink in the present invention should be interpreted broadly and applied to the recording medium to form an image, a pattern, a pattern, etc., process the recording medium, or process the recording medium. It shall refer to the liquid provided.
- FIG. 3A is a view showing the appearance of the head cartridge 219 used in this recording apparatus.
- FIG. 3B is a diagram illustrating the head cartridge 219 and the ink tank 124 that can be mounted on the head cartridge 219.
- the chassis 210 of the liquid ejection apparatus includes a medium feeding unit 211 that feeds a recording medium such as paper to a recording position, and a recording position to the medium discharging unit 212. And a medium transport unit 213 for guiding the recording medium. Further, in order to perform a predetermined recording operation on the recording medium transported to the recording position, the head cartridge 219 can be mounted by operating the set lever 217, and the carriage 216 supported so as to be able to scan along the carriage shaft 215. Is provided.
- the liquid ejecting apparatus is provided with a head recovery unit 214 that performs recovery processing.
- a contact flexible recording cable 222 is provided at the engaging portion of the carriage 216 on which the head cartridge 219 can be mounted.
- a contact portion (not shown) formed on the contact flexible recording cable 222 and a contact portion 223 provided on the head cartridge 219 are in electrical contact, exchange of various information, supply of power to the head cartridge 219, etc. It can be performed.
- a plurality of ink tanks 124 that store ink are removable from the head cartridge 219, respectively.
- the ink supplied from the ink tank 124 is ejected from the ink jet recording head 232 provided in the head cartridge 219 onto a recording medium, and a recording operation is performed.
- FIG. 4 is a partially transparent schematic perspective view showing the ink jet recording head of the first embodiment.
- the head 232 includes an ink jet recording head substrate (hereinafter also referred to as a head substrate) 107 including a heater 101 used as an element that generates energy for ejecting ink.
- a resin member 105 provided on the head substrate 107 is provided.
- An ink ejection port 106 is provided at a position facing the heater 101.
- the resin member 105 includes a wall 130a of the liquid chamber 130 that communicates with the discharge port 106, and a wall 131a of the flow channel 131 that communicates between the ink supply port 102 and the liquid chamber 130, with the wall facing inward.
- the head substrate 107 is provided with a supply port array in which a plurality of ink supply ports 102 penetrating the head substrate 107 are arranged, and a heater row (element row) in which a plurality of heaters 101 are arranged. .
- the ink supply port 102 is provided in a region between adjacent heaters (between elements). Such an ink supply port 102 can be provided at a desired position on the head substrate 107 with high accuracy by etching the head substrate 107 using, for example, a dry etching method.
- the liquid chamber 130 for temporarily storing ink is provided so as to correspond to the heater 101, and communicates with two flow paths 131 provided substantially symmetrically about the heater 101.
- FIG. 5A is a schematic view of a part of the upper surface portion of the head substrate 107, and schematically shows the heater 101 and the wiring.
- the head substrate 107 is provided with a first individual wiring 103, a second individual wiring 113, a first common wiring 110, and a second common wiring 129 connected to the heater 101.
- the element row 70 is provided in a region between the first common wiring 110 and the second common wiring 129.
- Each element and the first common wiring 110 are respectively connected by a first individual wiring 103 provided in a region between the element row 70 and the first common wiring 110.
- Each element and the second common wiring 129 are connected by a second individual wiring 113 provided in a region between the element row 70 and the second common wiring.
- GNDH common wiring By applying a potential difference between the first common wiring 110 and the second common wiring 129 (GNDH common wiring), the heater 101 is connected to the heater 101 via the first individual wiring 103 and the second individual wiring 113. Current flows.
- the second common wiring 129 has a lower potential than the first common wiring 110 and is used as a ground wiring. Further, the second individual wiring 113 is connected to the second common wiring 129 via a MOS transistor used as a control element that controls the driving of the heater 101.
- the MOS transistor includes a gate electrode, a source electrode, and a drain electrode. A region where such an electrode is provided is shown as a MOS transistor 109.
- the first individual wiring 103 and the second second individual wiring 113 connected to both sides of the heater 101 are along a direction substantially perpendicular to the arrangement direction of the heaters 101 (a direction substantially perpendicular to the element row 70). Is provided. Further, both individual wirings are provided at positions that are symmetric with respect to the element row.
- the second individual wiring 113 is not folded back in the direction in which the first individual wiring 103 is provided and provided in parallel with the first individual wiring, but as illustrated, the first individual wiring 113 Provided on the side opposite to the individual wiring 103. Accordingly, since no wiring is provided in the region between the ink supply port 102 and the heater 101, the heaters 101 can be provided at a high density by reducing the space between the heaters 101 corresponding to the region.
- the MOS transistor 109 determines whether to drive the heater 101 based on a signal input from a logic wiring (not shown) to a gate terminal (not shown).
- a logic wiring not shown
- a gate terminal not shown
- the MOS transistor 109 determines whether to drive the heater 101 based on a signal input from a logic wiring (not shown) to a gate terminal (not shown).
- a part of the region of the second common wiring 129 is provided on the region where the logic wiring is provided. Since the logic wiring used for controlling the drive is not provided in the region where the ink supply port 102 and the heater 101 are provided, the heater 101 can be provided at a high density.
- FIG. 5B is a schematic view of the head shown in FIG. 4 as viewed from above, and schematically shows the structure of the flow path 131, the liquid chamber 130, and the like.
- Ink passes through the ink supply port 102 from the surface opposite to the surface on which the heater 101 of the head substrate 107 is provided, passes through the filter 104, and is sent to the flow path 131. Further, the ink is supplied from the flow path 131 to the liquid chamber 130 corresponding to the heater 101 provided on the substrate.
- the ink in the liquid chamber 130 corresponding to the heater 101 is foamed by heating the heater 101 and is discharged from the discharge port 106 by the pressure.
- Two ink supply ports 102 are provided so as to sandwich the heater 101, and ink is supplied to the liquid chamber 130 through the two flow paths 131, so that ink refilling is smoothly performed and faint even if the ejection operation is performed at high speed. High-speed and high-speed recording operation can be performed.
- FIG. 6A shows the A-A ′ cross section of FIG. 5B
- FIG. 6B shows the B-B ′ cross section.
- the passage of the liquid from the supply port to the discharge port has a substantially symmetrical shape with the heater 101 as the center, and the member connected to the heater 101 and the layer related thereto are arranged symmetrically.
- a heat storage layer 118 made of SiO2 or the like is provided on the silicon substrate 80.
- a heating resistance layer 128 made of a high resistance material such as TaSiN is provided.
- a first individual wiring 103 and a second individual wiring 113 are provided with a conductive material made of Al or the like.
- the heating resistance layer 128 in the region between the first individual wiring 103 and the second individual wiring 113 is used as the heater 101.
- a protective layer 108 used for protection from corrosion by ink is provided on the heating resistance layer 128, the first individual wiring 103, and the second individual wiring 113.
- a member 105 made of resin is provided on the protective film to form a wall 130 a of the liquid chamber 130 that communicates with the discharge port 106 and a wall 131 a of the flow channel 131 that communicates with the discharge port 106.
- the member 105 made of resin forms a flow path by contacting the liquid discharge head substrate with the wall facing inward.
- the member 105 made of resin forming the discharge port 106 and the wall 131a of the flow path 131 is provided with a cured product of an epoxy resin, and after the wiring is formed, an epoxy resin or the like is applied to the entire surface. It is formed using photolithography technology.
- the level difference due to the wiring existing on the substrate surface affects the shape of the discharge port and the wall 131a of the flow path 131. I will give it.
- the step on the substrate surface is also symmetrical about the heater.
- the influence is symmetric with respect to the heater 101. Further, it is almost symmetrical about the discharge port 106 provided at a position facing the heater 101. Therefore, the symmetry of the surrounding structural members around the ejection port is hardly impaired by the step on the surface of the head substrate 107. As a result, the direction of ink ejection from the ejection port can be made straight (perpendicular to the surface of the head substrate 107). Therefore, the accuracy of the ink landing position is improved, and a head capable of performing a highly reliable recording operation can be provided.
- FIG. 1 A second embodiment will be described with reference to FIG.
- the present embodiment shows a form in which the ejection port 106 and the ink supply port 102 are different from those in the first embodiment.
- FIG. 7 is a partially transparent schematic perspective view showing the structure of the ink jet recording head of the second embodiment.
- 8A is a schematic diagram of CC ′ in FIG. 7
- FIG. 8B is a schematic diagram of the case where the head is cut perpendicularly to the surface of the head substrate 107 through DD ′ in FIG. FIG.
- the head substrate 107 is provided with a supply port array in which a plurality of ink supply ports 102 penetrating the head substrate 107 are arranged, as in the first embodiment, and the heater 101 Is provided with a heater array (element array).
- the ink supply port 102 is provided in a region between adjacent heaters (between elements).
- the ink supply ports 102 are provided on the other surface opposite to the surface of the head substrate 107 on which the heater 101 is provided, the concave portion 201 of the head substrate 107, the inside of the concave portion 201, and the head substrate 107. It is formed with a plurality of through portions 202 penetrating the surface. The ink is supplied from the recess through the penetrating portion to the liquid chamber 130 corresponding to the heater 101 provided on the substrate from the flow path 131.
- the ink supply port 102 shown in the first embodiment is provided by using a dry etching method
- the ink supply port 102 of this embodiment is provided by using a dry etching method and a wet etching method.
- a resist mask having an opening at a position where a recess is provided is provided on the surface (back surface) opposite to the surface on which the heater 101 of the head substrate 107 is provided.
- the recess 201 is provided by performing crystal anisotropic etching of the head substrate 107 using a strong alkaline aqueous solution such as TMAH or KOH as an etchant.
- the silicon Since silicon has a slow etching rate on the ⁇ 111> plane, the silicon has an inclined surface having an angle of about 54.7 degrees with respect to the other surface of the head substrate 107 when etching is performed using strong alkali. Etching proceeds as follows. Since the wet etching method can perform a plurality of substrates at the same time, time required for manufacturing can be reduced. Thereafter, a resist mask having an opening corresponding to the position of the penetrating portion 202 is provided, and the plurality of penetrating portions 202 can be provided with high accuracy and high density by using a dry etching method.
- the thick silicon substrate 80 In order to facilitate the handling at the time of manufacturing the head substrate, when the thick silicon substrate 80 is used, if the ink supply port 102 is provided only by the dry etching method in order to maintain the processing accuracy, It takes a long time and production efficiency falls. However, by using both the wet etching method and the dry etching method as in the present embodiment, it is possible to achieve both high-precision processing and high-speed processing.
- FIG. 9 is a partially transparent schematic perspective view showing an ink jet recording head according to a third embodiment of the present invention.
- FIG. 10A is a schematic view of a part of the upper surface portion of the head substrate 107 shown in FIG. 9, and shows individual wirings and common wirings connected to the heater 101.
- FIG. 10B is a view of the head shown in FIG. 9 as viewed from above, and schematically shows the structure of the flow path 131 and the liquid chamber 130 of the head.
- the ink supply ports 102 and the heaters 101 are alternately arranged in a straight line.
- the ink supply ports are provided between adjacent individual wires.
- column of 102 is shown.
- Other configurations are the same as those in the first embodiment.
- the liquid chamber 130 that temporarily stores ink provided so as to correspond to the heater 101 communicates with two flow paths 131 that are provided approximately symmetrically with respect to the heater 101.
- a columnar filter 104 that prevents dust mixed when supplied from the ink tank from being sent to the discharge port 106 is provided in the flow path 131 between the liquid chamber 130 corresponding to the heater 101 and the ink supply port 102. It can also be provided.
- the head substrate 107 is provided with a first individual wiring and a second individual wiring connected to the heater 101, a first common wiring 110, and a second common wiring 129.
- the element row 70 is provided in a region between the first common wiring 110 and the second common wiring 129.
- Each element and the first common wiring 110 are respectively connected by a first individual wiring 103 provided in a region between the element row 70 and the first common wiring 110.
- Each element and the second common wiring 129 are connected by a second individual wiring 113 provided in a region between the element row 70 and the second common wiring.
- GNDH common wiring By applying a potential difference between the first common wiring 110 and the second common wiring 129 (GNDH common wiring), a current is supplied to the heater 101 via the first individual wiring 103 and the second individual wiring 113. Flows.
- the second common wiring 129 has a lower potential than the first common wiring 110 and is used as a ground wiring. Further, the second individual wiring 113 is connected to the second common wiring 129 via the MOS transistor 109 as a control element for controlling the driving of the heater 101.
- the first individual wiring 103 and the second individual wiring 113 are provided substantially symmetrically with respect to the direction substantially orthogonal to the arrangement direction of the heaters 101 with the heater 101 as the center. In this way, the second individual wiring 113 is not folded back in the direction in which the first individual wiring 103 is provided and provided in parallel with the first individual wiring, but the first individual wiring 113 is not connected to the element row 70 in the first Provided on the side opposite to the individual wiring 103.
- the head substrate 107 is provided with two supply port arrays in which a plurality of ink supply ports 102 penetrating the substrate are arranged in parallel.
- a heater array in which a plurality of heaters 101 are arranged is provided.
- the ink supply port 102 is provided in a region between adjacent first individual wires and a region between adjacent second individual wires.
- the heaters 101 can be provided at a high density by reducing the distance between the heaters 101 corresponding to the area.
- the MOS transistor 109 determines whether to drive the heater 101 based on a signal input from a logic wiring (not shown) to a gate terminal (not shown).
- a logic wiring not shown
- a gate terminal not shown
- the MOS transistor 109 determines whether to drive the heater 101 based on a signal input from a logic wiring (not shown) to a gate terminal (not shown).
- a part of the region of the second common wiring 129 is provided on the region where the logic wiring is provided. Since the logic wiring used for controlling the drive is not provided in the region where the ink supply port 102 and the heater 101 are provided, the heater 101 can be provided at a high density.
- FIG. 10B shows the structure of the head flow path 131 and the liquid chamber 130, and the ink supply ports 102 are provided around the four sides of the heater 101.
- a wall 131 a of the flow channel 131 is provided between the adjacent heaters 101, and the ink flow channel 131 is formed along a direction substantially orthogonal to the arrangement direction of the heaters 101.
- the filter 104 is disposed between the ink supply port 102 and the heater.
- Ink is supplied from an ink supply port 102 penetrating from the back surface of the head substrate 107. Further, the ink passes through the filter 104 and is supplied to the liquid chamber 130 corresponding to the heater 101 from two flow paths 131 that are symmetrically connected to the liquid chamber 130. The ink supplied to the liquid chamber 130 corresponding to the heater 101 causes film boiling by heating the heater 101 and foams, and is discharged from the discharge port 106 by the pressure.
- the ink can be smoothly refilled even if the ejection operation is performed at a high speed, and a highly reliable and high speed recording operation without fading is performed. Can do.
- the shape is symmetrical with respect to the center position of the heater 101.
- the ink discharge direction can be a straight direction (perpendicular to the surface of the head substrate 107). Thereby, the accuracy of the ink landing position can be improved, and a head capable of performing a highly reliable recording operation can be provided.
- the ink supply port 102 can be provided by using a wet etching method and a dry etching method as shown in the second embodiment.
- FIG. 11 shows the configuration of the power supply wiring and the MOS transistor 109 to which the heater 101 described with reference to FIG. 10A in the fourth embodiment is connected.
- the heaters 101a (first elements) and the heaters 101b (second elements) are provided so that the heaters are alternately arranged to constitute the element row 70.
- the heater 101a (first element) is provided with a first individual wiring 103a and a second individual wiring 113a connected to each other.
- the first common wiring 110a and the second common wiring 129a (GNDH common wiring) are provided with the element row 70 interposed therebetween.
- the heater 101a and the first common wiring 110a are connected by a first individual wiring 103a provided in a region between the element array and the first common wiring 110a.
- the heater 101a and the second common wiring 129a are connected by a second individual wiring 113a provided in a region between the element row and the second individual wiring 113a.
- the heater 101a is connected to the heater 101a via the first individual wiring 103a and the second individual wiring 113a.
- the second common wiring 129a has a lower potential than the first common wiring 110a and is used as a ground wiring.
- the second individual wiring 113a is connected to the second common wiring 129a via a MOS transistor 109a (first control element) as a control element for controlling the driving of the heater 101a.
- a third individual wiring 103b and a fourth individual wiring 113b are connected to the heater 101b adjacent to the heater 101a.
- the third common wiring 110b and the fourth common wiring 129b (GNDH common wiring) are provided with the element row 70 interposed therebetween.
- the heater 101b and the third common wiring 110b are connected to each other by a third individual wiring 103b provided in a region between the element row and the third common wiring 110b.
- the heater 101b and the fourth common wiring 129b are connected by a fourth individual wiring 113b provided in a region between the element row and the fourth common wiring.
- the fourth common wiring 129a has a lower potential than the third common wiring 110a and is used as a ground wiring.
- the fourth individual wiring 113b is connected to the fourth common wiring 129b via a MOS transistor 109b (second control element) as a control element for controlling the driving of the heater 101b.
- a region of the heater 101a on the side where the first individual wiring 103a is provided (one side) is defined as a first region 150, and a region on the side where the second individual wiring 113a is provided (the other side). Is represented as 151.
- the third individual wiring 103 b connected to the heater 101 b is provided so as to be located in the second region 151.
- the fourth individual wiring 113 b connected to the heater 101 b is provided so as to be located in the first region 150.
- the MOS transistor 109b (second control element) and the first common wiring 110a are provided in the first region 150, and the MOS transistor 109a (first control element) and the third common wiring 110b are provided in the second region 151. And can be provided.
- the second individual wirings 113 connected to adjacent elements are provided alternately on the first region 150 side and the second region 151 side. This makes it possible to provide a MOS transistor region with a wider width in the direction along the element row (X direction in FIG. 11) than in the third embodiment.
- the width of the region in which the MOS transistor in the Y direction (direction orthogonal to the element row) is provided can be reduced instead of increasing the width in the X direction.
- the width of the head substrate 107 in the direction orthogonal to the element rows can be reduced.
- the first common wiring 110a can be provided above the region where the MOS transistor 109b is provided in the direction perpendicular to the surface of the substrate through an electrically insulating insulating layer.
- the first common wiring 110b can be provided above the region where the MOS transistor 109a is provided in the direction perpendicular to the surface of the substrate through an electrically insulating layer.
- the total width of the second common wirings that need to be provided on the first region 150 side and the second region 151 side is the second common wiring 129 required in the configuration of the third embodiment. Therefore, the substrate area required for the second common wiring 129 is the same as that of the third embodiment.
- the head substrate 107 is provided with two parallel supply port arrays in which a plurality of ink supply ports 102 penetrating the substrate are arranged, and a heater array 70 in which a plurality of heaters 101 are arranged between the supply port arrays. Is provided.
- the ink supply port 102 is provided in a region between the adjacent first individual wiring and the second individual wiring.
- the area of the substrate can be reduced and the manufacturing cost can be reduced.
- the MOS transistor 109a and the MOS transistor 109b determine whether to drive the heater 101a and the heater 101b based on a signal input from a logic wiring (not shown) to a gate terminal (not shown). On the region where such a logic wiring is provided, at least a part of the region of the second common wiring 129a and a part of the region of the fourth common wiring 129b are provided. Since the logic wiring used for controlling the driving is not provided in the region where the ink supply port 102, the heater 101a, and the heater 101b are provided, the heater 101a and the heater 101b can be provided with high density. .
- the ink supply port 102 can be provided by using a wet etching method and a dry etching method as in the second embodiment. Further, as in the first embodiment, instead of the region between the adjacent first individual wiring and the fourth individual wiring and the region between the adjacent second individual wiring and the third individual wiring. The supply port 102 can be provided in a region between the adjacent first element 101a and second element 101b.
- FIG. 12A is a diagram schematically showing an individual wiring layout extracted from the upper surface portion of the head substrate 107 according to the present embodiment.
- FIG. 12B is a view of the head as viewed from above, and schematically shows the structure of the flow path 131 and the liquid chamber 130.
- the first common wiring, the second common wiring, and the MOS transistor are not shown, but can be provided in the same manner as in the first to fourth embodiments.
- a first heater row (first element row) 70a and a second heater row (second element row) 70b in which heaters are arranged are provided in two rows.
- the first heater (first element) 101c belonging to the first heater row 70a is a second heater belonging to the second heater row closest to the heater. It is provided between the (second element) 101d and the third heater (third element) 101e. That is, the first heater 101c and the second heater 101d are provided so as to be shifted by 1/2 pitch with respect to the direction along the heater row, thereby achieving high density of the heater.
- the liquid chamber 130 that temporarily stores the ink provided so as to correspond to the heater 101 is in communication with two flow paths 131 that are provided substantially symmetrically with respect to the heater 101.
- the supply port arrays 40a, 40b, 40c formed by arranging a plurality of ink supply ports 102 are provided in three rows so as to be positioned on both sides of the heater array in parallel with the heater array 70a. Further, the ink supply ports 102 of one supply port array are provided so as to be equally spaced from the adjacent heaters in the heater array. As shown in FIG. 12, as shown in FIG. 12, the supply port rows provided on both sides of the first heater row 70a are divided into the first supply port row 40a, the second supply port row 40b, and the second supply port row.
- the supply port arrays provided on both sides of the heater array are referred to as a second supply port array 40b and a third supply port array 40c.
- ink can be stably supplied to the liquid chamber 130 via the two flow paths 131 from the plurality of ink supply ports 102 provided in the two supply port arrays 40a and 40b, and at high speed. Even if the ejection operation is performed, the ink can be smoothly refilled. As a result, a highly reliable recording operation can be performed in which no blurring of the recorded image occurs due to non-ejection.
- two individual wires are provided between adjacent ink supply ports 102 provided in the same supply port row, and one individual wire is provided between adjacent heaters 101 provided in the same heater row. Is provided.
- the individual wiring 113 on the ground side is not folded back in the direction of the individual wiring 103 on the power supply side, and is connected to the same heater 101 in the region between the adjacent ink supply ports 102 and the region between the adjacent heaters 101.
- the individual wiring 113 and the individual wiring 103 on the power supply side do not run in parallel.
- the individual wiring between the adjacent inks is provided at a position where the cross-sectional shape is symmetric.
- the discharge port is formed by applying an epoxy resin or the like of the member 105 made of resin, the shape becomes substantially symmetrical with the heater as the center.
- the shape of the material laminated on the head substrate 107 is affected by a step on the surface of the head substrate 107, the influence is symmetric about the heater 101, and the discharge port provided at a position facing the heater 101. Even the center of 106 is almost symmetrical.
- the symmetry of the surrounding structural members around the ejection port is hardly impaired by the step on the surface of the head substrate 107, and the ink ejection direction from the ejection port is a straight direction (with respect to the surface of the head substrate 107). Vertical).
- the accuracy of the ink landing position can be improved, and a head capable of performing a highly reliable recording operation can be provided.
- the ink supply port 102 can be provided by using a wet etching method and a dry etching method as in the second embodiment.
- the present invention also includes a configuration in which a plurality of groups including a plurality of heaters and a plurality of individual wires and a plurality of common wires corresponding to them are arranged along the direction in which the heaters are arranged, as shown in the above embodiment. Is included.
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Abstract
Description
図4、図5を参照して、本発明のインクジェット記録ヘッドの第1の実施形態を説明する。
図7を参照して第2の実施形態について説明する。第1の実施形態とは吐出口106、インク供給口102の形状が異なる形態を本実施形態において示す。
本発明に係るヘッド232の実施形態を、図9、図10を用いて説明する。
図11に、第4の実施形態において図10(a)を用いて説明したヒータ101が接続する電源配線及びMOSトランジスタ109の形態を示す。本実施形態において、ヒータが、ヒータ101a(第1の素子)と、ヒータ101b(第2の素子)が交互に列をなすように設けられることで、素子列70を構成している。
次に、第3の実施形態から、ヒータをさらに高密度に配置した一例を示す。
102 インク供給口
103 第1の個別配線
105 樹脂からなる部材
113 第2の個別配線
106 吐出口
130 液室
131 流路
Claims (9)
- 液体を吐出するためのエネルギーを発生する素子を複数配列してなる素子列と、複数の前記素子に其々接続された複数の第1の個別配線と、該複数の第1の個別配線に共通に接続された第1の共通配線と、複数の前記素子に其々接続された複数の第2の個別配線と、該複数の第2の個別配線に共通に接続された第2の共通配線と、前記素子列と前記複数の第1の個別配線と前記第1の共通配線と前記複数の第2の個別配線と前記第2の共通配線とが設けられた面と、を有し、前記第1の共通配線と前記第2の共通配線との間の電位差によって前記第1の個別配線と前記第2の個別配線とを介して前記素子に電流が流れることで該素子が前記エネルギーを発生する液体吐出ヘッド用基板であって、
前記面の上において、前記素子列は前記第1の共通配線と前記第2の共通配線との間の領域に設けられており、前記複数の第1の個別配線は前記素子列と前記第1の共通配線との間の領域に設けられており、前記複数の第2の個別配線は前記素子列と前記第2の共通配線との間の領域に設けられており、
隣り合う前記素子同士の間の領域、隣り合う前記第1の個別配線同士の間の領域及び隣り合う前記第2の個別配線同士の間の領域のうちの少なくとも一つの領域に、複数の前記素子に液体を供給するための供給口がそれぞれ設けられていることを特徴とする液体吐出ヘッド用基板。 - 前記第2の個別配線は、前記素子の駆動を制御する制御素子を介して前記第2の共通配線に接続されていることを特徴とする請求項1に記載の液体吐出ヘッド用基板。
- 前記供給口は、前記面とは反対側の他の面に設けられた凹部と、前記面とを貫通するように設けられていることを特徴とする請求項1又は請求項2に記載の液体吐出ヘッド用基板。
- 前記第1の個別配線と、前記第2の個別配線とは、前記素子を中心にして対称に設けられていることを特徴とする請求項1乃至請求項3のいずれかに記載の液体吐出ヘッド用基板。
- 液体を吐出するためのエネルギーを発生する複数の第1の素子と、該複数の第1の素子に其々接続された複数の第1の個別配線と、該複数の第1の個別配線に共通に接続された第1の共通配線と、前記複数の第1の素子に其々接続された複数の第2の個別配線と、該複数の第2の個別配線に共通に接続された第2の共通配線と、液体を吐出するためのエネルギーを発生する複数の第2の素子と、該複数の第2の素子に其々接続された複数の第3の個別配線と、該複数の第3の個別配線に共通に接続された第3の共通配線と、前記複数の第2の素子に其々接続された複数の第4の個別配線と、該複数の第4の個別配線に共通に接続された第4の共通配線と、前記複数の第1の素子と前記複数の第1の個別配線と前記第1の共通配線と前記複数の第2の個別配線と前記第2の共通配線と前記複数の第2の素子と前記複数の第3の個別配線と前記第3の共通配線と前記複数の第4の個別配線と前記第4の共通配線とが設けられた面と、を有し、
前記第1の共通配線と前記第2の共通配線との間の電位差によって前記第1の個別配線と前記第2の個別配線とを介して前記第1の素子に電流が流れることで該第1の素子が前記エネルギーを発生し、
前記第3の共通配線と前記第4の共通配線との間の電位差によって前記第3の個別配線と前記第4の個別配線とを介して前記第2の素子に電流が流れることで該第2の素子が前記エネルギーを発生する液体吐出ヘッド用基板であって、
前記面の上において、前記複数の第1の素子と前記複数の第2の素子とが配列されて素子列を形成し、該素子列を境にした一方の側に前記第1の共通配線と前記第4の共通配線とが設けられており、前記素子列を境にした他方の側に前記第2の共通配線と前記第3の共通配線とが設けられており、前記複数の第1の個別配線と前記複数の第4の個別配線とは前記素子列と前記第1の共通配線及び前記第4の共通配線との間の領域に設けられており、前記複数の第2の個別配線と前記複数の第3の個別配線とは前記素子列と前記第2の共通配線及び前記第3の共通配線との間の領域に設けられており、
隣り合う前記第1の素子と前記第2の素子との間の領域、隣り合う前記第1の個別配線と前記第4の個別配線との間の領域及び隣り合う前記第2の個別配線と前記第3の個別配線との間の領域のうちの少なくとも一つの領域には、前記複数の第1の素子と前記複数の第2の素子とに液体を供給するための供給口がそれぞれ設けられていることを特徴とする液体吐出ヘッド用基板。 - 前記素子列は、前記第1の素子と前記第2の素子とが交互になるように設けられていることを特徴とする請求項5に記載の液体吐出ヘッド用基板。
- 前記第2の個別配線は、前記第1の素子の駆動を制御する第1の制御素子を介して前記第2の共通配線に接続され、前記第4の個別配線は、前記第2の素子の駆動を制御する第2の制御素子を介して前記第4の共通配線に接続されていることを特徴とする請求項5又は請求項6に記載の液体吐出ヘッド用基板。
- 前記面の上において、前記第3の共通配線は、前記第1の制御素子の上側に設けられており、前記第4の共通配線は、前記第2の制御素子の上側に設けられていることを特徴とする請求項7に記載の液体吐出ヘッド用基板。
- 請求項1乃至請求項8のいずれかに記載の液体吐出ヘッド用基板と、
液体を吐出する吐出口と連通する流路の壁を有し、前記壁を内側にして前記液体吐出ヘッド用基板と接することで前記流路を形成する部材と、を有する液体吐出ヘッド。
Priority Applications (7)
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JP2011539226A JP5095011B2 (ja) | 2009-11-05 | 2009-11-05 | 液体吐出ヘッド用基板及び液体吐出ヘッド |
PCT/JP2009/068931 WO2011055441A1 (ja) | 2009-11-05 | 2009-11-05 | 液体吐出ヘッド用基板及び液体吐出ヘッド |
BR112012010289A BR112012010289A2 (pt) | 2009-11-05 | 2009-11-05 | substrato de cabeça de ejeção de líquido, e, cabeça de ejeção de líquido |
EP09851093.6A EP2497643B1 (en) | 2009-11-05 | 2009-11-05 | Substrate for liquid ejection head, and liquid ejection head |
CN200980162168.XA CN102596574B (zh) | 2009-11-05 | 2009-11-05 | 液体排出头用基板以及液体排出头 |
RU2012123026/12A RU2507072C1 (ru) | 2009-11-05 | 2009-11-05 | Подложка головки для выпуска жидкости и головка для выпуска жидкости |
US12/916,055 US8292407B2 (en) | 2009-11-05 | 2010-10-29 | Substrate for liquid discharging head and liquid discharging head |
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AU2019428712B2 (en) | 2019-02-06 | 2023-01-19 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
US11642884B2 (en) * | 2019-02-06 | 2023-05-09 | Hewlett-Packard Development Company, L.P. | Die for a printhead |
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US7384113B2 (en) * | 2004-04-19 | 2008-06-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with address generator |
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US8778200B2 (en) * | 2007-10-16 | 2014-07-15 | Canon Kabushiki Kaisha | Method for manufacturing liquid discharge head |
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