Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
  • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• a conductive plug is formed to interconnect metal lines at respective layers, which is outlined below.
• a semiconductor substrate 1 includes a first insulation layer 2 with trenches 3 formed by etching, with the first insulation layer 2 and the trenches 3 provided on a surface of the semiconductor substrate 1.
• the semiconductor substrate 1 may be either a logic structure with layers of metal lines or a metal line layer on the surface of a layer of logic structure, and the first insulation layer 2 electrically isolates the current of the generated semiconductor product so that it flows only through an interconnection line.
• the trenches 3 are filled up with a conductive substance layer to form first conductive plugs 4, wherein the material of the conductive substance may be tungsten, copper, etc.
• the first conductive plugs 4 are connected with the logic structure with layers of metal lines or with the metal line layer on the surface of a layer of logic structure, both of which may be formed in the semiconductor substrate 1.
• a process of forming the first conductive plugs 4 is as follows.
• the conductive substance layer is deposited (not shown) on the surface of the first insulation layer 2 to fill up the trenches 3 with the conductive substance layer, using a chemical vapor deposition method.
• the conductive substance layer on the surface of the first insulation layer 2 is removed using a chemical mechanical polishing method to leave only the conductive substance layer in the trenches 3.
• a second insulation layer 7 is deposited on the first metal wiring layers 5 and the first medium layers 6.
• the second insulation layer 7 is etched to form trenches therein traversing the thickness thereof to expose the first metal wiring layers 5.
• a conductive substance is deposited on the second insulation layer 7 to fill up the trenches with the conductive substance.
• the conductive substance layer on the second insulation layer 7 is removed to leave only the conductive substance in the trenches.
• second conductive plugs 8 are formed, connected with the first metal wiring layers 5.
• Second metal wiring layers 9, comprising a material of aluminum, copper, etc., are deposited on the surface of the second insulation layer 7 to cover the second conductive plugs 8.
• the second metal wiring layers 9 are isolated by second medium layers 10, where the second metal wiring layers 9 and the second medium layers 10 have the same thickness.
• a semiconductor device structure including a semiconductor substrate having a device area and a virtual area, the virtual area being located at an edge of the semiconductor substrate; a first conductive plug and a second conductive plug, wherein the first conductive plug is provided in the virtual area and electrically connected to the substrate; a metal layer disposed in contact with the first and second plugs to provide a conductive path therebetween; wherein the first conductive plug, the second conductive plug, and metal layer form an interconnection line structure electrically grounded through a portion of the substrate in the virtual area via the first conductive plug.
• the material of the metal layer is copper or aluminum.
• the metal layer is formed using an electroplating method or a chemical vapor deposition method.
• the material of the insulation layer is silicon dioxide or doped silicon oxide.
• the thickness of the insulation layer is less than ⁇ .
• the insulation layer is formed using chemical vapor deposition method.
• a method for manufacturing a semiconductor device structure includes forming a first conductive plug and a second conductive plug, wherein the first conductive plug is provided in a virtual area located at an edge of a semiconductor substrate and electrically connected to the substrate; forming a metal layer disposed in contact with the first and second plugs to provide a conductive path therebetween; wherein the first conductive plug, the second conductive plug, and metal layer form an interconnection line structure electrically grounded through a portion of the substrate in the virtual area via the first conductive plug.
• the material of the metal layer is copper or aluminum.
• the material of the insulation layer is silicon dioxide or doped silicon oxide.
• the thickness of the insulation layer is less than ⁇ .
• a semiconductor device structure including a semiconductor substrate having a device area and a virtual area, the virtual area being located at an edge of the semiconductor substrate; a first conductive plug and a second conductive plug, wherein the first conductive plug is provided in the virtual area and electrically connected to the substrate; a first insulating layer provided on the substrate surface and between the first and second conductive plugs; a metal layer disposed in contact with the first and second plugs to provide a conductive path therebetween; a second insulating layer formed on the metal layer; wherein the first conductive plug passes through the first and second insulating layers to provide the electrical connection to the substrate, and the first conductive plug, the second conductive plug, and metal layer form an interconnection line structure electrically grounded through a portion of the substrate in the virtual area via the first conductive plug.
• a method for manufacturing a semiconductor device structure including forming a first conductive plug and a second conductive plug, wherein the first conductive plug is provided in a virtual area located at an edge of a semiconductor substrate and electrically connected to the substrate; forming a first insulating layer provided on the substrate surface and between the first and second conductive plugs; forming a metal layer disposed in contact with the first and second plugs to provide a conductive path therebetween; forming a second insulating layer formed on the metal layer; wherein the first conductive plug passes through the first and second insulating layers to provide the electrical connection to the substrate, and the first conductive plug, the second conductive plug, and metal layer form an interconnection line structure electrically grounded through a portion of the substrate in the virtual area via the first conductive plug.
• any of the metal wiring layers are extended into a virtual area for direct connection with a semiconductor substrate in the virtual area through a virtual conductive plug in an insulation layer.
• the semiconductor substrate has a function of grounding, and the direct connection of the metal wiring layers with the semiconductor substrate can release charges accumulated in the metal wiring layers and the insulation layer during etching to thereby avoid both a crystal lattice defect and device damage due to the residual charges.
• Figure 1 to Figure 4 are schematic diagrams of manufacturing an interconnection line structure in the prior art
• Figure 5 is a flow chart of an embodiment of manufacturing a semiconductor device structure including an interconnection line structure according to the invention.
• Figure 6 to Figure 9 are schematic diagrams of a first embodiment of forming an interconnection line structure according to the invention.
• Figure 10 to Figure 13 are schematic diagrams of a second embodiment of forming an interconnection line structure according to the invention. Detailed Description of Embodiments
• FIG. 5 is a flow chart of an embodiment of manufacturing a semiconductor device structure including an interconnection line structure.
• Step Sll is performed to prepare a semiconductor substrate divided into a device area and a virtual area, which is located at an edge of the semiconductor substrate.
• Step S12 provides for several alternately formed insulation layers.
• the alternately formed insulation layers are provided with conductive plugs in the device area and in the virtual area, which are formed to traverse the thickness thereof, and several metal wiring layers provided on the semiconductor substrate.
• the respective metal wiring layers are connected to conductive plugs in the device area, such that the metal wiring layers directly connect with the semiconductor substrate through the conductive plugs in the virtual area.
• FIGS. 6 to Figure 9 are schematic diagrams of a first embodiment of forming an interconnection line structure.
• a semiconductor substrate 100 is prepared, which may be either a logic structure with layers of metal lines or a metal line layer on the surface of a layer of logic structure.
• the semiconductor substrate 100 is divided into a device area II, and a virtual area I which is located at an edge of the semiconductor substrate 100.
• a first insulation layer 102 is formed on the surface of the semiconductor substrate 100.
• the first insulation layer 102 may, for example, be formed having a thickness of less than ⁇ .
• the first insulation layer 102 may be formed using, for example, a chemical vapor deposition method.
• the material of the first insulation layer 102 may be silicon oxide.
• the first insulation layer 102 may be formed of doped silicon oxide.
• One or more first trenches 103 traversing the thickness of the first insulation layer 102 are formed in the device area II, and one or more other first trenches 103 traversing the thickness of the first insulation layer 102 are formed in the virtual area I.
• the number and arrangement of trenches 103 illustrated in Figure 6 is exemplary only. It will now be apparent to one of ordinary skill in the art that the multiple trenches 103 may be provided to the substrate 100 as a different number with a different arrangement, without departing from the scope of the discussion herein. For example, more than one trench 103 may be provided in virtual area I.
• the first insulation layer 102 provides electric isolation, so that current of a resulting semiconductor product will flow only through an interconnection line.
• a formation process consistent with the above embodiment is as follows.
• a photoresist layer (not shown) is spin-coated on the first insulation layer 102 and subject to exposure and development processes to define corresponding first trench patterns, corresponding to the first trenches 103, on the photoresist layer in the virtual area I and the device area II.
• the first insulation layer 102 is etched using the photoresist layer as a mask along the trench patterns.
• a dry etching method may be used to etch the first insulation layer 102 and expose the semiconductor substrate 100 using the photoresist layer as a mask.
• C 4 F 8 may be used as the etching gas for the dry etching method.
• a dose of the etchant may depend upon the thickness of the first insulation layer 102.
• Figure 7 illustrates another step in the formation of a semiconductor device consistent with the first embodiment.
• the first trenches 203 in the virtual area I are filled with a conductive substance layer to form first conductive plugs 104; and the first trenches 203 in the device area II are filled with the same conductive substance layer to form others of the first conductive plugs 104.
• the first conductive plugs 104 provide electrical connections to the substrate 100.
• a first conductive substance layer is deposited (not shown) on the first insulation layer 102 to fill up the first trenches 103 with the first conductive substance layer.
• the first conductive substance layer on the first insulation layer 102 is removed to form the first conductive plugs 104.
• a chemical machine polishing method may, for example, be used to form the first conductive plugs 104 from the first conductive substance layer in the first trenches 103.
• the material of the first conductive substance layer in the present embodiment may be tungsten, copper, etc. Tungsten may be deposited, for example, using a physical vapor deposition method, wherein a solid target of tungsten is bombarded using plasma, so that tungsten is deposited as a film in the first trenches 103.
• Figure 8 illustrates a further step in the formation of a semiconductor device consistent with the first embodiment.
• first metal wiring layers 105 are provided on the surface of the first insulation layer 102 to cover the first conductive plugs 104. A part of the first metal wiring layers 105 covers the first conductive plugs 104 in the virtual area I.
• First metal wiring layers 105 are isolated by first medium layers 106, the first medium layers 106 having the same thickness as the first metal wiring layer 105.
• First metal wiring layers 105 may comprise, for example, tungsten, aluminum or copper, etc.
• a first metal layer of a material for example, tungsten, aluminum or copper, etc, is formed on the first insulation layer 102 (not shown).
• the first metal layer may be formed, for example, using a physical vapor deposition method.
• a photoresist layer (not shown) is provided on the surface of the first metal layer.
• an adhesive layer (not shown) may be formed on the surface of the first metal layer before coating the photoresist, and subsequently the photoresist layer can be coated on the adhesive layer.
• a Dielectric Anti-Reflection Coating (DARC) layer e.g., SiON, may be formed the material of the adhesive layer.
• DARC Dielectric Anti-Reflection Coating
• the photoresist layer is exposed and developed to form first metal wiring pattern corresponding to the first metal wiring layers 105.
• the first metal layer is etched using the photoresist layer as a mask along the first metal wiring pattern to form the first metal wiring layers 105 connected with the first conductive plugs 104.
• the first metal layer can be etched, for example, using a reactive ion etching method.
• the first medium layers 106 are formed above the first metal wiring layers 105 and in the gaps therebetween.
• the first medium layers 106 may be formed, for example, using a chemical vapor deposition method.
• the first medium layers 106 on the first metal wiring layers 105 are removed, for example, using a chemical mechanical polishing, to leave the first medium layers 106 in the gaps between the first metal wiring layers 105.
• the first metal wiring layers 105 may comprise copper.
• the first medium layers 106 may be formed on the first insulation layer 102 using, for example, a chemical vapor deposition method.
• a photoresist layer is formed on the first medium layers 106 using, for example, a spin-coating method, and subjected to exposure and development processes to define the first metal wiring patterns on the photoresist layer (not shown).
• the first medium layers 106 are etched using the photoresist layer as a mask along the first metal wiring patterns until the first conductive plugs 104 and a part of the first insulation layer 102 are exposed to form first metal wiring openings.
• a first metal layer (not shown) comprised of copper is formed on the first medium layers 106 using, for example, an electroplating method, to fill up the first metal wiring openings with the first metal layer.
• the first metal layer on the first medium layers 106 is removed using, for example, a chemical mechanical polishing method that leaves the first metal layer in the first metal wiring openings, thus forming the first metal wiring layers 105.
• Figure 9 illustrates yet another step in the formation of a semiconductor device consistent with the first embodiment.
• a second insulation layer 107 is deposited on the first metal wiring layers 105 and the first medium layers 106.
• the second insulation layer 107 may have, for example, a thickness of less than ⁇ .
• Second conductive plugs 108 are formed in the second insulation layer 107 to connect second metal wiring layers 109 to the first metal wiring layers 105.
• the second metal wiring layers 109 are isolated by second medium layers 110.
• the number and arrangement of the second conductive plugs 108 is exemplary only. One or more conductive of the second conductive plugs 108 can be provided.
• the second insulation layer 107 is etched using, for example, a dry etching method, to form therein second trenches, corresponding to the second conductive plugs 108, traversing the thickness thereof to expose the first metal wiring layers 105.
• a conductive substance is deposited (not shown) on the second insulation layer 107 using, for example, a chemical vapor deposition method, to fill up the second trenches with the conductive substance; and the conductive substance layer on the second insulation layer 107 is removed using, for example, a chemical mechanical polishing method, to leave only the conductive substance in the second trenches, thus forming the second conductive plugs 108 connected with the first metal wiring layers 105.
• the second metal wiring layers 109 comprising a material of tungsten, aluminum, or copper, etc., are deposited on the surface of the second insulation layer 107 to cover the second conductive plugs 108 with the second metal wiring layers 109 for connection with the first metal wiring layers 105 through the second conductive plugs 108.
• the second metal wiring layers 109 are isolated by the second medium layers 110, the second medium layers 110 having, for example, the same thickness as second metal wiring layers 109.
• the second metal wiring layers 109 may be formed, for example, of tungsten.
• a process of formation consistent with such an embodiment follows.
• the second metal layer comprising tungsten is formed on the second insulation layer 107 using, for example, a physical vapor deposition method.
• a photoresist layer is provided on the surface of the second metal layer.
• the photoresist layer is exposed and developed to form second metal wiring patterns.
• the second metal layer is etched using the photoresist layer as a mask along the second metal wiring pattern to form the second metal wiring layers 109 connected with the second conductive plugs 108.
• Tungsten can be etched in a reactive ion etching, for example.
• the second medium layers 110 are formed on the second metal wiring layers 109 and in the gaps therebetween in a chemical vapor deposition method, and the second medium layers 110 on the second metal wiring layers 109 are removed in the chemical mechanical polishing.
• the second metal wiring layers 109 may be formed, for example, of copper.
• a process of formation consistent with such an embodiment follows.
• the second medium layers 110 are formed on the second insulation layer 107 using, for example, a chemical vapor deposition method.
• a photoresist layer is formed on the second medium layers 110, using a spin-coating method, and subject to exposure and development processes to define the second metal wiring patterns on the photoresist layer.
• the second medium layers 110 are etched using the photoresist layer as a mask along the second metal wiring patterns until the second conductive plugs 108 and a part of the second insulation layer 107 are exposed to form second metal wiring openings.
• the second metal layer comprising copper is formed on the second medium layers 110 by an electroplating method to fill up the second metal wiring openings with the second metal layer; and the second metal layer on the second medium layers 110 is removed using, for example, a chemical mechanical polishing method, to leave the second metal layer in the second metal wiring openings.
• insulation layers and metal wiring layers including conductive plugs can also be formed sequentially at an interval on the second metal wiring layers 109 and the second medium layers 110.
• the respective metal wiring layers in the device area II are connected with the semiconductor substrate 100 through the first metal wiring layers 105 and the first conductive plugs 104 in the virtual area I.
• the semiconductor substrate 100 has a grounding function, capable of timely release of charges accumulated in the metal wiring layers and the insulation layers during formation of the conductive plugs by etching, thus avoiding both a crystal lattice defect and a device damage due to the residual charges.
• FIGS. 10 to Figure 13 are schematic diagrams of a second embodiment of forming an interconnection line structure.
• a semiconductor substrate 200 which may be either a logic structure with layers of metal lines or a metal line layer on the surface of a layer of logic structure, is provided.
• the semiconductor substrate 200 is divided into a device area II, and a virtual area I which is located at an edge of the semiconductor substrate.
• a first insulation layer 202 is formed on the surface of the semiconductor substrate 200.
• the insulation layer 202 may be formed using, for example, a chemical vapor deposition method.
• the material of the first insulation layer 202 may be formed using, for example, a chemical vapor deposition method.
• the material of the first insulation layer 202 may be, for example, silicon oxide or doped silicon dioxide.
• trenches 203 are formed in the device area II, and the first trenches 203 traversing the thickness of the first insulation layer 202 are also formed in the virtual area I.
• the number and arrangement of trenches 203 illustrated in Figure 10 is exemplary only. It will now be apparent to one of ordinary skill in the art that the substrate 200 may be provided with trenches 203 different in number and arrangement without departing from the scope of the discussion herein.
• the insulation layer 202 provides electric isolation so that current of a resulting semiconductor product will flow only through an interconnection line.
• a formation process consistent with the above embodiment is as follows.
• a photoresist layer (not shown) is spin-coated on the first insulation layer 202 and subject to exposure and development processes to define corresponding first trench patterns, corresponding to the first trenches 203, in the virtual area I and the device area II.
• the first insulation layer 202 is etched using the photoresist layer as a mask along the trench patterns until the semiconductor substrate 200 is exposed.
• the first insulation layer 202 may be etched, for example, using a dry etching method.
• a corresponding etching gas may be selected based on the material of the first insulation layer 202. For example, C 4 F 8 may be used if the first insulation layer is provided as silicon oxide.
• a dose of the etchant may depend upon the thickness of the first insulation layer 202.
• Figure 11 illustrates another step in the formation of a semiconductor device consistent with the second embodiment. As illustrated in Figure 11, the first trenches
• first conductive plugs 204 provide an electrical connection to the substrate 200.
• the material of the first conductive substance layer in the present embodiment may be tungsten or copper, etc.
• Tungsten may be deposited, for example, using a physical vapor deposition method, wherein a solid target of tungsten is bombarded using plasma, so that tungsten is deposited as a film in the first trenches 203. Then the first conductive substance layer on the first insulation layer is removed by, for example, a chemical mechanical polishing method to leave the first conductive substance layer in the first trenches 203.
• Figure 12 illustrates another step in the formation of a semiconductor device consistent with the second embodiment.
• first metal wiring layers 205 comprising, for example, a material of tungsten, aluminum or copper, etc., are deposited on the surface of the first insulation layer 202 to cover the first conductive plugs 204 with the first metal wiring layers 205.
• the first metal wiring layers 205 are isolated by first medium layers 206 with the same thickness.
• a part of the first metal wiring layers 205 covers the first conductive plugs 204 in the virtual area I.
• Figure 13 illustrates yet another step in the formation of the semiconductor device consistent with the second embodiment.
• a second insulation layer 207 is formed on the first metal wiring layers 205 and the first medium layers 206.
• the second insulation layer 207 may be formed, for example, having a thickness of less than ⁇ .
• Second conductive plugs 208a and third conductive plugs 208b are provided in connection with second metal wiring layers 209.
• the second metal wiring layers 209 may comprise, for example, a material of tungsten, aluminum or copper, etc.
• the second metal wiring layers 209 are provided on the second insulating layer 207 with portions of the second metal wiring layers 209 provided in contact with the second conductive plugs 208a and the third conductive plugs 208b.
• the second metal wiring layers 209 in the device area II are connected with the first metal wiring layers 205 through the second conductive plugs 208a and the second metal wiring layers 209 in the virtual area I are connected with the semiconductor substrate 200 through the third conductive plugs 208b.
• the second conductive plugs 208a in the device area II are formed connected with the first metal wiring layers 205 and the third conductive plugs 208b in the virtual area I are formed connected with the semiconductor substrate 200.
• the second metal wiring layers 209 are isolated by second medium layers 210.
• the second metal wiring layers 209 and the second medium layers 210 may, for example, have the same thickness. It will now be apparent to one of ordinary skill in the art that although only one example of the third conductive plugs 208b is illustrated in Figure 13, other plugs 208b may also be provided in the virtual area I in other portions of the substrate 200.
• a formation process consistent with the above embodiment is as follows.
• the second insulating layer 207 is formed on the first metal wiring layers 205 and the first medium layers 206.
• the second insulation layer 207 in the device area II is etched using, for example, a dry etching method to form therein second trenches, corresponding to the second conductive plugs 208a, traversing the thickness of the second insulating layer 207 to expose the first metal wiring layers 205.
• the second insulation layer 207, the first medium layers 206 and the first insulation layer 202 in the virtual area I are etched using, for example, the dry etching method until the semiconductor substrate 200 is exposed to form third trenches, corresponding to the third conductive plugs 208b.
• a conductive substance is deposited (not shown) on the second insulation layer 207 using, for example, a chemical vapor deposition method, to fill up the second and third trenches with the conductive substance.
• the conductive substance layer on the second insulation layer 207 is removed using, for example, a chemical mechanical polishing method, to leave only the conductive substance in the second and third trenches, thus forming the second conductive plugs 208a in the device area II connected with the first metal wiring layers 205 and the third conductive plugs 208b in the virtual area I connected with the semiconductor substrate 200.
• the metal wiring layers 205 and 209 in the device area II are connected with the semiconductor substrate 200 through the first metal wiring layers 205 and the first conductive plugs 204 in the virtual area I, and also may be connected to the substrate 200 through the second metal wiring layers 209 and the third conductive plugs 208b in the virtual area I.
• the semiconductor substrate 200 has a function of grounding, thus releasing charges accumulated in the metal wiring layers and the insulation layers during formation of the conductive plugs through etching, and thereby avoids both a crystal lattice defect and a device damage due to the residual charges.
• insulation layers including conductive plugs and metal wiring layers can also be formed sequentially at an interval on the second metal wiring layers 209 and the second medium layers 210.
• Each of the metal wiring layers 205 and 209 can be directly connected with the semiconductor substrate 200 through the conductive plugs.

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• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

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• 2009
  • 2009-10-14 CN CN 200910205812 patent/CN102044523B/zh active Active
• 2010
  • 2010-10-12 WO PCT/CN2010/077670 patent/WO2011044833A1/en active Application Filing

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