WO2011040150A1 - 金型調芯装置、成形機、及び成形方法 - Google Patents
金型調芯装置、成形機、及び成形方法 Download PDFInfo
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- WO2011040150A1 WO2011040150A1 PCT/JP2010/064225 JP2010064225W WO2011040150A1 WO 2011040150 A1 WO2011040150 A1 WO 2011040150A1 JP 2010064225 W JP2010064225 W JP 2010064225W WO 2011040150 A1 WO2011040150 A1 WO 2011040150A1
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- mold
- alignment
- movable
- measurement sensor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76083—Position
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76254—Mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76568—Position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76655—Location of control
- B29C2945/76732—Mould
Definitions
- the present invention relates to a mold aligning device used for injection molding, a molding machine incorporating the same, and a molding method using the molding machine.
- This mold aligning device automatically adjusts the posture of one mold by causing the light receiving part provided on the support of one mold to detect the mark provided on the support of the other mold. ing.
- a light receiving portion is provided on a mold mounting plate that is a support for a mold, and therefore, when a displacement occurs between the mold and the mold mounting plate. There is a possibility that the shaft cores of both molds are displaced when the molds are clamped.
- an object of the present invention is to provide a mold aligning device that can match the axis of a pair of molds with high accuracy.
- an object of the present invention is to provide a molding machine provided with the above-described mold aligning device and a molding method using the molding machine.
- a mold aligning device is a mold incorporated in a molding machine that forms a mold space by clamping a first mold and a second mold.
- An alignment apparatus provided in at least one of an alignment section that supports the first mold in a displaceable manner, an actuator that drives the alignment section, and the first mold and the second mold, A position measurement sensor for measuring a relative position between the mold and the second mold, and a control device for controlling the actuator and the position measurement sensor, and during the mold closing operation of the first mold and the second mold Further, the alignment unit is controlled so that the output value of the position measurement sensor becomes a predetermined value.
- the mold aligning device by providing the position measurement sensor in one of the first and second molds, for example, even if a positional deviation occurs between the first mold and its support body, The relative position between the mold and the second mold can be accurately measured. Further, during the mold closing operation between the first mold and the second mold, the alignment unit is controlled so that the output value of the position measurement sensor becomes a predetermined value. The axis of the mold can be matched with high accuracy. Thereby, reproducibility, such as the performance of the molded product shape
- the alignment unit is configured to arrange the first mold in a first direction perpendicular to the mold closing direction, a mold closing direction, and a second direction perpendicular to the first direction. And at least one alignment plate that adjusts for rotation about the mold closing direction. In this case, the displacement of the first mold relative to the second mold can be adjusted with respect to the three axes, and the first mold can be moved to a desired position.
- the position measurement sensor is provided in one of the first mold and the second mold, and the first mold and the second mold are detected by detecting a detected portion provided in the other. It is characterized by measuring a relative position with a mold. In this case, the relative position between the first mold and the second mold can be directly and accurately measured.
- the position measurement sensor has a resolution of 10 nm or less.
- the positional deviation between the first mold and the second mold can be adjusted more accurately, and a highly accurate optical element or the like can be produced with high reproducibility.
- the mating surface of the first mold and the second mold is a flat surface other than the product portion.
- the mating surfaces other than the product portion are flat surfaces, the mating surfaces of the first mold and the second mold do not interfere with each other in the direction perpendicular to the mold closing direction. The mold can be clamped while keeping the alignment with the mold.
- the first mold and the second mold are clamped when the output value of the position measurement sensor is a predetermined value.
- the output value is a predetermined value, that is, when the alignment between the first mold and the second mold is completed, the mold is clamped. Therefore, when the mold is clamped, the first mold and the second mold are clamped.
- the shaft core can be reliably matched.
- a molding machine according to the present invention includes the above-described mold aligning device.
- the mold aligning device for example, even if a positional deviation occurs between the first mold and its support, the shafts of the first mold and the second mold are clamped.
- the cores can be matched with high accuracy. Thereby, reproducibility, such as the performance of the molded product shape
- a molding method is a molding method in which molding is performed by forming a mold space by clamping a first mold and a second mold, and includes a first mold and a second mold.
- the relative position between the first mold and the second mold can be accurately measured, and the axial centers of the first mold and the second mold can be accurately matched when clamping. Thereby, molding with high reproducibility can be performed.
- FIG. 1 It is a front view explaining the injection molding machine concerning a 1st embodiment.
- A is the figure which looked at the metal mold alignment apparatus concerning 1st Embodiment from the parting line surface side
- B is the side view of the metal mold alignment apparatus shown to (A)
- C is a CC cross-sectional view of the die alignment apparatus shown in (A).
- A), (B) is a figure explaining operation
- an injection molding machine 10 includes, as main elements, a molding die 40, a die aligning device 80, a movable platen 11, a fixed platen 12, an opening / closing driving device 15, and an injection device. 16.
- the injection molding machine 10 clamps a pair of molds 41 and 42 constituting the molding die 40 between the movable platen 11 and the fixed platen 12 to form a mold space therebetween. . Then, injection molding is performed by injecting a plastic resin from the injection device 16 into the mold space of the molding die 40 and curing it. As a result, a molded article of an optical element such as an optical pickup objective lens can be produced.
- the mold opening and closing of the molding die 40 are in the horizontal direction, that is, the horizontal direction.
- the molding die 40, the die aligning device 80, and the like can be incorporated into an injection molding machine that opens and closes in the vertical direction.
- the molding die 40 of the injection molding machine 10 includes a movable die 41 that is a first die and a fixed die 42 that is a second die.
- the movable mold 41 and the fixed mold 42 have parting line surfaces PL1 and PL2 as end mating surfaces.
- the parting line surfaces PL1 and PL2 extend to the end portions of the molds 41 and 42 other than the recessed product parts MM1 and MM2 corresponding to the molded product, and are flat surfaces with high accuracy, respectively. (See FIG. 3A). These parting line surfaces PL1 and PL2 are held parallel to each other and extend perpendicular to the axis AX.
- the movable platen 11 is supported by an opening / closing drive device 15 to be described later so that the movable platen can move forward and backward.
- the inner side of the movable platen 11 faces the fixed platen 12 and supports the movable die 41 via the die aligning device 80 and the die attachment plate 44.
- the mold aligning device 80 is fixed to the movable platen 11 so that the movable die 41 can be slightly displaced with respect to the movable platen 11.
- the mold mounting plate 44 is fixed to the mold aligning device 80 on one side, and supports the movable mold 41 in a removable manner on the other side.
- an ejector 45 is incorporated in the movable platen 11.
- the ejector 45 pushes an appropriate position of the molded article of the optical element left in the movable mold 41 when the mold is opened through an ejector plate and an ejector pin (not shown) inside the movable mold 41, etc.
- the movable mold 41 can be pushed out to the fixed mold 42 side.
- the fixed platen 12 is fixed to the upper surface on the center side of the support frame 14.
- the inner side of the fixed platen 12 faces the movable platen 11 and supports the fixed die 42 via a die attachment plate 46.
- the mold mounting plate 46 is fixed to the stationary platen 12 on one side, and the fixed mold 42 is detachably supported on the other side.
- the mold clamping machine 13 is fixed to the upper surface on the end side of the support frame 14, and the distance between the movable board 11 and the stationary board 12 can be adjusted.
- the mold clamping board 13 supports the movable board 11 from the back via a power transmission portion 15d of the opening / closing drive device 15 described later when clamping the mold.
- the opening / closing drive device 15 includes a linear guide 15a, a power transmission unit 15d, and a power generation unit 15e.
- the linear guide 15a enables the reciprocating movement of the movable platen 11 relative to the fixed platen 12 in the axis AX direction while supporting the movable platen 11 on the support frame 14.
- the power transmission unit 15d expands and contracts in response to the driving force from the power generation unit 15e. As a result, the movable platen 11 is freely displaced with respect to the mold clamping plate 13 as it approaches or separates.
- the movable mold 41 on the movable platen 11 and the fixed mold 42 on the fixed platen 12 can be closed so that they abut against each other at the parting line surfaces PL1 and PL2, and a desired clamping force can be obtained. Both can be tightened with.
- the injection device 16 includes a cylinder 16a, a raw material reservoir 16b, a resin injection end 16d, and a drive unit 16e.
- the injection device 16 can discharge a temperature-controlled liquid resin from a nozzle-shaped resin injection end 16d.
- the injection device 16 can connect the resin injection end 16d of the cylinder 16a to the sprue portion of the fixed mold 42 in a separable manner. That is, the fixed platen 12 is provided with a hole 12 a, and the resin injection end 16 d is inserted into the hole 12 a and connected to the fixed mold 42 via the mold attachment plate 46. Thereby, molten resin can be supplied at a desired timing into a mold space CV (see FIG.
- the cylinder 16a is connected to the raw material reservoir 16b, and receives supply of resin from the raw material reservoir 16b at an appropriate timing and amount.
- the drive unit 16e includes a rotation drive mechanism that rotates the screw 16f incorporated in the cylinder 16a and a linear motion drive mechanism that advances and retracts the screw 16f in the axial direction.
- the solid pellet-shaped resin supplied from the raw material reservoir 16b is dissolved in a liquid state in the cylinder 16a by the shear heat generated by rotating the screw 16f and the heat from a heater (not shown), and further stirred. Can do.
- the liquid resin in the cylinder 16a can be injected from the resin injection end 16d at a desired pressure and flow rate.
- the mold alignment device 80 includes a main body device 81 and a control device 82.
- the main unit 81 supports the mold mounting plate 44 and appropriately displaces the alignment unit 50, the piezoelectric element 60 associated with the alignment unit 50, and the movable mold 41 side away from the alignment unit 50.
- a position measuring sensor 70 attached to the device.
- the mold aligning device 80 is incorporated in the injection molding machine 10 as described above, and is inserted between the movable platen 11 and the mold attachment plate 44 so as to insert the mold attachment plate 44 and the movable die 41. Is supported to be movable with respect to the movable platen 11.
- the alignment unit 50 of the main body device 81 includes an alignment plate 51, a holding mechanism 52, and a mounting plate 53.
- the alignment plate 51 supports the movable mold 41 via the mold mounting plate 44 shown in FIG.
- the alignment plate 51 is a single rectangular flat plate, and has insertion holes HL penetrating in the direction of the axis AX parallel to the mold closing direction AB at four corners. Inside these insertion holes HL, a support spring 91 having an outer diameter slightly smaller than the inner diameter of the insertion hole HL is housed and fixed by a shoulder bolt 92.
- the alignment plate 51 is supported in close contact with the mounting plate 53 by the support spring 91 and the shoulder bolt 92.
- the screw portion 92b of the shoulder bolt 92 is screwed into a screw hole HI provided in the mounting plate 53, and the outer diameter of the shaft portion 92a of the shoulder bolt 92 is determined by the insertion hole HL and the support spring. It is slightly smaller than the inner diameter of 91. Therefore, except when the movable mold 41 and the fixed mold 42 are clamped, the alignment plate 51 is slid in the direction perpendicular to the axis AX while being biased toward the mounting plate 53. Yes.
- the alignment plate 51 when a predetermined force or more is applied to the alignment plate 51 in a predetermined direction, the alignment plate 51 can be moved minutely in the direction perpendicular to the axis AX with respect to the mounting plate 53, and a minute amount around the axis AX. It can be rotated.
- the holding mechanism 52 is provided so as to be interposed between the mounting plate 53 and the alignment plate 51 in order to stabilize the support of the alignment plate 51.
- a total of eight holding mechanisms 52 are mounted in correspondence with the four sides of the alignment plate 51.
- Each holding mechanism 52 includes a spring support portion 52a and a centering spring 52b.
- the alignment springs 52b are arranged in units of three with respect to one spring support portion 52a, and one end of the alignment spring 52b is fixed to the spring support portion 52a. The other end of the spring 52b is attached to the corresponding side surface 51a, 51b, 51c, 51d of the alignment plate 51.
- the alignment plate 51 is pushed from the surrounding four directions by a large number of alignment springs 52b, and is stably held at a position where the urging forces of the alignment springs 52b are balanced.
- the alignment spring 52b of the holding mechanism 52 individually expands and contracts to enable fine adjustment of the attitude of the alignment plate 51. ing.
- Three piezoelectric elements 60 are provided on the side surfaces 51a and 51b parallel to the Y axis of the alignment plate 51 as actuators.
- the first piezoelectric element 61 is provided near the center of one side surface 51 a of the alignment plate 51 and is fixed to the mounting plate 53.
- the end surface of the elastic member 61 a extending from the first piezoelectric element 61 is in contact with the lateral side surface of the protrusion 51 e formed on the alignment plate 51.
- the remaining second and third piezoelectric elements 62 and 63 are paired, and are located near the center of the both side surfaces 51a and 51b of the alignment plate 51 and symmetrical with respect to the center axis OX of the alignment plate 51. And is fixed to the mounting plate 53. End surfaces of the elastic members 62 a and 63 a extending from both the piezoelectric elements 62 and 63 are in contact with the lower surfaces of the pair of protrusions 51 e formed on the alignment plate 51.
- the expandable member 61a of the first piezoelectric element 61 expands and contracts when a predetermined voltage is applied, and drives the alignment plate 51 in the X direction.
- the expansion members 62a and 63a of the second and third piezoelectric elements 62 and 63 expand and contract when a predetermined voltage is applied, and the alignment plate 51 is driven to translate in the Y direction according to the average voltage, and the voltage difference is increased. Accordingly, the alignment plate 51 is rotationally driven in the ⁇ direction.
- the alignment unit 50 drives the piezoelectric element 60 so that the movable mold 41 is arranged in the first direction perpendicular to the mold closing direction AB (axis AX direction), that is, the X direction and the mold closing direction AB. And the second direction perpendicular to the X direction, ie, the Y direction, and the rotation around the mold closing direction AB, ie, the ⁇ direction.
- the position measurement sensor 70 is provided in the upper center of the movable mold 41 on the parting line surface PL1 side.
- the position measurement sensor 70 includes an imaging lens and a CCD as a light receiving unit, and has a resolution of, for example, 10 nm or less.
- the CCD is a two-dimensional image sensor having unit pixels arranged in a grid pattern.
- the position measurement sensor 70 detects, for example, the relative position of the movable mold 41 with respect to the fixed mold 42 by detecting a mark 72 which is a detected portion provided at the upper center of the fixed mold 42 at a position facing the position measuring sensor 70. Measure.
- edge detection is performed from an image including the mark 72 detected by each CCD, and measurement coordinates (X, Y, ⁇ ) corresponding to the detected edge are calculated.
- a deviation amount ( ⁇ X, ⁇ Y, ⁇ ) is calculated and fixed from the difference between the calculated measurement coordinates (X, Y, ⁇ ) and the reference coordinates (X 0 , Y 0 , ⁇ 0 ) corresponding to the edge of the reference image.
- the relative position of the movable mold 41 with respect to the mold 42 can be obtained.
- the reference image means an image detected when the axes of the movable mold 41 and the fixed mold 42 coincide.
- Control device 82 controls each piezoelectric element 61, 62, 63 and position measurement sensor 70.
- the control device 82 controls the position measurement sensor 70 to acquire the image of the mark 72 from the CCD, and measures the relative position of the movable mold 41, that is, the shift amount ( ⁇ X, ⁇ Y, ⁇ ) with respect to the fixed mold 42 or Perform the operation to determine. Further, the control device 82 determines the voltage to be applied to each piezoelectric element 61, 62, 63 based on the measurement result so that the output value relating to the deviation amount from the position measurement sensor 70 is within a predetermined allowable range.
- the alignment unit 50 is controlled. These controls are performed during the mold closing operation of the movable mold 41 and the fixed mold 42.
- the position measurement sensor 70 provided on the movable mold 41 is provided with a mark 72 provided on the fixed mold 42. Is detected.
- the measurement coordinates (X, Y, ⁇ ) are calculated for the image of the mark 72 based on the output value from the position measurement sensor 70, and the difference from the reference coordinates (X 0 , Y 0 , ⁇ 0 ) is calculated.
- the deviation amounts ( ⁇ X, ⁇ Y, ⁇ ) are measured as the relative position of the movable mold 41 with respect to the fixed mold 42.
- the controller 82 drives each piezoelectric element 61, 62, 63 so that the deviation ( ⁇ X, ⁇ Y, ⁇ ) corresponding to the measurement result, that is, the output value of the position measurement sensor 70, becomes zero, for example. 51 is displaced. Note that the timing and number of times the relative position measurement is started by the position measurement sensor 70 during the mold closing operation are appropriately set according to the required accuracy.
- the mold clamping is performed as it is.
- the movable mold 41 is once retracted along the axis AX to a position where the alignment plate 51 can be smoothly displaced.
- the piezoelectric elements 61, 62, and 63 are driven to displace the alignment plate 51. That is, the movable mold 41 and the fixed mold 42 are clamped only when the output value of the position measurement sensor 70 is within a predetermined allowable range and the deviation amounts ( ⁇ X, ⁇ Y, ⁇ ) are less than the allowable value.
- step S1 An outline of the operation of the injection molding machine 10 shown in FIG. 4 will be described.
- the movable mold 41 and the fixed mold 42 are heated to a temperature suitable for molding (step S1).
- the opening / closing drive device 15 is operated to advance the movable mold 41 toward the fixed mold 42 to start mold closing (step S2).
- the mark 72 is detected by the CCD of the position measuring sensor 70, and the relative position of the movable mold 41 with respect to the fixed mold 42 is measured (step S3).
- step S3 the position and inclination of the aligning plate 51 are finely adjusted according to the measurement result, and feedback control is performed to match the axes of the movable mold 41 and the fixed mold 42 (step S3).
- step S4 the control device 82 determines whether or not the output value of the position measurement sensor 70 is within a predetermined allowable range (step S5). If the output value is less than the allowable value (Y in step S5). Then, mold clamping is performed to clamp the fixed mold 42 and the movable mold 41 with a necessary pressure (step S6).
- Step S5 if it is out of the predetermined allowable range (N in Step S5), the mark detection is temporarily stopped and the movable mold 41 is retracted to a predetermined position where the alignment plate 51 can be displaced (Step S21).
- step S ⁇ b> 3 feedback control is performed again to align the axes of the movable mold 41 and the fixed mold 42.
- step S6 in which the mold is clamped, the injection device 16 is operated, and the resin of the injection device 16 is placed in the mold space CV formed between the clamped fixed mold 42 and the movable mold 41. Resin is injected from the injection end 16d (step S7). The resin injected and filled in the mold space CV is cooled to a predetermined temperature and solidified (step S8).
- the opening / closing drive device 15 is operated to retract the movable mold 41 and perform mold opening for separating the movable mold 41 from the fixed mold 42 (step S9).
- the molded product is released from the fixed mold 42 while being held by the movable mold 41, for example.
- the molded product remaining in the movable mold 41 is pushed out as a result of, for example, being driven by the ejector 45 and an ejector pin incorporated in the movable mold 41 is ejected and released from the movable mold 41 ( Step S10).
- This molded product is carried out of the injection molding machine 10 by a take-out machine (not shown), for example (step S11).
- the position measurement sensor 70 is provided in the movable mold 41, so that the position shift between the movable mold 41 and the mold mounting plate 44 that is the support body is performed. Even if this occurs, the relative position between the movable mold 41 and the fixed mold 42 can be accurately measured. Further, during the mold closing operation of the movable mold 41 and the fixed mold 42, the alignment plate 51 is moved in the X direction, the Y direction, and the ⁇ direction so that the output value of the position measurement sensor 70 is within a predetermined allowable range. Therefore, the axes of the movable mold 41 and the fixed mold 42 can be made to coincide with each other with high accuracy. Thereby, reproducibility, such as the performance of the molded product shape
- parts other than the product parts MM1 and MM2 are flat surfaces, so that the parting line surface PL1 of the movable mold 41 and the fixed mold 42 is obtained. , PL2 do not interfere with each other, the mold can be clamped while the movable mold 41 and the fixed mold 42 are kept aligned.
- the steps S5 and S21 performed in the first embodiment are omitted. That is, the mold clamping (step S6) is performed as it is after the mold closing is completed (step S4).
- the detection speed by the position measurement sensor 70 and the alignment unit 50 are reduced by reducing the speed at which the movable mold 41 is advanced. The accuracy of shaft alignment can be improved.
- the position measurement sensor 70 is provided in the upper center of the movable mold 41.
- the position measurement sensor 70 is positioned so that the relative position between the movable mold 41 and the fixed mold 42 can be measured. I just need it.
- one position measuring sensor 70 is provided in the movable mold 41, but two or more position measuring sensors 70 may be provided.
- the position measuring sensor 70 is provided on the movable mold 41, but may be provided on the fixed mold 42.
- the position measuring sensor 70 is not limited to the CCD sensor, and for example, a laser displacement sensor, a capacitance sensor, an eddy current sensor, a contact displacement sensor, or the like may be used.
- the movable mold 41 is provided with a laser sensor head
- the fixed mold 42 is provided with a mirror or a measurement object.
- a sensor head for detecting a change in capacitance is provided, and a measurement object is provided on the fixed mold 42.
- a sensor head for detecting eddy current is provided in the movable mold 41, and a measurement object is provided in the fixed mold 42.
- a sensor head for detecting the displacement of the spindle that contacts the measurement object is provided on the movable mold 41, and the measurement object is provided on the fixed mold 42.
- the fixed mold 42 can be directly measured instead of providing the measurement object on the fixed mold 42.
- a sensor head is provided on the fixed mold 42 side instead of the movable mold 41 side, and the movable mold 41 side is provided. An object to be measured can also be provided in.
- the alignment plate 51 is attached to the movable platen 11 on the movable mold 41 side, but may be attached to the fixed platen 12 on the fixed mold 42 side.
- one alignment plate 51 is provided.
- two or more alignment plates may be provided corresponding to the direction of displacement.
- the actuator is not limited to the piezoelectric element 60 but has a force capable of moving the movable mold 41 and the like, and a positioning resolution sufficient for the accuracy required for the molded product. If present, an electromagnetic actuator, an electrostatic actuator, a magnetostrictive actuator, a hydraulic actuator, or the like may be used.
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Abstract
Description
以下、図面を参照して、本発明の第1実施形態である金型調芯装置、成形機、及び成形方法について説明する。
以下、第2実施形態にかかる成形方法について説明する。なお、第2実施形態にかかる成形方法は、第1実施形態を変形したものであり、特に説明しない部分については、第1実施形態と同様であるものとする。
11 可動盤
12 固定盤
13 型締め盤
15 開閉駆動装置
16 射出装置
40 成形金型
41 固定金型
42 可動金型
50 調芯部
51 調芯板
52 保持機構
60,61,62,63 圧電素子
70 位置測定センサ
80 金型調芯装置
PL1,PL2 パーティングライン面
Claims (8)
- 第1金型と第2金型とを型締めすることによって型空間を形成して成形を行う成形機に組み込まれる金型調芯装置であって、
前記第1金型を変位可能に支持する調芯部と、
前記調芯部を駆動するアクチュエータと、
前記第1金型及び前記第2金型のうち少なくとも一方に設けられ、前記第1金型と前記第2金型との相対位置を測定する位置測定センサと、
前記アクチュエータと前記位置測定センサとを制御する制御装置と、
を備え、
前記第1金型と前記第2金型との型閉じ動作中に、前記位置測定センサの出力値が所定値となるように前記調芯部を制御することを特徴とする金型調芯装置。 - 前記調芯部は、前記第1金型の配置を、型閉じ方向に対して垂直な第1方向、前記型閉じ方向及び前記第1方向に垂直な第2方向、及び前記型閉じ方向のまわりの回転に関して調整する少なくとも1つの調芯板を有することを特徴とする請求項1に記載の金型調芯装置。
- 前記位置測定センサは、前記第1金型及び前記第2金型のうち一方に設けられ、他方に設けられた被検出部を検出することにより、前記第1金型と前記第2金型との相対位置を測定することを特徴とする請求項1又は請求項2に記載の金型調芯装置。
- 前記位置測定センサは、10nm以下の分解能を有することを特徴とする請求項1から請求項3までのいずれか一項に記載の金型調芯装置。
- 前記第1金型と前記第2金型との合わせ面は、製品部以外が平坦面であることを特徴とする請求項1から請求項4までのいずれか一項に記載の金型調芯装置。
- 前記第1金型と前記第2金型とは、前記位置測定センサの出力値が前記所定値になっている時に型締めされることを特徴とする請求項1から請求項5までのいずれか一項に記載の金型調芯装置。
- 請求項1から請求項6までのいずれか一項に記載の金型調芯装置を備えることを特徴とする成形機。
- 第1金型と第2金型とを型締めすることによって型空間を形成して成形を行う成形方法であって、
前記第1金型と前記第2金型との型閉じ動作中に、前記第1金型及び前記第2金型のうち少なくともいずれか一方に設けられた位置測定センサによって、前記第1金型と前記第2金型との相対位置を測定する工程と、
前記位置測定センサの出力値が所定値になるように、前記第1金型を変位可能に支持する調芯部を駆動することによって、前記第2金型に対する前記第1金型の相対位置を調節する工程と、
を備えることを特徴とする成形方法。
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