WO2011038552A1

WO2011038552A1 - Power saving lamp with better heat radiating function

Info

Publication number: WO2011038552A1
Application number: PCT/CN2009/074345
Authority: WO
Inventors: 霍为民
Original assignee: Huo Weimin
Priority date: 2009-09-30
Filing date: 2009-09-30
Publication date: 2011-04-07

Abstract

A power saving lamp with better heat radiating function includes: a housing for the power saving lamp, a LED module (10), a power supply for the power saving lamp, a metal heat sink (30) and a circuit for current supply. The LED module (10) may be a LED chip or a LED. The LED module (10) can be bound or mounted on the heat sink (30). The metal heat sink (30) which connects with the electrode of the power supply (20) for the power saving lamp and the metal conductor (60, 70) make up of the circuit for current supply. The LED chip is set with the transparent protective glue. With the circuit for current supply, it can avoid the reducing of the efficiency of the thermal conductivity by the insulate layer of the circuit board, and improve the efficiency of the thermal conductivity.

Description

Instruction manual

Title of Invention: A light-emitting diode energy-saving lamp with a good heat sink function

[1] Technical field

[2] The present invention relates to a lighting lamp, and more particularly to an LED energy-saving lamp with a good heat sink function

[3] Background Art

[4] LED energy-saving lamps because their luminous efficiency is higher than that of tungsten lamps and ordinary energy-saving lamps, compared with ordinary energy-saving lamps, because it does not contain mercury, and the theoretical life is several times that of ordinary energy-saving lamps, it is generally considered to be the next generation. Electric light source. However, due to the light decay and the service life of the light-emitting diode of the light-emitting diode of the light-emitting diode energy-saving lamp, the photoelectric conversion efficiency of the existing light-emitting diode crystal chip is about 25% to 35%. Between 65% and 75% of the electric energy is converted into heat energy. Therefore, the heat dissipation efficiency of the LED chip of the LED energy-saving lamp becomes the key to ensure the service life and practical use of the LED energy-saving lamp. The existing LED energy-saving lamps are all implemented by mounting the LED device on a circuit board or by arranging the LED chip on the circuit board to form a power supply circuit. The circuit board shown in FIG. 1A and FIG. 1B is generally composed of a metal conductive layer 90 and an insulating substrate 92 or a metal conductive layer 90, an insulating layer 60 and a metal substrate 91. Since the heat insulating efficiency of the insulating substrate or the insulating layer is low, the light emitting diode The heat generated by the crystal chip during operation is therefore difficult to derive quickly, causing the junction temperature of the LED chip to rise to an extent that affects its useful life. Even if the heat transfer efficiency of the insulating substrate or the insulating layer is improved, it is difficult to compare with the heat transfer efficiency of directly mounting the light emitting diode crystal chip on the metal conductor heat sink.

[5] Summary of the invention

[6] The present invention is directed to solving the above problems, and provides a metal conductor heat sink and metal that directly mounts or helps a light emitting diode or a light emitting diode crystal chip on a metal conductor heat sink and is electrically connected to a power supply source of the energy saving lamp. The conductor is an LED energy-saving lamp that constitutes a power supply circuit of the light-emitting diode or the LED chip. Since the LED energy-saving lamp does not use a circuit board to form a light-emitting diode to form a power supply circuit, the heat conduction efficiency reduction due to the insulation layer of the circuit board is eliminated, and the heat dissipation efficiency of the light-emitting diode is effectively improved. [7] The object of the present invention can be achieved by the following technical solutions, a light-emitting diode energy-saving lamp with a good heat sink function, which comprises: an energy-saving lamp outer casing, a light-emitting diode component, and an energy-saving lamp power supply:

[8] In the light emitting diode device, when the light emitting diode device 10 is a packaged light emitting diode, the heat emitting end electrode 111 of the light emitting diode is directly connected to the metal heat sink 30, and the electrode is electrically connected to the metal heat sink 30, and the metal heat sinks. The electrode 30 is electrically connected to the electrode corresponding to the energy-saving lamp power supply 20; the other end electrode 112 of the packaged LED is electrically connected to the other electrode of the energy-saving lamp power supply 20;

[9] In the light emitting diode device, when the light emitting diode device 10 is a bare LED chip, and the LED chip is a DC power supply chip, the heat dissipating surface 103 of the LED chip is directly supported on the metal heat sink 30. If the heat dissipating surface 103 of the LED chip is an electrode, the electrode is electrically connected to the metal heat sink 30, and the metal heat sink 30 is electrically connected to the electrode corresponding to the energy-saving lamp power supply 20, and the other electrode of the LED crystal chip The other electrode of the power-conserving lamp power supply 20 is electrically connected; if the heat-dissipating surface of the LED chip is not an electrode, the two electrodes of the LED chip are electrically connected to the energy-saving lamp power supply 20 through the electrode leads 101 and 102 respectively Electrode; or

[10] When the LED device 10 is a die-emitting diode crystal chip, and the LED chip is an AC-powered chip, the heat-dissipating surface 103 of the LED chip is directly supported on the metal heat sink 30, if the LED crystal The heat dissipating surface 103 of the chip is an electrode, and the electrode is electrically connected to the metal heat sink 30, and the metal heat sink 30 electrically conducts one electrode of the energy-saving lamp power supply 20, the other electrode of the LED chip, and the energy-conducting energy-saving lamp The other electrode of the power supply 20; if the heat dissipating surface 103 of the LED chip is not an electrode, the two electrodes of the LED chip 10 are respectively connected to the electrodes corresponding to the energy-saving lamp power supply 20 through the electrode leads 101, 102;

[11] The LED chip 10 is provided with a transparent protective adhesive 40.

[12] The LED energy-saving lamp with a good heat sink function, the surface of the metal heat sink 30 of the photodiode crystal chip is a reflective surface 80.

[13] The LED energy-saving lamp with a good heat sink function, when the heat-dissipating surface 103 of the LED chip is an electrode, the electrode is electrically connected to the energy-saving lamp power supply through the metal heat sink 30 provided by the electrode One electrode of the light-emitting diode or the other electrode of the light-emitting diode crystal chip is connected to the other electrode of the energy-saving lamp power supply 20 through the electrode lead 101 to connect the metal conductor 50 that is not electrically connected to the metal heat sink 30. [14] The LED energy-saving lamp with good heat sink function, its light-emitting diode and metal radiator

The electrical connection between the 30 and the metal conductor 50 is achieved by soldering, welding or mechanical snapping.

[15] The LED energy-saving lamp with a good heat sink function is provided with an insulator 60 between the metal heat sink (30) and the metal conductor 50).

[16] The LED energy-saving lamp with good heat sink function, characterized in that the metal conductor

The 50 is embedded in the metal heat sink 30 with an insulator 60 therebetween.

[17] The LED energy-saving lamp with a good heat sink function, when the heat-dissipating surface 103 of the LED chip is not the electrode, the electrode leads 101, 102 of the LED chip are respectively dissipated by heat The metal conductor 50 and the metal conductor 70, which are electrically connected to each other and are insulated from each other, are connected to different electrodes of the energy-saving lamp power supply 20.

[18] The LED energy-saving lamp with good heat sink function, the surface of the metal heat sink 30 equipped with the light-emitting diode or the LED chip is a reflective surface 80, and the reflective surface is polished.

[19] The LED energy-saving lamp with a good heat sink function, the surface of the metal heat sink 30 with the light-emitting diode or the LED chip is mounted as a reflective surface 80, and the reflective surface 80 is lighted. Good reflective material, such as silver.

[20] The LED energy-saving lamp with good heat sink function, the reflective surface 80 is a surface required for design

, such as a plane, a paraboloid, a cone, a curved surface, a spherical one, or a combination of more than one.

[21] The LED energy-saving lamp with a good heat sink function, the metal heat sink 30 is a metal body prefabricated into a shape required for a light-emitting diode energy-saving lamp.

[22] The LED energy-saving lamp with a good heat sink function has a plurality of light-emitting diodes or light-emitting diode crystal chips, which may be connected in series, in parallel, or in series and parallel according to requirements.

[23] The LED energy-saving lamp with good heat sink function has a plurality of metal heat sinks 30, and an insulator 60 is disposed between different metal heat sinks 30, so that the LED crystal chip thereon can be Implement series, parallel, or series and parallel.

[24] The LED energy-saving lamp with a good heat sink function, the metal heat sink 30 is a metal body prefabricated into the shape required for the LED energy-saving lamp, and the reflective surface 80 is provided with a plurality of light-emitting diodes. Or a light-emitting diode crystal chip, corresponding to each light-emitting diode or light-emitting diode crystal chip The partial reflective surface may be one of a plane, a paraboloid, a cone, a curved surface, a spherical surface, or a combination of more than one, which satisfies the overall requirements of the reflective surface.

[25] The light-emitting diode energy-saving lamp with good heat sink function, which is prefabricated into the reflective surface 80 of the metal body heat sink 30 of the shape of the LED energy-saving lamp, the LED crystal chip, the electrode lead 101, The electrode lead 102, the metal conductor 50, the metal conductor 70, and the insulator 60 are protected by a transparent protective adhesive 40.

[26] An advantage of the present invention is that the provided technology is to directly mount or help a light-emitting diode or a light-emitting diode crystal chip on a metal conductor heat sink, and through a metal heat sink and a metal conductor electrically connected to a power supply of the energy-saving lamp. A power supply circuit constituting a light-emitting diode or a light-emitting diode crystal chip; the heat generated by the light-emitting diode crystal chip in the working process is quickly derived, thereby prolonging the service life of the light-emitting diode.

[27] BRIEF DESCRIPTION OF THE DRAWINGS

[28] FIG. 1A is a structural view of a composite circuit board directly connected to a metal conductive layer on an insulating substrate;

[1] FIG. 1B is a structural view of a composite circuit board through an insulating layer and a metal conductive layer on an insulating substrate;

[30] FIG. 2A is a schematic view of a light-emitting diode crystal chip applied to a surface of a metal heat sink;

[2] FIG. 2B is a schematic view of a light-emitting diode crystal chip disposed on a surface of a metal heat sink;

[32] FIG. 3A is a diagram showing an implementation of an LED chip in the surface of a metal heat sink according to the present invention.

[33] FIG. 3B is a schematic diagram of an implementation of an LED mounted on a surface of a metal heat sink according to the present invention; [34] FIG. 4 is a circuit schematic diagram of an implementation of FIG.

[35] FIG. 5 is a diagram showing an implementation manner of an LED chip of the present invention applied to a surface of a metal heat sink.

[36] FIG. 6 is a circuit schematic diagram of an implementation of FIG. 5;

7A is a schematic structural view of a reflective surface of the present invention;

[38] FIG. 7B is a schematic view showing the outer shape of a reflective surface of the present invention;

[39] FIG. 8A is a schematic structural view of a reflective surface of the present invention being non-planar;

[40] FIG. 8B is a schematic view showing the outer shape of a reflective surface of the present invention;

[41] Figure 9 is a schematic view of a light emitting diode mounted on a surface of a metal heat sink. [42] Specific implementation

[43] The light emitting diode device 10 of the present invention may be a light emitting diode or a light emitting diode crystal chip, which is mounted or bonded to the metal heat sink 30, and is electrically conductively connected to the metal heat sink 30 and the metal. The conductor 50 and the metal conductor 70 constitute a power supply circuit of the light emitting diode or the LED chip. Thereby, the heat extraction efficiency due to the insulation of the board is eliminated.

As shown in FIG. 2A, when the LED device 10 is an LED chip, the heat dissipating surface 103 is an electrode, and the heat dissipating surface 103 of the LED chip is applied to the metal heat sink 30. The metal heat sink 30 Electrically conducting the corresponding electrode of the energy-saving lamp power supply 20; the light-emitting surface of the LED crystal chip is provided with the LED electrode wire 101, the electrode wire 101 is connected with the metal conductor 50, and the metal conductor 50 electrically conducts another energy-saving lamp power supply 20 An electrode 60 is disposed between the metal heat sink 30 and the metal conductor 50 and thereby forms a power supply circuit for the LED chip.

[45] As shown in FIG. 2B, when the heat dissipating surface 103 of the LED chip is not the electrode, the heat dissipating surface 103 of the LED chip is disposed on the metal heat sink 30, the metal heat sink 30 and the energy saving lamp power supply 20 The electrodes are not electrically conductive; the two electrodes of the LED chip are connected to the metal conductor 50 and the metal conductor 70 through the electrode wire 101 and the electrode wire 102, respectively, and the metal conductor 50 and the metal conductor 70 are corresponding to the energy-saving lamp power supply 20 The electrode is electrically connected; an insulator 60 is disposed between the metal heat sink 30 and the metal conductor 50 and the metal conductor 70, respectively, thereby forming a power supply circuit for the LED chip.

[46] As shown in FIG. 9, when the LED device 10 is a packaged LED, the electrode heat-dissipating end 111 of the LED chip with the LED chip is mounted on the metal heat sink 30 to facilitate the LED crystal. The heat generated by the chip is led out, and the metal heat sink 30 electrically conducts the corresponding electrode of the energy-saving lamp power supply 20; the other end electrode 112 of the light-emitting diode is mounted on the metal conductor 50, and the metal conductor 50 electrically conducts another energy-saving lamp power supply 20 An electrode 60 is disposed between the metal heat sink 30 and the metal conductor 50 and thereby forms a power supply circuit for the light emitting diode. The two electrodes of the light emitting diode can be connected and fixed to the metal heat sink 30 and the metal conductor 50 by soldering, welding or mechanical snapping.

[47] The metal conductor 50 can be embedded in the metal heat sink 30 with an insulator 60 therebetween.

[48] As shown in FIG. 3A, the metal heat sink 30 is connected to one electrode of the energy-saving lamp power supply 20, and a plurality of LED crystal chips are disposed on the metal heat sink 30; the light-emitting diode crystal chip has a light-emitting surface The diode electrode lead 101 and the other end of the LED electrode lead 101 are connected to the metal conductor 50 And the metal conductor 50 is connected to the other electrode of the energy-saving lamp power supply, and the insulator 60 is mounted between the metal heat sink 30 and the metal conductor 50, thereby forming a parallel power supply circuit of the circuit schematic shown in FIG.

[49] As shown in FIG. 3B, the metal heat sink 30 is connected to one electrode of the energy-saving lamp power supply 20, the heat-dissipating end electrode 101 of the plurality of light-emitting diodes is mounted on the metal heat sink 30; and the other end electrode 102 of the light-emitting diode is mounted. On the metal conductor 50, and the metal conductor 50 is connected to the other electrode of the energy-saving lamp power supply, an insulator 60 is mounted between the metal heat sink 30 and the metal conductor 50, thereby forming a parallel circuit diagram as shown in FIG. Power supply loop.

[50] As shown in FIG. 5, the metal heat sink 30 is connected to one electrode of the energy-saving lamp power supply 20, and a plurality of LED crystal chips are disposed on the metal heat sink 30, and the light-emitting diode is connected to the light-emitting surface of the LED chip. The electrode lead 101, the other end of the LED electrode lead 101 is connected to an adjacent one of the metal heat sinks 30. The metal conductor heat sink 30 also has a plurality of LED crystal chips, and repeats a plurality of such connections. The other end of the electrode lead 101 of the light-emitting diode crystal chip 10 having the plurality of light-emitting diode crystal chips is bonded to the metal conductor 50, and the metal conductor 50 is connected to the other electrode of the energy-saving lamp power supply 20; An insulator 60 is mounted between the metal conductor heat sink 30 and the metal conductor 50, thereby constituting a series-parallel power supply circuit of the circuit schematic shown in FIG.

[51] As shown in FIG. 7A, the surface of the metal heat sink 30 on which the light emitting diode or the LED chip is mounted constitutes a reflective surface 80 for reflecting the light emitted by the light emitting diode or the LED chip. Reflective efficiency, reflective surface 80 can be polished, or treated with good reflective materials such as silver and nickel.

[52] As shown in Fig. 7B, the metal heat sink 30 and the insulator 60 therebetween constitute a part of the energy-saving lamp housing, and the metal heat sink 30 exposed to the energy-saving lamp housing can further improve the heat dissipation efficiency.

As shown in Figs. 7A and 7B, the reflective surface 80 of the metal heat sink 30, the LED chip, the electrode lead 101, the metal conductor 50, and the insulator 60 are covered by the transparent protective adhesive 40. It is used to protect the LED chip and the LED electrode lead, and derive the transparent light guide that emits light from the LED chip.

As shown in FIGS. 7A and 7B, the reflective surface of the metal heat sink 30 is a flat surface. As shown in FIGS. 8A and 8B, in order to meet the overall requirements of the reflective surface of the energy-saving lamp, the reflective surface 80 of the metal heat sink 30 can be designed as one of a non-planar plane, a paraboloid, a cone, a curved surface, or a spherical surface, or a More than one combination. To meet the above design The metal heat sink 30 is required to be prefabricated into a metal body of a shape required for the LED energy-saving lamp.

[55] In order to improve the reflective efficiency of each LED or LED chip, the partial reflective surface corresponding to each LED or LED chip can be a plane, a paraboloid, a cone, or an arc that satisfies the overall requirements of the reflective surface. One of the faces, the spheres, or a combination of more than one.

[56] Conventional devices can be used for the devices used in the various units described above.

Although the invention is disclosed by the above embodiments, the scope of the invention is not limited thereto, and the above components may be similar or equivalent elements known to those skilled in the art without departing from the inventive concept. replace.

Claims

Claim

[Claim 1] 1. A light-emitting diode energy-saving lamp with good heat sink function, which comprises: an energy-saving lamp outer casing, a light-emitting diode component, and an energy-saving lamp power supply, characterized in that: in the light-emitting diode component, when the light-emitting diode component ( 10) is a packaged light emitting diode 吋, the heat-distributing terminal electrode (111) of the light-emitting diode is directly connected to the metal heat sink (30), the electrode is electrically connected to the metal heat sink (30), and the metal heat sink (30) is The electrode corresponding to the energy-saving lamp power supply (20) is electrically connected; the other end electrode (112) of the packaged LED is electrically connected to the other electrode of the energy-saving lamp power supply (20);

In the light-emitting diode device, when the light-emitting diode device (10) is a bare-state light-emitting diode crystal chip, and the light-emitting diode crystal chip is a DC-powered chip, the heat-dissipating surface (103) of the light-emitting diode crystal chip is directly supported on the metal heat sink ( 30) If the heat dissipating surface (103) of the LED chip is an electrode, the electrode is electrically connected to the metal heat sink (30), and the metal heat sink (30) corresponds to the energy-saving lamp power supply (20). The electrode is electrically connected, the other electrode of the LED chip is electrically connected to the other electrode of the energy-saving lamp power supply (20); if the heat dissipating surface of the LED chip is not an electrode, the two electrodes of the LED chip pass respectively Electrode leads (101), (102) are electrically connected to electrodes corresponding to the energy-saving lamp power supply (20); or

When the light emitting diode device (10) is a die light emitting diode crystal chip, and the light emitting diode crystal chip is an AC power supply chip, the heat dissipating surface (103) of the LED crystal chip is directly supported on the metal heat sink (30). The heat dissipating surface (103) of the LED crystal chip is an electrode, and the electrode is electrically connected to the metal heat sink (30), and the metal heat sink (30) electrically conducts an electrode of the energy-saving lamp power supply (20), and emits light. The other electrode of the diode crystal chip electrically conducts the other electrode of the energy-saving lamp power supply (20); if the heat dissipation surface (103) of the LED chip is not the electrode, the two electrodes of the LED chip (10) are respectively Electrodes (101) and (102) are connected to electrodes corresponding to the energy-saving lamp power supply (20);

A transparent protective paste (40) is disposed on the LED chip (10).

[Claim 2] 2. The light-emitting diode energy-saving lamp with good heat sink function according to claim 1 The metal heat sink (30) is a part of the energy-saving lamp outer casing, and the surface of the metal heat sink (30) on which the light-emitting diode or the LED chip is mounted is a reflective surface (80).

3. The LED energy-saving lamp with a good heat sink function according to claim 1 or 2, wherein when the heat dissipating surface (103) of the LED chip is an electrode, the electrode is assisted by the electrode The metal heat sink (30) is electrically connected to one electrode of the energy-saving lamp power supply (20); the other electrode of the light-emitting diode or the LED chip passes through the electrode lead (101), and the connection is not electrically connected to the metal heat sink (30). The metal conductor (50) is connected to the other electrode of the energy-saving lamp power supply (20).

The LED energy-saving lamp with a good heat sink function according to claim 1 or 2, wherein the electrical connection between the light-emitting diode and the metal heat sink (30) and the metal conductor (50) is It is realized by welding, welding or mechanical clamping.

5. The LED energy-saving lamp with good heat sink function according to claim 3.

It is characterized in that an insulator (60) is provided between the metal heat sink (30) and the metal conductor (50).

6. The LED energy-saving lamp with good heat sink function according to claim 3

The metal conductor (50) is embedded in the metal heat sink (30) with an insulator (60) therebetween.

The LED energy-saving lamp with a good heat sink function according to claim 1 or 2, wherein when the heat dissipating surface (103) of the LED chip is not an electrode, the electrode of the LED chip The lead wires (101) and (102) are respectively connected to the energy-saving lamp power supply (20) by a metal conductor (50) and a metal conductor (70) which are not electrically connected to the metal heat sink (30) and are insulated from each other. Different electrodes.

8. The LED energy-saving lamp with a good heat sink function according to claim 1 or 2, wherein the surface of the metal heat sink (30) on which the light-emitting diode or the LED chip is mounted is a reflective surface. (80), the reflective surface is polished.

9. The LED energy-saving lamp with a good heat sink function according to claim 8, wherein the light-emitting diode or the light-emitting diode crystal core is mounted The surface of the metal heat sink (30) of the sheet is a reflective surface (80), and a reflective material such as silver is used on the reflective surface (80).

The LED energy-saving lamp with good heat sink function according to claim 1 or 8, wherein the reflective surface (80) is a surface required for design, such as a plane, a paraboloid, a cone, and a curved surface. , one of the spheres, or a combination of more than one.

11. A light-emitting diode energy-saving lamp having a good heat sink function according to claim 1 or 2, wherein the metal heat sink (30) is a metal body prefabricated into a shape required for the light-emitting diode energy-saving lamp.

12. The LED energy-saving lamp with a good heat sink function according to claim 1, wherein the light-emitting diode or the LED chip is a plurality of

, according to needs, can be connected in series, or in parallel, or in series and parallel.

13. The LED energy-saving lamp with good heat sink function according to claim

The metal heat sink (30) is a plurality of metal heat sinks (30), and an insulator (60) is disposed between the different metal heat sinks (30), so that the LED crystal chips thereon can be connected in series or in parallel. , or series and parallel.

The LED energy-saving lamp with a good heat sink function according to claim 11, wherein the metal heat sink (30) is a metal body prefabricated into a shape required for the LED energy-saving lamp, The light reflecting surface (80) is provided with a plurality of light emitting diodes or light emitting diode crystal chips, and the partial reflecting surface corresponding to each light emitting diode or the light emitting diode crystal chip may be a plane, a paraboloid, a cone surface, an arc satisfying the overall requirements of the reflecting surface. One of the faces, the spheres, or a combination of more than one.

The LED energy-saving lamp with a good heat sink function according to claim 14, wherein the pre-formed LED light-emitting lamp requires a reflective surface of a metal body heat sink (30) of an outer shape ( 80), the LED chip, the electrode lead (101), the electrode lead (102), the metal conductor (50), the metal conductor (70), and the insulator (60) are covered by a transparent protective adhesive (40).