WO2011027742A1 - 圧電アクチュエータ及び圧電アクチュエータを備える光走査装置 - Google Patents

圧電アクチュエータ及び圧電アクチュエータを備える光走査装置 Download PDF

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Publication number
WO2011027742A1
WO2011027742A1 PCT/JP2010/064794 JP2010064794W WO2011027742A1 WO 2011027742 A1 WO2011027742 A1 WO 2011027742A1 JP 2010064794 W JP2010064794 W JP 2010064794W WO 2011027742 A1 WO2011027742 A1 WO 2011027742A1
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Prior art keywords
piezoelectric actuator
spring
axis
drive
driving
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PCT/JP2010/064794
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English (en)
French (fr)
Japanese (ja)
Inventor
司 山田
Original Assignee
ミツミ電機株式会社
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Application filed by ミツミ電機株式会社 filed Critical ミツミ電機株式会社
Priority to CN201080032814.3A priority Critical patent/CN102474204B/zh
Priority to KR1020127001948A priority patent/KR101478205B1/ko
Publication of WO2011027742A1 publication Critical patent/WO2011027742A1/ja

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means

Definitions

  • the present invention relates to a piezoelectric actuator and an optical scanning device including the piezoelectric actuator, and more particularly to a piezoelectric actuator that tilts and drives an object to be driven and an optical scanning device including the piezoelectric actuator.
  • a piezoelectric unimorph diaphragm Conventionally, a piezoelectric unimorph diaphragm, a support body having a hollow portion for fixing and supporting one end of the piezoelectric unimorph diaphragm, an elastic body connected to the piezoelectric unimorph diaphragm, an elastic body connected to the elastic body, and an elastic body
  • an optical polarizer that includes a reflector that rotates and vibrates in a hollow portion by driving a unimorph diaphragm via the, and integrally forms them all (see, for example, Patent Document 1).
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a piezoelectric actuator that can be stably driven at a low speed and an optical scanning device including the piezoelectric actuator.
  • a piezoelectric actuator is a piezoelectric actuator that tilts and drives a driven object around an axis, and includes weight portions disposed on both sides of the axis, and extending across the axis.
  • a movable frame that has an annular structure that planarly surrounds the drive object with a connection part that connects the weight part, and that connects the drive object and supports the drive object; and an elastic body And a drive beam disposed outside the movable frame and connected to the connecting portion of the movable frame so as to apply tilting power about the axis. It is characterized by.
  • FIG. 1 is a diagram illustrating a cross-sectional configuration of a piezoelectric actuator of Example 1.
  • FIG. FIG. 3 is a diagram for explaining a method of driving the piezoelectric actuator according to the first embodiment.
  • FIG. 3 is a diagram for explaining a method of driving the piezoelectric actuator according to the first embodiment.
  • FIG. 3 is a diagram for explaining a method of driving the piezoelectric actuator according to the first embodiment.
  • 1 is a perspective view showing a configuration of a piezoelectric actuator of Example 1.
  • FIG. 1 is a perspective view illustrating a configuration of a piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a detailed configuration of a piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a detailed configuration of a piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a configuration of a packaged piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a configuration of a packaged piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a configuration of a packaged piezoelectric actuator of Example 1.
  • FIG. 1 is an exploded view of a packaged piezoelectric actuator of Example 1.
  • FIG. It is an expansion perspective view of an upper control member. It is an expansion perspective view of a downward restricting member. It is a figure for demonstrating the function of the meandering spring of the piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a detailed configuration of a piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a configuration of a packaged piezoelectric actuator of Example 1.
  • FIG. 1 is a diagram illustrating a configuration of a packaged piezoelectric
  • FIG. It is a figure for demonstrating the function of the meandering spring of the piezoelectric actuator of Example 1.
  • FIG. It is a figure for demonstrating the function of the meandering spring of the piezoelectric actuator of Example 1.
  • FIG. It is a figure which shows the state which carried out tilting operation
  • FIG. 5 is a diagram for explaining a configuration for shortening the wiring length of the piezoelectric actuator according to the first embodiment.
  • FIG. 3 is an enlarged view illustrating a planar configuration example of the piezoelectric actuator according to the first embodiment.
  • FIG. 6 is a diagram illustrating an overall configuration of a piezoelectric actuator of Example 2.
  • FIG. 10 is a perspective view illustrating a configuration of a piezoelectric actuator of Example 4.
  • FIG. 10 is a perspective view illustrating a configuration of a piezoelectric actuator of Example 4.
  • FIG. 10 is a perspective view illustrating a configuration of a piezoelectric actuator of Example 4.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 5.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 5.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 5.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 6.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 6.
  • FIG. 10 is a perspective view showing a configuration of a piezoelectric actuator of Example 6. It is a figure which shows the structure of the projector 300 of Example 7 of this invention.
  • FIG. 1 is a diagram showing a cross-sectional configuration of the piezoelectric actuator of Example 1 of the present invention.
  • the piezoelectric actuator of Example 1 includes a semiconductor wafer 10 and a drive source 20.
  • the piezoelectric actuator according to the first embodiment can be manufactured by processing the semiconductor wafer 10 using, for example, MEMS (Micro Electro Mechanical Systems) technology.
  • MEMS Micro Electro Mechanical Systems
  • FIG. 1 an example in which a piezoelectric actuator is configured using such a semiconductor wafer 10 will be described.
  • the semiconductor wafer 10 includes a silicon substrate 11, SiO 2 12 and 14, and a Si active layer 13.
  • a Si substrate For example, an SOI (Silicon On Insulator) substrate may be used as the semiconductor wafer 10.
  • SOI substrate between the silicon substrate 11 is a substrate which SiO 2 12 is formed of an insulating film, in the case of cutting the silicon substrate 11 by deep reactive ion etching or the like, it is SiO 2 on the bottom surface of the cutting end point Since it is formed, deep etching can be easily performed.
  • the beam 15 is formed by the SiO 2 12, the Si active layer 13 and the SiO 2 14. In the portion of the beam 15, an operation of supporting the driving object or transmitting the driving force is performed.
  • the portion of the silicon substrate 11 is used as an outer fixed frame, for example.
  • a semiconductor wafer 10 having a total thickness of 300 to 500 [ ⁇ m] may be used.
  • the semiconductor wafer 10 is 350 [ ⁇ m]
  • the Si active layer 13 is about 30 [ ⁇ m]
  • the SiO 2 12 and 14 are about 0.5 [ ⁇ m]
  • the beams 15 are about 31 [ ⁇ m] in total.
  • the thickness may be about 1/10 of that of the semiconductor wafer 10.
  • the driving source 20 is a power source that generates a driving force in the piezoelectric actuator of this embodiment.
  • various means can be used as the drive source 20, but in the first embodiment, the case where the piezoelectric element 21 is used as the drive source 20 will be described as an example.
  • the piezoelectric element 21 is a passive element that converts a voltage applied to the piezoelectric body 22 into a force.
  • the piezoelectric element 21 is driven to drive the mounted beam 15 by expanding and contracting its length when a voltage is applied.
  • piezoelectric bodies 22 may be applied as the piezoelectric body 22, but for example, a PZT thin film (lead zirconate titanate) may be used.
  • a PZT thin film lead zirconate titanate
  • the piezoelectric element 21 may be formed with a thickness of about 2 [ ⁇ m].
  • the piezoelectric element 21 includes an upper electrode 23 and a lower electrode 24.
  • the upper electrode 23 and the lower electrode 24 are electrodes for applying a voltage to the piezoelectric body 22, and when the voltage is applied to the upper electrode 23 and the lower electrode 24, the piezoelectric body 22 expands and contracts to drive the beam 15.
  • FIG. 2A to 2C are views for explaining a method in which the piezoelectric element 21 drives the piezoelectric actuator of the first embodiment by generating bending vibration in the beam 15.
  • FIG. FIG. 2A is a side view schematically showing the beam 15 and the piezoelectric element 21 made of silicon. As shown in FIG. 2A, a piezoelectric element 21 is mounted in a thin film shape on a beam 15 composed of a Si active layer 13 or the like.
  • FIG. 2B is a diagram showing a state in which the piezoelectric element 21 is contracted and deformed. As shown in FIG. 2B, when the piezoelectric element 21 contracts, the beam 15 has a shape that warps upward and downward.
  • FIG. 2C is a diagram showing a state in which the piezoelectric element 21 is expanded and deformed. As shown in FIG. 2C, when the piezoelectric element 21 extends, the beam 15 has a shape that warps upward and downward.
  • the piezoelectric element 21 warps upward or follows downward depending on the polarity or phase of the applied voltage.
  • the piezoelectric actuator of the present embodiment for example, by using such a property of the piezoelectric element 21, the driving target is driven using the piezoelectric element 21 as the driving source 20.
  • the structure in which the piezoelectric thin film 22 is formed on the beam 15 and the piezoelectric element 21 is provided as shown in FIG. And the tilting power can be applied to the driven object, so that it will be called a driving beam.
  • FIG. 3A and 3B are perspective views showing the overall configuration of the piezoelectric actuator of Example 1.
  • FIG. 3A is a top perspective view of the piezoelectric actuator of the first embodiment
  • FIG. 3B is a bottom perspective view of the piezoelectric actuator of the first embodiment.
  • the piezoelectric actuator of Example 1 includes a driving object 30, an elastic connecting member 40, a second driving beam 50, a movable frame 70, a meandering spring 80, a driving beam 90, and a fixed frame 100. And have.
  • the drive beam 90 and the second drive beam 50 are provided, and the piezoelectric actuator is described as a biaxial drive type.
  • the piezoelectric actuator is a single axis low speed drive type. In the case of the configuration, only the drive beam 90 may be provided. Therefore, the second drive beam 50 may be provided as necessary.
  • the upper surface of the piezoelectric actuator is all except that the driving object 30 is disposed on the surface of the central portion, and the surfaces of the driving beam 90 and the second driving beam 50 are covered with the driving source 20 including the piezoelectric element 21. It is composed of a Si active layer 13 covered with SiO 2 14.
  • the mirror may be the driving object 30, for example.
  • the mirror tilt drive can be used for projectors, printer scanners, and the like.
  • the X axis and the Y axis are set through the center of the driven object 30.
  • the X-axis is a tilting axis when the piezoelectric actuator of this embodiment is used as a low-speed driving single-axis actuator.
  • the Y axis is a tilt axis on the high speed drive side when the piezoelectric actuator of this embodiment is used as a two-axis type piezoelectric actuator that drives at low speed around the X axis and drives at high speed around the Y axis.
  • the driven object 30 when the driven object 30 is only driven at high speed around the Y axis, it can be configured as a high speed driven single axis type piezoelectric actuator.
  • the piezoelectric actuator according to the present embodiment is used as a piezoelectric actuator that drives the driving target 30 about one axis around the X axis
  • the driving target 30, the elastic connecting member 40, and the second driving beam 50 are used. Are driven to tilt around the X axis.
  • the driving object 30, the elastic connecting member 40, and the second driving beam 50 may be considered as the driving object 60 as a unit.
  • the movable frame 70 is a member for connecting the driving objects 30 and 60 to connect and support the driving objects 30 and 60 and transmitting the tilting power from the driving beam 90 to the driving objects 30 and 60. .
  • the movable frame 70 is configured to be thick with the Si support layer 11 described in FIG. Therefore, the movable frame 70 is configured to be heavier than the portion configured as the beam 15.
  • the movable frame 70 is formed as a weight (weight) portion 71 with a large area on both sides of the X axis, and both sides of the Y axis are formed as connection portions 72 that connect the weight portions 71.
  • the applied tilting power can be reduced by the weight of the weight portion 71. That is, even when the tilting power applied by the driving beam 90 is larger than the desired tilting power, the driving force can be reduced and the desired low-speed driving can be performed.
  • FIG. 3A the connecting portion 72 of the movable frame 70 is hidden, but as described in FIG. 3B, the second drive beam 50 is connected to the connecting portion 72 of the movable frame 70. .
  • the meandering spring 80 is a member for transmitting the tilting power generated by the drive beam 90 to the movable frame 70. Since the meandering spring 80 has the structure of the beam 15, it has elasticity and can absorb and reduce the tilting power transmitted from the driving beam 90. In addition, the meandering spring 80 has a meandering shape with a gap and has a shape that further increases the elasticity, so that the elasticity can be greatly increased as compared with a simple linear beam 15. The meandering spring 80 also transmits to the connecting portion 72 of the movable frame 70 while reducing the tilting force generated in the drive beam 90.
  • the driving beam 90 includes the piezoelectric element 21 as the driving source 20, and alternately drives the driving force to generate tilting power that tilts and oscillates by repeatedly deforming upward or downward. It is a generation means.
  • the drive beam 90 is disposed so as to sandwich the movable frame 70 from both sides in the extending direction of the X axis and extends in a direction perpendicular to the X axis. That is, it is arranged so that the letter H is drawn by the X axis and the drive beam 90. Separately, the drive beam 90 is disposed on both sides of the X axis so that the drive beam 90 is divided along the X axis.
  • a voltage that is displaced in the same direction is applied to the drive beam 90 on the same side with respect to the X axis, and an electrode that is applied with a voltage that is displaced in the opposite direction to the drive beam 90 on the opposite side with respect to the X axis.
  • a wiring configuration Thereby, with the X axis as a boundary, one side warps upward and the other side warps downward, so that a driving force that tilts the meandering spring 80 can be generated.
  • the vibration of the driving beam 90 is resonant vibration.
  • Resonance vibration has large vibration energy and can generate a large tilt angle sensitivity.
  • the vibration frequency is high, it is generally difficult to use it directly for low-speed driving.
  • the tilting power is transmitted to the driven objects 30 and 60 through the meandering spring 80 having great elasticity and the movable frame 70 having the weight portion 71, so that the frequency is sufficiently lowered. It is possible to drive at low speed.
  • the piezoelectric actuator of the present embodiment also generates tilting power by resonance vibration for the second drive beam 50 when the drive target 30 is driven in two axes.
  • the second drive beam 50 only needs to drive the driven object 30 at high speed around the Y axis. Therefore, the second drive beam 50 generates high speed vibration by resonance and vibrates while reducing the stress via the elastic connecting member 40.
  • the configuration is such that the tilting power is directly imparted to the driven object 30 by transmitting.
  • the piezoelectric actuator of the present embodiment when configured as a two-axis drive type, it tilts around the X axis at 60 Hz with an inclination of ⁇ 9 deg, and around the Y axis about 30 kHz with an inclination of ⁇ 12 deg.
  • a pressure actuator that is tilt-driven is configured will be described.
  • FIGS. 4A and 4B are diagrams illustrating a detailed configuration of the piezoelectric actuator according to the first embodiment.
  • FIG. 4A is a diagram illustrating a detailed configuration between the driving object 30 and the driving beam 90 of the piezoelectric actuator according to the first embodiment.
  • a mirror 31 is used as the driving object 30, the details of the configuration of the elastic connecting member 40 that connects the mirror 31 and the second driving beam 50, the weight portion 71 of the movable frame 70, the fixed frame 100, and the like. And details of the connection relationship between the drive beam 90 and the connecting portion 72 of the movable frame 70 are shown.
  • the periphery of the mirror 31 shows the structure of the high-speed drive unit 55 that is resonantly driven at 30 kHz.
  • the high speed drive unit 55 includes the second drive beam 50 and the elastic connecting member 40.
  • the elastic coupling member 40 that couples the mirror 31 and the second drive beam 50 has a structure of two springs in which a portion coupled to the mirror 31 is separated into two.
  • the elastic connecting member 40 is formed as an elastic body because it is formed as a thin beam 15 and is also formed as a thin linear beam 15 in terms of shape.
  • protrusions 101 and 102 are formed on the fixed frame 100 side between the weight portion 71 and the fixed frame 100. Further, weight projections 73 and 74 are formed on the weight portion 71 so as to face each of the projections 101 and 102. Accordingly, the movable range of the weight portion 71 in the horizontal direction can be restricted.
  • the protrusion 101 restricts the movable range of the weight portion 71 in the vertical direction (Y-axis direction), and the protrusion 102 restricts the movable range of the weight portion 71 in the horizontal direction (X-axis direction).
  • the weight portion 71 can move by the size of the gap between the weight portion 71 and the fixed frame 100, so that a large force is applied to the serpentine spring 80 and the like due to external impact, which may cause damage.
  • the protrusion 101 the risk of breakage can be reduced.
  • the protrusion 102 does not exist, the weight portion 71 may collide with the drive source 90 due to an impact of an external force and cause damage.
  • the provision of the protrusion 102 can prevent the damage.
  • a high-speed drive unit wiring terminal 103 and an electrode wiring 104 are provided on the surface of the fixed frame 100.
  • the high-speed driving unit wiring terminal 103 is a wiring terminal for supplying electric power to the electrodes 23 and 24 of the second driving beam 50 of the high-speed driving unit 55, and the electrode wiring 104 has the same purpose. Since the second drive beam 50 is in the central region near the drive target 30, in order to supply power to the second drive beam 50, the fixed frame 100, the drive beam 90, and the meandering spring 80 on the outside are provided. However, since the driving beam 90 has a simple shape in the piezoelectric actuator of the present embodiment, it is possible to reduce the routing of the electrode wiring 104 and reduce the power consumption. Details of this point will be described later.
  • FIG. 4B is an enlarged view around the meandering spring.
  • the driving source 90 has a gap 91 along the X axis, and can perform different deformations on both sides of the X axis.
  • the meandering spring 80 is connected to both of the two drive sources 90 on both sides of the X axis so as to straddle the gap 91.
  • the drive source 90 can impart a tilting force that alternately vibrates to the meandering spring 80 by performing warping deformation opposite to each other in the vertical vertical direction on the near side and the far side with the X axis as a boundary.
  • the drive target parts 30 and 60 can be tilted.
  • FIG. 4B the driving source 90 has a gap 91 along the X axis, and can perform different deformations on both sides of the X axis.
  • the meandering spring 80 is connected to both of the two drive sources 90 on both sides of the X axis so as to straddle the gap 91.
  • the spring structure of the meandering spring 80 has an unequally spaced spring structure in which the distances between adjacent spring portions are not uniform at all. Details of this point will be described later.
  • the electrode wiring 104 is installed along the meandering spring 80. Since the number of turns of the meandering spring 80 is small and the total length is short, the electrode wiring 104 can be configured with a low resistance, and the power consumption can be improved. Details of this point will be described later.
  • FIG. 5A to FIG. 5C are diagrams showing the configuration of the packaged piezoelectric actuator of the first embodiment.
  • 5A is a perspective view illustrating an example of the overall configuration of the packaged piezoelectric actuator 200 according to the first embodiment.
  • FIG. 5B is an example of a central cross-sectional perspective view of the packaged piezoelectric actuator 200 according to the first embodiment.
  • FIG. 5C is a central sectional view of the packaged piezoelectric actuator 200 of the first embodiment.
  • the packaged piezoelectric actuator 200 of the present embodiment is configured such that the piezoelectric actuator 110 is housed in a package 140 and the upper surface is sealed with a sealing glass 150.
  • the piezoelectric actuator 110 according to the present embodiment is gas-sealed using the sealing glass 150 by, for example, vacuum sealing or Ar or N 2 .
  • the driving object 30 is a mirror 31
  • the mirror 31 is irradiated with light through the sealing glass 150, and the irradiated light is reflected and scanned by tilting, thereby being packaged for a projector or a scanner.
  • the piezoelectric actuator 200 can be configured.
  • the packaged piezoelectric actuator 200 includes a package 140 in which a lower regulating member 130 is accommodated, a piezoelectric actuator 110 is accommodated thereon, and an upper regulating member 120 is provided above the piezoelectric actuator 110. On top of that, sealing is performed with a sealing glass 150.
  • the lower regulating member 130 has an adhesive reservoir 131 at the center, and is configured to be able to adhere and fix to the package 140 by accumulating the adhesive.
  • FIG. 5C a sectional configuration in which a lower regulating member 130 is provided below the piezoelectric actuator 110, an upper regulating member 120 is provided above, the package 140 accommodates the whole from below, and a sealing glass 150 is provided on the upper surface. It is shown. Further, an adhesive reservoir 131 is provided at the center of the lower regulating member 130.
  • the movable range of the piezoelectric actuator 110 is regulated by the upper regulating member 120 at the upper side and regulated by the lower regulating member 130 at the lower side. Therefore, even when the packaged piezoelectric actuator 200 receives a large impact due to dropping or the like, it is possible to restrict rapid movement of the piezoelectric actuator 110 and prevent damage.
  • FIG. 6A to 6C are exploded views of the packaged piezoelectric actuator 200 according to the first embodiment.
  • FIG. 6A is an overall exploded view of the packaged piezoelectric actuator 200.
  • an upper restricting member 120 is provided above the piezoelectric actuator 110, and a lower restricting member 130 is provided below, and the entire package 140 is accommodated from below and the upper surface is covered with the sealing glass 150. Yes.
  • the package 140 has a recess 141 at the center, and the fixed frame 100 of the piezoelectric actuator 110 is placed on the flat portion 142 outside the recess 141. Further, on the X axis of the flat portion 142, a placement portion 143 for placing the lower regulating member 130 is provided.
  • the packaged piezoelectric actuator 200 of this embodiment includes protrusions 101 and 102 that restrict the horizontal movable range of the piezoelectric actuator 110 itself. In the vertical direction, an upper restricting member 120 attached to the fixed frame 100 of the piezoelectric actuator 110 and a lower restricting member 130 attached to the package 140 are provided. Therefore, the packaged piezoelectric actuator 200 according to the present embodiment has a configuration that restricts the movable range of the movable frame 70 in two horizontal directions and two vertical directions, and has a configuration that is resistant to impact such as dropping. .
  • FIG. 6B is an enlarged perspective view of the upper regulating member 120
  • FIG. 6C is an enlarged perspective view of the lower regulating member 130.
  • the upper restricting member 120 is configured to be placed on the fixed frame 100 of the piezoelectric actuator 110
  • the lower restricting member 130 is placed and suspended on the placing portions 143 on both sides of the center of the package 140.
  • And has a suspended portion 132.
  • the point that the adhesive reservoir 131 is provided in the central portion of the lower regulating member 130 is as described with reference to FIGS. 5A to 5C.
  • the upper restricting member 120 and the lower restricting member 130 can be easily provided by being placed on the piezoelectric actuator 110 or the package 140, and the piezoelectric actuator 110 that is resistant to an impact in the vertical direction can be realized. It has become.
  • FIGS. 7A to 7C are diagrams for explaining the function of the meandering spring 80 of the piezoelectric actuator 110 according to the first embodiment.
  • FIG. 7A is a perspective view showing the overall configuration of the piezoelectric actuator 110 of the first embodiment
  • FIG. 7B shows a connection of a meandering spring 80 of the piezoelectric actuator 110 of the first embodiment with a straight beam 15 as a comparative reference example. It is a figure which shows the whole structure at the time of setting it as the member 180.
  • FIG. 7C shows a characteristic comparison between the piezoelectric actuator 110 of Example 1 having the meandering spring 80 shown in FIG. 7A and the piezoelectric actuator having the connecting member 180 without the meandering spring 80 shown in FIG. 7B.
  • FIG. 7A is a perspective view showing the overall configuration of the piezoelectric actuator 110 of the first embodiment
  • FIG. 7B shows a connection of a meandering spring 80 of the piezoelectric actuator 110 of the first embodiment with a straight beam 15 as
  • the upper part shows the characteristic of the piezoelectric actuator 110 of Example 1 having the meandering spring of FIG. 7A
  • the lower part shows the characteristic of the piezoelectric actuator of the comparative reference example not having the meandering spring 80 of FIG. 7B.
  • the tilt sensitivity is the same at 2.21 deg / V, but the resonance frequency is 60 Hz for the piezoelectric actuator 110 of Example 1, whereas the piezoelectric actuator of the comparative reference example is 200 Hz. ing. That is, it is considered that the meandering spring 80 has an effect of reducing the resonance frequency.
  • the piezoelectric actuator 110 of Example 1 is 0.08 GPa, whereas the piezoelectric actuator of the comparative reference example is 0.35 GPa. Higher than. From this, it is considered that the meandering spring 80 has an effect of reducing the maximum stress and preventing stress concentration.
  • the meandering spring 80 included in the piezoelectric actuator 110 of the first embodiment has no effect on the tilt sensitivity, but has an effect of reducing the resonance frequency and preventing stress concentration.
  • the meandering spring 80 between the drive source 90 and the movable frame 70, the resonance frequency can be lowered and the maximum stress can be reduced.
  • the weight portion 71 of the movable frame 70 described with reference to FIGS. 3A and 3B will be described.
  • the movable frame 70 has a weight portion 71 so as to sandwich the X axis on both sides of the X axis, and the weight portion 71 is connected by a connecting portion 72 that sandwiches the Y axis.
  • the movable frame 70 including the weight portion 71 is formed of the Si support layer 11 described with reference to FIG.
  • the weight portion 71 has a function of reducing the vibration frequency of the tilting power generated by the drive source 90, similarly to the meandering spring 80 described with reference to FIGS. 7A to 7C. If the area of the weight part 71 is made larger and the thickness of the Si support layer 11 is made thicker, the mass of the weight part 71 is increased, and the resonance frequency can be greatly reduced.
  • the piezoelectric actuator 110 is usually demanded to be small and space-saving. Therefore, the shape of the movable frame 70 including the weight portion 71 is determined based on the shape of the meandering spring 80. Adjustments may be made to obtain the desired low frequency. For example, when the driven object 30 is driven at a low speed of 60 Hz in the X-axis direction, the meandering spring 80 and the weight portion are reduced so that the frequency of the resonance vibration generated by the drive source 90 is reduced to obtain a frequency of 60 Hz. 71 may be adjusted and configured.
  • FIGS. 8A to 11B are diagrams illustrating a state where the piezoelectric actuator 110 according to the first embodiment is configured with two axes and is tilted around each axis.
  • FIG. 8A is a diagram illustrating a state in which the piezoelectric actuator 110 according to the first embodiment is driven to tilt around the axis of the X axis
  • FIG. 8B illustrates that the piezoelectric actuator 110 according to the first embodiment is driven to tilt around the axis of the Y axis.
  • FIG. 8A is a diagram illustrating a state in which the piezoelectric actuator 110 according to the first embodiment is driven to tilt around the axis of the X axis
  • FIG. 8B illustrates that the piezoelectric actuator 110 according to the first embodiment is driven to tilt around the axis of the Y axis.
  • the piezoelectric actuator 110 when configured as the two-axis type, the low-speed driving around the X axis and the high-speed driving around the Y axis are independent vibration systems that do not give vibration to each other's driving system. ing.
  • the tilt around the X axis is driven at 60 Hz and the tilt around the Y axis is driven at 30 kHz.
  • the setting of the drive frequency is variously changed according to the application.
  • FIG. 9A and FIG. 9B are diagrams showing the maximum stress and tilt sensitivity at the adjacent resonance frequency of each resonance drive frequency.
  • FIG. 9A is a diagram showing the maximum stress and tilt sensitivity at the adjacent resonance frequency of the resonance vibration frequency in the 60 Hz drive around the X axis.
  • a high frequency component is present at a value that is a multiple of the resonance frequency within a range of 5 times the resonance frequency. ing. Therefore, when the driven object 30 is driven at a resonance frequency of 60 Hz, high-frequency components do not have to appear at frequencies of 120 Hz, 180 Hz, 240 Hz, and 300 Hz that are multiples of 60 Hz.
  • FIG. 9A there is no peak in the tilt sensitivity characteristic with the above frequency value in the range of 60 Hz to 300 Hz. Further, as described above, if the maximum stress is 0.5 GPa or less, it can be said that there is no problem, but in FIG. 9A, the maximum stress does not exceed 0.2 Gpa, and there is no problem. Therefore, FIG. 9A shows that the tilt drive around the X axis of the piezoelectric actuator 110 of Example 1 does not cause interference with the tilt of the Y axis and has no problem in strength. .
  • FIG. 9B is a diagram showing the maximum stress and tilt sensitivity at the resonance frequency adjacent to the resonance vibration frequency in the 30 kHz drive around the Y axis.
  • the tilt sensitivity has a peak around 30 kHz, and the maximum stress also has a peak.
  • the maximum stress is 0.49 GPa, which is a peak value smaller than 0.5 GPa.
  • the piezoelectric actuator 110 is an independent vibration system that does not cause interference in the tilting of the X axis and the Y axis, and has a configuration with no problem in strength.
  • FIG. 10 is a diagram for explaining the reason why no interference occurs between the tilt drive around the X axis and the tilt drive around the Y axis.
  • a perspective view of an example of the overall configuration of the lower surface side of the piezoelectric actuator 110 according to the first embodiment is shown.
  • the movable frame 70 surrounds the driving object 30.
  • the tilting motion around the Y axis is completed within the frame of the movable frame 70, and the tilting motion around the X axis is completed by applying tilting power to the connecting portion 72 of the movable frame 70. It has become.
  • the movable frame 70 is formed of the Si support layer 11 and is made of a rigid member.
  • the second drive source 50 that is a 30 kHz resonance drive unit, the elastic coupling member 40, and the movable frame 70 that includes the drive target 30 are formed into an annular structure, thereby providing a structure.
  • vibration at 30 kHz resonance is not transmitted to the meandering spring 80 and the drive source 90.
  • vibration propagation from the drive source 90, which is a 60 Hz resonance drive unit, to the second drive source 50 and the elastic connecting member 40 is also hindered. Therefore, the piezoelectric actuator 110 according to the first embodiment has a structure in which the drive sources 50 and 90 are vibrationally independent and the occurrence of interference is suppressed.
  • FIG. 11A and 11B show, as a comparative reference example, the operation of a piezoelectric actuator in which the connecting portion 80 is eliminated from the movable frame 70, the movable frame 70 is not an annular structure, and only the weight portions 71 are present on both sides of the X axis. It is a figure which shows a state.
  • FIG. 11A shows an operating state during 60 Hz resonant driving
  • FIG. 11B shows an operating state during 30 kHz resonant driving.
  • FIG. 12A to 12C are diagrams illustrating a method for optimally designing the shape of the high-speed drive unit 55 of the piezoelectric actuator 110 according to the first embodiment.
  • FIG. 12A is a diagram illustrating a planar configuration of the high-speed drive unit 55 of the piezoelectric actuator according to the first embodiment.
  • the piezoelectric actuator 110 may be configured by the semiconductor wafer 10 or the like, but the dynamic breaking stress due to the twist mode of Si is about 2 GPa. Considering a work-affected layer by D-RIE (Deep Reactive Ion Etching), the breaking stress is about 1.5 GPa. Furthermore, considering the application of repeated stress, it is necessary to design the maximum stress to 0.5 GPa or less. Further, the tilt sensitivity is set to 1.2 deg / V or more as a target value.
  • the high-speed drive unit 55 of the piezoelectric actuator 110 includes an elastic connecting member 40 and a second drive beam 50.
  • the elastic connecting member 40 includes a first spring 41, a second spring 42, and a spring connecting portion 43.
  • the driving object 30 is connected to the second driving beam 50 via the first spring 41, the spring connecting portion 43, and the second spring 42.
  • each parameter is defined as follows.
  • the widths of the first spring 41 and the second spring are both 0.06 mm.
  • the resonance frequency can be greatly changed.
  • the distance between the first springs 41 is A
  • the distance between the first and second springs is B
  • the first spring 41 and the second spring 42 from the outermost side in the X-axis direction to the Y axis
  • the resonance frequency can be adjusted to a constant 30 kHz by making C variable.
  • FIG. 12B shows a case where the distance A between the two first springs 41 and the length B of the spring connecting portion 43 are used as parameters when the driven object 30 is tilted by ⁇ 12 deg under the conditions shown in FIG. 12A. It is a figure which shows the change characteristic of maximum stress.
  • the horizontal axis indicates the length B [mm] of the spring connecting portion 43
  • the vertical axis indicates the maximum stress [GPa].
  • FIG. 12B shows that the smaller the value of A, the smaller the maximum stress.
  • the above equation (1) is a relational expression obtained by connecting the minimum values of the characteristic curves.
  • the width of the first spring 41 and the second spring 42 is 0.06 mm, which is narrower than the spring connecting portion 43 connecting them, and includes a twisted portion. Therefore, when the length of the spring connecting portion 43 is shortened, stress concentrates on the twisted portion of the second spring 42, and when the length of the spring connecting portion 43 is increased, stress concentrates on the twisted portion of the first spring 41.
  • the stress concentration portion can be moved to the spring connecting portion 43 by setting the length of the spring connecting portion 43 to an intermediate length. By moving the stress concentration portion to the spring connection portion 43 that is wide and does not include a large twist portion, the stress when the drive target 30 is tilted by ⁇ 12 deg can be reduced and a minimum value can be obtained.
  • FIG. 14 is a diagram showing the characteristics of the tilt sensitivity when the distance A between the first springs 41 and the length B of the spring connecting portion 43 are used as parameters.
  • the horizontal axis indicates the length B [mm] of the spring connecting portion 43
  • the vertical axis indicates the tilt sensitivity [deg / V].
  • the width of each of the first spring 41 and the second spring 42 is 0.06 mm
  • C 1.2 mm
  • R1 0.015 mm
  • R2 0.175 mm.
  • the tilt sensitivity is 3.58 deg / V
  • the voltage for tilting at a tilt angle of ⁇ 12 deg is 0 to 6.5 V
  • the maximum stress is 0.49 GPa.
  • the piezoelectric actuator 110 of the present embodiment the power consumption of the high-speed drive unit 55 is reduced to 1 / 9.5 due to the improvement in sensitivity.
  • the piezoelectric actuator 110 is not a system in which tilting is piled up by non-resonant driving of a driving beam that is folded back many times, but is driven by resonance, and the frequency is lowered by the meandering spring 80 and the weight part 71. Adopts a low-speed drive system. Therefore, the driving beam 90 that performs low-speed driving does not have a complicated folding structure, and there are only two (4 pieces) near the fixed frame 100. Therefore, in order to supply power to the 30 kHz drive units 40 and 50 existing in the central portion, it is not necessary to lay out complicated wiring along the folded structure, and power can be supplied with short wiring.
  • the fixed frame 100 is provided with four high-speed drive wiring terminals 103.
  • the second driving beam 50 of the 30 kHz resonance unit can be reached with extremely short wiring,
  • the power supply wiring for the 30 kHz resonance unit can be arranged with a short wiring.
  • the wiring length is reduced to 1/10 as compared with the prior art, and the power consumption can be reduced due to the reduction of the wiring resistance.
  • the driving beam 90 that performs low-speed driving is not a folded structure as described above, but has a structure in which only two driving beams 90 are arranged on the outside, so that the area of the driving source 20 is greatly reduced. It has a configuration. Due to the reduction in the area of the drive source 20 and the improvement in the tilt angle sensitivity (conventional 0.8 deg / V ⁇ the present embodiment 2.2 deg / V), the power consumption of the drive beam 90 that drives at low speed is about 1/15. Can be reduced.
  • the area of the drive source 20 of the second drive beam 50 that performs high-speed driving is the same as the area of the conventional drive source 20 that performs high-speed driving, a synergistic effect of improving tilt sensitivity and reducing wiring resistance is also achieved.
  • the power consumption of the second drive beam 50 can be reduced to about 1/20.
  • FIGS. 16 to 22C a structure resistant to the drop impact of the piezoelectric actuator 110 according to the first embodiment will be described with reference to FIGS. 16 to 22C.
  • FIGS. 16 to 18 a configuration serving as an impact countermeasure for the movable frame 70 and the fixed frame 100 will be described.
  • the weight portion 71 when the weight portion 71 is tilted by ⁇ 9 deg around the X axis, the weight portions 71 on both sides of the X axis approach the fixed frame 100 of about 0.05 mm in the Y axis direction.
  • FIG. 17 is a view for explaining an arrangement configuration of the weight protrusions 73 and 74 and the protrusions 101 and 102.
  • FIG. 17 is a perspective view of the lower surface of the piezoelectric actuator 110 according to the first embodiment.
  • the weight portion protrusion 73 is provided on the extension line of the connecting portion 72 extending in the Y-axis direction.
  • a protrusion 101 is provided on the opposite outer side. Therefore, regarding the movement in the Y-axis direction, a force is received at a portion resistant to the impact on the extension line of the connecting portion 72, and the movable frame 70 is highly resistant to the impact.
  • FIG. 18 is a diagram illustrating an example of a cross-sectional configuration cut along the X axis of the packaged piezoelectric actuator 110 according to the first embodiment.
  • FIG. 19 is an enlarged view including the periphery of the meandering spring 80.
  • a meandering spring 80 is shown, and two electrode wirings 104 pass through the meandering spring 80 in order to supply power to the drive source 20 of the second drive beam 50 on the high speed side. Therefore, when the width of the electrode wiring 104 is 0.02 mm, the spring width of the meandering spring 80 is 0.07 mm (line 0.02 mm ⁇ 2 + space 0.01 mm).
  • the interval between adjacent springs of the meandering spring 80 is expressed as H, I, J from the outside to the inside, and the length of the meandering spring 80 in the X-axis direction is K.
  • adjacent spring intervals H, I, and J have a relationship of H ⁇ J ⁇ I, and are not equal intervals.
  • an example of a method for setting the adjacent spring intervals H, I, and J will be described.
  • the breaking stress is 1.5 GPa, and the stress is not repeatedly applied in the drop impact. Therefore, if the design is made so that the maximum stress is 1.0 GPa or less by multiplying the safety factor, it is sufficient for the drop impact. Designed to withstand.
  • the interval D described in FIGS. 16 and 18 is symmetric with respect to the X axis
  • the interval E is symmetric with respect to the Y axis
  • the meandering spring 80 is also symmetrical with respect to the Y axis. Shall.
  • FIG. 20A shows that a large stress is applied in the + Y direction.
  • 20B shows that the meandering spring 80 on the left side has the adjacent spring interval H narrowed, the adjacent spring interval I opened, and the spring shape is deformed. It is also shown in FIG. 20B that the maximum stress of the serpentine spring 80 is applied to the connecting portion of the adjacent spring interval I.
  • 20C shows that the spring shape of the right serpentine spring 80 is deformed so that the adjacent spring intervals H and J are narrowed and the adjacent spring interval I is opened.
  • the maximum stress value was 0.66 GPa.
  • the piezoelectric actuator 110 according to the first embodiment generates a stress of 1 even when the driving object 30, the high-speed driving unit 55, and the movable frame 70 are displaced in the X, Y, and Z directions by the application of the drop impact acceleration. 0.0 GPa or less.
  • FIG. 22A to 22C are diagrams showing stress distributions when the driving beam 90 and the movable frame 70 are connected by a linear spring 180 of an elastic beam without providing the meandering spring 80 as a comparative reference example.
  • FIG. 22A is a general deformation view
  • FIG. 22B is an enlarged view of the left linear spring 180
  • the meandering spring 80 has the effect of preventing stress concentration by reducing the resonance frequency described with reference to FIGS. 7A to 7C, as well as the effect of dispersing the stress generated by the drop impact and preventing the piezoelectric actuator 110 from being damaged. I understand that there is.
  • the driving beam 90 for low-speed driving has a simple configuration of two outside (four pieces), the driving beam 90 is driven to resonate, and the meandering spring 80 and the movable
  • the piezoelectric actuator 110 of an independent vibration system that does not cause interference in two axes. Can be configured.
  • power consumption can be reduced by reducing the length of the wiring 104 and the area of the driving source 20.
  • the drive beam 92 for low-speed drive has a folded structure, and the drive beam group 93 is configured by a plurality of drive beams 92, whereby the tilt sensitivity can be improved.
  • the tilt sensitivity of the piezoelectric actuator 111 of Example 2 was 4.4 deg / V, and the tilt sensitivity of about twice that of the piezoelectric actuator 111 of Example 1 was obtained. Further, the maximum stress was about 3 MPa, and there was no problem.
  • FIGS. 24A and 24B are diagrams illustrating a deformed state when the piezoelectric actuator 111 according to the second embodiment is driven.
  • FIG. 24A is a modified view showing a state in which the piezoelectric actuator 111 of the second embodiment is driven at a low speed around the X axis
  • FIG. 24B is a diagram showing a high speed operation of the piezoelectric actuator 111 of the second embodiment around the Y axis. It is the deformation
  • the piezoelectric actuator 111 according to the second embodiment is configured as the biaxial piezoelectric actuator 111, the tilting drive around the axis of the other drive shaft does not interfere with the tilting drive around the other axis. It has a configuration.
  • the piezoelectric actuator 111 of the second embodiment since the driving beam 92 has a folded structure, the manufacturing process is slightly more complicated than that of the piezoelectric actuator 110 of the first embodiment, but the number of stages of the folded structure is small. It is unlikely that the power will increase significantly or the manufacturing yield will deteriorate significantly.
  • the piezoelectric actuator 111 according to the second embodiment has advantages in terms of power consumption and manufacturing yield as compared with a piezoelectric actuator using a non-resonant driving beam for low-speed driving.
  • the tilt sensitivity can be further improved.
  • FIGS. 25A to 25C are diagrams for explaining a changed portion of the piezoelectric actuator 112 according to the third embodiment of the present invention.
  • the piezoelectric actuator 112 according to the third embodiment has a configuration that improves the tilt angle sensitivity and reduces the maximum stress in the high-speed drive unit 55.
  • parameters are set in the high-speed drive unit 55 so as to improve the tilt sensitivity and reduce the maximum stress.
  • the width of the first spring 44 is set to A
  • the width of the second spring 42 is set to A / 2 that is 1 ⁇ 2 of the width A of the first spring 44.
  • the length of the spring connecting portion 43 is B
  • the distance from the outer ends of the first spring 44 and the second spring 42 to the X axis is C.
  • the resonance frequency is set to fixed 30 kHz by making the distance C to the X-axis of the 1st spring 44 and the spring connection part 43 variable.
  • the spring connection part 43 exists in four places as a whole, all are set to a common value.
  • FIG. 25B shows a change characteristic of the inclination sensitivity [deg / V] with respect to the change of the width A of the first spring 44 and the length B of the spring connecting portion 43 when the driving object 30 is inclined at an inclination angle of ⁇ 12 deg.
  • the tilt sensitivity is 4.50 deg / V
  • the voltage for tilting at a tilt angle of ⁇ 12 deg is 0-3.5 V
  • the maximum stress can be 0.38 GPa
  • the maximum stress is small
  • the tilt sensitivity is high. Good characteristics can be obtained.
  • the piezoelectric actuator 112 of the third embodiment it is possible to improve the tilt angle sensitivity of the high-speed drive unit 55 and reduce the maximum stress.
  • FIG. 26A to 26C are perspective views showing an example of the configuration of the packaged piezoelectric actuator 201 according to the fourth embodiment of the present invention.
  • FIG. 26A is an example of an overall perspective view of the packaged piezoelectric actuator 201 of Example 4
  • FIG. 26B is an example of an exploded perspective view of the packaged piezoelectric actuator 201 of Example 4.
  • FIG. These are the cross-sectional perspective views of the packaged piezoelectric actuator 201 of Example 4.
  • the piezoelectric actuator 110 is accommodated in the package 140, and the upper surface is covered with the sealing glass 150, which is the same as the packaged piezoelectric actuator 200 of the first embodiment.
  • the packaged piezoelectric actuator 201 according to the fourth embodiment is different from the upper regulating member 120 in that the member that regulates the movable range in the vertical direction is the vertical regulating member 133 in which the upper regulating member and the lower regulating member are integrated. This is different from the packaged piezoelectric actuator 200 of the first embodiment in which the lower regulating member 130 is provided separately. Since the other components are the same as those in the first embodiment, the same reference numerals as those in the first embodiment are attached and the description thereof is omitted.
  • FIG. 26B a perspective view of the vertical direction regulating member 133 is shown, but the vertical walking regulating member 133 has an upper regulating portion 134 and a lower regulating portion 135.
  • the lower restricting portion 135 is placed and accommodated on the package 140, and the upper restricting portion 134 extends upward so as to sandwich the meandering spring 80, and restricts the upward movement of the piezoelectric actuator 110.
  • FIG. 26C shows a cross-sectional configuration of the packaged piezoelectric actuator 201 according to the fourth embodiment.
  • the lower restricting portion 135 floats at the center and restricts the movable range below the piezoelectric actuator 110.
  • the upper restricting portion 134 extends from the gap on both sides of the meandering spring 80 of the piezoelectric actuator 110 so as to penetrate the piezoelectric actuator 110, and the movable range above the piezoelectric actuator 110 is restricted by a key-shaped portion. is doing.
  • both the upper and lower piezoelectric actuators 201 can be used.
  • the movable range can be restricted. Thereby, it is possible to prevent damage due to impact such as dropping with a simple configuration that is easy to assemble.
  • FIG. 27A to 27C are perspective views showing the configuration of the packaged piezoelectric actuator 202 according to the fifth embodiment of the present invention.
  • FIG. 27A is a perspective view illustrating an example of the overall configuration of the packaged piezoelectric actuator 202 of the fifth embodiment
  • FIG. 27B is an example of an exploded perspective view of the packaged piezoelectric actuator 202 of the fifth embodiment.
  • FIG. 27C is a cross-sectional perspective view of the packaged piezoelectric actuator 202 according to the fifth embodiment.
  • the configuration in which the piezoelectric actuator 110 is accommodated in the package 140 and the upper surface is covered with the sealing glass 150 is the first embodiment. And it is the same as the packaged piezoelectric actuator 200 of the fourth embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
  • the vertical direction regulating member 136 is attached to the movable frame 70 instead of the package 140. This is different from the bent piezoelectric actuator 201.
  • the vertical restricting member 136 is provided at a position between the movable frame 70 and the meandering spring 80, only the vertical movable range can be restricted without hindering normal tilting drive.
  • the vertical regulating member 136 is similar to the packaged piezoelectric actuator 201 of the fourth embodiment in that it has an upper regulating portion 137 and a lower regulating portion 138.
  • the packaged piezoelectric actuator 202 of the fifth embodiment it is possible to take measures against dropping of the piezoelectric actuator 110 by using a small vertical regulating member 136, and to reduce the overall size. While configuring, the drop impact can be appropriately performed.
  • FIG. 28A to 28C are perspective views showing the configuration of the packaged piezoelectric actuator 203 according to the sixth embodiment of the present invention.
  • FIG. 28A is a perspective view showing an example of the overall configuration of the packaged piezoelectric actuator 203 of the sixth embodiment
  • FIG. 28B is an example of an exploded perspective view of the packaged piezoelectric actuator 203 of the sixth embodiment.
  • FIG. 28C is a perspective view of a cross-sectional configuration of the packaged piezoelectric actuator 203 according to the sixth embodiment.
  • the configuration in which the piezoelectric actuator 110 is accommodated in the package 140 and the upper surface is covered with the sealing glass 150 is the first embodiment. Similar to the 4 and 5 packaged piezoelectric actuators 200. Therefore, the same components as those in the first, fourth, and fifth embodiments are denoted by the same reference numerals, and the description thereof is omitted.
  • the packaged piezoelectric actuator 203 includes an upper restriction member 121 attached to the sealing glass 150 and a lower restriction member 139 attached to the package 140. Different from 4 and 5 packaged piezoelectric actuators 203. As described above, the upper regulating member 121 may be configured to be attached to the sealing glass 150.
  • both the upper restricting member 121 and the lower restricting member 139 are linear members having a thickness, and have a simple configuration. Is very easy to process.
  • the packaged piezoelectric actuator 203 of the sixth embodiment by using the upper restricting member 121 and the lower restricting member 139 that are easy to process with a simple configuration, it is possible to reliably take measures to prevent the drop. .
  • the projector 300 includes a piezoelectric mirror 205, a laser diode 210, a collimator lens 220, a polarizing beam splitter 230, a quarter wavelength plate 240, and a CPU (Central Processing Unit). ) 250, a laser diode driver IC (Integrated Circuit) 260, and a piezoelectric mirror driver IC 270.
  • a screen 310 is shown as a related component.
  • the laser diode 210 is a light source that emits laser light.
  • the laser light emitted from the laser diode 210 may be diverging light.
  • the polarizing beam splitter 230 is a beam separating unit on which a polarizing film that reflects P-polarized light (or S-polarized light) and transmits S-polarized light (or P-polarized light) is formed.
  • P-polarized light is a component of light that oscillates within the light incident surface
  • S-polarized light is a component of light that oscillates perpendicularly to the light incident surface. That is, the polarization beam splitter 230 reflects one of P-polarized light and S-polarized light and transmits the other.
  • the polarization beam splitter 230 functions as a light guiding unit that guides light in the direction of the piezoelectric mirror 205.
  • the laser light reflected by the polarization beam splitter 230 passes through the quarter-wave plate 240 integrated with the polarization beam splitter 230 and travels toward the piezoelectric mirror 205.
  • Piezoelectric mirror 205 drives mirror 31 biaxially and reflects laser light from quarter-wave plate 240.
  • the laser beam reflected by the piezoelectric mirror 205 is transmitted through the quarter-wave plate 240 again to be converted to S-polarized light, transmitted through the polarization beam splitter 230, and irradiated onto the screen 310.
  • CPU 250 is means for controlling the laser diode driver IC 260 and the piezoelectric mirror driver IC 270.
  • the laser diode driver IC 260 is means for driving the laser diode 210.
  • the piezoelectric mirror driver IC 270 is means for driving the piezoelectric mirror 205.
  • the CPU 250 controls the laser driver IC 260 and drives the laser diode 210.
  • the CPU 250 also controls the piezoelectric mirror driver 270 to control the tilting movement of the piezoelectric mirror 205 around the X axis and the Y axis.
  • the piezoelectric mirror 205 tilts, the light reflected by the mirror 31 of the piezoelectric mirror 205 is scanned on the screen 310, and an image is formed on the screen 310.
  • the biaxial piezoelectric actuators 110, 111, 112, 200, 201, 202, 203, and 205 have been described.
  • the low-speed drive or The present invention can also be applied to a uniaxial piezoelectric actuator that performs only high-speed driving.
  • the configuration and functions of the piezoelectric actuators 110 to 112, 200 to 203, and 205 of this embodiment may be applied to only one axis that is driven at high speed or low speed. Good.
  • the present invention can be used for a projector, a scanner, or the like that includes a small actuator and a piezoelectric actuator that drive a tilted drive object such as a mirror to scan a light beam or the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
PCT/JP2010/064794 2009-09-04 2010-08-31 圧電アクチュエータ及び圧電アクチュエータを備える光走査装置 WO2011027742A1 (ja)

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CN102474204B (zh) 2014-11-05
CN102474204A (zh) 2012-05-23
KR20120039662A (ko) 2012-04-25
JP2011061881A (ja) 2011-03-24
KR101478205B1 (ko) 2014-12-31
JP5509742B2 (ja) 2014-06-04

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