WO2011024502A1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
WO2011024502A1
WO2011024502A1 PCT/JP2010/055838 JP2010055838W WO2011024502A1 WO 2011024502 A1 WO2011024502 A1 WO 2011024502A1 JP 2010055838 W JP2010055838 W JP 2010055838W WO 2011024502 A1 WO2011024502 A1 WO 2011024502A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
package
light
emitting element
Prior art date
Application number
PCT/JP2010/055838
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French (fr)
Japanese (ja)
Inventor
徹 三宅
Original Assignee
京セラ株式会社
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Publication of WO2011024502A1 publication Critical patent/WO2011024502A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F21V13/08—Combinations of only two kinds of elements the elements being filters or photoluminescent elements and reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting device including a light emitting element such as a light emitting diode.
  • a light emitting device having a light emitting element is expected from the viewpoint of low power consumption.
  • the light emitting device includes a wavelength conversion member that is excited by light emitted from the light emitting element.
  • the light emitting device is required to further improve the luminous efficiency.
  • As one method for improving the light emission efficiency of the light emitting device there is a method of reducing fluctuations in the light emission efficiency of the light emitting element or the wavelength conversion member due to heat.
  • the light emitting device includes a first package, a second package, a light emitting element, and a wavelength conversion member.
  • the first package has a first recess.
  • the 2nd package is provided in the 1st crevice, and has the 2nd crevice.
  • the light emitting element is provided in the second recess.
  • the wavelength conversion member is provided above the second package and is fixed to the first package.
  • FIG. 1 shows a perspective view of a light emitting device in one embodiment of the present invention.
  • FIG. 2 shows a cross-sectional view of the light emitting device shown in FIG. 1.
  • FIG. 2 is a perspective view of the first frame member 12 shown in FIG. 1.
  • the perspective view of the 2nd frame member 22 shown by FIG. 1 is shown.
  • 3 shows heat conduction and dissipation in the light emitting device shown in FIG. 3 shows a heat conduction path in the light emitting device shown in FIG. 2.
  • 3 shows a heat conduction path in the light emitting device shown in FIG. 2.
  • 3 shows a light emitting structure in the light emitting device shown in FIG.
  • the perspective view of the light-emitting device in other embodiments of the present invention is shown.
  • a light emitting device includes a first package 1, a second package 2 provided in the first package, and a second package.
  • the light emitting element 3 provided in the package 2 and the wavelength conversion member 4 provided above the second package 2 are included.
  • the light emitting device is mounted on the xy plane of a virtual xyz space and is partially omitted for the purpose of showing the internal structure.
  • the upward direction means the positive direction of the virtual z axis.
  • the first package 1 includes a first base body 11 and a first frame member 12 provided on the first base body 11.
  • the first package 1 has a first recess 13 surrounded by a first base 11 and a first frame member 12.
  • the first base 11 is substantially made of a resin, for example.
  • the first frame member 12 is bonded to the upper surface of the first base 11 and is substantially made of, for example, an insulating material.
  • An example of the insulating material is ceramics.
  • the first frame member 12 includes an opening 121 in which the second package 2 is provided, and a first light reflecting portion 122 that reflects light emitted from the light emitting element 3.
  • the first light reflecting portion 122 has a porous structure, for example.
  • the porous structure is a structure having a plurality of ceramic particles 123 and a plurality of pores 124 existing between the plurality of ceramic particles 123, and has a porosity included in a range of 15% to 43%.
  • An exemplary method of measuring the porosity of the first light reflecting portion 122 is a mercury intrusion method using a Pore Sizer 9310 type manufactured by Micromeritics.
  • the second package 2 is provided in the first recess 13 of the first package 1, and includes a second base 21 and a second frame member 22. It is out.
  • the second package 1 has a second recess 23 surrounded by the second base 21 and the second frame member 22.
  • the second base 21 is substantially made of ceramics, for example.
  • the second frame member 22 is bonded to the upper surface of the second base 21 and is substantially made of ceramics, for example.
  • the second frame member 22 has a second light reflecting portion 222 that reflects the light emitted from the light emitting element 3.
  • the second light reflecting portion 222 has a porous structure, for example.
  • the porous structure is a structure having a plurality of ceramic particles 223 and a plurality of pores 224 existing between the plurality of ceramic particles 223, and has a porosity included in a range of 15% to 43%.
  • An exemplary method for measuring the porosity of the second light reflecting portion 222 is a mercury intrusion method using a Pore Sizer 9310 type manufactured by Micromeritics.
  • the light emitting element 3 is provided in the second recess 23 of the second package 2 and mounted on the upper surface of the second base 21.
  • the light emitting element 3 is, for example, a light emitting diode (LED) containing a semiconductor material.
  • the light emitting element 3 emits primary light according to the driving power.
  • the primary light has a wavelength included in a range from ultraviolet light to blue light, for example.
  • the wavelength conversion member 4 covers the light emitting element 3 and is fixed to the first package 1.
  • the wavelength conversion member 4 is joined to the upper end portion of the first frame member 12.
  • the wavelength conversion member 4 includes a plurality of fluorescent particles 41.
  • the fluorescent particles 41 are excited by the primary light and emit secondary light.
  • the secondary light has a wavelength included in the visible light region.
  • the wavelength conversion member 4 emits white light, for example.
  • the wavelength conversion member 4 has a sheet shape.
  • the light emitting device further includes an enclosing member 5 that is provided in the second recess 23 of the second package 2 and covers the light emitting element 3.
  • the enclosing member 5 is attached to the light emitting element 3 and surrounds the upper surface and the side surface of the light emitting element 3.
  • the enclosing member 5 is filled in the second recess 23 and covers the light emitting element 3.
  • the enclosing member 5 has translucency. Translucency means that at least a part of the wavelength of the primary light emitted from the light emitting element 3 is transmitted.
  • the enclosing member 5 is substantially made of a silicone resin, for example.
  • Heat generated by the light emitting element 3 is conducted to the first base 11 through the second package 2.
  • the heat conducted to the first substrate 11 is conducted downward in the light emitting device.
  • the heat conduction region generated by the light emitting element 3 is indicated by a dot pattern region including the mounting position of the light emitting element 3.
  • Part of the heat generated by the fluorescent particles 41 of the wavelength conversion member 4 is dissipated from the surface of the wavelength conversion member 4.
  • Another part of the heat generated by the fluorescent particles 4 is conducted to the upper end of the first frame member 12.
  • the heat conducted to the upper end portion of the first frame member 12 is dissipated from the first frame member 12.
  • the heat conduction region generated by the tendency particles 41 is indicated by a dot pattern region including the arrangement position of the wavelength conversion member 4.
  • the light emitting device has a structure in which the region where heat generated by the light emitting element 3 is conducted and the region generated by the wavelength fluorescent particles 41 but are conducted hardly overlap each other. 3 or the variation in the luminous efficiency of the fluorescent particles 41 can be reduced.
  • the light emitting element 3 is less susceptible to fluctuations in light emission efficiency due to heat generated by the fluorescent particles 41.
  • the fluorescent particles 41 are less susceptible to fluctuations in luminous efficiency due to heat generated by the light emitting element 3.
  • the light emitting device of this embodiment is improved in terms of light emission efficiency.
  • the heat conduction from the fluorescent particle 41 to the light emitting element 3 will be described. Part of the heat generated by the fluorescent particles 41 of the wavelength conversion member 4 is radiated below the wavelength conversion member 4. Since the light emitting device in the present embodiment includes the enclosing member 5, the conduction of the heat radiated below the wavelength conversion member 4 to the light emitting element 3 is reduced. Therefore, the light emitting device in the present embodiment is reduced with respect to variation in the light emission efficiency of the light emitting element 3 due to heat.
  • the heat conduction from the light emitting element 3 to the fluorescent particles 41 will be described with reference to FIG.
  • the light emitting device of the present embodiment has a gap provided between the first frame member 12 and the second package 2. Part of the heat generated by the light emitting element 3 is conducted to the second package 2 and dissipated from the second package 2.
  • the second package 2 and the first frame member 12 are separated from each other, so that heat conduction from the second package 2 to the first frame member 12 is reduced. . Therefore, the light emitting device in the present embodiment is reduced with respect to fluctuations in the luminous efficiency of the fluorescent particles 41 due to heat.
  • the light emission structure in the light-emitting device of this embodiment is demonstrated.
  • the primary light 100 radiated from the light emitting element 3 is guided upward by the second package 2.
  • the light reflected downward on the lower surface of the wavelength conversion member 4 or the surface of the fluorescent particles 41 is reflected upward by the light reflecting portion 122 of the first frame member 12.
  • the light reflecting portion 122 has a porous structure, so that the light is totally reflected by the light reflecting portion 122. Therefore, the light emitting device of this embodiment is improved with respect to the light emission efficiency.
  • the second package 2 includes the second light reflecting portion 222 having a porous structure, thereby improving the reflection efficiency of the primary light emitted from the light emitting element 3. ing. Therefore, the light emitting device of this embodiment is improved in terms of light emission efficiency.
  • the second package 2 includes the second light reflecting portion 222 having a porous structure, so that the primary light emitted from the light emitting element 3 can be scattered. . Therefore, the light emitting device of this embodiment is improved in terms of light emission efficiency.
  • the possibility that the encapsulating member 5 is peeled off due to heat is reduced because part of the enclosing member 5 is impregnated in the second light reflecting portion 222. Therefore, the light emitting device in this embodiment is improved with respect to reliability.
  • the first frame member 12 has a lower end portion including a surface parallel to the side surface of the second frame member 22, so that the first frame member 12 in the manufacturing process It is reduced with respect to damage of the first frame member 12 or the second frame member 22 due to contact with the second frame member 22.
  • FIG. 9 a light emitting device according to another embodiment of the present invention will be described.
  • the configuration different from the light emitting device shown in FIG. 1 is the shape of the enclosing member 5.
  • Other configurations are the same as those of the light emitting device shown in FIG.
  • the enclosing member 5 has an upper end portion located above the upper end portion of the second frame member 22.
  • the upward direction is the positive direction of the virtual z axis.
  • the upper end portion of the enclosing member 5 has a dome shape.

Abstract

Disclosed is a light emitting device that comprises, for example, a light emitting element such as a light-emitting diode. The light emitting device comprises a first package, a second package, the light emitting element, and a wavelength conversion member. The first package is provided with a first recess. The second package is disposed within the first recess and is provided with a second recess. The light emitting element is disposed within the second recess. The wavelength conversion member is disposed above the second package and is fixed to the first package.

Description

発光装置Light emitting device
　本発明は、例えば発光ダイオードなどの発光素子を含む発光装置に関するものである。 The present invention relates to a light emitting device including a light emitting element such as a light emitting diode.
　近年、例えば照明分野などにおいて、発光素子を有する発光装置の開発が進められている。発光素子を有する発光装置は、低消費電力の観点などにおいて期待されている。発光装置は、発光素子から放射された光によって励起される波長変換部材を含んでいる。 In recent years, for example, in the lighting field, development of light emitting devices having light emitting elements has been promoted. A light emitting device having a light emitting element is expected from the viewpoint of low power consumption. The light emitting device includes a wavelength conversion member that is excited by light emitted from the light emitting element.
　発光装置は、さらなる発光効率の向上が求められている。発光装置の発光効率を向上させるための一つの方法として、熱による発光素子または波長変換部材の発光効率の変動を低減させる方法がある。 The light emitting device is required to further improve the luminous efficiency. As one method for improving the light emission efficiency of the light emitting device, there is a method of reducing fluctuations in the light emission efficiency of the light emitting element or the wavelength conversion member due to heat.
　本発明の一つの態様によれば、発光装置は、第１のパッケージと、第２のパッケージと、発光素子と、波長変換部材とを含んでいる。第１のパッケージは、第１の凹部を有している。第２のパッケージは、第１の凹部内に設けられており、第２の凹部を有している。発光素子は、第２の凹部内に設けられている。波長変換部材は、第２のパッケージの上方に設けられており、第１のパッケージに固定されている。 According to one aspect of the present invention, the light emitting device includes a first package, a second package, a light emitting element, and a wavelength conversion member. The first package has a first recess. The 2nd package is provided in the 1st crevice, and has the 2nd crevice. The light emitting element is provided in the second recess. The wavelength conversion member is provided above the second package and is fixed to the first package.
本発明の一つの実施形態における発光装置の斜視図を示している。1 shows a perspective view of a light emitting device in one embodiment of the present invention. 図１に示された発光装置の断面図を示している。FIG. 2 shows a cross-sectional view of the light emitting device shown in FIG. 1. 図１に示された第１のフレーム部材１２の斜視図を示している。FIG. 2 is a perspective view of the first frame member 12 shown in FIG. 1. 図１に示された第２のフレーム部材２２の斜視図を示している。The perspective view of the 2nd frame member 22 shown by FIG. 1 is shown. 図２に示された発光装置における熱の伝導および放散を示している。3 shows heat conduction and dissipation in the light emitting device shown in FIG. 図２に示された発光装置における熱の伝導経路を示している。3 shows a heat conduction path in the light emitting device shown in FIG. 2. 図２に示された発光装置における熱の伝導経路を示している。3 shows a heat conduction path in the light emitting device shown in FIG. 2. 図２に示された発光装置における発光構造を示している。3 shows a light emitting structure in the light emitting device shown in FIG. 本発明の他の実施形態における発光装置の斜視図を示している。The perspective view of the light-emitting device in other embodiments of the present invention is shown.
　以下、本発明の実施形態について図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　図１および図２に示されているように、本発明の一つの実施形態における発光装置は、第１のパッケージ１と、第１のパッケージ内に設けられた第２のパッケージ２と、第２のパッケージ２内に設けられた発光素子３と、第２のパッケージ２の上方に設けられた波長変換部材４とを含んでいる。図１において、発光装置は、仮想のｘｙｚ空間のｘｙ平面上に実装されているとともに、内部構造を示すことを目的に部分的に省略されている。図１において、上方向とは、仮想のｚ軸の正方向のことをいう。 As shown in FIGS. 1 and 2, a light emitting device according to an embodiment of the present invention includes a first package 1, a second package 2 provided in the first package, and a second package. The light emitting element 3 provided in the package 2 and the wavelength conversion member 4 provided above the second package 2 are included. In FIG. 1, the light emitting device is mounted on the xy plane of a virtual xyz space and is partially omitted for the purpose of showing the internal structure. In FIG. 1, the upward direction means the positive direction of the virtual z axis.
　第１のパッケージ１は、第１の基体１１と、第１の基体１１の上に設けられた第１のフレーム部材１２とを含んでいる。第１のパッケージ１は、第１の基体１１および第１のフレーム部材１２に囲まれた第１の凹部１３を有している。第１の基体１１は、例えば、実質的に樹脂からなる。第１のフレーム部材１２は、第１の基体１１の上面に接合されており、例えば、実質的に絶縁材料からなる。絶縁材料の例は、セラミックスである。 The first package 1 includes a first base body 11 and a first frame member 12 provided on the first base body 11. The first package 1 has a first recess 13 surrounded by a first base 11 and a first frame member 12. The first base 11 is substantially made of a resin, for example. The first frame member 12 is bonded to the upper surface of the first base 11 and is substantially made of, for example, an insulating material. An example of the insulating material is ceramics.
　図３に示されているように、第１のフレーム部材１２は、第２のパッケージ２が設けられる開口部１２１と、発光素子３から放射された光を反射する第１の光反射部１２２とを有している。第１の光反射部１２２は、例えばポーラス構造を有している。ポーラス構造とは、複数のセラミック粒子１２３と、その複数のセラミック粒子１２３の間に存在する複数の気孔１２４とを有する構造のことであり、１５％から４３％までの範囲に含まれる気孔率を有している。第１の光反射部１２２の気孔率の例示的な測定方法は、マイクロメリティクス（Micromeritics）社製のポアサイザー（Pore Sizer）９３１０型による水銀圧入法である。 As shown in FIG. 3, the first frame member 12 includes an opening 121 in which the second package 2 is provided, and a first light reflecting portion 122 that reflects light emitted from the light emitting element 3. have. The first light reflecting portion 122 has a porous structure, for example. The porous structure is a structure having a plurality of ceramic particles 123 and a plurality of pores 124 existing between the plurality of ceramic particles 123, and has a porosity included in a range of 15% to 43%. Have. An exemplary method of measuring the porosity of the first light reflecting portion 122 is a mercury intrusion method using a Pore Sizer 9310 type manufactured by Micromeritics.
　再び図１および図２を参照して、第２のパッケージ２は、第１のパッケージ１の第１の凹部１３内に設けられており、第２の基体２１および第２のフレーム部材２２を含んでいる。第２のパッケージ１は、第２の基体２１および第２のフレーム部材２２に囲まれた第２の凹部２３を有している。第２の基体２１は、例えば、実質的にセラミックスからなる。第２のフレーム部材２２は、第２の基体２１の上面に接合されており、例えば、実質的にセラミックスからなる。 Referring to FIGS. 1 and 2 again, the second package 2 is provided in the first recess 13 of the first package 1, and includes a second base 21 and a second frame member 22. It is out. The second package 1 has a second recess 23 surrounded by the second base 21 and the second frame member 22. The second base 21 is substantially made of ceramics, for example. The second frame member 22 is bonded to the upper surface of the second base 21 and is substantially made of ceramics, for example.
　図４に示されているように、第２のフレーム部材２２は、発光素子３から放射された光を反射する第２の光反射部２２２を有している。第２の光反射部２２２は、例えばポーラス構造を有している。ポーラス構造とは、複数のセラミック粒子２２３と、その複数のセラミック粒子２２３の間に存在する複数の気孔２２４とを有する構造のことであり、１５％から４３％までの範囲に含まれる気孔率を有している。第２の光反射部２２２の気孔率の例示的な測定方法は、マイクロメリティクス（Micromeritics）社製のポアサイザー（Pore Sizer）９３１０型による水銀圧入法である。 As shown in FIG. 4, the second frame member 22 has a second light reflecting portion 222 that reflects the light emitted from the light emitting element 3. The second light reflecting portion 222 has a porous structure, for example. The porous structure is a structure having a plurality of ceramic particles 223 and a plurality of pores 224 existing between the plurality of ceramic particles 223, and has a porosity included in a range of 15% to 43%. Have. An exemplary method for measuring the porosity of the second light reflecting portion 222 is a mercury intrusion method using a Pore Sizer 9310 type manufactured by Micromeritics.
　再び図１および図２を参照して、発光素子３は、第２のパッケージ２の第２の凹部２３内に設けられており、第２の基体２１の上面に実装されている。発光素子３は、例えば、半導体材料を含む発光ダイオード（ＬＥＤ）である。発光素子３は、駆動電力に応じて第１次光を放射する。第１次光は、例えば、紫外光から青色光までの範囲に含まれる波長を有する。 Referring to FIGS. 1 and 2 again, the light emitting element 3 is provided in the second recess 23 of the second package 2 and mounted on the upper surface of the second base 21. The light emitting element 3 is, for example, a light emitting diode (LED) containing a semiconductor material. The light emitting element 3 emits primary light according to the driving power. The primary light has a wavelength included in a range from ultraviolet light to blue light, for example.
　波長変換部材４は、発光素子３を覆っており、第１のパッケージ１に固定されている。波長変換部材４は、第１のフレーム部材１２の上端部に接合されている。波長変換部材４は、複数の蛍光粒子４１を含んでいる。蛍光粒子４１は、第１次光によって励起されて第２次光を放射する。第２次光は、可視光領域に含まれる波長を有している。波長変換部材４は、例えば、白色光を放射する。波長変換部材４は、シート形状を有している。 The wavelength conversion member 4 covers the light emitting element 3 and is fixed to the first package 1. The wavelength conversion member 4 is joined to the upper end portion of the first frame member 12. The wavelength conversion member 4 includes a plurality of fluorescent particles 41. The fluorescent particles 41 are excited by the primary light and emit secondary light. The secondary light has a wavelength included in the visible light region. The wavelength conversion member 4 emits white light, for example. The wavelength conversion member 4 has a sheet shape.
　発光装置は、第２のパッケージ２の第２の凹部２３内に設けられており、発光素子３を覆っている封入部材５をさらに含んでいる。封入部材５は、発光素子３に付着しており、発光素子３の上面および側面を囲んでいる。封入部材５は、第２の凹部２３内に充填されており、発光素子３を覆っている。封入部材５は、透光性を有している。透光性とは、発光素子３から放射された第１次光の少なくとも一部の波長が透過することをいう。封入部材５は、例えば、実質的にシリコーン樹脂からなる。 The light emitting device further includes an enclosing member 5 that is provided in the second recess 23 of the second package 2 and covers the light emitting element 3. The enclosing member 5 is attached to the light emitting element 3 and surrounds the upper surface and the side surface of the light emitting element 3. The enclosing member 5 is filled in the second recess 23 and covers the light emitting element 3. The enclosing member 5 has translucency. Translucency means that at least a part of the wavelength of the primary light emitted from the light emitting element 3 is transmitted. The enclosing member 5 is substantially made of a silicone resin, for example.
　図５を参照して、本実施形態の発光装置における熱の伝導および放散について説明する。発光素子３によって発生された熱は、第２のパッケージ２を介して第１の基体１１に伝導される。この第１の基体１１に伝導された熱は、発光装置の下方向へ伝導される。図５において、発光素子３によって発生された熱の伝導領域が、発光素子３の実装位置を含むドット模様の領域によって示されている。波長変換部材４の蛍光粒子４１によって発生された熱の一部は、波長変換部材４の表面から放散される。蛍光粒子４によって発生された熱の他の一部は、第１のフレーム部材１２の上端部に伝導される。この第１のフレーム部材１２の上端部に伝導された熱は、第１のフレーム部材１２から放散される。図５において、傾向粒子４１によって発生された熱の伝導領域が、波長変換部材４の配置位置を含むドット模様の領域によって示されている。 With reference to FIG. 5, the conduction and dissipation of heat in the light emitting device of this embodiment will be described. Heat generated by the light emitting element 3 is conducted to the first base 11 through the second package 2. The heat conducted to the first substrate 11 is conducted downward in the light emitting device. In FIG. 5, the heat conduction region generated by the light emitting element 3 is indicated by a dot pattern region including the mounting position of the light emitting element 3. Part of the heat generated by the fluorescent particles 41 of the wavelength conversion member 4 is dissipated from the surface of the wavelength conversion member 4. Another part of the heat generated by the fluorescent particles 4 is conducted to the upper end of the first frame member 12. The heat conducted to the upper end portion of the first frame member 12 is dissipated from the first frame member 12. In FIG. 5, the heat conduction region generated by the tendency particles 41 is indicated by a dot pattern region including the arrangement position of the wavelength conversion member 4.
　本実施形態の発光装置は、発光素子３によって発生された熱が伝導される領域と波長蛍光粒子４１によって発生されたが伝導される領域とが、重なりにくい構造となっていることによって、発光素子３または蛍光粒子４１の発光効率の変動を低減させることができる。発光素子３は、蛍光粒子４１によって発生された熱による発光効率の変動に関して影響を受けにくくなっている。蛍光粒子４１は、発光素子３によって発生された熱による発光効率の変動に関して影響を受けにくくなっている。上述のように、発光素子３および蛍光粒子４１が互いに熱による影響を受けにくくなっていることによって、本実施形態の発光装置は、発光効率に関して改善されている。 The light emitting device according to the present embodiment has a structure in which the region where heat generated by the light emitting element 3 is conducted and the region generated by the wavelength fluorescent particles 41 but are conducted hardly overlap each other. 3 or the variation in the luminous efficiency of the fluorescent particles 41 can be reduced. The light emitting element 3 is less susceptible to fluctuations in light emission efficiency due to heat generated by the fluorescent particles 41. The fluorescent particles 41 are less susceptible to fluctuations in luminous efficiency due to heat generated by the light emitting element 3. As described above, since the light emitting element 3 and the fluorescent particles 41 are not easily affected by heat, the light emitting device of this embodiment is improved in terms of light emission efficiency.
　図６を参照して、蛍光粒子４１から発光素子３への熱伝導について説明する。波長変換部材４の蛍光粒子４１によって発生された熱の一部は、波長変換部材４の下方へ放射される。本実施形態における発光装置は、封入部材５を含んでいることにより、波長変換部材４の下方へ放射された熱の発光素子３への伝導に関して低減されている。従って、本実施形態における発光装置は、熱による発光素子３の発光効率の変動に関して低減されている。 Referring to FIG. 6, the heat conduction from the fluorescent particle 41 to the light emitting element 3 will be described. Part of the heat generated by the fluorescent particles 41 of the wavelength conversion member 4 is radiated below the wavelength conversion member 4. Since the light emitting device in the present embodiment includes the enclosing member 5, the conduction of the heat radiated below the wavelength conversion member 4 to the light emitting element 3 is reduced. Therefore, the light emitting device in the present embodiment is reduced with respect to variation in the light emission efficiency of the light emitting element 3 due to heat.
　図７を参照して、発光素子３から蛍光粒子４１への熱伝導について説明する。本実施形態の発光装置は、第１のフレーム部材１２と第２のパッケージ２との間に設けられた空隙を有している。発光素子３によって発生された熱の一部は、第２のパッケージ２に伝導されて、第２のパッケージ２から放散される。本実施形態の発光装置は、第２のパッケージ２および第１のフレーム部材１２が互いに離間していることにより、第２のパッケージ２から第１のフレーム部材１２への熱伝導に関して低減されている。従って、本実施形態における発光装置は、熱による蛍光粒子４１の発光効率の変動に関して低減されている。 The heat conduction from the light emitting element 3 to the fluorescent particles 41 will be described with reference to FIG. The light emitting device of the present embodiment has a gap provided between the first frame member 12 and the second package 2. Part of the heat generated by the light emitting element 3 is conducted to the second package 2 and dissipated from the second package 2. In the light emitting device of the present embodiment, the second package 2 and the first frame member 12 are separated from each other, so that heat conduction from the second package 2 to the first frame member 12 is reduced. . Therefore, the light emitting device in the present embodiment is reduced with respect to fluctuations in the luminous efficiency of the fluorescent particles 41 due to heat.
　図８を参照して、本実施形態の発光装置における発光構造について説明する。発光素子３から放射された第１次光１００は、第２のパッケージ２によって上方へ導かれる。波長変換部材４の下面または蛍光粒子４１の表面において下方へ反射された光は、第１のフレーム部材１２の光反射部１２２によって上方へ反射される。本実施形態の発光装置において、光反射部１２２がポーラス構造を有していることにより、光が光反射部１２２において全反射される。従って、本実施形態の発光装置は、発光効率に関して改善されている。 With reference to FIG. 8, the light emission structure in the light-emitting device of this embodiment is demonstrated. The primary light 100 radiated from the light emitting element 3 is guided upward by the second package 2. The light reflected downward on the lower surface of the wavelength conversion member 4 or the surface of the fluorescent particles 41 is reflected upward by the light reflecting portion 122 of the first frame member 12. In the light emitting device of the present embodiment, the light reflecting portion 122 has a porous structure, so that the light is totally reflected by the light reflecting portion 122. Therefore, the light emitting device of this embodiment is improved with respect to the light emission efficiency.
　第２のパッケージ２は、図４において示されたようにポーラス構造の第２の光反射部２２２を有していることにより、発光素子３から放射された第１次光の反射効率に関して改善されている。従って、本実施形態の発光装置は、発光効率に関して向上されている。 As shown in FIG. 4, the second package 2 includes the second light reflecting portion 222 having a porous structure, thereby improving the reflection efficiency of the primary light emitted from the light emitting element 3. ing. Therefore, the light emitting device of this embodiment is improved in terms of light emission efficiency.
　第２のパッケージ２は、図４において示されたようにポーラス構造の第２の光反射部２２２を有していることにより、発光素子３から放射された第１次光を散乱させることができる。従って、本実施形態の発光装置は、発光効率に関して向上されている。 As shown in FIG. 4, the second package 2 includes the second light reflecting portion 222 having a porous structure, so that the primary light emitted from the light emitting element 3 can be scattered. . Therefore, the light emitting device of this embodiment is improved in terms of light emission efficiency.
　本実施形態における発光装置は、封入部材５の一部が第２の光反射部２２２に含浸されていることにより、熱によって封入部材５の剥がれる可能性が低減されている。従って、本実施形態における発光装置は、信頼性に関して改善されている。 In the light emitting device according to the present embodiment, the possibility that the encapsulating member 5 is peeled off due to heat is reduced because part of the enclosing member 5 is impregnated in the second light reflecting portion 222. Therefore, the light emitting device in this embodiment is improved with respect to reliability.
　本実施形態の発光装置において、第１のフレーム部材１２は、第２のフレーム部材２２の側面と平行な面を含む下端部を有していることにより、製造工程における第１のフレーム部材１２と第２のフレーム部材２２との接触による第１のフレーム部材１２または第２のフレーム部材２２の損傷などに関して低減されている。 In the light emitting device of the present embodiment, the first frame member 12 has a lower end portion including a surface parallel to the side surface of the second frame member 22, so that the first frame member 12 in the manufacturing process It is reduced with respect to damage of the first frame member 12 or the second frame member 22 due to contact with the second frame member 22.
　図９を参照して、本発明の他の実施形態における発光装置について説明する。他の実施形態の発光装置において、図１に示された発光装置と異なる構成は、封入部材５の形状である。その他の構成は、図１に示された発光装置と同様である。 Referring to FIG. 9, a light emitting device according to another embodiment of the present invention will be described. In the light emitting device of another embodiment, the configuration different from the light emitting device shown in FIG. 1 is the shape of the enclosing member 5. Other configurations are the same as those of the light emitting device shown in FIG.
　封入部材５は、第２のフレーム部材２２の上端部より上側に位置する上端部を有している。図９において、上方向とは仮想のｚ軸の正方向である。封入部材５の上端部は、ドーム形状を有している。他の実施形態における発光装置は、封入部材５の内部と外部の境界における光の全反射が低減されている。従って、他の実施形態における発光装置は、発光効率に関して改善されている。 The enclosing member 5 has an upper end portion located above the upper end portion of the second frame member 22. In FIG. 9, the upward direction is the positive direction of the virtual z axis. The upper end portion of the enclosing member 5 has a dome shape. In the light emitting device according to another embodiment, total reflection of light at the boundary between the inside and the outside of the enclosing member 5 is reduced. Therefore, the light-emitting device in other embodiment is improved regarding luminous efficiency.

Claims (8)

  1. 第１の凹部を有する第１のパッケージと、
    　前記第１の凹部内に設けられており、第２の凹部を有している第２のパッケージと、
    　前記第２の凹部内に設けられた発光素子と、
    　前記第２のパッケージの上方に設けられており、前記第１のパッケージに固定された波長変換部材と、
    を備えた発光装置。      A first package having a first recess;
    A second package provided in the first recess and having a second recess;
    A light emitting device provided in the second recess;
    A wavelength conversion member provided above the second package and fixed to the first package;
    A light emitting device comprising:
  2. 前記第２の凹部内に設けられており、前記発光素子を覆っている封入部材をさらに備えていることを特徴とする請求項１記載の発光装置。  The light emitting device according to claim 1, further comprising a sealing member provided in the second recess and covering the light emitting element.
  3. 前記第１のパッケージが、第１の基体と、前記第１の基体の上に設けられた第１のフレーム部材とを含んでおり、
    　前記第２のパッケージが、第２の基体と、前記第２の基体の上に設けられた第２のフレーム部材とを含んでおり、
    　前記第１のフレーム部材が、前記第２のフレーム部材から離間していることを特徴とする請求項１記載の発光装置。      The first package includes a first base and a first frame member provided on the first base;
    The second package includes a second base and a second frame member provided on the second base;
    The light emitting device according to claim 1, wherein the first frame member is separated from the second frame member.
  4. 前記第１のパッケージが、前記第１の凹部を囲んでいるとともにポーラス構造を有している第１の光反射部を有していることを特徴とする請求項１記載の発光装置。  2. The light emitting device according to claim 1, wherein the first package includes a first light reflecting portion that surrounds the first recess and has a porous structure.
  5. 前記第２のパッケージが、前記発光素子を囲んでいるとともにポーラス構造を有している第２の光反射部を有していることを特徴とする請求項４記載の発光装置。  The light emitting device according to claim 4, wherein the second package includes a second light reflecting portion that surrounds the light emitting element and has a porous structure.
  6. 前記発光素子を覆っている封入部材をさらに備えており、
    　前記封入部材の一部が、前記第２のパッケージの第２の光反射部に含浸されていることを特徴とする請求項５記載の発光装置。      Further comprising a sealing member covering the light emitting element;
    The light emitting device according to claim 5, wherein a part of the enclosing member is impregnated in the second light reflecting portion of the second package.
  7. 前記発光素子を覆っている封入部材をさらに備えており、
    　前記封入部材が、前記第２のパッケージの上端部より上側に位置する上端部を有していることを特徴とする請求項１記載の発光装置。      Further comprising a sealing member covering the light emitting element;
    The light-emitting device according to claim 1, wherein the enclosing member has an upper end portion located above the upper end portion of the second package.
  8. 前記封入部材の前記上端部がドーム形状を有していることを特徴とする請求項７記載の発光装置。 The light emitting device according to claim 7, wherein the upper end portion of the enclosing member has a dome shape.
PCT/JP2010/055838 2009-08-28 2010-03-31 Light emitting device WO2011024502A1 (en)

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