WO2011018842A1 - Résistance pavé à faible résistance et son procédé de fabrication - Google Patents

Résistance pavé à faible résistance et son procédé de fabrication Download PDF

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Publication number
WO2011018842A1
WO2011018842A1 PCT/JP2009/064180 JP2009064180W WO2011018842A1 WO 2011018842 A1 WO2011018842 A1 WO 2011018842A1 JP 2009064180 W JP2009064180 W JP 2009064180W WO 2011018842 A1 WO2011018842 A1 WO 2011018842A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
resistance
resistance layer
low
chip resistor
Prior art date
Application number
PCT/JP2009/064180
Other languages
English (en)
Japanese (ja)
Inventor
修 松川
立樹 平野
篤司 戸田
Original Assignee
釜屋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 釜屋電機株式会社 filed Critical 釜屋電機株式会社
Priority to CN200980160900.XA priority Critical patent/CN102473494B/zh
Priority to KR1020127003762A priority patent/KR101489347B1/ko
Priority to PCT/JP2009/064180 priority patent/WO2011018842A1/fr
Priority to JP2011526658A priority patent/JP5373912B2/ja
Priority to TW098127711A priority patent/TWI496172B/zh
Publication of WO2011018842A1 publication Critical patent/WO2011018842A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Definitions

  • the present invention relates to a chip resistor, particularly a low resistor chip resistor and a method of manufacturing the same.
  • Patent Document 1 reinforces the mechanical strength of a component by bonding a resistor 2 directly on a ceramic substrate 1 by thermal diffusion.
  • Patent Document 2 discloses that a resistor is integrally joined to a ceramic substrate by an activated metal method using silver braze or the like.
  • Patent Document 3 proposes a resistor to which a technique of applying a resistance foil to a ceramic substrate with an inorganic adhesive containing silica is applied.
  • JP 2006-313763 A Japanese Patent Laid-Open No. 11-97203 Japanese Patent Laid-Open No. 9-320802
  • Patent Document 1 when a resistance metal plate or foil is bonded to a ceramic substrate, bonding by thermal diffusion in an atmosphere of high temperature of 960 to 980 ° C. and oxygen concentration of 50 ppm or less becomes a large scale as mass production equipment. A problem is assumed. Further, since the cutting width is adjusted within the allowable range of the resistor width for adjusting the resistance value, it is difficult to mechanically easily cut the resistance metal plate and the ceramic. In addition, the electrical characteristics of the resistive metal plate may be deteriorated by the high temperature treatment.
  • Patent Document 2 applies an activated metal method using silver braze or the like when a resistance metal plate or foil is bonded to a ceramic substrate.
  • temperature such as temperature as in Patent Document 1
  • Patent Document 3 a resistance foil is provided from an upper surface to a side surface of a substrate via an inorganic adhesive mainly composed of silica. It is described that the resistance value is adjusted by forming an opening by laser trimming or the like.
  • current concentration occurs in that portion, leading to a decrease in the life characteristics of the resistor.
  • the present invention has been made to solve the above-described problems, and the problem is that a higher current can be detected, and a high electrical durability and a low self-supporting mechanical strength are improved.
  • the present invention provides a resistor chip resistor.
  • giving the chip resistor the above self-supporting property means that the chip resistor has sufficient mechanical strength to be mounted by a mounting machine, and also has high electrical durability. This means that it can be applied to a large current. Therefore, even when a large current is applied, a substrate or a resistance film that reduces the surface temperature of the resistor, and a low-resistance chip-type resistor with a resistance layer structure that has a self-supporting property while reducing the volume further To be able to get.
  • Another object of the present invention is to enhance the electrical durability of the resistor by using an end face electrode or a belt-like one provided with a protective film if necessary, which is a laminate of a substrate and a resistance layer. Therefore, without providing the current concentration portion due to the trimming trace in the resistance layer, instead of adjusting the cutting width in the longitudinal direction of the band and cutting with a preset width according to the resistance value, it is easy and quick This method makes it possible to manufacture a highly accurate resistor.
  • the low-resistance chip-type resistor according to the present invention is a solution to the above-mentioned problem, and the gist thereof is that a resistance layer is formed on both the front and back surfaces of the substrate, and a protective film is formed on the center of both the front and back surfaces.
  • the front and back electrodes are disposed on both sides of the protective film on the resistance layer, and end electrodes are formed on both ends of the substrate, the resistance film, and the front and back electrodes. It is made of an insulating resin or rubber dispersed in the metal, and the resistance layer is either a metal plate or a metal foil.
  • the metal plate or metal foil of the resistance layer there are manganin, nichrome, iron / chromium / aluminum, or an alloy thereof.
  • the metal plate is 0.1 mm or more and the metal foil is less than 0.1 mm. It is set by the volume resistivity specified by the kind of the low resistance metal plate and its thickness depending on the desired resistance value. Therefore, various plates and foils are conceivable depending on the thickness of the resistance film.
  • insulating resin or rubber with ceramic powder dispersed inside is epoxy resin, chloroprene rubber, butyl rubber, urethane rubber, nitrile-butadiene rubber, styrene-butadiene rubber, One or more selected from polyester resins, polyvinyl chloride resins, polyurethane resins, silicone resins, phenol resins, amide resins, imide resins, cellulose resins, and ABS resins.
  • the resistance layer is made of manganin, nichrome, iron / chromium / aluminum, or an alloy thereof.
  • the surface electrode is formed from a copper, nickel, tin plating film on the resistance layer in order from the bottom, for example, by electroplating.
  • the end face electrode is made of, for example, a copper, nickel, or tin plating film by electroplating on a nichrome film by sputtering or a film by conductive resin paste from below.
  • a method for manufacturing a low-resistance chip-type resistor in which a resistive layer made of a metal plate or a metal foil is provided on both the front and back surfaces of a strip-shaped insulating resin or rubber substrate in which ceramic powder is dispersed. And a protective film is formed in the longitudinal center of both sides of the laminated belt-like front and back, and a front electrode and a back electrode are formed on the resistance layer on both sides of the protective film, and the substrate, the resistance film, and the front and back are formed. After end face electrodes are formed on both ends of the electrode, it may be obtained by crossing in the longitudinal direction of the belt and cutting to a predetermined width.
  • the present invention is a method of manufacturing a low resistance chip resistor according to claim 1, characterized in that a resistance layer and a protective film are formed on both front and back sides of a belt-like substrate, and front and back electrodes and end electrodes are formed on both sides thereof. It is characterized by applying a technique in which the formed belt-like material is crossed in the longitudinal direction and cut into a length (predetermined width) designed in advance.
  • a method for laminating the resistance layer on the strip-shaped insulating resin or rubber substrate according to the third aspect, wherein the resistance layer of either the metal plate or the metal foil is used. Heating and sticking to the substrate, and the both ends of the laminated strip in the longitudinal direction are laminated by rolling that presses more than the central part where the protective film formed in the subsequent process is located. . According to the present invention, both end portions in the longitudinal direction of the laminated body are pressed more greatly than the center portion so that they are integrated in the inner direction from both end sides of the laminated body.
  • the method for laminating the resistive layer on the strip-shaped insulating resin or rubber substrate according to the third aspect is characterized in that the resistive layer of either the metal plate or the metal foil is used. Heating and sticking to the substrate, and laminating the central portion in the longitudinal direction where the protective film formed in the post-process of the laminated strip is positioned by rolling that presses more than both ends.
  • the laminated central portion in the longitudinal direction is pressed more greatly than both end portions, and both end sides are sufficiently integrated from the central portion of the laminate.
  • a substrate is formed in the center of both front and back surfaces of the resistance layer, and front and back electrodes are disposed on the resistance layer on both sides of the substrate, and the resistance layer and the substrate There is one in which end electrodes are formed on both sides, the substrate is made of an insulating resin or rubber in which ceramic powder is dispersed, and the resistance layer is either a metal plate or a metal foil.
  • the invention of claim 2 is a simplified structure than that of claim 1 in which the substrate of claim 1 and the resistance layer are reversed and the substrate also has a protective film function.
  • the resistance layer is heated at the center in the longitudinal direction on both the front and back sides of the belt-like resistance layer of either a metal plate or a metal foil, and the ceramic An insulating resin or rubber substrate in which powder is dispersed is bonded to form a front electrode and a back electrode on the resistance layer on both sides of the substrate, and end electrodes are formed on both ends of the resistance layer and the substrate. Thereafter, it is obtained by crossing the strip in the longitudinal direction and cutting it to a predetermined width.
  • the sixth aspect of the present invention is a method for manufacturing the low resistance chip resistor of the second aspect.
  • the feature of the present invention is that it can detect even larger currents, improves the mechanical strength of high electrical durability and self-sustainedness, and further protects the surface of the low-resistance chip resistor when the current is applied or the surface on the substrate Reduced temperature.
  • an insulating resin in which ceramic powder is dispersed or a rubber insulating resin is applied to the substrate of the present invention.
  • the current resistance between the trimming grooves in the conventional resistance layer which is a cause of lowering the electrical durability of the low resistance chip resistors to which the insulating resin is applied, is manufactured in a quick and easy manner. can do.
  • (A) And (b) is the one part strip
  • (A) And (b) is the one part strip
  • FIGS. (A) -1 to 4 and (b) -1 to 4 are explanatory views showing a manufacturing procedure of a low-resistance chip resistor different from those shown in FIGS.
  • (A) -1 to 3 and (b) -1 to 4 are explanatory diagrams showing a manufacturing procedure of the low-resistance chip resistor of FIG. It is the graph which compared the surface temperature of the resistor using the insulated substrate of this invention, and the conventional insulated substrate.
  • the low-resistance chip-type resistor is a thin, small and low-resistance resistor, it is possible to improve durability by increasing the mechanical strength by giving it self-independence.
  • a belt-like substrate and a resistance layer are stretched, and a protective film, front and back electrodes and end face electrodes, or a resistance layer and a substrate provided with front and back electrodes and end face electrodes, It is manufactured by cutting in a predetermined width by crossing in the direction.
  • FIG. 1 (a) and 1 (b) are a perspective view of a long object of an insulating substrate in which alumina powder, which is a kind of ceramic powder, is dispersed in an epoxy resin in a volume ratio of 7 to 3, and a cross section thereof.
  • alumina powder which is a kind of ceramic powder
  • FIG. 1 (b) both the front and back surfaces of a strip-shaped substrate 1 having a thickness of 0.3 mm and a width of 4.3 mm have a length of approximately several meters of a strip-shaped substrate having a thickness of 0.05 mm and a width of 6.3 mm.
  • a metal plate made of iron, chrome, and aluminum alloy is laminated as the resistance layer 2.
  • an epoxy resin protective film 3 is formed by a screen printing method to a thickness of about 10 ⁇ m, and on the resistive layer 2 on both sides of the upper and lower protective films 3 is a substrate.
  • the front and back electrodes 4-1 and 4-3 are polymerized through end face electrodes 4-2 provided at 1 and the end portions of the resistance layer 2. Note that the above-mentioned long layered objects are cut every 3.2 mm shown in FIG. 1A to complete the low-resistance chip resistor of the present invention. As shown in the graph of FIG.
  • the surface temperature of the protective film depends on the insulating resin or rubber insulating resin substrate in which the ceramic powder is dispersed (A), and the insulating resin or rubber insulating material in which the ceramic powder is not dispersed in the conventional product. It shows that there is a difference between the resin substrate (B). As a result, the surface temperature of the protective film when a current corresponding to each of the electric powers is applied is mixed with ceramic powder dispersed in the substrate of the present invention rather than the conventional ceramic substrate, and the heat release effect is more effective. It turns out that there is.
  • Example 1-1 the manufacturing method of the low resistance chip resistor of the present invention will be described below.
  • Example 1-1 the manufacturing method of the low resistance chip resistor of the present invention.
  • FIGS. 3A and 3B are a partial perspective view and a cross-sectional view showing a manufacturing procedure of the low-resistance chip resistor of FIG.
  • Figures (a) -1 and (b) -1 are insulating plates 1 in which alumina powder is dispersed and mixed in an epoxy resin.
  • Figures (a) -2 and (b) -2 show resistance layers on both sides.
  • An iron / chromium / aluminum alloy metal plate is stretched, heated at 150 ° C. to 200 ° C., and then pressed and rolled in the range of 2 hPa to 3 hPa.
  • the above epoxy resin is screen printed on the part and baked at a temperature of 150 ° C.
  • the embodiment shown in FIG. 4 is a modified example of the above (Embodiment 1-1).
  • This example differs from (Example 1-1) in that when the resistance film 2 is heated and rolled on the insulating substrate 1, both ends are stronger than the center in the width direction, that is, the center is 1.5 hPa. And both sides are to press and roll at 3 hPa.
  • Example 1-3 Comparative 1-3
  • FIG. 5 shows another modification example of the above-described (Embodiment 1-1) and (Embodiment 1-2).
  • the difference between this example and (Example 1-1) and (Example 1-2) is the reverse of (Example 1-2) above when the resistance layer 2 is heated and rolled on an insulating substrate.
  • the center part is pressed at 3 hPa at both end parts 1.5 hPa in the width direction and rolled.
  • FIGS. 2A and 2B are resistors different from those in the above embodiment.
  • the resistive layer 2 is a strip-shaped layer having a thickness of 0.1 mm and a width of 6.3 mm, which is about several meters in size.
  • An insulating substrate 1 in which ceramic powder is dispersed in epoxy resin is laminated at the upper and lower central portions of a metal plate made of iron, chrome, and aluminum alloy. Note that there are upper and lower electrodes on both upper and lower sides of the upper and lower substrates via end face electrodes 4-2 at both ends of the resistance layer 2.
  • Example 2-1
  • FIG. 6 is the manufacturing method of Embodiment 2 described above.
  • Insulating substrate 1 in which alumina powder is dispersed and mixed in an epoxy resin at a volume ratio of 7: 3 is heated at 150 ° C. to 200 ° C. at the center of the front and back of resistance layer 2 of a metal plate made of iron, chrome, and aluminum alloy.
  • Baking is carried out by sequentially dipping in a solution made of chromium / nickel, and finally, it is cut to a width of 3.0 mm to 3.3 mm as shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)

Abstract

Cette invention concerne une résistance pavé à faible résistance dotée d’une structure simple, présentant une impédance propre et une résistance mécanique accrue à des fins de durabilité. L’invention concerne en outre un procédé qui rend la fabrication de ladite résistance plus aisée et plus rapide. La résistance pavé de la présente invention est caractérisée en ce que des couches résistives sont formées sur les deux surfaces, avant et arrière, d’un substrat isolant, ou bien en ce que des substrats isolants sont formés sur les deux surfaces, avant et arrière, d’une couche résistive. Ladite résistance est en outre caractérisée en ce que, dans le premier cas, des films protecteurs sont formés sur les parties centrales des couches résistives dans le sens longitudinal et des électrodes de surface ainsi que des électrodes arrière sont formées sur les couches résistives des deux côtés des films protecteurs. Dans le deuxième cas, des électrodes de surface ainsi que des électrodes arrière sont formées sur les couches résistives des deux côtés des substrats. Ladite résistance est de plus caractérisée en ce que dans les deux cas, les électrodes de surface sont disposées aux deux extrémités dans le sens de la largeur.
PCT/JP2009/064180 2009-08-11 2009-08-11 Résistance pavé à faible résistance et son procédé de fabrication WO2011018842A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200980160900.XA CN102473494B (zh) 2009-08-11 2009-08-11 低电阻的片形电阻器及其制造方法
KR1020127003762A KR101489347B1 (ko) 2009-08-11 2009-08-11 저저항의 칩형 저항기와 그 제조 방법
PCT/JP2009/064180 WO2011018842A1 (fr) 2009-08-11 2009-08-11 Résistance pavé à faible résistance et son procédé de fabrication
JP2011526658A JP5373912B2 (ja) 2009-08-11 2009-08-11 低抵抗のチップ形抵抗器とその製造方法
TW098127711A TWI496172B (zh) 2009-08-11 2009-08-18 Low resistance sheet resistors and methods of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/064180 WO2011018842A1 (fr) 2009-08-11 2009-08-11 Résistance pavé à faible résistance et son procédé de fabrication

Publications (1)

Publication Number Publication Date
WO2011018842A1 true WO2011018842A1 (fr) 2011-02-17

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PCT/JP2009/064180 WO2011018842A1 (fr) 2009-08-11 2009-08-11 Résistance pavé à faible résistance et son procédé de fabrication

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JP (1) JP5373912B2 (fr)
KR (1) KR101489347B1 (fr)
CN (1) CN102473494B (fr)
TW (1) TWI496172B (fr)
WO (1) WO2011018842A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459373A (zh) * 2019-08-19 2019-11-15 南京隆特电子有限公司 一种低阻电阻器及制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108777199A (zh) * 2018-06-15 2018-11-09 深圳市业展电子有限公司 一种双面电阻层结构的大功率抗浪涌合金片电阻
CN111462967A (zh) * 2020-05-08 2020-07-28 国巨电子（中国）有限公司 一种厚膜高功率贴片电阻及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182592A (ja) * 1983-03-31 1984-10-17 日東電工株式会社 抵抗回路基板
JPH0621593A (ja) * 1992-04-14 1994-01-28 Hitachi Chem Co Ltd 印刷配線用基板の製造方法
JPH09320802A (ja) * 1996-05-29 1997-12-12 Matsushita Electric Ind Co Ltd 抵抗器
JP2004022710A (ja) * 2002-06-14 2004-01-22 Dowa Mining Co Ltd 金属−セラミックス接合体およびその製造方法
JP2006313763A (ja) * 2005-05-06 2006-11-16 Mitsubishi Materials Corp 抵抗器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045703A (ja) * 2001-07-31 2003-02-14 Koa Corp チップ抵抗器及びその製造方法
JP3848245B2 (ja) * 2002-11-29 2006-11-22 ローム株式会社 チップ抵抗器
JP4904825B2 (ja) * 2006-01-19 2012-03-28 パナソニック株式会社 チップ抵抗器の製造方法
TWI430293B (zh) * 2006-08-10 2014-03-11 Kamaya Electric Co Ltd Production method of corner plate type chip resistor and corner plate type chip resistor
CN101542643B (zh) * 2007-08-30 2011-09-28 釜屋电机株式会社 金属板芯片电阻器的制造方法以及制造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182592A (ja) * 1983-03-31 1984-10-17 日東電工株式会社 抵抗回路基板
JPH0621593A (ja) * 1992-04-14 1994-01-28 Hitachi Chem Co Ltd 印刷配線用基板の製造方法
JPH09320802A (ja) * 1996-05-29 1997-12-12 Matsushita Electric Ind Co Ltd 抵抗器
JP2004022710A (ja) * 2002-06-14 2004-01-22 Dowa Mining Co Ltd 金属−セラミックス接合体およびその製造方法
JP2006313763A (ja) * 2005-05-06 2006-11-16 Mitsubishi Materials Corp 抵抗器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459373A (zh) * 2019-08-19 2019-11-15 南京隆特电子有限公司 一种低阻电阻器及制造方法

Also Published As

Publication number Publication date
CN102473494B (zh) 2015-11-25
TW201106385A (en) 2011-02-16
TWI496172B (zh) 2015-08-11
JP5373912B2 (ja) 2013-12-18
JPWO2011018842A1 (ja) 2013-01-17
KR101489347B1 (ko) 2015-02-03
KR20120040241A (ko) 2012-04-26
CN102473494A (zh) 2012-05-23

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