WO2011016186A1 - Dispositif filtrant - Google Patents

Dispositif filtrant Download PDF

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Publication number
WO2011016186A1
WO2011016186A1 PCT/JP2010/004560 JP2010004560W WO2011016186A1 WO 2011016186 A1 WO2011016186 A1 WO 2011016186A1 JP 2010004560 W JP2010004560 W JP 2010004560W WO 2011016186 A1 WO2011016186 A1 WO 2011016186A1
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WO
WIPO (PCT)
Prior art keywords
partition
filter device
frame
conductor
lid
Prior art date
Application number
PCT/JP2010/004560
Other languages
English (en)
Japanese (ja)
Inventor
浅川恭輝
高橋辰夫
難波英樹
山田貴司
中村俊昭
北川元祥
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009182153A external-priority patent/JP2011035799A/ja
Priority claimed from JP2009188241A external-priority patent/JP2011041111A/ja
Priority claimed from JP2009191559A external-priority patent/JP2011044899A/ja
Priority claimed from JP2009234773A external-priority patent/JP2011082882A/ja
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2011016186A1 publication Critical patent/WO2011016186A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators

Definitions

  • the present invention relates to a filter device used in a base station for communication or the like.
  • FIG. 5A is a cross-sectional view of a conventional filter device.
  • FIG. 5B is a top view of the housing with the lid of the conventional filter device opened.
  • a filter device 1 is provided in a base station for two-way communication such as a cellular phone, and an antenna terminal 2 (connector) to which a signal input from an antenna (not shown) is supplied.
  • the housing 3 is made by zinc die casting, and the entire surface is plated with copper.
  • Four circular hollow portions 5 are formed in the housing 3.
  • a resonance projection 5 a is formed integrally with the housing 3 at the center of each hollow portion 5.
  • the lid 7 is a copper plate, is mounted on the upper side of the casing 3, and is fixed to the casing 3 with screws 8a.
  • the housing 3 needs a screw hole for attaching the screw 8a for fixing the lid 7, and the housing 3 needs a thick portion having a thickness sufficient to provide the screw hole.
  • a frequency adjusting screw 8 b is screwed at a position corresponding to the protrusion 5 a and the coupling window 6.
  • Patent Document 1 is known as a prior art document related to the invention of the present application.
  • the casing 3 in the conventional filter device 1 is plated with copper on the entire surface of the zinc die casting.
  • the housing 3 since the housing 3 is large and heavy, it cannot be plated by a plating method with good productivity such as the barrel method. Therefore, many steps are required for plating the housing 3, and the filter device 1 becomes expensive.
  • the conductor resistance value of the inner wall surface constituting the hollow portion 5 increases and the signal passing loss increases.
  • the filter device of the present invention includes a housing including a frame, a partition, a hollow portion, a coupling window, a resonant element, and a lid, and an antenna terminal connected to the housing.
  • the frame is formed of a surface-treated steel plate having a metal on the surface, and the frame is partitioned into a plurality of hollow portions by partitions.
  • the coupling window connects adjacent hollow portions, and the lid is attached to the opening of the frame by solder.
  • the partition has a base material made of a non-magnetic material and a conductor film formed on the base material, and the conductor film and the lid are electrically connected to each other on the first end side (lower side) of the partition. On the second end side (upper side), the conductor film and the frame are connected by solder. Since the partition is made of a non-magnetic material, a filter device with a small passage loss can be realized.
  • the conductor film is provided on the base material of the non-magnetic material and the partition is formed, the passage loss of the filter can be reduced. Further, it is not necessary to plate the entire casing. Since the partition can be configured using a copper-clad substrate or the like without performing a treatment such as plating, a filter device with a small passage loss can be realized at a low price.
  • FIG. 1A is a cross-sectional view of the filter device according to Embodiment 1 of the present invention.
  • FIG. 1B is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 1 of the present invention is opened.
  • FIG. 2A is a cross-sectional view from above of the partition of the filter device according to Embodiment 1 of the present invention.
  • FIG. 2B is a cross-sectional view from above of the partition in another example of the filter device according to Embodiment 1 of the present invention.
  • FIG. 2C is a side view of the partition of the filter device of FIG. 2B.
  • FIG. 2D is a side view of a partition in another example of the filter device according to Embodiment 1 of the present invention.
  • FIG. 1A is a cross-sectional view of the filter device according to Embodiment 1 of the present invention.
  • FIG. 1B is a bottom view of the housing in a state where the lid of the filter device according
  • FIG. 3A is a cross-sectional view of the filter device according to Embodiment 2 of the present invention.
  • FIG. 3B is a partially enlarged view of the periphery of the leg portion of FIG. 3A.
  • FIG. 3C is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 2 of the present invention is opened.
  • FIG. 4A is a cross-sectional view of the filter device according to Embodiment 3 of the present invention.
  • FIG. 4B is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 3 of the present invention is opened.
  • FIG. 5A is a cross-sectional view of a conventional filter device.
  • FIG. 5B is a top view of the housing with the lid of the conventional filter device opened.
  • FIG. 1A is a cross-sectional view of the filter device according to Embodiment 1 of the present invention.
  • FIG. 1B is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 1 of the present invention is opened.
  • FIG. 2A is a cross-sectional view from above of the partition of the filter device according to Embodiment 1 of the present invention.
  • FIG. 2B is a cross-sectional view from above of the partition in another example of the filter device according to Embodiment 1 of the present invention.
  • FIG. 2C is a side view of the partition of the filter device of FIG. 2B.
  • FIG. 2D is a side view of a partition in another example of the filter device according to Embodiment 1 of the present invention.
  • FIGS. 1A and 1B the same components as those in FIGS. 5A and 5B are denoted by the same reference numerals, and the description thereof is omitted.
  • the filter device 11 is fixed to the antenna terminal 2 (input connector), a metal casing 13 to which the antenna terminal 2 is fixed, a resonance element 14 provided in the casing 13, and the casing 13.
  • the output terminal 4 is provided.
  • the antenna terminal 2 is connected to an antenna (not shown) and receives a received signal received by the antenna.
  • the antenna terminal 2 is fixed to one side surface of the housing 13 with a screw or the like.
  • the filter device 11 is a so-called air cavity filter, and in this embodiment, a frequency of about 3 GHz is used as a pass band.
  • the air cavity filter has a plurality of hollow portions 12 (also referred to as cavities), a resonance element 14 is disposed in each of the hollow portions 12, and the hollow portions 12 are coupled to each other at high frequency by a coupling window 12a. It is a combined filter. With this configuration, a filter having an inductance component and a capacitance component is equivalently configured. In the present embodiment, a four-stage filter having four hollow portions 12 is configured.
  • the housing 13 includes a frame 13b, a partition 13c, and a lid 15.
  • the frame body 13 b is made of metal and constitutes the outside of the housing 13.
  • a surface-treated steel sheet in which a metal surface treatment is applied to both surfaces of the steel sheet is used.
  • the frame body 13b is constituted by a top plate and a side plate erected around the top plate, and has an opening 13a on one surface (the lower surface side in the drawing).
  • the partition 13c has a conductor film (metal film) formed on both side surfaces of a non-magnetic material, and is arranged so as to divide the inside of the frame 13b into a plurality of hollow portions 12.
  • the inner wall surface of the hollow portion 12 must be a conductor in order to have a capacitance (capacitance) with the resonance element 14.
  • the partition 13c is made of a resin having a conductor film formed on at least the entire front and back sides.
  • a metal that can be soldered is selected for the conductor film.
  • the partition 13c is arranged in the frame 13b so as to divide the frame 13b into four hollow portions 12. Therefore, the two partitions 13c are combined so as to intersect with the center of the frame 13b. As a result, a conductor film is formed on the inner wall surface of the hollow portion 12.
  • a glass epoxy resin is used as the non-magnetic material
  • a substrate (so-called double-sided copper-clad printed circuit board) in which copper foil is formed as a conductor film on both surfaces of the glass epoxy resin base material is used for the partition 13c. It was.
  • the copper foil of the double-sided copper-clad substrate is formed on the inner wall surface of the hollow portion 12. Since a printed circuit board is used for the partition 13c, a low-cost filter device 11 can be realized.
  • the copper foil is formed on both surfaces of the partition 13c, it is not necessary to partially remove the copper foil by etching or the like, and it is only necessary to cut the double-sided copper-clad substrate. Also from this, the low-cost filter device 11 can be realized.
  • the substrate is made of resin, the weight of the filter device 11 can be reduced.
  • the lid 15 is made of resin and is mounted so as to close the opening 13a, and the housing 13 has a hollow rectangular parallelepiped shape.
  • the conductor 15a is formed on the upper surface of the lid 15, and the inner wall surface at the end of the frame 13b on the opening 13a side and the conductor 15a are connected by the solder 16.
  • a fillet 16a made of solder 16 is formed at least between the conductor portion 15a and the side plate 17b. This is because the passage loss of the filter device 11 increases if a missing portion of the solder 16 occurs in the entire circumference of the end portion on the opening 13a side.
  • the shape of the corner has a great influence on the passage characteristics (passage loss). Therefore, the conductor part 15a and the front-end
  • the conductor portion 15a is made larger than the opening portion 13a so that the opening portion 13a is completely covered with the conductor portion 15a.
  • a single-sided copper-clad substrate is used for the lid 15, a low-cost filter device 11 can be realized.
  • the copper foil 24 on the first end side (lower side) of the partition 13c is connected to the conductor portion 15a of the lid 15 by the solder 16, and the second end portion of the partition 13c.
  • the copper foil 24 on the side (upper side) is connected to the frame body 13 b by the solder 16.
  • the copper foils 24 of the partitions 13c are connected by solder 16.
  • the casing 13 is completed by connecting the copper foil 24 and the side plate of the partition 13c with the solder 16.
  • a notch for combining the partitions 13c is formed at a location where the partitions 13c intersect with each other, and the notches are fitted together to form a cross-shaped partition 13c.
  • a conductor or the like is preferably formed on the side surface of the notch.
  • a metallic resonance element 14 is disposed in each of the four hollow portions 12 of the casing 13 formed in this manner.
  • a pipe made of a solderable material is used for the resonant element 14.
  • a copper pipe cut is used. This is because it is possible to reduce the weight by forming the resonance element 14 from resin and performing metal plating, but the resin-like metal film is vulnerable to heat, and is likely to cause blistering and peeling, and in terms of reliability. This is because it is difficult to maintain a stable surface for a long time.
  • the potential concentrates on the surface of the resonance element 14 (particularly the upper end portion) if the plating or the like is peeled off at this portion, the signal passing loss becomes very large.
  • the resonance element 14 is obtained by cutting a copper pipe, it is possible to realize the filter device 11 having a stable surface state and good reliability.
  • the resonance element 14 is connected to the conductor portion 15a of the lid 15 by the solder 16. However, this may be connected to the frame body 13b or the partition 13c.
  • a surface-treated steel plate whose surface is covered with metal is used for the frame 13b, while a material in which a conductor film is formed on a non-magnetic base material is used for the partition 13c.
  • the conductor film of the partition 13c and the metal surface treatment layer of the frame 13b, the conductor portion 15a of the lid 15, or the conductor film of the intersecting partition 13c are connected by solder 16.
  • a magnetic field is not generated by the base material.
  • the high-frequency signal between the front and back sides of the partition 13c is caused by the stray capacitance between the front and back sides of the partition 13c.
  • a magnetic field is generated by the high-frequency current, and the state of electromagnetic coupling between the hollow portions 12 is changed by the magnetic field, so that a passage loss of the filter device 11 is increased and a frequency characteristic is changed.
  • base stations having communication devices are air-conditioned by air conditioners, etc., and the humidity is low, and temperature fluctuations and humidity fluctuations are not often regarded as problems.
  • air-conditioning management is difficult and the risk of being affected by temperature fluctuations and humidity fluctuations increases.
  • the resin 25 absorbs moisture from the exposed portion of the resin, and the dielectric constant of the resin 25 changes. It can change. Therefore, as shown in FIG. 2A, for the filter device 11 used in such an environment, if through holes are provided between the copper foils 24 on the front and back of the partition 13c and connected by the connection conductor 22, High frequency current can be made difficult to flow. As a result, it is possible to realize the filter device 11 that is less susceptible to changes in passage loss and changes in frequency characteristics even when the resin 25 absorbs moisture.
  • the partition 13c (or the frame 13b or the lid 15) intersecting with the solder 16 at a location where the partitions 13c intersect, a location where the partition 13c and the frame 13b intersect, or a location where the partition 13c and the lid 15 intersect.
  • the front and back partitions 13c are electrically connected via the copper foil 24 on the surface. Therefore, the difference in potential at these points is small. Therefore, the connection conductor 22 is preferably provided at a location away from these locations. That is, in the height direction of the partition 13c, the connection conductor 22 is preferably provided at the center in the height direction of the partition 13c. Further, in the width direction of the partition 13c, the partition 13c may be provided as close as possible to the end portion 21.
  • the distance 23 from the end portion 21 to the connection conductor 22 is a distance of about half or more of the plate thickness of the partition 13c, and at an interval of about 1.5 times or more of the plate thickness in the height direction. It is arranged.
  • the resin 25 is exposed at the end 21, but the connection conductor 22 may be formed at the end 21 as shown in FIGS. 2B and 2C. In this way, the front and back are connected at the end 21 and a part of the end 21 is covered with the conductor film, so that the signal passing loss can be further reduced.
  • the connection conductors 22 are discretely provided, but may be formed so as to cover the entire end 21 as shown in FIG. 2D. In this way, the resin 25 is less likely to absorb moisture at the end portion 21, so that it is considered that the effect of changes in humidity and the like can be further reduced.
  • connection conductors 22 When the frequency of the signal to be passed is high (3 GHz band or higher), the signal passing loss increases unless a conductor is provided at the end of the partition 13c on the coupling window 12a side. Therefore, when the passing frequency is high, it is desirable to provide the connection conductors 22 as close to the end portion 21 as possible and in as wide a range as possible.
  • the partition 13c is not limited to a double-sided copper-clad substrate, but a multilayer substrate may be used. In any case, the copper foils on the front and back sides are connected in the vicinity of the coupling window 12a side end of the partition 13c. It is good to leave.
  • the partition 13c does not require a thick part for stopping screws or the like. Accordingly, since the partition 13c can be formed of a thin plate material, a lightweight filter device 11 can be realized. Moreover, since the double-sided copper-clad board
  • the opening 13a of the frame 13b has a conductor 15a formed on the upper surface of the resin lid 15 closing the opening 13a.
  • the conductor part 15a plays the role of the inner wall of the hollow part 12, and the filter apparatus 11 is comprised.
  • the lid 15 is connected to the frame body 13b by the solder 16, a thick portion for stopping screws or the like is not necessary for the frame body 13b, and the frame body 13b is formed of a thin steel plate or the like. You can also. Therefore, the filter device 11 can be further reduced in weight.
  • the partition 13c uses a resin base material, but a metal material is used for the frame 13b. This is to prevent the filter device 11 from being destroyed by energy such as lightning (or induced lightning) flying to the antenna. That is, the frame 13b is made of metal, and the frame 13b is grounded to the ground. As a result, lightning does not flow through the partition 13c but flows through the frame 13b to a ground from a metal ground terminal (not shown) fixed to the frame 13b. Therefore, even if a resin base material is used for the partition 13c, the lightning energy can be reliably dropped to the ground.
  • a metal having good conductivity such as copper may be used for the frame 13b.
  • a surface-treated steel plate in which metal plating with good conductivity is applied to the front and back surfaces of the steel plate in advance is used, and the frame body 13b is formed by pressing this.
  • the frame 13b is plate-shaped and is formed of a steel plate that has been subjected to a surface treatment in advance, it is necessary to perform a plating process on the frame 13b or the housing 13 when the filter device 11 is manufactured. Absent. Therefore, it is possible to realize a filter device 11 that is lightweight and very inexpensive.
  • the surface-treated steel sheet plated with copper on both surfaces of the cold-rolled steel sheet is used, the resistance value is small and lightning can easily escape to the ground, and the loss of the received signal can be reduced.
  • the side plate in the present embodiment is formed integrally with the top plate by being bent in four directions from the periphery of the top plate. Therefore, it is not necessary to separately join the top plate and the side plate with the solder 16 or the like, and the low-cost filter device 11 can be realized. Furthermore, since the joining by the solder 16 is unnecessary, weight reduction is also realizable.
  • the resin base material that is the base of the partition 13c in the present embodiment does not have the solder 16 attached thereto. Therefore, in order to connect the partition 13c and the lid 15 with the solder 16 without a gap, it is important to keep the partition 13c and the lid 15 in close contact with each other. Therefore, in order to press the partition 13c against the lid 15, the opening 13a side tip of the partition 13c is projected from the tip of the side plate. Further, a caulking portion 18 extending from the side plate is formed at the tip of the opening 13a side of the frame 13b, and the caulking portion 18 is caulked to the lid 15.
  • the partition 13c is pinched
  • the partition 13c and the frame 13b, and the partition 13c and the lid 15 can be reliably connected by the solder 16, so that a filter with a small passage loss can be obtained.
  • the device 11 can be realized. Charges tend to concentrate on the corner where the partition 13c and the lid 15 are connected and the corner where the partition 13c and the frame 13b are connected, and the shape of this connecting portion tends to affect the passage loss of the filter. Therefore, it is important to securely connect the partition 13c with the solder 16 as described above. In addition, since a gap between the frame body 13b and the lid 15 is less likely to occur, the filter device 11 with good shielding properties and small passage loss can be realized.
  • the lid 15 is provided with a hole (not shown) at a position corresponding to the caulking portion 18. Then, the caulking portion 18 is inserted into the hole provided in the lid 15, and is caulked and fixed in the outward direction of the frame 13b as shown in FIG. 1A.
  • the lid 15 may be warped due to the protrusion of the partition 13c. Therefore, as another method, in the state before soldering 16, the front end of the side plate of the frame 13b protrudes from the front end of the partition 13c plate (between the front end of the partition 13c on the opening 13a side and the lid 15). There may be a gap). In this case, it is important to select a base material having a larger linear expansion coefficient of the partition 13c than the frame body 13b.
  • the partition 13c extends more than the frame body 13b. Therefore, the clearance gap between the opening 13a side front end of the partition 13c and the lid
  • cover 15 can be made small (or eliminated). Therefore, since the partition 13c and the lid 15 can be soldered without a gap, the filter device 11 with a small passage loss can be realized.
  • the partition 13c may be formed by resin molding and conductor plated thereon.
  • the conductor is formed on the entire surface of the partition 13c, the solderability between the frame 13b and the conductor portion 15a of the lid 15 is good.
  • the base material of the partition 13c is resin, it is lightweight. Or what formed the lid
  • the base material is resin, the lid 15 and the partition 13c need not be connected with the solder 16 in addition to being lightweight. Therefore, the price can be reduced and the weight can be further reduced.
  • the base material is resin, a magnetic field due to a high-frequency current is less likely to occur at the joint. Therefore, a filter device with even smaller loss can be realized.
  • the lid 15 may be a double-sided board or a multilayer board.
  • the lower surface of the lid 15 as a ground, it is possible to realize the filter device 11 in which leakage of a high-frequency signal is unlikely to occur.
  • the upper and lower surfaces are connected by a connection conductor or the like, the shield can be more reliably performed.
  • FIG. 3A is a cross-sectional view of the filter device according to Embodiment 2 of the present invention.
  • FIG. 3B is a partially enlarged view of the periphery of the leg portion of FIG. 3A.
  • FIG. 3C is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 2 of the present invention is opened.
  • the housing 13 includes a frame 13b, a partition 13c, and a lid 15.
  • the frame body 13 b is made of metal and constitutes the outside of the housing 13.
  • the partition 13c is disposed in the frame 13b so as to divide the frame 13b into four hollow portions.
  • the frame 13b is a hollow rectangular parallelepiped composed of a top plate and a side plate, and has an opening 13a on one surface (the lower surface side in the figure).
  • the frame 13b is formed by a top plate and a side plate 17b erected around the top plate.
  • the lid 15 is made of resin and is mounted so as to close the opening 13a. At this time, a conductor portion 15 a is formed on the upper surface of the lid 15, and the end portion of the frame 13 b on the opening portion 13 a side and the conductor portion 15 a are connected by the solder 16. In addition, since the copper 15 board
  • the conductor portion 15a is larger than the opening portion 13a so that the opening portion 13a is completely covered with the conductor portion 15a, and a fillet 16a made of solder 16 is formed between the conductor portion 15a and the side plate 17b. is there. Since the high-frequency signal is concentrated at the corner where the lid 15 and the side plate 17b intersect, the shape of this corner has a great influence on the passage characteristics (passage loss). Therefore, the conductor portion 15a and the tip of the side plate 17b must be connected all around the side plate 17b. Furthermore, it is desirable that the shape of the fillet formed at the corner where the conductor portion 15a and the side plate 17b intersect is substantially constant over the entire circumference of the side plate 17b.
  • each hollow part 11a it is necessary to reduce the variation in the distance between the resonance element 14 and the side plate 17b.
  • the frequency of the signal passing through and the loss of the signal are determined by the value of the capacitance component formed between the resonance element 14 and the side plate 17b. Therefore, it is necessary to reduce the variation in the position where the frame 13b is mounted. Therefore, a leg portion 17c extending from the side plate 17b is formed at the tip of the side plate 17b.
  • the lid 15 is provided with a hole 15b at a position corresponding to the leg portion 17c. Then, the frame body 13b is positioned by inserting the leg portion 17c into the hole 15b.
  • the leg portion 17c is inserted in the hole 15b so as to be arranged at a position eccentric from the central axis 15c of the hole 15b to the inner side of the frame 13b. .
  • the fillet 16b of the solder 16 can be reliably formed between the conductor part 15a and the side plate 17b. Accordingly, the Q value of the filter device 11 can be increased and the passage loss can be reduced. In addition, it is possible to realize the filter device 11 with small variations in the position of the frame 13b.
  • the leg portion 17c in order to surely decenter the leg portion 17c inward, the leg portion 17c is provided with a protrusion 17d (used as an example of a fillet forming portion) protruding outward from the frame body 13b. Formed.
  • the leg portion 17c is reliably inserted in a position eccentrically inward with respect to the hole 15b, so that the distance between the leg portion 17c and the conductor portion 15a can be reduced.
  • the fillet 16b can be reliably formed between the side plate 17b and the conductor portion 15a at a position above the leg portion 17c.
  • the protrusion 17d is formed near the base of the leg as the fillet forming portion.
  • this may be another method, for example, by forming a caulking portion or the like at the tip of the leg portion 17c and caulking the caulking portion outward so that the leg portion 17c is eccentric inward.
  • first end side (lower side) of the partition 13c is connected to the conductor portion 15a of the lid 15 by the solder 16 and the second end side (upper side) of the partition 13c is connected to the frame body 13b by the solder 16.
  • the partitions 13c are connected by solder 16.
  • the housing 13 is completed by connecting the partition 13c and the side plate 17b with the solder 16.
  • the fillet forming portion is formed at the base of the leg portion 17c, so that the fillet 16b can be reliably formed. Therefore, the Q value of the filter device 11 can be increased, and the insertion loss can be reduced.
  • the side plate in the present embodiment is formed integrally with the top plate by being bent in four directions from the periphery of the top plate. Therefore, it is not necessary to separately join the top plate and the side plate 17b with the solder 16 or the like, and the low-cost filter device 11 can be realized. Furthermore, since the joining by the solder 16 is unnecessary, weight reduction is also realizable.
  • FIG. 4A is a cross-sectional view of the filter device according to Embodiment 3 of the present invention.
  • FIG. 4B is a bottom view of the housing in a state where the lid of the filter device according to Embodiment 3 of the present invention is opened.
  • a flange 17e is formed between the leg portion 17c and the side plate 17b.
  • the flange 17e faces the conductor portion 15a and is formed by being bent in a direction toward the outside of the frame body 13b.
  • the flange 17e is also formed at the tip of the side plate 17b other than the leg 17c.
  • the tip of the flange 17e is further extended, and a screw hole is provided in the flange 17e.
  • the filter device according to the present invention has an effect of realizing a filter device with a small passage loss, and is particularly useful when used for a filter device used in a base station for communication or the like.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

La présente invention concerne un dispositif filtrant qui comporte un boîtier équipé d’un corps de cadre, d’une cloison, de sections creuses, d’une fenêtre d’accouplement, d’un élément de résonance et d’un couvercle ; et une borne d’antenne raccordée au boîtier. Le corps de cadre est formé à partir d’une plaque d’acier traitée en surface comportant une couche métallique sur la surface, et l’intérieur du corps de cadre est divisé en une pluralité de sections creuses au moyen de la cloison. La fenêtre d’accouplement relie les sections creuses adjacentes, et le couvercle est monté sur l’ouverture du corps de cadre au moyen d’une soudure. La cloison possède un substrat d’un matériau de corps non magnétique et un film conducteur formé sur le substrat, le film conducteur et le couvercle étant électriquement connectés sur la première extrémité de la cloison, et le film conducteur et le corps de cadre étant connectés par une soudure sur la seconde extrémité de la cloison. Un dispositif filtrant présentant une faible perte de transit peut être obtenu du fait que la cloison est un corps non magnétique.
PCT/JP2010/004560 2009-08-05 2010-07-14 Dispositif filtrant WO2011016186A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2009-182153 2009-08-05
JP2009182153A JP2011035799A (ja) 2009-08-05 2009-08-05 フィルタ装置
JP2009188241A JP2011041111A (ja) 2009-08-17 2009-08-17 フィルタ装置
JP2009-188241 2009-08-17
JP2009191559A JP2011044899A (ja) 2009-08-21 2009-08-21 フィルタ装置
JP2009-191559 2009-08-21
JP2009234773A JP2011082882A (ja) 2009-10-09 2009-10-09 フィルタ装置
JP2009-234773 2009-10-09

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Cited By (1)

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CN103531875A (zh) * 2013-10-24 2014-01-22 江苏贝孚德通讯科技股份有限公司 具有抑制度可调功能的带通腔体滤波器

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JPH07212101A (ja) * 1994-01-24 1995-08-11 Murata Mfg Co Ltd 誘電体共振器装置
JPH07212113A (ja) * 1994-01-24 1995-08-11 Matsushita Electric Ind Co Ltd 誘電体同軸共振器
JP2003289204A (ja) * 2002-03-28 2003-10-10 Matsushita Electric Ind Co Ltd 導波管フィルタ
JP2004072730A (ja) * 2002-06-12 2004-03-04 Matsushita Electric Ind Co Ltd 誘電体フィルタ、通信機器、共振周波数を制御する方法
WO2008026493A1 (fr) * 2006-08-31 2008-03-06 Panasonic Corporation Dispositif de filtre et son procédé de fabrication

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Publication number Priority date Publication date Assignee Title
JPH07212101A (ja) * 1994-01-24 1995-08-11 Murata Mfg Co Ltd 誘電体共振器装置
JPH07212113A (ja) * 1994-01-24 1995-08-11 Matsushita Electric Ind Co Ltd 誘電体同軸共振器
JP2003289204A (ja) * 2002-03-28 2003-10-10 Matsushita Electric Ind Co Ltd 導波管フィルタ
JP2004072730A (ja) * 2002-06-12 2004-03-04 Matsushita Electric Ind Co Ltd 誘電体フィルタ、通信機器、共振周波数を制御する方法
WO2008026493A1 (fr) * 2006-08-31 2008-03-06 Panasonic Corporation Dispositif de filtre et son procédé de fabrication

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531875A (zh) * 2013-10-24 2014-01-22 江苏贝孚德通讯科技股份有限公司 具有抑制度可调功能的带通腔体滤波器

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