WO2010137841A3 - 발광 다이오드 패키지 및 백라이트 유닛 - Google Patents

발광 다이오드 패키지 및 백라이트 유닛 Download PDF

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Publication number
WO2010137841A3
WO2010137841A3 PCT/KR2010/003279 KR2010003279W WO2010137841A3 WO 2010137841 A3 WO2010137841 A3 WO 2010137841A3 KR 2010003279 W KR2010003279 W KR 2010003279W WO 2010137841 A3 WO2010137841 A3 WO 2010137841A3
Authority
WO
WIPO (PCT)
Prior art keywords
pad
lead
backlight unit
light
emitting diode
Prior art date
Application number
PCT/KR2010/003279
Other languages
English (en)
French (fr)
Other versions
WO2010137841A2 (ko
Inventor
권순목
배진우
문강훈
신허영
김하철
Original Assignee
일진반도체(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일진반도체(주) filed Critical 일진반도체(주)
Publication of WO2010137841A2 publication Critical patent/WO2010137841A2/ko
Publication of WO2010137841A3 publication Critical patent/WO2010137841A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 방열 특성 및 발광 효율이 높은 LED 패키지 및 백라이트 유닛을 제공하기 위한 것으로, 제1패드; 상기 제1패드와 전기적으로 분리된 제2패드; 상기 제1패드에 안착되고 상기 제1패드 및 제2패드와 전기적으로 연결되며 발광되는 제1칩; 상기 제1패드 및 제2패드를 고정하고 지지면을 갖는 몰딩부; 상기 제1패드와 전기적으로 연결되고 상기 몰딩부의 외측에 위치하며 제1면을 갖는 제1리드; 및 상기 제2패드와 전기적으로 연결되고 상기 제1리드와는 분리되며 상기 몰딩부의 외측에 위치하고 상기 제1면과 평행한 제2면을 갖는 제2리드;를 포함하고, 상기 제1리드의 제1면과 제2리드의 제2면의 면적의 합은 상기 지지면의 면적의 30% 이상인 발광 다이오드 패키지 및 백 라이트 유닛에 관한 것이다.
PCT/KR2010/003279 2009-05-26 2010-05-25 발광 다이오드 패키지 및 백라이트 유닛 WO2010137841A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090046148A KR101107770B1 (ko) 2009-05-26 2009-05-26 발광 다이오드 패키지 및 백라이트 유닛
KR10-2009-0046148 2009-05-26

Publications (2)

Publication Number Publication Date
WO2010137841A2 WO2010137841A2 (ko) 2010-12-02
WO2010137841A3 true WO2010137841A3 (ko) 2011-03-03

Family

ID=43223219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003279 WO2010137841A2 (ko) 2009-05-26 2010-05-25 발광 다이오드 패키지 및 백라이트 유닛

Country Status (3)

Country Link
KR (1) KR101107770B1 (ko)
TW (1) TWI423487B (ko)
WO (1) WO2010137841A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012256558A (ja) * 2011-06-10 2012-12-27 Meitaku Kogyo Kk 大判面光源装置
KR101886073B1 (ko) * 2011-06-23 2018-09-06 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
GB201410117D0 (en) 2014-06-06 2014-07-23 Idough Invest Company Improvements in and relating to bale wrapping machines
CN108470559A (zh) * 2018-04-25 2018-08-31 昆山海旭科技电子有限公司中山分公司 一种smd蜂鸣器
CN113555326A (zh) * 2021-06-03 2021-10-26 珠海越亚半导体股份有限公司 可润湿侧面的封装结构与其制作方法及垂直封装模块

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719282B1 (ko) * 2005-12-20 2007-05-17 서울반도체 주식회사 탑 뷰 및 사이드 뷰 공용 발광 다이오드
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
KR20080061763A (ko) * 2006-12-28 2008-07-03 주식회사 우영 Ｌｅｄ백라이트 유닛
KR20090002172A (ko) * 2007-06-20 2009-01-09 엘지이노텍 주식회사 반도체 발광소자 패키지
KR20090044306A (ko) * 2007-10-31 2009-05-07 서울반도체 주식회사 발광다이오드 패키지

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TWI283937B (en) * 2005-06-23 2007-07-11 Lite On Technology Corp Optoelectronic semiconductor component with high light-emitting efficiency
KR100632002B1 (ko) * 2005-08-02 2006-10-09 삼성전기주식회사 보호 소자를 포함하는 측면형 발광 다이오드
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR100747642B1 (ko) * 2006-06-27 2007-08-08 서울반도체 주식회사 측면 발광형 ｌｅｄ 패키지
TWI349141B (en) * 2007-02-27 2011-09-21 Au Optronics Corp An edge-type backlight module comprises
US7566159B2 (en) * 2007-05-31 2009-07-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Side-emitting LED package with improved heat dissipation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100719282B1 (ko) * 2005-12-20 2007-05-17 서울반도체 주식회사 탑 뷰 및 사이드 뷰 공용 발광 다이오드
KR20080061763A (ko) * 2006-12-28 2008-07-03 주식회사 우영 Ｌｅｄ백라이트 유닛
KR20090002172A (ko) * 2007-06-20 2009-01-09 엘지이노텍 주식회사 반도체 발광소자 패키지
JP2007329502A (ja) * 2007-08-16 2007-12-20 Toshiba Corp 発光装置
KR20090044306A (ko) * 2007-10-31 2009-05-07 서울반도체 주식회사 발광다이오드 패키지

Also Published As

Publication number Publication date
WO2010137841A2 (ko) 2010-12-02
KR20100127623A (ko) 2010-12-06
TWI423487B (zh) 2014-01-11
TW201104936A (en) 2011-02-01
KR101107770B1 (ko) 2012-01-20

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