201104936 3477 lpif 六、發明說明： 【發明所屬之技術領域】 本發明是關於發光二極體（light emitting diode，LED) 封裝以及背光單元’且更特定言之，是關於具有改良之散 熱效率的LED封裝以及背光單元。 相關專利申請案之交互參考 本申請案主張2009年5月26曰在韓國智慧財產局申 請之韓國專利申請案第1〇_2〇〇9-〇〇〇46148號之權益，該專 利申請案之揭露内容以全文引用之方式併入本文中。 【先前技術】 發光二極體（下文稱作LED)為用於藉由使用化合物 半導體之特性而將電轉換成光的裝置，且在各種領域中作 為下一代光源來使用並加以開發。 此LED藉由模製部分以及引線框架而封裝於LED封 裝中。近來，針對各種類型之顯示裝置來開發LED封裴， 且尤其作為液晶顯示器（liquid crystal display，LCD)裝 置之背光單元來廣泛研究且開發LED封裝。 LED封裝可基於所發射之光射出的方向而分成兩 類：頂視(top-view)型LED封裝以及側視(side_view)型led 封裝。大尺寸LCD裝置（諸如，τν)中使用之背光單元 使用頂視i LED封裝來獲得高功率。然而，在此種情況 下，若LED封裝沿導光板之光入射纟面之一側來配置，則 必需配置-種安裝有LED封裝之印刷電路板（priced ⑽uit board ’ PCB) ’使此印刷電路板平行於導光板之光 4 201104936 34771pif 入射表面，且因此需要獨立之鋁底盤（chassis)或托架 (bracket)。因此，所需零件之數目增加，且因此總體結構 變複^。此外，歸因於所需零件數目之增加，在零件之間 形成氣隙，且因此歸因於氣隙使熱阻增加。因此，以此方 式形成之背光單元的效能惡化。 兩側視型LED封裝廣泛用於行動裝置（諸如，蜂巢式 电話個人數位助理（personal digitai assistant，pdAs}以 及其類似者）中使用之小尺寸顯示器的背光單元中。為將 侧視型LED封裝用於大尺寸顯示裝置（諸如，τν)，需要 高功率以及極好之散熱效率。然而，一般侧視型LED封裝 具有僅適合用於小尺寸顯示器的結構。因此，若側視型 LED封裝之輸出功率增加，則不可確保足夠之散熱效率， 且因此難以將一般侧視型LED封裝用於丁¥或其類似者。 【發明内容】 ~ ' 本發明提供一種具有改良之散熱效率的LED封裝以 及背光單元。 本發明亦提供一種具有改良之發光效率的LED封 以及背光單元。 、 根據本發明之一態樣，提供一種發光二極體（led) 封裝，所述LED封裝包含：第一墊；第二墊，其與第一墊 電分離；第一晶片，其安裝於第一墊上、電連接至第一墊 以及第二墊且發射光；模製部分，其固定第一墊以及第_ 墊且具有支撐表面；第一引線，其電連接至第一墊、配^ 於模製部分之外側且具有第一表面；以及第二引線，其電 201104936 34771pif 連接至第二塾、與第〜 處且具有平行於Ϊ—表面線，、配置於模製部分之外侧 二表面之組合面積為帛表面其中第-表面與第 第一表面絲二面之面躺啊以上。 積的100%以下。 之、’且δ面積可在支樓表面之面 第一表面以及第-主 伸。 L表面可朝著切表面之―部分延 支^面可平行於第—晶片發射 根據本發明之另i f向。 ，所述LED封裝包含n第二==(第LED) 電分離;第一晶片，其安裳於第-墊上、電連接=一= 以及第二墊且發射光；模势， 運接至弟一墊 塾且具有繼面;第」“以及第二 於模製部分之外辑，且具有帛n ' =置 其電連接至第二墊、與第—引錄八雜币一N線， 外側且J·有平行於帛刀離置於模製部分之 側且”有和了於第-表面之第二表面，其中 包含向外部敞開之散熱孔。 ' 4刀更 散熱孔可在與第-塾之安裝有第—晶 的方向上敞開。 衣面相反 根據本發明之另一態樣，提供一種發光二極體 封裝，所述LED封裝包含：第一墊；第二墊，其與 ） 電分離立具有凹陷部分；第一晶片，其安裝於1遠二一墊 電連接至第m第二塾且發射光；第二晶片， 於凹陷部分中且電連接至第一墊以及第二墊;模製部：裝 6 201104936 34771pif 其固定第一墊以及第二墊且具有支撐表面；第一引線，其 電連接至第一墊、配置於模製部分之外侧且具有第一表 面；以及第二引線’其電連接至第二墊、與第一引線分離、 配置於模製部分之外側且具有平行於第一表面之第二表 面。 根據本發明之另一態樣，提供一種背光單元，所述背 光單元包含.主體，導光板，其配置於主體上；印刷電路 板（PCB)，其安裝至主體；以及如上所述之LED封震， 其安裝至PCB且與導光板之光入口對準。 所述PCB可為金屬PCB。 導光板之光入口可位於導光板之一側且可延伸 至導光板與主體之間的空間。 背光單元可更包含插入於主體與pCB之間的導熱層。 根據本發明之另-態樣，提供一種背光單元，所述背 光單兀包含.主體’導紐，其配置於主體上；印刷電路 板（PCB) ’其女裝至主體；如中請專利範圍第^至7項中 任-項所狀LED封裝，其安裝至pcB且料歧之光 入口對準，以及導熱層’赫人於主軸pcB 。 所述PCB可為金屬pcB。201104936 3477 lpif VI. Description of the Invention: [Technical Field] The present invention relates to a light emitting diode (LED) package and a backlight unit' and, more particularly, to an LED having improved heat dissipation efficiency Package and backlight unit. Cross-Reference to Related Patent Applications This application claims the benefit of Korean Patent Application No. 1〇2〇〇9-〇〇〇46148, filed on May 26, 2009 in Korea Intellectual Property Office, the patent application The disclosure is hereby incorporated by reference in its entirety. [Prior Art] A light-emitting diode (hereinafter referred to as an LED) is a device for converting electricity into light by using characteristics of a compound semiconductor, and is used and developed as a next-generation light source in various fields. This LED is packaged in the LED package by means of a molded part and a lead frame. Recently, LED packages have been developed for various types of display devices, and in particular, as backlight units for liquid crystal display (LCD) devices, LED packages have been extensively researched and developed. LED packages can be divided into two categories based on the direction in which the emitted light is emitted: a top-view LED package and a side-view LED package. A backlight unit used in a large-sized LCD device such as τν uses a top view i LED package to obtain high power. However, in this case, if the LED package is disposed along one side of the light incident on the surface of the light guide plate, it is necessary to configure a printed circuit board ( priced (10) uit board 'PCB) mounted with the LED package to make the printed circuit The plate is parallel to the light of the light guide 4 201104936 34771pif incident surface, and thus requires a separate aluminum chassis or bracket. Therefore, the number of parts required increases, and thus the overall structure changes. Furthermore, due to the increase in the number of parts required, an air gap is formed between the parts, and thus the thermal resistance is increased due to the air gap. Therefore, the performance of the backlight unit formed in this manner deteriorates. The two-sided view type LED package is widely used in backlight units of small-sized displays used in mobile devices such as personal digitai assistants (pdAs} and the like). The package is used for large-sized display devices (such as τν), which requires high power and excellent heat dissipation efficiency. However, the general side view type LED package has a structure suitable only for a small-sized display. Therefore, if the side view type LED package When the output power is increased, sufficient heat dissipation efficiency cannot be ensured, and thus it is difficult to use a general side view type LED package for D or the like. [Invention] The present invention provides an LED package with improved heat dissipation efficiency. And a backlight unit. The invention also provides an LED package with improved luminous efficiency and a backlight unit. According to an aspect of the invention, a light emitting diode (LED) package is provided, the LED package comprising: a first pad a second pad electrically separated from the first pad; a first wafer mounted on the first pad, electrically connected to the first pad and the second pad a molded portion that fixes the first pad and the _ pad and has a support surface; a first lead electrically connected to the first pad, disposed on an outer side of the molded portion and having a first surface; and a second lead , the electric 201104036 34771pif is connected to the second crucible, and the second portion, and has a parallel to the crucible-surface line, and the combined area disposed on the outer surface of the molded portion is the crucible surface, wherein the first surface and the first surface filament The two sides are lying above or above. The product is less than 100%. The 'δ area can be on the first surface of the surface of the branch and the first-threshold. The L surface can be extended toward the surface of the cut surface. The LED package may include n second == (LED) electrical separation in parallel with the first wafer, the first wafer, which is mounted on the first pad, and electrically connected = one = And a second pad and emitting light; a mode potential, transported to the pad and having a step; the first and the second part of the molded part, and having 帛n ' = electrically connected to the second Pad, and the first - cited eight miscellaneous coins - N line, the outside and J · have parallel to the file to leave the mold The side and the second surface of the first surface include a heat dissipation hole that is open to the outside. The four-blade heat dissipation hole can be opened in the direction in which the first-side is mounted with the first crystal. In contrast, according to another aspect of the present invention, a light emitting diode package is provided, the LED package comprising: a first pad; a second pad electrically separated from the body having a recessed portion; and a first wafer mounted on the first The far two pads are electrically connected to the mth second turn and emit light; the second wafer is in the recessed portion and is electrically connected to the first pad and the second pad; the molding portion: is mounted 6 201104936 34771pif, the fixed first pad and a second pad having a support surface; a first lead electrically connected to the first pad, disposed on an outer side of the molded portion and having a first surface; and a second lead ' electrically connected to the second pad, and the first lead Separated, disposed on an outer side of the molded portion and having a second surface parallel to the first surface. According to another aspect of the present invention, a backlight unit is provided, the backlight unit comprising: a main body, a light guide plate disposed on the main body; a printed circuit board (PCB) mounted to the main body; and the LED seal as described above Shock, it is mounted to the PCB and aligned with the light entrance of the light guide. The PCB can be a metal PCB. The light entrance of the light guide plate may be located on one side of the light guide plate and may extend to a space between the light guide plate and the main body. The backlight unit may further include a heat conductive layer interposed between the body and the pCB. According to another aspect of the present invention, a backlight unit is provided, the backlight unit includes a main body 'conductor, which is disposed on the main body; a printed circuit board (PCB) 'its women's body to the main body; The LED package of any of items ^ to 7 is mounted to the pcB and the light entrance of the material is aligned, and the heat conducting layer is 'Herman' on the spindle pcB. The PCB can be a metal pcB.
導光板之光入口可位於導光板之一側，且pc 至導光板與主體之間的空間。 T 【實施方式】 在下文中，將藉由參看附圖來解釋 例而詳細描述本發明，使本發明之下述 201104936 3477 lpif 點變得更明顯。圖式中之相同參考數字表示相同元件。 圖1為根據本發明之-實施例的絲二極體（led) 封裝100的前視圖’且圖2為圖1之LED封裝100的底視 圖。圖3為沿圖1之線m_m獲得的截面圖，且圖*為^ 圖1之線IV-IV獲得的截面圖。 σ 根據本實施例之LED封裝100為側視型㈣封裝。 在圖1至圖4巾，x轴方向為光自第一晶片1〇8發射 之方向，第-晶片1G8可為LED晶片，而z轴方向為根據 本發明之LED封裝_可絲附接至印刷電触（pcB) 上的方向。在下文中，為便於解釋，LED封裝1〇〇之面向 z軸方向的表面將被稱作底面，LED封裝1〇〇之面向與z 軸方向相反之方向的表面將被稱作頂面，LED封裝1〇〇之 面向y軸方向的表面將被稱作側面，且LED封裝1〇〇之面 向X軸方向的表面將被稱作前面。 參看圖1至圖4’根據本實施例之LED封裝100包含 彼此分離之第一墊104與第二墊1〇5、第一晶片1〇8、模^ 部分10卜第一引線106以及第二引線1〇7。 衣 第一墊104以及第二墊105可由傳導金屬板形成。 第一晶片108安裝於第一墊104上。第一晶片ι〇8可 為LED晶片，且可藉由使用晶粒(die)點接劑而晶粒結合至 第一墊104。第一晶片108可分別經由第一線1〇9以及第 二線110而電連接至第一墊104以及第二墊ι〇5。然而， 第一晶片108與第一墊104以及第二墊105之間的連接不 限於經由線之連接，且第一晶片108與第一墊1〇4以及第 8 201104936 3477 lpif 二墊105可藉由使用覆晶結合(flip Chip bonding)方法而無 線地連接。此外，多個第一晶片1〇8可附接至第一墊1〇4。 第一墊104以及第二墊105；藉由模製部分1〇1而固 定。模製部分ιοί藉由使用（例如）轉注成型(transfer molding)或射出成型㈣ecti〇n m〇lding)方法而由樹脂材料 形成且將第一墊104以及第二墊1〇5支撐並固定於其上。 模製部分101形成LED封裝1〇〇之外邊緣。 模製部分101可經配置以在第一晶片1〇8周圍形成反 射表面102。如圖3以及圖4中所展示，反射表面1〇2經 傾斜配置以集中由第一晶片1〇8在向前方向上發射之更多 光，且可經配置以使得反射表面102相對於向前方向成52 度至88度之間的角度而向外傾斜。因此，更多光可朝著導 光板集中，且水平視角可最大化，且因此在背光單元之形 成期間LED封裝之間的黑暗部分可最小化。因此，一組背 光單元之遮光屏寬度（bezel width)可最小化。 如圖3以及圖4中所展示，可在反射表面1〇2之内側 處進一步形成獨立密封部件115以保護第一晶片1〇8免遭 外部元件損害。可在㈣部件lls巾混合縣㈣以調整 第一晶片108發射之光的顏色。 模製部分101之底面安裝於PCB上’將在稍後描述所 述PCB，其中底面（亦即，面向PCB之表面）將在下 稱作支撐表面101a ^ 同時，第一引線106以及第二引線1〇7分別自第一墊 104以及第二墊105延伸且在模製部分1〇1之外侧處暴 201104936 34771pif 露。第一引線106以及第二引線107分別電連接至第一塾 104以及第二墊105,其中第一引線106以及第二引線1〇7 可分別與第一墊1〇4以及第二墊105整合成單一主體。 如圖2中所示，第一引線1〇6以及第二引線107形成 為板狀且沿支撐表面l〇la之一部分延伸。更嚴格地說，第 一引線106以及第二引線1〇7沿χ·γ平面延伸。 第一引線106以及第二引線107分別具有第一表面 106a以及第二表面1〇7a。在本發明中，第一表面1〇6&與 第二表面l〇7a之組合面積是支撐表面1〇la之面積的約 30%至約ι〇0%。儘管第一引線1〇6以及第二弓|線107之尺 寸可更大，但為了生產力以及可加工性，其尺寸可為支， 表面101a之面積的約3〇%至約1〇0〇/〇。 牙The light entrance of the light guide plate may be located on one side of the light guide plate, and pc to the space between the light guide plate and the main body. [Embodiment] Hereinafter, the present invention will be described in detail by explaining the examples with reference to the accompanying drawings, and the following 201104936 3477 lpif points of the present invention will become more apparent. The same reference numerals in the drawings denote the same elements. 1 is a front view of a wire diode package 100 in accordance with an embodiment of the present invention and FIG. 2 is a bottom plan view of the LED package 100 of FIG. 3 is a cross-sectional view taken along line m_m of FIG. 1, and FIG. * is a cross-sectional view taken along line IV-IV of FIG. σ The LED package 100 according to the present embodiment is a side view type (four) package. In FIGS. 1 to 4, the x-axis direction is the direction in which light is emitted from the first wafer 1-8, the first wafer 1G8 may be an LED wafer, and the z-axis direction is an LED package according to the present invention. The direction on the printed electrical touch (pcB). Hereinafter, for convenience of explanation, the surface of the LED package 1 facing the z-axis direction will be referred to as a bottom surface, and the surface of the LED package 1 facing the direction opposite to the z-axis direction will be referred to as a top surface, and the LED package The surface facing the y-axis direction will be referred to as a side surface, and the surface of the LED package 1 facing the X-axis direction will be referred to as a front surface. Referring to FIGS. 1 to 4, the LED package 100 according to the present embodiment includes a first pad 104 and a second pad 1〇5, a first wafer 1〇8, a die portion 10, a first lead 106, and a second, which are separated from each other. Lead 1〇7. The first pad 104 and the second pad 105 may be formed of a conductive metal plate. The first wafer 108 is mounted on the first pad 104. The first wafer ι 8 may be an LED wafer and may be die bonded to the first pad 104 by using a die splicer. The first wafer 108 can be electrically connected to the first pad 104 and the second pad 5 via the first line 1〇9 and the second line 110, respectively. However, the connection between the first wafer 108 and the first pad 104 and the second pad 105 is not limited to the connection via the line, and the first wafer 108 and the first pad 1〇4 and the 8th 201104936 3477 lpif two pad 105 may be borrowed. It is connected wirelessly by using a flip chip bonding method. Further, a plurality of first wafers 1A8 may be attached to the first pads 1A4. The first pad 104 and the second pad 105 are fixed by the molding portion 1〇1. The molding portion ιοί is formed of a resin material by using, for example, a transfer molding or an injection molding method, and supports and fixes the first pad 104 and the second pad 1〇5 thereon. . The molded portion 101 forms an outer edge of the LED package 1 . The molded portion 101 can be configured to form a reflective surface 102 around the first wafer 1A8. As shown in Figures 3 and 4, the reflective surface 1〇2 is configured obliquely to concentrate more light emitted by the first wafer 1〇8 in the forward direction, and may be configured such that the reflective surface 102 is relatively forward The direction is inclined outwardly at an angle between 52 degrees and 88 degrees. Therefore, more light can be concentrated toward the light guide plate, and the horizontal viewing angle can be maximized, and thus the dark portion between the LED packages can be minimized during the formation of the backlight unit. Therefore, the bezel width of a set of backlight units can be minimized. As shown in Figures 3 and 4, a separate sealing member 115 can be further formed at the inner side of the reflective surface 1 2 to protect the first wafer 1 8 from external component damage. The color of the light emitted by the first wafer 108 can be adjusted in the (four) part lls towel mixing county (four). The bottom surface of the molded portion 101 is mounted on the PCB. The PCB will be described later, wherein the bottom surface (that is, the surface facing the PCB) will be referred to as a support surface 101a hereinafter. Meanwhile, the first lead 106 and the second lead 1 The crucible 7 extends from the first mat 104 and the second mat 105, respectively, and is exposed at the outer side of the molded portion 1〇1 201104636 34771pif. The first lead 106 and the second lead 107 are electrically connected to the first cymbal 104 and the second pad 105, respectively, wherein the first lead 106 and the second lead 〇7 are respectively integrated with the first pad 1 〇 4 and the second pad 105 Become a single subject. As shown in Fig. 2, the first lead 1?6 and the second lead 107 are formed in a plate shape and extend along a portion of the support surface 10a. More strictly speaking, the first lead 106 and the second lead 1〇7 extend along the χ·γ plane. The first lead 106 and the second lead 107 have a first surface 106a and a second surface 1〇7a, respectively. In the present invention, the combined area of the first surface 1?6& and the second surface 10a is about 30% to about ι?0% of the area of the support surface 1? Although the size of the first lead 1〇6 and the second bow|wire 107 may be larger, for productivity and workability, the size may be a branch, and the area of the surface 101a may be about 3〇% to about 1〇0〇/ Hey. tooth
川/叩男双千地散熟。此處’如圖6中所展示，筮一α姑Chuan / 叩 men's doubles scattered. Here, as shown in Figure 6, 筮一α姑
之間以防止第一引線106與第二引線1〇7 與第二弓丨線107 之間的短路且平 201104936 3477 lpif 衡整個LED封裝100。如圖3中所展示，支撐單元1〇3之 底面的一部分可不平坦，且可在向後方向上傾斜。然而， 本發明不限於此，且支撐單元103之底面的所述部分可為 平坦的且平行於X-Y平面而延伸。 同時’如圖4中所展示，散熱孔1H進一步形成於模 製部分101中。自第一晶片108散發出的熱可不僅經由第 一引線106以及第二引線1〇7排出，且亦經由模製部分 排出。為改良模製部分1〇1之散熱特性，在模製部分 中形成散熱孔114 ’使得外部大氣可經由散熱孔114而流 進。因此’可易於排出來自模製部分1〇1的熱。 如圖3以及圖4中所展示，散熱孔114可經形成以在 第一墊104之向後方向上敞開，第一晶片1〇8安裝於第一 墊104上。因此，模製部分1〇1的安裝有第一晶片1〇8之 一部分的厚度可最小化。儘管圖3以及圖4中所展示之散 熱孔114的數目為二，但本發明不限於此，且可形成更少 或更多散熱孔。如圖3以及圖4中所展示，散熱孔114之 深度可為模製部分101在χ軸方向上之厚度的約一半以 上。隨著散熱孔114之深度增加，模製部分1〇1的上面安 裝有第一晶片108之部分的厚度減小，且因此可改良模製 部分101之散熱效率。舉例而言，如圖5中所展示，散熱 孔114可經形成以具有用以部分暴露第一墊1〇4以及第二 塾105的深度。在此種情況下，可經由散熱孔114藉由外 邛大氣直接冷卻第—墊114，且因此可改良整個LED封裝 100的散熱效率。 201104936 3477 lpif 此外，如圖1中所展示，第二晶片113可進一步安裝 於第二墊104上。第二晶片113可為用於保護第一晶片1〇8 免遭靜電損害之齊納(zener)二極體晶片。第二晶片113電 連接至第二墊105，且亦經由第三線ill而電連接至第一 墊 104。 在本發明中，為防止第一晶片108發射之光的強度因 第二晶片113而惡化，如圖4中所展示，在第二墊1〇5中 形成凹陷部分112’且將第二晶片113配置於凹陷部分11: 中。因此，第一晶片108所發射之光歸因於第二晶片 所致之損失可最小化。凹陷部分112之深度可對應於第二 曰曰片113之厚度。然而，本發明不限於此，且凹陷部分 可具有任何深度，只要第一晶片108之光特性不受第二晶 片113之突出在凹陷部分112上方之部分所影響便可。 如圖6中所展示，如上文所述般形成之LED封裝1〇〇 可安裝至背光單元。 根據本發明之實施例的背光單元包含主體2〇〇、導光 板 300、PCB 400 以及 LED 封裝 1〇〇。 導光板300安裝至主體200，使得導光板3〇〇之底面 (為相對較大的表面）面向主體2〇〇，如圖6中所展示。 PCB 400可為金屬PCB，使得由LED封裝1〇〇產生 的熱可經由PCB 400有效地傳輸至主體2〇〇。pCB 4〇〇可 形成為足夠大以橫跨導光板300之光入口，且因此藉由導 光板300之光入口所反射的光可再次儘可能多地反射以藉 由金屬PCB來改良效率。因此，使用具有極好反射性之光 12 201104936 34771pif 阻焊劑（photo solder resist，PSR)以及具有約 1 \V7mK 至 約2 W/mk之熱導率的絕緣材料來形成PCB 400。然而， PCB 400不限於金屬PCB，且可使用一般PCB或可撓性 PCB (FPCB)。 PCB 400 (如上文所描述，LED封裝100安裝於其上） 是沿導光板300之邊緣而配置，亦即，光入口在導光板3〇〇 之一側處。在此種情況下，PCB 400可經形成以具有足夠 大面積以觸及導光板300之底面，所述底面為導光板3〇〇 相對較大的表面。因此’由於PCB400具有相對較大的面 積’則可進一步改良經由PCB 400傳熱之效率，且因此可 改良背光單元之整體散熱效率。 如上文所描述，若將高功率側視型LED封裝安裝至 PCB 400，則獨立的鋁底盤或托架皆非必需的。換言之， 在先前技術中，在需要高功率之背光單元中僅可使用頂視 型LED封裝。然而，在此種情況下’安裝有頂視型 封裝之PCB經配置以平行於導光板之光入射表面，且因此 使獨立的鋁底盤或托架變成必需的。然而，在使用如上文 所描述的根據本發明之實施例之側視型LED封裴的情況 下，僅藉由將安裝有LED封裝之PCB 400安裝至主體 2〇〇，而將LED封裝所發射之光導向導光板3〇〇 ^光入射 表面，且因此無需獨立的底盤或托架。 、 沾道’根據本發明之實施例，由高黏性熱化合物形成 的導熱層500可插人於PCB4〇〇與主體2〇〇之間以+ 改良高的散熱效率。藉由形成導熱層，，可消除主體^ 201104936 3477 lpif 與PCB 400之間的空氣層’且因此可更平緩地傳輸熱。如 此’導熱層500可由具有高於0.5 W/mk之熱導率的熱化合 物形成，其中可使用中性硬化矽或樹脂、熱硬化石夕或樹脂、 非硬化梦或樹脂或導熱帶來形成導熱層500。即使PCB 400 並非金屬PCB，但導熱層500仍平緩地將熱自peg 4〇〇傳 輸至主體200 ’且因此可改良整個背光單元之散熱效率。 如上文所描述，根據本發明，可提供具有改良之散熱 效率之LED封裝以及背光單元。 此外，可提供具有改良之發光效率的LED封農以及 背光單元。 因此，甚至可將側視型LED封裝應用於需要高於 0.25W之高功率的背光單元。 ' 此外，安裝根據本發明之LED封裝無需獨立的底盤 或托架，且因此根據本發明之LED封裝具有裝配效率、生 產力以及生產成本的優點。 雖然已參考本發明之例示性實施例來特定地展示並 描述本發明，但一般熟習此項技術者應理解，在未脫離例 如由以下申請專利範圍界定的本發明之精神以及範疇的情 况下可在形式以及細節上對本發明進行各種改變。 【圖式簡單說明】 圖1為根據本發明之一實施例的發光二極體（led) 封裝之前視圖。 圖2為圖1之LED封裝的底視圖。 圖3為沿圖1之線mu獲得的截面圖。 201104936 3477 lpif 圖4為沿圖1之線IV-IV獲得的截面圖。 圖5為根據本發明之另一實施例的發光二極體（LED) 封裝之截面圖。 圖6為根據本發明之一實施例的背光單元之截面圖。 【主要元件符號說明】 100 :發光二極體（LED)封裝 101:模製部分 101a :支撐表面 102 :反射表面 103 :支撐單元 104 :第一墊 105 :第二墊 106 :第一引線 106a :第一表面 107 :第二引線 107a :第二表面 108 第一晶片 109 第一線 110 第二線 111 第三線 112 凹陷部分 113 第二晶片 114 散熱孔 115 密封部件 15 201104936 34771pif 200 :主體 300 :導光板 400 :印刷電路板（PCB) 500 :導熱層Between the first lead 106 and the second lead 1〇7 and the second bow line 107 are prevented from being short-circuited and the entire LED package 100 is balanced. As shown in Fig. 3, a part of the bottom surface of the support unit 1〇3 may not be flat and may be inclined in the rearward direction. However, the present invention is not limited thereto, and the portion of the bottom surface of the support unit 103 may be flat and extend parallel to the X-Y plane. Meanwhile, as shown in Fig. 4, the heat dissipation holes 1H are further formed in the molding portion 101. The heat radiated from the first wafer 108 can be discharged not only through the first lead 106 and the second lead 1〇7 but also through the molded portion. In order to improve the heat dissipation characteristics of the molded portion 101, the heat dissipation holes 114' are formed in the molded portion so that the outside atmosphere can flow through the heat dissipation holes 114. Therefore, heat from the molded portion 1〇1 can be easily discharged. As shown in FIGS. 3 and 4, the heat dissipation holes 114 may be formed to be open in the rearward direction of the first pads 104, and the first wafers 1A8 are mounted on the first pads 104. Therefore, the thickness of a portion of the molded portion 1?1 on which the first wafer 1?8 is mounted can be minimized. Although the number of the heat dissipation holes 114 shown in Figs. 3 and 4 is two, the present invention is not limited thereto, and fewer or more heat dissipation holes may be formed. As shown in Figures 3 and 4, the depth of the heat dissipation holes 114 may be more than about half of the thickness of the molded portion 101 in the z-axis direction. As the depth of the heat dissipation holes 114 increases, the thickness of the portion of the molded portion 1?1 on which the first wafer 108 is mounted is reduced, and thus the heat dissipation efficiency of the molded portion 101 can be improved. For example, as shown in FIG. 5, the heat dissipation holes 114 may be formed to have a depth to partially expose the first pad 1〇4 and the second crucible 105. In this case, the first pad 114 can be directly cooled by the external air through the heat dissipation holes 114, and thus the heat dissipation efficiency of the entire LED package 100 can be improved. 201104936 3477 lpif Further, as shown in FIG. 1, the second wafer 113 may be further mounted on the second pad 104. The second wafer 113 may be a Zener diode wafer for protecting the first wafer 1 8 from electrostatic damage. The second wafer 113 is electrically connected to the second pad 105 and is also electrically connected to the first pad 104 via the third line ill. In the present invention, in order to prevent the intensity of the light emitted from the first wafer 108 from being deteriorated by the second wafer 113, as shown in FIG. 4, the recessed portion 112' is formed in the second pad 1?5 and the second wafer 113 is to be formed. Disposed in the recessed portion 11:. Therefore, the loss of light emitted by the first wafer 108 due to the second wafer can be minimized. The depth of the recessed portion 112 may correspond to the thickness of the second gusset 113. However, the present invention is not limited thereto, and the depressed portion may have any depth as long as the optical characteristics of the first wafer 108 are not affected by the portion of the second wafer 113 protruding above the recessed portion 112. As shown in FIG. 6, the LED package 1A formed as described above can be mounted to the backlight unit. A backlight unit according to an embodiment of the present invention includes a main body 2, a light guide plate 300, a PCB 400, and an LED package. The light guide plate 300 is mounted to the main body 200 such that the bottom surface (which is a relatively large surface) of the light guide plate 3 faces the main body 2, as shown in FIG. The PCB 400 may be a metal PCB such that heat generated by the LED package 1 有效 can be efficiently transmitted to the main body 2 via the PCB 400. The pCB 4 can be formed to be large enough to traverse the light entrance of the light guide plate 300, and thus the light reflected by the light entrance of the light guide plate 300 can be reflected again as much as possible to improve efficiency by the metal PCB. Therefore, the PCB 400 is formed using an excellent reflective light 12 201104936 34771pif photo solder resist (PSR) and an insulating material having a thermal conductivity of about 1 \V7mK to about 2 W/mk. However, the PCB 400 is not limited to a metal PCB, and a general PCB or a flexible PCB (FPCB) can be used. The PCB 400 (on which the LED package 100 is mounted as described above) is disposed along the edge of the light guide plate 300, that is, the light entrance is at one side of the light guide plate 3'. In this case, the PCB 400 may be formed to have a large enough area to touch the bottom surface of the light guide plate 300, which is a relatively large surface of the light guide plate 3'. Therefore, the efficiency of heat transfer through the PCB 400 can be further improved because the PCB 400 has a relatively large area, and thus the overall heat dissipation efficiency of the backlight unit can be improved. As described above, if a high power side view LED package is mounted to the PCB 400, a separate aluminum chassis or carrier is not required. In other words, in the prior art, only a top view type LED package can be used in a backlight unit requiring high power. However, in this case, the PCB mounted with the top view type package is configured to be parallel to the light incident surface of the light guide plate, and thus a separate aluminum chassis or bracket becomes necessary. However, in the case of using the side view type LED package according to the embodiment of the present invention as described above, the LED package is emitted only by mounting the PCB 400 on which the LED package is mounted to the main body 2? The light guides the light guide 3 to the light incident surface and thus does not require a separate chassis or bracket. According to an embodiment of the present invention, the heat conductive layer 500 formed of a highly viscous thermal compound can be inserted between the PCB 4 and the main body 2 to improve the heat dissipation efficiency. By forming the heat conducting layer, the air layer ' between the body ^ 201104936 3477 lpif and the PCB 400 can be eliminated and thus heat can be transferred more gently. Thus the 'thermally conductive layer 500 can be formed from a thermal compound having a thermal conductivity higher than 0.5 W/mk, wherein heat can be formed using a neutral hardening crucible or a resin, a thermosetting stone or a resin, a non-hardening dream or a resin or a heat conductive tape. Layer 500. Even if the PCB 400 is not a metal PCB, the heat conductive layer 500 smoothly transfers heat from the peg 4 to the main body 200' and thus can improve the heat dissipation efficiency of the entire backlight unit. As described above, according to the present invention, an LED package having an improved heat dissipation efficiency and a backlight unit can be provided. In addition, LED enclosures and backlight units with improved luminous efficiency can be provided. Therefore, the side view type LED package can be applied even to a backlight unit requiring a high power of more than 0.25W. Furthermore, the mounting of the LED package according to the present invention does not require a separate chassis or bracket, and thus the LED package according to the present invention has the advantages of assembly efficiency, productivity, and production cost. While the invention has been particularly shown and described with reference to the exemplary embodiments of the present invention, it will be understood by those skilled in the art The invention is subject to various modifications in form and detail. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front elevational view of a light emitting diode (LED) package in accordance with an embodiment of the present invention. 2 is a bottom view of the LED package of FIG. 1. Figure 3 is a cross-sectional view taken along line mu of Figure 1. 201104936 3477 lpif Figure 4 is a cross-sectional view taken along line IV-IV of Figure 1. 5 is a cross-sectional view of a light emitting diode (LED) package in accordance with another embodiment of the present invention. Figure 6 is a cross-sectional view of a backlight unit in accordance with an embodiment of the present invention. [Main Component Symbol Description] 100: Light Emitting Diode (LED) Package 101: Molded Portion 101a: Supporting Surface 102: Reflecting Surface 103: Supporting Unit 104: First Pad 105: Second Pad 106: First Lead 106a: First surface 107: second lead 107a: second surface 108 first wafer 109 first line 110 second line 111 third line 112 recessed portion 113 second wafer 114 heat dissipation hole 115 sealing member 15 201104936 34771pif 200 : main body 300 : guide Light Board 400: Printed Circuit Board (PCB) 500: Thermal Conductive Layer