WO2010121720A1 - Verfahren zur herstellung eines elektromechanischen wandlers - Google Patents

Verfahren zur herstellung eines elektromechanischen wandlers Download PDF

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Publication number
WO2010121720A1
WO2010121720A1 PCT/EP2010/002238 EP2010002238W WO2010121720A1 WO 2010121720 A1 WO2010121720 A1 WO 2010121720A1 EP 2010002238 W EP2010002238 W EP 2010002238W WO 2010121720 A1 WO2010121720 A1 WO 2010121720A1
Authority
WO
WIPO (PCT)
Prior art keywords
recesses
polymer layer
continuous
cover
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2010/002238
Other languages
German (de)
English (en)
French (fr)
Inventor
Werner Jenninger
Joachim Wagner
Wolfgang Fischer
Jörg Büchner
Thomas Bernert
Andreas Nübler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Deutschland AG
Original Assignee
Bayer MaterialScience AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer MaterialScience AG filed Critical Bayer MaterialScience AG
Priority to JP2012506369A priority Critical patent/JP2012524986A/ja
Priority to US13/258,646 priority patent/US8779650B2/en
Priority to CN201080018062.5A priority patent/CN102415106B/zh
Priority to EP10713317A priority patent/EP2422530A1/de
Publication of WO2010121720A1 publication Critical patent/WO2010121720A1/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/08—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers separated by air or other fluid
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S310/00—Electrical generator or motor structure
    • Y10S310/80—Piezoelectric polymers, e.g. PVDF
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • connecting the first recesses-comprising polymer layer to the cover takes place by only partially solidifying the material of the first recesses-comprising polymer layer after application to the first continuous polymer layer, and / or only partially solidifying the material of the second recesses Polymer layer after application to the second continuous polymer layer, and further, in particular complete, solidifying the material of the first recesses comprehensive polymer layer after the application of the cover, and / or further, in particular complete, solidifying the material of the second recesses comprising polymer layer after the application of the Cover.
  • solidification, drying and / or crosslinking and / or solidification and / or crystallization can be understood.
  • the ink, the ink, the paste, the formulation, the paint or the adhesive or the first and / or second recesses polymer layer comprises a resin
  • the printing ink, the ink, the paste, the formulation, the paint or the adhesive or the first and / or second Recesses comprising polymer layer optionally further comprise one or more resin hardener.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
PCT/EP2010/002238 2009-04-24 2010-04-10 Verfahren zur herstellung eines elektromechanischen wandlers Ceased WO2010121720A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012506369A JP2012524986A (ja) 2009-04-24 2010-04-10 電気機械の変換器の製造プロセス
US13/258,646 US8779650B2 (en) 2009-04-24 2010-04-10 Process for the producing of an electromechanical transducer
CN201080018062.5A CN102415106B (zh) 2009-04-24 2010-04-10 生产电-机换能器的方法、电-机换能器及其用途
EP10713317A EP2422530A1 (de) 2009-04-24 2010-04-10 Verfahren zur herstellung eines elektromechanischen wandlers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09005740.7 2009-04-24
EP09005740A EP2244489A1 (de) 2009-04-24 2009-04-24 Verfahren zur Herstellung eines elektromechanischen Wandlers

Publications (1)

Publication Number Publication Date
WO2010121720A1 true WO2010121720A1 (de) 2010-10-28

Family

ID=41078219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/002238 Ceased WO2010121720A1 (de) 2009-04-24 2010-04-10 Verfahren zur herstellung eines elektromechanischen wandlers

Country Status (7)

Country Link
US (1) US8779650B2 (enExample)
EP (2) EP2244489A1 (enExample)
JP (1) JP2012524986A (enExample)
KR (1) KR20120016611A (enExample)
CN (1) CN102415106B (enExample)
TW (1) TW201110434A (enExample)
WO (1) WO2010121720A1 (enExample)

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DE102012016378A1 (de) * 2012-08-13 2014-02-13 Technische Universität Dresden Dielektrischer Elastomeraktor und Verfahren zu seiner Herstellung
DE102014204015A1 (de) * 2014-03-05 2015-09-10 Tesa Se Mehrschicht-Verbund mit hoher innerer Dämpfung

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WO2009006318A1 (en) 2007-06-29 2009-01-08 Artificial Muscle, Inc. Electroactive polymer transducers for sensory feedback applications
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
EP2284919A1 (de) * 2009-08-07 2011-02-16 Bayer MaterialScience AG Verfahren zur Herstellung eines elektromechanischen Wandlers
JP2014513510A (ja) 2011-03-01 2014-05-29 バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 変形可能なポリマー装置及び変形可能なポリマーフィルムを作るための自動化された製造プロセス
US9195058B2 (en) 2011-03-22 2015-11-24 Parker-Hannifin Corporation Electroactive polymer actuator lenticular system
EP2511352A1 (de) * 2011-04-13 2012-10-17 Bayer Materialscience AG Siebdruckverfahren mit zu einem Polyurethanpolymer reagierender Drucktinte
RU2014129880A (ru) * 2011-12-21 2016-02-10 Конинклейке Филипс Н.В. Управляемый полимерный актюатор
WO2013142552A1 (en) 2012-03-21 2013-09-26 Bayer Materialscience Ag Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
US9761790B2 (en) 2012-06-18 2017-09-12 Parker-Hannifin Corporation Stretch frame for stretching process
EP2885868A4 (en) * 2012-08-16 2016-04-13 Bayer Ip Gmbh LAMINATED AND COMPLIANT DIELECTRIC ELASTOMER ACTUATORS
CN103682083A (zh) * 2012-08-31 2014-03-26 纳米新能源（唐山）有限责任公司 一种压电驻极体薄膜及其制备方法
CN103682081B (zh) * 2012-09-14 2017-07-11 纳米新能源（唐山）有限责任公司 压电驻极体薄膜及其制备方法
US9590193B2 (en) 2012-10-24 2017-03-07 Parker-Hannifin Corporation Polymer diode
US9913321B2 (en) * 2013-01-25 2018-03-06 Energyield, Llc Energy harvesting container
US9444030B2 (en) 2013-05-10 2016-09-13 Wisconsin Alumni Research Foundation Nanoporous piezoelectric polymer films for mechanical energy harvesting
JP2016020814A (ja) * 2014-07-11 2016-02-04 積水化学工業株式会社 圧電センサスイッチ
JP6870200B2 (ja) * 2014-11-13 2021-05-12 株式会社リコー 素子、及び発電装置
WO2017130591A1 (ja) * 2016-01-29 2017-08-03 株式会社リコー 感圧センサ、把持装置及びロボット
CN105788863B (zh) * 2016-02-29 2018-06-12 杭州电子科技大学 一种聚偏氟乙烯薄膜驻极体的制备方法
US10629800B2 (en) 2016-08-05 2020-04-21 Wisconsin Alumni Research Foundation Flexible compact nanogenerators based on mechanoradical-forming porous polymer films
DE102018221051A1 (de) * 2018-04-05 2019-10-10 Continental Reifen Deutschland Gmbh Vorrichtung zum Messen einer mechanischen Kraft, umfassend eine erste, zweite, dritte, vierte und fünfte Schicht sowie die Verwendungen der Vorrichtung und Reifen oder technischer Gummiartikel umfassend die Vorrichtung
KR20220016107A (ko) * 2019-05-31 2022-02-08 스토로브 가부시키가이샤 멀티레이어 구조를 갖는 정전 액추에이터
EP3869575A1 (en) * 2020-02-21 2021-08-25 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Piezoelectric device with pillar structure and method of manufacturing
JP7617695B2 (ja) * 2022-06-13 2025-01-20 順治 曽根 センサ
CN115643783B (zh) * 2022-11-07 2023-07-25 中南大学 多层定向多孔压电复合材料及制备和压电能量收集器

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DE1256822B (de) 1963-07-23 1967-12-21 Bayer Ag Verkleben von weichmacherhaltigen Kunststoffen aus Polyvinylchlorid oder dessen Mischpolymerisaten
DE1930336A1 (de) 1969-06-14 1971-01-07 Bayer Ag Verfahren zur Herstellung von Klebungen hoher Sofortfestigkeit
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012016378A1 (de) * 2012-08-13 2014-02-13 Technische Universität Dresden Dielektrischer Elastomeraktor und Verfahren zu seiner Herstellung
DE102012016378B4 (de) 2012-08-13 2020-06-18 Technische Universität Dresden Dielektrischer Elastomeraktor und Verfahren zu seiner Herstellung
DE102014204015A1 (de) * 2014-03-05 2015-09-10 Tesa Se Mehrschicht-Verbund mit hoher innerer Dämpfung

Also Published As

Publication number Publication date
US20120068572A1 (en) 2012-03-22
US8779650B2 (en) 2014-07-15
JP2012524986A (ja) 2012-10-18
TW201110434A (en) 2011-03-16
CN102415106B (zh) 2014-09-24
KR20120016611A (ko) 2012-02-24
CN102415106A (zh) 2012-04-11
EP2422530A1 (de) 2012-02-29
EP2244489A1 (de) 2010-10-27

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