WO2010116898A1 - Procédé de traitement d'objets cibles - Google Patents

Procédé de traitement d'objets cibles Download PDF

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Publication number
WO2010116898A1
WO2010116898A1 PCT/JP2010/055370 JP2010055370W WO2010116898A1 WO 2010116898 A1 WO2010116898 A1 WO 2010116898A1 JP 2010055370 W JP2010055370 W JP 2010055370W WO 2010116898 A1 WO2010116898 A1 WO 2010116898A1
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Prior art keywords
laser
workpiece
processing
resist layer
fine
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PCT/JP2010/055370
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English (en)
Japanese (ja)
Inventor
宇佐美　由久
邦浩 和田
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富士フイルム株式会社
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Publication of WO2010116898A1 publication Critical patent/WO2010116898A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Definitions

  • the present invention relates to a processing method for a workpiece that can efficiently form fine holes or grooves having a high aspect ratio (depth / width) in a workpiece having a heat mode resist layer.
  • a laser processing method has been proposed in which a workpiece made of a heat-reactive substrate (for example, a platinum oxide film) is irradiated with laser light, and an ultrafine pattern having a beam spot diameter or less is formed on the surface of the workpiece.
  • a workpiece made of a heat-reactive substrate for example, a platinum oxide film
  • an ultrafine pattern having a beam spot diameter or less is formed on the surface of the workpiece.
  • a method of manufacturing a light emitting element having a light emitter a recording material layer capable of changing a heat mode shape is formed on a light emitting surface, and the recording material layer is irradiated with condensed light, whereby the light emitter
  • a method of forming a plurality of recesses at a pitch of 0.01 to 100 times the center wavelength of light emitted from see Patent Document 2.
  • the concavo-convex portion can be formed only by resist drawing without development, and fine processing can be performed with a higher resolution than that of a conventional resist.
  • the depth of the fine holes 3 formed in the heat mode resist layer 2 on the substrate 1 is not sufficient, and the fineness of the high aspect ratio (depth / width) is small. It was extremely difficult to form holes or grooves.
  • a workpiece having a heat mode resist layer has good processability in the depth direction, a high aspect ratio (depth / width), and a high-definition fine hole or groove can be efficiently formed.
  • the processing method of the workpiece is not provided yet.
  • the present invention has good processability in the depth direction with respect to a workpiece having a heat mode resist layer, and has a high aspect ratio (depth / width), and efficiently forms high-definition fine holes or grooves. It is an object of the present invention to provide a method for processing a possible workpiece.
  • the heat mode resist layer when the heat mode resist layer is irradiated with laser light having a wavelength at which the material absorbs light (wavelength absorbed by the material), the heat mode resist layer As a result, the laser beam is absorbed, the absorbed light is converted into heat, and the temperature of the irradiated portion of the light rises.
  • the fine holes are formed by the movement or disappearance of the material that has caused such a change.
  • the width of the fine holes is unexpectedly narrowed. It has been found that workability in the depth direction is improved and fine holes with a high aspect ratio can be obtained. Regarding the reason why this knowledge arises, laser processing is performed around the bottom of the fine hole when the laser irradiation is performed in a place where the fine hole (concave portion) already exists. It can be presumed that the ejected matter such as gas, fine particles, and scattered matter generated here adheres to the side surface portion of the already existing fine hole and the fine hole becomes narrow. In the case of groove processing, it can be presumed that the effect of narrowing the groove width is obtained by the same mechanism.
  • the present invention is based on the above findings by the present inventors, and means for solving the above problems are as follows. That is, ⁇ 1> a heat mode resist layer forming step of forming a heat mode resist layer on a substrate; A method for processing a workpiece, comprising: forming a microhole or groove by irradiating the heat mode resist layer with a laser beam a plurality of times to form a microhole or groove. ⁇ 2> The method for processing a workpiece according to ⁇ 1>, wherein the number of times of laser light irradiation is 2 times or more and 1,000 times or less.
  • ⁇ 3> The method for processing a workpiece according to any one of ⁇ 1> to ⁇ 2>, wherein a linear velocity of the laser is 100 m / s or less.
  • ⁇ 4> The processing method for a workpiece according to any one of ⁇ 1> to ⁇ 3>, wherein a shortest distance between centers of adjacent fine holes or grooves is 0.01 ⁇ m or more and 1,000 ⁇ m or less.
  • ⁇ 5> If the depth of the fine holes or grooves from the outermost surface of the heat mode resist layer is X (nm) and the width of the fine holes or grooves on the outermost surface is Y (nm), the aspect ratio of the fine holes or grooves
  • ⁇ 6> The workpiece processing method according to any one of ⁇ 1> to ⁇ 5>, wherein the laser scanning is any one of r ⁇ , drum, xy, and xyz.
  • ⁇ 7> The method for processing a workpiece according to ⁇ 6>, wherein when the laser scanning is r ⁇ , the disk-shaped workpiece is scanned in the circumferential direction from the outer periphery toward the inner periphery.
  • ⁇ 8> The method for processing a workpiece according to ⁇ 6>, wherein when the laser scanning is a drum, scanning is performed from the top to the bottom along the side peripheral surface of the drum-shaped workpiece.
  • the conventional problems can be solved, and the workability in the depth direction is good for the workpiece having the heat mode resist layer, and the aspect ratio (depth / width) is high, It is possible to provide a processing method of a workpiece capable of efficiently forming high-definition fine holes or grooves.
  • FIG. 1 is a schematic view showing an example of a conventional method of processing a workpiece.
  • FIG. 2 is a schematic diagram showing an example of a method for processing a workpiece according to the present invention.
  • FIG. 3A is a diagram showing an example of a planar view of the surface of the heat mode resist layer in which fine holes are formed.
  • FIG. 3B is a diagram showing another example of a planar view of the surface of the heat mode resist layer in which fine holes are formed.
  • FIG. 3C is a cross-sectional view illustrating an example of a heat mode resist layer and a substrate in which fine holes are formed.
  • FIG. 4A is a diagram for explaining laser irradiation intervals, and shows an example not included in the present invention in which all irradiation intervals are less than 0.1 ⁇ s.
  • FIG. 4B is a diagram for explaining the laser irradiation interval, and shows an example included in the present invention in which the irradiation interval at one or more places is 0.1 ⁇ s or more.
  • FIG. 5 is a diagram illustrating a method of laser scanning a disk-shaped workpiece.
  • FIG. 6 is a diagram illustrating a method of laser scanning a drum-shaped workpiece.
  • FIG. 7A is a diagram illustrating a relationship between a light emission waveform of a laser and a shape of a fine hole.
  • FIG. 7B is a diagram showing the relationship between the laser emission waveform and the shape of the fine hole.
  • FIG. 2 is a schematic view showing the fine hole 3 after being irradiated twice with the laser beam in the processing method of the workpiece of the present invention.
  • the aspect ratio (depth / width) of the fine hole 3 is increased by multiple laser irradiations as compared to FIG.
  • the heat mode resist layer forming step is a step of forming a heat mode resist layer on a substrate.
  • the material, shape, structure, size and the like of the substrate are not particularly limited and can be appropriately selected depending on the purpose.
  • the material include metals, inorganic substances, and organic substances.
  • the shape include a flat plate shape such as a disk and a rectangle, a drum shape, a film shape, and the like.
  • the structure may be a single layer structure, a laminated structure, or the size. Can be appropriately selected depending on the application.
  • the metal is preferably a transition metal. Examples of the transition metal include various metals such as Ni, Cu, Al, Mo, Co, Cr, Ta, Pd, Pt, and Au, or alloys thereof.
  • the inorganic material include glass, silicon (Si), and quartz (SiO 2 ).
  • the resin examples include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), low-melting fluororesin, polymethyl methacrylate (PMMA), triacetate cellulose (TAC), and the like.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PC polycarbonate
  • PMMA polymethyl methacrylate
  • TAC triacetate cellulose
  • the heat mode resist layer is a layer in which light is converted into heat by irradiation of intense light, and the shape of the material can be changed by the heat to form fine holes (recesses), and includes a heat mode resist material. Formed with.
  • the heat mode resist material is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include cyanine-based, phthalocyanine-based, quinone-based, squarylium-based, azurenium-based, thiol complex-based, and merocyanine-based. .
  • methine dyes cyanine dyes, hemicyanine dyes, styryl dyes, oxonol dyes, merocyanine dyes, etc.
  • macrocyclic dyes phthalocyanine dyes, naphthalocyanine dyes, porphyrin dyes, etc.
  • azo dyes including azo metal chelate dyes
  • Arylidene dyes complex dyes, coumarin dyes, azole derivatives, triazine derivatives, 1-aminobutadiene derivatives, cinnamic acid derivatives, quinophthalone dyes, and the like.
  • methine dyes and azo dyes are particularly preferable.
  • the heat mode resist layer can appropriately select a dye or modify the structure depending on the wavelength of the laser light source.
  • the oscillation wavelength of the laser light source is around 780 nm
  • trimethine cyanine dye, pentamethine oxonol dye, azo dye, azo metal complex dye, and pyromethene complex dye is advantageous to select from trimethine cyanine dye, pentamethine oxonol dye, azo dye, azo metal complex dye, and pyromethene complex dye.
  • monomethine cyanine dye when the oscillation wavelength of the laser light source is around 405 nm, monomethine cyanine dye, monomethine oxonol dye, zero methine merocyanine dye, phthalocyanine dye, azo dye, azo metal complex dye, porphyrin dye, arylidene dye, complex dye And a coumarin dye, an azole derivative, a triazine derivative, a benzotriazole derivative, a 1-aminobutadiene derivative, and a quinophthalone dye.
  • the compounds represented by the following formulas III-1 to III-14 are preferably used as the compound of the heat mode resist layer.
  • preferred compounds in the case of being around 660 nm include compounds described in paragraphs [0024] to [0028] of JP-A-2008-252056. .
  • the present invention is not limited to these compounds.
  • JP-A-4-74690 JP-A-8-127174, JP-A-11-53758, JP-A-11-334204, JP-A-11-334205, JP-A-11-334206,
  • the dyes described in JP-A-11-334207, JP-A-2000-43423, JP-A-2000-108513, JP-A-2000-158818 and the like are also preferably used.
  • a dye is dissolved in an appropriate solvent together with a binder and the like to prepare a coating solution.
  • the coating solution can be formed by applying the coating solution on a substrate to form a coating film, and then drying.
  • the temperature of the surface on which the coating solution is applied is preferably in the range of 10 ° C to 40 ° C.
  • the lower limit is more preferably 15 ° C. or higher, still more preferably 20 ° C. or higher, and particularly preferably 23 ° C. or higher.
  • the upper limit value is more preferably 35 ° C. or less, still more preferably 30 ° C. or less, and particularly preferably 27 ° C. or less.
  • the heat mode resist layer may be a single layer or a multilayer, and in the case of a multilayer structure, it can be formed by performing the coating process a plurality of times.
  • the concentration of the dye in the coating solution is preferably 0.3% by mass or more and 30% by mass or less, more preferably 1% by mass or more and 20% by mass or less with respect to the organic solvent, It is particularly preferable to dissolve in 2,3,3-tetrafluoropropanol at a concentration of 1% by mass or more and 20% by mass or less.
  • the solvent in the coating solution is not particularly limited and may be appropriately selected depending on the intended purpose.
  • esters such as butyl acetate, ethyl lactate and cellosolve acetate; ketones such as methyl ethyl ketone, cyclohexanone and methyl isobutyl ketone; dichloromethane, Chlorinated hydrocarbons such as 1,2-dichloroethane and chloroform; Amides such as dimethylformamide; Hydrocarbons such as methylcyclohexane; Ethers such as tetrahydrofuran, ethyl ether and dioxane; Ethanol, n-propanol, isopropanol, n-butanol diacetone Alcohols such as alcohols; fluorine-based solvents such as 2,2,3,3-tetrafluoropropanol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol Gly
  • butyl acetate, ethyl lactate, cellosolve acetate, methyl ethyl ketone, isopropanol, and 2,2,3,3-tetrafluoropropanol are particularly preferable.
  • the said solvent can be used individually by 1 type in consideration of the solubility of the pigment
  • various additives such as an antioxidant, a UV absorber, a plasticizer, and a lubricant may be added according to the purpose, if necessary.
  • the coating method is not particularly limited and may be appropriately selected depending on the intended purpose. For example, spraying method, spin coating method, dip method, roll coating method, blade coating method, doctor roll method, doctor blade method, screen Printing method, etc. Among these, the spin coat method is particularly preferable because of excellent productivity and easy control of the film thickness.
  • the heat mode resist layer is preferably dissolved at a concentration of 0.3% by mass to 30% by mass with respect to the organic solvent from the viewpoint that it is advantageous for formation by a spin coating method. It is more preferable to dissolve at a concentration of not more than%.
  • thermal decomposition temperature is 150 degreeC or more and 500 degrees C or less, and, as for a pigment
  • the temperature of the coating solution is preferably 23 ° C. to 50 ° C., more preferably 24 ° C. to 40 ° C., and even more preferably 25 ° C. to 30 ° C.
  • the binder is not particularly limited and may be appropriately selected depending on the intended purpose.
  • natural organic polymers such as gelatin, cellulose derivatives, dextran, rosin, and rubber.
  • Hydrocarbon resin such as polyethylene, polypropylene, polystyrene, polyisobutylene, etc.
  • Vinyl resin such as polyvinyl chloride, polyvinylidene chloride, polyvinyl chloride / polyvinyl acetate copolymer; polymethyl acrylate, polymethyl methacrylate
  • Acrylic resins such as polyvinyl alcohol, chlorinated polyethylene, epoxy resins, butyral resins, rubber derivatives, synthetic organic polymers such as initial condensates of thermosetting resins such as phenol / formaldehyde resins, and the like.
  • the amount of the binder added is generally preferably 0.01 to 50 times (mass ratio), preferably 0.1 to A 5-fold amount (mass ratio) is more preferred.
  • the heat mode resist layer can contain various anti-fading agents in order to improve the light resistance of the heat mode resist layer.
  • a singlet oxygen quencher is generally used.
  • the singlet oxygen quencher those described in publications such as known patent specifications can be used. Specific examples thereof include JP-A Nos.
  • the use amount of the anti-fading agent such as the singlet oxygen quencher is preferably 0.1% by mass to 50% by mass, more preferably 0.5% by mass to 45% by mass with respect to the amount of the dye, and 3% by mass. % To 40% by mass is more preferable, and 5% to 25% by mass is particularly preferable.
  • the heat mode resist layer can also be formed by a film forming method such as vapor deposition, sputtering, or CVD.
  • the dye a dye having a higher light absorption rate than the other wavelengths at the wavelength of laser light used for processing a minute hole or groove to be described later is used.
  • the absorption peak wavelength of the dye is not necessarily limited to that in the visible light wavelength range, and may be in the ultraviolet range or the infrared range.
  • the thickness of the heat mode resist layer may correspond to the depth of a fine hole or groove to be described later.
  • the thickness can be appropriately set within a range of 1 nm to 10,000 nm, for example.
  • the lower limit of the thickness is preferably 10 nm or more, and more preferably 30 nm or more. If the thickness is too thin, the fine holes or grooves are formed shallow, and the optical effect may not be obtained.
  • the upper limit of the thickness is preferably 1,000 nm or less, and more preferably 500 nm or less. If the thickness is too thick, a large laser power is required, it may be difficult to form a deep hole, and the processing speed may be reduced.
  • the fine hole or groove forming step is a step of forming the fine hole or groove by irradiating the heat mode resist layer with a laser beam a plurality of times.
  • irradiating the laser beam a plurality of times means irradiating the same irradiation position a plurality of times under the same laser irradiation conditions (linear velocity, scanning method, laser power, frequency, duty ratio, etc.) Or intermittent irradiation.
  • the number of laser irradiations is preferably 2 or more and 1,000 or less, more preferably 2 or more and 100 or less, and still more preferably 2 or more and 10 or less. When the number of times of laser irradiation is less than 2, a high aspect ratio may not be obtained.
  • the number of times of laser irradiation exceeds 1,000, the number of times of laser irradiation is too large, and it takes too much processing time, As a result, the temperature of the material part may rise too much and the shape of the end of the fine hole or groove may melt and become rounded.
  • the laser irradiation is preferably performed when the irradiation interval at one or more places is 0.1 ⁇ s or more.
  • the lower limit of the laser irradiation interval is preferably 0.1 ⁇ s or more, more preferably 1 ⁇ s or more, and still more preferably 10 ⁇ s or more.
  • the upper limit of the laser irradiation interval is preferably 10 s or less, more preferably 1 s or less, and further preferably 0.1 s or less.
  • the laser irradiation interval is less than 0.1 ⁇ s, substantially one laser irradiation is performed, and a high aspect ratio may not be obtained. If it exceeds 10 s, it takes too much processing time. In some cases, the material part temperature rises too much due to processing heat, and the shape of the end of the fine hole or groove melts and becomes round.
  • the effect of the present invention can be obtained when the irradiation time interval is within a preferable range of the laser irradiation interval at least once in the laser pulse train irradiated substantially at one place.
  • the one-time laser irradiation means irradiation from when the laser intensity reaches 10% of the peak until it decreases to 10%.
  • -Types of laser light- There is no restriction
  • the laser wavelength includes infrared rays, visible rays, ultraviolet rays, X-ray lasers, etc., and it is necessary to select a wavelength at which the workpiece is absorbed.
  • An organic material that can change at a low temperature generally has absorption in the ultraviolet, visible, and infrared regions. Since the diameter at which light can be narrowed depends on the wavelength, it is preferable that the wavelength be short when performing fine processing. Among these, the visible region and the ultraviolet region are particularly preferable.
  • a wavelength of 532 nm, 355 nm, 266 nm, etc. is preferable because it generates a harmonic of 1,064 nm.
  • wavelengths such as 405 nm, 635 nm, 650 nm, 680 nm, 785 nm, 830 nm, 1.3 ⁇ m, and 1.5 ⁇ m are preferable.
  • 405 nm, 650 nm, etc. are preferable in terms of versatility. It should be noted that the wavelength shown here includes a change of about ⁇ 3% due to device variations.
  • the laser beam may be continuous oscillation or pulse oscillation.
  • continuous oscillation is preferable because the semiconductor laser can modulate light emission on / off.
  • pulse oscillation a solid laser capable of increasing the output is preferable.
  • the pulse oscillation is preferable when the light emission time is 1 nsec or less because the effect of expanding the hole due to heat conduction can be reduced.
  • the laser is basically used alone. However, the power may be increased by combining a plurality of lasers. Further, lasers having different wavelengths may be combined. In the case of a plurality of lasers, one can be used for servo such as focus and the other can be used for laser processing.
  • the processing method for a workpiece of the present invention it is preferable to irradiate a laser while scanning.
  • the laser scanning is performed in a spiral shape, and the laser irradiation is performed at the same place after returning to the point that there is no waiting time.
  • the scan may be any of r ⁇ , drum, xy, and xyz.
  • the r ⁇ is a method of scanning a disk spirally or concentrically by combining a disk scanning system and a linear scanning system.
  • the drum is a method of scanning the outer or inner surface of a cylinder spirally or concentrically by combining a cylindrical scanning system and a linear scanning system.
  • the xy is a method of scanning a plane by combining two linear scanning systems.
  • the xyz is a method of scanning three-dimensionally by combining three linear scanning systems.
  • R ⁇ is preferred for disc-shaped workpieces.
  • a drum is preferred for a drum-like or planar (film-like) work piece wound around the drum.
  • xy or xyz is preferable in terms of high-speed scanning.
  • the laser scanning is r ⁇ , as shown in FIG. 5, the ejected matter generated during processing is scanned outwardly by centrifugal force or wind as the disk-shaped workpiece is scanned from the outer periphery toward the inner periphery. Therefore, it is preferable in that it has a low possibility of affecting the processing or scanning place.
  • the laser scanning is a drum, as shown in FIG.
  • the ejected matter generated during processing is to scan from the top to the bottom of the drum-shaped workpiece (the unprocessed portion comes from above).
  • the linear velocity of the laser is preferably 100 m / s or less, more preferably 50 m / s or less, and still more preferably 10 m / s or less.
  • the lower limit of the linear velocity of the laser is preferably 0.01 m / s or more, more preferably 0.1 m / s or more, and still more preferably 1 m / s or more. If the linear velocity of the laser exceeds 100 m / s, it may be difficult to maintain the processing position accuracy, and high laser power may be required. If it is less than 0.01 m / s, it takes too much processing time. Sometimes.
  • the laser power is preferably 0.1 mW to 10 W, more preferably 0.5 mW to 1 W, still more preferably 1 mW to 0.2 W, and particularly preferably 1 mW to 0.1 W. If the laser power is too low, a sufficient processed shape may not be obtained, and if it is too high, the formed holes or grooves may be too large.
  • a pattern (shape) which can be formed by laser processing there is no restriction
  • the laser irradiation method when processing into a linear shape, it is preferable to irradiate in a continuous light emission or a pulse shape with a short pulse interval. When a uniform line is used, continuous light emission is preferable. In addition, it is preferable that the pulse width is short because a long pulse width is formed into an oval shape when the dot processing is performed.
  • the frequency of the laser is preferably 1 kHz to 1,000 MHz, more preferably 10 kHz to 500 MHz, and still more preferably 100 kHz to 100 MHz. If the frequency is too low, the processing efficiency may decrease, and if it is too high, fine holes or grooves may be connected.
  • the duty ratio of the laser is preferably 1% to 50%, more preferably 3% to 40%, still more preferably 5% to 30%.
  • the shortest distance (pitch) between the centers of adjacent fine holes or grooves is preferably 0.01 ⁇ m to 1,000 ⁇ m, more preferably 0.05 ⁇ m to 100 ⁇ m, and even more preferably 0.1 ⁇ m to 10 ⁇ m. If the pitch is too narrow, fine holes or grooves may be connected, and if it is too wide, the processing efficiency may be reduced.
  • the processing method for the fine holes or grooves is not particularly limited, and for example, a pit processing method known for a write-once optical disc or a write once optical disc can be applied. Specifically, for example, by detecting the intensity of the reflected light of the laser that changes depending on the pit size, and correcting the output of the laser so that the intensity of the reflected light is constant, a uniform pit is formed.
  • a known running OPC technique Japanese Patent No. 3096239) can be applied.
  • the fine holes or grooves formed by the laser light irradiation can be formed with a high aspect ratio.
  • the aspect ratio of the fine holes or grooves ( X / Y) is preferably 0.8 or more, more preferably 1 or more, and still more preferably 1.2 or more.
  • the upper limit is preferably 20 or less, more preferably 10 or less, and still more preferably 5 or less. If the aspect ratio is less than 0.8, the target optical effect may be small, or when etching, the aspect ratio of the surface to be processed may be small.
  • FIG. 3A is a diagram showing an example of the heat mode resist layer viewed in a plane
  • FIG. 3B is a diagram showing another example of the heat mode resist layer viewed in a plane
  • FIG. 3A the fine holes 15 are formed in a dot shape, and those in which the dots are arranged in a lattice shape can be adopted. Further, as shown in FIG. 3B, the fine hole 15 may be formed in an elongated groove shape, which is intermittently connected. Further, although not shown, it can be formed as a continuous groove shape.
  • a scattered matter removing step can be included between a plurality of laser irradiation steps.
  • the scattered matter removing step can be performed by a method in which the resist is washed with a liquid that does not dissolve and blown off with a blower, or a method of removing with a pressure sensitive adhesive sheet.
  • the processing method of the workpiece of the present invention can form a fine hole or groove with a high aspect ratio to the workpiece, the processing of the fine hole or groove is performed using a heat mode resist material. It can be applied as a processing method for micro holes or grooves in all technical fields, and is particularly suitable for micro processing fields such as optical elements, surface modification, and semiconductors.
  • Example 1 Fine hole processing- Using a silicon substrate having a diameter of 101.6 mm (4 inches), 200 mg of an oxonol organic compound represented by the following structural formula was dissolved in 1 ml of 2,2,3,3-tetrafluoro-1-propanol on the silicon substrate. The solution was applied using a spin coater at a rotation speed of 300 rpm, and then dried at a rotation speed of 1,000 rpm to form a heat mode resist layer having a thickness of 1 ⁇ m, thereby producing a disk-shaped workpiece.
  • a laser linear velocity of 5 m / s, a laser power of 10 mW, a laser frequency of 5 MHz, and a laser duty ratio of 20% are obtained with NEO1000 (manufactured by Pulstec Industrial Co., Ltd.).
  • the generated laser pulse irradiation was performed as one laser irradiation, and the laser irradiation was performed twice. Note that the radial position for laser processing was 30 mm from the center. Thereby, the workpiece of Example 1 in which the fine hole was formed on the surface was produced.
  • Example 1 About the workpiece of Example 1 in which the obtained fine hole was formed, the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 2 Fine hole processing- In Example 1, except that the number of times of laser irradiation was changed from 2 times to 3 times, a workpiece of Example 2 in which fine holes were formed on the surface was produced in the same manner as Example 1. About the workpiece of Example 2 in which the obtained fine hole was formed, the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 3 Fine hole processing- In Example 1, except that the number of times of laser irradiation was changed from 2 times to 4 times, the workpiece of Example 3 in which fine holes were formed on the surface was produced in the same manner as Example 1. About the workpiece of Example 3 in which the obtained fine hole was formed, the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 5 Fine hole processing-
  • the workpiece of Example 5 in which fine holes were formed on the surface was produced in the same manner as Example 1 except that the laser linear velocity was changed from 5 m / s to 1 m / s.
  • the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 6 Fine hole processing-
  • the workpiece of Example 6 in which fine holes were formed on the surface was produced in the same manner as Example 1 except that the laser linear velocity was changed from 5 m / s to 6 m / s.
  • the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 1 (Comparative Example 1) -Fine hole processing- In Example 1, except that the number of times of laser irradiation was changed from 2 times to 1 time, a workpiece of Comparative Example 1 having a fine hole formed on the surface was produced in the same manner as in Example 1. About the workpiece of the comparative example 1 in which the obtained fine hole was formed, using the AFM apparatus (OLS3500, Olympus Corporation), the depth and width of the fine hole were measured, and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 7 Fine hole processing- A silicon substrate having a diameter of 101.6 mm (4 inches) was used, and 30 mg of phthalocyanine organic substance [(ZnPc ( ⁇ -SO 2 Bu-sec) 4 ] was added to the 2,2,3,3-tetrafluoro- A solution dissolved in 1 mL of 1-propanol was applied at a rotation speed of 600 rpm using a spin coater, and then dried at a rotation speed of 1,000 rpm to form a 250 nm thick heat mode resist layer. Produced.
  • phthalocyanine organic substance [(ZnPc ( ⁇ -SO 2 Bu-sec) 4 ]
  • NEO1000 manufactured by Pulstec Industrial Co., Ltd.
  • NEO1000 generates laser linear velocity 5 m / s, laser power 5 mW, laser frequency 5 MHz, laser duty ratio 20% with respect to the heat mode resist layer of the workpiece.
  • the laser pulse irradiation was one laser irradiation, and the laser irradiation was performed twice.
  • the workpiece of Example 7 in which the fine holes were formed on the surface was produced.
  • the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 8 Fine hole processing-
  • the workpiece of Example 8 in which fine holes were formed on the surface was produced in the same manner as Example 7 except that the number of times of laser irradiation was changed from 2 times to 3 times.
  • the depth and width of the fine holes were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 10 (Example 10) -Fine hole processing-
  • the setting of the laser irradiation apparatus (NEO1000, manufactured by Pulstec Industrial Co., Ltd.) is changed to change the shortest distance (pitch) between the centers of adjacent fine holes from 1 ⁇ m to 3 ⁇ m.
  • the workpiece of Example 10 in which fine holes were formed on the surface was produced.
  • the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • the setting of the laser irradiation apparatus (NEO1000, manufactured by Pulstec Industrial Co., Ltd.) is changed to change the shortest distance (pitch) between the centers of adjacent fine holes from 1 ⁇ m to 5 ⁇ m.
  • a workpiece of Example 11 having a fine hole formed on the surface was produced.
  • the depth and width of the fine hole were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked.
  • the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 2 (Comparative Example 2) -Fine hole processing- In Example 7, a workpiece of Comparative Example 2 in which a fine hole was formed on the surface was produced in the same manner as Example 7 except that the number of times of laser irradiation was changed from 2 to 1. About the workpiece of the comparative example 2 in which the obtained fine hole was formed, using the AFM apparatus (OLS3500, Olympus Corporation), the depth and width of the fine hole were measured, and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine holes was measured. The results are shown in Table 1.
  • Example 12 Fine groove processing-
  • NEO1000 manufactured by Pulstec Industrial Co., Ltd.
  • the workpiece of Example 12 having a fine groove formed on the surface was produced in the same manner as in Example 1.
  • Example 12 About the workpiece of Example 12 in which the obtained fine groove was formed, the depth and width of the fine groove were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine grooves was measured. The results are shown in Table 2.
  • Example 3 (Comparative Example 3) -Fine groove processing-
  • 1 laser pulse irradiation was performed with NEO1000 (manufactured by Pulstec Industrial Co., Ltd.) under the conditions of a laser linear velocity of 5 m / s, a laser power of 4 mW, and a laser frequency of 5 MHz without intermittent laser.
  • a workpiece of Comparative Example 3 having a fine groove formed on the surface was produced in the same manner as in Example 1 except that the laser irradiation was performed once and the laser irradiation was performed once.
  • Example 12 About the workpiece of Example 12 in which the obtained fine groove was formed, the depth and width of the fine groove were measured using an AFM apparatus (OLS3500, manufactured by Olympus Corporation), and the aspect ratio (depth / width) Asked. Similarly, the shortest distance (pitch) between the centers of adjacent fine grooves was measured. The results are shown in Table 2.
  • the fine holes or grooves can be formed with a high aspect ratio (depth / width) on the workpiece, the fine holes or grooves are formed using the heat mode resist material.
  • the present invention can be applied as a microhole or groove processing method in all technical fields for processing grooves, and is particularly suitable for microprocessing fields such as optical elements, surface modification, and semiconductors.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

L'invention concerne un procédé de traitement d'objets cibles, ledit procédé comprenant : une étape de formation d'une couche de réserve en mode thermique lors de laquelle une couche de réserve en mode thermique est formée sur un substrat ; et une étape de formation de micro-trous/rainures lors de laquelle la couche de réserve en mode thermique est exposée de multiples fois à de la lumière laser pour ainsi former des micro-trous ou des rainures.
PCT/JP2010/055370 2009-04-07 2010-03-26 Procédé de traitement d'objets cibles WO2010116898A1 (fr)

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JP2009093097A JP2012135767A (ja) 2009-04-07 2009-04-07 被加工物の加工方法
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WO2010116898A1 true WO2010116898A1 (fr) 2010-10-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016171013A (ja) * 2015-03-13 2016-09-23 東洋インキＳｃホールディングス株式会社 レーザー加工用導電性ペースト、およびその利用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI654049B (zh) * 2017-05-16 2019-03-21 中國砂輪企業股份有限公司 研磨工具及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004223836A (ja) * 2003-01-22 2004-08-12 Fuji Photo Film Co Ltd パターンロールの製作方法及び装置並びに光学シートの製膜方法
JP2008252056A (ja) * 2007-03-05 2008-10-16 Fujifilm Corp 発光素子およびその製造方法ならびに光学素子およびその製造方法
JP2009503903A (ja) * 2005-08-01 2009-01-29 パナソニック株式会社 モノリシックマイクロ波集積回路用ビアホールの加工形成

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004223836A (ja) * 2003-01-22 2004-08-12 Fuji Photo Film Co Ltd パターンロールの製作方法及び装置並びに光学シートの製膜方法
JP2009503903A (ja) * 2005-08-01 2009-01-29 パナソニック株式会社 モノリシックマイクロ波集積回路用ビアホールの加工形成
JP2008252056A (ja) * 2007-03-05 2008-10-16 Fujifilm Corp 発光素子およびその製造方法ならびに光学素子およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016171013A (ja) * 2015-03-13 2016-09-23 東洋インキＳｃホールディングス株式会社 レーザー加工用導電性ペースト、およびその利用

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