WO2010100830A1 - 半導体装置、回路修正方法、設計支援装置及び設計支援プログラムが格納された記録媒体 - Google Patents
半導体装置、回路修正方法、設計支援装置及び設計支援プログラムが格納された記録媒体 Download PDFInfo
- Publication number
- WO2010100830A1 WO2010100830A1 PCT/JP2010/000794 JP2010000794W WO2010100830A1 WO 2010100830 A1 WO2010100830 A1 WO 2010100830A1 JP 2010000794 W JP2010000794 W JP 2010000794W WO 2010100830 A1 WO2010100830 A1 WO 2010100830A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- trigger
- wiring
- additional supply
- supply element
- branch
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
- G06F1/10—Distribution of clock signals, e.g. skew
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/396—Clock trees
Definitions
- the present invention relates to a semiconductor device, a circuit correction method, a design support apparatus, and a design support program, and in particular, a semiconductor device having a clock wiring for distributing a clock signal to a trigger signal driving element, a circuit correction method for a semiconductor device, a design support apparatus, and Related to design support program.
- Patent Document 1 discloses an example of a design technique for reducing the time required for the design back-up process.
- Patent Document 1 a circuit is cut and divided in advance, and the circuit is corrected in units of division. As a result, it is possible to perform the correction process only on the division unit that requires the circuit correction while maintaining the current design information (for example, layout information) for the division unit that does not need correction. That is, in Patent Document 1, the time required for the return process is reduced by minimizing the area where the re-layout is performed.
- the clock signal is broadly included in the trigger signal, and the trigger signal includes a set signal, a reset signal, a request signal in asynchronous communication, an acknowledge signal, and the like in addition to the clock signal.
- the flip-flop is broadly included in the trigger signal driving element, and the trigger signal driving element includes a latch, a memory, and the like in addition to the flip-flop. Furthermore, timing design is also performed for data signals transmitted and received between a plurality of flip-flops.
- Patent Document 2 describes a method of reducing the backward work as much as possible by dealing with the change in the parasitic capacitance of the existing clock wiring only by adjusting the clock wiring.
- One aspect of the semiconductor device includes a plurality of trigger signal driving elements that operate based on a trigger signal, a trigger wiring that distributes the trigger signal to the plurality of trigger signal driving elements, and a branch from the clock wiring.
- An additional trigger wiring provided; and an additional supply element that is supplied via the additional trigger wiring and is provided separately from the plurality of trigger signal driving elements.
- a circuit correction method for a semiconductor device is a circuit correction method for a semiconductor device, comprising: a trigger wiring that transmits a trigger signal; and a plurality of trigger signal drive elements that operate based on the trigger signal.
- An additional supply element connected to the wiring via an additional trigger wiring and not connected to any of the plurality of trigger driving elements is provided in advance, and a correction target element to be corrected is searched for among the plurality of trigger signal driving elements.
- the correction target element and the additional supply element are connected.
- One aspect of the design support apparatus is an additional trigger for connecting an additional supply element to a trigger wiring for distributing a trigger signal to a trigger signal driving element and the additional supply element and the trigger wiring in a design process of a semiconductor device.
- a design support apparatus that arranges wiring, and generates additional supply element statistical information indicating the number of additional supply elements for each constraint condition based on the number of the additional supply elements and the constraint condition of the additional supply elements
- the additional supply element condition setting unit to extract the trigger wiring information from the first netlist describing the connection information of the circuit including the plurality of trigger driving elements, and based on the number of branch stages of the extracted trigger wiring Determines the position to place the additional supply element included in the additional supply element statistical information, and outputs branch position information describing the position information of the additional supply element
- a branch position determination unit that adds a connection information of the additional supply element and the additional trigger line to the first netlist based on the branch position information, and generates a second netlist, Have
- One aspect of the design support apparatus includes a trigger signal driving element that operates based on a trigger signal included in a first netlist generated after layout completion, a trigger wiring that transmits the trigger signal, and an additional trigger wiring And an additional supply element that is not connected to the trigger signal driving element, and is located at both ends of the element addition node to be corrected from the first netlist.
- the trigger signal drive element is searched, the correction target element search unit for registering the searched trigger signal drive element as a correction target element, and the number of branch stages of the trigger wiring connected to the correction target element are analyzed and analyzed.
- a clock supply source analysis unit that outputs clock supply source analysis information indicating the number of branch stages, and the correction based on the clock supply source analysis information
- the additional supply element connected to the trigger wiring having the number of branch stages that matches or approximates the trigger wiring that supplies the trigger signal to the elephant element is searched, and the searched additional supply element is the additional supply element to be added
- a circuit correction unit that generates a second netlist in which the additional supply element determined by the addition destination determination part and the trigger signal driving element are connected to each other.
- One aspect of the design support program according to the present invention is executed by an arithmetic device, and in a design process of a semiconductor device, an additional supply element, a supply element, and a trigger wiring are added to a trigger wiring that distributes a trigger signal to a trigger signal driving element
- a design support apparatus program for arranging an additional trigger wiring for connecting the additional supply element number information indicating the number of the additional supply elements from the memory, and additional supply element constraint information indicating the constraint condition of the additional supply elements; , And an additional supply element condition setting unit for storing additional supply element statistical information indicating the number of the additional supply elements for each of the constraint conditions in the memory, and connection information of a circuit including a plurality of the trigger drive elements is described.
- the first netlist is read from the memory, and the trigger wiring information is extracted from the first netlist and extracted.
- a branch position that determines a position where the additional supply element included in the additional supply element statistical information is arranged based on the number of branch stages of the trigger wiring, and stores branch position information describing the position information of the additional supply element in the memory
- the connection information of the additional supply element and the additional trigger wiring is added to the first netlist to generate a second netlist, and the memory is stored in the memory.
- a trigger wiring correction unit for storing the second netlist.
- One aspect of the design support program according to the present invention is a trigger signal driving element that is executed by an arithmetic device and operates based on a trigger signal included in a first netlist generated after completion of layout, and transmits the trigger signal.
- a design support program for connecting an additional supply element that is connected via a trigger wiring and an additional trigger wiring and that is not connected to the trigger signal driving element reads the first netlist from a memory, and Search for the trigger signal drive element located at both ends of the element addition node to be corrected from one netlist, and store the correction target element analysis information indicating the searched trigger signal drive element in the memory
- the first netlist and the correction target element analysis information from the memory, and the correction pair Analyzes the number of branch stages of the trigger wiring connected to the element, stores the clock supply source analysis information indicating the analyzed branch stage number in the memory, and reads the clock supply source analysis information from the memory
- the semiconductor device According to the semiconductor device, the circuit correction method, the design support apparatus, and the design support program according to the present invention, it is possible to reduce the time for the return process accompanying the circuit correction.
- FIG. 1 is a block diagram of a semiconductor device according to a first embodiment
- 3 is a circuit example of an additional supply element according to the first embodiment
- 10 is another circuit example of the additional supply element according to the first embodiment
- 10 is another circuit example of the additional supply element according to the first embodiment.
- FIG. 2 is a block diagram of a semiconductor device obtained by performing circuit correction on the semiconductor device shown in FIG. 1.
- 6 is a flowchart showing a circuit design procedure of the semiconductor device according to the second embodiment
- FIG. 3 is a block diagram of a semiconductor device design support apparatus according to a second embodiment
- 10 is a flowchart showing an operation procedure of the design support apparatus according to the second exemplary embodiment
- 10 is a flowchart illustrating a circuit correction procedure of the semiconductor device according to the third embodiment
- FIG. 4 is a block diagram of a semiconductor device design support apparatus according to a third embodiment
- 10 is a flowchart illustrating an operation procedure of the design support apparatus according to the third exemplary embodiment.
- FIG. 9 is a block diagram illustrating an example of a semiconductor device that has been subjected to circuit correction by a design support apparatus according to a third embodiment
- FIG. 11 is a block diagram illustrating another example of a semiconductor device that has been subjected to circuit correction by the design support apparatus according to the third embodiment;
- FIG. 1 a block diagram of the semiconductor device 1 according to the first embodiment is shown in FIG.
- the semiconductor device 1 includes a clock generation circuit 10, a logic circuit 20, an additional supply element 30, trigger wirings CW0 to CW3, and an additional trigger wiring CWb.
- the semiconductor device 1 has a plurality of logic circuits 20.
- the clock generation circuit 10 distributes a trigger signal (for example, a clock signal) to the logic circuit 20 via trigger lines (for example, clock lines) CW0 to CW3.
- the logic circuit 20 includes a plurality of trigger signal driving elements that operate based on a trigger signal supplied via a trigger wiring.
- one of the logic circuits 20 includes flip-flop circuits FFa and FFb.
- a flip-flop circuit is used as an example of the trigger signal driving element.
- a clock signal is used as the trigger signal, and the trigger wiring is referred to as clock wiring.
- the trigger signal driving element may be a circuit element that operates based on the trigger signal, and includes a latch circuit, a memory circuit, and the like in addition to the flip-flop circuit.
- the trigger signal includes a set signal, a reset signal, a request signal in asynchronous communication, an acknowledge signal, and the like.
- a number is added to the clock wiring after the symbol CW. This number indicates the number of branch stages of the clock wiring.
- the clock wiring CW0 connected to the output terminal of the clock generation circuit 10 is used as a reference. Note that the starting point of the number of branch stages of the clock wiring can be arbitrarily set.
- ND0 to ND3 are added to the branch points of the clock wiring.
- the branch point is numbered after the symbol ND, and this number indicates the number of branch stages of the clock wiring.
- the output terminal of the clock generation circuit 10 is the start point of the branch point. Note that the start point of the number of branch points can be arbitrarily set.
- a constraint condition (for example, a skew value) is set for each of the clock wirings CW0 to CW3. That is, a constant skew value is set for the clock wiring CW1 with respect to the clock wiring CW0.
- the skew value of the clock wiring CW2 is constant with respect to the clock wiring CW0 and is set to a value different from that of the clock wiring CW1.
- the skew value of the clock wiring CW3 is constant with respect to the clock wiring CW0 and is set to a value different from that of the clock wirings CW1 and CW2.
- the additional supply element 30 is supplied with a clock signal via an additional trigger wiring (for example, an additional clock wiring), and is provided separately from a plurality of flip-flop circuits. And in circuit correction, it is connected with a plurality of flip-flop circuits.
- An example of this additional supply element 30 is shown in FIGS.
- the additional trigger wiring CWb is a wiring provided by branching from the clock wiring, and the same constraint condition (for example, skew value) as that of the branching clock wiring is set.
- the additional supply element 30 is set in advance with a constraint condition (for example, a skew value) in consideration of a later use state, and is arranged based on the constraint condition. That is, the additional supply element 30 is arranged at a place where the constraint condition of the additional supply element and the constraint condition of the clock wirings CW0 to CW3 coincide.
- the example shown in FIG. 2A uses a buffer BUF as an additional supply element.
- the buffer BUF has an input terminal connected to the clock wiring via the additional clock wiring CWb, and an output terminal is an open end when not used for circuit correction.
- the example shown in FIG. 2B uses a buffer BUF and a flip-flop circuit FF as additional supply elements.
- the buffer BUF has an input terminal connected to the clock line via the additional clock line CWb, and an output terminal connected to the clock input terminal of the flip-flop circuit FF.
- the flip-flop circuit FF has an input terminal and an output terminal connected to each other when not used for circuit correction.
- FIG. 2C uses a flip-flop circuit FF as an additional supply element. In a state where the flip-flop circuit FF is not used for circuit correction, an input terminal and an output terminal are connected to each other, and a clock input terminal is connected to a clock wiring via an additional clock wiring CWb.
- FIG. 3 shows a block diagram of the semiconductor device 1a in which the semiconductor device 1 shown in FIG. 1 is corrected by using the circuit correcting method according to this embodiment.
- the flip-flop circuit FFc included in the additional supply element 30 is connected between the flip-flop circuits FFa and FFb originally used in the logic circuit 20. Is done.
- the flip-flop circuit FFc is supplied with a clock signal via an additional clock line CWb that branches off from the clock line CW1 and a buffer BUF.
- the circuit correction of the semiconductor device is a circuit correction method for a semiconductor device having a clock wiring for transmitting a clock signal and a plurality of flip-flop circuits that operate based on the clock signal.
- the additional supply element 30 that is connected to the clock wirings CW0 to CW3 via the additional clock wiring and is not connected to any of the plurality of flip-flop circuits is provided in advance, and the correction target element (to be corrected) among the plurality of flip-flop circuits ( In the example shown in FIG. 3, the flip-flop circuits FFa and FFb) are searched and the flip-flop circuits FFa and FFb are connected to the additional supply element 30.
- the additional clock wiring and the additional supply element 30 are incorporated in advance, and the additional supply element 30 is used in the subsequent circuit correction.
- the skew values of the clock wirings CW0 to CW3 including the parasitic capacitance caused by the additional supply element 30 and the additional clock wiring CWb are set at the initial stage of design.
- the parasitic capacitance values of the clock wirings CW0 to CW3 are kept constant by using the additional supply elements. be able to.
- the skew values of the clock wirings CW0 to CW3 do not vary due to circuit correction as long as additional supply elements are used. Therefore, in the semiconductor device according to the present embodiment, even if the additional supply element 30 and the additional clock wiring CWb are used in the circuit correction process, it is not necessary to calculate the clock signal skew value (timing design) again. That is, in the semiconductor device according to the present embodiment, it is possible to reduce the time required for the return process accompanying circuit correction.
- the additional supply element 30 is a small circuit such as one or two buffer circuits or flip-flop circuits FFa, and even if the additional supply element 30 is added, the chip area is hardly increased. Absent. In the miniaturized process in recent years, there is a tendency that the demerit due to the cost and time increase due to the return process accompanying the circuit correction is larger than the demerit due to the increase in the small chip area.
- the reticle corresponding to the lower layer (circuit formation layer) of the wafer must be corrected, and in this case, all the reticles must be remanufactured.
- enormous time and cost are required to remanufacture all the reticles.
- only the reticle corresponding to the circuit wiring layer may be manufactured again. For this reason, in the semiconductor device according to the present embodiment, it is possible to reduce the cost and time of reticle manufacturing associated with circuit correction. That is, in recent miniaturized processes, the effects of shortening the design time and cost reduction according to the present invention become more prominent.
- the designer can arbitrarily arrange the additional supply element 30 and the additional clock wiring CWb.
- Embodiment 2 In the second embodiment, the design procedure of the semiconductor device 1 described in the first embodiment will be described. Therefore, a flowchart of the setting procedure of the semiconductor device 1 is shown in FIG.
- circuit design is performed (step S1).
- the circuit is designed based on the functions and specifications of the semiconductor device 1.
- a design using HDL (Hardware Description Language) such as Verilog (this design is referred to as RTL (Register Transfer Level) design) is performed.
- logic synthesis of the circuit designed in step S1 is performed to generate a first design verification netlist M1 (step S2).
- the logic synthesis process generates a first design verification netlist M1 in which a specific circuit configuration (including connection between elements) is described based on the description created by the design performed in step S1.
- step S3 the additional clock wiring CWb and the additional supply element 30 are added to the first design verification netlist M1 to generate the second design verification netlist M2 (step S3).
- step S3 the additional supply element 30 and the additional clock wiring CWb of the semiconductor device 1 are added to the circuit.
- the additional clock wiring CWb and the additional supply element 30 are added in step S3.
- the process of adding the additional clock wiring CWb and the additional supply element 30 is performed in the reticle netlist (manufacturing) of the semiconductor device 1. Any process may be performed as long as it is a stage before the generation of a net list that serves as a reference for the reticle used in the process.
- the additional supply element 30 can be added in the circuit design in step S1, or can be added to a circuit after layout processing performed later.
- Synthesis) buffer is inserted with respect to the 2nd design verification netlist M2 produced
- the CTS buffer is a buffer inserted into the clock wirings CW0 to CW3, and adjusts the skew values of the clock wirings CW0 to CW3.
- This verification is one of timing verification and verification performed on the skew value of the clock signal is particularly referred to as clock skew verification.
- step S6 if the timing verification result is not valid (NO branch of step S6), the second design verification netlist is corrected (step S7), and the verification work in steps S5 and S6 is performed again. On the other hand, if the timing verification result is valid in step S6 (YES branch in step S6), a layout netlist M3 is generated by adding the CTS buffer information to the second design verification netlist.
- a layout pattern of the semiconductor device is generated based on the layout netlist (step S8).
- step S8 the circuit layout and the wiring length and wiring width for connecting the circuit elements are determined.
- signal delay verification (back annotation) is performed in consideration of the parasitic resistance and parasitic capacitance of the wiring extracted from the layout pattern in step S8 (step S9).
- This back annotation mainly verifies whether the setup time and hold time of the flip-flop circuit etc. meet the standard. If the back annotation verification result is not valid (NO in step S10), the layout netlist is corrected (step S11), and the layout (step S8) and back annotation (step S9) are performed again. On the other hand, if the back annotation verification result is valid (YES in step S10), a reticle netlist M4 is generated based on the layout netlist. Then, the semiconductor device 1 is manufactured based on the reticle netlist.
- the additional supply element 30 and the additional clock wiring CWb are added in step S3.
- the process of step S3 is performed using the design support apparatus 100.
- a block diagram of the design support apparatus 100 is shown in FIG. Note that the design support apparatus 100 may be a computer or the like in which a design support program for executing the process of step S3 is mounted, or may be a dedicated apparatus that performs the process of step S3.
- the design support apparatus 100 may be a computer or the like in which a design support program for executing the process of step S3 is mounted, or may be a dedicated apparatus that performs the process of step S3.
- a description will be given of a design support program for executing the processing of step S3 on a computer or the like.
- the design support apparatus 100 includes a computing device (for example, CPU: Central Processing40Unit) 40, an input device 41, a display device 42, a program memory 50, and a database memory 60.
- the arithmetic device 40 performs processing according to the program based on the various programs read from the program memory 50 and the various information read from the database memory 60, and stores the information generated by the processing in the database memory 60.
- the arithmetic device 40 is connected to the program memory 50 and the database memory 60 via bus wiring.
- the input device 41 gives an operation instruction to the arithmetic device 40.
- the display device 42 displays an interface screen of a program executed in the arithmetic device 40.
- the program memory 50 includes an additional supply element 30 and an additional clock for connecting the additional supply element 30 and the clock wiring to the clock wiring for distributing the clock signal to the flip-flop circuit in the semiconductor device design process (for example, step S3).
- a design support program for arranging wiring is stored.
- the design support program includes an additional supply element condition setting unit 51, a branch position determination unit 52, and a trigger wiring correction unit 53. In the design support program, these three parts may be implemented as one program, or may be implemented as individual programs.
- the database memory 60 also includes additional supply element number information 61, additional supply element restriction information 62, additional supply element statistical information 63, branch position information 64, a first design verification netlist 65, and a second design verification.
- a netlist 66 is stored.
- the additional supply element number information 61 and the additional supply element restriction information 62 are information input by the designer via the input device 41 and the arithmetic device 40.
- the additional supply element statistical information 63 is information generated by the additional supply element condition setting unit 51.
- the branch position information 64 is information generated by the branch position determination unit 52.
- the first design verification netlist 65 is a netlist generated in step S2 of FIG. 4. In the description of the design support apparatus 100 and the design support program executed by the design support apparatus 100, the first list for design verification is the first.
- the second design verification netlist 66 is a netlist generated by the trigger wiring correction unit 53.
- the second list for design verification is a second. Called the netlist.
- the additional supply element condition setting unit 51 reads the additional supply element number information 61 indicating the number of additional supply elements from the database memory 60 and the additional supply element constraint information 62 indicating the constraint condition of the additional supply elements, and for each constraint condition.
- the additional supply element statistical information 63 indicating the number of additional supply elements is generated. This additional supply element statistical information 63 is stored in the memory.
- the branch position determination unit 52 reads a first net list (for example, the first design verification net list 65) describing connection information of a circuit including a plurality of flip-flop circuits from the database memory 60, and performs the first design. Clock wiring information is extracted from the verification netlist 65. Then, the branch position determination unit 52 determines a position where the additional supply element included in the additional supply element statistical information is arranged based on the extracted number of branch stages of the clock wiring. More specifically, the branch position determination unit 52 searches for the number of branch stages of the clock wiring satisfying the constraint included in the statistical information, and determines the position of the clock wiring corresponding to the searched branch stage number as an additional supply element and an additional trigger. Determine as wiring.
- a first net list for example, the first design verification net list 65
- Clock wiring information is extracted from the verification netlist 65.
- the branch position determination unit 52 determines a position where the additional supply element included in the additional supply element statistical information is arranged based on the extracted number of branch stages of the clock wiring. More specifically, the
- the branch position determination unit 52 stores the branch position information 64 describing the position information of the additional supply element 30 in the database memory.
- a constraint condition is set for each number of branch stages of the clock wiring. Therefore, the branch position determination unit 52 determines the position to add the additional supply element 30 based on the consistency between the constraint condition set for the clock wiring and the constraint condition set for the additional supply element 30. Details of this determination process will be described later.
- the trigger wiring correction unit 51 adds the connection information of the additional supply element 30 and the additional clock wiring CWb to the first design verification net list 65 based on the branch position information 64 read from the database memory 60, and thereby adds the second net list. (For example, the second design verification netlist 66) is generated.
- the trigger wiring correction unit 51 stores the second design verification netlist in the database memory 60.
- the additional supply element condition setting unit 51 is executed in the arithmetic device 40.
- the additional supply element condition setting unit 51 reads the additional supply element number information 61 and the additional supply element restriction information 62 and generates additional supply element statistical information 63 (step S21).
- the additional supply element statistical information 63 includes information such as 30 additional supply elements 30 having a constraint condition (for example, skew value) of 100 ps and 100 additional supply elements having a skew value of 50 ps. That is, the additional supply element statistical information 63 includes statistical information of additional supply elements having the same constraint condition.
- the design support apparatus 100 executes the branch position determination unit 52 in the arithmetic unit 40.
- the branch position determination unit 52 first reads the additional supply element statistical information 63 and the first design verification netlist 65. Then, the branch position determination unit 52 analyzes the number of branch stages of the existing clock wiring from the first design verification netlist 65 (step S22). More specifically, in the example of the present embodiment, the number of branch points ND through which the clock wiring to be calculated passes from the clock wiring CW0 is calculated based on the clock wiring CW0.
- the branch position determination unit 52 determines the distribution of additional supply elements (step S23). Specifically, based on the information included in the additional supply element statistical information 63, the additional supply element having a constraint condition that can be permitted by the constraint condition set for the clock wiring for each branch stage number is distributed to the clock wiring.
- the additional supply element having a constraint condition that can be permitted by the constraint condition set for the clock wiring for each branch stage number is distributed to the clock wiring.
- n is an integer indicating the number of branch stages of the clock wiring.
- ⁇ is a skew value set for the clock wiring, and is different for each number of stages of the clock wiring (for example, the clock skew value of the clock wiring having n stages of branching is represented by ⁇ n).
- the additional supply element 30 in which 100 ps is set as the maximum clock skew value Skew_max and 40 ps is set as the minimum clock skew value Skew_min is supplied to the clock wiring having three branch stages.
- equation (32) has the smallest number of stages and satisfies the condition represented by the equation. Therefore, the clock wiring CW2 having two branch stages is determined as the branch destination of this additional supply element.
- the branch position determining unit 52 outputs the position of the additional clock wiring CWb and the information of the additional supply element determined by the process of step S23 as the branch position information 64 (step S24).
- the trigger wiring correcting unit 53 adds the element information and connection information of the additional supply element 30 and the additional clock wiring CWb to the first design verification netlist 65 based on the branch position information 64, thereby performing the second design verification.
- a netlist 66 for use is generated (step S25).
- the design support apparatus 100 appropriately inputs a plurality of additional supply elements and clock wirings by inputting the constraint condition of the additional supply element 30 to be added for each additional supply element (restriction condition). Can be inserted).
- the design support apparatus 100 can shorten the design time as the number of additional supply elements to be added increases. That is, when a designer searches for a clock wiring to be added by himself and provides an additional supply element there, if the clock wiring to be added becomes enormous, the search takes time.
- the design support apparatus 100 according to the present embodiment by inputting the constraint condition of the additional supply element 30 to be added for each additional supply element, the clock wiring having the constraint condition satisfying the constraint condition of the additional supply element is calculated.
- Judgment can be made instantaneously, and an additional supply element can be automatically provided in the corresponding clock wiring. That is, by using the design support apparatus 100, it is possible to reduce the time required for the insertion process of the additional supply element (the time required for step S3 in FIG. 4).
- Embodiment 3 In the third embodiment, a circuit correction procedure of the semiconductor device 1 described in the first embodiment will be described. Therefore, a flowchart of the circuit correction procedure of the semiconductor device 1 is shown in FIG. As shown in FIG. 7, in the circuit correction of the semiconductor device 1, first, the reticle netlist M ⁇ b> 4 used in the manufacture of the semiconductor device 1 is read. Then, circuit correction using the additional clock wiring CWb and the additional supply element 30 is performed on the reticle netlist M4 (step S12). The corrected layout netlist M5 is generated by the circuit correction in step S12.
- step S13 to S16 layout and back annotation processing (steps S13 to S16) is performed based on the corrected layout netlist to generate a corrected reticle netlist M6.
- steps S13 to S16 correspond to steps S8 to S11 described with reference to FIG.
- the semiconductor device 1a shown in FIG. 3 is manufactured based on the corrected reticle netlist.
- step S12 circuit correction using the additional supply element 30 and the additional clock wiring CWb is performed in step S12.
- the process of step S12 is performed using the design support apparatus 200.
- a block diagram of the design support apparatus 200 is shown in FIG. Note that the design support apparatus 200 may be a computer or the like mounted with a design support program for executing the process of step S12, or may be a dedicated apparatus that performs the process of step S12.
- a design support program for executing the process of step S12 is installed on a computer or the like will be described as an example of the design support apparatus 200.
- the design support apparatus 200 includes an arithmetic device (for example, CPU: Central Processing Unit) 40, an input device 41, a display device 42, a program memory 70, and a database memory 80.
- the arithmetic device 40 performs processing according to the program based on various programs read from the program memory 70 and various information read from the database memory 80, and stores information generated by the processing in the database memory 80.
- the arithmetic device 40 is connected to the program memory 70 and the database memory 80 via bus wiring.
- the input device 41 gives an operation instruction to the arithmetic device 40.
- the display device 42 displays an interface screen of a program executed in the arithmetic device 40.
- the program memory 70 includes a flip-flop circuit that operates based on a clock signal included in a first netlist (for example, reticle netlist M4) generated after layout completion, a clock wiring that transmits the clock signal, and an additional clock.
- a design support program for connecting an additional supply element 30 that is connected via wiring and not connected to the flip-flop circuit is stored.
- the design support program includes a correction target element search unit 71, a clock supply source analysis unit 72, an addition destination determination unit 73, and a circuit correction unit 74. In the design support program, these four portions may be implemented as one program, or may be implemented as individual programs.
- the database memory 80 stores a reticle netlist 81, a corrected layout netlist 82, correction target element analysis information 83, and clock supply source analysis information 84.
- the reticle netlist 81 is generated according to the design flow described with reference to FIG.
- the corrected layout netlist is a netlist that is finally output by the design support apparatus 200, and is the basis of the semiconductor device after the circuit correction.
- the correction target element analysis information 83 is information generated by the correction target element search unit 71.
- the clock supply source analysis information 84 is information generated by the clock supply source analysis unit 72.
- the reticle net list 81 is referred to as a first net list depending on the case.
- the corrected layout netlist 82 is referred to as a second netlist according to circumstances.
- the correction target element search unit 71 reads the reticle netlist 81 from the database memory 80. Then, the correction target element search unit 71 searches for flip-flop circuits located at both ends of the addition target node to be corrected (hereinafter, this flip-flop circuit is referred to as a correction target element), and the position of the searched flip-prop circuit. Is stored in the database memory 80.
- the clock supplier analysis unit 72 reads the first netlist (for example, the reticle netlist 81) and the correction target element analysis information 83 from the database memory 80. Then, the clock source analysis unit 72 analyzes the number of branch stages of the clock wiring connected to the correction target element, and stores the clock source analysis information 84 indicating the analyzed number of branch stages in the database memory 80.
- the first netlist for example, the reticle netlist 81
- the correction target element analysis information 83 from the database memory 80. Then, the clock source analysis unit 72 analyzes the number of branch stages of the clock wiring connected to the correction target element, and stores the clock source analysis information 84 indicating the analyzed number of branch stages in the database memory 80.
- the addition destination determination unit 73 reads the clock supply source analysis information 84 from the database memory 80, and the additional supply element connected to the clock wiring having the number of branch stages that matches or approximates the clock wiring that supplies the clock signal to the correction target element And the searched additional supply element is determined as an additional supply element to be added.
- the circuit correction unit 74 generates a second netlist (for example, a corrected layout netlist) in which the additional supply element determined by the addition destination determination unit 73 is connected to the flip-flop circuit, and the second netlist is generated. Is stored in the memory.
- a second netlist for example, a corrected layout netlist
- the correction target element search unit 71 is executed in the arithmetic device 40.
- the correction target element search unit 71 reads the reticle netlist 81.
- the correction target element search unit 71 is a flip-flop circuit disposed at both ends of an element addition node for inserting an additional supply element based on the circuit information described in the reticle netlist 81 (this flip-flop circuit is used as the correction target element). Is specified) (step S31). That is, the correction target element includes at least two flip-flop circuits.
- the correction target element search unit 71 outputs correction target element analysis information 83 including information on the specified correction target element.
- the design support apparatus 200 executes the clock supply source analysis unit 72.
- the clock supply source analysis unit 72 analyzes the number of branch stages of the clock wiring that supplies the clock signal to the correction target element based on the correction target element analysis information 83 and the reticle netlist 81 (step S32).
- step S32 for example, when the correction target element includes two flip-flop circuits, the number of branch stages of the clock wiring that supplies the clock signal to one flip-flop circuit, and the clock signal to the other flip-flop circuit Analyze the number of branches of the clock wiring to be supplied.
- the clock supply source analysis unit 72 generates clock supply source analysis information 84 including information on the number of branch stages of the clock wiring that supplies the clock signal to the correction target element obtained by the analysis.
- the design support apparatus 200 executes the addition destination determination unit 73.
- the addition destination determination unit 73 first reads the clock supply source analysis information 84. Then, it is determined whether or not the number of branch stages of the clock wiring that supplies the clock signal to the plurality of flip-flop circuits included in the correction target element is the same in the plurality of flip-flop circuits (step S33). If it is determined in step S33 that the clock signal is supplied from the clock wiring having the same branch stage number to the plurality of flip-flop circuits included in the correction target element (YES branch in step S33), the correction target element The clock line to be connected and the first selected clock line are set (step S34).
- step S35 it is determined whether or not there is an additional clock wiring in the first clock wiring (step S35). If there is an additional clock wiring in the first clock wiring in step S35 (YES branch of step S35), an additional supply element connected to the additional clock wiring provided in the first selected clock wiring is added as an element. decide.
- the circuit correction unit 74 includes a second netlist (for example, corrected) including connection information between the additional supply element determined as the addition target and the existing flip-flop circuit. A layout netlist 82) is generated (step S36).
- step S33 when it is determined in step S33 that a clock signal is supplied from a clock wiring having a different number of branch stages to a plurality of flip-flop circuits included in the correction target element (NO branch in step S33), and in step S35, If there is no additional clock wiring in the one clock wiring (NO branch of step S35), the clock wiring considered to be optimal next to the first selected clock wiring selected in step S34 is searched (step S37).
- the addition destination determination unit 73 sequentially searches for a clock wiring having the number of branch stages close to the number of branch stages of the clock wiring that supplies the clock signal to the correction target element, and detects the clock wiring having the additional clock wiring. To do.
- the addition destination determination unit 73 selects the detected clock wiring as the second selected clock wiring. Then, the addition destination determination unit 73 determines the additional supply element that is closest to the correction target element among the additional supply elements connected to the second selected clock wiring as an additional supply element. That is, the addition destination determination unit 73 preferentially selects the additional supply element connected to the clock wiring having the number of branch stages close to the clock wiring that supplies the clock signal to the correction target element as the addition destination.
- the circuit correction unit 74 generates a second netlist (for example, a corrected layout netlist 82) to which the connection information between the additional supply element determined based on the determination of the addition destination determination unit 73 and the correction target element is added. (Step S38).
- FIG. 10 shows an example of a block diagram of the semiconductor device 1b in which an additional supply element has been determined through the processing of steps S33 to S36.
- the flip-flop circuits FFa and FFb included in the logic circuit 20 are supplied with the clock signal from the clock wiring CW1 having the same number of branch stages, and the additional supply element 30 is connected to the clock wiring CW1. If it is, the flip-flop circuit FFc included in the additional supply element 30 is inserted between the existing flip-flop circuits FFa and FFb.
- FIG. 11 shows an example of a block diagram of the semiconductor device 1c in which additional supply elements are determined through the processes of steps S33 to S38.
- the flip-flop circuits FFa and FFb included in the logic circuit 20 are supplied with clock signals from the clock lines CW1 and CW3 having different branch stages, respectively, and the clock lines CW1 and CW3.
- the additional supply element 30 is not connected to the clock line CW1, the clock line CW1 and the clock line CW3 are searched for different clock lines.
- the flip-flop circuit FFc included in the additional supply element 30 connected to the clock wiring CW2 is replaced with the existing flip-flop circuit FFa. , FFb.
- the design support apparatus 200 when the circuit correction using the additional supply element 30 is performed, the determination of the additional supply element after specifying the correction target element can be performed by calculation. . This eliminates the need for the designer to search for additional supply elements to be used, thereby shortening the design period.
- additional supply elements used for circuit correction are sequentially selected from those connected to a clock wiring having the number of branch stages close to the clock wiring for supplying a clock signal to the correction target element. Therefore, it is possible to reduce the possibility that the circuit operation becomes unstable compared to the additional supply element used for circuit correction.
- the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit of the present invention.
- how to use the additional supply element 30 in circuit correction can be selected by a designer.
- the designer may select from a plurality of selection candidates.
- the circuit correction methods described in the first to third embodiments can also be provided as a program that is executed by a computer.
- This program can be provided by being recorded on a recording medium, or can be provided by being transmitted via the Internet or other communication media.
- the storage medium includes, for example, a flexible disk, a hard disk, a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD, a ROM cartridge, a battery-backed RAM memory cartridge, a flash memory cartridge, and a nonvolatile RAM cartridge.
- the communication medium includes a wired communication medium such as a telephone line, a wireless communication medium such as a microwave line, and the like.
- the present invention relates to a semiconductor device, a circuit correction method, a design support apparatus, and a design support program, and in particular, a semiconductor device having a clock wiring for distributing a clock signal to a trigger signal driving element, a circuit correction method for a semiconductor device, a design support apparatus, and It can be used for design support programs.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- Computer Networks & Wireless Communication (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
以下、図面を参照して本発明の実施の形態について説明する。まず、実施の形態1にかかる半導体装置1のブロック図を図1に示す。図1に示すように半導体装置1は、クロック生成回路10、論理回路20、追加供給素子30、トリガ配線CW0~CW3及び追加トリガ配線CWbを有する。を有する。また、半導体装置1では、論理回路20を複数有する。
実施の形態2では、実施の形態1において説明した半導体装置1の設計手順について説明する。そこで、半導体装置1の設定手順のフローチャートを図3に示す。図3に示すように、半導体装置1の設計では、まず、回路設計が行われる(ステップS1)。この回路設計では、半導体装置1の機能及び仕様に基づき回路の設計が行われる。ステップS1の設計では、Velirog等のHDL(Hardware Description Language)を用いた設計(この設計をRTL(Register Transfer Level)設計と称す)が行われる。続いて、ステップS1で設計した回路の論理合成を行い第1の設計検証用ネットリストM1を生成する(ステップS2)。論理合成処理は、ステップS1で行った設計により作成された記述に基づき具体的な回路構成(素子間の接続を含む)を記述した第1の設計検証用ネットリストM1を生成する。
δ=(Skew_max-Skew_min) ・・・(1)
また、式(2)において係数θを求める。なお、式(2)においてBRCHは、クロック配線の分岐段数のうち最も大きな値(つまり、クロック配線の総分岐段数)である。
θ=δ/BRCH ・・・(2)
Skew_min≦λ1≦Skew_min+θ ・・・(31)
Skew_min≦λ2≦Skew_min+2θ ・・・(32)
Skew_min≦λ3≦Skew_min+3θ ・・・(33)
・・・・・
Skew_min≦λn≦Skew_min+nθ ・・・(3n)
実施の形態3では、実施の形態1において説明した半導体装置1の回路修正手順について説明する。そこで、半導体装置1の回路修正手順のフローチャートを図7に示す。図7に示すように、半導体装置1の回路修正では、まず、半導体装置1の製造において用いられたレチクル用ネットリストM4が読み込まれる。そして、レチクル用ネットリストM4に対して追加クロック配線CWb及び追加供給素子30を用いた回路修正が行われる(ステップS12)。ステップS12の回路修正により修正済みレイアウト用ネットリストM5が生成される。
10 クロック生成回路
20 論理回路
30 追加供給素子
40 演算装置
41 入力装置
42 表示装置
50 プログラムメモリ
51 追加供給素子条件設定部
51 追加供給素子条件設定部
52 分岐位置決定部
53 トリガ配線修正部
60 データベースメモリ
61 追加供給素子個数情報
62 追加供給素子制約情報
63 追加供給素子統計情報
64 分岐位置情報
65 第1の設計検証用ネットリスト
66 第2の設計検証用ネットリスト
70 プログラムメモリ
71 修正対象素子検索部
72 クロック供給元解析部
73 追加先決定部
74 回路修正部
80 データベースメモリ
81 レチクル用ネットリスト
82 修正済みレイアウト用ネットリスト
83 修正対象素子解析情報
84 クロック供給元解析情報
100 設計支援装置
200 設計支援装置
BUF バッファ
CW0~CW3 クロック配線
CWb 追加クロック配線
FF、FFa~FFc フリップフロップ回路
Claims (24)
- トリガ信号に同期して動作する複数のトリガ信号駆動素子と、
前記トリガ信号を前記複数のトリガ信号駆動素子に分配するトリガ配線と、
前記トリガ配線から分岐して設けられる追加トリガ配線と、
前記追加トリガ配線を介して前記トリガ信号が供給され、前記複数のトリガ信号駆動素子から分離して設けられる追加供給素子と、
を有する半導体装置。 - 前記追加供給素子は、出力端子が他の素子に接続されないバッファ回路である請求項1に記載の半導体装置。
- 前記追加供給素子は、出力端子と入力端子とがループ接続され、トリガ信号入力端子に前記追加クロック配線を介して前記クロック信号が入力されるフリップフロップ回路である請求項1に記載の半導体装置。
- 前記追加供給素子は、出力端子と入力端子とがループ接続されるフリップフロップ回路と、前記追加クロック配線を介して入力される前記クロック信号を前記フリップフロップ回路のトリガ信号入力端子に供給するバッファ回路と、を有する請求項1に記載の半導体装置。
- トリガ信号を伝達するトリガ配線と、前記トリガ信号に基づき動作する複数のトリガ信号駆動素子と、を有する半導体装置の回路修正方法であって、
前記トリガ配線に追加トリガ配線を介して接続され、かつ、前記複数のトリガ駆動素子のいずれとも接続されない追加供給素子を予め設け、
前記複数のトリガ信号駆動素子のうち修正対象とする修正対象素子を検索し、
前記修正対象素子と前記追加供給素子とを接続する
回路修正方法。 - 前記追加供給素子は、予め設定された制約条件に応じて前記トリガ配線のいずれの位置に接続されるか決定される請求項5に記載の回路修正方法。
- 前記トリガ配線は、複数の分岐配線を有し、前記分岐配線毎に制約条件が設定される請求項5又は6に記載の回路修正方法。
- 前記制約条件は、トリガ信号のスキュー値である請求項5乃至7のいずれか1項に記載の回路修正方法。
- この設計支援装置は、
半導体装置の設計工程において、トリガ信号駆動素子にトリガ信号を分配するトリガ配線に追加供給素子及び前記追加供給素子と前記トリガ配線とを接続する追加トリガ配線を配置する、
ここで、前記設計支援装置は、
前記追加供給素子の個数と、前記追加供給素子の制約条件と、に基づき前記制約条件毎の前記追加供給素子の個数を示す追加供給素子統計情報を生成する追加供給素子条件設定手段と、
複数の前記トリガ駆動素子を含む回路の接続情報を記述した第1のネットリストから前記トリガ配線の情報を抽出し、抽出した前記トリガ配線の分岐段数に基づき前記追加供給素子統計情報に含まれる前記追加供給素子を配置する位置を決定し、前記追加供給素子の位置情報を記述した分岐位置情報を出力する分岐位置決定手段と、
前記分岐位置情報に基づき前記第1のネットリストに前記追加供給素子及び前記追加トリガ配線の接続情報を追加して第2のネットリストを生成するトリガ配線修正手段と、を有する。 - 前記分岐位置決定手段は、前記統計情報に含まれる前記制約条件を満たす前記トリガ配線の前記分岐段数を検索し、検索された前記分岐段数に該当する前記トリガ配線の位置を前記追加供給素子及び前記追加トリガ配線として決定する請求項9に記載の設計支援装置。
- 前記トリガ配線は、複数の分岐配線を有し、前記分岐配線毎に制約条件が設定される請求項9又は10に記載の設計支援装置。
- 前記制約条件は、トリガ信号のスキュー値である請求項9乃至11のいずれか1項に記載の設計支援装置。
- この設計支援装置は、レイアウト完了後に生成される第1のネットリストに含まれるトリガ信号に基づき動作するトリガ信号駆動素子と、前記トリガ信号を伝達するトリガ配線と追加トリガ配線を介して接続され、かつ、前記トリガ信号駆動素子と接続されない追加供給素子と、を接続する、
ここで、前記設計支援装置は、
前記第1のネットリストから修正対象とする素子追加ノードの両端に位置する前記トリガ信号駆動素子を検索し、検索した前記トリガ信号駆動素子を修正対象素子として登録する修正対象素子検索手段と、
前記修正対象素子に接続される前記トリガ配線の分岐段数を解析し、解析した分岐段数を示すクロック供給元解析情報を出力するクロック供給元解析手段と、
前記クロック供給元解析情報に基づき前記修正対象素子に前記トリガ信号を供給する前記トリガ配線と一致する又は近似する前記分岐段数を有するトリガ配線に接続された前記追加供給素子を検索し、検索した前記追加供給素子を追加対象の追加供給素子として決定する追加先決定手段と、
前記追加先決定手段において決定された前記追加供給素子と前記トリガ信号駆動素子とを接続した第2のネットリストを生成する回路修正手段と、を有する。 - 前記追加先決定手段は、前記修正対象素子に前記トリガ信号を供給する前記トリガ配線に近い前記分岐段数を有するトリガ配線に接続された前記追加供給素子を優先的に追加先として選択する請求項13に記載の設計支援装置。
- 前記トリガ配線は、複数の分岐配線を有し、前記分岐配線毎に制約条件が設定される請求項13又は14に記載の設計支援装置。
- 前記制約条件は、トリガ信号のスキュー値である請求項13乃至15のいずれか1項に記載の設計支援装置。
- この記録媒体は、演算装置で実行され、半導体装置の設計工程において、トリガ信号駆動素子にトリガ信号を分配するトリガ配線に追加供給素子及び前記追加供給素子と前記トリガ配線とを接続する追加トリガ配線を配置する設計支援プログラムが格納されている、
ここで、前記設計支援プログラムは、
メモリから前記追加供給素子の個数を示す追加供給素子個数情報と、前記追加供給素子の制約条件を示す追加供給素子制約情報と、を読み出して前記制約条件毎の前記追加供給素子の個数を示す追加供給素子統計情報を前記メモリに格納する追加供給素子条件設定手段と、
複数の前記トリガ駆動素子を含む回路の接続情報を記述した第1のネットリストを前記メモリから読み出して前記第1のネットリストから前記トリガ配線の情報を抽出し、抽出した前記トリガ配線の分岐段数に基づき前記追加供給素子統計情報に含まれる前記追加供給素子を配置する位置を決定し、前記追加供給素子の位置情報を記述した分岐位置情報を前記メモリに格納する分岐位置決定手段と、
前記メモリから読み出した前記分岐位置情報に基づき前記第1のネットリストに前記追加供給素子及び前記追加トリガ配線の接続情報を追加して第2のネットリストを生成し、前記メモリに第2のネットリストを格納するトリガ配線修正手段と、を有する。 - 前記分岐位置決定手段は、前記統計情報に含まれる前記制約条件を満たす前記トリガ配線の前記分岐段数を検索し、検索された前記分岐段数に該当する前記トリガ配線の位置を前記追加供給素子及び前記追加トリガ配線として決定する請求項17に記載の設計支援プログラムが格納された記録媒体。
- 前記トリガ配線は、複数の分岐配線を有し、前記分岐配線毎に制約条件が設定される請求項17又は18に記載の設計支援プログラムが格納された記録媒体。
- 前記制約条件は、トリガ信号のスキュー値である請求項17乃至19のいずれか1項に記載の設計支援プログラムが格納された記録媒体。
- この記録媒体は、設計支援プログラム演算装置で実行され、レイアウト完了後に生成される第1のネットリストに含まれるトリガ信号に基づき動作するトリガ信号駆動素子と、前記トリガ信号を伝達するトリガ配線と追加トリガ配線を介して接続され、かつ、前記トリガ信号駆動素子と接続されない追加供給素子と、を接続する設計支援プログラムが格納されている、
ここで、前記設計支援プログラムは、
メモリから前記第1のネットリストを読み出し、前記第1のネットリストから修正対象とする素子追加ノードの両端に位置する前記トリガ信号駆動素子を検索し、検索した前記トリガ信号駆動素子を示す修正対象素子解析情報を前記メモリに格納する修正対象素子検索手段と、
前記メモリから前記第1のネットリスト及び前記修正対象素子解析情報を読み出し、前記修正対象素子に接続される前記トリガ配線の分岐段数を解析し、解析した分岐段数を示すクロック供給元解析情報を前記メモリに格納するクロック供給元解析手段と、
前記メモリから前記クロック供給元解析情報を読み出し、前記修正対象素子に前記トリガ信号を供給する前記トリガ配線と一致する又は近似する前記分岐段数を有するトリガ配線に接続された前記追加供給素子を検索し、検索した前記追加供給素子を追加対象の追加供給素子として決定する追加先決定手段と、
前記追加先決定手段が決定した前記追加供給素子と前記トリガ信号駆動素子とを接続した第2のネットリストを生成し、前記第2のネットリストを前記メモリに格納する回路修正手段と、を有する。 - 前記追加先決定手段は、前記修正対象素子に前記トリガ信号を供給する前記トリガ配線に近い前記分岐段数を有するトリガ配線に接続された前記追加供給素子を優先的に追加先として選択する請求項21に記載の設計支援プログラムが格納された記録媒体。
- 前記トリガ配線は、複数の分岐配線を有し、前記分岐配線毎に制約条件が設定される請求項21又は22に記載の設計支援プログラムが格納された記録媒体。
- 前記制約条件は、トリガ信号のスキュー値である請求項21乃至23のいずれか1項に記載の設計支援プログラムが格納された記録媒体。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/203,197 US20120013373A1 (en) | 2009-03-05 | 2010-02-09 | Semiconductor device, circuit correction method, design support device, and recording medium storing design support program |
JP2011502611A JPWO2010100830A1 (ja) | 2009-03-05 | 2010-02-09 | 半導体装置、回路修正方法、設計支援装置及び設計支援プログラム |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-051880 | 2009-03-05 | ||
JP2009051880 | 2009-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010100830A1 true WO2010100830A1 (ja) | 2010-09-10 |
Family
ID=42709403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/000794 WO2010100830A1 (ja) | 2009-03-05 | 2010-02-09 | 半導体装置、回路修正方法、設計支援装置及び設計支援プログラムが格納された記録媒体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120013373A1 (ja) |
JP (1) | JPWO2010100830A1 (ja) |
WO (1) | WO2010100830A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10684642B2 (en) * | 2018-03-20 | 2020-06-16 | International Business Machines Corporation | Adaptive clock mesh wiring |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131747A (ja) * | 1997-07-10 | 1999-02-02 | Toshiba Corp | 半導体集積回路のクロック設計装置及び半導体集積回路の設計方法ならびに半導体集積回路のクロック供給回路網 |
JP2001308186A (ja) * | 2000-04-24 | 2001-11-02 | Nec Microsystems Ltd | フリップフロップ追加修正が可能なレイアウト方法およびレイアウトプログラムを記録した記録媒体 |
JP2002329784A (ja) * | 2001-05-07 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 半導体回路 |
JP2005116793A (ja) * | 2003-10-08 | 2005-04-28 | Toshiba Corp | 半導体集積回路及びそのクロック配線方法 |
JP2006128635A (ja) * | 2004-09-30 | 2006-05-18 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP2006518095A (ja) * | 2002-10-25 | 2006-08-03 | アトメル・コーポレイション | 製造された集積回路の設計ミスを修正するための予備のセル構造 |
JP2007311485A (ja) * | 2006-05-17 | 2007-11-29 | Matsushita Electric Ind Co Ltd | 標準セル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001022816A (ja) * | 1999-07-12 | 2001-01-26 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置のレイアウト方法 |
US6910195B2 (en) * | 2003-02-05 | 2005-06-21 | Intel Corporation | Flip-flop insertion in a circuit design |
US7363606B1 (en) * | 2005-08-23 | 2008-04-22 | Sun Microsystems, Inc. | Flip-flop insertion method for global interconnect pipelining |
US7546568B2 (en) * | 2005-12-19 | 2009-06-09 | Lsi Corporation | Automation of tie cell insertion, optimization and replacement by scan flip-flops to increase fault coverage |
US8164345B2 (en) * | 2008-05-16 | 2012-04-24 | Rutgers, The State University Of New Jersey | Spectral and information theoretic method of test point, partial-scan, and full-scan flip-flop insertion to improve integrated circuit testability |
-
2010
- 2010-02-09 US US13/203,197 patent/US20120013373A1/en not_active Abandoned
- 2010-02-09 JP JP2011502611A patent/JPWO2010100830A1/ja active Pending
- 2010-02-09 WO PCT/JP2010/000794 patent/WO2010100830A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131747A (ja) * | 1997-07-10 | 1999-02-02 | Toshiba Corp | 半導体集積回路のクロック設計装置及び半導体集積回路の設計方法ならびに半導体集積回路のクロック供給回路網 |
JP2001308186A (ja) * | 2000-04-24 | 2001-11-02 | Nec Microsystems Ltd | フリップフロップ追加修正が可能なレイアウト方法およびレイアウトプログラムを記録した記録媒体 |
JP2002329784A (ja) * | 2001-05-07 | 2002-11-15 | Matsushita Electric Ind Co Ltd | 半導体回路 |
JP2006518095A (ja) * | 2002-10-25 | 2006-08-03 | アトメル・コーポレイション | 製造された集積回路の設計ミスを修正するための予備のセル構造 |
JP2005116793A (ja) * | 2003-10-08 | 2005-04-28 | Toshiba Corp | 半導体集積回路及びそのクロック配線方法 |
JP2006128635A (ja) * | 2004-09-30 | 2006-05-18 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP2007311485A (ja) * | 2006-05-17 | 2007-11-29 | Matsushita Electric Ind Co Ltd | 標準セル |
Also Published As
Publication number | Publication date |
---|---|
US20120013373A1 (en) | 2012-01-19 |
JPWO2010100830A1 (ja) | 2012-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7809971B2 (en) | Clock distribution circuit, semiconductor integrated circuit and method of designing clock distribution circuit | |
JP2010146047A (ja) | バッファ回路挿入方法、バッファ回路挿入装置及びバッファ回路挿入プログラム | |
US8255851B1 (en) | Method and system for timing design | |
US6763513B1 (en) | Clock tree synthesizer for balancing reconvergent and crossover clock trees | |
JP4918934B2 (ja) | 半導体集積回路の遅延解析装置及び遅延解析方法並びにそのプログラム | |
JP2003271689A (ja) | 半導体集積回路の設計方法および設計プログラム | |
JP5040758B2 (ja) | シミュレーション装置、シミュレーション方法及びプログラム | |
JP5444985B2 (ja) | 情報処理装置 | |
US8510693B2 (en) | Changing abstraction level of portion of circuit design during verification | |
JP4736822B2 (ja) | 半導体集積回路の設計支援装置、設計支援方法および設計支援プログラム | |
WO2010100830A1 (ja) | 半導体装置、回路修正方法、設計支援装置及び設計支援プログラムが格納された記録媒体 | |
JP2010073136A (ja) | ホールドタイムエラーの収束方法、収束装置、及び収束プログラム | |
JP4017583B2 (ja) | 半導体集積回路の設計データの回路表示方法 | |
JP4831375B2 (ja) | 検証装置、検証方法、及びプログラム | |
US8060845B2 (en) | Minimizing impact of design changes for integrated circuit designs | |
JP2005136286A (ja) | 半導体集積回路の設計方法、及びその装置 | |
JP2006268165A (ja) | 集積回路のタイミング解析装置、集積回路のタイミング最適化装置、集積回路のタイミング解析方法、集積回路のタイミング最適化方法、集積回路基板の製造方法、制御プログラムおよび可読記録媒体 | |
JP2012150631A (ja) | 半導体集積回路の設計方法および設計装置 | |
JP3116915B2 (ja) | クロックネットのレイアウト設計変更方式 | |
JP2008152329A (ja) | 回路解析方法、及び回路解析プログラム、回路シミュレーション装置 | |
JP2001308186A (ja) | フリップフロップ追加修正が可能なレイアウト方法およびレイアウトプログラムを記録した記録媒体 | |
JP2008226069A (ja) | 論理回路、半導体設計支援装置および半導体設計支援方法 | |
JP5515757B2 (ja) | スキャンフリップフロップ追加システム及びスキャンフリップフロップ追加方法 | |
JP2006085595A (ja) | クロック合成方法、半導体装置及びプログラム | |
JP2005215934A (ja) | Lsi設計システム及びlsi設計プログラム及びlsi設計装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10748434 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011502611 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13203197 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10748434 Country of ref document: EP Kind code of ref document: A1 |