WO2010095332A1 - レンズユニット、位置合わせ方法、撮像装置及び撮像装置の製造方法 - Google Patents
レンズユニット、位置合わせ方法、撮像装置及び撮像装置の製造方法 Download PDFInfo
- Publication number
- WO2010095332A1 WO2010095332A1 PCT/JP2009/070747 JP2009070747W WO2010095332A1 WO 2010095332 A1 WO2010095332 A1 WO 2010095332A1 JP 2009070747 W JP2009070747 W JP 2009070747W WO 2010095332 A1 WO2010095332 A1 WO 2010095332A1
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- WIPO (PCT)
- Prior art keywords
- lens
- lens unit
- wafer
- unit
- light receiving
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 230000003287 optical effect Effects 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011521 glass Substances 0.000 claims abstract description 44
- 125000006850 spacer group Chemical group 0.000 claims description 53
- 238000000465 moulding Methods 0.000 claims description 51
- 238000003384 imaging method Methods 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 3
- 239000006059 cover glass Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 230000004304 visual acuity Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Definitions
- the present invention relates to a lens unit, a method of aligning a lens unit and a sensor, an imaging device using the same, and a manufacturing method of the imaging device.
- such a wafer lens is obtained by stacking and bonding a plurality of wafer lens arrays, cutting them into individual pieces, and attaching them to the sensor to make it small and high inclusive of sensors. Attention is also paid to the fact that imaging units with resolving power can be mass-produced.
- alignment of such a wafer lens is a big problem. Especially when stacking multiple wafer lens arrays, the accuracy of optical axis alignment of micro lenses formed on each wafer lens and the accuracy of aligning wafer lens units that have already been stacked, bonded, and cut with sensors Since the lens itself is very small, high alignment accuracy on the order of several ⁇ m is required.
- the aperture mechanism of the lens holder package that covers the exterior of the lens unit as an exterior member is also covered by the aperture mechanism, or the aperture mechanism of another member, and the optical axis of the light receiving sensor of the sensor unit is viewed from above the object side of the lens unit. There is a problem that it is difficult to align the desired optical axis.
- optical axis alignment a technique for optical axis alignment of a compound lens in which a resin lens is formed on a base lens as in Patent Document 1 is known.
- a glass member optical lens
- axial misalignment between the optical lens and the resin member is performed. It is intended to prevent and suppress transmission eccentricity based on axial deviation. (See paragraphs 0023, 0076, etc.).
- the lens of this Patent Document 1 always starts at the point where the optical axis of the object side and the subject side of a single lens to be formed is aligned, and the high accuracy of the sensor and the lens, which is a problem particularly with wafer lenses. No alignment is disclosed. In particular, a general wafer lens is separated into pieces by cutting (dicing). Therefore, when such a cut lens is aligned with the optical axis of the sensor, the optical axes may be displaced due to the accuracy of dicing. However, since the problem is not presented at all, the technique of Patent Document 1 cannot be applied to the alignment between the wafer lens and the sensor.
- the wafer lens when used as one part of an electronic device such as a digital camera, the wafer lens is used in combination with a light receiving sensor that receives transmitted light. Even if they match, it is difficult to form a desired image if the optical axis is deviated from the light receiving sensor. Therefore, when manufacturing a wafer lens for electronic equipment, alignment of the optical axis of the wafer lens and the light receiving sensor is also an important issue.
- a main object of the present invention is to provide a lens unit capable of matching the optical axes of a wafer lens and a light receiving sensor, a method of aligning the lens unit and the sensor, an imaging device, and a manufacturing method of the imaging device. It is in.
- a lens unit in which a molded part made of resin is formed on a glass substrate and a plurality of wafer lenses each having a lens part formed thereon are laminated, A lens unit is provided in which the resin-molded portion around the first lens portion formed on the most object side forms a protruding portion that protrudes more on the object side than the first lens portion.
- a lens unit in which a resin molded part is formed on a glass substrate and a plurality of wafer lenses each having a lens part formed thereon are laminated,
- the lens unit in order from the object side, has a convex surface facing the object side, a first lens part formed in a part of the resin molded part, and a glass substrate, and a concave surface facing the image side.
- the convex surface is directed to the object side, the first lens part formed on a part of the resin molding part, and the concave surface facing the image side formed through the glass substrate, the resin molding A first wafer lens having a second lens part formed on a part of the part; A third lens part formed on a part of the resin molding part bonded to the resin molding part on which the second lens part of the first wafer lens is formed, and having a concave surface facing the object side; and glass A second wafer lens having a fourth lens part formed on a part of a resin-made molding part, formed through a substrate; A lens unit having An exterior member that covers the lens unit from the outside and has an opening formed to allow light to enter the first lens unit; A sensor unit in which a light receiving sensor arranged at a predetermined interval from the second wafer lens is arranged on one surface of a substrate, The resin-molded portion around the first lens portion is formed with an annular projecting portion that protrudes closer to the object
- the optical axis of a lens unit in which a plurality of wafer lenses each having a lens part formed on a glass substrate and a lens part formed on the glass substrate is used as a predetermined light receiving sensor for receiving the transmitted light of each wafer lens.
- a positioning jig is brought into contact with the inclined portion formed on the outer periphery of the lens portion, which is a molding portion arranged on the outermost side of the plurality of wafer lenses.
- an alignment method characterized by comprising:
- a sensor having a lens unit in which a plurality of wafer lenses each having a lens part formed thereon are formed on a glass substrate and a light receiving sensor that receives incident light transmitted through the lens part.
- a method of manufacturing an imaging device including a unit, A first wafer lens array comprising a plurality of resin lens portions on the first glass substrate, and an inclined portion projecting obliquely outward from each lens portion, and on the second glass substrate A second wafer lens array provided with a plurality of resin lens portions is prepared, and the first wafer lens array is laminated with the second wafer lens array so that the inclined portion is exposed to the outside.
- the lens unit is arranged without the exterior member with the lens unit facing down the most object side, with the configuration in which the periphery of the lens unit closest to the object side protrudes from the lens unit.
- the optical axis can be aligned through the light receiving sensor of the unit and the lens on the image side.
- the protruding portion is provided around the lens portion closest to the object side without being subjected to the interference of the exterior member, the optical axis of the lens unit from the object side to the light receiving sensor is accurately positioned at a predetermined position. It is possible to align.
- an inclined part for abutting a positioning jig against a fixed molding part of the wafer lens is formed, and the lens unit can be positioned while the jig is in contact with the inclined part. Therefore, the optical axis of the wafer lens can be accurately matched with a predetermined position of the light receiving sensor, for example, the optical axis of the light receiving sensor.
- FIG. 1 is a plan view of an image pickup apparatus according to a first embodiment, illustrating a state where a package is removed. 1 is a perspective view illustrating a schematic configuration of a package according to Example 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an image pickup apparatus according to a first embodiment, illustrating a state where a package is mounted.
- FIG. 1 is a drawing for schematically explaining one step of an optical axis alignment method according to Example 1;
- FIG. 6 is a diagram for explaining a subsequent process of FIG. 5.
- 3 is a cross-sectional view for explaining a schematic configuration of a molded part of the wafer lens according to Example 1.
- FIG. It is sectional drawing which shows the modification of FIG. (A) It is sectional drawing which shows schematic structure of the imaging device concerning preferable Example 2 of this invention, (b) It is a schematic top view of the sensor unit in the said imaging device.
- 6 is a plan view illustrating a schematic configuration of a lens unit according to Embodiment 2.
- FIG. FIG. 6 is a bottom view illustrating a schematic configuration of a lens unit according to Example 2.
- FIG. 10 is a diagram for schematically explaining steps of an optical axis alignment method according to Example 2; 6 is a plan view showing a schematic configuration of a jig used in Example 2.
- FIG. 10 is a diagram for schematically explaining steps of an optical axis alignment method according to Example 2; It is drawing for demonstrating the process of FIG. It is drawing for demonstrating the process of FIG.
- the imaging apparatus 1 is mainly composed of a lens unit 3, a sensor unit 5, and a spacer 7.
- the lens unit 3 and the sensor unit 5 are composed of the lens unit 3 and the sensor unit 5. It has a configuration of being interposed by a spacer 7.
- the lens unit 3 includes wafer lenses 10 and 20 and a cover package 30, and the wafer lenses 10 and 20 are covered with the cover package 30 in a state where the wafer lens 10 is laminated and bonded onto the wafer lens 20. .
- the wafer lens 10 has a glass substrate 12 having a flat plate shape.
- a molding part 14 is formed on the upper part of the glass substrate 12, and a molding part 16 is formed on the lower part of the glass substrate 12.
- a convex lens portion (hereinafter also referred to as a convex lens portion) 14a having a convex shape on the object side is formed in the approximate center of the molding portion 14, and the molding portion 14 is directed upward from the convex lens portion 14a toward the outer peripheral portion.
- Inclined portion 14b is formed.
- a concave lens portion (hereinafter also referred to as a concave lens portion) 16a having a concave shape on the image side is formed at a substantially center of the molded portion 16, and the peripheral portion 16b of the concave lens portion 16a is substantially flat in the molded portion 16. It has become.
- the wafer lens 20 also has a flat glass substrate 22, and formed portions 24 and 26 are formed on the upper and lower portions of the glass substrate 22, respectively.
- a concave lens portion (hereinafter also referred to as a concave lens portion) 24a having a concave shape on the object side is formed at the approximate center of the molding portion 24.
- the peripheral portion 24b of the concave lens portion 24a is substantially flat. It has become.
- a convex lens portion (hereinafter also referred to as a convex lens portion) 26a having a convex shape on the image side is formed at a substantially center of the molding portion 26.
- a peripheral portion 26b of the convex lens portion 26a is substantially flat. It has become.
- the molding parts 14, 16, 24, 26 are light transmissive at the part where the photocurable resin is molded, and in particular, the convex lens part in the molding parts 14, 16, 24, 26. 14a, the concave lens portion 16a, the concave lens portion 24a, and the convex lens portion 26a are lens effective portions that exhibit a lens function (optical function).
- the wafer lenses 10 and 20 have a configuration in which the flat surface of the peripheral portion 16b, which is a molded portion having the concave lens portion 16a, and the flat surface of the peripheral portion 24b, which is the molded portion having the concave lens portion 24a, are bonded with an adhesive. It has become.
- the lens unit is constituted by two wafer lenses 10 and 20, but it goes without saying that the present invention may include another wafer lens.
- FIG. 1A An example of an imaging apparatus according to a modification of the first embodiment is shown in FIG.
- the components common to those in FIG. 1A are denoted by the same reference numerals as those in FIG.
- the first of the different parts from the imaging device of FIG. 1A is the diaphragm member 17 for limiting the light beam incident on the object side surface and the image side surface of the glass substrate 12 in FIG. 18, similarly, a diaphragm member 19 is formed on the image side surface of the glass substrate 22.
- the diaphragm members 17, 18, and 19 are formed on the substrates 12 and 22 with black photoresist layers, respectively.
- a resin-made lens having a lens portion formed on a glass substrate is used. Since the diaphragm member is provided integrally with the glass substrate between the molding surface and the molding surface, the entire imaging apparatus can be thinned.
- the second of the different parts is different from the shape of the opening on the object side of the cover package 30 as an exterior member that covers the lens unit 3 from the outside.
- an annular protruding portion around the object side lens portion of the wafer lens 10 when viewed from the object side in the optical axis that is, a lens once from the lens portion side to the object side.
- the resin-made molded part is formed so that the top part protrudes higher than the part and further the height is lowered on the outside.
- 1 (b) is the same as FIG. 1 (a) in that it has an inclined portion from the lens portion side to the topmost portion. However, an inclined shape is formed such that the diameter expands toward the image side even further outside. A protrusion is formed.
- the lens unit 3 formed in this way When the lens unit 3 formed in this way is inserted into the cover package 30 from below on the open side as shown in FIG. 1B, the lens unit 3 on the most object side of the cover package 30 and the lens unit 3.
- the non-lens part 14e formed in the periphery and the end part 32a that forms the opening of the cover package are tapered to each other.
- the center of the opening of the cover package 30 and the optical axis of the lens unit 3 are configured to be matched by inserting the lens unit 4.
- the third different part is different in that the side surface of the lens unit 3 and the side surface of the spacer substrate 7 are configured as the same surface in FIG. This is because when a wafer lens before cutting having a plurality of lens portions and a spacer substrate before cutting having a plurality of openings are bonded together and then cut together, the lens unit as a cutting surface and the side surface of the spacer substrate This is because they match.
- the fourth of the different parts is a configuration in which the side surface of the cover glass 60 of the sensor unit 5 is flush with the side surface of the package 50 in FIG. It is. Similar to the lens unit and the spacer substrate described above, this structure is obtained by bonding the package 50 and the cover glass and then cutting them for separation.
- the cover package 30 is not formed so as to cover the upper surface of the lens portion, but is formed around the protruding portion, outside 14b in FIG. 1A. 1B, since the end of the opening of the cover package 30 is arranged in the non-lens portion 14e in FIG. 1B, the periphery of the lens portion is exposed from the object side through the cover package opening. Since it becomes a structure, predetermined
- the convex lens portion 14a, the concave lens portion 16a, the concave lens portion 24a, and the convex lens portion 26a are as shown in FIG. These lens portions are stacked vertically so that their optical axes PA coincide with each other.
- an eccentricity identification mark 14 c may be provided on the surface of the molded part 14 to indicate the eccentricity of the convex lens part 14 a with respect to the cutting position.
- the cutting position may be cut at a slightly eccentric position in advance so as to correspond to the sensor portion eccentrically arranged on the sensor unit. Even in such a case, since each lens is very small, it may be difficult to determine which side is decentered and cut. However, by displaying such an eccentricity identification mark 14c, When installing, there is an advantage that it is possible to prevent the wrong installation direction.
- the cover package 30 has a bottomless box shape (the lower part is opened), and is composed of one top plate portion 32 and four side plate portions 34 each having a square shape. ing.
- a circular opening 32 a is formed at the center of the top plate 32.
- two side plate portions 34 adjacent to each other have three cutout portions 34a (the remaining one side plate portion 34 is not formed with the corresponding portion).
- the sensor unit 5 mainly includes a sensor 40, a package 50, and a cover glass 60.
- the sensor unit used in the imaging apparatus of FIG. 1 mainly includes a sensor 40, a package 50, and a cover glass 60.
- the sensor 40 is a light receiving sensor that receives light transmitted through the lens unit 3 and can photoelectrically convert the received light to output an electrical signal to an external device (not shown).
- the package 50 has a bottomed box shape and is open at the top. As shown in FIG. 1B, a sensor 40 is disposed at a substantially central portion of the package 50.
- the cover glass 60 is provided as a lid on the top of the package 50, and the sensor 40 is sealed in a space surrounded by the package 50 and the cover glass 60.
- the spacer 7 is interposed between the molding portion 26 of the lens unit 3 and the cover glass 60 of the sensor unit 5, and between the lens unit 3 and the sensor unit 5. Is given a certain interval.
- the spacer 7 has a rectangular frame shape, and the protrusions 7a are formed on the two sides adjacent to each other among the four sides and the corners thereof.
- the protrusion 7a protrudes outside the cover package 30, and more specifically, protrudes (exposes) from the notch 34a.
- An IR cut filter 70 is provided inside the spacer 7.
- the IR cut filter 70 is disposed above the cover glass 60 and shields infrared rays that are to enter the sensor 40.
- the spacer 7 on which the IR cut filter 70 is mounted in advance is placed on the flat base 100.
- the spacer 7 is positioned at a predetermined position, and when viewed from the object side (when viewed from the jig insertion side in FIG. 5), an L-shaped jig 110 (in FIG. As shown in FIG. 15, each protrusion 7 a of the spacer 7 is brought into contact with the jig 110, and the spacer 7 is a base corresponding to the jig 110. Temporarily fix on 100.
- the lens unit 3 is aligned with the spacer 7 by using a positioning jig 120 and bonded and fixed.
- the jig 120 has a tapered shape with a tapered tip, and the jig 120 has a tapered portion 120a.
- a suction part 120 b suction hole capable of sucking the lens unit 3 is formed at the center of the jig 120.
- the jig 120 is movable in the front-rear and left-right directions (on a two-dimensional plane) and in the up-down direction (see arrows in FIGS. 5 and 6).
- the jig 120 is disposed so as to face the molding portion 14 of the lens unit 3, and the tapered portion 120a and the inclined portion 14b are brought into contact with each other.
- the jig 120 is moved in the front / rear / left / right direction and the vertical direction, and the inclined part 14b of the lens unit 3 is located at the position of the jig 120.
- the lens unit 3 is moved to a predetermined position of the spacer 7 by the adjusting action due to the contact, and the lens unit 3 is adhered and fixed to the spacer 7 at the predetermined position.
- the lens unit 3 is adjusted to an appropriate position (predetermined position) according to the position of the jig 120 on the spacer 7.
- the protrusion 7a of the spacer 7 since the notch 34a is formed in the cover package 30 of the lens unit 3, the protrusion 7a of the spacer 7 remains in contact with the jig 110 while being exposed (projected) from the notch 34a. Retained. As a result, the protrusion 7a of the spacer 7 becomes a reference for temporary fixing, and the temporary fixing position of the spacer 7 is maintained.
- the lens unit 3 may be bonded and fixed to the spacer 7 with the cover package 30 removed.
- the cover package 30 is viewed from above the wafer lenses 10 and 20 so that the notch 34 a of the cover package 30 is fitted to the protrusion 7 a of the spacer 7. Cover it.
- the spacer 7 (with the lens unit 3 bonded and fixed) is bonded and fixed to the sensor unit 5 in the same manner as the lens unit 3 is bonded and fixed to the spacer 7.
- the sensor unit 5 is mounted on the base 100.
- the base 100 has an L-shaped jig 130 for positioning the sensor unit 5 at a predetermined position on the base when viewed from the object side.
- the side surface (two adjacent side surfaces 50a) of the package 50 of the sensor unit 5 is brought into contact with the jig 130 to cure the sensor unit 5 as shown in FIG. Temporarily fix at a predetermined position C on the base 100 corresponding to the tool 130.
- the spacer 7 is aligned with the sensor unit 5 by using the alignment jig 120 again, and is bonded and fixed.
- the jig 120 is moved back and forth, left and right, and up and down.
- the lens unit 3 is moved to a predetermined position corresponding to the sensor unit 5 (sensor 40), and the spacer 7 is bonded and fixed to the sensor unit 5 at the predetermined position.
- the spacer 7 is gradually pressed against the cover glass 60 as the jig 120 is lowered.
- 14b is finely moved so as to be completely fitted to the tapered portion 120a of the jig 120, and the lens unit 3 is positioned on the sensor unit 5 at an appropriate position (predetermined position) according to the arrangement position of the jig 120,
- the optical axes of the wafer lenses 10 and 20 of the lens unit 3 coincide with the optical axis of the sensor 40 of the sensor unit 5.
- the optical axis alignment between the optical axis of the sensor and the optical axis of the wafer lens 10 or 20 of the lens unit 3 is shown here, the optical axis of the wafer lens 10 or 20 is not necessarily aligned with the optical axis of the sensor. It is not limited to. That is, depending on the specifications of the imaging apparatus, the optical axes of the wafer lenses 10 and 20 may be aligned with a predetermined position that is shifted from the optical axis of the sensor.
- the “sensor optical axis” refers to the diagonal center of the effective pixel area that can be actually used for photographing by the imaging device in the pixel area of the light receiving sensor.
- a photo-curing resin adhesive is applied in advance between them, and when the lens unit 3 is positioned, it is directed toward the application site. Light irradiation.
- the optical axes of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis of the sensor 30 of the sensor unit 5 can be aligned via the spacer 7.
- the lens unit 3 and the sensor unit 5 are positioned using the jig 130 and the jig 120, they may be positioned by the following method instead.
- the lens unit 3 is moved by the jig 120 to a position where the protrusion 7 a of the spacer 7 abuts on the jig 130, and the jig 120 is lowered at the position to attach the spacer 7 to the sensor unit 5.
- -It may be fixed.
- the lens unit 3 and the sensor unit 5 are positioned using the jig 130.
- the portion with which the spacer protrusion 7a comes into contact may be constituted by a jig separate from the jig 130. .
- the wafer lenses 10 and 20 and the optical axis of the sensor 40 coincide with each other based on the cut surfaces (side end surfaces) of the wafer lenses 10 and 20, the wafer lenses 10 and 20 are manufactured at the time of manufacture.
- the optical axes of the wafer lenses 10 and 20 and the sensor 40 can be made to coincide with each other regardless of the dicing accuracy.
- the inclined part 14b is inclined upward from the convex lens part 14a toward the outer peripheral part, and the top part of the inclined part 14b is higher than the convex lens part 14a.
- a molded portion 14 as shown in FIG. 8 may be formed.
- the inclined part 14s is inclined downward from the convex lens part 14a toward the outer peripheral part, and the inclined part 14s is lower than the convex lens part 14a.
- the height (thickness) of the resin of the molding part 14 is determined by the height of the inclined part 14s and the height of the convex lens part 14a, but in the molding part 14 of FIG.
- the height (thickness) of the resin of the molded portion 14 is determined by either the height of the convex lens portion 14a.
- the configuration of FIG. 7 is more advantageous in reducing the thickness of the resin of the molded portion 14, and if the thickness of the resin is reduced, the amount of cure shrinkage of the resin during molding can be reduced. It is possible to form a highly effective lens effective portion having excellent properties.
- the convex lens portion 14a since the convex lens portion 14a is exposed and protrudes on the same plane, the convex lens portion 14a is likely to be scratched or damaged during handling or the like.
- the convex lens portion 14a can be included at a height of 14b, and it is possible to effectively prevent the convex lens portion 14a from being damaged or damaged during handling.
- Example 2 The second embodiment is mainly different from the first embodiment in the following points, and is otherwise the same as the first embodiment.
- the inclined portion 14 b and the spacer 7 (including the IR cut filter 70) in the molding portion 14 of the wafer lens 10 are not provided.
- a spacer portion 26 c is formed in the molding portion 26 of the wafer lens 20.
- the spacer portion 26c includes an inner inclined portion 26d, an adhesive portion 26e, and an outer inclined portion 26f, and is higher than the thickness of the convex lens portion 26a.
- the inner inclined portion 26d is inclined downward from the convex lens portion 26a toward the outer periphery.
- the bonding portion 26 e is flat and serves as a bonding surface that is bonded to the cover glass 60 of the sensor unit 5.
- the outer inclined portion 26f is inclined upward from the adhesive portion 26e toward the outer periphery.
- the side surfaces (two side surfaces 50a) of the package 50 of the sensor unit 5 are brought into contact with the jig 130, and the sensor unit 5 is temporarily fixed at a predetermined position C.
- the lens unit 3 is aligned with the sensor unit 5 by using the alignment jig 150, and is bonded and fixed.
- the jig 150 is a member having a circular shape when viewed from the object side as in FIG. 1C, and the side surface 150 a has an outer inclined portion 26 f in the molding portion 26 of the wafer lens 20. It is inclined so that it can come into contact.
- the lens unit 3 is placed on the temporarily fixed sensor unit 5, the spacer portion 26c in the molding portion 26 of the lens unit 3 is pressed toward the jig 150, and the lens unit 3 is moved to the sensor unit at that position. Adhere to 5 and fix.
- the lens unit 3 is positioned on the sensor unit 5 at an appropriate position (predetermined position) on the sensor unit 5 while the outer inclined portion 26 f of the spacer portion 26 c is in contact with the side surface 150 a of the jig 150.
- the optical axes of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis of the sensor 40 of the sensor unit 5 coincide with each other.
- an adhesive made of a photocurable resin is applied in advance between the 26e of the molding portion 26 and the cover glass 60, and the lens unit 3 is positioned. Then, light may be irradiated toward the application site.
- the optical axes of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis of the sensor 40 of the sensor unit 5 can be matched.
- the wafer lens 20 may be omitted and the lens unit 3 may be configured by the wafer lens 10 and the cover package 30.
- the wafer lens 10 is omitted.
- the lens unit 3 may be constituted by the wafer lens 20 and the cover package 30.
- the optical axis alignment between the optical axis of the sensor and the optical axis of the wafer lens 10 or 20 of the lens unit 3 is shown here, but the optical axis of the wafer lens 10 or 20 is not necessarily aligned with the optical axis of the sensor. It is not limited to things. That is, depending on the specifications of the imaging apparatus, the optical axes of the wafer lenses 10 and 20 may be aligned with a predetermined position that is shifted from the optical axis of the sensor.
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Abstract
Description
ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットであって、
最も物体側に形成された第1レンズ部の周囲の樹脂製の成形部は、前記第1レンズ部よりも物体側に突出した突出部を形成していることを特徴とするレンズユニットが提供される。
ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットにおいて、
当該レンズユニットは、物体側から順に、物体側に凸面を向け、樹脂製の成形部の一部に形成された第1レンズ部と、ガラス基板を介して形成され、像側に凹面を向け、樹脂製の成形部の一部に形成された第2レンズ部とを有する第1ウエハレンズと、
前記第1ウエハレンズの前記第2レンズ部が形成された樹脂製の成形部に接着された樹脂製の成形部の一部に形成され、物体側に凹面を向けた第3レンズ部と、ガラス基板を介して形成された、樹脂製の成形部の一部に形成された第4レンズ部とを有する第2ウエハレンズと、を有し、
前記第1レンズ部の外周には、位置合わせ用の治具を当接させるための傾斜部が形成されていることを特徴とするレンズユニットが提供される。
物体側から順に、物体側に凸面を向け、樹脂製の成形部の一部に形成された第1レンズ部と、ガラス基板を介して形成された、像側に凹面を向け、樹脂製の成形部の一部に形成された第2レンズ部とを有する第1ウエハレンズと、
前記第1ウエハレンズの前記第2レンズ部が形成された樹脂製の成形部に接着された樹脂製の成形部の一部に形成され、物体側に凹面を向けた第3レンズ部と、ガラス基板を介して形成された、樹脂製の成形部の一部に形成された第4レンズ部とを有する第2ウエハレンズと、
を有するレンズユニットと、
前記レンズユニットを外方から覆うと共に、前記第1レンズ部に光を入射すべく開口部を形成した外装部材と、
前記第2ウエハレンズから所定間隔を以って配置された受光センサーを基板の一面に配置したセンサーユニットと、を有する撮像装置であって、
前記第1レンズ部の周囲の樹脂製の成形部は、前記第1レンズ部よりも物体側に突出した、前記第1レンズ部の光軸方向物体側からみて環状の突出部が形成されており、当該環状の突出部の周囲に前記外装部材の開口部の端部が配置されていることを特徴とする撮像装置が提供される。
ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットの光軸を、各ウエハレンズの透過光を受光する受光センサーの所定位置に一致させるための位置合わせ方法であって、
前記受光センサーを所定位置に配置する工程と、
配置された前記受光センサーに、複数枚のウエハレンズのうち最も外側に配置された成形部であって、レンズ部の外周に形成された傾斜部に対し、位置合わせ用の治具を当接させながら前記レンズユニットの光軸を前記受光センサーの所定位置に一致させるように移動させる工程と、
を有することを特徴とする位置合わせ方法が提供される。
ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数積層したレンズユニットと、前記レンズ部を透過した入射光を受光する受光センサーを備えたセンサーユニットと、を備えた撮像装置の製造方法であって、
第1のガラス基板上に樹脂製の複数のレンズ部と、各レンズ部の外方に傾斜して突出している傾斜部とを備えた第1のウエハレンズアレイと、第2のガラス基板上に樹脂製の複数のレンズ部を供えた第2のウエハレンズアレイを準備し、前記第1のウエハレンズアレイが前記傾斜部が外部に露出するように前記第2のウエハレンズアレイと積層した後接合し、切断してレンズユニットを生成する工程と、
前記受光センサーを所定位置に配置する工程と、
所定位置に配置された前記受光センサーに、複数枚のウエハレンズのうち前記傾斜部に対し、位置合わせ用の治具を当接させながら前記レンズユニットを前記受光センサーに対して所定位置に移動させる工程と、
前記レンズユニットを前記所定位置へ移動後、前記センサーユニットに対して前記レンズユニットを固定する工程と、
を有することを特徴とする撮像装置の製造方法が提供される。
図1(a)に示す通り、本発明の好ましい実施例1にかかる撮像装置1は主にはレンズユニット3、センサーユニット5、スペーサ7で構成されており、レンズユニット3とセンサーユニット5とがスペーサ7で介在された構成を有している。
本実施例2は主には下記の点で実施例1と異なっており、それ以外は実施例1と同様となっている。
3 レンズユニット
5 センサーユニット
7 スペーサ
7a 突起部
10 ウエハレンズ
12 ガラス基板
14、16 成形部
14a 凸レンズ部
14b 傾斜部
14c 偏芯識別標識
14s 傾斜部
16a 凹レンズ部
16b 周辺部
20 ウエハレンズ
22 ガラス基板
24、26 成形部
24a 凹レンズ部
24b 周辺部
26a 凸レンズ部
26b 周辺部
26c スペーサ部
26d 内傾斜部
26e 接着部
26f 外傾斜部
30 パッケージ
32 天板部
32a 開口部
34 側板部
34a 切欠部
40 センサー
50 パッケージ
60 カバーガラス
70 IRカットフィルタ
100 ベース
110、130 治具
120 (位置合わせ用)治具
120a テーパ部
120b 吸引部
150 (位置合わせ用)治具
150a 側面
PA 光軸
Claims (24)
- ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットにおいて、
最も物体側に形成された第1レンズ部の周囲の樹脂製の成形部は、前記第1レンズ部よりも物体側に突出した突出部を形成していることを特徴とするレンズユニット。 - 前記レンズユニットは、物体側から順に、物体側に凸面を向け、樹脂製の成形部の一部に形成された第1レンズ部と、ガラス基板を介して形成され、像側に凹面を向け、樹脂製の成形部の一部に形成された第2レンズ部とを有する第1ウエハレンズと、
前記第1ウエハレンズの前記第2レンズ部が形成された樹脂製の成形部に接着された樹脂製の成形部の一部に形成され、物体側に凹面を向けた第3レンズ部と、ガラス基板を介して形成された、樹脂製の成形部の一部に形成された第4レンズ部とを有する第2ウエハレンズと、
を有することを特徴とする請求項1に記載のレンズユニット。 - 前記突出部は、前記第1レンズ部の光軸方向物体側からみて環状に形成されていることを特徴とする請求項1又は請求項2に記載のレンズユニット。
- 前記突出部は、前記第1レンズ部側の側面が物体側に向かって径が広がる第1の傾斜部をもって形成されていることを特徴とする請求項3に記載のレンズユニット。
- 前記突出部は、前記第1レンズ部側とは反対側の側面が像側に向かうにつれて径が拡がる第2の傾斜部をもって形成されていることを特徴とする請求項3に記載のレンズユニット。
- 前記第1レンズ部を形成する樹脂製の成形部は、ガラス基板の表面上に形成され、当該ガラス基板の表面上には前記樹脂製の成形部との間に絞り部材が形成されていることを特徴とする請求項1から請求項5までのいずれか一項に記載のレンズユニット。
- ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットであって、
当該レンズユニットは、物体側から順に、物体側に凸面を向け、樹脂製の成形部の一部に形成された第1レンズ部と、ガラス基板を介して形成され、像側に凹面を向け、樹脂製の成形部の一部に形成された第2レンズ部とを有する第1ウエハレンズと、
前記第1ウエハレンズの前記第2レンズ部が形成された樹脂製の成形部に接着された樹脂製の成形部の一部に形成され、物体側に凹面を向けた第3レンズ部と、ガラス基板を介して形成された、樹脂製の成形部の一部に形成された第4レンズ部とを有する第2ウエハレンズと、を有し、
前記第1レンズ部の外周には、位置合わせ用の治具を当接させるための傾斜部が形成されていることを特徴とするレンズユニット。 - 前記傾斜部が、前記レンズ部から外周部に向かって高くなっていることを特徴とする請求項7に記載のレンズユニット。
- 前記レンズ部が凸状を呈しており、
前記傾斜部の最頂部が前記レンズ部より高いことを特徴とする請求項7に記載のレンズユニット。 - 物体側から順に、物体側に凸面を向け、樹脂製の成形部の一部に形成された第1レンズ部と、ガラス基板を介して形成された、像側に凹面を向け、樹脂製の成形部の一部に形成された第2レンズ部とを有する第1ウエハレンズと、
前記第1ウエハレンズの前記第2レンズ部が形成された樹脂製の成形部に接着された樹脂製の成形部の一部に形成され、物体側に凹面を向けた第3レンズ部と、ガラス基板を介して形成された、樹脂製の成形部の一部に形成された第4レンズ部とを有する第2ウエハレンズと、
を有するレンズユニットと、
前記レンズユニットを外方から覆うと共に、前記第1レンズ部に光を入射すべく開口部を形成した外装部材と、
前記第2ウエハレンズから所定間隔を以って配置された受光センサーを基板の一面に配置したセンサーユニットと、を有する撮像装置であって、
前記第1レンズ部の周囲の樹脂製の成形部は、前記第1レンズ部よりも物体側に突出した、前記第1レンズ部の光軸方向物体側からみて環状の突出部が形成されており、当該環状の突出部の周囲に前記外装部材の開口部の端部が配置されていることを特徴とする撮像装置。 - 前記突出部は、前記第1レンズ部側の側面が物体側に向かって径が広がる第1の傾斜部をもって形成されていることを特徴とする請求項10に記載の撮像装置。
- 前記突出部は、第1レンズ部側とは反対側の側面が像側に向かうにつれて径が拡がる第2の傾斜部が形成されており、前記外装部材の開口部は当該第2の傾斜部と嵌合する傾斜開口部が形成されていることを特徴とする請求項10又は請求項11に記載の撮像装置。
- 前記第1レンズ部を形成する樹脂製の成形部は、ガラス基板の表面上に形成され、当該ガラス基板の表面上には前記成形部との間に絞り部材が形成されていることを特徴とする請求項10から請求項12までのいずれか一項に記載の撮像装置。
- 前記レンズユニットの外形が、光軸方向からみて矩形形状を成していることを特徴とする請求項10から請求項13までのいずれか一項に記載の撮像装置。
- 前記レンズユニットの光軸と、前記センサーユニットの受光センサーの光軸とが一致していることを特徴とする請求項10から請求項14までのいずれか一項に記載の撮像装置。
- 前記第2ウエハレンズの前記第4レンズ部側に配置され、前記第1乃至第4レンズ部に対応する位置に開口部を有するガラスからなるスペーサ基板を有し、前記センサーユニットは、前記スペーサ基板の他端部が接合されたガラスからなるカバー部材を有し、当該カバー部材から所定間隔を以って受光センサーを基板の一面に配置していることを特徴とする請求項10から請求項15までのいずれか一項に記載の撮像装置。
- ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数枚積層したレンズユニットの光軸を、各ウエハレンズの透過光を受光する受光センサーの所定位置に一致させるための位置合わせ方法であって、
前記受光センサーを所定位置に配置する工程と、
配置された前記受光センサーに、複数枚のウエハレンズのうち最も外側に配置された成形部であって、レンズ部の外周に形成された傾斜部に対し、位置合わせ用の治具を当接させながら前記レンズユニットの光軸を前記受光センサーの所定位置に一致させるように移動させる工程と、
を有することを特徴とする位置合わせ方法。 - 前記傾斜部に対して、位置合わせ用の治具を当接させながら前記レンズユニットを所定位置に移動させる工程の後、
前記レンズユニットを光軸方向に移動させ、所定位置に配置された前記受光センサーとの距離を所定距離にすることを特徴とする請求項17に記載の位置合わせ方法。 - 前記受光センサーを所定位置に配置する工程の前に、
前記レンズユニットと前記受光センサーとの間に一定の間隔を付与するスペーサを、仮固定する工程と、
前記傾斜部に対し前記位置合わせ用の治具を当接させながら前記レンズユニットを駆り固定された前記スペーサに移動させ、前記レンズユニットと前記スペーサとを接着する工程と、
を有することを特徴とする請求項18に記載の位置合わせ方法。 - 前記傾斜部に対して前記位置合わせ用の治具を当接させながら前記レンズユニットを所定位置に移動させた後に、前記レンズユニットを光軸方向に移動させて、受光センサーとの距離を所定位置にする工程と、
前記受光センサーとの距離を所定位置に配置する工程後、前記レンズユニットと前記スペーサとを接着することを特徴とする請求項19に記載の位置合わせ方法。 - 前記レンズユニットは複数枚のウエハレンズを覆うカバーパッケージを有し、かつ、前記カバーパッケージには切欠部が形成され、
前記レンズユニットと前記スペーサとを接着する工程では、前記カバーパッケージの切欠部から露出した前記スペーサの一部を基準として、前記スペーサの仮固定位置を維持することを特徴とする請求項19又は請求項20に記載の位置合わせ方法。 - 前記レンズユニットは、ガラス基板上に複数の成形部が形成された複数枚のウエハレンズアレイを積層して接合後、切断して個片化されたものであることを特徴とする請求項17から請求項21までのいずれか一項に記載の位置合わせ方法。
- 前記レンズユニットの光軸は、前記受光センサーの光軸と一致するように位置合わせすることを特徴とする請求項17から請求項22までのいずれか一項に記載の位置合わせ方法。
- ガラス基板上に樹脂製の成形部が形成され、その一部にレンズ部が形成されたウエハレンズを複数積層したレンズユニットと、前記レンズ部を透過した入射光を受光する受光センサーを備えたセンサーユニットと、を備えた撮像装置の製造方法であって、
第1のガラス基板上に樹脂製の複数のレンズ部と、各レンズ部の外方に傾斜して突出している傾斜部とを備えた第1のウエハレンズアレイと、第2のガラス基板上に樹脂製の複数のレンズ部を供えた第2のウエハレンズアレイを準備し、前記第1のウエハレンズアレイが前記傾斜部が外部に露出するように前記第2のウエハレンズアレイと積層した後接合し、切断してレンズユニットを生成する工程と、
前記受光センサーを所定位置に配置する工程と、
所定位置に配置された前記受光センサーに、複数枚のウエハレンズのうち前記傾斜部に対し、位置合わせ用の治具を当接させながら前記レンズユニットを前記受光センサーに対して所定位置に移動させる工程と、
前記レンズユニットを前記所定位置へ移動後、前記センサーユニットに対して前記レンズユニットを固定する工程と、
を有することを特徴とする撮像装置の製造方法。
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TWI672537B (zh) * | 2018-11-21 | 2019-09-21 | 大立光電股份有限公司 | 塑膠透鏡組、成像鏡頭模組及電子裝置 |
CN110376699B (zh) * | 2019-07-26 | 2021-12-03 | 业成科技(成都)有限公司 | 镜片对位方法、镜头模组及成像装置 |
CN112751988B (zh) * | 2019-10-29 | 2023-04-07 | 宁波舜宇光电信息有限公司 | 大广角摄像模组的组装方法 |
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- 2009-12-11 JP JP2011500469A patent/JP5464502B2/ja not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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JPWO2010095332A1 (ja) | 2012-08-23 |
CN102308240B (zh) | 2015-03-04 |
JP5464502B2 (ja) | 2014-04-09 |
CN102308240A (zh) | 2012-01-04 |
US20110298075A1 (en) | 2011-12-08 |
EP2400332A1 (en) | 2011-12-28 |
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