WO2010087240A1 - 電子パッケージおよび表示装置 - Google Patents
電子パッケージおよび表示装置 Download PDFInfo
- Publication number
- WO2010087240A1 WO2010087240A1 PCT/JP2010/050479 JP2010050479W WO2010087240A1 WO 2010087240 A1 WO2010087240 A1 WO 2010087240A1 JP 2010050479 W JP2010050479 W JP 2010050479W WO 2010087240 A1 WO2010087240 A1 WO 2010087240A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid crystal
- crystal display
- display device
- circuit board
- fpc board
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133314—Back frames
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Definitions
- the present invention relates to an electronic package and a display device (for example, a liquid crystal display device) on which the electronic package is mounted.
- a display device for example, a liquid crystal display device
- a thin liquid crystal television is an example.
- an FPC (Flexible Printed Circuits) substrate which is a flexible circuit substrate is easily used for thinning (see Patent Document 1).
- the number of FPC boards mounted on the liquid crystal display device is not limited to one, and a plurality of FPC boards are mounted.
- an LED on which a panel FPC board (first circuit board) pb11 connected to the liquid crystal display panel 249 and an LED (Light Emitting Diode) as a light source are mounted.
- FPC board (second circuit board) pb22 is mounted.
- solder 211 that is a conductive adhesive is used.
- FIG. 21 which is a partially enlarged view of FIG. 20B
- a connection portion c11 (see halftone hatching) in the panel FPC board pb11
- a connection portion c22 (see halftone hatching) in the LED FPC board pb22 are electrically connected by solder 211.
- the bezels (front bezel bz11 and back bezel bz22) serving as the housing of the liquid crystal display device 269 are formed of conductive metal, a short circuit between the bezels bz11 and bz22 and the solder 211 becomes a problem (note that The bezels bz11 and bz22 are collectively referred to as a housing unit ut, and the bezels bz11 and bz22 that accommodate the FPC circuit boards pb11 and pb22 are referred to as electronic packages pg).
- a part of the panel FPC board pb11 and the LED FPC board pb22 is drawn out from the inside surrounded by the bezels bz11 and bz22. Furthermore, the connection parts c11 and c22 are formed in a part of the both drawn FPC boards pb11 and pb22, and solder 211 is attached so as to cover the connection parts c11 and c22 (see FIGS. 20B and 21). Then, the solder 211 does not contact the inner surface of the back bezel bz, for example, and a short circuit (leak) does not occur.
- the portions of the FPC boards pb11 and pb22 to which the solder 211 is attached are located outside the liquid crystal display device 269 and can be said to be free ends that are relatively easy to move. Therefore, a leak may occur between the solder 211 and the outer surface of the bezels bz11 and bz22 depending on the variation of the FPC boards pb11 and pb22.
- a leak may occur between the metal component and the solder 211 inside the liquid crystal television.
- the cost of the liquid crystal display device 269 increases by the amount of the insulating member.
- the thickness of the insulating member must be taken into account, and the thickness of the liquid crystal display device 269 and the liquid crystal television may increase.
- the present invention has been made to solve the above problems. And the objective is to provide the thin electronic package etc. which prevented the leak resulting from a conductive adhesive, without adding a separate member.
- the electronic package includes a first circuit board, a second circuit board, and a housing unit that accommodates both circuit boards, and the first circuit board and the second circuit board are electrically connected via a conductive adhesive.
- a conductive adhesive an exposure opening for exposing the conductive adhesive from the inside of the housing unit to the outside is formed in a part of the housing unit located in front of the conductive adhesive.
- the housing unit is made of a conductive metal
- the exposed opening is located in front of the conductive adhesive and there is no metal. For this reason, leakage due to the conductive adhesive does not occur in the electronic package.
- the electronic package is not attached with an insulating member that closes the conductive adhesive. Therefore, there is no cost for the insulating member, and further, the thickness of the electronic package does not increase due to the thickness of the insulating member.
- a display apparatus is mentioned as an example of the electronic device containing an electronic package.
- a flexible circuit board that connects a first circuit board to a display panel, a flexible circuit board that mounts a light emitting element on a second circuit board, and a display device that uses a conductive adhesive as solder.
- a frame-shaped chassis serving as a skeleton is accommodated in the housing unit, and a part of the second circuit board to which the conductive adhesive is applied is bent, so that the inside of the frame of the chassis Is desirable.
- the housing unit is composed of a plurality of housings, and at least one housing is formed with a lead-out port for drawing out at least one of the first circuit board and the second circuit board to the outside of the housing unit.
- the outlet is a ring-shaped opening.
- this electronic package does not require a cost for a separate insulating member, and further becomes thin without taking into account the thickness of the insulating member.
- FIG. 3 is a perspective view of a liquid crystal display device.
- FIG. 3 is a perspective view of a liquid crystal display device.
- FIG. 3 is an exploded perspective view of a liquid crystal display device.
- FIG. 5 is a perspective view of a liquid crystal display device in which a bezel is omitted. These are the perspective views which show 1 process of the assembly process of a liquid crystal display device, and show the LED module etc. which approach a light-guide plate. These are the perspective views which show 1 process of the assembly process of a liquid crystal display device, and show the FPC board for LED etc. which are going to bend. These are the perspective views which show 1 process of the assembly process of a liquid crystal display device, and show the FPC board
- FIG. 14 is a partially enlarged view of FIG. 13. These are the perspective views which show 1 process of the assembly process of a liquid crystal display device, and show the back bezel etc. which cover a reflective sheet.
- FIG. 3 is an exploded perspective view of a liquid crystal display device. These are the parts contained in the liquid crystal display device shown in FIG. 16, and are side views of the front bezel. These are the components contained in the liquid crystal display device shown in FIG. 16, and are side views of the built-in chassis. These are the components contained in the liquid crystal display device shown in FIG. 16, and are side views of the back bezel. These are the disassembled perspective views of the liquid crystal display device used as a comparative example. These are the components contained in the liquid crystal display device shown in FIG. 18, and are side views of the front bezel.
- FIG. 19 shows components included in the liquid crystal display device shown in FIG. 18, and is a side view of the built-in chassis. These are the parts contained in the liquid crystal display device shown in FIG. 18, and are side views of the back bezel.
- FIG. 3 is a perspective view of a conventional liquid crystal display device.
- FIG. 3 is a perspective view of a conventional liquid crystal display device.
- FIG. 20B is a partially enlarged view of FIG. 20B.
- a liquid crystal display device will be described as an example of a display device, but the present invention is not limited to this.
- an organic EL (Electro-Luminescence) display and a plasma display may be used.
- a package in which a flexible circuit board is mounted on a bezel serving as an exterior of a liquid crystal display device is referred to as an electronic package (Note that an electronic package is not limited to a liquid crystal display device and can be mounted on various devices. is there).
- FIG. 3 shows a liquid crystal display device 69 mounted on a liquid crystal television (electronic device), and FIG. 4 is an exploded perspective view showing the liquid crystal display device 69 in an exploded manner.
- the liquid crystal display device 69 sandwiches the liquid crystal display panel 49, the backlight unit 59, and the liquid crystal display panel 49 and the backlight unit 59, thereby holding the bezel BZ (table bezel BZ1,. Including back bezel BZ2).
- the shape of the bezel BZ is not particularly limited.
- the back bezel BZ2 may be a box that houses the liquid crystal display panel 49 and the backlight unit 59
- the front bezel BZ1 may be a frame that covers the back bezel BZ2 (note that Both the bezels BZ1 and BZ2 can be said to be housings because they accommodate members, and the unitized bezels BZ1 and BZ2 are referred to as housing units UT).
- the liquid crystal display panel 49 includes an active matrix substrate 42, a counter substrate 43, polarizing films 44 and 45, and a panel FPC (Flexible Printed Circuits) substrate PB1.
- FPC Flexible Printed Circuits
- an active matrix substrate 42 including a switching element such as a TFT (Thin Film Transistor) and an opposite substrate 43 facing the active matrix substrate 42 are bonded together with a sealing material (not shown). Then, liquid crystal (not shown) is injected into the gap between the substrates 42 and 43.
- a polarizing film 44 is attached to the active matrix substrate 42 side, while a polarizing film 45 is attached to the counter substrate 43 side, and both the polarizing films 44 and 45 sandwich the active matrix substrate 42 and the counter substrate 43.
- the panel FPC board (first circuit board) PB1 is a flexible board including supply wiring (not shown) through which current flows.
- the panel FPC board PB1 is electrically and physically connected to the active matrix board 42.
- the panel FPC board PB1 is connected to the edge of the active matrix substrate 42 and extends along the edge, and intersects the first extension part L1. However, it is a series including the 2nd extending
- the first extending portion L1 is formed with a first connection portion C1 required for electrical connection with an LED FPC board PB2 described later (see FIGS. 1 and 14 described later).
- the backlight unit 59 supplies light to the non-light emitting liquid crystal display panel 49.
- the liquid crystal display panel 49 exhibits a display function by receiving light (backlight light) from the backlight unit 59. Therefore, if the light from the backlight unit 59 can uniformly irradiate the entire surface of the liquid crystal display panel 49, the display quality of the liquid crystal display panel 49 is improved.
- the backlight unit 59 includes an LED module MJ, a light guide plate 53, a reflection sheet 54, an optical sheet group 55 (a diffusion sheet 55A, lens sheets 55B and 55C, a diffusion sheet 55D) and Including a built-in chassis CS.
- the LED module MJ is a module that emits light, and includes an LED (Light Emitting Diode) 51 that emits light, and an LED FPC board (second circuit board) PB2 on which the LED is mounted.
- LED Light Emitting Diode
- PB2 LED FPC board
- the LED 51 is mounted on an electrode (not shown) formed on the mounting surface PB2f of the LED FPC board PB2, thereby receiving light and emitting light.
- an electrode not shown
- a plurality of LEDs (light emitting elements, point light sources) 51 are mounted on the LED FPC board PB2 (however, for convenience, only some of the LEDs 51 are shown in the drawing. Only).
- the LED FPC board PB2 is substantially L-shaped and includes a long portion PB2L and a short portion PB2S.
- the longitudinal portion PB2L has a length corresponding to the longitudinal length of the side surface 53S of the light guide plate 53, and the LEDs 51 are arranged in parallel on the mounting surface PB2f of the longitudinal portion PB2L (hereinafter, the direction in which the LEDs 51 are arranged). Called the alignment direction P).
- a second connection portion C2 required for electrical connection with the panel FPC board PB1 is formed in the short portion PB2S (see FIGS. 1 and 14 described later).
- the light guide plate 53 is a plate-like member having a side surface 53S, and a top surface 53U and a bottom surface 53B positioned so as to sandwich the side surface 53S. And one surface (light-receiving surface) of the side surface 53S receives the light from the LED 51 by facing the light-emitting surface of the LED 51. The received light is multiple-reflected inside the light guide plate 53 and is emitted outward from the top surface 53U as planar light.
- the reflection sheet 54 is positioned so as to be covered by the light guide plate 53. Then, one surface of the reflection sheet 54 facing the bottom surface 53B of the light guide plate 53 becomes the reflection surface 54U (reversely, the back surface of the reflection surface 54U is a non-reflection surface 54B). Therefore, the reflection surface 54U reflects the light from the LED 51 and the light propagating through the light guide plate 53 so as to return to the light guide plate 53 (specifically, the light guide plate 53 through the bottom surface 53B of the light guide plate 53) without leaking. .
- the optical sheet group 55 includes two diffusion sheets 55A and 55D and two lens sheets 55B and 55C. More specifically, a plurality of sheets stacked in the order of the diffusion sheet 55A, the lens sheet 55B, the lens sheet 55C, and the diffusion sheet 55D can be said to be the optical sheet group 55.
- the diffusion sheet 55 ⁇ / b> A is positioned so as to cover the top surface 53 ⁇ / b> U of the light guide plate 53, diffuses the planar light from the light guide plate 53, and spreads the light throughout the liquid crystal display panel 49.
- the lens sheets 55B and 55C are, for example, optical sheets that have a prism shape in the sheet surface and deflect the light radiation characteristics, and are positioned so as to cover the diffusion sheet 55A (in detail, the lens sheet 55B is the diffusion sheet 55A). And the lens sheet 55C covers the lens sheet 55B). Therefore, these lens sheets 55B and 55C collect the light traveling from the diffusion sheet 55A and improve the luminance. Note that the diverging directions of the respective lights collected by the lens sheet 55B and the lens sheet 55C intersect each other.
- the diffusion sheet 55D is positioned so as to cover the lens sheet 55C, diffuses the light that has passed through the diffusion sheet 55A and the lens sheets 55B and 55C, and spreads the light throughout the liquid crystal display panel 49.
- the built-in chassis (chassis) CS is a frame-like member that holds the various members described above, and serves as a skeleton of the liquid crystal display device 69. More specifically, the built-in chassis CS holds the reflection sheet 54, the light guide plate 53, and the optical sheet group 55 while being stacked in this order ⁇ Note that this stacking direction is referred to as an overlapping direction Q, and the alignment direction P and the overlapping direction Q are A direction intersecting with (for example, an orthogonal direction) is referred to as a crossing direction R ⁇ .
- the light from the LED 51 is emitted as planar light by the light guide plate 53, and the planar light passes through the optical sheet group 55 to increase the light emission luminance. The light is emitted. Then, the backlight light reaches the liquid crystal display panel 49, and the liquid crystal display panel 49 displays an image by the backlight light.
- the electrical connection between the panel FPC board PB1 and the LED FPC board PB2 will be described in detail.
- the first connection portion C1 of the panel FPC board PB1 and the LED are connected via the solder (conductive adhesive) 11.
- An assembling process until the second connecting portion C2 of the FPC board PB2 is electrically connected will be described with reference to FIGS.
- FIG. 5 illustrates the liquid crystal display device 69 shown in FIG. 3 with the front bezel BZ1 and the back bezel BZ2 omitted. Then, before reaching the state of the liquid crystal display device 69 shown in FIG. 5, the assembly process shown in FIG. For convenience, the built-in chassis CS is omitted in FIGS. Further, the following assembly process is an example, and is not limited to this assembly process.
- the LED module MJ is brought closer to the light guide plate 53 that covers the reflection sheet 54. More specifically, the LED module MJ is brought close to the side surface 53S of the light guide plate 53 so that the light emitting surface of the LED 51 faces the side surface 53S of the light guide plate 53 serving as the light receiving surface 53S (note that the LED module MJ is connected to the light guide plate). 53, the mounting surface PB2f of the LED FPC board PB2 faces the back bezel BZ2 side, and the tip of the short part PB2S of the L-shaped LED FPC board PB2 It deviates from the light receiving surface 53S).
- the L-shaped LED FPC board PB2 uses the short portion PB2S as a reference in the direction of the arrow X based on the vicinity of the intersection of the long portion PB2L and the short portion PB2S. It bends toward the reflection sheet 54 (more specifically, the non-reflection surface 54B). Then, as shown in FIG. 8, the mounting surface PB ⁇ b> 2 f of the short portion PB ⁇ b> 2 ⁇ / b> S faces the non-reflecting surface 54 ⁇ / b> B of the reflective sheet 54.
- the optical sheet group 55 is stacked on the top surface 53U of the light guide plate 53, and further, the liquid crystal display panel 49 covers the optical sheet group 55 as shown in FIG. Put on. Specifically, the liquid crystal display panel 49 is brought close to the optical sheet group 55 so that the polarizing sheet 44 of the liquid crystal display panel 49 faces the diffusion sheet 55D.
- the first extending portion L1 in the panel FPC board PB1 bends. More specifically, the first extending portion L1 is directed toward the non-reflecting surface 54B of the reflecting sheet 54 according to the direction of the arrow X shown in FIG. (See FIG. 12). As the first extending portion L1 is bent, the second extending portion L2 is turned over according to the direction of the arrow Y shown in FIG. 11 (see FIG. 12).
- FIG. 13 which shows the non-reflecting surface 54B of the reflective sheet 54
- FIG. 14 which is a partially enlarged view of FIG. 13 (note that the built-in chassis CS is also shown in FIG. 13 and FIG. 14)
- the first extending portion L1 covers the short portion PB2S of the LED FPC board PB2 that covers the non-reflecting surface 54B.
- the first connection portion C1 in the first extending portion L1 of the panel FPC board PB1 and the second connection portion C2 (see halftone hatching) in the short portion PB2S of the LED FPC board PB2 are designed to overlap. Is done.
- connection portion C2 when the second connection portion C2 is formed in the vicinity of the front end of the short portion PB2S in the LED FPC board PB2, the first FPC board PB1 for panel overlapping the second connection portion C2 is formed.
- the first connection portion C1 is formed on a part (for example, an edge) of the extending portion L1. Thereby, both connection parts C1 and C2 overlap, and also solder 11 is attached to both these connection parts C1 and C2.
- the first connection part C1 and the second connection part C2 are attached by the solder 11 after the panel FPC board PB1 and the LED FPC board PB2 overlap, the first connection part C1 is directed outward. And the second connection portion C2 must be exposed (in short, it must be in a state that can be attached by the solder 11 from the outside). Therefore, as shown in FIG. 14, when the first extending portion L1 of the panel FPC board PB1 overlaps the short part PB2S of the LED FPC board PB2, the following is preferable.
- the first connection portion C1 is formed by attaching gold plating to the notch of the U-shape at the edge of the first extending portion L1 that overlaps the short portion PB2S, and the first connection portion C1 is partially overlapping with the first connection portion C1.
- a second connection portion C2 made of pad-shaped gold plating is formed in the vicinity of the end of the short portion PB2S that exposes another portion without overlapping the panel FPC board PB1.
- connection portion C1 overlaps a part of the second connection portion C2.
- solder 11 is attached (prepared) so as to cover both the connection portions C1 and C2 from above the first extending portion L1 of the panel FPC substrate PB1 overlapping the short portion PB2S of the LED FPC substrate PB2. .
- the reflective sheet in which the back bezel BZ2 fits within the frame of the built-in chassis CS as shown in FIG. 54 is brought closer to the non-reflective surface 54B and attached to the built-in chassis CS (how to attach is not particularly limited).
- An opening (drawer port) OP2 is formed on the side surface of the box-shaped back bezel BZ2, and the second extending portion L2 of the panel FPC board PB1 extends from the opening OP2 to the outside of the back bezel BZ2. Pulled out.
- the front bezel BZ1 approaches the polarizing film 45 of the liquid crystal display panel 49 that fits within the frame of the built-in chassis CS, and is attached to the built-in chassis CS and the back bezel BZ2 (how to attach is not particularly limited) Absent).
- a cutout (drawer port) OP1 is formed on the side surface of the frame-shaped front bezel BZ1, and the second extending portion L2 of the panel FPC board PB1 is drawn out of the front bezel BZ1 from the cutout OP1. (See FIG. 16 described later).
- FIGS. 3 and 2 are perspective views of the liquid crystal display device 69 completed as described above. 2 and 1 (partially enlarged view of FIG. 2), the solder 11 is exposed from the inside of the liquid crystal display device 69 (the space surrounded by the front bezel BZ1 and the back bezel BZ2) to the outside. . More specifically, in the space surrounded by the front bezel BZ1 and the back bezel BZ2, an opening (exposing opening) HL for exposing the solder 11 from the inside of this space to the outside is provided in a part of the back bezel BZ2 located in front of the solder 11. It is formed.
- the first extending portion L1 of the panel FPC board PB1 to which the solder 11 is attached and the short part PB2S of the LED FPC board PB2 are pressed by the back bezel BZ2 and are difficult to move (in detail, the inside of the back bezel BZ2).
- the first extending portion L1 and the short portion PB2 that fall within the range are difficult to move).
- the solder 11 is also less likely to fluctuate due to the fact that some of these FPC boards PB1 and PB2 do not fluctuate. As a result, for example, the solder 11 fluctuates and does not contact the edge of the exposure port HL, and the liquid crystal display device 69 is not further damaged due to leakage.
- the cost of the liquid crystal display device 69 is suppressed by the amount that the insulating member is unnecessary.
- the thickness of the insulating member causes an increase in the thickness of the liquid crystal display device 69.
- the exposure port HL does not cause an increase in the thickness of the liquid crystal display device 69. That is, the liquid crystal display device 69 is relatively thin (of course, the liquid crystal television on which such a liquid crystal display device 69 is mounted is also thin).
- FIG. 16 is an exploded perspective view of the liquid crystal display device 69 of FIG. 16, FIG. 17A is a side view of the front bezel BZ1, and FIG. 17C is a side view of the back bezel BZ2, the panel FPC board PB1 has a front bezel. It is drawn out through the notch OP1 of BZ1 and the opening OP2 of the back bezel BZ2 (note that the white arrow in FIG. 16 indicates the front direction in FIGS. 17A to 17C).
- the short portion PB2S of the LED FPC board PB2 bends into the frame of the built-in chassis CS (not shown in FIGS. 7 and 8). As shown in the side view of FIG. 17B, there may be no outlet for pulling out the short portion PB2S.
- FIG. 18 shows a liquid crystal display device 169 which is a comparative example and FIG. 19B which is a side view of the built-in chassis cs
- an FPC board for LED toward the frame of the built-in chassis cs When the pb2 is not bent, the built-in chassis cs must be formed with a lead-out port op11 for pulling out the LED FPC board pb2.
- the panel FPC board pb1 is pulled out from the liquid crystal display device 169, as shown in the side view of FIG. 19A and the side view of FIG. 19C, the front bezel bz1 and the back bezel bz2 have drawer openings (for example, both bezels bz1). -Notches op1 and op2) are formed on the side surface of bz2.
- any of the front bezel bz1, the built-in chassis cs, and the back bezel bz2 if a mouth part (op1, op2, op11) formed by partially missing is formed, a load such as pressure tends to concentrate in the vicinity thereof. For this reason, the liquid crystal display panel 149 in the vicinity of the gathered mouth portions (op1, op2, op11) is likely to be pressurized, and the entire liquid crystal display panel 149 may be cracked (cracked) from the point where the pressure is applied. .
- the frame-like built-in chassis CS serving as a skeleton is housed in the housing unit UT composed of the front bezel BZ1 and the back bezel BZ2, and the LED to which the solder 11 is attached.
- the short part PB2S of the FPC board PB2 for use is bent and accommodated in the frame of the built-in chassis CS. Therefore, as shown in FIG. 17B, the built-in chassis CS has no drawer port.
- the liquid crystal display device 69 that houses such a built-in chassis CS as a skeleton has a relatively high strength and makes it difficult to transmit the pressure to the liquid crystal display panel 49 even if it receives pressure.
- the ring-shaped opening OP2 is formed in the back bezel BZ2, as shown in FIG. 17C, a part 21 of the back bezel BZ2 around the opening OP2 functions as a beam. Since a plurality of such portions 21 are generated, the strength of the back bezel BZ2 does not deteriorate relatively (for example, the back bezel BZ2 has higher strength than the front bezel BZ1 in which the notch OP1 is formed). Therefore, the liquid crystal display device 69 in which such a back bezel BZ2 is accommodated together with the built-in chassis CS is further increased in strength and prevents the liquid crystal display panel 49 from being damaged.
- the exposure port HL for exposing the solder 11 to the outside of the liquid crystal display device 69 is formed in the back bezel BZ2, it is not limited to this.
- the exposure port HL may be formed in the front bezel BZ1.
- circuit board drawn out through the notch OP1 of the front bezel BZ1 and the opening OP2 of the back bezel BZ2 is the panel FPC board PB1, it is not limited to this.
- the LED FPC board PB2 may be pulled out through the notch OP1 and the opening OP2.
- both circuit boards PB1 and PB2 may be pulled out through the notch OP1 and the opening OP2.
Abstract
Description
実施の一形態について、図面に基づいて説明すれば、以下の通りである。なお、便宜上、ハッチングや部材符号等を省略する場合もあるが、かかる場合、他の図面を参照するものとする。逆に、断面図以外の図であっても、便宜上、ハッチングを付す場合もある。
なお、本発明は上記の実施の形態に限定されず、本発明の趣旨を逸脱しない範囲で、種々の変更が可能である。
BZ1 表ベゼル(ハウジング)
OP1 切欠(引き出し口)
BZ2 裏ベゼル(ハウジング)
HL 露出口
OP2 開孔
21 梁
UT ハウジングユニット
PB1 パネル用FPC基板(第1回路基板)
L1 第1延伸部
C1 第1接続部
L2 第2延伸部
PB2 LED用FPC基板(第2回路基板)
PB2L 長手部分
PB2S 短手部分
C2 第2接続部
PG 電子パッケージ
42 アクティブマトリックス基板
49 液晶表示パネル
MJ LEDモジュール
51 LED
53 導光板
54 反射シート
55 光学シート群
CS 内蔵シャーシ(シャーシ)
59 バックライトユニット
69 液晶表示装置(表示装置)
Claims (4)
- 第1回路基板と、第2回路基板と、これら両回路基板を収容するハウジングユニットと、を含み、導電性接着剤を介して、上記第1回路基板と上記第2回路基板とを導通させている電子パッケージにあって、
上記導電性接着剤の面前に位置する上記ハウジングユニットの一部分には、上記導電性接着剤を、上記ハウジングユニットの内部から外部に露出させる露出口が形成される電子パッケージ。 - 請求項1に記載の電子パッケージを含む表示装置にあって、
上記第1回路基板は、表示パネルにつながる可撓性の回路基板であり、
上記第2回路基板は、発光素子を実装する可撓性の回路基板であり、
上記導電性接着剤は、ハンダである、
表示装置。 - 骨格となる枠状のシャーシが、上記ハウジングユニットに収容され、
上記導電性接着剤の付される上記第2回路基板の一部は、撓むことで、上記シャーシの枠内に収められる請求項2に記載の表示装置。 - 上記ハウジングユニットは、複数のハウジングで構成されており、
少なくとも1つの上記ハウジングには、上記第1回路基板および上記第2回路基板の少なくとも一方を、ハウジングユニットの外部に引き出す引き出し口が形成されており、
上記引き出し口は、輪状の開孔である請求項3に記載の表示装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010800037839A CN102265213A (zh) | 2009-01-30 | 2010-01-18 | 电子封装和显示装置 |
US13/141,700 US20110255251A1 (en) | 2009-01-30 | 2010-01-18 | Electronic package and display apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009019600 | 2009-01-30 | ||
JP2009-019600 | 2009-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010087240A1 true WO2010087240A1 (ja) | 2010-08-05 |
Family
ID=42395501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/050479 WO2010087240A1 (ja) | 2009-01-30 | 2010-01-18 | 電子パッケージおよび表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110255251A1 (ja) |
CN (1) | CN102265213A (ja) |
WO (1) | WO2010087240A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019120757A (ja) * | 2017-12-28 | 2019-07-22 | 株式会社ジャパンディスプレイ | 表示装置 |
KR20200057855A (ko) * | 2018-11-16 | 2020-05-27 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07231187A (ja) * | 1994-02-16 | 1995-08-29 | Murata Mfg Co Ltd | 回路モジュールのカバー構造 |
JP2005216915A (ja) * | 2004-01-27 | 2005-08-11 | Seiko Epson Corp | 実装構造体、実装構造体の製造方法、電気光学装置および電子機器 |
JP2008009229A (ja) * | 2006-06-30 | 2008-01-17 | Optrex Corp | 表示装置 |
JP2008129046A (ja) * | 2006-11-16 | 2008-06-05 | Hitachi Displays Ltd | 液晶表示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3129206U (ja) * | 2006-11-27 | 2007-02-08 | 船井電機株式会社 | 液晶モジュール |
KR101348247B1 (ko) * | 2007-06-07 | 2014-01-09 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
-
2010
- 2010-01-18 CN CN2010800037839A patent/CN102265213A/zh active Pending
- 2010-01-18 WO PCT/JP2010/050479 patent/WO2010087240A1/ja active Application Filing
- 2010-01-18 US US13/141,700 patent/US20110255251A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07231187A (ja) * | 1994-02-16 | 1995-08-29 | Murata Mfg Co Ltd | 回路モジュールのカバー構造 |
JP2005216915A (ja) * | 2004-01-27 | 2005-08-11 | Seiko Epson Corp | 実装構造体、実装構造体の製造方法、電気光学装置および電子機器 |
JP2008009229A (ja) * | 2006-06-30 | 2008-01-17 | Optrex Corp | 表示装置 |
JP2008129046A (ja) * | 2006-11-16 | 2008-06-05 | Hitachi Displays Ltd | 液晶表示装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110255251A1 (en) | 2011-10-20 |
CN102265213A (zh) | 2011-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100777871B1 (ko) | 백라이트 유닛, 상기 백라이트 유닛이 마련된 표시 장치,및 상기 표시 장치의 제조 방법 | |
JP4581726B2 (ja) | 表示装置および携帯機器 | |
KR101558166B1 (ko) | 광출사 모듈 및 이를 갖는 표시장치 | |
KR100821043B1 (ko) | 연성인쇄회로기판 | |
WO2010021200A1 (ja) | 電子パッケージ、表示装置、および電子機器 | |
US7891858B2 (en) | Display | |
KR100786479B1 (ko) | 평판표시장치 및 이를 이용한 휴대용 표시기기 | |
JP3129206U7 (ja) | ||
WO2015141368A1 (ja) | 表示装置、及びテレビ受信装置 | |
WO2009130955A1 (ja) | 電子パッケージ、表示装置、および電子機器 | |
WO2011148733A1 (ja) | 照明装置、表示装置、及びテレビ受信装置 | |
JP2011095452A (ja) | 液晶表示モジュール | |
WO2009130945A1 (ja) | 電子パッケージ、表示装置、および電子機器 | |
US9250472B2 (en) | Liquid crystal display device | |
US9121988B2 (en) | Back light unit, method of manufacturing the same and liquid crystal display device including the same | |
US8373824B2 (en) | Liquid crystal display device | |
JP5148059B2 (ja) | 液晶表示装置 | |
JP2001117094A (ja) | 液晶表示装置 | |
WO2010087240A1 (ja) | 電子パッケージおよび表示装置 | |
KR101245086B1 (ko) | 백라이트 유닛 및 이를 구비한 액정표시소자 | |
JP6529354B2 (ja) | 光源装置および表示装置 | |
JP2014048322A (ja) | 液晶表示装置 | |
KR100989160B1 (ko) | 액정표시장치 | |
JP4106997B2 (ja) | 表示装置 | |
KR101950841B1 (ko) | 액정 표시장치 및 그 조립방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080003783.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10735709 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13141700 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10735709 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |