WO2010087141A1 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- WO2010087141A1 WO2010087141A1 PCT/JP2010/000373 JP2010000373W WO2010087141A1 WO 2010087141 A1 WO2010087141 A1 WO 2010087141A1 JP 2010000373 W JP2010000373 W JP 2010000373W WO 2010087141 A1 WO2010087141 A1 WO 2010087141A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- earphone jack
- substrate
- electronic device
- interface unit
- rib
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005192 partition Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
- H04M1/6033—Substation equipment, e.g. for use by subscribers including speech amplifiers for providing handsfree use or a loudspeaker mode in telephone sets
- H04M1/6041—Portable telephones adapted for handsfree use
- H04M1/6058—Portable telephones adapted for handsfree use involving the use of a headset accessory device connected to the portable telephone
Definitions
- the present invention relates to an electronic device, and particularly relates to waterproofing in an electronic device in which an opening is provided in a housing.
- An electronic device such as a mobile phone is provided with an interface for connecting to an external device such as an earphone jack or a USB terminal.
- an opening for exposing the connection terminal is provided in the housing. If there is an opening, naturally, there is a possibility that a substance that is harmful to the components provided in the casing of the mobile phone, such as water droplets or dust, may enter from the opening.
- a rubber cover is attached to such an opening portion to prevent intrusion of water droplets or dust from the opening portion when an earphone or a USB cable is not connected.
- An object is to provide an electronic device to be reduced.
- the present invention provides an electronic device including a housing, a board provided inside the housing, and an interface unit disposed on the board, It is characterized by comprising an opening for exposing the interface part, and a partition part provided so as to surround the interface part with the opening as an end.
- the board is a multilayer board, and the connection line connecting the interface unit and other components connects the interface unit and the other components from the interface unit via the inner layer of the board. Also good.
- the partition wall portion may include a support portion formed toward the interface portion.
- the interface unit may be an earphone jack.
- the interface unit may be a USB terminal.
- FIG. 1 is an external view of a mobile phone 100.
- FIG. FIG. 6 is a development view of the lower housing 120. It is an enlarged view of the rib periphery part 123.
- FIG. It is an enlarged view at the time of arrange
- positioning an earphone jack to the enlarged view shown in FIG. 3 is a cross-sectional view of a lower housing 120.
- FIG. 1 is an external view showing the external appearance of the mobile phone 100.
- the mobile phone 100 has an upper housing 110 and a lower housing 120 connected by a hinge 140.
- the lower housing 120 includes an earphone jack 130 exposed from the opening 150 of the upper housing 121.
- an earphone plug (not shown) is inserted into the earphone jack 130, sound is output from the earphone.
- the earphone jack 130 is a round earphone jack.
- the mobile phone 100 does not include a rubber cover that covers the opening 150 where the earphone jack is located.
- the present invention can also be applied to an electronic device such as a mobile phone having such a cover.
- FIG. 2 is an exploded perspective view of the simplified lower housing 120.
- the lower housing 120 is formed by sandwiching a substrate 123 between a first lower housing 121 made of resin and a second lower housing 122 made of resin.
- a first lower housing 121 made of resin
- a second lower housing 122 made of resin.
- the earphone jack 130 is described on the substrate 123, but other components such as a CPU, a capacitor, and a resistor are actually arranged. Further, here, components such as a battery other than those on the substrate 123 are not described.
- the board 123 surrounds the earphone jack 130 together with the board 123.
- ribs 200 are provided.
- the rib 200 functions as a partition wall for preventing the intrusion portion from expanding when a substance such as moisture enters the housing from the earphone jack 130.
- a conventional product having a fitting opening is used as the earphone jack 130.
- FIG. 3 and 4 are enlarged views of the rib peripheral portion 124 of the first lower housing 121 shown in FIG. 2 when viewed from the back.
- FIG. 3 is a diagram illustrating a state where the earphone jack 130 is not provided
- FIG. 4 is a diagram illustrating a state where the earphone jack 130 is disposed.
- 5 is a cross-sectional view of the rib peripheral portion 124 when the mobile phone 100 is viewed from the direction indicated by the arrow A in FIG. 1 and the mobile phone 100 is cut along the line BB ′ in FIG.
- FIG. 3 is a diagram illustrating a state where the earphone jack 130 is not provided
- FIG. 4 is a diagram illustrating a state where the earphone jack 130 is disposed
- 5 is a cross-sectional view of the rib peripheral portion 124 when the mobile phone 100 is viewed from the direction indicated by the arrow A in FIG. 1 and the mobile phone 100 is cut along the line BB ′ in FIG.
- the first lower housing 121 of the mobile phone 100 which is an embodiment of the electronic device according to the present invention, is provided with a rib 200 so as to surround the position where the earphone jack 130 is to be placed. Is provided.
- Ribs are originally provided to increase the rigidity of the housing.
- the first lower housing 121 is designed so that the rib is provided so as to surround the place where the earphone jack 130 is to be installed.
- the casing is created by designating its outer shape, which is already included in the creation man-hours. There will be no increase in production costs.
- the earphone jack 130 includes connection terminals 131 and 132, and the connection terminals 131 and 132 are connected to the substrate 123. More specifically, as shown in FIG. 5, the substrate 123 is a multilayer substrate including a first layer 501, a second layer 502, a third layer 503, and a fourth layer 504, and the connection terminal 131 of the earphone jack 130. Is connected to the second layer 502 via the via 511 and extended to other components. Further, the connection terminal 132 of the earphone jack 130 is connected to the second layer 503 through the via 512 and is extended to other components such as a CPU.
- the earphone jack is connected through the inner layer of the substrate 123, there is no need to form a connection line for connecting the earphone jack and other components on the surface of the substrate 123. It is possible to avoid short circuits caused by Thereby, improvement of the reliability as an apparatus can be further promoted.
- the sub rib 210 protrudes substantially perpendicularly to the rib 200 toward the inner wall, that is, the side on which the earphone jack 130 is placed. 210 is provided so as to be substantially in contact with the earphone jack 130. As a result, even if the user forcibly attaches / detaches the earphone plug to / from the earphone jack 130, the earphone jack 130 is less likely to be shaken. It can prevent as much as possible.
- the mobile phone 100 is formed with the rib 200 so as to surround the earphone jack 130 in the casing, there is a possibility that the internal circuit of the mobile phone such as moisture may be abnormal from the earphone jack 130. Even if certain substances enter, those substances do not enter from the periphery of the earphone jack 130 to other parts on the substrate. As a result, it is possible to obtain the effects of reducing the cost for providing a rubber cover and the number of manufacturing steps, which are conventionally provided.
- the partition wall prevents moisture from penetrating into other parts of the housing. . Since the housing is originally designed to specify its shape when creating an electronic device, it is only necessary to instruct that the partition wall be created so as to surround the interface part at that time. In addition, an electronic device that can reduce the influence on the components inside the housing even when moisture from the interface unit enters without realizing an increase in the number of manufacturing steps can be realized. ⁇ Supplement> In the above embodiment, the method of implementing the present invention has been described, but it goes without saying that the embodiment of the present invention is not limited to this.
- the earphone jack 130 has been described as an example of an interface having a connection terminal to the outside.
- the interface has a connection terminal to the outside.
- a USB terminal, an SD card connection terminal, a charging terminal, or the like may be used.
- the earphone jack 130 is described as a round earphone jack. However, this may be a flat type.
- the substrate 123 has been described as a four-layer substrate in the above embodiment, this may be any number of layers, for example, seven layers.
- the substrate 123 does not have to be a single layer substrate, that is, a multilayer substrate. However, in this case, a connection line between the earphone jack 130 and other parts is provided on the surface of the substrate 123.
- the ribs provided perpendicular to the ribs 200 are referred to as sub-ribs 210 for the sake of convenience, but normally the sub-ribs 210 are also simply referred to as ribs.
- the rib 200 is extended to contact with the substrate 123.
- the end of the stretched rib 200 may be adhered to the substrate 123 to improve its sealing performance.
- the end of the rib 200 may not be completely in close contact with the substrate 123 as long as a waterproof effect that prevents a minimum amount of moisture from entering is obtained.
- a mobile phone has been described as an example of an electronic device.
- an external connection terminal such as an earphone jack is provided, and an opening for exposing the connection terminal to the housing is provided.
- Any electronic device may be used, not limited to a mobile phone, and may be a PDA (Personal Digital Assistants), for example.
- the sub-rib 210 protrudes substantially perpendicular to the rib 200, but the angle of the sub-rib 210 with respect to the rib 200 may be an angle other than vertical, and is an appropriate angle in design. May be.
- the electronic apparatus according to the present invention can be used as an electronic apparatus that can prevent the influence of moisture or the like entering the apparatus having a connection terminal to the outside without using a cover or the like to the circuit.
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
<補足>
上記実施の形態において、本発明の実施の手法について説明してきたが、本発明の実施形態がこれに限られないことは勿論である。以下、上記実施形態以外に本発明として含まれる各種の変形例について説明する。
(1)上記実施の形態においては、外部への接続端子を備えるインターフェースとして、イヤホンジャック130を例に説明したが、インターフェースとしては外部への接続端子を備えており、そのために筐体に開口部を備えることになるものであればよく、例えば、USB端子、SDカード接続端子あるいは充電端子などであってもよい。
(2)上記実施の形態においては、基板123を4層基板として説明したが、これは、何層であってもかまわず、例えば7層であってもかまわない。
(3)上記実施の形態においては、便宜上区別するために、リブ200に対して垂直に設けられているリブをサブリブ210と呼称したが、通常はこのサブリブ210も単にリブと呼称される。
(4)上記実施の形態において、リブ200は、基板123に接するあたりまで延伸することとした。
(5)上記実施の形態においては、電子機器の一例として携帯電話機を例に説明してきたが、イヤホンジャック等の外部への接続端子を備え、筐体に接続端子を露出させるための開口部を備える電子機器であればよく、携帯電話機に限らず、例えばPDA(Personal Digital Assistants)などであってもよい。
(6)上記実施の形態においては、サブリブ210はリブ200に対して略垂直に突出させることとしたが、サブリブ210のリブ200に対する角度は垂直以外の角度でもよく、設計上適宜な角度であっても良い。
110 上部筐体
120 下部筐体
121 第1下部筐体
122 第2下部筐体
123 基板
130 イヤホンジャック(インターフェース部)
131、132 接続端子
140 ヒンジ部
150 開口部
200 リブ(隔壁部)
210 サブリブ(支持部)
Claims (5)
- 筐体と、
前記筐体内部に設けられた基板と、
前記基板上に配されたインターフェース部とを備える電子機器であって、
前記筐体は、前記インターフェース部を露出させるための開口部と、
前記開口部を端とし、前記インターフェース部を囲うように設けられている隔壁部とを備える
ことを特徴とする電子機器。 - 前記基板は多層基板であり、
前記インターフェース部と他の部品を接続する接続線は、前記インターフェース部から前記基板の内層を経由して前記インターフェース部と前記他の部品とを接続する
ことを特徴とする請求項1記載の電子機器。 - 前記隔壁部は、前記インターフェース部に向けて形成された支持部を備える
ことを特徴とする請求項2記載の電子機器。 - 前記インターフェース部は、イヤホンジャックである
ことを特徴とする請求項1記載の電子機器。 - 前記インターフェース部は、USB端子である
ことを特徴とする請求項1記載の電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/146,628 US8767406B2 (en) | 2009-01-28 | 2010-01-22 | Electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009016730A JP2010177880A (ja) | 2009-01-28 | 2009-01-28 | 電子機器 |
JP2009-016730 | 2009-01-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010087141A1 true WO2010087141A1 (ja) | 2010-08-05 |
Family
ID=42395406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/000373 WO2010087141A1 (ja) | 2009-01-28 | 2010-01-22 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8767406B2 (ja) |
JP (1) | JP2010177880A (ja) |
KR (1) | KR20110119752A (ja) |
WO (1) | WO2010087141A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5680474B2 (ja) | 2011-04-26 | 2015-03-04 | 京セラ株式会社 | ジャックを具えた電子機器 |
KR20130042158A (ko) * | 2011-10-18 | 2013-04-26 | 삼성전자주식회사 | 휴대 단말기의 장신구 고정 장치 |
CN103140086A (zh) * | 2011-12-02 | 2013-06-05 | 富泰华工业(深圳)有限公司 | 电子装置壳体及其制造方法 |
US20130140966A1 (en) * | 2011-12-06 | 2013-06-06 | Htc Corporation | Mobile devices with mechanically bonded connector assemblies and methods for forming such mobile devices |
KR101892132B1 (ko) * | 2012-02-24 | 2018-08-27 | 삼성전자주식회사 | 휴대 단말기에서 이어 잭 방수 장치 |
KR101946321B1 (ko) * | 2012-05-02 | 2019-02-11 | 삼성전자주식회사 | 전자 기기의 침수 라벨 장치 |
CN103633481A (zh) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | 电连接器组件及具有该电连接器组件的电子装置 |
KR101966259B1 (ko) * | 2012-10-11 | 2019-04-05 | 삼성전자주식회사 | 전자 기기의 실링 장치 |
WO2014110113A2 (en) * | 2013-01-08 | 2014-07-17 | Hzo, Inc. | Apparatuses, systems, and methods for reducing power to ports of electronic devices |
US9258921B1 (en) * | 2013-03-07 | 2016-02-09 | Amazon Technologies, Inc. | Systems and methods for securing electrical receptacles in a user device |
CN106302946A (zh) * | 2015-05-12 | 2017-01-04 | 中兴通讯股份有限公司 | 一种耳机、终端以及音频处理方法 |
CN205945885U (zh) * | 2016-07-26 | 2017-02-08 | 深圳市汤姆拓客科技有限公司 | 用于固定配件的独立式手机夹页 |
JP6464462B2 (ja) | 2016-10-31 | 2019-02-06 | 富士通クライアントコンピューティング株式会社 | 端末装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284855A (ja) * | 1997-04-04 | 1998-10-23 | Nitsuko Corp | 電気機器用筐体における防水装置 |
JP2002534814A (ja) * | 1998-12-30 | 2002-10-15 | エリクソン インコーポレイテッド | 電子部品用の簡単なエンクロージャ |
JP2006162738A (ja) * | 2004-12-03 | 2006-06-22 | Konica Minolta Photo Imaging Inc | 携帯電話機及びストロボ装置 |
JP2007216836A (ja) * | 2006-02-16 | 2007-08-30 | Denso Corp | 車載用電子機器回路モジュール |
JP2008072616A (ja) * | 2006-09-15 | 2008-03-27 | Kyocera Corp | 携帯端末 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919052A (en) * | 1998-01-08 | 1999-07-06 | Ho; Ching-Chih | Earphone jack |
JP3927725B2 (ja) | 1999-04-09 | 2007-06-13 | 松下電器産業株式会社 | イヤホンジャック防水構造を備えた携帯用無線機並びに携帯用無線機のイヤホンジャック防水方法 |
JP2003324783A (ja) * | 2002-05-02 | 2003-11-14 | Mitsubishi Electric Corp | 差込口の配設構造および携帯装置 |
CN2809973Y (zh) * | 2005-06-29 | 2006-08-23 | 富士康(昆山)电脑接插件有限公司 | 电源连接器 |
CN2862395Y (zh) * | 2005-10-21 | 2007-01-24 | 富士康(昆山)电脑接插件有限公司 | 插座连接器 |
-
2009
- 2009-01-28 JP JP2009016730A patent/JP2010177880A/ja active Pending
-
2010
- 2010-01-22 US US13/146,628 patent/US8767406B2/en not_active Expired - Fee Related
- 2010-01-22 WO PCT/JP2010/000373 patent/WO2010087141A1/ja active Application Filing
- 2010-01-22 KR KR1020117019757A patent/KR20110119752A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284855A (ja) * | 1997-04-04 | 1998-10-23 | Nitsuko Corp | 電気機器用筐体における防水装置 |
JP2002534814A (ja) * | 1998-12-30 | 2002-10-15 | エリクソン インコーポレイテッド | 電子部品用の簡単なエンクロージャ |
JP2006162738A (ja) * | 2004-12-03 | 2006-06-22 | Konica Minolta Photo Imaging Inc | 携帯電話機及びストロボ装置 |
JP2007216836A (ja) * | 2006-02-16 | 2007-08-30 | Denso Corp | 車載用電子機器回路モジュール |
JP2008072616A (ja) * | 2006-09-15 | 2008-03-27 | Kyocera Corp | 携帯端末 |
Also Published As
Publication number | Publication date |
---|---|
KR20110119752A (ko) | 2011-11-02 |
US8767406B2 (en) | 2014-07-01 |
JP2010177880A (ja) | 2010-08-12 |
US20110279987A1 (en) | 2011-11-17 |
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