WO2010071278A1 - Wafer transfer unit and probe station including the same - Google Patents

Wafer transfer unit and probe station including the same Download PDF

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Publication number
WO2010071278A1
WO2010071278A1 PCT/KR2009/002676 KR2009002676W WO2010071278A1 WO 2010071278 A1 WO2010071278 A1 WO 2010071278A1 KR 2009002676 W KR2009002676 W KR 2009002676W WO 2010071278 A1 WO2010071278 A1 WO 2010071278A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
unit
transfer arm
transfer
rotary chuck
Prior art date
Application number
PCT/KR2009/002676
Other languages
English (en)
French (fr)
Inventor
Jeon-Ho Jin
Ki-Uk Choi
Jin-Yung Jung
In-Wook Hwang
Woo-Yeol Kim
Chan-Wook Hwang
Original Assignee
Secron Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secron Co., Ltd. filed Critical Secron Co., Ltd.
Publication of WO2010071278A1 publication Critical patent/WO2010071278A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Definitions

  • the present invention relates to a wafer transfer unit and a probe station including the wafer transfer unit. More particularly, the present invention relates to a wafer transfer unit for transferring a wafer from a cassette in which the wafer is received to a chuck, and a probe station including the wafer transfer unit.
  • a probe station includes a loading unit and a probing unit.
  • the loading unit transfers a wafer on which a plurality of chips is formed and pre-aligns the wafer.
  • the probing unit receives the wafer from the loading unit and electrically connects the chips with a tester to test electrical characteristics of the chips.
  • the loading unit picks up the wafer from a cassette in which a plurality of wafers is sequentially stacked and transfers the wafer to the probing unit.
  • the probing unit includes a chuck and an aligner.
  • the chuck moves in x-y-z directions and rotates to direct the wafer toward a probe card through which the chips each are electrically connected to a tester.
  • the aligner may adjust the position of the wafer while the chuck supports the wafer in order to match positions of both wafer and the probe card.
  • CMOS complementary metal-oxide semiconductor
  • CIS complementary metal-oxide semiconductor
  • Example embodiments of the present invention provide a wafer transfer unit capable of efficiently removing particles from a wafer.
  • example embodiments of the present invention provide a probe station including the wafer transfer unit and capable of removing particles from a wafer.
  • a wafer transfer unit includes a rotary chuck, a transfer arm positioned over the rotary chuck, the transfer arm transferring a wafer, a driving part positioned under the rotary chuck, the driving part linearly moving the transfer arm and a cover covering the rotary chuck and the transfer arm, the cover including a first opening formed therethrough such that a cleaning gas flows downward toward the wafer.
  • the driving part may include a motor rotatably secured to a lower face of the rotary plate, a driving pulley mechanically engaged with the motor, a driven pulley rotatably mounted to a lower face of the rotary plate and a driving belt combining the driven pulley with the driving pulley, and the driving belt being coupled to the transfer arm to linearly move the transfer arm.
  • the wafer transfer unit may further include a sensing plate interposed between the rotary plate and the cover, the sensing plate including a mapping sensor sensing a wafer positioned in a cassette configured to determine the existence of the wafer in the cassette.
  • the sensing plate may include a second opening formed adjacent to the first opening such that the cleaning gas smoothly flows toward the wafer.
  • the wafer transfer unit may further include an ionizer disposed on an edge portion of the sensing plate, the ionizer removing electrostatic charges between the wafer and particles.
  • a probe station includes a stage unit having a test space for testing a plurality of chips formed on a wafer, a loading unit providing the wafer for the stage unit, a gas supplying unit disposed over the loading unit, the gas supplying unit supplying a cleaning gas for the loading unit and a gas discharging unit disposed under the loading unit, the gas discharging unit discharging the cleaning gas downwardly, wherein the loading unit includes a rotary chuck, a transfer arm positioned over the rotary chuck, the transfer arm transferring a wafer to/from the stage unit, a driving part positioned under the rotary chuck, the driving part linearly moving the transfer arm and a cover covering the rotary chuck and the transfer arm, the cover including a first opening formed therethrough such that the cleaning gas flows downward toward the wafer.
  • an opening is formed through a cover such that the cleaning gas smoothly flows to effectively the particles from the wafer.
  • a transfer arm is positioned over a rotary chuck and a first driving part for driving the transfer arm is positioned under the rotary chuck, particles which may be generated during an operation of the first driving part may be prevented from adhering to the wafer which is supported by the transfer arm due to a downstream of the cleaning gas.
  • an ionizer may remove electrostatic charges combining both a surface of the wafer and particles which remain on the wafer to cause a combining force between the wafer and the particles to decrease, such that the cleaning gas may effectively eliminate the particles from the wafer.
  • FIG. 1 is a perspective view illustrating a wafer transfer unit in accordance with an example embodiment of the present invention
  • FIG. 2 is a cross-sectional view illustrating the transfer arm in FIG. 1;
  • FIG. 3 is a cross-sectional view illustrating the cover in FIG. 1;
  • FIG. 4 is a perspective view illustrating a probe station in accordance with an example embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating the loading unit in FIG. 4.
  • first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
  • a first thin film could be termed a second thin film, and, similarly, a second thin film could be termed a first thin film without departing from the teachings of the disclosure.
  • relative terms such as “lower” or “bottom” and “upper” or “top” may be used herein to describe one element's relationship to other elements as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower,” can therefore, encompass both an orientation of “lower” and “upper” depending on the particular orientation of the figure.
  • Example embodiments of the present invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments of the present invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat may, typically, have rough and/or nonlinear features. Moreover, sharp angles that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present invention.
  • FIG. 1 is a perspective view illustrating a wafer transfer unit in accordance with an example embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating a transferring arm in FIG. 1.
  • FIG. 3 is a cross-sectional view illustrating the cover in FIG. 1.
  • a wafer transfer unit 100 in accordance with example embodiments of the present invention includes a rotary plate 110, a transfer arm 120, a first driving part 130 and a cover 150.
  • the rotary plate 110 may be rotatable. For example, while the rotary plate 110 rotates, the wafer transfer unit 100 may transfer a wafer between a cassette (not shown) in which the wafer is received and a chuck (not shown) supporting the wafer.
  • the rotary plate 110 may include a third opening 115 formed through the rotary plate 110 such that a cleaning gas rapidly flows through the third opening 115.
  • the rotary plate 110 may include a guide member (not shown) to guide the transfer arm 120 for linear motion.
  • the guide member may correspond to a fourth opening (not shown) formed through the rotary plate 110.
  • the transfer arm 120 is disposed over the rotary plate 110.
  • the transfer arm 120 may pick up the wafer positioned in the cassette and may transfer the wafer to a predetermined positions.
  • the predetermined position may include one of positions located on the chuck.
  • the transfer arm 120 may include a first arm 121, a second arm 122 and a connection part 123 connecting the first and the second arms 121 and 122 to the first driving part 130.
  • the first and the second arm 121 and 122 may pick up the wafer disposed on the cassette or the chuck.
  • the connection part 123 may move along the fourth opening formed through the rotary plate 110.
  • the first driving part 130 is positioned under the rotary plate 11.
  • the first driving part 130 may drive the transfer arm 120 to move linearly toward the cassette.
  • the first driving part 130 may include a motor 131, a driving pulley 133, a driven pulley 135 and a driving belt 137.
  • the motor 131 is disposed under the rotary plate 110.
  • the driving pulley 133 is engaged with the motor 131 to rotate as the motor 131 rotates.
  • the driving belt 137 connects the driving pulley 133 with the driven pulley 135. Further, the driving belt 137 is connected to the transfer arm 120. Thus, since the driving belt 137 rotates, the transfer arm 120 may move linearly.
  • the cover 150 is positioned over the rotary plate 110 and the transfer arm 120.
  • the cover 150 covers the rotary plate 110 and the transfer arm 120.
  • the cover 150 may prevent particles from approaching the wafer positioned on the transfer arm 120.
  • the cover 150 may include a first opening 155 therethrough such that the cleaning gas flows through the first opening 155.
  • the wafer disposed on the transfer arm 120 may be prevented from being contaminated by particles which may be generated during an operation of the first driving part 130, while the cleaning gas flows downward from an upper portion of the rotary plate 110 toward the lower portion of the rotary plate 110.
  • the wafer transfer unit 110 may further include a sensing plate 160, a mapping sensor 165 and an ionizer 170.
  • the sensing plate 160 is positioned between the rotary plate 110 and the cover 150.
  • the sensing plate 160 may be disposed in parallel with the rotary plate 110.
  • the sensing plate 160 may have an arc shape.
  • a combining member 161 may combine the sensing plate 160 with the rotary plate 110.
  • the mapping sensor 165 is movably disposed under a lower face of the sensing plate 160.
  • the mapping sensor 165 may move linearly.
  • the mapping sensor 165 may move forwardly away from an edge of the sensing plate 160 such that the mapping sensor 165 may sense the wafer positioned in the cassette to determine the existence of the wafer in the cassette.
  • the wafer transfer unit 100 may further include a second driving part (not shown) for moving the mapping sensor 165.
  • the second driving part is positioned on the sensing plate 160.
  • the second driving part may include a linear motion guider (not shown) and a cylinder (not shown).
  • the ionizer 170 is disposed on a lower surface of the sensing plate 160.
  • the ionizer is positioned toward the transfer arm 120 supporting the wafer.
  • the ionizer 170 is disposed along an edge portion of the sensing plate 160 having the arc shape.
  • the ionizer 170 may remove electrostatic charges which may be generated between the wafer and particles which remain on the wafer to cause a combining force between the wafer and the particles to decrease. Thus, when the cleaning gas is downwardly introduced onto the wafer, the particles may be efficiently removed from the wafer.
  • a second opening 163 may be formed through the sensing plate 160.
  • the second opening 163 is formed at a position facing the first opening 155 such that the cleaning gas may flow through the first and the second opening 155 and 163.
  • the wafer transfer unit 100 may further include a third driving part 140 to rotate the rotary plate 110.
  • the third driving part 140 may, in one example embodiment, include a rotary motor 141 and a rotary axis connecting the rotary motor 141 to the rotary plate 110.
  • the third driving part 140 may include a rotary axis (not shown) extending downward from the rotary plate 110, a rotary motor (not shown) and a belt connecting the rotary axis to the rotary motor.
  • FIG. 4 is a perspective view illustrating a probe station in accordance with an example embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating the loading unit in FIG. 4.
  • a probe station 200 in accordance with example embodiments of the present invention includes a stage unit 210, a loading unit 220, a first gas supplying unit and a first gas discharging unit 240.
  • the probe station 200 may electrically connect a plurality of chips formed on a wafer to a tester (not shown) via a probe card (not shown) to apply electrical signals to the chips and to determine whether each of the chips is good or bad.
  • the stage unit 210 provides a test space 215 for testing electrical characteristics of the chips formed on the wafer.
  • the stage unit 210 may include a chuck 211, a stage 213 and a second cover 215.
  • the chuck 211 supports the wafer.
  • the stage 213 is positioned under the chuck 211.
  • the stage 213 is connected to the chuck 211 such that the chuck 211 moves when the stage 213 moves.
  • the second cover 215 covers a sidewall of the chuck 211 and a sidewall of the stage 213.
  • the second cover 215 may have a streamlined shape.
  • the second cover 215 may allow a cleaning gas introduced from one side of the probe station 200 to smoothly flow toward another side of the probe station 200.
  • the chuck 211 is positioned in the test space 215.
  • the chuck 211 may secure the wafer using a vacuum force.
  • the stage unit 210 may further include a plurality of lift pins (not shown) to ascend/descend through the chuck 211 to support the wafer transferred by the loading unit 220. Further, the stage unit 210 may include a vacuum pump (not shown) generating a vacuum force, a vacuum line (not shown) communicating with the vacuum pump, and a vacuum hole (not shown) formed through the chuck 211 to be connected with the vacuum line such that the chuck 211 may secure the wafer using the vacuum force.
  • the stage 213 is positioned under the chuck 211.
  • the stage 213 is connected to the chuck 211 such that the chuck 211 may move as the stage 213 moves.
  • the stage unit 210 may further include a driving source (not shown) to be connected to the stage 213.
  • the driving source includes a cylinder, a linear motor, a ball screw, etc.
  • the second cover 215 covers a sidewall of the stage 213.
  • the second cover 215 may prevent particles which may be generated in an operation of the stage 213 from drifting into the test space 215.
  • the second cover 215 may have a streamlined shape to cover the sidewall of the stage 213.
  • a flow resistance of the cleaning air which is introduced in the test space 215 may decrease such that the cleaning air flows smoothly.
  • the loading unit 220 is positioned adjacent to the stage unit 210.
  • the loading unit 220 is mounted to the stage unit 210 in a docking manner which is attachable and detachable between the stage unit 210 and the loading unit 220.
  • the loading unit 220 may load the wafer from a cassette 20 in which the wafer is stacked to the stage unit 210.
  • the loading unit 220 may include a load port 221, a transfer part 222 and a control part 223.
  • the load port 221 supports the cassette 20 in which a plurality of wafers is sequentially stacked.
  • the transfer part 222 may include a transfer arm (not shown) for transferring the wafer from the cassette 20 to the stage unit 210.
  • the control part 223 may include wirings and electric circuits for controlling the transfer part 222.
  • the load port 221, the transfer part 222 and the control part 223 may be arranged in a row.
  • the loading unit 220 further includes a rotary plate 110, a transfer arm 120, a first driving part 130 and a first cover 150.
  • the rotary plate 110, the transfer arm 120, the first driving part 130 and the first cover 150 are each the same as those included in the wafer transfer unit 100 with reference to the FIGS. 1 to 3. Any further explanation on the same elements will be omitted.
  • the loading unit 220 may further include a shutter 229.
  • the shutter 229 may be formed between the load port 221 and the transfer part 222 to isolate the transfer part 222 from the load port 221.
  • the shutter 229 may move vertically or horizontally.
  • the transfer arm 120 may load or unload the wafer between the cassette 20 positioned on the load port 221 and the transfer part 222 while the shutter 229 is open.
  • the transfer arm 120 may stop operating while the shutter 229 is closed.
  • particles which remain in the cassette 20 may be prevented from drifting into the transfer part 222.
  • the loading unit 220 may further include a third cover 226 covering the control part 223 having the wirings and electrical circuits.
  • the third cover 226 may guide the cleaning gas to flow downward toward the control part 223 to direct the cleaning gas into the transfer part 222.
  • the cleaning gas which is introduced into the loading unit 220 may be intensively provided onto the wafer positioned on the chuck 221 to effectively remove the particles which remain on the wafer.
  • the loading unit 220 may further include a buffer part 227 disposed under the control part 223 and a fourth cover 228 isolating the transfer part 222 from the buffer part 227.
  • the buffer part 227 may include a first table (not shown) for supporting a wafer utilized for polishing tips of a probe card and a second table (not shown) for supporting a tested wafer.
  • the fourth cover 228 is interposed between the buffer part 227 and the transfer part 222.
  • the fourth cover 228 may isolate the buffer part 227 from the transfer part 222 such that particles which remain in the buffer part 227 may be prevented from drifting into the transfer part 222. Further, the fourth cover 228 may prevent the cleaning gas flowing downward from entering into the buffer part 227 to efficiently drain out the cleaning gas.
  • the loading unit 220 may further include a preliminary aligner 225 for pre-aligning the wafer.
  • the preliminary aligner 225 may be, for example, is positioned under the load port 221.
  • the preliminary aligner 225 may include a subsidiary chuck (not shown) for pre-aligning the wafer and an information reader (not shown) for reading identification information of the wafer such as an optical character reader and a bar code reader.
  • a cleaning gas flows downward to remove particles from a wafer
  • an opening is formed through a cover such that the cleaning gas smoothly flows to effectively the particles from the wafer.
  • a transfer arm is positioned over a rotary chuck and a first driving part for driving the transfer arm is positioned under the rotary chuck, particles which may be generated during an operation of the first driving part may be prevented from adhering to the wafer which is supported by the transfer arm.
  • an ionizer may remove electrostatic charges which may be generated between the wafer and particles which remain on the wafer to cause a combining force between the wafer and the particles to decrease such that the cleaning gas may effectively eliminate the particles from the wafer.
  • a cleaning gas flows downward to remove particles from a wafer
  • an opening is formed through a cover such that the cleaning gas smoothly flows to effectively remove the particles from the wafer.
  • a transfer arm is positioned over a rotary chuck and a first driving part for driving the transfer arm is positioned under the rotary chuck, particles which may be generated during an operation of the first driving part may be prevented from adhering to the wafer which is supported by the transfer arm.
  • an ionizer may remove electrostatic charges which may be generated between the wafer and particles which remain on the wafer to cause a combining force between the wafer and the particles to decrease, such that the cleaning gas may effectively eliminate the particles from the wafer.
  • the present invention may be employed in a probe station for testing electrical characteristics of a wafer.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PCT/KR2009/002676 2008-12-19 2009-05-21 Wafer transfer unit and probe station including the same WO2010071278A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080129885A KR101541538B1 (ko) 2008-12-19 2008-12-19 웨이퍼 이송 유닛 및 이를 포함하는 프로브 스테이션
KR10-2008-0129885 2008-12-19

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WO2010071278A1 true WO2010071278A1 (en) 2010-06-24

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PCT/KR2009/002676 WO2010071278A1 (en) 2008-12-19 2009-05-21 Wafer transfer unit and probe station including the same

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KR (1) KR101541538B1 (zh)
TW (1) TWI460115B (zh)
WO (1) WO2010071278A1 (zh)

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Publication number Priority date Publication date Assignee Title
KR101503143B1 (ko) * 2013-01-31 2015-03-18 세메스 주식회사 프로브 카드의 반송 방법

Citations (5)

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Publication number Priority date Publication date Assignee Title
KR940005476B1 (ko) * 1989-05-18 1994-06-20 대우전자 주식회사 전자펌프용 원형 필터망 제조방법
JPH06198589A (ja) * 1992-12-28 1994-07-19 Hitachi Ltd カバー付搬送ロボット
JPH0997825A (ja) * 1995-07-26 1997-04-08 Fujitsu Ltd 基板搬送装置と基板処理システム及び基板搬送方法と半導体装置の製造方法
KR20020047196A (ko) * 1999-09-30 2002-06-21 리차드 로브그렌 제어된 소규모주변부를 갖춘 웨이퍼의 대기중이송모듈
JP2004228576A (ja) * 2003-01-24 2004-08-12 Samsung Electronics Co Ltd 基板加工装置

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US6690993B2 (en) * 2000-10-12 2004-02-10 R. Foulke Development Company, Llc Reticle storage system
JP3950299B2 (ja) * 2001-01-15 2007-07-25 東京エレクトロン株式会社 基板処理装置及びその方法
JP3983481B2 (ja) 2001-01-31 2007-09-26 東京エレクトロン株式会社 基板処理装置及び基板処理装置における基板搬送方法
JP4369851B2 (ja) * 2004-11-01 2009-11-25 株式会社ダイヘン 直線移動機構およびこれを用いた搬送ロボット
WO2008078939A1 (en) * 2006-12-27 2008-07-03 Secron Co., Ltd. Probe station, and testing method of wafer using the same

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
KR940005476B1 (ko) * 1989-05-18 1994-06-20 대우전자 주식회사 전자펌프용 원형 필터망 제조방법
JPH06198589A (ja) * 1992-12-28 1994-07-19 Hitachi Ltd カバー付搬送ロボット
JPH0997825A (ja) * 1995-07-26 1997-04-08 Fujitsu Ltd 基板搬送装置と基板処理システム及び基板搬送方法と半導体装置の製造方法
KR20020047196A (ko) * 1999-09-30 2002-06-21 리차드 로브그렌 제어된 소규모주변부를 갖춘 웨이퍼의 대기중이송모듈
JP2004228576A (ja) * 2003-01-24 2004-08-12 Samsung Electronics Co Ltd 基板加工装置

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KR101541538B1 (ko) 2015-08-04
TW201024194A (en) 2010-07-01
KR20100071243A (ko) 2010-06-29
TWI460115B (zh) 2014-11-11

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