WO2010064505A1 - Electronic component - Google Patents
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- WO2010064505A1 WO2010064505A1 PCT/JP2009/068382 JP2009068382W WO2010064505A1 WO 2010064505 A1 WO2010064505 A1 WO 2010064505A1 JP 2009068382 W JP2009068382 W JP 2009068382W WO 2010064505 A1 WO2010064505 A1 WO 2010064505A1
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- WIPO (PCT)
- Prior art keywords
- coil
- magnetic
- electronic component
- layer
- magnetic layers
- Prior art date
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- 230000005291 magnetic effect Effects 0.000 claims abstract description 89
- 230000035699 permeability Effects 0.000 claims abstract description 27
- 238000003475 lamination Methods 0.000 claims abstract 2
- 239000012212 insulator Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 description 45
- 239000000919 ceramic Substances 0.000 description 27
- 239000000843 powder Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 229910000859 α-Fe Inorganic materials 0.000 description 11
- 230000007423 decrease Effects 0.000 description 9
- 229910000480 nickel oxide Inorganic materials 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000005094 computer simulation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
Definitions
- the present invention relates to an electronic component, and more particularly, to an electronic component having a coil incorporated in a laminated body.
- a multilayer inductor described in Patent Document 1 As a conventional electronic component incorporating a coil, for example, a multilayer inductor described in Patent Document 1 is known.
- a coil composed of a plurality of coil patterns is incorporated in a multilayer body composed of magnetic layers.
- the nonmagnetic layer is provided so as to intersect the coil axis inside the coil.
- the multilayer inductor since the nonmagnetic material layer is provided, the magnetic flux density in the multilayer body is reduced. As a result, even if the direct current flowing through the multilayer inductor is increased, magnetic saturation is less likely to occur in the multilayer body, and a sudden decrease in inductance value due to magnetic saturation is less likely to occur. That is, the DC superimposition characteristic of the multilayer inductor is improved.
- the multilayer inductor described in Patent Document 1 may be used in, for example, a DC-DC converter in an electronic device such as a mobile phone.
- a multilayer inductor when a relatively small DC current flows through the coil, a large inductance value can be obtained, and even if a relatively large DC current flows through the coil, the inductance value does not rapidly decrease. DC superposition characteristics are required.
- an object of the present invention is to obtain a large inductance value when a relatively small DC current flows through the coil, and the inductance value rapidly decreases even when a relatively large DC current flows through the coil. It is to provide an electronic component having a direct current superimposition characteristic.
- An electronic component includes a laminated body in which a plurality of first insulator layers are laminated, and a coil having a coil shaft that is built in the laminated body and extends in the laminating direction. And the laminate has a lower magnetic permeability than the first insulator layer, and is provided in the laminate so as to intersect the coil axis. And a high magnetic permeability that is higher than that of the first insulator layer and that is provided on each of the upper side and the lower side in the stacking direction of the second insulator layer inside the coil. And a portion.
- the present invention when a relatively small DC current is flowing through the coil, a large inductance value is obtained, and even if a relatively large DC current flows through the coil, the inductance value does not rapidly decrease. Superimposition characteristics can be obtained.
- FIG. 2 is a cross-sectional structural view taken along line AA of the electronic component in FIG. It is the graph which showed the result of computer simulation. It is the perspective view which showed the manufacturing process of the ceramic green sheet which should become a magnetic body layer.
- FIG. 6 is a cross-sectional structure view taken along the line AA of an electronic component according to another embodiment.
- FIG. 1 is a perspective view of electronic components 10a and 10b according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a according to the first embodiment.
- FIG. 3 is a sectional structural view taken along the line AA of the electronic component 10a of FIG.
- the stacking direction of the electronic component 10a is defined as the z-axis direction
- the direction along the long side of the electronic component 10a is defined as the x-axis direction
- the direction along the short side of the electronic component 10a is defined as the y-axis direction.
- the x axis, the y axis, and the z axis are orthogonal to each other.
- the electronic component 10a includes a laminate 12a and external electrodes 14a and 14b as shown in FIG.
- the laminated body 12a has a rectangular parallelepiped shape and incorporates a coil L.
- the external electrodes 14a and 14b are each electrically connected to the coil L, and are provided so as to cover the side surfaces located at both ends in the x-axis direction.
- the laminated body 12a is formed by laminating magnetic layers (insulator layers) 16a to 16k and a nonmagnetic layer (insulator layer) 17. Furthermore, the laminated body 12a includes a high magnetic permeability portion 19 (see FIG. 3) described later.
- the magnetic layers 16a to 16k are made of ferromagnetic ferrite (for example, Ni—Zn—Cu ferrite).
- the nonmagnetic layer 17 is made of a material having a lower magnetic permeability than the magnetic layers 16a to 16k. In the present embodiment, the nonmagnetic layer 17 is made of nonmagnetic ferrite (for example, Zn—Cu ferrite).
- the nonmagnetic layer 17 is provided in the stacked body 12a, and more specifically, is provided between the magnetic layer 16e and the magnetic layer 16f.
- the magnetic layers 16a to 16k are constituted by eleven magnetic layers, but the total number of the magnetic layers 16a to 16k is not limited to this. Further, only one nonmagnetic layer 17 is provided, but two or more layers may be provided.
- an alphabet is appended to the reference symbol, and when referring to these, the alphabet after the reference symbol is omitted.
- the coil L is a spiral coil that advances in the z-axis direction while rotating as shown in FIG. That is, the coil axis X of the coil L extends along the z-axis direction as shown in FIG. In the present embodiment, the coil axis X is parallel to the z-axis direction. Thereby, the nonmagnetic layer 17 intersects the coil axis X. As shown in FIG. 2, the coil L includes coil conductors 18a to 18f and via-hole conductors b1 to b5.
- the coil conductors 18a to 18f are provided on the main surfaces of the magnetic layers 16d and 16e, the nonmagnetic layer 17, and the magnetic layers 16f to 16h, respectively.
- Each of the coil conductors 18a to 18f is made of a conductive material made of Ag, has a length of 7/8 turns, and is arranged so as to overlap each other in the z-axis direction.
- the coil L constituted by the coil conductors 18a to 18f forms a rectangular ring when viewed in plan from the z-axis direction.
- the length of the coil conductors 18a to 18f is not limited to 7/8 turns.
- each of the via-hole conductors b1 to b5 is provided so as to penetrate the magnetic layers 16d and 16e, the nonmagnetic layer 17, and the magnetic layers 16f and 16g in the z-axis direction.
- the via-hole conductors b1 to b5 function as connecting portions that connect the ends of the adjacent coil conductors 18 when the magnetic layers 16a to 16k and the nonmagnetic layer 17 are laminated. More specifically, the via-hole conductor b1 connects the end of the coil conductor 18a where the lead-out portion 20a is not provided and the end of the coil conductor 18b.
- the via-hole conductor b2 connects the end of the coil conductor 18b to which the via-hole conductor b1 is not connected and the end of the coil conductor 18c.
- the via hole conductor b3 connects the end of the coil conductor 18c to which the via hole conductor b2 is not connected and the end of the coil conductor 18d.
- the via-hole conductor b4 connects the end of the coil conductor 18d to which the via-hole conductor b3 is not connected and the end of the coil conductor 18e.
- the via-hole conductor b5 includes an end of the coil conductor 18e that is not connected to the via-hole conductor b4, and an end of the coil conductor 18f that is not provided with the lead-out portion 20b. Is connected. Thereby, the coil conductors 18a to 18f and the via-hole conductors b1 to b5 constitute a spiral coil L.
- the high magnetic permeability portion 19 has a higher magnetic permeability than the magnetic layer 16 and, as shown in FIGS. 2 and 3, the z-axis direction so as to cross the non-magnetic layer 17 inside the coil L. It is provided to extend. As shown in FIGS. 2 and 3, the high magnetic permeability portion 19 has a coil axis within a rectangular region formed by being surrounded by the coil conductors 18a to 18f when viewed in plan from the z-axis direction. X is provided so as to overlap with X.
- the high magnetic permeability portion 19 is composed of magnetic layers 19d to 19i. As shown in FIG.
- the magnetic layers 19d to 19i are respectively magnetic layers 16d and 16e and nonmagnetic layer 17 in regions surrounded by the coil conductors 18a to 18f when viewed in plan from the z-axis direction. And the magnetic layers 16f to 16h are provided so as to penetrate in the z-axis direction. Then, the magnetic layers 16a to 16k and the nonmagnetic layer 17 are laminated, so that the magnetic layers 19d to 19i constitute a prismatic high permeability portion 19.
- an alphabet is appended to the reference symbol, and when these are collectively referred to, the alphabet after the reference symbol is omitted. .
- each of the coil conductors 18a and 18f has lead portions 20a and 20b at the ends thereof.
- the lead portions 20a and 20b are drawn to the side surfaces of the multilayer body 12a and connected to the external electrodes 14a and 14b, respectively. Thereby, the coil L is connected to the external electrodes 14a and 14b.
- the electronic component 10a configured as described above has a large inductance value when a relatively small DC current is flowing through the coil L, as will be described below, and a relatively large DC current. Even if it flows through the coil L, it has a DC superposition characteristic in which the inductance value does not rapidly decrease.
- the nonmagnetic layer 17 is provided so as to cross the coil L.
- the magnetic saturation is suppressed from occurring in the stacked body 12a, and an abrupt decrease in inductance value due to magnetic saturation is suppressed.
- a high magnetic permeability portion 19 having a magnetic permeability higher than that of the magnetic layer 16 is provided inside the coil L. Therefore, when a small direct current that does not cause magnetic saturation in the high magnetic permeability portion 19 flows through the coil L, a sufficient inductance value can be obtained.
- an electronic component used for a DC-DC converter As an electronic component used for a DC-DC converter, it operates with a stable inductance value when a large current flows, and can exhibit excellent conversion efficiency when a small current flows. It is necessary to operate with a large inductance value. Therefore, the electronic component 10a can be suitably used for such a DC-DC converter.
- the inventor of the present application performed the following computer simulation in order to make the effect of the electronic component 10a clearer.
- this inventor produced the electronic component 10a as a 1st model.
- the inventor of the present application manufactured an electronic component 10a in which the high magnetic permeability portion 19 is not provided as a second model according to the comparative example.
- the change of the inductance value was computed by changing the direct current passed through the first model and the second model.
- FIG. 4 is a graph showing the results of this computer simulation.
- the vertical axis represents the inductance value
- the horizontal axis represents the direct current.
- a high permeability portion 19 is provided in addition to the second model. Therefore, when a relatively small DC current flows through the coil L, an inductance value higher than that of the second model can be obtained. Even when a relatively large direct current flows through the coil L, a stable inductance value can be obtained. Therefore, according to this computer simulation, even if a relatively large direct current flows through the coil L in the electronic component 10a, the occurrence of magnetic saturation in the stacked body 12a is suppressed, and the inductance value due to magnetic saturation is reduced. It can be seen that the rapid decrease is suppressed.
- ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio and each material was put into a ball mill as a raw material, and wet blended I do.
- the obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour.
- the obtained calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a first ferrite ceramic powder.
- a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added to the first ferrite ceramic powder, mixed by a ball mill, and then defoamed by reduced pressure.
- the obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the magnetic layer 16.
- each material obtained by weighing ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO) and copper oxide (CuO) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed.
- the obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour.
- the obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a second ferrite ceramic powder.
- a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material and a dispersing agent are added and mixed by a ball mill, and then defoamed by reduced pressure.
- the obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the nonmagnetic layer 17.
- ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) are weighed at a predetermined ratio, and the respective materials are put into a ball mill as raw materials. Mix. At this time, the respective materials are mixed so that the ratio of nickel oxide (NiO) is lower than that of the first ferrite ceramic powder.
- the obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour.
- the obtained calcined powder is wet pulverized by a ball mill, then dried and crushed to obtain a third ferrite ceramic powder.
- a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added and mixed with a ball mill. Ceramic slurry used for the body layers 19d to 19i is obtained.
- FIG. 5 is a perspective view showing a manufacturing process of a ceramic green sheet to be the magnetic layer 16e.
- a ceramic green sheet to be a magnetic layer 16e with a carrier film 22e as shown in FIG. 5 (a) is prepared.
- a hole H2 to be the magnetic layer 19e and a via hole h2 to be the via-hole conductor b2 are formed by irradiating a laser beam or the like.
- the laser beam is irradiated while adjusting the strength so that only the ceramic green sheet is burned out and the carrier film 22e is not burned out.
- the ceramic slurry used for the magnetic layer 19e is filled into the holes H2 by screen printing or the like.
- a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is screen printed on the ceramic green sheet to be the magnetic layer 16e.
- the coil conductor 18b is formed by coating by a method such as photolithography. Further, in the step of forming the coil conductor 18b, the via hole h2 is filled with a conductive paste to form the via hole conductor b2.
- the ceramic green sheets to be the magnetic layers 16a to 16e, the nonmagnetic layer 17 and the magnetic layers 16f to 16k are stacked so as to be arranged in this order from the positive direction side in the z-axis direction. . More specifically, a ceramic green sheet to be the magnetic layer 16k is disposed. Next, the ceramic green sheet to be the magnetic layer 16j is disposed and temporarily pressed onto the ceramic green sheet to be the magnetic layer 16k. Thereafter, the ceramic green sheets to be the magnetic layers 16i, 16h, 16g and 16f, the nonmagnetic layer 17 and the magnetic layers 16e, 16d, 16c, 16b and 16a are similarly laminated and temporarily pressed in this order. To obtain a mother laminate. Further, the mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.
- the mother laminated body is cut into a laminated body 12a having a predetermined size by pressing to obtain an unfired laminated body 12a.
- This unfired laminate 12a is subjected to binder removal processing and firing.
- the binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed, for example, at 1000 ° C. for 2 hours.
- the fired laminated body 12a is obtained through the above steps.
- the laminated body 12a is chamfered by barrel processing.
- a silver electrode to be the external electrodes 14a and 14b is formed on the surface of the laminated body 12a by applying and baking an electrode paste whose main component is silver by a method such as dipping.
- the silver electrode is dried at 120 ° C. for 10 minutes, and the silver electrode is baked at 890 ° C. for 1 hour.
- the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode.
- FIG. 6 is a cross-sectional structural view taken along line AA of the electronic component 10b according to another embodiment.
- the high magnetic permeability portion 19 is provided so as to penetrate the nonmagnetic layer 17.
- the high magnetic permeability portion 19 is provided separately on each of the positive direction side and the negative direction side in the z-axis direction of the nonmagnetic layer 17. Also in the electronic component 10b having such a structure, it is possible to achieve the same operational effects as the electronic component 10a.
- the high magnetic permeability portion 19 forms one prism, but the structure of the high magnetic permeability portion 19 is not limited to this.
- the magnetic layers 19d to 19i may be provided on the magnetic layers 16d to 16h without forming the holes H. In this case, in the coil L, the magnetic layers 19d to 19i and the magnetic layers 16d to 16h are alternately arranged.
- the nonmagnetic layer 17 is provided in the electronic components 10a and 10b.
- a magnetic layer having a magnetic permeability lower than that of the magnetic layer 16 may be provided instead of the nonmagnetic layer 17, a magnetic layer having a magnetic permeability lower than that of the magnetic layer 16 may be provided. .
- the present invention is useful for electronic components. Particularly, when a relatively small direct current flows through the coil, a large inductance value can be obtained, and even if a relatively large direct current flows through the coil, Further, it is excellent in that a direct current superimposition characteristic in which the inductance value does not decrease can be obtained.
Abstract
Description
以下に、本発明の一実施形態に係る電子部品10aについて図面を参照しながら説明する。図1は、本発明の実施形態に係る電子部品10a,10bの透視図である。図2は、第1の実施形態に係る電子部品10aの積層体12aの分解斜視図である。図3は、図1の電子部品10aのA-Aにおける断面構造図である。以下、電子部品10aの積層方向をz軸方向と定義し、電子部品10aの長辺に沿った方向をx軸方向と定義し、電子部品10aの短辺に沿った方向をy軸方向と定義する。x軸、y軸及びz軸は互いに直交している。 (Configuration of electronic parts)
Hereinafter, an
以上のように構成された電子部品10aは、以下に説明するように、相対的に小さな直流電流がコイルLに流れているときには、大きなインダクタンス値が得られ、かつ、相対的に大きな直流電流がコイルLに流れても、急激にインダクタンス値が低下しない直流重畳特性を有するようになる。 (effect)
The
以下に、電子部品10aの製造方法について図面を参照しながら説明する。なお、以下では、一つの電子部品10aの製造方法について説明する。しかしながら、実際には、マザーセラミックシートを積層してマザー積層体を作製し、マザー積層体をカットすることにより複数の電子部品10aを同時に得ている。 (Method for manufacturing electronic parts)
Below, the manufacturing method of the
本発明に係る電子部品は、前記電子部品10aに限らず、その要旨の範囲内において変更されてもよい。図6は、その他の実施形態に係る電子部品10bのA-Aにおける断面構造図である。 (Other embodiments)
The electronic component according to the present invention is not limited to the
X コイル軸
b1~b5 ビアホール導体
10a,10b 電子部品
12a 積層体
14a,14b 外部電極
16a~16k,19d~19i 磁性体層
17 非磁性体層
18a~18f コイル導体
19 高透磁率部
20a,20b 引き出し部 L coil X coil axis b1 to b5 via
Claims (3)
- 複数の第1の絶縁体層が積層されてなる積層体と、
前記積層体に内蔵され、かつ、積層方向に沿って延在するコイル軸を有するコイルと、
を備え、
前記積層体は、
前記第1の絶縁体層よりも低い透磁率を有し、かつ、前記コイル軸と交差するように前記積層体内に設けられている第2の絶縁体層と、
前記第1の絶縁体層よりも高い透磁率を有し、かつ、前記コイルの内部において前記第2の絶縁体層の積層方向の上側及び下側のそれぞれに設けられている高透磁率部と、
を更に含んでいること、
を特徴とする電子部品。 A laminate in which a plurality of first insulator layers are laminated;
A coil built in the laminate and having a coil axis extending along the lamination direction;
With
The laminate is
A second insulator layer having a lower magnetic permeability than the first insulator layer and provided in the stacked body so as to intersect the coil axis;
A high permeability portion having a higher magnetic permeability than the first insulator layer, and provided in each of an upper side and a lower side in the stacking direction of the second insulator layer inside the coil; ,
Further including,
Electronic parts characterized by - 前記高透磁率部は、前記第2の絶縁体層を横切るように設けられていること、
を特徴とする請求項1に記載の電子部品。 The high permeability portion is provided so as to cross the second insulator layer;
The electronic component according to claim 1. - 前記第2の絶縁体層は、非磁性体層であること、
を特徴とする請求項1又は請求項2のいずれかに記載の電子部品。 The second insulator layer is a non-magnetic layer;
The electronic component according to claim 1, wherein:
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010541273A JP5327231B2 (en) | 2008-12-03 | 2009-10-27 | Electronic components |
CN2009801483054A CN102232233A (en) | 2008-12-03 | 2009-10-27 | Electronic component |
Applications Claiming Priority (2)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012138496A (en) * | 2010-12-27 | 2012-07-19 | Murata Mfg Co Ltd | Coil built-in substrate |
CN103563022A (en) * | 2011-07-06 | 2014-02-05 | 株式会社村田制作所 | Electronic component |
JP2015119033A (en) * | 2013-12-18 | 2015-06-25 | 京セラ株式会社 | Coil built-in substrate and dc-dc converter |
Families Citing this family (1)
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KR101994724B1 (en) * | 2013-11-05 | 2019-07-01 | 삼성전기주식회사 | Laminated Inductor and Manufacturing Method Thereof |
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JP2001267129A (en) * | 2000-03-16 | 2001-09-28 | Murata Mfg Co Ltd | Chip inductor and manufacturing method thereof |
JP2002008922A (en) * | 2000-06-19 | 2002-01-11 | Tdk Corp | Coil part |
JP2005045108A (en) * | 2003-07-24 | 2005-02-17 | Fdk Corp | Core type multilayer inductor |
WO2007088914A1 (en) * | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | Laminated component and module using same |
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JPH023605Y2 (en) * | 1980-09-18 | 1990-01-29 | ||
US5349743A (en) * | 1991-05-02 | 1994-09-27 | At&T Bell Laboratories | Method of making a multilayer monolithic magnet component |
JPH0714716A (en) * | 1993-06-22 | 1995-01-17 | Taiyo Yuden Co Ltd | Multilayer ceramic magnetic component and production thereof |
JP2944898B2 (en) * | 1994-09-29 | 1999-09-06 | 富士電気化学株式会社 | Laminated chip transformer and method of manufacturing the same |
JP2000182834A (en) * | 1998-12-10 | 2000-06-30 | Tokin Corp | Laminate inductance element and manufacture thereof |
JP4525066B2 (en) * | 2003-12-11 | 2010-08-18 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
JP4725120B2 (en) * | 2005-02-07 | 2011-07-13 | 日立金属株式会社 | Multilayer inductor and multilayer substrate |
WO2008004633A1 (en) * | 2006-07-05 | 2008-01-10 | Hitachi Metals, Ltd. | Laminated component |
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2009
- 2009-10-27 JP JP2010541273A patent/JP5327231B2/en active Active
- 2009-10-27 CN CN2009801483054A patent/CN102232233A/en active Pending
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Patent Citations (4)
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JP2001267129A (en) * | 2000-03-16 | 2001-09-28 | Murata Mfg Co Ltd | Chip inductor and manufacturing method thereof |
JP2002008922A (en) * | 2000-06-19 | 2002-01-11 | Tdk Corp | Coil part |
JP2005045108A (en) * | 2003-07-24 | 2005-02-17 | Fdk Corp | Core type multilayer inductor |
WO2007088914A1 (en) * | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | Laminated component and module using same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012138496A (en) * | 2010-12-27 | 2012-07-19 | Murata Mfg Co Ltd | Coil built-in substrate |
CN103563022A (en) * | 2011-07-06 | 2014-02-05 | 株式会社村田制作所 | Electronic component |
JP2015119033A (en) * | 2013-12-18 | 2015-06-25 | 京セラ株式会社 | Coil built-in substrate and dc-dc converter |
Also Published As
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CN102232233A (en) | 2011-11-02 |
JPWO2010064505A1 (en) | 2012-05-10 |
JP5327231B2 (en) | 2013-10-30 |
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