WO2010050278A1 - 無線通信装置 - Google Patents
無線通信装置 Download PDFInfo
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- WO2010050278A1 WO2010050278A1 PCT/JP2009/063100 JP2009063100W WO2010050278A1 WO 2010050278 A1 WO2010050278 A1 WO 2010050278A1 JP 2009063100 W JP2009063100 W JP 2009063100W WO 2010050278 A1 WO2010050278 A1 WO 2010050278A1
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- Prior art keywords
- conductor
- wireless communication
- slot
- capacitive coupling
- coupling means
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- 238000004891 communication Methods 0.000 title claims abstract description 96
- 239000004020 conductor Substances 0.000 claims abstract description 211
- 230000008878 coupling Effects 0.000 claims abstract description 121
- 238000010168 coupling process Methods 0.000 claims abstract description 121
- 238000005859 coupling reaction Methods 0.000 claims abstract description 121
- 230000003071 parasitic effect Effects 0.000 claims description 19
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- 230000005540 biological transmission Effects 0.000 claims description 7
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- 238000007747 plating Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/22—Capacitive coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/378—Combination of fed elements with parasitic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
- H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
Definitions
- the present invention relates to a wireless communication apparatus, and more particularly to an RFID (Radio Frequency IDentification) tag using a radiated electromagnetic field.
- RFID Radio Frequency IDentification
- the RFID tag may be used by being attached to a metal object (conductive object).
- RFID tags that can be installed regardless of a conductive object or a non-conductive object by providing a slot in a radiation conductor of a microstrip antenna and mounting an RFID IC chip have been proposed (for example, , See Patent Document 1).
- the microstrip antenna is used in the antenna using the RFID tag described in Patent Document 1, the operating frequency band is narrow because it does not include means for widening the impedance characteristic.
- the UHF band RFID system uses “952-954 MHz” in Japan, “902-928 MHz” in the United States, and “865-868 MHz” in Europe. The frequency used is different.
- the operating frequency band is narrow, so the RFID system user can attach an RFID tag suitable for each region. There was a problem that it had to be used.
- the present invention has been made in order to solve the above-described problems, and obtains an RFID tag that can be used in common regardless of region by widening the operating frequency of an antenna used for the RFID tag.
- An object of the present invention is to obtain a wireless communication device that can be matched to an arbitrary load impedance and can widen the operating frequency band even when the input impedance of the IC chip cannot be freely selected.
- a wireless communication device includes a first conductor, a second conductor disposed substantially parallel to the first conductor, a hole formed in the second conductor, and a capacitor disposed in proximity to the hole. And a communication circuit having at least one of a radio wave transmission function and a reception function, and the communication circuit has a capacitance between two parts on the conductor in the vicinity of the boundary between the second conductor and the hole. It is connected via a sexual coupling means.
- the present invention it is possible to obtain a wireless communication device that can be matched to an arbitrary load impedance and can widen the operating frequency band even when the input impedance of the IC chip cannot be freely selected.
- Example 1 is a plan view and a cross-sectional view showing a wireless communication apparatus according to Embodiment 1 of the present invention.
- Example 1 It is the top view and sectional drawing which show the microstrip antenna to which Example 1 of this invention is applied.
- FIG. 3 is an equivalent circuit diagram of the microstrip antenna of FIG. 2.
- Example 1 It is a Smith chart which shows the difference of the impedance characteristic according to slot length by Example 1 of this invention.
- Example 1 It is an equivalent circuit diagram for demonstrating the operation
- Example 1 It is a top view for demonstrating the coupling
- Example 1 It is a Smith chart figure which shows the difference in the impedance characteristic according to the magnetic field coupling length by Example 1 of this invention.
- Example 1 It is a Smith chart figure which shows the difference in the impedance characteristic according to the offset space
- Example 1 It is a top view which shows the other structural example of the radio
- Example 1 It is a top view which shows the other structural example of the radio
- Example 1 It is a top view which shows the other structural example of the slot by Example 1 of this invention.
- Example 1 It is a top view which shows the radio
- Example 2 It is a top view which shows the direction of the magnetic current on a slot in the certain moment for demonstrating the operation
- Example 2 It is a Smith chart figure which shows the difference in the impedance characteristic according to the slot shape by Example 2 of this invention.
- Example 3 It is a top view which shows the radio
- Example 3 It is an enlarged plan view which shows the specific structural example of the radio
- Example 3) It is an enlarged plan view which shows the other specific structural example of the radio
- Example 3 It is sectional drawing which shows the radio
- Example 4 It is sectional drawing which shows the radio
- Example 5 It is a top view which shows the radio
- Example 6 It is a top view which shows the radio
- Example 1 1A and 1B are a plan view and a cross-sectional view showing a wireless communication apparatus according to Embodiment 1 of the present invention, and show the configuration of an RFID tag that functions as the wireless communication apparatus.
- 1A is a plan view
- FIG. 1B is a cross-sectional view taken along the line GG ′ in FIG.
- an RFID tag includes a ground conductor 1, a radiating conductor (hereinafter simply referred to as “conductor”) 2, a slot line (hereinafter simply referred to as “slot”) 3, capacitive coupling means 4a and 4b, IC chip 5 is provided.
- the ground conductor 1 is a conductor having a finite size and has, for example, a rectangular shape as shown in FIG.
- the conductor 2 is a plate-like conductor, and has a rectangular shape, for example, like the ground conductor 1.
- the conductor 2 is disposed substantially parallel to the ground conductor 1 with a space therebetween, and constitutes a microstrip antenna together with the ground conductor 1.
- the size of the conductor 2 is selected so as to resonate with a predetermined operating frequency.
- the shape of the conductor 2 is not limited to a rectangle and can be freely selected as long as the shape resonates with respect to a predetermined operating frequency.
- the conductor 2 is provided with a slot 3 configured by removing a part of the conductor 2.
- the shape of the slot 3 is, for example, “inverted U-shaped” as shown in FIG.
- the capacitive coupling means 4a and 4b are, for example, plate-like conductors having a rectangular shape, and are arranged substantially parallel to the conductor 2 with an interval d as shown in FIG. Note that the shape of the capacitive coupling means 4a and 4b is not limited to a rectangle, and a free shape such as a circle or a triangle can be selected as long as a predetermined capacitive coupling is obtained with respect to the conductor 2.
- the capacitive coupling means 4 a and 4 b are individually arranged to face each other via the slot 3.
- the IC chip 5 is an integrated circuit having functions such as storage, calculation and transmission / reception, and is inserted between the capacitive coupling means 4a and 4b so that the capacitive coupling means 4a and 4b straddle the slot 3. And connected to the capacitive coupling means 4a, 4b.
- the power of the received radio wave by the microstrip antenna composed of the ground conductor 1 and the conductor 2 is supplied to the IC chip 5 through the capacitive coupling means 4a and 4b, and the IC chip 5 is driven.
- FIG. 1 the operation and effect of the RFID tag according to the first embodiment of the present invention shown in FIG. 1 will be described while showing numerical calculation results by electromagnetic field analysis. Due to the reversibility of the antenna, the operation at the time of transmission and reception of the antenna is the same, so the case where voltage is supplied to the position where the IC chip 5 is connected will be described below.
- FIG. 2 shows a structure in which the capacitive coupling means 4a and 4b and the IC chip 5 in FIG. 1 are removed.
- FIG. 2 (a) is a plan view
- FIG. 2 (b) is an H- It is sectional drawing which follows a H 'line.
- a slot length Ls from the center of the slot 3 to one end of the slot 3 and a feeding point F where a voltage is applied to the slot 3 are shown.
- slot 3 When slot 3 is excited by a voltage applied to slot 3, a magnetic field is generated in slot 3, and this magnetic field is magnetically coupled to the internal magnetic field of the microstrip antenna composed of ground conductor 1 and conductor 2. As a result, the microstrip antenna composed of the ground conductor 1 and the conductor 2 is excited by the slot 3.
- FIG. 3A is an equivalent circuit diagram described in the above-mentioned publicly known document, and is represented using a transformer (turn ratio is “1: N”).
- the input impedance Zin viewed from the feeding point F (FIG. 2)
- the impedance Za of the microstrip antenna composed of the ground conductor 1 and the conductor 2 (FIG. 2)
- the inductance L obtained by the slot 3 It is shown.
- FIG. 3 (a) when the impedance on the secondary side of the transformer is converted to the primary side, the circuit in FIG. 3 (a) is transformed into an equivalent circuit in FIG. 3 (b).
- FIG. 4 is a Smith chart showing the difference in impedance characteristics depending on the slot length Ls, and shows an example of a change in impedance characteristics viewed from the feeding point F (FIG. 2).
- ⁇ is a free space wavelength with respect to the center frequency of the operating frequency (use frequency) of the wireless communication apparatus.
- the impedance trajectories Z07 ⁇ (Ls), Z09 ⁇ (Ls), and Z11 ⁇ (Ls) are inductive. It has moved to the reactance side. That is, it can be seen that the slot 3 operates as an inductance L inserted in series with respect to the microstrip antenna composed of the ground conductor 1 and the conductor 2.
- the capacitive coupling means 4a and 4b Since the capacitive coupling means 4a and 4b are arranged substantially in parallel with the conductor 2 at a distance d, a parallel plate capacitor is formed at the portion where the capacitive coupling means 4a and 4b face each other. , Capacitively coupled to each other in high frequency.
- the capacitive coupling means 4 a and 4 b are arranged so as to straddle the slot 3, they operate as a capacitance C inserted in series with respect to the slot 3.
- the capacitance C of the capacitive coupling means 4a and 4b is calculated as a capacitance, the relationship is as shown in the following formula (1).
- S is an area of the location facing the conductor 2 of the capacitive coupling means 4a or the capacitive coupling means 4b.
- D is the distance between the capacitive coupling means 4a or capacitive coupling means 4b and the conductor 2
- ⁇ is the dielectric constant between the capacitive coupling means 4a or capacitive coupling means 4b and the conductor 2. It is.
- FIG. 5 a capacitance C obtained by the capacitive coupling means 4a and 4b is added to the circuit described above (FIG. 3B). That is, the circuit of FIG. 5 has a configuration in which a capacitance C is added in series with the inductance L.
- the wireless communication apparatus is equivalent to a configuration in which an LC series resonance circuit is connected to a microstrip antenna having parallel resonance characteristics, so that the operating frequency band is widened. .
- the degree of coupling between the microstrip antenna and the slot 3 is closely related to the magnitude of “twist” in the impedance locus on the Smith chart, and is an important parameter in widening the operating frequency.
- FIG. 6 is a plan view for explaining the degree of coupling between the microstrip antenna and the slot 3 and shows the magnetic current flowing on the slot 3 at a certain moment and the internal magnetic field of the microstrip antenna composed of the ground conductor 1 and the conductor 2. The direction (broken arrow B) is shown.
- the magnetic field coupling between the microstrip antenna composed of the ground conductor 1 and the conductor 2 and the slot 3 occurs at a portion (length Ws) corresponding to the broken line arrow A parallel to the direction of the internal magnetic field (broken line arrow B). They are not coupled in the direction perpendicular to the direction of the internal magnetic field.
- the length Ws of the portion causing the magnetic field coupling is referred to as “magnetic field coupling length”. Therefore, the coupling degree can be changed by changing the magnetic field coupling length Ws in FIG.
- FIG. 7 is a Smith chart showing the difference in impedance characteristics according to the magnetic field coupling length Ws.
- the slot length Ls (FIG. 2) is fixed to 0.11 ⁇ and the magnetic field coupling length Ws is changed. 2 shows an example of a change in impedance characteristics viewed from the feeding point F (FIG. 2).
- the internal magnetic field of the microstrip antenna is maximized at the center in the resonance direction of the radiating element.
- the center of the conductor 2 is the origin O
- the surface of the conductor 2 is the xy plane
- the resonance direction of the conductor 2 is the x-axis
- the axis orthogonal to the resonance direction is the y-axis
- the internal magnetic field Hy in the basic mode (TM 10 mode) is given by the following equation (2).
- a is the length of the conductor 2 in the resonance direction
- ⁇ is the angular frequency
- ⁇ is the dielectric constant between the ground conductor 1 and the conductor 2
- k is the wave number in the dielectric
- Vo is the conductor. 2 is the voltage at the end. Therefore, the smaller the offset distance D between the portion corresponding to the broken line arrow A in FIG. 6 and the central portion (origin O) in the resonance direction of the conductor 2, the more the internal magnetic field of the microstrip antenna composed of the ground conductor 1 and the conductor 2 becomes. It can be considered that the magnetic field coupling with the slot 3 becomes stronger.
- FIG. 8 is a Smith chart showing the difference in impedance characteristics depending on the offset interval D.
- the slot length Ls (FIG. 2) is fixed at 0.11 ⁇ , and the magnetic field coupling length Ws (FIG. 6) is 0.021 ⁇ .
- FIG. 2 shows an example of a change in impedance characteristics viewed from the feeding point F (FIG. 2) when the offset interval D is changed.
- the inductance L is adjusted by the slot length Ls
- the capacitance C is adjusted by the capacitive coupling means 4a and 4b.
- the degree of coupling between the slot 3 and the microstrip antenna can be adjusted by the magnetic field coupling length Ws of the slot 3 or the offset interval D of the slot 3.
- the capacitive coupling means 4 a and 4 b are configured to straddle the center position of the slot 3, but the position where the capacitive coupling means 4 a and 4 b straddle the slot 3 is limited to the center of the slot 3. There is no.
- capacitive coupling means 4 a and 4 b may be arranged at positions shifted from the center of the slot 3.
- the slot 3 is formed in an “inverted U shape”. However, if an appropriate magnetic field coupling is obtained between the microstrip antenna composed of the ground conductor 1 and the conductor 2 and the slot 3, the slot 3 is formed.
- the direction of 3 may be changed. For example, as shown in FIG. 10, even if the slot 3 is formed in an “upward U shape”, the magnetic field coupling is performed in a part of the slot 3 that is parallel to the direction of the internal magnetic field. Can be played.
- the capacitive coupling means 4 a and 4 b and the IC chip 5 are disposed above the conductor 2, but may be disposed between the ground conductor 1 and the conductor 2.
- the IC chip 5 can be protected from the outside world, an unnecessary protruding structure can be avoided, and the appearance can be improved.
- the shape of the slot 3 is not limited to the “inverted U-shape” shown in FIG. 1, and an appropriate magnetic field coupling can be obtained between the microstrip antenna composed of the ground conductor 1 and the conductor 2 and the slot 3. It is possible to select an appropriate shape as appropriate.
- the shape of the slot 3 can be selected from various shapes such as a linear shape, a circular shape, a triangular shape, or a combined shape of a circular shape and a linear shape. .
- the slot 3 may be formed in an asymmetric shape, or in the case of a rectangular shape, it may be formed in a shape with rounded corners.
- the ground conductor 1, the conductor 2, and the capacitive coupling means 4a, 4b A dielectric (not shown) is interposed (filled) between (or around) each of the two conductors, and the conductor 2 is supported from the ground conductor 1 via the dielectric, and the capacitive coupling means 4a, 4b from the conductor 2. May be supported.
- the relative dielectric constant of the dielectric interposed between the ground conductor 1, the conductor 2, and the capacitive coupling means 4a, 4b may be set to a different value at each location.
- the capacitive coupling means 4a and 4b can be formed on a film substrate and attached to the conductor 2.
- the ground conductor (first conductor) 1 and the conductor (second conductor) 2 arranged substantially in parallel with the ground conductor 1;
- a slot (hole) 3 formed in the conductor 2 capacitive coupling means 4a and 4b arranged close to the slot 3, and an IC chip (communication circuit) 5 having at least one of a radio wave transmission function and a reception function.
- the IC chip 5 is connected between two parts on the conductor 2 in the vicinity of the boundary line between the conductor 2 and the slot 3 via capacitive coupling means 4a and 4b.
- the two parts that connect the IC chip 5 via the capacitive coupling means 4 a and 4 b are selected so as to straddle the slot 3. Thereby, optimal impedance matching can be realized with respect to the input impedance of the IC chip 5, and a broadband wireless communication device can be obtained.
- FIG. 12 is a plan view showing an RFID tag constituting a wireless communication apparatus according to Embodiment 2 of the present invention.
- the same components as those described above are denoted by the same reference numerals as those described above, and detailed description thereof is omitted.
- each folded slot portion includes opposing slots provided in parallel to each other at two points separated within a distance range that affects each other.
- the direction of the magnetic current flowing on the slot 3A at a certain moment is represented by broken line arrows E to E ′ in FIG.
- the magnetic current E and the magnetic current E ′ flowing through the opposite slot portions are opposite to each other.
- the magnetic field coupling generated in the portion corresponding to the broken line arrow E in FIG. 13 and the magnetic field coupling generated in the broken line arrow E ′ have an effect of canceling each other, so the coupling degree in the wireless communication apparatus in FIG. It becomes smaller than the case of Example 1 (FIG. 1).
- the magnitude of “twist” in the impedance locus of the microstrip antenna on the Smith chart is related to the input resistance of the microstrip antenna. In general, the greater the input resistance, the greater the “twist”.
- the input resistance and the no-load Q are in a proportional relationship, and the higher the no-load Q, the larger the input resistance. Therefore, the higher the no-load Q, the greater “twist”. Therefore, in order to realize the optimum impedance matching, it is necessary to reduce the “twist” by reducing the degree of coupling between the microstrip antenna and the slot 3A.
- the degree of coupling can be adjusted using the distance Ga between the substantially parallel portions (opposing slots) of the slot 3A as a third parameter.
- FIG. 14A in the case of the slot shape of Example 1 (FIG. 1) (the folded slot portion is not formed), the impedance locus Z049 ⁇ (when the magnetic field coupling length Ws is set to 0.049 ⁇ ( Ws).
- FIG. 14B shows the impedance locus Z006 ⁇ (Ws) when the magnetic field coupling length Ws is set to 0.006 ⁇ in the case of the slot shape of the first embodiment (FIG. 1).
- FIG. 14C in the case of the slot shape of Example 2 (FIG. 12), the magnetic field coupling length Ws is set to 0.049 ⁇ and the gap Ga is set to 0.012 ⁇ .
- the impedance locus Z012 ⁇ (Ga) is shown.
- the offset interval D is set to 0.106 ⁇ , and the total length of the slot 3A is the same.
- the shape of the slot 3A according to the second embodiment is considered. Can be said to be suitable for adjusting the degree of coupling.
- the slot 3A has the direction of the internal magnetic field of the microstrip antenna composed of the ground conductor 1 and the conductor 2 (broken arrow).
- B) has a folded slot portion so as to be substantially parallel to the portion parallel to B).
- the optimum coupling degree can be obtained even when the no-load Q of the microstrip antenna is high. Since an optimum impedance matching can be realized with respect to the input impedance, a broadband wireless communication apparatus can be obtained.
- the gap Ga is within a distance range in which each of the portions parallel to the internal magnetic field (broken arrow B) of the microstrip antenna in the slot 3A affects each other (for example, with respect to the wavelength ⁇ with respect to the center frequency of the used frequency) .05 ⁇ or less).
- the gap Ga is set to be as small as about 0.01 ⁇ , and it is desirable to optimize the coupling degree by adjusting the offset amount D (see FIG. 6) of the slot 3A.
- FIG. 15 is a plan view showing an RFID tag that constitutes a wireless communication apparatus according to Embodiment 3 of the present invention.
- the same components as those described above (see FIG. 1) are denoted by the same reference numerals as those described above, and are described in detail. Omitted.
- the capacitive coupling means 4A and 4B are provided on a common plane with the slot 3B.
- the capacitive coupling means 4A and 4B are each made of a third conductor
- the capacitive coupling means 4A is arranged so as to be close to one side of the slot 3B
- the capacitive coupling means 4B It is arranged so as to be close to the side.
- the capacitive coupling means 4A, 4B are configured to be capacitively coupled to the side of the slot 3B, and are made of, for example, a linear conductor.
- interdigital capacitors 6a and 6b may be used as the capacitive coupling means 4A and 4B, for example, as shown in FIG. 16, instead of the linear conductor.
- the interdigital capacitors 6a and 6b are constituted by comb-like sides of the capacitive coupling means 4A and 4B and comb-like sides of the slot 3B facing the capacitive coupling means 4A and 4B. Has been.
- the capacitive coupling means 4a and 4b are constituted by chip capacitors (capacitors) 7a and 7b and third conductors 8a and 8b. May be.
- the chip capacitors 7a and 7b is connected to each inner end of the slot 3C, and the other end of each of the chip capacitors 7a and 7b is connected to the IC chip 5 via the third conductors 8a and 8b.
- the capacitive coupling means 4A and 4B include the third conductor connected to the terminal of the IC chip (communication circuit) 5, and the capacitance
- the sex coupling means 4A and 4B are configured by capacitively coupling the conductor 2 (each side of the slot 3B) with the third conductor.
- the capacitive coupling means 4A and 4B are made of a third conductor, and are constituted by interdigital capacitors 6a and 6b together with the slot 3B.
- the capacitive coupling means is constituted by chip capacitors 7a and 7b and third conductors 8a and 8b.
- the capacitive coupling means 4A and 4B formed in the same plane as the slot 3B can be manufactured simultaneously with the conductor 2 by a method of etching a conductor pattern on a dielectric substrate, and therefore, the manufacture becomes easy.
- FIG. 18 is a cross-sectional view showing an RFID tag constituting a wireless communication apparatus according to Embodiment 4 of the present invention.
- the same components as those described above (see FIG. 1) are denoted by the same reference numerals as those described above, and are described in detail. Omitted.
- the parasitic element 9 is installed between the ground conductor 1 and the conductor 2 by taking the case where the present invention is applied to the wireless communication apparatus shown in FIG.
- the parasitic element 9 is disposed at a position where magnetic resonance is generated with the conductor 2 to cause double resonance, and near the resonance frequency in the operating frequency band of the wireless communication device (within the operating frequency band or within the operating frequency). It has an electrical length that resonates near the band.
- Other configurations and operations are the same as those of the first embodiment.
- a microstrip antenna provided with a parasitic element 9
- double resonance characteristics can be obtained by coupling an excitation element that is a radiation conductor and the parasitic element 9.
- the operating frequency band can be widened by appropriately selecting the shape of the parasitic element 9 and the positional relationship between the excitation element and the parasitic element 9.
- the parasitic element 9 is disposed between the ground conductor 1 and the conductor 2.
- the parasitic element 9 is magnetically coupled to the conductor (radiating conductor) 2 to obtain a double resonance characteristic
- the arrangement configuration of the parasitic element 9 is not limited to the example of FIG.
- the parasitic element 9 may be disposed on the opposite side of the ground conductor 1 as viewed from the conductor 2, and the parasitic element 9 may be disposed at a location close to the conductor 2 in the x direction or the y direction. Also good.
- the parasitic element 9 is added to the wireless communication apparatus of the first embodiment (FIG. 1).
- the configuration is not limited to this example.
- the parasitic element 9 may be added to the wireless communication apparatus shown in FIGS. 12 and 15 to 17 and the same operation and effect can be obtained.
- FIG. 19 is a cross-sectional view showing an RFID tag that constitutes a wireless communication apparatus according to Embodiment 5 of the present invention. Components similar to those described above (see FIG. 1) are denoted by the same reference numerals as those described above, and are described in detail. Omitted.
- the length of the conductor 10 in the resonance direction is set to approximately half that of the conductor 2 described above (FIG. 1).
- a short-circuit conductor 11 is short-circuited between a part (one end) of the outer periphery of the conductor 10 and the ground conductor 1. This constitutes a so-called short patch antenna.
- the current on the radiation conductor becomes zero at both ends in the resonance direction. It is well known that when the radiating conductor resonates at about half the wavelength of the signal wave and a standing wave current appears on the radiating conductor, the current is maximized at the center of the radiating conductor. Yes. In the standing wave, the electric field at the center in the resonance direction of the radiation conductor becomes zero because the phase of the voltage is shifted by 90 degrees from the phase of the current.
- the electromagnetic field distribution inside the microstrip antenna does not change.
- the short-patch antenna is reduced in size by making the length of the radiating conductor in the resonance direction correspond to about 1 ⁇ 4 wavelength of the signal wave.
- An antenna composed of the conductor 1, the conductor 10, and the short-circuit conductor 11 corresponds to this.
- the impedance characteristic of the short patch antenna also has parallel resonance characteristics as in the case of a normal microstrip antenna
- the equivalent circuit of the wireless communication device in FIG. 19 is the same as the circuit shown in FIG. Other configurations and operations are the same as those of the first embodiment.
- the wireless communication apparatus includes a short-circuit conductor (fourth conductor) 11 connected to one end corresponding to a portion where the electric field at the center of the resonance direction of the conductor 10 is zero.
- the conductor 10 is configured so that the length in the resonance direction is substantially halved, and one end of the conductor 10 is short-circuited to the ground conductor (first conductor) 1 via the short-circuit conductor 11.
- the conductor 10 having a length in the resonance direction that is approximately half that of the conductor 2 described above (FIG. 1) is used.
- the length in the resonance direction can be halved and the ground conductor 1 can be made smaller.
- the size of the wireless communication device can be reduced to about half that of the first embodiment.
- FIG. 19 the configuration in which the conductor 2 of the first embodiment (FIG. 1) is replaced with the conductor 10 having a length of about half has been described as an example.
- the configuration of the short patch antenna wireless communication device is as follows. The configuration is not limited to the example of FIG. 19, and for example, the conductor 2 in Example 3 or Examples 2 to 4 (FIGS. 12 and 15 to 18) may be replaced with the conductor 10.
- Example 6 In Examples 1 to 5 (FIGS. 1, 12, and 15 to 19), the capacitive coupling means is provided separately from the IC chip 5, but as shown in FIG. Capacitive coupling means may be configured.
- 20 is a plan view and a cross-sectional view showing an RFID tag that constitutes a wireless communication apparatus according to Embodiment 6 of the present invention. Components similar to those described above (see FIG. 1) are denoted by the same reference numerals as those described above. Detailed description is omitted.
- 20A is a plan view
- FIG. 20B is a cross-sectional view taken along the line KK ′ of FIG. 20A.
- the circuit corresponding to the inductance L and the capacitance C in FIG. 5 can be incorporated in the IC chip 5A (communication circuit) as shown in FIG. 20 by improving the integration technology of the IC circuit.
- the capacitive coupling means 4a and 4b in FIG. 1 are removed, and an IC chip 5A including the circuit function of the capacitive coupling means 4a and 4b is connected to the slot 3.
- the IC chip 5A is an integrated circuit having functions such as storage, calculation, and transmission / reception, and includes a series LC resonance circuit including an inductance L and a capacitance C of the circuit shown in FIG.
- the capacitive coupling means is constituted by a series capacitance circuit or a series LC circuit in the IC chip 5A.
- the IC chip 5A is connected to the slot 3 via the series LC resonance circuit.
- the magnetic field generated in the slot 3 is magnetically coupled to the internal magnetic field of the microstrip antenna composed of the ground conductor 1 and the conductor 2 as in the first embodiment. Therefore, the equivalent circuit of the wireless communication apparatus of FIG. 20 is substantially the same as the circuit shown in FIG.
- the wireless communication apparatus of FIG. 20 can also be matched to an arbitrary load impedance. That is, optimal impedance matching can be realized with respect to the input impedance of the IC chip 5A, and a broadband wireless communication apparatus can be obtained. Further, since it is not necessary to attach the capacitive coupling means 4a and 4b, the manufacturing becomes easy and the cost can be reduced.
- the inductance L and the capacitance C are configured in the IC chip 5A.
- the inductance L is obtained by adjusting the slot length Ls without incorporating the inductance L in the IC chip 5A. You may do it.
- 20 illustrates the case where the IC chip 5A is applied to the configuration of FIG. 1 (Embodiment 1).
- the configuration is not limited to the configuration example of FIG. 20, and FIGS. Needless to say, the present invention can be similarly applied to the configurations of the second to fifth embodiments.
- the input impedance at the antenna feeding point (the portion where the IC chip 5 is mounted) and the input impedance of the IC chip 5 have a complex conjugate relationship. You may adjust as follows.
- the input impedance of the IC chip 5 has a high capacitive reactance (capacitance), and when impedance matching is performed between the IC chip 5 and the antenna, the feeding point of the antenna (the part where the IC chip 5 is mounted). It is necessary to adjust the input impedance at to be in a complex conjugate relationship with the input impedance of the IC chip 5. That is, the input impedance of the antenna needs to have a high inductive reactance (inductance).
- the operation of the wireless communication device can be explained by the circuit of FIG. 5, and the input inductance of the microstrip antenna composed of the ground conductor 1 and the conductor 2 is adjusted by adjusting the length of the slot 3. Is possible.
- the length of the slot 3 is appropriately selected, and the input reactance of the microstrip antenna composed of the ground conductor 1 and the conductor 2 is Adjust the input capacitance so that it has a complex conjugate relationship.
- the coupling degree is adjusted by the offset position D and the shape of the slot 3 (for example, the shape of the slot 3A in FIG. 12).
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Abstract
Description
図1はこの発明の実施例1に係る無線通信装置を示す平面図および断面図であり、無線通信装置として機能するRFIDタグの構成を示している。
図1(a)は平面図、図1(b)は図1(a)内のG-G’線に沿う断面図である。
地導体1は、有限の大きさからなる導体であり、たとえば図1(a)に示すように矩形形状を有している。導体2は、板状の導体であり、地導体1と同様に、たとえば矩形形状を有している。
容量性結合手段4a、4bは、スロット3を介して、個別に対向配置されている。
アンテナの可逆性により、アンテナの送信時および受信時の動作は同じなので、以下においては、ICチップ5が接続される位置に電圧が供給された場合について説明する。
図2は図1内の容量性結合手段4a、4bおよびICチップ5を除去した構造を示しており、図2(a)は平面図、図2(b)は図2(a)のH-H’線に沿う断面図である。
図2においては、スロット3の中央からスロット3の片側の端までのスロット長さLsと、スロット3に電圧が印加される給電点Fとが示されている。
この結果、スロット3により、地導体1と導体2からなるマイクロストリップアンテナが励振される。
図3(a)においては、給電点F(図2)からみた入力インピーダンスZinと、地導体1および導体2(図2)からなるマイクロストリップアンテナのインピーダンスZaと、スロット3によって得られるインダクタンスLとが示されている。
すなわち、「Nの2乗」倍を乗じたマイクロストリップアンテナのインピーダンスZa(=N^2・Za)に対して、直列にインダクタンスLが接続された回路構成となる。
図4において、図4(a)は、Ls=0.07λの場合のインピーダンス軌跡Z07λ(Ls)、図4(b)は、Ls=0.09λの場合のインピーダンス軌跡Z09λ(Ls)、図4(c)は、Ls=0.11λの場合のインピーダンス軌跡Z11λ(Ls)、をそれぞれ示している。なお、λは無線通信装置の動作周波数(使用周波数)の中心周波数に対する自由空間波長である。
すなわち、スロット3は、地導体1および導体2からなるマイクロストリップアンテナに対して、直列に挿入されるインダクタンスLとして動作していることが分かる。
容量性結合手段4a、4bは、導体2に対して、間隔dをおいてほぼ平行に配置されていることから、容量性結合手段4a、4bが対向する部分においては、平行平板コンデンサが形成され、高周波的に互いに容量結合する。
また、dは、容量性結合手段4aまたは容量性結合手段4bと導体2との間の間隔であり、εは、容量性結合手段4aまたは容量性結合手段4bと導体2との間の誘電率である。
図5においては、前述(図3(b))の回路に、容量性結合手段4a、4bによって得られるキャパシタンスCが追加されている。すなわち、図5の回路は、インダクタンスLに対して直列にキャパシタンスCが追加された構成となる。
マイクロストリップアンテナとスロット3との結合度は、スミスチャート上のインピーダンス軌跡における「ねじれ」の大きさと密接な関係があり、動作周波数の広帯域化において重要なパラメータとなる。
したがって、図6内の磁界結合長さWsを変えることによって、結合度を変化させることができる。
図6において、導体2の中心を原点Oとし、導体2の表面をx-y平面とし、導体2の共振方向をx軸とし、共振方向に直交する軸をy軸とすると、マイクロストリップアンテナの基本モード(TM10モード)における内部磁界Hyは、以下の式(2)で与えられる。
したがって、図6内の破線矢印Aに該当する部分と導体2の共振方向の中央部(原点O)とのオフセット間隔Dが小さいほど、地導体1および導体2からなるマイクロストリップアンテナの内部磁界とスロット3との磁界結合は強くなると考えることができる。
また、スロット3とマイクロストリップアンテナとの結合度は、スロット3の磁界結合長さWs、またはスロット3のオフセット間隔Dによって調整することができる。
つまり、ICチップ5の入力インピーダンスに対して、最適なインピーダンス整合を実現することができ、広帯域な無線通信装置を得ることができる。
たとえば図9に示すように、スロット3の中央からずらした位置に容量性結合手段4a、4bを配置してもよい。
たとえば図10のように、スロット3を「上向きコの字型」に形成しても、内部磁界の向きに対して平行となるスロット3の一部分において磁界結合されるので、前述と同様の作用効果を奏することができる。
この場合、ICチップ5を外界から保護することができるとともに、不要な突出構造を回避することができ、外観を向上させることができる。
たとえば図11(a)~図11(f)に示すように、スロット3の形状は、線状、円形、三角形、または、円形と線状との複合形状など、種々の形状が選択可能である。また、スロット3を非対称形状に形成してもよく、矩形状の場合に角に丸みを持たせた形状に形成してもよい。
この場合、地導体1、導体2および容量性結合手段4a、4bのそれぞれの間に介在されている誘電体の比誘電率が、各箇所で異なる値に設定されてもよい。
また、誘電体を用いる場合、誘電体多層基板に導体パターンをエッチングする方法、樹脂成形品と板金とを組み合わせる方法、樹脂成形品にメッキを施す方法などを適用して、容易に無線通信装置を製造することができる。
これにより、ICチップ5の入力インピーダンスに対して、最適なインピーダンス整合を実現することができ、広帯域な無線通信装置を得ることができる。
なお、上記実施例1(図1)では、導体2のスロット3の形状を任意としたが、図12に示すように、工夫した形状のスロット3Aを用いることにより、地導体1および導体2からなるマイクロストリップアンテナと、スロット3Aとの結合度の調整が可能となり、設計の自由度を高めることができる。
図12はこの発明の実施例2に係る無線通信装置を構成するRFIDタグを示す平面図であり、前述と同様のものについては、前述と同一符号を付して詳述を省略する。
各折り返しスロット部は、互いに影響する距離範囲内で離間された2地点に互いに平行に設けられた対向スロットを含む。
一方、スミスチャート上のマイクロストリップアンテナのインピーダンス軌跡における「ねじれ」の大きさは、マイクロストリップアンテナの入力抵抗と関連し、一般に、入力抵抗が大きいほど「れじれ」は大きくなる。
これに対し、実施例2に係る無線通信装置では、スロット3Aのほぼ平行となる部分(対向スロット)の間隔Gaを第3のパラメータとして、結合度の調整を行うことができる。
なお、図14(a)~図14(c)においては、いずれの場合も、オフセット間隔Dは0.106λに設定されており、スロット3Aの全長は同一であるものとする。
なお、上記実施例1、2(図1、図12)では、容量性結合手段4a、4bを、導体2のスロット3に対して積層構造により形成したが、図15のように、スロット3Bと同一の平面上に形成してもよい。
図15はこの発明の実施例3に係る無線通信装置を構成するRFIDタグを示す平面図であり、前述(図1参照)と同様のものについては、前述と同一符号を付して詳述を省略する。
この場合、容量性結合手段4A、4Bは、それぞれ第3の導体からなり、容量性結合手段4Aは、スロット3Bの一辺に近接するように配置され、容量性結合手段4Bは、スロット3Bの他辺に近接するように配置されている。
また、容量性結合手段4A、4Bは、スロット3Bの辺に対して、容量結合するように構成されており、たとえば線状の導体からなる。
図16において、インターディジタルキャパシタ6a、6bは、容量性結合手段4A、4Bの櫛歯状の各辺と、容量性結合手段4A、4Bに対向するスロット3Bの櫛歯状の各辺とにより構成されている。
また、図15、図16において、他の構成および動作については、前述の実施例1と同様なので、実施例3に係る無線通信装置の等価回路は、図5で示した回路と実質的に同様のものとなる。
つまり、ICチップ5の入力インピーダンスに対して最適なインピーダンス整合を実現することができ、広帯域な無線通信装置を得ることができる。
また、容量性結合手段4A、4Bは、誘電体基板に導体パターンをエッチングする方法などにより、導体2と同時に製造できるため製造が容易となる。
図17において、チップキャパシタ7a、7bの各一端は、スロット3Cの各内端に接続され、チップキャパシタ7a、7bの各他端は、第3の導体8a、8bを介してICチップ5に接続されている。
または、図17のように、容量性結合手段は、チップキャパシタ7a、7bおよび第3の導体8a、8bにより構成されている。
さらに、スロット3Bと同一平面に形成された容量性結合手段4A、4Bは、誘電体基板に導体パターンをエッチングする方法などにより、導体2と同時に製造できるため製造が容易となる。
なお、上記実施例1~3では、特に言及しなかったが、図18のように、導体2と磁界結合して複共振を生じる位置に無給電素子9を追加配置してもよい。
図18はこの発明の実施例4に係る無線通信装置を構成するRFIDタグを示す断面図であり、前述(図1参照)と同様のものについては、前述と同一符号を付して詳述を省略する。
図18において、無給電素子9は、導体2と磁界結合して複共振を生じる位置に配置されており、無線通信装置の動作周波数帯の共振周波数付近(動作周波数帯の範囲内、または動作周波数帯の近傍)で共振する電気長を有する。他の構成および動作は、前述の実施例1と同様である。
なお、図18においては、地導体1と導体2との間に無給電素子9を配置したが、無給電素子9が導体(放射導体)2と磁界結合して複共振特性が得られれば、無給電素子9の配置構成は、図18の例に限定されるものではない。
たとえば、導体2から見て、地導体1の反対側に無給電素子9を配置してもよく、導体2に対してx方向またはy方向に近接した箇所などに無給電素子9を配置してもよい。
なお、上記実施例1~4では、特に言及しなかったが、図19に示すように、導体(第2の導体)10の一端に短絡導体(第4の導体)11を接続し、短絡導体11を介して、導体10を地導体(第1の導体)1に短絡接続してもよい。
図19はこの発明の実施例5に係る無線通信装置を構成するRFIDタグを示す断面図であり、前述(図1参照)と同様のものについては、前述と同一符号を付して詳述を省略する。
導体10の外周の一部(一端)と地導体1との間は、短絡導体11によって短絡接続されている。これにより、いわゆるショートパッチアンテナを構成している。
また、定在波では、電圧の位相が電流の位相と90度ずれていることにより、放射導体の共振方向の中央の電界は零となる。
また、ショートパッチアンテナのインピーダンス特性も、通常のマイクロストリップアンテナと同様に、並列共振特性となるので、図19の無線通信装置の等価回路は、図5に示した回路と同様のものとなる。他の構成および動作は、前述の実施例1と同様である。
この結果、無線通信装置の大きさを、実施例1の場合に比べて、約半分に小型化することができる。
なお、上記実施例1~5(図1、図12、図15~図19)では、ICチップ5とは別に容量性結合手段を設けたが、図20に示すように、ICチップ5A内に容量性結合手段を構成してもよい。
図20はこの発明の実施例6に係る無線通信装置を構成するRFIDタグを示す平面図および断面図であり、前述(図1参照)と同様のものについては、前述と同一符号を付して詳述を省略する。
図20において、図20(a)は平面図、図20(b)は図20(a)のK-K’線に沿う断面図である。
ここで、ICチップ5Aは記憶、演算、送受信などの機能を有する集積回路であり、図5に示す回路のインダクタンスLおよびキャパシタンスCからなる直列LC共振回路を含んだ構成となっている。
図20のように構成することにより、ICチップ5Aは、直列LC共振回路を介してスロット3に接続される。
したがって、図20の無線通信装置の等価回路は、図5に示す回路と実質的に同様となる。
つまり、ICチップ5Aの入力インピーダンスに対して最適なインピーダンス整合を実現することができ、広帯域な無線通信装置を得ることができる。
また、容量性結合手段4a、4bの取り付けが不要となるので、製造が容易となり、低コスト化を図ることができる。
また、図20では、図1(実施例1)の構成にICチップ5Aを適用した場合について説明したが、図20の構成例に限定されるものではなく、図12、図15~図19(実施例2~5)の構成に対しても同様に適用可能なことは言うまでもない。
なお、上記実施例1~6では特に言及しなかったが、アンテナの給電点(ICチップ5が実装される部分)における入力インピーダンスと、ICチップ5の入力インピーダンスとを、複素共役の関係になるように調整してもよい。
また、容量性結合手段4の取り付けが不要となるので、製造が容易となり、低コスト化を図ることができる。
さらに、前述の実施例6のように、容量性結合手段をICチップ5Cに内蔵する場合でも、回路が簡略化できるという利点がある。
Claims (18)
- 第1の導体と、
前記第1の導体とほぼ平行に配置された第2の導体と、
前記第2の導体に形成された穴と、
前記穴に近接配置された容量性結合手段と、
電波の送信機能および受信機能の少なくとも一方を有する通信回路とを備え、
前記通信回路は、前記第2の導体と前記穴との境界線の近傍の導体上の2つの部位間に、前記容量性結合手段を介して接続されたことを特徴とする無線通信装置。 - 前記穴は、スロット線路により形成されたことを特徴とする請求項1に記載の無線通信装置。
- 前記容量性結合手段を介して前記通信回路を接続する前記2つの部位は、前記スロット線路をまたぐように選択されたことを特徴とする請求項2に記載の無線通信装置。
- 前記容量性結合手段は、前記通信回路の端子に接続された第3の導体を含み、
前記容量性結合手段は、前記第2の導体を前記第3の導体と容量結合させることにより構成されたことを特徴とする請求項1から請求項3までのいずれか1項に記載の無線通信装置。 - 前記容量性結合手段は、インターディジタルキャパシタにより構成されたことを特徴とする請求項4に記載の無線通信装置。
- 前記容量性結合手段は、チップキャパシタにより構成されたことを特徴とする請求項4に記載の無線通信装置。
- 前記第2の導体と磁界結合して複共振を生じる位置に配置された無給電素子を備え、
前記無給電素子は、前記無線通信装置の動作周波数帯の範囲内または近傍で共振する電気長を有することを特徴とする請求項1から請求項6までのいずれか1項に記載の無線通信装置。 - 前記第2の導体の共振方向の中央部の電界が零となる部位に該当する一端に接続された第4の導体を備え、
前記第2の導体は、共振方向の長さがほぼ半分に構成されるとともに、前記第2の導体の前記一端は、前記第4の導体を介して前記第1の導体に短絡接続されたことを特徴とする請求項1から請求項7までのいずれか1項に記載の無線通信装置。 - 前記容量性結合手段は、前記通信回路内の直列キャパシタンス回路により構成されたことを特徴とする請求項1から請求項8までのいずれか1項に記載の無線通信装置。
- 前記容量性結合手段は、前記通信回路内の直列LC回路により構成されたことを特徴とする請求項1から請求項8までのいずれか1項に記載の無線通信装置。
- 前記スロット線路は、少なくとも1つの折り返しスロット部を有し、
前記折り返しスロット部は、互いに影響する距離範囲内で離間された2地点に互いに平行に設けられた対向スロットを含むことを特徴とする請求項1から請求項10までのいずれか1項に記載の無線通信装置。 - 前記対向スロットの距離は、使用周波数の中心周波数に対する波長の0.05倍以下に設定されたことを特徴とする請求項11に記載の無線通信装置。
- 第1の導体と、
前記第1の導体とほぼ平行に配置された第2の導体と、
前記第2の導体に形成された穴と、
電波の送信機能および受信機能の少なくとも一方を有する通信回路とを備え、
前記通信回路は、前記第2の導体と前記穴との境界線の近傍の導体上の2つの部位間に接続されたことを特徴とする無線通信装置。 - 前記穴は、スロット線路により形成されたことを特徴とする請求項13に記載の無線通信装置。
- 前記第2の導体と磁界結合して複共振を生じる位置に配置された無給電素子を備え、
前記無給電素子は、前記無線通信装置の動作周波数帯の範囲内または近傍で共振する電気長を有することを特徴とする請求項13または請求項14に記載の無線通信装置。 - 前記第2の導体の共振方向の中央部の電界が零となる部位に該当する一端に接続された第4の導体を備え、
前記第2の導体は、共振方向の長さがほぼ半分に構成されるとともに、前記第2の導体の前記一端は、前記第4の導体を介して前記第1の導体に短絡接続されたことを特徴とする請求項13から請求項15までのいずれか1項に記載の無線通信装置。 - 前記スロット線路は、少なくとも1つの折り返しスロット部を有し、
前記折り返しスロット部は、互いに影響する距離範囲内で離間された2地点に互いに平行に設けられた対向スロットを含むことを特徴とする請求項13から請求項16までのいずれか1項に記載の無線通信装置。 - 前記対向スロットの距離は、使用周波数の中心周波数に対する波長の0.05倍以下に設定されたことを特徴とする請求項17に記載の無線通信装置。
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US13/122,025 US8659495B2 (en) | 2008-10-27 | 2009-07-22 | Wireless communication device |
EP09823391.9A EP2343834A4 (en) | 2008-10-27 | 2009-07-22 | RADIO COMMUNICATION DEVICE |
CN200980142585.8A CN102204112B (zh) | 2008-10-27 | 2009-07-22 | 无线通信装置 |
JP2010535708A JP5328803B2 (ja) | 2008-10-27 | 2009-07-22 | 無線通信装置 |
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PCT/JP2008/069433 WO2010049984A1 (ja) | 2008-10-27 | 2008-10-27 | 無線通信装置 |
JPPCT/JP2008/069433 | 2008-10-27 |
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PCT/JP2009/063100 WO2010050278A1 (ja) | 2008-10-27 | 2009-07-22 | 無線通信装置 |
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US (1) | US8659495B2 (ja) |
EP (1) | EP2343834A4 (ja) |
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WO2010049984A1 (ja) | 2010-05-06 |
EP2343834A1 (en) | 2011-07-13 |
CN102204112A (zh) | 2011-09-28 |
CN102204112B (zh) | 2014-03-12 |
EP2343834A4 (en) | 2013-08-21 |
US20110175790A1 (en) | 2011-07-21 |
US8659495B2 (en) | 2014-02-25 |
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