WO2010044374A1 - Structure de dissipation de chaleur - Google Patents

Structure de dissipation de chaleur Download PDF

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Publication number
WO2010044374A1
WO2010044374A1 PCT/JP2009/067605 JP2009067605W WO2010044374A1 WO 2010044374 A1 WO2010044374 A1 WO 2010044374A1 JP 2009067605 W JP2009067605 W JP 2009067605W WO 2010044374 A1 WO2010044374 A1 WO 2010044374A1
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WO
WIPO (PCT)
Prior art keywords
heat
sheet
heat dissipation
circuit pattern
pattern layer
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PCT/JP2009/067605
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English (en)
Japanese (ja)
Inventor
裕久 横倉
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有限会社アイレックス
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Publication of WO2010044374A1 publication Critical patent/WO2010044374A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a heat dissipation structure that efficiently dissipates heat generated from a power device or a light emitting device to the outside.
  • Heat-generating electronic components such as power devices and light-emitting devices (hereinafter also referred to as heat-generating devices) are overheated by the heat generated by themselves and their own temperature rises, resulting in deterioration of electrical characteristics or optical properties. Degradation of performance such as deterioration of characteristics occurs. Therefore, in order to maintain the performance of the exothermic device, it is necessary to efficiently dissipate heat generated from the exothermic device to suppress the temperature rise of the exothermic device.
  • the heat dissipation mechanism refers to a mechanism in which a heat dissipation structure including a printed wiring board on which a heat generating device is mounted and a heat dissipation plate or a heatsink (heat sink: heat ⁇ ⁇ ⁇ ⁇ ⁇ sink) are closely attached.
  • a heat dissipation sheet formed by using a graphite film obtained by sheeting graphite powder such as natural graphite and forming an inorganic substance layer on the surface of the graphite film is disclosed (see Patent Document 9).
  • the inorganic material layer formed on the surface of the graphite film is a metal film formed by plating or the like, or an inorganic material film formed by directly applying a liquid material for forming an inorganic material on the graphite film.
  • Etc. This heat radiating sheet is characterized by having a flexibility that it can be easily attached to a curved portion of an electronic device or the like.
  • a heat dissipation structure including a heat dissipation sheet configured using a graphite material as a heat conductive layer
  • dust such as carbon powder is generated from the cut surface of the heat dissipation sheet.
  • the dust such as carbon powder adheres to the printed wiring portion of the printed wiring board constituting the heat dissipation structure or the exothermic device attached to the main surface of the printed wiring board, resulting in inconvenience such as an electrical short circuit. there is a possibility.
  • the inventor of the present invention has conducted a number of trials, and as a result, heat is efficiently generated by a heat dissipation sheet formed by closely adhering a polypyrrole infiltrated sheet infiltrated with a polypyrrole polymer into a cellulose sheet and a metal layer. I found it to be dissipated. Moreover, it has been found that heat can be efficiently dissipated by a heat dissipating sheet formed by adhering a metal sheet to the main surface and / or the back surface of the polypyrrole infiltrating sheet via an adhesive member. . Moreover, it was confirmed that no dust such as carbon powder was generated from these heat radiation sheets.
  • the inventor of the present invention can form a heat dissipation structure including a printed wiring board configured to be connected to the back surface conductor pattern through a through hole, and a heat dissipation sheet including the above-described polypyrrole infiltrating sheet as a component. Based on the excellent heat dissipation characteristics of the heat dissipation sheet, the inventors have come to realize that a heat dissipation structure capable of efficiently dissipating the heat generated by the exothermic device is realized.
  • the present invention has the thermal characteristics that the heat generated by the exothermic device can be efficiently dissipated, and the generation of dust such as carbon powder that adversely affects the electrical characteristics of the exothermic device and
  • An object of the present invention is to provide a heat dissipation structure having no metal fiber protrusion.
  • the heat dissipating structure has the following structural features.
  • the first heat dissipating structure of the present invention dissipates the heat of the exothermic device configured to include a substrate on which the exothermic device is mounted on the main surface and a heat dissipating sheet closely attached to the back surface of the substrate.
  • This is a heat dissipation structure.
  • the heat radiating sheet is configured such that a metal layer is in close contact with either or both of the main surface and the back surface of a polypyrrole infiltrated sheet in which a polypyrrole polymer is infiltrated into a cellulose sheet.
  • the second heat dissipation structure of the present invention is similar in configuration to the first heat dissipation structure, but the configuration of the heat dissipation sheet is different. That is, the heat radiating sheet provided in the second heat radiating structure has a metal sheet via an adhesive member on both or either one of the main surface and the back surface of the polypyrrole infiltrated sheet in which the polypyrrole polymer is infiltrated into the cellulose sheet. It is composed by bonding.
  • the above-mentioned substrate has a front surface circuit pattern layer made of a conductive material formed on the main surface thereof, and a back surface circuit pattern layer made of a conductive material formed on the back surface. It is preferable that the layer is electrically connected through a through hole.
  • an internal circuit pattern layer made of a conductive material is interposed inside the substrate, and the internal circuit pattern layer is a surface circuit pattern layer formed on the main surface of the substrate through a through hole. And, it is preferable that the back surface circuit pattern layer formed on the back surface of the substrate is electrically connected.
  • the internal circuit pattern layer may be provided in a plurality of layers separated in the thickness direction of the substrate.
  • the heat dissipation sheet provided with the first and second heat dissipation structures of the present invention includes a polypyrrole infiltrated sheet infiltrated with a polypyrrole polymer, and the polypyrrole infiltrated sheet has a metal layer directly adhered thereto, or a metal sheet Are bonded via an adhesive member.
  • the thermal conductivity of the polypyrrole infiltrated sheet is smaller than the thermal conductivity of the metal sheet or metal layer.
  • this heat dissipation sheet is configured such that the polypyrrole infiltrated sheet is in close contact with the metal sheet or the metal layer, the heat diffusivity ⁇ p parallel to the surface of the heat dissipation sheet is greater than the heat diffusivity ⁇ t in the vertical direction, That is, ⁇ p / ⁇ t> 1.
  • the isothermal surface when the heat radiating sheet is closely attached to the substrate spreads at a higher speed in a direction parallel to the direction perpendicular to the surface of the heat radiating sheet.
  • the thermal conductivity is a physical quantity indicating the propagation characteristic of thermal energy
  • the thermal diffusivity is a physical quantity indicating the propagation characteristic of temperature. That is, the temperature diffusivity is a value proportional to the thermal conductivity of the material and inversely proportional to the heat capacity.
  • Thermal resistance means the amount of temperature rise with respect to the amount of heat generated per unit time, and approximately the reciprocal of the heat transfer coefficient between the heat generating device (high temperature part) and the heat sink (low temperature part). It is calculated by dividing by the contact area.
  • the heat transfer coefficient is obtained by dividing the thermal energy passing through the unit area in a short time between the exothermic device and the heat sink by the temperature difference between the exothermic device and the heat sink. That is, the thermal resistance is a numerical value indicating difficulty in transmitting temperature, and the larger the numerical value, the harder it is to transmit temperature.
  • the thermal resistance can be defined.
  • the first and second heat dissipating structures of the present invention are parallel to the surface of the heat dissipating sheet that is in close contact with the heat dissipating sheet provided in the heat dissipating structure through the printed wiring board. It has a thermal characteristic that a high temperature region is formed in a short time over a wide range of the heat sink surface that diffuses quickly along the direction and is in contact with the heat dissipation sheet. The total amount of heat absorbed by the heat sink per unit time is larger as the temperature of the heat sink surface in contact with the heat radiating sheet is higher over a wide range.
  • the heat generated from the heat generating device can be efficiently dissipated.
  • the heat dissipation sheet constituting the heat dissipation structure of the present invention does not generate carbon powder or the like during work processing such as cutting processing. Therefore, according to the heat dissipation structure of the present invention, there is no inconvenience that carbon powder or the like adheres to the electronic module attached to the heat dissipation structure or the like and an electrical short circuit occurs.
  • FIG. 5 is a diagram for explaining the configuration of the heat dissipation sheet and the manufacturing method thereof, and (A) and (B) are perpendicular to the main surface and the back surface of the heat dissipation sheet, which are components of the first and second heat dissipation structures, respectively.
  • FIG. 3 is a schematic cross-sectional structure diagram cut in various directions.
  • FIG. 6 is a diagram for explaining a verification experiment on thermal properties of a heat dissipation sheet that is a component of the first and second heat dissipation structures of the embodiment of the present invention.
  • FIG. 5 is a diagram for explaining the configuration of the heat dissipation sheet and the manufacturing method thereof, and (A) and (B) are perpendicular to the main surface and the back surface of the heat dissipation sheet, which are components of the first and second heat dissipation structures, respectively.
  • FIG. 3 is a schematic cross-sectional structure diagram cut in various directions.
  • FIG. 6 is a diagram
  • FIG. 6 is a diagram showing a change in temperature over time in CH1 to CH8 when a heat dissipation sheet, which is a component of the first heat dissipation structure of the embodiment of the present invention, is used as the heat dissipation sheet 44.
  • FIG. 7 is a diagram showing a change in temperature over time in CH1 to CH8 when a heat radiating sheet constituted by integrating a conventional graphite sheet with a net made of a metal wire is used as a heat radiating sheet.
  • FIG. 6 is a diagram showing a change in temperature over time in CH1 to CH8 when the electric wiring board and the heat sink are in direct contact with each other without using a heat dissipation sheet.
  • FIG. 1 is a diagram for explaining a heat dissipation structure of a first embodiment of the present invention, and is a schematic cross-sectional configuration diagram including a heat dissipation sheet and a heat sink.
  • FIG. 4 is a diagram for explaining a heat dissipation structure according to a second embodiment of the present invention, and is a schematic cross-sectional structure diagram including a heat dissipation sheet and a heat sink.
  • FIG. 6 is a diagram for explaining a heat dissipation structure according to a third embodiment of the present invention, and is a schematic cross-sectional structure diagram including a heat dissipation sheet and a heat sink.
  • FIG. 1 is a diagram for explaining an LED backlight module using the heat dissipation structure of the present invention
  • A is a front view of the LED backlight module
  • B is a side view
  • C is a back surface.
  • D is a sectional structure figure expanding and showing a side view. It is a figure where it uses for description about evaluation of the thermal characteristic of the LED backlight module using the thermal radiation structure of this invention.
  • FIGS. 1A and 1B are schematic cross-sectional structure diagrams cut in a direction perpendicular to a main surface and a back surface of a heat dissipation sheet, which is a component of the first and second heat dissipation structures, respectively.
  • a heat radiating sheet that is a component of the first heat generating structure is referred to as a first heat radiating sheet
  • a heat radiating sheet that is a component of the second heat generating structure is referred to as a second heat radiating sheet.
  • the first heat dissipating sheet shown in FIG. 1 (A) is configured by adhering a metal layer to at least one of the main surface 18a and the back surface 18b of the polypyrrole infiltrating sheet 18 in which a cellulose sheet is infiltrated with a polypyrrole polymer.
  • the FIG. 1 (A) shows an example in which the metal layer 16 and the metal layer 20 are formed on the main surface 18a and the back surface 18b of the polypyrrole infiltrating sheet 18, respectively. It is sufficient that one of them is formed.
  • the formation of the first heat radiation sheet shown in FIG. 1 (A) can be performed by three manufacturing methods, and these methods are as follows.
  • the first method is a step of producing a polypyrrole infiltrated sheet in which a polypyrrole polymer is infiltrated into a cellulose sheet (hereinafter also referred to as step (2-1-1)) and at least one of the polypyrrole infiltrated sheet.
  • This is a method including a step of forming a metal layer on one surface by a vacuum deposition method (hereinafter also referred to as a (2-1-2) step).
  • the second method is a step of making a polypyrrole polymer infiltrated into a cellulose sheet to produce a polypyrrole infiltrated sheet (hereinafter also referred to as the (2-2-1) step) and at least one of the polypyrrole infiltrated sheet.
  • This method includes a step of forming a metal layer by printing and fixing metal fine particles on one surface (hereinafter also referred to as a (2-2-2) step).
  • the third method is a step of infiltrating a polypyrrole polymer into a cellulose sheet to produce a polypyrrole infiltrated sheet (hereinafter also referred to as the (2-3-1) step) and at least one of the polypyrrole infiltrated sheet.
  • This method includes a step of forming a metal layer on one surface by a plating method (hereinafter also referred to as a (2-3-2) step).
  • the (2-1-1) step, the (2-2-1) step and the (2-3-1) step are common to produce a polypyrrole infiltrated sheet in which a polypyrrole polymer is infiltrated into a cellulose sheet. Since these are steps, these steps will be described collectively below.
  • the step of producing the polypyrrole infiltrating sheet includes (3-1) and (3-2) steps.
  • Step (3-1) is a step of impregnating the cellulose sheet with cupric chloride, and is performed as follows. For example, a filter paper having a thickness of 0.1 mm for filtration is immersed in an aqueous solution of cupric chloride having a concentration of 2 mol / liter so that the cupric chloride is sufficiently soaked in the filter paper. Thereby, the (3-1) step is executed.
  • the evaluation of thermal characteristics described later was performed on the first heat radiating sheet composed of a polypyrrole infiltrated sheet prototyped using the filter paper having a thickness of 0.1 mm for the filtering operation described here as a constituent element.
  • the polypyrrole infiltrated sheet is not limited to forming using a filter paper having a thickness of 0.1 mm for filtration work, and is a commercially available filter paper made from cotton fibers whose main component is a cellulose sheet. Alternatively, it can be formed using Japanese paper or the like as appropriate.
  • Step (3-2) is a step of bringing pyrrole in a gaseous state into contact with a cellulose sheet impregnated with cupric chloride, and is performed as follows. For example, pyrrole is heated to 80 ° C. to vaporize, and a filter paper infiltrated with polypyrrole polymer is formed by passing the vaporized pyrrole vapor through a filter paper soaked with cupric chloride for 10 minutes.
  • the first (2-1-2) step in the first method is a step of forming a metal layer on at least one surface of the polypyrrole infiltrated sheet by a vacuum deposition method.
  • a vacuum deposition method For the metal layer, copper, gold, silver, aluminum or the like is appropriately selected, and these metals are vaporized in vacuum by resistance heating or electron beam overheating, and vacuum deposition is performed on at least one surface of the polypyrrole infiltrated sheet. Just do it. At this time, it is not necessary to make the vapor deposition range the entire main surface or back surface of the polypyrrole infiltrated sheet.
  • the vapor deposition range can be set as appropriate according to the form of use of the first heat dissipation sheet.
  • the step (2-2-2) in the second method is realized by printing and fixing metal fine particles on at least one surface of the polypyrrole infiltrated sheet using a printing technique.
  • the printing range need not be the entire main surface or back surface of the polypyrrole infiltrated sheet. It is possible to set the printing range as appropriate according to the use form of the first heat dissipation sheet.
  • the step (2-3-2) in the third method is realized by plating a metal layer on at least one surface of the polypyrrole infiltrated sheet using a plating solution.
  • the plating solution can be prepared, for example, by adding 150 g of cupric sulfate and 20 ml of sulfuric acid to 500 ml (milliliter) of distilled water and stirring to completely dissolve the cupric sulfate. This plating solution was set to 35 ° C., and the main surface and the back surface of the polypyrrole infiltrated sheet were plated. In carrying out the plating, a polypyrrole infiltrated sheet was connected to the cathode to form a copper layer having a thickness of 0.02 mm.
  • the surface on which the metal layer is not formed is an insulator film such as a polymer film.
  • the (2-1-2) step, the (2-2-2) step, and the (2-3-2) step may be executed after covering.
  • the first heat-dissipating sheet in which the metal layer is formed only in the required area is produced.
  • the range in which the metal layer is formed by the (2-1-2) step, the (2-2-2) step, and the (2-3-2) step as appropriate according to the use form of the first heat dissipation sheet Can be set.
  • the second heat dissipation sheet shown in FIG. 1 (B) is a metal sheet via an adhesive member on at least one of the main surface 26a and the back surface 26b of the polypyrrole infiltrated sheet 26 in which the polypyrrole polymer is infiltrated into the cellulose sheet. It is composed by bonding.
  • a metal sheet 22 is bonded to the main surface 26a of the polypyrrole infiltrating sheet 26 via an adhesive member 24, and a metal sheet 30 is bonded to the back surface 26b via an adhesive member 28.
  • the second heat radiation sheet is shown, any one of the metal sheet 22 and the metal sheet 30 may be formed.
  • a double-sided adhesive tape (product number NW-50) manufactured by Nichiban Co., Ltd. or cemedine (product number SX720W) which is an acrylic modified silicone resin manufactured by Cemedine Co., Ltd. is appropriately selected and used. It is possible.
  • FIG. 2 is a diagram for explaining the verification experiment about the thermal properties of the heat dissipation sheet according to the embodiment of the present invention, and schematically shows the arrangement relationship of the exothermic device 40, the electrical wiring board 42, the heat dissipation sheet 44, and the heat sink 46.
  • FIG. 2 is a diagram for explaining the verification experiment about the thermal properties of the heat dissipation sheet according to the embodiment of the present invention, and schematically shows the arrangement relationship of the exothermic device 40, the electrical wiring board 42, the heat dissipation sheet 44, and the heat sink 46.
  • a 1 W light emitting diode was used as the exothermic device 40.
  • the electrical wiring board 42 a well-known universal printed circuit board was used.
  • This universal printed circuit board is a universal printed circuit board (model number: ICB-93SHG) manufactured by Sanhayato Co., Ltd., formed using a glass epoxy material.
  • the heat sink 46 an aluminum plate heat sink made of aluminum and having a thickness of 0.5 mm was used.
  • the electric wiring board 42, the heat radiation sheet 44, and the heat sink 46 are cut into 60 mm squares and overlapped as shown in FIG.
  • the center position of the exothermic device 40 is a position 5 mm away from one side of a 60 mm square, and is arranged at an equal distance from two sides perpendicular to the one side.
  • the thermal characteristics were verified using the heat dissipation sheet shown in FIG. 1 (A) and a heat dissipation sheet composed of a graphite material for comparison.
  • the thermal characteristics in the case where the electric wiring board 42 and the heat sink 46 are in direct contact with each other without using these heat radiating sheets were also verified.
  • the heat dissipation sheet shown in FIG. 1B is the same as the thermal characteristics of the heat dissipation sheet shown in FIG.
  • Evaluation of the thermal characteristics of the heat-dissipating sheet was performed by observing changes in temperature with time from the start of energization to the exothermic device 40 at a total of 8 locations of CH1 to CH8 shown in FIG. CH1, CH3, CH5, and CH7 indicate temperature measurement points on the surface of the electrical wiring board 42 on the side where the exothermic device 40 is installed. Further, CH2, CH4, CH6, and CH8 indicate temperature measurement points on the surface of the heat sink 46 opposite to the side where the electric wiring board 42 is installed.
  • CH1 is a temperature measurement point set immediately below the exothermic device 40, and CH3, CH5, and CH7 are located at positions 15 mm, 30 mm, and 45 mm away from the exothermic device 40, respectively. This is the set temperature measurement point.
  • CH2 is a temperature measurement point set directly under the exothermic device 40, and CH4, CH6, and CH8 are temperature measurement set at positions 15 mm, 30 mm, and 45 mm away from the exothermic device 40, respectively. It is a point.
  • Table 1 shows a summary of the thermal resistance required in the evaluation of the thermal characteristics of the heat dissipation sheet.
  • the vertical columns labeled I and II show the magnitude of thermal resistance when using a heat radiating sheet composed of the first heat radiating sheet and the graphite material shown in FIG. It is shown.
  • the vertical column shown as III shows the magnitude of the thermal resistance when no heat dissipation sheet 44 is installed.
  • the horizontal columns labeled A to H in Table 1 show the values of thermal resistance between the two locations shown below.
  • Column A is the thermal resistance value between the exothermic device and the space in contact with this exothermic device
  • column B is the thermal resistance value between the space in contact with CH2 and CH2
  • column C is in contact with CH3 and CH3
  • D column is the thermal resistance value between the space in contact with CH4 and CH4
  • E column is the thermal resistance value between the space in contact with CH5 and CH5
  • F column is CH6
  • the thermal resistance value between the space in contact with CH6 indicates the thermal resistance value between the space in contact with CH7 and CH7
  • the H column indicates the thermal resistance value between the space in contact with CH8 and CH8. ing.
  • FIG. 3 is a diagram showing a change in temperature over time in CH1 to CH8 when the heat dissipation sheet, which is a component of the first heat dissipation structure of the embodiment of the present invention, is used as the heat dissipation sheet 44.
  • FIG. The horizontal axis shows time in units of minutes, and the vertical axis shows temperature in degrees Celsius.
  • the heat radiating sheet which is a component of the first heat radiating structure according to the embodiment of the present invention, has a 0.1 mm thick copper plate attached to a polypyrrole infiltrated sheet formed using 0.1 mm thick filter paper. It is a heat radiating sheet configured to be in direct contact without being used.
  • the universal printed circuit board as the electric wiring board 42 and the heat dissipation sheet 44 are in direct contact with each other, and the aluminum heat sink as the heat sink 46 and the heat dissipation sheet 44 are in close contact with each other.
  • the temperature change at the temperature measurement point CH1 set immediately below the exothermic device 40 reaches 45.4 ° C. three minutes after the start of energization of the light emitting diode as the exothermic device. Finally, the temperature reaches 52.7 ° C. and is in a thermal equilibrium state.
  • the temperature measurement points CH2 to CH8 are approximately 15 ° C. lower than CH1.
  • the thermal resistance value is approximately 21.2 ° C / W to 37.3 ° C / W.
  • FIG. 4 shows a conventional heat dissipating sheet 44 disclosed in Patent Document 3 as a heat dissipating sheet 44 for comparison with the case where the heat dissipating sheet as a heat dissipating sheet 44 is a component of the first heat dissipating structure of the embodiment of the present invention.
  • Temperature in CH1 to CH8 when using the same type of heat dissipation sheet (made by Japan Matex Co., Ltd., trade name “Jits 3D Thermal Conduction Sheet”) composed of a graphite sheet sandwiched by a mesh of metal wire It is a figure which shows the time change of.
  • the thickness of this heat dissipation sheet is 0.15 mm.
  • the horizontal axis of FIG. 4 shows time in units of minutes, and the vertical axis shows temperature in units of degrees Celsius.
  • the temperature change at the temperature measurement point CH1 set immediately below the exothermic device 40 reaches 49.1 ° C. 3 minutes after the start of energization of the light emitting diode as the exothermic device. Finally, the temperature reaches 57.5 ° C. and is in a thermal equilibrium state.
  • the temperature measurement points CH2 to CH8 are approximately 15 ° C to 18 ° C lower than CH1.
  • the heat resistance value is approximately 19.0 ° C / W to 32.7 ° C / W.
  • FIG. 5 is a diagram showing the time change of temperature in CH1 to CH8 when the electric wiring board 42 and the heat sink 46 are in direct contact without using the heat dissipation sheet 44.
  • FIG. The horizontal axis shows time in units of minutes, and the vertical axis shows temperature in degrees Celsius.
  • the temperature change at the temperature measurement point CH1 set immediately below the exothermic device 40 reaches 93.6 ° C. 3 minutes after the start of energization of the light emitting diode as the exothermic device. Further, it can be seen that the temperature tends to increase with time.
  • the temperature measurement points CH2 to CH8 are approximately 60 ° C. lower than CH1.
  • the temperature change at the temperature measurement point CH1 set immediately below the exothermic device 40 when using the heat dissipation sheet shown in FIG. 3 and FIG. 4 described above remains in the range of 50 ° C. to 60 ° C.
  • the temperature at CH1 rises to 90 ° C. or more. From this, it can be seen that the temperature rise of the exothermic device can be effectively prevented by using the heat dissipation sheet.
  • the thermal resistance value when the heat radiating sheet 44 is not used is approximately 14.5 ° C./W to 75.5 ° C./W.
  • the thermal resistance value between the exothermic device shown in column A of Table 1 and the space in contact with the exothermic device is remarkably high. That is, if the heat dissipation sheet 44 is not used, the heat generated from the exothermic device cannot be effectively dissipated, and the temperature rise of the exothermic device is large, resulting in performance such as deterioration in electrical characteristics or optical characteristics. This suggests the possibility of degradation.
  • heat dissipating sheet comprising a polypyrrole infiltrating sheet
  • heat dissipating is constructed by sandwiching a conventional graphite sheet, which is said to have excellent heat dissipation properties, with a net made of metal wire. It was confirmed that the heat dissipation effect equivalent to or higher than that of the sheet was realized.
  • the heat dissipating sheet comprising the polypyrrole infiltrating sheet has an excellent characteristic that dust such as carbon powder that adversely affects the electronic module is not generated.
  • Heat dissipation structure The difference between the first heat dissipating structure and the second heat dissipating structure of the present invention lies in the structure of the heat dissipating sheet as a component. Since the structure of the heat dissipating sheet used for the first and second heat dissipating structures of the present invention has already been described, the exothermic property commonly used for the first and second heat dissipating structures of the present invention is described below. The configuration of the substrate on which the electronic component is mounted will be described with reference to three examples.
  • first and second heat dissipation structures are not distinguished and may be simply referred to as a heat dissipation structure.
  • first and second heat radiating sheets may be simply referred to as heat radiating sheets unless it is particularly necessary to distinguish them.
  • FIGS. 6 to 8 the heat radiating structures of the first to third embodiments of the present invention will be described.
  • any of the first and second heat dissipating sheets described above can be used as the heat dissipating sheet.
  • FIG. 6 is a diagram for explaining the heat dissipation structure of the first embodiment, and is a schematic cross-sectional configuration diagram including a heat dissipation sheet and a heat sink.
  • the heat dissipation structure 54 of the first embodiment includes a glass epoxy substrate 50 having a heat generating device 60 mounted on the main surface 50a, and a heat dissipation sheet 52 in close contact with the back surface 50b of the substrate 50. ing.
  • the substrate 50 is not limited to a glass epoxy substrate, and may be an aluminum substrate configured with an insulating layer for electrical insulation from the exothermic device 60 or the like.
  • a front circuit pattern layer 62 made of a conductive material is formed on the main surface 50a of the substrate 50, and a back circuit pattern layer 66 made of a conductive material is formed on the back surface 50b.
  • the front surface circuit pattern layer 62 and the back surface circuit pattern layer 66 are electrically connected through the through hole 64.
  • the front surface circuit pattern layer 62 and the back surface circuit pattern layer 66 mean, for example, copper wiring layers formed on the main surface 50a and the back surface 50b of the substrate 50 made of glass epoxy, on which circuit patterns are formed.
  • the exothermic device 60 is mounted so as to be in close contact with the surface circuit pattern layer 62 with the insulating layer 58 interposed therebetween.
  • the heat dissipation sheet 52 is in close contact with the back surface 50b of the substrate 50, and the heat sink 56 is in close contact with the heat dissipation sheet 52.
  • the heat sink 56 is a commonly used aluminum plate or an aluminum plate having a fin structure or the like.
  • the exothermic device 60 refers to an active electronic element such as a light emitting diode (LED: “Light Emitting Diode”), a logic integrated circuit, and a power transistor.
  • LED Light Emitting Diode
  • the heat generated in the exothermic device 60 is transmitted to the surface circuit pattern layer 62 through the insulating layer 58, and is propagated through the surface circuit pattern layer 62 and diffused.
  • the heat diffused to the front surface circuit pattern layer 62 propagates through the through-holes to the back surface circuit pattern layer 66 and is diffused.
  • the heat that reaches the back surface circuit pattern layer 66 and is diffused is transferred to the heat dissipation sheet 52.
  • the heat transmitted to the heat radiating sheet 52 is transmitted to the heat sink 56 that is in close contact with the heat radiating sheet 52, and is radiated to the outside.
  • the heat-dissipating sheet 52 in close contact with the substrate 50 has the property of spreading heat at a higher speed in a direction parallel to the direction perpendicular to the surface of the heat-dissipating sheet 52 as described above. Therefore, when the heat generated from the exothermic device 60 is transferred to the heat radiating sheet 52 through the substrate 54, it quickly diffuses along the direction parallel to the surface of the heat radiating sheet 52 and is in contact with the heat radiating sheet 52. A high temperature region is formed in a short time over a wide range of the main surface 56a of 56.
  • the total amount of heat absorbed by the heat sink 56 per unit time is larger as the temperature of the main surface 56a of the heat sink 56 in contact with the heat dissipation sheet 52 is higher over a wide range. That is, if the heat generating device 60 and the heat sink 56 are indirectly contacted via the heat dissipation structure 54, the heat generated from the heat generating device 60 can be efficiently dissipated.
  • FIG. 7 is a diagram for explaining the heat dissipation structure of the second embodiment, and is a schematic cross-sectional configuration diagram including a heat dissipation sheet and a heat sink.
  • the heat dissipation structure 74 of the second embodiment is different from the heat dissipation structure 54 of the first embodiment described above in that an internal circuit pattern layer 68 is provided inside the substrate 70. Since the other components are the same as those of the heat dissipation structure 54 of the first embodiment, a duplicate description is omitted.
  • the internal circuit pattern layer 68 is, for example, a layered copper plate formed as a plane parallel to the main surface 70a and the back surface 70b inside a glass epoxy substrate 70, and a copper wiring layer on which a circuit pattern is formed Can be.
  • the heat dissipation structure 74 of the second embodiment is provided with the internal circuit pattern layer 68 inside the substrate 70, the heat generated from the exothermic device 60 is once generated in the internal circuit pattern layer 68 by the internal circuit pattern layer 68. Since diffusion is performed along the horizontal direction, the thermal diffusion efficiency in the substrate 70 is increased. Therefore, the heat generated from the exothermic device 60 can be dissipated more efficiently than the heat dissipation structure of the first embodiment described above.
  • FIG. 8 is a diagram for explaining the heat dissipation structure of the third embodiment, and is a schematic cross-sectional structure diagram including a heat dissipation sheet and a heat sink.
  • the heat dissipating structure 76 of the third embodiment is that the first internal circuit pattern layers 68-1 and 68-2 are provided in the substrate 72 so as to be separated from each other in the thickness direction of the substrate.
  • the heat dissipating structures 54 and 74 of the second embodiment are different.
  • the other constituent elements are the same as those of the heat dissipation structures 54 and 74 of the first and second embodiments, and a duplicate description is omitted.
  • the internal circuit pattern layers 68-1 and 68-2 are formed in a plane parallel to the main surface 72a and the back surface 72b in the glass epoxy substrate 72, for example, in the thickness direction of the substrate.
  • the copper plates are layered copper plates that are spaced apart from each other, and may be copper wiring layers on which circuit patterns are formed.
  • the heat generated from the exothermic device 60 is temporarily reduced to the internal circuit pattern layer.
  • the thermal diffusion efficiency in the substrate 72 is increased. Since the substrate 72 includes two internal circuit pattern layers, the lateral diffusion efficiency of the heat generated from the heat generating device 60 is higher than that of the substrate 70 of the second embodiment. Generally, the greater the number of internal circuit pattern layers provided in the substrate, the higher the lateral diffusion efficiency of heat in the substrate.
  • the heat dissipation structure 76 of the third embodiment can dissipate heat generated from the exothermic device 60 more efficiently than the heat dissipation structures of the first and second embodiments described above.
  • FIGS. 9A to 9D an LED backlight module using the heat dissipation structure of the present invention will be described.
  • 9 (A) is a front view of the LED backlight module
  • FIG. 9 (B) is a side view
  • FIG. 9 (C) is a back view
  • FIG. 9 (D) is an enlarged side view.
  • FIG. 9 (A) is a front view of the LED backlight module
  • FIG. 9 (B) is a side view
  • FIG. 9 (C) is a back view
  • FIG. 9 (D) is an enlarged side view.
  • the LED backlight module using the heat dissipation structure of the present invention is configured by fixing a heat dissipation structure 82 on which the LED lamp 80 is mounted to a heat sink 84 having a function as an attachment part.
  • the heat dissipation structure 82 the heat dissipation structure of the first embodiment of the present invention described above is used.
  • the heat dissipating structure 82 is configured such that a heat dissipating sheet 82-2 is in close contact with a substrate 82-1 to which an LED rod 80 is attached.
  • the heat radiation sheet 82-2 is attached so as to extend from a portion sandwiched between the substrate 82-1 and the heat sink 84 to a portion sandwiched between the aluminum back support panel 86 and the heat sink 84.
  • the size of the surface plate 92 is A4 size (length 210 mm, width 297 mm). That is, the dimension of the front view of the LED backlight module in FIG. 9A corresponds to the A4 size.
  • heat is also generated from the LED lamp 80, and this heat is transmitted to the heat sink 84 and the aluminum back support panel 86 through the heat dissipating structure 82 and diffused to the outside.
  • an LED backlight module was constructed without using the heat dissipation structure of the present invention, and the same experiment was conducted.
  • this comparative experiment when a forward current of 60 mA was applied to the LED 80 to emit light, it was confirmed that the temperature of the LED °C 80 exceeded 100 ° C and the luminous efficiency dropped to 70%.
  • the evaluation of the thermal characteristics of the LED backlight module using the heat dissipation structure of the present invention is based on the change in temperature with time from the start of energization at a total of 5 points A to E shown in FIGS. 9 (A) to 9 (D). Done by observing. A and B indicate measurement points in the vicinity of the LED lamp 80, and C and D indicate measurement points of the heat sink 84. Although the temperature F of the frame of the LED backlight module is not shown in FIGS. 9A to 9D, it is the room temperature around the LED backlight module. G represents the center position of the front surface of the LED backlight module, and E represents the center position of the back surface of the LED backlight module.
  • FIG. 10 is a diagram for explaining the evaluation of the thermal characteristics of the LED backlight module using the heat dissipation structure of the present invention.
  • the horizontal axis shows the time elapsed from the start of energization of the LED lamp 80 in units of minutes.
  • the vertical axis on the left shows the temperature in A to F in units of ° C.
  • the vertical axis on the right shows the illuminance G of the surface plate 92 in units of Lux.
  • the illuminance G of the surface plate 92 decreased immediately after the start of energization, but stabilized at 10000 lux. Further, the room temperature around the LED backlight module, which is the temperature F of the frame of the LED backlight module, is constant at approximately 30 ° C., and the temperatures in the vicinity A and B of the LED lamp 80 do not rise above 77 ° C. Further, the measurement points C and D of the heat sink 84 near the LED lamp 80 are stable at about 55 ° C.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention porte sur une structure de dissipation de chaleur qui peut dissiper de la chaleur générée par un dispositif générateur de chaleur de façon efficace, et est exempte de la production de poussières telle que de la poudre de carbone et de projections de fibres métalliques qui auraient un effet adverse sur les caractéristiques électriques du dispositif générateur de chaleur. La structure de dissipation de chaleur (54) comprend un substrat en verre époxy (50) ayant une surface principale (50a) sur laquelle un dispositif générateur de chaleur (60) est monté, et une feuille de dissipation de chaleur (52) constituée d'une feuille à infiltration de polypyrrole. Une couche de motif de circuit de surface avant (62) constituée d'un matériau conducteur est formée sur la surface principale du substrat, et une couche de motif de circuit de surface arrière (66) constituée d'un matériau conducteur est formée sur la surface arrière (50b) de celui-ci. La couche de motif de circuit de surface avant (62) et la couche de motif de circuit de surface arrière (66) sont électriquement connectées l'une à l'autre par un trou traversant (64). Le dispositif générateur de chaleur est monté de façon à être en contact étroit avec la couche de motif de circuit de surface avant tout en prenant en sandwich une couche isolante (68) entre eux. La feuille de dissipation de chaleur est maintenue en contact étroit avec la surface arrière du substrat, et un dissipateur thermique (56) est maintenu en contact étroit avec la feuille de dissipation de chaleur.
PCT/JP2009/067605 2008-10-16 2009-10-09 Structure de dissipation de chaleur WO2010044374A1 (fr)

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JP4256463B1 (ja) 2009-04-22

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