WO2010034185A1 - Dispositif général de transfert permettant de tester un dispositif de test de carte de circuits imprimés et dispositif associé - Google Patents

Dispositif général de transfert permettant de tester un dispositif de test de carte de circuits imprimés et dispositif associé Download PDF

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Publication number
WO2010034185A1
WO2010034185A1 PCT/CN2009/070129 CN2009070129W WO2010034185A1 WO 2010034185 A1 WO2010034185 A1 WO 2010034185A1 CN 2009070129 W CN2009070129 W CN 2009070129W WO 2010034185 A1 WO2010034185 A1 WO 2010034185A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
grid point
test
circuit board
universal
Prior art date
Application number
PCT/CN2009/070129
Other languages
English (en)
Chinese (zh)
Inventor
陈涛
Original Assignee
Chen Tao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Tao filed Critical Chen Tao
Priority to CN200980000060.0A priority Critical patent/CN101680912B/zh
Publication of WO2010034185A1 publication Critical patent/WO2010034185A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Definitions

  • the present invention relates to an electrical performance testing device, and more particularly to a testing device and a jig for testing short circuits and open circuits of a printed circuit.
  • the prior art test equipment for short circuit and open circuit of the circuit board includes a special test machine, a universal test machine and a flying probe test machine, wherein the flying probe test machine has a slow test speed, and is mainly suitable for testing engineering samples, and is used for mass production of circuit boards.
  • the test equipment is mainly a dedicated test machine and a universal test machine.
  • the dedicated tester is mainly used to test the circuit board by means of a composite test device in electrical contact with the circuit board.
  • the composite test device comprises a dial and a reel, and the dial is a component equipped with a plurality of test probes, each test probe corresponding to each test point on the test circuit board; the reel is loaded Components of elastic components
  • each test probe can be in contact with one of the elastic components on the reel.
  • the flexibility provided by the elastomeric components allows each test probe to be in good contact with the board to be tested, while reducing the strain on the board from each test probe. Since the coil structure of the composite test device is relatively complicated, the production time is relatively long, and each composite test device is made for the same type of circuit board, and cannot be used universally.
  • the dial and reel of the composite test device must be reworked; although the total cost of the dedicated test machine is lower than that of the universal test machine, the composite test device on it is for different types of circuit boards. Both the dial and the reel have to be reworked, which increases the cost, and the production of the reel is long, which also brings inconvenience to the user.
  • the universal tester includes a universal test fixture and a universal flexible assembly base.
  • the universal test fixture is a dial with multiple test probe assemblies. Each test probe on the dial needs to be tested.
  • Each test point on the circuit board has a one-to-one correspondence;
  • the universal elastic component base is a grid point component of a dense elastic component to ensure that the tail of each test probe on the dial can fall on the universal elastic component The base of the grid points on a flexible component. After testing different types of circuit boards, you only need to make a dial that corresponds to each test point of different types of circuit boards to test the circuit board. But because of the universal test There is a universal elastic component base on the test machine. The number of elastic components on the base is very large. At the same time, each elastic component has a switch point inside the test machine, and the total cost is much more expensive than the dedicated test machine. Generally, manufacturers are difficult to accept.
  • the technical problem to be solved by the present invention is to provide a universal adapter device and a universal fixture for testing a circuit board dedicated tester with a simple structure and low cost.
  • the technical solution adopted by the present invention to solve the technical problem thereof is to provide a universal switching device for testing a special tester for a circuit board, and a plurality of test probes are provided on the special test machine. And test signal conductive lines,
  • the test probe corresponds to a test point of a circuit board to be tested;
  • the universal switching device includes an upper grid point component provided with a plurality of first conductive elements, and a lower grid point component provided with a plurality of second conductive elements a conversion circuit board between the upper grid point component and the lower grid point component, and a base disposed on a lower side of the lower grid point assembly;
  • the front and back sides of the conversion circuit board are respectively provided with a plurality of front conductive points and opposite conductive points, and the position of the front conductive points and the first contact with the test probe in the upper grid point assembly
  • the positions of the points of the conductive elements are in one-to-one correspondence, and the front conductive points are electrically connected in one-to-one correspondence with the opposite conductive points inside the conversion circuit board;
  • the base has a socket point connectable with the test signal conductive line;
  • the second conductive element is electrically connected to the socket on the base;
  • the upper grid point component is mounted on a back surface of the dial; each test probe on the dial passes the corresponding first conductive element on the upper grid point component, and the front side of the conversion circuit board is electrically conductive
  • the corresponding second conductive elements on the point and back conductive points and the lower grid point assembly are electrically connected to the socket point and the test signal line on the base.
  • the first conductive element and the second conductive element are spring-loaded conductive devices; and the access point is respectively opened on the upper grid point component and the lower grid component a first through hole and a second through hole with a spring conductive device; or
  • the upper grid point component and/or the lower grid component are elastic insulating plates, and conductive particles are present at positions of the first conductive element and the second conductive element, and the conductive particles and the elastic insulating plate The first conductive element and the second conductive element are formed in combination.
  • the first conductive element on the upper grid point component is filled with all the test areas of the upper grid point assembly;
  • the first conductive elements are uniformly arranged in a row and in a row on the upper grid point component;
  • the first conductive element on the upper grid point component has a distribution density of 2, 4, 8, or 10 times density.
  • one side of the second conductive member protrudes from a front surface of the lower grid point assembly to form a good electrical contact with the opposite conductive point; and/or The tail of the first conductive element on the grid point assembly extends beyond the reverse side of the upper grid point assembly, and has good electrical contact with the front conductive point corresponding to the conversion board.
  • the dial, the upper grid point assembly, the conversion circuit board, the lower grid point assembly, and the base are respectively provided with corresponding alignment holes.
  • each of the socket points is electrically or electrically contacted with the second conductive element through a conductive line or an external conductive line inside the base; the base extends outward
  • the socket point is fixed at a portion where the base extends outward.
  • the present invention also provides a universal jig for testing a circuit board-specific test machine, the universal jig comprising an upper jig and a lower jig respectively located on two sides of the circuit board; Both the lower and the lower fixtures include the above-mentioned dial and universal adapter.
  • the number of second conductive elements on the lower grid point component of the universal adapter of the lower fixture is greater than or equal to the number of test points of the dedicated testing machine,
  • the number of second conductive elements on the lower grid point component of the universal adapter of the fixture is greater than or equal to half the number of test points of the dedicated test machine.
  • the number of second conductive elements on the lower grid point component of the lower fixture is equal to N times the number of test points of the dedicated test machine, an integer of N>1;
  • the N pieces of the second conductive elements of the lower grid point assembly are a group, and each group is connected to a socket point on the base;
  • the number of second conductive elements on the lower grid point component of the upper jig is equal to N times half of the number of pilots of the dedicated test machine, an integer of N >
  • the sum of the number of second conductive elements on the two lower grid point components of the upper jig and the lower jig is equal to the number of test points of the dedicated test machine, and The number of second conductive elements of the fixture and the lower fixture is assigned in a given ratio.
  • the utility model has the beneficial effects of the universal adapter device and the universal fixture for testing the special tester for the circuit board:
  • the universal switching device of the present invention is mounted on a special testing machine to test the circuit board, the universal switching device has a similar function to the universal flexible device base on the universal testing machine, and is equipped with the universal switching device.
  • the test machine tests different types of circuit boards, and only needs to make the dial and the conversion circuit board corresponding to the circuit board to be tested.
  • the conversion circuit board takes out the elastic components used for each jig probe, and passes the circuit board.
  • the reverse point is connected with the grid points of the test points provided by the dedicated test itself, thereby realizing the tens of thousands or hundreds of thousands of elastic components and the test machine itself thousands of points on the universal test base.
  • the production of the conversion board is shorter than the coil and the cost is low.
  • the universal jig of the present invention sets the lower grid point number of the universal adapter corresponding to the lower fixture to the same or N times as the total number of points of the testing machine, and the lower universal fixture corresponding to the upper fixture
  • the number of grid points is set to be more than half of the total number of points of the test machine. This ensures that the board to be tested can be used with the universal adapter as long as the number of points to be tested is less than the number of test points of the entire test machine.
  • the lower grid point and the base can be connected together by a spring with wires, which has the advantage of low manufacturing cost.
  • the elastic conductive elements on the lower grid point assembly and the insulating plate forming the lower grid point assembly may also be made of a piece of rubber.
  • metal particles are contained in each of the positions where the elastic conductive members are provided, and the elastic conductive members are formed by the combination of the metal particles and the rubber. This way, the height of the lower grid point assembly can be lowered, and the function of lowering the height of the entire switching device is also achieved.
  • the conductive element on the lower grid point slightly protrudes from the opposite side of the lower grid point, and the base has a circuit board having conductive points corresponding to the positions of the conductive elements on the lower grid point.
  • the conductive dots are electrically connected through the lines inside the circuit board and the socket points. After assembling the lower grid point and the base, the conductive elements on the lower grid point can be electrically connected to the socket point.
  • FIG. 1 is a general-purpose adapter device and a dedicated device for testing a circuit board-specific tester according to an embodiment of the present invention
  • FIG. 2 is a schematic exploded perspective view of the single-sided circuit board ⁇ of the universal switching device of the present invention and the dial on the special testing machine;
  • FIG. 3 is a cross-sectional view showing the universal switching device of one embodiment of the universal jig of the present invention and the dial on the special testing machine mounted together to test the double-sided circuit board;
  • FIG. 4 is a schematic diagram showing the density of the through hole 112 of the grid point assembly 110 on the universal switching device of the present invention at a density of 2 times;
  • FIG. 5 is a front elevational view showing the density of the through holes 112 of the grid point assembly 110 on the universal switching device of the present invention at a density of 4 times;
  • FIG. 6 is a schematic diagram showing the density of the through hole 112 of the grid point assembly 110 on the universal switching device of the present invention at a density of 8 times;
  • Figure 7 is a front elevational view showing the density of the through-holes 112 on the grid point assembly 110 of the universal switching device of the present invention at a density of 10 times;
  • Figure 8 is a schematic illustration of a lower grid point assembly using an elastic insulating plate and conductive particles of the universal switching device of the present invention.
  • the dedicated tester includes a dial 200 having a plurality of test probes 210 and test signal conductive lines (shown in the figure).
  • the dial 200 is made according to the circuit board 400 or 400' to be tested. Different types of circuit boards 400 or 400' correspond to different dials 200, so that the test probe 210 of the dial 200 corresponds to the test point of the circuit board to be tested.
  • the number of test points of the circuit board to be tested 400 or 400' is smaller than the number of test points in the dedicated test machine.
  • the universal adapter device 100 includes an upper grid point assembly 110 provided with a plurality of resilient first conductive elements 111, a conversion circuit board 120, a lower grid point assembly 130 provided with a plurality of resilient second conductive elements 131, and a base 140. All of the elastic first conductive elements 111 are evenly arranged in a row on the upper grid point assembly 110 and are distributed in a row in each of the first through holes 112. All of the elastic second conductive elements 131 are distributed among the respective second through holes 132 of the lower grid point assembly 130.
  • the front and back sides of the conversion circuit board 120 are provided with a plurality of front conductive dots 121 and opposite conductive dots 122, and the position of the front conductive dots 121 of the circuit board 120 and the upper mesh point assembly 110 are tested and tested.
  • the position of the elastic first conductive unit 111 contacted by the needle 210 is one-to-one correspondence, and the front conductive point 121 is electrically connected to the opposite conductive point 122 inside the conversion circuit board 120.
  • the base 140 is provided with conductive points 141 corresponding to the positions of all the elastic second conductive elements 131 of the lower grid point assembly 130.
  • the conductive points 141 and the elastic second conductive elements 131 are equal in number; the front conductive points 121 and the reverse side
  • the conductive dots 122 and the test probes 210 are equal in number, and the number of the test probes 210 is smaller than the number of the elastic first conductive elements 111 and the second conductive elements 131.
  • the heads of the plurality of test probes 210 on the dial 200 are placed on the respective test points (illustrated in the figure) corresponding to the circuit board 400 or 400' to be tested, and are associated with the circuit board 400 or 400' to be tested. Each test point is in electrical contact.
  • the upper grid point assembly 110 is mounted below the dial 200, and the plurality of test probes 210 on the dial 200 are in electrical contact with the corresponding resilient first conductive element 111 heads on the upper grid point assembly 110.
  • the transition board 120 is located between the upper grid point assembly 110 and the lower grid point assembly 130, the base 140 is located below the lower grid point assembly 130, and the base 140 is secured to a dedicated test machine.
  • a plurality of socket points 147 are provided on the base 140, and are electrically connected to the test signal lines of the dedicated tester through the socket points 147.
  • Each test probe 210 on the dial 200 passes through a corresponding elastic first conductive element 11 on the upper grid point assembly 110, a front conductive point 121 on the conversion circuit board 120, a reverse conductive point 122, and a lower grid point.
  • the corresponding elastic second conductive elements 131 on the component 130 are electrically connected to the corresponding conductive dots 141 on the base 140.
  • the conductive dots 141 on the base 140 are connected to the socket point 147 through the internal circuit thereof, through the socket point 147. It is electrically connected to each test signal conductive line.
  • each test point of the circuit board 400 to be tested is electrically connected to the test signal conductive lines drawn on the special test machine, and the test is performed by means of a dedicated test machine for breaking, opening, and the like.
  • the lower grid point can also be electrically connected directly to the socket point 147 on the base via a conductive line, omitting the conductive dots on the base.
  • the conversion circuit board 120 is fabricated according to the circuit board 400 or 400' to be tested. Different types of circuit boards correspond to different conversion circuit boards 120, and actually convert the front conductive points 121, the reverse conductive points 122 and the standby on the circuit board 120. The number of test points of the test circuit board 400 is the same. Through the transfer circuit board 120, the circuit board to be tested that cannot be tested on the dedicated test machine can be successfully tested on the dedicated test machine after the line conversion, without re-making the reel or using the universal test machine.
  • the first through hole 112 of the upper grid point component 110 is filled with all the test areas of the upper grid point assembly 110; the density of the first through hole 112 and the coil network of the composite test device The density of the grid points is the same.
  • the density of the first through holes 112 may be 2 times, that is, the center distance L1 of two adjacent first through holes 112 in each row is 2.54 mm, and the adjacent first through holes 112 of each column are adjacent.
  • the center distance L2 is also 2.54 mm, but the center distance L3 of one first through hole 112 of each row and the adjacent first through hole 112 of the adjacent column is 1.80 mm.
  • the density of the first through holes 112 may be 4 times, that is, the center distance L1 of two adjacent first through holes 112 in each row is 1.27 mm, and the adjacent first through holes 112 of each column are adjacent.
  • the center distance L2 is 1.27 mm, and the center distance of one first through hole 112 of each row and the adjacent first through hole 112 of the adjacent row is also 1.27 mm.
  • the density of the first through holes 112 may be 8 times, that is, the center distance L1 of two adjacent first through holes 112 in each row is 1.27 mm, and the adjacent first through holes 112 of each column are adjacent.
  • the center distance L2 is also 1.27 mm, but the center distance L3 of one first through hole 112 of each row and the adjacent first through hole 112 of the adjacent column is 0.90 mm.
  • the density of the first through holes 112 may be 10 times, that is, the center distance L1 of two adjacent first through holes 112 in each row is 1.13 mm, and the adjacent first through holes 112 of each column are adjacent.
  • the center distance L2 is also 1.13 mm, but the center distance L3 of one first through hole 112 of each row and the adjacent first through hole 112 of the adjacent column is 0.80 mm.
  • the density of the first through holes 112 may also be a higher density.
  • test probes 210 on the dial 200 are tilted so that the test points of the test board 210 can be passed through the test points of the test board 210, so that the corresponding first pass on the upper grid point assembly 110
  • the holes 112 are slightly opened. After all the first through holes 112 of the grid point assembly 110 are fabricated, the needle is processed by the manufacturing software of the composite test device. The software processes the needles, and each needle must have a unique one. The first through hole 112 corresponds thereto; thus, it can be ensured that each of the test probes 210 on the different types of dials 200 can be electrically contacted with an elastic first conductive member 111 on the upper grid point assembly 110.
  • the number of second through holes 132 and elastic second conductive members 131 on the lower grid point assembly 130 depends on the number of test points of the dedicated tester.
  • the dedicated test machine only needs to mount the dial 200 and the universal switching device 100, the second through hole 132 on the lower grid point assembly 130 and the elasticity.
  • the second conductive element 131 is equal in number to the number of test points of the dedicated test machine. If the number of test points of the special test machine is 10240 points, the second through hole 132 and the elastic second conductive element 131 on the lower grid point assembly 130 each have 10240 points.
  • the universal jig includes an upper jig and a lower jig on both sides of the double-sided circuit board 400'.
  • the upper and lower fixtures include the dial and the universal adapter device described above; that is, two needles 200 and a universal adapter 100 are required to be mounted, and one needle is used on each of the front and back sides of the circuit board.
  • the disc 200 and the universal switching device 100 are tested in the same manner.
  • the number of second conductive elements 132 on the lower grid point assembly 130 of the lower fixture universal switching device 100 is greater than or equal to the number of test points of the dedicated testing machine, and the lower grid point assembly of the upper fixture universal switching device 100
  • the number of through holes on 130 is greater than or equal to half of the number of test points of the dedicated test machine. Since the board test generally puts the side with more points to be tested in the fixture test below, the lesser side of the test point is placed on the fixture test, so that the number of grid points under the upper and lower fixtures can be set as long as the newspaper is waiting
  • the number of points to be tested on the test board is less than the number of test points of the entire test machine, and can be used on the test machine of the universal adapter that adapts the above grid point.
  • the lower grid points have more spare points.
  • the grid points can be selected and connected according to the nearest principle.
  • the number of grid points can be multiplied. That is, for the test of the single-sided circuit board, the dedicated test machine only needs to install one of the dial 200 and the universal transfer device 100, and the number of the second through holes 132 on the lower grid point assembly 130 is the number of test points of the dedicated test machine. Times, N>1, each N points are set as a group, and there are a plurality of N conductive points 141 on the base 140 of the same number as the elastic second conductive elements 131 in the second through holes 132 of the lower grid point assembly 130.
  • the points are short-circuited together, and the N conductive points 14 1 on the base 140 are short-circuited together and then electrically connected according to a given rule and a test signal conductive line of the special testing machine, in the production of the conversion circuit board 120 ⁇ , the reverse side of each
  • the elastic second conductive elements 131 each have 30720, and at the same time, the base 140 has 30720 conductive dots 141, a total of 10240 sets of points, 10240 3 points are shorted together, and 10240 of the base 140 are 3 The points are shorted together and electrically connected to 10,240 test signal conductive lines of the dedicated test machine.
  • the number of grid point components 130 is N times the number of test points of the dedicated tester, so that there are more options for the position of the conductive points on the reverse side of the conversion board 120 of the special circuit board to be tested.
  • the difficulty of making the board 120 is much smaller.
  • the number of second conductive elements on the two lower grid point components of the upper fixture and the lower fixture can also be allocated as needed, for example: two upper and lower fixtures Grid point component 130
  • the sum of the number of the two conductive elements 131 is equal to the number of test points of the dedicated test machine, and the number of the second conductive elements 131 of the upper jig and the lower jig is allocated according to a given ratio, such as according to 7: 3 or 8: 2 or 6: 4 And other proportions are allocated.
  • each of the elastic second conductive members 131 on the lower grid point assembly 130 protrudes slightly beyond the front and back sides of the lower grid point assembly 130 to cause the lower grid point assembly 130.
  • Each of the elastic second conductive elements 1 31 has good electrical contact with the opposite conductive dots 122 corresponding to the conversion wiring board 120 and the corresponding conductive dots 141 of the base 140, respectively.
  • each of the elastic first conductive members 111 on the upper grid point assembly 110 slightly protrudes from the opposite side of the upper grid point assembly 110, so that each of the upper grid point assemblies 110 is first elasticized.
  • the conductive elements 111 have good electrical contact with the front conductive dots 121 corresponding to the conversion wiring board 120, respectively.
  • the dial 200, the upper grid point assembly 110, the conversion circuit board 120, the lower grid point assembly 130, and the base 140 are respectively provided with corresponding positioning holes 205, 115, 125, 135, 145, which are convenient. Install them together.
  • the base 140 extends outwardly, and a socket point 147 electrically connected to each test signal conductive line is fixed to a portion 146 where the base 140 extends outward.
  • the elastic first conductive element 111 used in the present invention can be applied to the Chinese invention patent "switching spring for circuit board test" which was applied for by the applicant on December 16, 2004, and issued on February 22, 2005. Manufacturing, the patent number is ZL200420103000.6.
  • the elastic second conductive member 131 may be a spring or a dedicated type probe with a spring inside. Other types of elastic probes can also be used.
  • the upper grid point component and/or the lower grid component of the present invention may also employ another embodiment.
  • the upper grid point component and the lower grid point component are elastic insulating plates, and at the position where the first conductive element 111 and the second conductive element 131 are required to be provided with conductive particles, the conductive particles and the elastic insulating plate The first conductive element 111 and the second conductive element 131 are combined to form.
  • the conductive insulation powder in the elastic insulation board can have the characteristics of electrical conductivity and elasticity. This way, the height of the lower grid point assembly can be lowered, and the same function of lowering the height of the entire switching device.
  • the universal adapter used to test the board-specific tester has a test point of around 10,000 points or less, while the grid point of the universal tester's universal flexible component base is even small.
  • the area will be far more than 10,000 points, usually tens of thousands of grid points. How to make the reel or universal flexibility
  • the tens of thousands of grid points on the base of the module and the number of test points in the dedicated test machine are one-to-one correspondence in the industry.
  • the present invention passes the circuit board 400 or 400' to be tested through the dial 200, the upper grid point assembly 110, the conversion circuit board 120, The lower grid point component 130 and the base 140 can realize the electrical connection of the test points of the circuit board 400 or 400' to be tested and the test points of the special test machine, and only need to be replaced for different types of circuit boards.
  • the dial 200 and the conversion board 120 it is possible to test different types of boards in a dedicated test machine. Since the circuit board 120 has a simple circuit, it takes a short time to manufacture and the price is relatively low, so the user will not spend a long time on the reel which cannot afford the universal test machine and the special-purpose test machine of the prior art. And troubles.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne un dispositif (100) général de transfert permettant de tester un dispositif de test de carte de circuits imprimés comprenant un module (110) supérieur de points grille, une carte (120) de circuits imprimés de transfert, un module (130) inférieur de points grille et une base (140). Le module (110) supérieur de points grille est situé sur le dos d'une plaque-cadran (200), la carte (120) de circuits imprimés de transfert se situant entre les modules (110, 130) supérieur et inférieur de points grille, la base (140) étant située sous le module (130) inférieur de points grille et fixée sur le dispositif de tests. Chaque aiguille de test à ressort (210) de la plaque-cadran (200) est connectée électriquement à une prise femelle (147) via respectivement un élément conducteur (111) situé sur le module (110) supérieur de points grille, un point conducteur (121) situé sur la face avant et un point conducteur (122) situé au dos de la carte (120) de circuits imprimés de transfert et un élément (131) conducteur situé sur le module (130) inférieur de points grille. Chaque prise femelle (147) de la base (140) est connectée électriquement à la ligne électrique de signal de test. Un autre dispositif général utilisant le présent dispositif est aussi proposé.
PCT/CN2009/070129 2008-09-23 2009-01-13 Dispositif général de transfert permettant de tester un dispositif de test de carte de circuits imprimés et dispositif associé WO2010034185A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200980000060.0A CN101680912B (zh) 2008-09-23 2009-01-13 用于测试线路板专用测试机的通用转接装置及通用治具

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN200820212074.1 2008-09-23
CN200820212074 2008-09-23
CNU2008201794982U CN201319056Y (zh) 2008-09-23 2008-12-01 用于测试线路板专用测试机的通用转接装置及通用治具
CN200820179498.2 2008-12-01

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WO2017213387A1 (fr) * 2016-06-10 2017-12-14 김형익 Support en caoutchouc et son procédé de fabrication
CN108008161A (zh) * 2017-10-26 2018-05-08 惠州市金百泽电路科技有限公司 金属化半孔光电产品电性能的快速检测方法
CN109672592A (zh) * 2019-02-18 2019-04-23 深圳市菲菱科思通信技术股份有限公司 路由器测试治具
CN111343050A (zh) * 2020-03-02 2020-06-26 瑞声科技(新加坡)有限公司 传输模组的测试装置
CN112014721A (zh) * 2020-09-01 2020-12-01 珠海景旺柔性电路有限公司 一种通用型lcr测试板及其制作方法
CN112269119A (zh) * 2020-10-25 2021-01-26 苏州市方普电子科技有限公司 高密度测点转接测试治具及转接方法
CN113820585A (zh) * 2021-08-16 2021-12-21 胜宏科技（惠州）股份有限公司 一种多通道可监测出单PCS不良的Hipot测试机

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CN104111358A (zh) * 2014-07-11 2014-10-22 浙江开化建科电子科技有限公司 一种pcb专用测试架
WO2017213387A1 (fr) * 2016-06-10 2017-12-14 김형익 Support en caoutchouc et son procédé de fabrication
KR20170140082A (ko) * 2016-06-10 2017-12-20 김형익 러버소켓 및 그 제조방법
CN108008161A (zh) * 2017-10-26 2018-05-08 惠州市金百泽电路科技有限公司 金属化半孔光电产品电性能的快速检测方法
CN109672592A (zh) * 2019-02-18 2019-04-23 深圳市菲菱科思通信技术股份有限公司 路由器测试治具
CN111343050A (zh) * 2020-03-02 2020-06-26 瑞声科技(新加坡)有限公司 传输模组的测试装置
CN112014721A (zh) * 2020-09-01 2020-12-01 珠海景旺柔性电路有限公司 一种通用型lcr测试板及其制作方法
CN112014721B (zh) * 2020-09-01 2023-04-11 珠海景旺柔性电路有限公司 一种通用型lcr测试板及其制作方法
CN112269119A (zh) * 2020-10-25 2021-01-26 苏州市方普电子科技有限公司 高密度测点转接测试治具及转接方法
CN112269119B (zh) * 2020-10-25 2023-05-23 苏州方普智能装备有限公司 高密度测点转接测试治具及转接方法
CN113820585A (zh) * 2021-08-16 2021-12-21 胜宏科技（惠州）股份有限公司 一种多通道可监测出单PCS不良的Hipot测试机
CN113820585B (zh) * 2021-08-16 2024-03-08 胜宏科技（惠州）股份有限公司 一种多通道可监测出单PCS不良的Hipot测试机

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