WO2010028575A1 - Packaging process of white led - Google Patents
Packaging process of white led Download PDFInfo
- Publication number
- WO2010028575A1 WO2010028575A1 PCT/CN2009/073665 CN2009073665W WO2010028575A1 WO 2010028575 A1 WO2010028575 A1 WO 2010028575A1 CN 2009073665 W CN2009073665 W CN 2009073665W WO 2010028575 A1 WO2010028575 A1 WO 2010028575A1
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- WO
- WIPO (PCT)
- Prior art keywords
- glass lens
- packaging process
- phosphor film
- led chip
- base
- Prior art date
Links
- 238000012858 packaging process Methods 0.000 title claims abstract description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011521 glass Substances 0.000 claims abstract description 25
- 229920003023 plastic Polymers 0.000 claims description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Definitions
- the present invention relates to a packaging process of a white LED.
- FIG. 1 shows a white LED mainly comprising an LED chip 1, a highly thermally conductive metal pedestal 2, a connection bracket 3, a lens 4, a phosphor film layer 5, a transparent plastic package 6, and a manufacturing method thereof It is: a ) fixing the LED chip 1 to the bowl 2 mounting surface of the base; b) mounting the base 2 on the bracket 3; c) connecting the electrode lead at the electrode end of the LED chip 1, and completing the circuit of the lead and the bracket 3 Electrical connection between the two; d) coating 5 layers of phosphor film in the cavity of the base 2; e) sealing with the transparent plastic package 6 on the coated phosphor film layer 5; f) Finally, The white LED shown in Fig.
- the phosphor film layer 5 is filled in the base bowl to directly cover the LED chip 1.
- the heat generated by the LED chip 1 directly acts on the phosphor film layer 5, causing the phosphor to heat up, which inevitably affects the phosphor.
- the stability and reliability of the work are prone to light instability and the formation of light difference; further, the operation of directly filling the phosphor film layer 5 is difficult, and the coating of the film layer is prone to unevenness, and the phosphor is on the susceptor 2 The cup is excited to cause partial back and side light loss, which seriously affects the light output efficiency and aggravates the light decay.
- the object of the present invention is to solve various disadvantages caused by the difficulty in operation of the existing white LED packaging process and improper arrangement of the phosphor film layer, to provide a packaging process of the white LED, to simplify the packaging process, and to change the phosphor film layer.
- the arrangement improves the light extraction efficiency, reduces the light loss, and greatly improves the working stability of the LED.
- a packaging process for a white LED characterized in that: the packaging process comprises the steps of: a) fixing the LE D chip on the pedestal mounting surface; b) mounting the pedestal on the support; c) at the electrode end of the LED chip Connecting the electrode leads and completing the electrical connection between the leads and the holder circuit; d) coating the phosphor film on the bottom surface of the preselected hemispherical glass lens; e) pouring the transparent glue on the LED chip, The LED chip and the circuit package are packaged in a one-piece transparent plastic package; f) Finally, the phosphor of the bottom surface of the glass lens The film is laminated on the top surface of the transparent plastic sealing body, and then heated and baked, and the base, the bracket and the glass lens are tightly fixed together.
- the bottom surface of the glass lens is formed to have a non-planar uneven structure to increase the adhesion between the phosphor film layer and the glass lens and to increase the amount of light emitted.
- the phosphor film layer is pre-coated on the bottom surface of the glass lens, and the glass lens and the phosphor film layer are prefabricated into an integrated assembly for easy assembly, which is convenient for controlling the adjustment, coating and baking of the phosphor film layer according to actual needs.
- Such key operations ensure that the phosphor film is evenly coated and structurally strong, simplifying the packaging process to produce high quality, highly reliable white LEDs; body-filled silica gel separates the LED chip from the phosphor film layer to avoid The heat generated by the LED chip directly acts on the phosphor film layer, greatly improving the working stability and reliability of the phosphor film layer, ensuring stable LED light output and uniform color temperature; and, the phosphor is excited outside the pedestal cup, max. Limit the reduction of back and side light loss, improve the brightness and brightness of the LED, avoid the occurrence of light shifts, and reduce light decay.
- Fig. 1 is a schematic structural view of a conventional white LED.
- FIG. 2 is a schematic structural view of a white LED provided by the present invention (1)
- FIG. 3 is a schematic structural view of a white LED provided by the present invention (2).
- FIG. 4 is a perspective enlarged view of a glass lens provided by the present invention.
- FIG. 1 A packaging process for a white LED, the packaging process comprising the following steps:
- the base 2 may comprise two structural forms: First, as shown in FIG. 2, the top surface 21 of the base 2 is flat. The LED chip 1 is directly disposed in the middle of the flat top surface 21 of the base; Secondly, as shown in FIG. 3, the top surface 21 of the base 2 is recessed with a cup bowl, and the bottom surface 22 of the cup bowl forms the LED chip 1. Mounting surface, LED chip 1 is mounted on the bottom surface 22 of the base cup;
- the appearance of the above-mentioned glass lens 4 is not limited to that shown in the drawings, and the shape of the glass lens 4 can be designed according to optical different shapes, which are not one by one. List.
- the packaging process of the white LED of the present invention is to pre-coat the phosphor film layer on the bottom surface of the glass lens, and then prefabricate the glass lens and the phosphor film layer into an integrated assembly for easy assembly, which is convenient to control according to actual needs. Key tasks such as adjusting, coating and baking of the phosphor film layer ensure uniform coating of the phosphor film layer, firm structure, simplify the packaging process, and have good industrial applicability.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A packaging process of white LED can control the mixing of glue of phosphor film, the coating and baking operation effectively and simplify the packaging procedure, improve the light extraction efficiency and reduce the light loss by using the step of coating the phosphor film on the bottom surface of the preselected hemispherical-type glass lens firstly, then packaging the LED chip and circuit into the transparent glue packaging body, layering the phosphor film of the bottom surface of the glass lens on the top surface of the transparent glue packaging body, and finally heating it for baking to complete the packaging operation of white LED.
Description
一种白光 LED的封装工艺 White LED packaging process
技术领域 Technical field
[ 1] 本发明涉及一种白光 LED的封装工艺。 [1] The present invention relates to a packaging process of a white LED.
背景技术 Background technique
[2] 图 1中示出了一种白光 LED , 主要包括 LED芯片 1、 高导热的金属基座 2、 连接 支架 3、 透镜 4、 荧光粉膜层 5、 透明胶封装体 6， 其制作方法是： a) 将 LED芯片 1 固定于基座 2碗腔安装面上； b) 将基座 2装置在支架 3上； c) 在 LED芯片 1电极端 连接电极引线， 并完成引线与支架 3电路之间的电性导接； d) 在基座 2碗腔内涂 布荧光粉膜 5层； e) 在涂布荧光粉膜层 5之上用透明胶封装体 6封接； f) 最后， 在发光侧组装半球型塑料透镜或直接灌透明胶模注成型的透镜 4， 便完成图 1中 所示的白光 LED。 这种白光 LED的不足是： 荧光粉膜层 5充填于基座碗腔直接覆 盖 LED芯片 1， LED芯片 1发出的热量直接作用于荧光粉膜层 5， 导致荧光粉受热 升温， 必然影响荧光粉的工作稳定性和可靠性， 容易出现出光不稳定形成光差 ； 还有， 这种直接充填荧光粉膜层 5的操作难度大， 容易出现膜层涂布不均， 且 荧光粉在基座 2杯碗内被激发以致部分背向和侧向光损失， 严重影响出光效率、 加剧光衰。 [2] FIG. 1 shows a white LED mainly comprising an LED chip 1, a highly thermally conductive metal pedestal 2, a connection bracket 3, a lens 4, a phosphor film layer 5, a transparent plastic package 6, and a manufacturing method thereof It is: a ) fixing the LED chip 1 to the bowl 2 mounting surface of the base; b) mounting the base 2 on the bracket 3; c) connecting the electrode lead at the electrode end of the LED chip 1, and completing the circuit of the lead and the bracket 3 Electrical connection between the two; d) coating 5 layers of phosphor film in the cavity of the base 2; e) sealing with the transparent plastic package 6 on the coated phosphor film layer 5; f) Finally, The white LED shown in Fig. 1 is completed by assembling a hemispherical plastic lens on the light-emitting side or directly filling the lens 4 of the transparent injection molding. The shortcoming of the white LED is: the phosphor film layer 5 is filled in the base bowl to directly cover the LED chip 1. The heat generated by the LED chip 1 directly acts on the phosphor film layer 5, causing the phosphor to heat up, which inevitably affects the phosphor. The stability and reliability of the work are prone to light instability and the formation of light difference; further, the operation of directly filling the phosphor film layer 5 is difficult, and the coating of the film layer is prone to unevenness, and the phosphor is on the susceptor 2 The cup is excited to cause partial back and side light loss, which seriously affects the light output efficiency and aggravates the light decay.
发明内容 Summary of the invention
[3] 本发明的目的是解决现有白光 LED封装工艺操作难度大以及荧光粉膜层布置不 当导致的各种不良状况， 提供一种白光 LED的封装工艺， 简化封装工艺， 改变荧 光粉膜层的布置， 提高出光效率、 减少光损， 大幅度提升 LED的工作稳定性。 [3] The object of the present invention is to solve various disadvantages caused by the difficulty in operation of the existing white LED packaging process and improper arrangement of the phosphor film layer, to provide a packaging process of the white LED, to simplify the packaging process, and to change the phosphor film layer. The arrangement improves the light extraction efficiency, reduces the light loss, and greatly improves the working stability of the LED.
[4] 本发明的目的通过如下技术方案实现： [4] The object of the present invention is achieved by the following technical solutions:
一种白光 LED的封装工艺， 其特征在于： 该封装工艺包括以下步骤： a) 将 LE D芯片固定于基座安装面上； b) 将基座装置在支架上； c) 在 LED芯片电极端连 接电极引线， 并完成引线与支架电路之间的电性导接； d) 在预选的半球型玻璃 透镜的底面上涂布的荧光粉膜层； e) 在 LED芯片之上灌注透明胶， 将 LED芯片 及电路封装于一体成型的透明胶封装体内； f) 最后， 将玻璃透镜底面的荧光粉
膜层叠置在透明胶封接体顶面上， 再施以加温烘烤作， 将基座、 支架和玻璃透 镜紧密固定成一体。 A packaging process for a white LED, characterized in that: the packaging process comprises the steps of: a) fixing the LE D chip on the pedestal mounting surface; b) mounting the pedestal on the support; c) at the electrode end of the LED chip Connecting the electrode leads and completing the electrical connection between the leads and the holder circuit; d) coating the phosphor film on the bottom surface of the preselected hemispherical glass lens; e) pouring the transparent glue on the LED chip, The LED chip and the circuit package are packaged in a one-piece transparent plastic package; f) Finally, the phosphor of the bottom surface of the glass lens The film is laminated on the top surface of the transparent plastic sealing body, and then heated and baked, and the base, the bracket and the glass lens are tightly fixed together.
[6] 进一步， 为确保荧光粉膜层牢固粘接在透镜上， 上述玻璃透镜的底面做成具有 非平面的凹凸结构， 以增加荧光粉膜层与玻璃透镜之间的附着性并提高出光量 [6] Further, in order to ensure that the phosphor film layer is firmly adhered to the lens, the bottom surface of the glass lens is formed to have a non-planar uneven structure to increase the adhesion between the phosphor film layer and the glass lens and to increase the amount of light emitted.
[7] 本发明具有以下优点： [7] The present invention has the following advantages:
[8] 荧光粉膜层预先涂布于玻璃透镜底面， 将玻璃透镜与荧光粉膜层预制为便于组 装的一体装配件， 便于依据实际需要控制荧光粉膜层的调胶、 涂布、 烘烤等关 键性作业， 确保荧光粉膜层涂布均匀、 结构牢固， 简化封装工艺， 以生产高质 量、 高信赖性的白光 LED; —体灌注的硅胶将 LED芯片与荧光粉膜层隔开， 避免 LED芯片发出的热量直接作用于荧光粉膜层， 大大提高荧光粉膜层的工作稳定性 和可靠性， 确保 LED出光稳定、 色温一致； 还有， 荧光粉在基座杯碗外被激发， 最大限度减少背向和侧向光损失， 提高 LED的亮度与辉度， 避免光班出现， 减少 光衰。 [8] The phosphor film layer is pre-coated on the bottom surface of the glass lens, and the glass lens and the phosphor film layer are prefabricated into an integrated assembly for easy assembly, which is convenient for controlling the adjustment, coating and baking of the phosphor film layer according to actual needs. Such key operations ensure that the phosphor film is evenly coated and structurally strong, simplifying the packaging process to produce high quality, highly reliable white LEDs; body-filled silica gel separates the LED chip from the phosphor film layer to avoid The heat generated by the LED chip directly acts on the phosphor film layer, greatly improving the working stability and reliability of the phosphor film layer, ensuring stable LED light output and uniform color temperature; and, the phosphor is excited outside the pedestal cup, max. Limit the reduction of back and side light loss, improve the brightness and brightness of the LED, avoid the occurrence of light shifts, and reduce light decay.
附图说明 DRAWINGS
[9] 下面结合附图对本发明作进一步详细说明。 [9] The present invention will be further described in detail below with reference to the accompanying drawings.
[10] 图 1是现有白光 LED的结构示意图。 [10] Fig. 1 is a schematic structural view of a conventional white LED.
[11] 图 2是本发明提供的白光 LED的结构示意图 （一） [11] FIG. 2 is a schematic structural view of a white LED provided by the present invention (1)
[12] 图 3是本发明提供的白光 LED的结构示意图 （二） 。 [12] FIG. 3 is a schematic structural view of a white LED provided by the present invention (2).
[13] 图 4是本发明提供的玻璃透镜的立体放大示意图。 [13] FIG. 4 is a perspective enlarged view of a glass lens provided by the present invention.
具体实施方式 detailed description
[14] 参照图 2、 图 3。 一种白光 LED的封装工艺， 该封装工艺包括以下步骤： [14] Refer to Figure 2, Figure 3. A packaging process for a white LED, the packaging process comprising the following steps:
[15] a) 将 LED芯片 1固定于高导热的金属基座 2安装面上； 基座 2可包括两种结构形 式： 其一， 如图 2中所示， 基座 2顶面 21为平面， LED芯片 1直接装置在基座的平 顶面 21中部； 其二， 如图 3中所示， 基座 2的顶面 21中部凹设有杯碗， 杯碗内底 面 22形成 LED芯片 1的安装面， LED芯片 1装置在基座杯碗内底面 22上； [15] a) Fixing the LED chip 1 on the mounting surface of the highly thermally conductive metal base 2; The base 2 may comprise two structural forms: First, as shown in FIG. 2, the top surface 21 of the base 2 is flat. The LED chip 1 is directly disposed in the middle of the flat top surface 21 of the base; Secondly, as shown in FIG. 3, the top surface 21 of the base 2 is recessed with a cup bowl, and the bottom surface 22 of the cup bowl forms the LED chip 1. Mounting surface, LED chip 1 is mounted on the bottom surface 22 of the base cup;
[16] b) 将基座 2装置在支架 3上， 支架 3上布设有连接电路 （图中未示出） ； [16] b) The base 2 is mounted on the bracket 3, and the bracket 3 is provided with a connecting circuit (not shown);
[17] c) 在 LED芯片 1电极端连接电极引线 （图中未示出） ， 并完成电极引线与支架
3上的连接电路之间的电性导接； [17] c) Connect the electrode leads (not shown) at the electrode end of the LED chip 1 and complete the electrode leads and brackets Electrical connection between the connection circuits on 3;
[18] d) 在预选的半球型玻璃透镜 4的底面上涂布的荧光粉膜层 5; 参照图 4， 为确保 荧光粉膜层 5牢固粘接在透镜上， 玻璃透镜 4的底面 41做成具有非平面的网格凹 凸结构， 以增加荧光粉膜层 5与玻璃透镜 4之间的附着性并提高 LED的出光量； [19] e) 在 LED芯片 1之上灌注透明胶， 将 LED芯片 1及电路封装于一体成型的透明 胶封装体 6内； [18] d) a phosphor film layer 5 coated on the bottom surface of the preselected hemispherical glass lens 4; referring to Fig. 4, in order to ensure that the phosphor film layer 5 is firmly adhered to the lens, the bottom surface 41 of the glass lens 4 is made Forming a non-planar mesh relief structure to increase the adhesion between the phosphor film layer 5 and the glass lens 4 and increase the amount of light emitted by the LED; [19] e) injecting a transparent glue over the LED chip 1, the LED The chip 1 and the circuit are packaged in the integrally formed transparent plastic package 6;
[20] f) 最后， 将玻璃透镜 4底面的荧光粉膜层 5叠置在透明胶封接体 6顶面上， 再施 以加温烘烤作， 将基座 2、 支架 3和玻璃透镜 4紧密固定成一体， 便完成白光 LED 的封装作业。 [20] f) Finally, the phosphor film layer 5 on the bottom surface of the glass lens 4 is stacked on the top surface of the transparent plastic sealing body 6, and then subjected to warm baking, and the base 2, the bracket 3 and the glass lens are attached. 4 Tightly fixed into one, complete the packaging of white LEDs.
[21] 为满足提高 LED发光角度与照度的要求， 上述玻璃透镜 4的外观造型不局限于 图中所示， 玻璃透镜 4的造型可依据光学设计出不同的外型结构， 在此不一一列 举。 [21] In order to meet the requirements of improving the LED illumination angle and illuminance, the appearance of the above-mentioned glass lens 4 is not limited to that shown in the drawings, and the shape of the glass lens 4 can be designed according to optical different shapes, which are not one by one. List.
[22] 以上所述， 仅为本发明的较佳实施例而已， 故不能以此限定本发明实施的范围 ， 即依本发明申请专利范围及说明书内容所作的等效变化与修饰， 皆应仍属本 发明专利涵盖的范围内。 [22] As described above, it is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, that is, equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still be It is within the scope of the patent of the present invention.
工业实用性 Industrial applicability
[23] 本发明一种白光 LED的封装工艺， 是将荧光粉膜层预先涂布于玻璃透镜底面， 再将玻璃透镜与荧光粉膜层预制为便于组装的一体装配件， 便于依据实际需要 控制荧光粉膜层的调胶、 涂布、 烘烤等关键性作业， 确保荧光粉膜层涂布均匀 、 结构牢固， 简化封装工艺， 具有良好的工业实用性。
[23] The packaging process of the white LED of the present invention is to pre-coat the phosphor film layer on the bottom surface of the glass lens, and then prefabricate the glass lens and the phosphor film layer into an integrated assembly for easy assembly, which is convenient to control according to actual needs. Key tasks such as adjusting, coating and baking of the phosphor film layer ensure uniform coating of the phosphor film layer, firm structure, simplify the packaging process, and have good industrial applicability.
Claims
[1] 一种白光 LED的封装工艺， 其特征在于： 该封装工艺包括以下步骤： a) 将 [1] A white LED packaging process, characterized in that: the packaging process comprises the following steps: a)
LED芯片固定于基座安装面上； b) 将基座装置在支架上； c) 在 LED芯片 电极端连接电极引线， 并完成引线与支架电路之间的电性导接； d) 在预选 的半球型玻璃透镜的底面上涂布的荧光粉膜层； e) 在 LED芯片之上灌注透 明胶， 将 LED芯片及电路封装于一体成型的透明胶封装体内； f) 最后， 将 玻璃透镜底面的荧光粉膜层叠置在透明胶封接体顶面上， 再施以加温烘烤 作， 将基座、 支架和玻璃透镜紧密固定成一体。 The LED chip is fixed on the mounting surface of the base; b) the base is mounted on the bracket; c) the electrode lead is connected at the electrode end of the LED chip, and the electrical connection between the lead and the bracket circuit is completed; d) in the preselected a phosphor film layer coated on the bottom surface of the hemispherical glass lens; e ) injecting a transparent adhesive on the LED chip, and encapsulating the LED chip and the circuit in the integrally formed transparent plastic package; f) Finally, the bottom surface of the glass lens The phosphor film is laminated on the top surface of the transparent plastic sealing body, and then heated and baked, and the base, the bracket and the glass lens are tightly fixed together.
[2] 根据权利要求 1所述的封装工艺， 其特征在于： 所述玻璃透镜的底面做成具 有非平面的凹凸结构， 以增加荧光粉膜层与玻璃透镜之间的附着性并提高 出光量。 [2] The packaging process according to claim 1, wherein: the bottom surface of the glass lens is formed to have a non-planar uneven structure to increase adhesion between the phosphor film layer and the glass lens and to increase the amount of light emitted. .
[3] 根据权利要求 2所述的封装工艺， 其特征在于： 所述玻璃透镜的底面为网格 凹凸结构， 其上涂布有荧光粉膜层。 [3] The packaging process according to claim 2, wherein the bottom surface of the glass lens is a mesh concave-convex structure on which a phosphor film layer is coated.
[4] 根据权利要求 1或 3所述的封装工艺， 其特征在于： 所述基座的顶面为平面 [4] The packaging process according to claim 1 or 3, wherein: the top surface of the pedestal is a flat surface
， LED芯片直接装置在基座的平顶面中部。 The LED chip is directly mounted in the middle of the flat top surface of the base.
[5] 根据权利要求 1或 3所述的封装工艺， 其特征在于： 所述基座的顶面中部凹 设有杯碗， 杯碗内底面形成芯片的安装面， LED芯片装置在基座杯碗内底 面上。
[5] The packaging process according to claim 1 or 3, wherein: a cup is recessed in a central portion of the top surface of the base, and a bottom surface of the cup body forms a mounting surface of the chip, and the LED chip is mounted on the base cup. On the bottom of the bowl.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810071799.8 | 2008-09-10 | ||
| CNA2008100717998A CN101358715A (en) | 2008-09-10 | 2008-09-10 | Packaging technology for white light LED |
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| Publication Number | Publication Date |
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| WO2010028575A1 true WO2010028575A1 (en) | 2010-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2009/073665 WO2010028575A1 (en) | 2008-09-10 | 2009-09-01 | Packaging process of white led |
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| Country | Link |
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| CN (1) | CN101358715A (en) |
| WO (1) | WO2010028575A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8936955B2 (en) | 2011-01-10 | 2015-01-20 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing light emitting diodes |
| CN111897163A (en) * | 2020-08-20 | 2020-11-06 | 安徽芯瑞达科技股份有限公司 | Backlight module device for realizing ultra-low OD by matching LED with lens |
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| CN101707232B (en) * | 2009-12-01 | 2013-04-10 | 桂林电子科技大学 | LED product and manufacture method thereof |
| CN101826590B (en) * | 2010-04-20 | 2013-11-13 | 北京朗波尔光电股份有限公司 | LED lamp with lens injected with fluorescent glue and packaging method thereof |
| CN102130236A (en) * | 2010-12-31 | 2011-07-20 | 北京大学深圳研究生院 | Packaging method of LED (light-emitting diode) chip and packaging device |
| CN102593306B (en) * | 2011-01-10 | 2014-12-10 | 展晶科技(深圳)有限公司 | Light emitting diode crystal grain, manufacture method thereof and light emitting diode packaging structure |
| CN102270729A (en) * | 2011-07-26 | 2011-12-07 | 东华大学 | White-light LED (light emitting diode) package structure and package method |
| CN103178196B (en) * | 2013-03-19 | 2016-02-10 | 东南大学 | Spherical White-light LED package structure |
| CN114927513A (en) * | 2022-07-21 | 2022-08-19 | 杭州华普永明光电股份有限公司 | Light-emitting module and plant lighting lamp |
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| CN101358715A (en) | 2009-02-04 |
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