I244783 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種反射蓋的製造方法，且特別是有 關於種適用於發光二極體的反射蓋製造方法。 【先削技術】 發光二極體近年來已被廣泛應用在各種照明和顯示的 φ 項域中。在應用發光二極體時，常會附加一反射蓋（外蓋）， 藉以保護及引導光線。因此，反射蓋均會具有一可透光膠I244783 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a reflective cover, and more particularly to a method for manufacturing a reflective cover suitable for a light emitting diode. [Pre-cut technology] In recent years, light-emitting diodes have been widely used in the φ-term domain of various lighting and displays. When applying a light emitting diode, a reflective cover (outer cover) is often attached to protect and guide the light. Therefore, the reflective cover will have a transparent adhesive
的部分，使覆蓋於其下的發光二極體，可藉由此可透光膠 的部分射出光線。 V 習知發光二極體反射蓋的可透光膠部分之製造方式係 #由點膠方式形成。製程中通常利料筒將膠體注入反射 ,i的中空孔洞中。此種反射蓋的點膠方式通常無法精準的 ㈣膠量且速度慢又容易產线泡。為了量產的需求及品 質，上述的方法可能無法達成客戶的需求。 Φ 冑L於此’相關的製造商莫不針對上述缺點，尋求適 當的解決方案。 【發明内容】 目此本發明的目的就是在提供—種發光二極體的反射 讀造Μ，用以使此製程有效減少膠體中的氣泡、可精 準控制膠量且量產速度快。 —,根據本發明之上述目的，提出—種發光二極體的反射 蓋製w方法。將-反射蓋設計成一反射蓋上半部及一反射 1244783 蓋下半部。貼上一阻流層於反射蓋上半部的正面。架一導 流鋼板於反射蓋上半部的背面，並將背面朝上。將膠透過 導流鋼板的孔洞刷入反射蓋上半部内的中空孔部分。烘烤 該反射蓋上半部。最後組合反射蓋上半部與反射蓋的下半 部形成一完整的反射蓋。 由上述可知，應用本發明之反射蓋製造方式，藉由將 反射蓋設計成反射蓋上半部及反射蓋下半部，在真空腔室 中以刷膠的方式’將可透光膠刷入反射蓋上半部的中空孔 洞中。反射蓋製造方式可以有效減少膠體中的氣泡、可精 準控制膠量且量產速度快。 【實施方式】 為了解決習知的反射蓋製造方式所造成的缺點—無法 精準控制膠量、速度慢及容易產生氣泡，本發明提出一種 改良的反射蓋製造方式克服上述問題。本方法將反射蓋設 計成反射蓋上半部及反射蓋下半部，在真空腔室中以刷膠 的方式，將可透光膠刷入反射蓋上半部的中空孔洞中。最 後將反射蓋上半部及反射蓋下半部組合成一完整的反射 蓋。 明參照第1 A-1Η圖，其繪示依照本發明一較佳實施例 的一種發光二極體反射蓋的製造步驟。第1Α圖係繪示一反 射蓋上半部100,貼合一阻流層1〇2於其正面。反射蓋上半 口Ρ 100具有中空孔部分1〇4藉以填入可透光膠。藉著將反 射蓋上半部1〇〇的反面朝上（如第18圖），並架上導流鋼板 1〇6(如第ic圖）。阻流層1〇2可以是一膠帶藉以防止填入 1244783 的可透光膠漏出中空孔部分104。導流鋼板106具有孔洞對 應中空孔部分104。參照第1D圖，將反射蓋上半部1〇〇刷 膠製程於一真空腔室108中進行，以刷膠板112將可透光 膠110經導流鋼板106的孔洞刷入反射蓋上半部1 〇〇的中 空孔部分104。因此，可透光膠11〇填入中空孔部分1〇4 時不易產生氣泡。而且，以刷膠板112配合導流鋼板1〇6 執行點膠的製程可以克服習知的缺點—無法精準控制膠量 及速度慢。刷膠完成的反射蓋上半部100如第圖。將反 射蓋上半部100與其反射蓋下半部U4組合成一完整的反 射蓋（參照第1E圖）。參照第1G圖，接著將反射蓋120與 已裝配發光二極體124的印刷電路板122組合，且反射蓋 120的中空孔需對齊發光二極體124。組合完成的發光二極 體裝置如第1H圖所示。 請參照第2圖，其繪示依照本發明一較佳實施例的一 種發光二極體反射蓋的應用示意圖。本實施例之發光二極 體反射蓋可應用於如此圖所示之數字顯示器。因為反射蓋 可以拆解成反射蓋上半部及下半部，反射蓋上半部可以方 便更換字節内膠體的種類及顏色。例如，加螢光粉的膠體 可以將藍光轉換為白光，或使用其他種類的螢光粉與晶片 做發光顏色變化。 由上述本發明較佳實施例可知，應用本發明之反射蓋 製造方式’藉由將反射蓋設計成反射蓋上半部及反射蓋下 半部’在真空腔室中以刷膠的方式，將可透光膠刷入反射 盍上半部的中空孔洞中。反射蓋製造方式可以有效減少膠 體中的氣泡、可精準控制膠量且量產速度快。 7 1244783 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 遵範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1A-1H圖係繪示依照本發明一較佳實施例的一種發 光二極體反射蓋的製造步驟；以及 第2圖係繪示依照本發明一較佳實施例的一種發光二 極體反射蓋的應用示意圖。 【主要元件符號說明】 100 :反射蓋上半部 102 :阻流層 104 :中空孔 106 ··導流鋼板 110 :可透光膠 112 :刷膠板 1〇8 :真空腔室 114 :反射蓋上半部 114a :中空孔 120 :反射蓋 124 :發光二極體 122 :印刷電路板 8The light-emitting diode covered by the light-emitting diode can emit light through the light-transmitting gel portion. V The manufacturing method of the light-transmissive adhesive part of the conventional light-emitting diode reflective cover is # formed by dispensing. In the process, the colloid is usually injected into the hollow cavity of the reflection, i. This type of reflective cap dispensing method usually cannot accurately dispense the glue, is slow and easy to produce line bubbles. In order to meet the needs and quality of mass production, the above methods may not meet customer needs. Φ 胄 L Here's the relevant manufacturer who is always seeking an appropriate solution to the above disadvantages. [Summary of the Invention] The purpose of the present invention is to provide a reflective readout M of light-emitting diodes, so that this process can effectively reduce the bubbles in the colloid, can accurately control the amount of glue, and has a rapid mass production speed. According to the above-mentioned object of the present invention, a method for manufacturing a reflection cap of a light emitting diode is proposed. The -reflective cover is designed as an upper half of the reflective cover and a lower half of the reflective 1244783 cover. Paste a blocking layer on the front of the upper half of the reflective cover. Hold a deflector plate on the back of the upper half of the reflective cover with the back facing up. Brush the glue through the holes of the deflector plate into the hollow hole part in the upper part of the reflection cover. Bake the top half of the reflective lid. Finally, the upper half of the reflection cover and the lower half of the reflection cover are combined to form a complete reflection cover. From the above, it can be known that by applying the reflection cover manufacturing method of the present invention, by designing the reflection cover as the upper half of the reflection cover and the lower half of the reflection cover, the light-transmitting glue is brushed in the vacuum chamber by brushing. In the hollow hole in the upper half of the reflection cover. The manufacturing method of the reflection cover can effectively reduce the air bubbles in the colloid, can precisely control the amount of glue, and the mass production speed is fast. [Embodiment] In order to solve the disadvantages caused by the conventional manufacturing method of the reflective cover-inability to accurately control the amount of glue, slow speed and easy generation of bubbles, the present invention proposes an improved manufacturing method of the reflective cover to overcome the above problems. In this method, the reflection cover is designed as the upper half of the reflection cover and the lower half of the reflection cover. In a vacuum chamber, the light-transmitting glue is brushed into the hollow hole in the upper half of the reflection cover by means of brushing. Finally, the upper half of the reflection cover and the lower half of the reflection cover are combined into a complete reflection cover. Reference is made to Figure 1 A-1, which illustrates the manufacturing steps of a light-emitting diode reflective cover according to a preferred embodiment of the present invention. Figure 1A shows the upper half 100 of a reflective cover, and a blocking layer 10 is attached to the front surface. The upper half P 100 of the reflection cover has a hollow hole portion 104 to fill the light-transmissive glue. By putting the reverse side of the upper part of the reflection cover 100 upwards (as shown in Fig. 18), and placing a guide plate 106 (as shown in Fig. Ic) on the frame. The flow blocking layer 102 may be an adhesive tape to prevent the light-transmitting adhesive filled in 1244783 from leaking out of the hollow hole portion 104. The deflector steel plate 106 has a hole corresponding to the hollow hole portion 104. Referring to FIG. 1D, the 100-degree brushing process of the upper half of the reflection cover is performed in a vacuum chamber 108, and the light-transmitting glue 110 is brushed into the upper half of the reflection cover through the holes of the deflector steel plate 106 with the brush plate 112 The hollow hole portion 104 of the portion 100. Therefore, when the light-transmissive glue 11 fills the hollow hole portion 104, it is difficult to generate air bubbles. In addition, the glue-dispensing plate 112 and the deflector steel plate 106 are used to perform the dispensing process, which can overcome the conventional shortcomings-it is impossible to precisely control the amount of glue and the speed is slow. The upper half 100 of the reflection cover after the glue application is as shown in the figure. The upper half 100 of the reflection cover and the lower half U4 of the reflection cover are combined into a complete reflection cover (refer to FIG. 1E). Referring to FIG. 1G, the reflective cover 120 is then combined with the printed circuit board 122 on which the light emitting diode 124 is assembled, and the hollow hole of the reflective cover 120 needs to be aligned with the light emitting diode 124. The combined LED device is shown in Figure 1H. Please refer to FIG. 2, which illustrates an application schematic diagram of a light-emitting diode reflective cover according to a preferred embodiment of the present invention. The light-emitting diode reflective cover of this embodiment can be applied to a digital display as shown in the figure. Because the reflection cover can be disassembled into the upper half and the lower half of the reflection cover, the upper half of the reflection cover can easily change the type and color of the colloid in the byte. For example, colloids with fluorescent powder can convert blue light to white light, or use other types of fluorescent powder and chips to change the color of light. It can be known from the above-mentioned preferred embodiments of the present invention that the method of manufacturing the reflective cover of the present invention is 'by designing the reflective cover as the upper half of the reflective cover and the lower half of the reflective cover' by applying glue in a vacuum chamber. The light-transmissive glue is brushed into the hollow hole in the upper half of the reflective ridge. The manufacturing method of the reflection cover can effectively reduce the air bubbles in the gel, can accurately control the amount of glue, and has a rapid mass production speed. 7 1244783 Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes and decorations without departing from the spirit and scope of the present invention. Therefore, the scope of guarantee of the present invention shall be determined by the scope of the attached patent application. [Brief description of the drawings] In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the detailed description of the drawings is as follows: Figures 1A-1H show a comparison according to the present invention. The manufacturing steps of a light-emitting diode reflective cover according to the preferred embodiment; and FIG. 2 is a schematic diagram showing the application of a light-emitting diode reflective cover according to a preferred embodiment of the present invention. [Description of main component symbols] 100: upper half of reflection cover 102: baffle layer 104: hollow hole 106 · guide plate 110: light-transmittable adhesive 112: rubber brush plate 108: vacuum chamber 114: reflection cover Upper part 114a: Hollow hole 120: Reflective cover 124: Light emitting diode 122: Printed circuit board 8