JPH0519705A - Light emission display body and manufacture thereof - Google Patents

Light emission display body and manufacture thereof

Info

Publication number
JPH0519705A
JPH0519705A JP3198445A JP19844591A JPH0519705A JP H0519705 A JPH0519705 A JP H0519705A JP 3198445 A JP3198445 A JP 3198445A JP 19844591 A JP19844591 A JP 19844591A JP H0519705 A JPH0519705 A JP H0519705A
Authority
JP
Japan
Prior art keywords
light
film
rubber elastic
led chip
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3198445A
Other languages
Japanese (ja)
Other versions
JP2900000B2 (en
Inventor
Masanobu Miura
正信 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takiron Co Ltd
Original Assignee
Takiron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takiron Co Ltd filed Critical Takiron Co Ltd
Priority to JP3198445A priority Critical patent/JP2900000B2/en
Publication of JPH0519705A publication Critical patent/JPH0519705A/en
Application granted granted Critical
Publication of JP2900000B2 publication Critical patent/JP2900000B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To provide the light emission body which is highly reliable and sufficiently withstands outdoor use by radiating the heat that an LED chip generates effectively into the outside air, improving the display contrast, and absorbing and reducing thermal stress. CONSTITUTION:Many LED chips 2 which perform spot lighting are arranged on a discoid display body substrate 1 and a film formed body which has projection parts 7a projecting in a temple bell shape to the front side corresponding to the LED chips 2 is superposed; and a rubber elastic body is filled in the respective projection parts 7a to constitute light emission dots 3 wherein the LED chips are sealed hermetically. The film formed body 7 has the concave lens type projection parts 7a molded by vacuum forming corresponding to the respective LED chips 2 by using a transparent synthetic resin film having superior light transmissivity and flat surfaces 7d between projection root parts 7c where the projection parts 7a are raised and the respective projection parts 7a are formed into light nonreflective surfaces 7a colored in black by printing, etc.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、LEDチップ等の点発
光する発光素子を用いて構成される発光表示体とその製
造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting display constructed by using a light emitting element such as an LED chip which emits light in a point manner and a method for manufacturing the same.

【0002】[0002]

【従来の技術】発光表示体のなかには、例えば、図9に
示すように、点発光するLEDランプ100を表示体基
板101に挿入して配列配線したものが知られており、
前方側が開口したケース102に収容され、傾斜した後
端面を屋外の壁面等に取り付けて使用されている。上記
LEDランプ100は、図10に示すように、点発光す
るLEDチップ103を透明樹脂104で封止したもの
で、先端を球面状に成形することによって円形凸レンズ
の役目を果たすようにしてあり、LEDチップ103の
光を収束して指向特性を鋭くさせている。そして、この
LEDチップ100の点灯・消灯における表示コントラ
ストを高めるために、例えば、表示体基板100に挿着
された各LEDランプ100間に黒色系のシール剤10
5を充填したり、黒色系のマスク板(不図示)等を挿着
するなどしている。
2. Description of the Related Art Among light-emitting displays, for example, as shown in FIG. 9, one in which an LED lamp 100 which emits light is inserted into a display substrate 101 and arranged and wired, is known.
It is housed in a case 102 having an opening on the front side, and the inclined rear end surface is attached to an outdoor wall surface or the like for use. As shown in FIG. 10, the LED lamp 100 is formed by sealing an LED chip 103 that emits point light with a transparent resin 104, and has a spherical tip formed to serve as a circular convex lens. The directional characteristics are sharpened by converging the light of the LED chip 103. Then, in order to enhance the display contrast when the LED chip 100 is turned on and off, for example, a black sealant 10 is provided between the LED lamps 100 attached to the display substrate 100.
5 is filled or a black mask plate (not shown) or the like is inserted.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、図9に
示す上記発光表示体では、充填されたシール剤105に
よって各LEDランプ100の殆どの部分が埋め込まれ
た状態となっているので、外気と接触している各LED
ランプ100の表面積が通常での使用により極端に小さ
くなっている。そのため、各LEDランプ100を点灯
したときに生じる熱が外気中に逃げずにそれぞれのLE
Dランプ100が高温となり、場合によっては破壊に至
る等の問題があった。
However, in the light-emitting display body shown in FIG. 9, most of the LED lamps 100 are filled with the sealant 105 filled therein, and therefore, contact with the outside air occurs. Each LED doing
The surface area of the lamp 100 is extremely small due to normal use. Therefore, the heat generated when each LED lamp 100 is turned on does not escape to the outside air, and
There is a problem that the D lamp 100 becomes high in temperature and may be destroyed in some cases.

【0004】また、マスク板を各LEDランプ100間
に挿着した場合にも外気と接触するLEDランプ100
の表面積が狭くなり、放熱作用の妨げとなっていた。
Further, even when a mask plate is inserted between the LED lamps 100, the LED lamps 100 are in contact with the outside air.
The surface area of was reduced, which hindered the heat dissipation.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
に本発明の発光表示体は、凸レンズ状突出部を多数成形
したフィルム成形体の各突出部の突出元部及び各突出部
間の平坦面をそれぞれ光無反射面とすると共に、表示体
基板の表面に多数配設されたLEDチップをそれぞれゴ
ム弾性体を介して上記各突出部に対応させて密封したこ
とを特徴とする。
In order to solve the above-mentioned problems, the light-emitting display body of the present invention has a projection base of each protrusion of a film molded body in which a large number of convex lens-shaped protrusions are molded, and a flatness between the protrusions. Each of the surfaces is a light non-reflective surface, and a large number of LED chips arranged on the surface of the display substrate are sealed with rubber elastic bodies corresponding to the respective protrusions.

【0006】また、本発明の発光表示体の製造方法は、
表示体基板に多数のLEDチップを配設すると共に、各
LEDチップの配設位置と対応して凸レンズ状突出部の
形成予定部としたフィルムの前記突出部の形成予定部内
を一部含んでこのフィルム面を光無反射面を形成するよ
う予め平板フィルム面上にスクリーン印刷等で選択的に
黒色塗装印刷を施してから、前記突出部の形成予定部を
真空成形加工等により各突出部に成形してフィルム成形
体を形成し、該フィルム成形体の各突出部を下向き配置
して未硬化のゴム弾性体樹脂液をそれぞれの突出部内に
供給してから、該未硬化のゴム弾性体樹脂液内に上記表
示体基板のLEDチップ配設面側を下向きにして対応す
る各LEDチップをそれぞれ浸漬した後、上記未硬化の
ゴム弾性体樹脂液を硬化させて各LEDチップをゴム弾
性体を介して対応する各突出部に密封することを特徴と
する。
The method for manufacturing a light emitting display body of the present invention is
A large number of LED chips are arranged on the display substrate, and a part of the film is formed in which the convex lens-like protrusions are to be formed in correspondence with the positions of the LED chips. Selective black coating is applied to the flat film surface beforehand by screen printing to form a non-reflecting surface on the film surface, and then the projected part to be formed is formed on each projecting part by vacuum forming, etc. To form a film molded body, and the protrusions of the film molded body are arranged downward to supply uncured rubber elastic resin liquid into the respective protrusions, and then the uncured rubber elastic resin liquid After immersing each corresponding LED chip with the LED chip mounting surface side of the display substrate facing downward, the uncured rubber elastic resin liquid is cured to put each LED chip through the rubber elastic body. Correspond That wherein the sealing to each protrusion.

【0007】[0007]

【作用】上記構成の発光表示体は、各LEDチップの発
した光がそれぞれゴム弾性体が充填された凸レンズ状の
突出部内を屈折して前面側に集光放出され、周囲に光が
散乱し難くなって実用視野位置での輝度が向上し、視認
性が向上したものとなる。しかも、各突出部の突出元部
と各突出部間の平坦面とが光無反射面となっているた
め、周囲が明るい場所に配置した場合でも点灯時と消灯
時の表示コントラストが良好となる。また、各LEDチ
ップがゴム弾性体を介してフィルム成形体の凸レンズ状
の突出部に密封状態となるので、各LEDチップを点灯
したときの発熱は、この凸レンズ状の突出部の全表面か
ら外気中に発散される。このため、突出部が高温になら
ずにLEDチップの寿命が延びる。さらに、LEDチッ
プの点灯・消灯による温度変化によって生じる熱応力を
このゴム弾性体が吸収緩和し、表示体自体の歪み、反り
等が防止され、信頼性の向上した発光表示体となる。
In the light-emitting display unit having the above structure, the light emitted from each LED chip is refracted in the convex lens-shaped protrusion filled with the rubber elastic body and is condensed and emitted to the front side, and the light is scattered around. It becomes difficult, the brightness at the position of the practical field of view is improved, and the visibility is improved. In addition, since the protrusion bases of the protrusions and the flat surface between the protrusions are non-light-reflecting surfaces, the display contrast at the time of lighting and at the time of extinguishing is good even when the surroundings are arranged in a bright place. . In addition, since each LED chip is sealed in the convex lens-shaped protrusion of the film molded body through the rubber elastic body, heat generated when each LED chip is turned on is outside air from the entire surface of the convex lens-shaped protrusion. Diverged inside. Therefore, the temperature of the protrusion does not rise and the life of the LED chip is extended. Further, the rubber elastic body absorbs and relaxes the thermal stress caused by the temperature change caused by turning on / off the LED chip, and the display body itself is prevented from being distorted or warped, so that the light emitting display body has improved reliability.

【0008】また、上記発光表示体の製造方法は、予め
平板フィルム面上の突出部形成予定部の一部を含んで全
面を黒系の光無反射面とするようにスクリーン印刷等に
より該平板フィルム面上に選択的に光無反射面を形成印
刷しておき、次に、真空成形加工によりこれらの突出部
形成予定部を凸レンズ状の突出部に成形することによ
り、各突出部の立ち上がりとなる突出元部及び各突出部
間の平坦面が光無反射面となったフィルム成形体が簡単
に形成できる。そして、このフィルム成形体の各突出部
に未硬化のゴム弾性体樹脂液を注入し、表示体基板に配
設した各LEDチップを対応する突出部内の未硬化のゴ
ム弾性体樹脂液に浸漬してから加熱等によって硬化させ
るだけで、簡単に表示体基板とフィルム成形体とを接合
一体とし、各LEDチップがゴム弾性体を介してフィル
ム成形体のそれぞれの突出部内に密封され、効率よく発
光表示体を製造することができる。
Further, the above-mentioned method for manufacturing a light-emitting display is carried out by screen-printing or the like so that the entire surface including a part of a projected portion forming portion on the flat film surface is made into a black light non-reflection surface in advance. By selectively printing a non-light-reflecting surface on the film surface, and then forming these projecting portions to be formed into convex lens-shaped projecting portions by vacuum forming, the rise of each projecting portion It is possible to easily form a film molded body in which the protruding base portion and the flat surface between the protruding portions are non-reflecting surfaces. Then, uncured rubber elastic resin liquid is injected into each protrusion of the film molded body, and each LED chip disposed on the display substrate is dipped in the uncured rubber elastic resin liquid in the corresponding protrusion. The display substrate and the film molded body can be easily joined and integrated by simply heating and curing afterwards, and each LED chip is hermetically sealed in each projection of the film molded body via the rubber elastic body, and efficiently emits light. A display body can be manufactured.

【0009】[0009]

【実施例】以下、図面を参照して本発明の一実施例を説
明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0010】図1は本発明の一実施例に係る発光表示体
の平面図であり、図2は図1のA−A線に沿った概略断
面図である。
FIG. 1 is a plan view of a light emitting display according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view taken along line AA of FIG.

【0011】この実施例の発光表示体は、円盤状の表示
体基板1に点発光する多数のLEDチップ2をそれぞれ
同心円状に配設し、各LEDチップ2に対応してその前
面側に釣鐘状に突出する発光エレメント部3を形成し、
前方が開口したケース9に収容配置したものである。
In the light emitting display body of this embodiment, a large number of LED chips 2 for point emission are arranged concentrically on a disc-shaped display body substrate 1, and a bell is provided on the front side corresponding to each LED chip 2. Forming the light emitting element portion 3 protruding in a
It is housed and arranged in a case 9 having an open front.

【0012】上記表示体基板1は、例えば、ガラスエポ
キシ樹脂や紙フェノール等を基材とする銅張り積層板を
エッチング加工する等の手段によって、表面に導電パタ
ーン4a(例えば、カソード側)を形成すると共に、裏
面に導電パターン4b(例えば、アノード側)を形成し
たものであり、この裏面の導電パターン4bをスルーホ
ール5を介して各LEDチップ2に対応させて表面に導
出させている。そして、各LEDチップ2を導電パター
ン4aにダイボンディングすると共にボンディングワイ
ヤ6により表示体基板1の表面の導電パターン4bと接
続して点灯回路を構成している。
The display substrate 1 has a conductive pattern 4a (eg, cathode side) formed on its surface by means such as etching a copper-clad laminate having a glass epoxy resin or paper phenol as a base material. In addition, a conductive pattern 4b (for example, the anode side) is formed on the back surface, and the conductive pattern 4b on the back surface is led out to the front surface through the through holes 5 corresponding to each LED chip 2. Then, each LED chip 2 is die-bonded to the conductive pattern 4a and connected to the conductive pattern 4b on the surface of the display substrate 1 by the bonding wire 6 to form a lighting circuit.

【0013】この場合、各LEDチップ2は、例えば、
赤色発光と緑色発光など発光色の異なるチップを組み合
わせ配置してそれぞれの発光色毎に選択(又は同時)点
灯・消灯できる回路を構成している。
In this case, each LED chip 2 is, for example,
By arranging chips with different emission colors such as red emission and green emission in combination, a circuit capable of selectively (or simultaneously) turning on / off each emission color is configured.

【0014】上記表示体基板1上に配設された各LED
チップ2に対応して形成される各発光エレメント部3
は、この表示体基板1に接合一体となったフィルム成形
体7の釣鐘状を呈した凸レンズ状突出部7a内に硬化し
た透光性のゴム弾性体8が充填されたもので、各LED
チップ2がこのゴム弾性体8によって各突出部7a内に
密封封止状態となっている。尚、実施例では発光エレメ
ント部3に1個のLEDチップを配設した例を示してい
るが、各発光エレメント部3に複数のLEDチップを配
設したものであっても良いことは云うまでもない。
Each LED arranged on the display substrate 1
Each light emitting element portion 3 formed corresponding to the chip 2
Is a bell-shaped convex lens-like protruding portion 7a of a film molded body 7 integrally joined to the display substrate 1 filled with a cured translucent rubber elastic body 8.
The chip 2 is hermetically sealed in each protrusion 7a by the rubber elastic body 8. In addition, in the embodiment, an example in which one LED chip is arranged in the light emitting element section 3 is shown, but it goes without saying that a plurality of LED chips may be arranged in each light emitting element section 3. Nor.

【0015】上記フィルム成形体7は、透明で透光性に
優れた例えば、ポリカーボネートやPETフィルム等の
合成樹脂製フィルムを真空成形加工によって各LEDチ
ップ2に対応する凸レンズ状突出部7aを成形したもの
で、この突出部7aの立ち上がりとなる突出元部7cと
各突出部7a間の平坦面7dがスクリーン印刷等により
黒色に着色された光無反射面7bとなり、平坦面7dと
表示体基板1とが接合一体となっている。このフィルム
成形体7の厚みとしては、あまり薄いと突出部7aの保
形性が悪くなり、また、反対に厚すぎると成形の困難さ
と各発光エレメント部3の光の横方向への無効放射が生
じ易くなるので、0.1〜0.3mm程度の厚みとする
のがよい。また、平坦面7dから立ち上がる突出元部7
cの高さhと突出部7aの頂上までの高さHとの関係
は、H/2≦h≦2H/3の範囲とするのが、光の放射
効率と表示コントラストの改善効果のバランスが取れて
効果的でありより好ましい。
The film molded body 7 is formed of a synthetic resin film which is transparent and excellent in translucency, for example, a synthetic resin film such as polycarbonate or PET film, by vacuum forming to form the convex lens-like protruding portions 7a corresponding to the respective LED chips 2. The flat surface 7d between the projecting base 7c and each projecting portion 7a, which is the rising edge of the projecting portion 7a, becomes the light non-reflective surface 7b colored in black by screen printing or the like, and the flat surface 7d and the display substrate 1 And are joined together. If the thickness of the film molded body 7 is too thin, the shape retention of the protruding portion 7a deteriorates. On the other hand, if the thickness is too thick, molding is difficult and the light emitted from the light emitting element portions 3 ineffective in the lateral direction. Since it tends to occur, it is preferable to set the thickness to about 0.1 to 0.3 mm. In addition, the protruding base portion 7 rising from the flat surface 7d
The relationship between the height h of c and the height H to the top of the protruding portion 7a is H / 2 ≦ h ≦ 2H / 3, because the balance between the light emission efficiency and the display contrast improving effect is good. It is more effective and more preferable.

【0016】各LEDチップ2に対応して成形された各
突出部7a内に充填硬化されるゴム弾性体8としては、
透光性を有する例えば、透明なシリコーンゴム等が好適
に使用される。このゴム弾性体8は、各LEDチップ2
を密封すると共に、それぞれのLEDチップ2の点灯時
の発熱や周囲温度の変化等により生じる熱応力を吸収
し、温度変化によって生じる表示体基板1の反りや歪み
等を防止し、さらに、ボンディングワイヤ6の断線等を
防ぐものである。
As the rubber elastic body 8 which is filled and hardened in the respective projecting portions 7a formed corresponding to the respective LED chips 2,
For example, transparent silicone rubber or the like having transparency is preferably used. This rubber elastic body 8 is used for each LED chip 2
The LED chip 2 is sealed and absorbs heat stress generated due to heat generation when each LED chip 2 is turned on or a change in ambient temperature to prevent warpage or distortion of the display substrate 1 caused by a temperature change. It is intended to prevent the disconnection of 6 and the like.

【0017】そして、ケース9は図9に示す従来のもの
と実質的に同一であり、前面側の上方がひさし状に延出
して開口し、後端面は傾斜面となって屋外の壁面等に取
り付けたときにこの発光表示体が下方を向くように構成
されている。
The case 9 is substantially the same as the conventional case shown in FIG. 9, in which the upper part of the front surface extends and opens in a canopy shape, and the rear end surface becomes an inclined surface and is used as a wall surface outdoors. The light-emitting display body is configured to face downward when attached.

【0018】上記構成の発光表示体は、表示体基板1に
多数のLEDチップが配設してゴム弾性体を介してフィ
ルム成形体7の凸レンズ状突出部7aに密封状態となっ
ているので、該突出部7a全面が外気と接触するように
なり、外気への放熱面積が増大し、各LEDチップ2を
点灯したときの熱はこの各突出部7aの表面から逃げ易
くなり、放熱作用が有効に働くようになる。そのため、
各LEDチップ2が高温にさらされて破壊等に至る心配
がなくなる。また、各LEDチップ2の点灯・消灯によ
る温度変化等によって生じる熱応力は各突出部7a内に
充填されたゴム弾性体8によって吸収緩和されるように
なり、発光表示体自体の歪み、反り等が防止され、熱に
対する信頼性がより向上した発光表示体となる。
In the light emitting display body having the above-mentioned structure, since a large number of LED chips are arranged on the display body substrate 1 and sealed by the convex lens-like protruding portion 7a of the film molded body 7 through the rubber elastic body, The entire surface of the protruding portion 7a comes into contact with the outside air, the area for radiating heat to the outside air increases, and the heat when each LED chip 2 is turned on easily escapes from the surface of each protruding portion 7a, so that the heat radiation effect is effective. To work. for that reason,
There is no fear that each LED chip 2 will be exposed to high temperature and will be destroyed. Further, the thermal stress caused by the temperature change due to the turning on / off of each LED chip 2 is absorbed and relaxed by the rubber elastic body 8 filled in each protruding portion 7a, so that the light emitting display body itself is distorted or warped. Is prevented, and the light-emitting display has improved heat reliability.

【0019】さらに、各LEDチップ2から発せられた
光は、それぞれ対応する凸レンズ状の突出部7a内に充
填されたゴム弾性体8の光屈折効果によりその略中心線
に沿って集束され、挟視野角でほぼ直線状となって均一
で鋭いものとなり、実用視野位置で輝度が良好となる。
また、フィルム成形体7の平坦面7dを黒色に着色した
光無反射面7bとすると共に、各突出部7aの立ち上が
りとなる突出元部7cも光無反射面7bとしているた
め、LEDチップ2の点灯・消灯時における表示コント
ラストが向上する。従って、この発光表示体を一つの表
示画素として屋外の明るい壁面等に配置して大型のマト
リクス状表示体を構成し、所望の文字、記号、図形等を
点灯表示した場合でも、各LEDチップ2から発せられ
る光が上記したように均一で鋭い指向特性をもち、実用
視野位置において明るくて表示コントラストが良好で視
認性のより向上した表示が可能となる。
Further, the light emitted from each LED chip 2 is focused along the substantially center line thereof by the light refraction effect of the rubber elastic body 8 filled in the corresponding convex lens-shaped protruding portion 7a, and is sandwiched. The viewing angle becomes almost linear and uniform and sharp, and the brightness becomes good at the practical viewing position.
Moreover, since the flat surface 7d of the film molded body 7 is the light non-reflective surface 7b colored in black and the projection base portion 7c that is the rising edge of each projection portion 7a is also the light non-reflective surface 7b, the LED chip 2 The display contrast when the light is turned on and off is improved. Therefore, even when the large-sized matrix display body is configured by arranging the light emitting display body as one display pixel on a bright wall surface outdoors, each LED chip 2 can be displayed even when desired characters, symbols, figures, etc. are lit up and displayed. As described above, the light emitted from the light source has uniform and sharp directional characteristics, is bright in a practical visual field position, has a good display contrast, and can be displayed with improved visibility.

【0020】尚、フィルム成形体7の突出部7aの形状
によってゴム弾性体8内に密封された各LEDチップ2
の発する光の指向特性を変更できるので、例えば、輝度
半値角度を±50°〜±3°程度の範囲で所望の指向特
性となるように突出部7aの形状を設計することが可能
となる。この場合、輝度半値角度を±20°〜±3°程
度の狭角が得られるようにようにすると特に実用上有効
となる。
The LED chips 2 sealed in the rubber elastic body 8 due to the shape of the protruding portion 7a of the film molded body 7.
Since it is possible to change the directional characteristic of the light emitted by, the shape of the protruding portion 7a can be designed so as to have a desired directional characteristic within a range of the luminance half value angle of ± 50 ° to ± 3 °. In this case, it is particularly practically effective to make the half-value luminance angle a narrow angle of about ± 20 ° to ± 3 °.

【0021】上記構成の発光表示体は次のよう製造され
る。即ち、まず、図3に示すように、表示体基板1より
広い平面積を有する円板状のフィルム10を準備し、各
LEDチップ2と対応するように同心円状に突出部7a
の形成予定部10aを位置決めすると共に、該突出部7
aの形成予定部10aの内部に光無反射面7bとなる突
出元部7cを設けるための境界部10bとして、該境界
部10b内を除く表示体基板1の外形位置となる部分ま
でをスクリーン印刷等により黒色に着色印刷して光無反
射面7bを予め形成する。尚、後述するように、表示体
基板1の外形位置でこのフィルム10が切断されて分割
されるので、上記黒色に着色される光無反射面7bを表
示体基板1の外形位置を越えて周縁にまで形成しても特
に問題はない。この場合、境界部10bの位置設定は後
述する真空成形加工を施したときのフィルム10の伸び
分を考慮して、前記した平坦面7dから立ち上がる突出
元部7cの高さhと突出部7aの頂上までの高さHとの
関係が、H/2≦h≦2H/3の範囲の位置となったフ
ィルム成形体7を得られるように決定すれば良い。
The light emitting display having the above structure is manufactured as follows. That is, first, as shown in FIG. 3, a disk-shaped film 10 having a larger plane area than the display substrate 1 is prepared, and the projections 7a are concentrically formed so as to correspond to the LED chips 2.
The planned formation portion 10a of the
As the boundary portion 10b for providing the projection base portion 7c which becomes the light non-reflective surface 7b inside the portion 10a where the a is to be formed, screen printing is performed up to a portion other than the inside of the boundary portion 10b which is the outer shape position of the display body substrate 1. The light non-reflective surface 7b is formed in advance by coloring and printing in black by the above method. As will be described later, since the film 10 is cut and divided at the outer shape position of the display body substrate 1, the light non-reflective surface 7b colored in black is surrounded by the outer shape position of the display body substrate 1 and the periphery thereof. There is no particular problem even if it is formed up to. In this case, the position of the boundary portion 10b is set so that the height h of the protrusion base portion 7c rising from the flat surface 7d and the protrusion portion 7a are taken into consideration in consideration of the elongation of the film 10 when the vacuum forming process described later is performed. The relationship with the height H to the top may be determined so that the film molded body 7 having a position in the range of H / 2 ≦ h ≦ 2H / 3 can be obtained.

【0022】平板フィルム10の表面の突出部形成予定
部10a内の境界部10bを除いて黒色に着色して光無
反射面7bをスクリーン印刷により形成し、このフィル
ム10に真空成形加工を施し、図4に示すように、各突
出部7aの形成予定部10aの位置に釣鐘状を呈した凸
レンズ状突出部7aをそれぞれ成形する、と同時に、表
示体基板1の外形より外側に位置するフィルム10の周
囲に凹溝10cを成形する。これにより、先端部分が透
明で突出元部7cが黒系の光無反射面7bとなった凸レ
ンズ状突出部7aと各突出部7a間の平坦面7dを黒色
の光無反射面7bとしたフィルム成形体7が形成され
る。
The light non-reflective surface 7b is formed by screen printing by coloring it in black except the boundary portion 10b in the projected portion formation planned portion 10a on the surface of the flat film 10, and vacuum-forming the film 10. As shown in FIG. 4, the bell-shaped convex lens-shaped protruding portions 7a are formed at the positions of the projected portions 10a of the respective protruding portions 7a, and at the same time, the film 10 located outside the outer shape of the display substrate 1 is formed. A groove 10c is formed around the. As a result, the convex lens-like protrusion 7a having a transparent front end portion and the protrusion base 7c being a black light non-reflection surface 7b, and the flat surface 7d between the respective projections 7a are black light non-reflection surfaces 7b. The molded body 7 is formed.

【0023】一方、表示体基板1には導電パターン4
a,4bをエッチング等により形成すると共に、一方の
導電パターン4bの所定位置にLEDチップ2を銀ペー
スト等の導電性接着剤によりダイボンディングして接合
一体とし、他方の導電パターン4aと対応するLEDチ
ップ2の表面とをワイヤ6でワイヤボンディングして点
灯回路を構成する。
On the other hand, the conductive pattern 4 is formed on the display substrate 1.
a and 4b are formed by etching or the like, and the LED chip 2 is die-bonded to a predetermined position of one conductive pattern 4b by a conductive adhesive such as a silver paste so as to be integrally joined, and an LED corresponding to the other conductive pattern 4a is formed. The surface of the chip 2 is wire-bonded to the surface of the chip 2 to form a lighting circuit.

【0024】上記した表示体基板1とフィルム成形体7
とが準備されると、図5に示すように、フィルム成形体
7の各突出部7aを下向きに配置し、該突出部7a内に
それぞれシリコーンゴム等の未硬化のゴム弾性体樹脂液
8aを多少多めに供給し、表示体基板1のLEDチップ
2の配設面側を下向きにして下降させてフィルム成形体
7と表示体基板1とを重ね合わせる。これにより、各L
EDチップ2が対応する突出部7aに供給された未硬化
のゴム弾性体樹脂液8a内に浸漬される。このとき、L
EDチップ2の浸漬によって突出部7a内から溢れ出る
余剰のゴム弾性体樹脂液8bは、図6に示すように、フ
ィルム成形体7の周囲に凹設された凹溝10e内に溜め
られるようになる。このとき表示体基板1に配設された
各LEDチップ2の近傍に穿孔されているスルーホール
5を通って内存した気泡等が外部に押し出され、フィル
ム成形体7と表示体基板1とが接合一体となる。
The above-mentioned display substrate 1 and film molded body 7
When the and are prepared, as shown in FIG. 5, the projecting portions 7a of the film molded body 7 are arranged downward, and the uncured rubber elastic resin liquid 8a such as silicone rubber is placed in each of the projecting portions 7a. A little more than that is supplied, and the film molded body 7 and the display substrate 1 are superposed on each other by lowering the display substrate 1 with the side where the LED chips 2 are disposed facing downward. As a result, each L
The ED chip 2 is dipped in the uncured rubber elastic resin liquid 8a supplied to the corresponding protrusion 7a. At this time, L
Excessive rubber elastic resin liquid 8b overflowing from the inside of the protruding portion 7a due to the immersion of the ED chip 2 is stored in a groove 10e provided around the film molded body 7 as shown in FIG. Become. At this time, air bubbles and the like existing through the through holes 5 formed in the vicinity of each LED chip 2 arranged on the display body substrate 1 are extruded to the outside, and the film molded body 7 and the display body substrate 1 are bonded to each other. Become one.

【0025】しかる後、これを加熱炉等に載置して未硬
化のゴム弾性体樹脂液8aを硬化させる。この硬化され
たゴム弾性体8によって各LEDチップ2がフィルム成
形体7の対応する各突出部7a内に密封される。
Thereafter, this is placed in a heating furnace or the like to cure the uncured rubber elastic resin liquid 8a. The cured rubber elastic body 8 seals each LED chip 2 in each corresponding protruding portion 7 a of the film molded body 7.

【0026】最後に、図6に一点鎖線で示す表示体基板
1の外周縁に沿って切断し、硬化した余剰のゴム弾性体
が溜まった凹溝10cを分離し、フィルム成形体7の各
突出部7a内にゴム弾性体8を介して対応する各LED
チップ2が密封された発光表示体が製造される。
Finally, cutting is carried out along the outer peripheral edge of the display substrate 1 shown by the alternate long and short dash line in FIG. 6 to separate the concave groove 10c in which the hardened surplus rubber elastic body is accumulated, and each projection of the film molded body 7 is cut. Each LED corresponding to the rubber elastic body 8 in the portion 7a
A light emitting display body in which the chip 2 is sealed is manufactured.

【0027】本発明の製造方法では、予め表示体基板1
に配設される多数のLEDチップ2と対応する凸レンズ
状突出部7aの突出元部7cと各突出部7a間の平坦面
7dとが光無反射面7bとなるフィルム10に境界部1
0bとした部分を予め平板フィルム面にスクリーン印刷
を施し、しかる後、真空成形加工することにより簡単に
光無反射面7bの形成と凸レンズ状突出部7aの形成が
行え、成形した各突出部7a内に未硬化のゴム弾性体樹
脂液を供給してから、表示体基板1を重ね合わせ、未硬
化のゴム弾性体樹脂液を硬化させるだけで、各LEDチ
ップがゴム弾性体8を介して凸レンズ状の突出部7a内
に密封させ、突出元部7cと各突出部7a間とを光無反
射面7bとした発光表示体を簡単に製造できる。
In the manufacturing method of the present invention, the display substrate 1 is previously prepared.
A plurality of LED chips 2 arranged in the same direction as the projection base 7c of the convex lens-shaped projection 7a and the flat surface 7d between the projections 7a are the boundary portions 1 on the film 10 serving as the light non-reflective surface 7b.
0b is screen-printed on the flat film surface in advance, and thereafter, by vacuum forming, the light non-reflective surface 7b and the convex lens-like protruding portion 7a can be easily formed. After supplying the uncured rubber elastic resin liquid therein, the display body substrates 1 are superposed and the uncured rubber elastic resin liquid is cured, and each LED chip makes a convex lens through the rubber elastic body 8. It is possible to easily manufacture a light-emitting display body that is hermetically sealed in the protruding portion 7a and has the light non-reflecting surface 7b between the protruding base portion 7c and each protruding portion 7a.

【0028】また、凸レンズ状突出部として図7に示す
ように、表示体基板11に配設した各LEDチップ2の
横列に対応して棒状を呈した凸レンズ状突出部71aを
成形したフィルム成形体11として、それぞれの突出部
71aにゴム弾性体8を充填して発光エレメント部31
を構成し、各凸レンズ状突出部71aの突出元部71c
と各突出部71a間の平坦面71dを何れも光無反射面
71bとした発光表示体としてもよい。
Further, as shown in FIG. 7, as the convex lens-shaped protrusion, a film molded body is formed by molding a convex lens-shaped protrusion 71a having a rod shape corresponding to the row of the LED chips 2 arranged on the display substrate 11. 11, the protrusions 71a are filled with the rubber elastic body 8 to form the light emitting element portion 31.
And the projection base 71c of each convex lens-shaped projection 71a.
Any of the flat surfaces 71d between the projections 71a and the projections 71a may be a light-emitting display body having a light non-reflection surface 71b.

【0029】このような発光表示体では、前記発光表示
体と同様に棒状を呈した凸レンズ状突出部71a全面が
外気と接触するようになり、この外気との接触表面積が
広く、外気への放熱面積が増加し、放熱作用がより有効
となり、各LEDチップ2の昇温による破壊等が防止で
きる。また、各棒状を呈した各凸レンズ状突出部71a
内に密封されたそれぞれのLEDチップ2の発する上下
方向の光が絞られ、実用上有用な左右の視野角が確保さ
れるようになる。そして、各発光エレメント部31を構
成する棒状を呈した各凸レンズ状突出部71aの突出元
部71cと各突出部71a間の平坦面71dとが光無反
射面71bとなっているので、点灯・消灯時の表示コン
トラストが良好となる。
In such a light emitting display, the entire surface of the convex lens-like protruding portion 71a having a rod shape comes into contact with the outside air like the above-mentioned light emitting display, and the contact surface area with the outside air is wide, so that heat radiation to the outside air is possible. The area is increased, the heat dissipation effect becomes more effective, and the destruction of each LED chip 2 due to the temperature rise can be prevented. In addition, each convex lens-shaped protruding portion 71a having each rod shape
The vertical light emitted from each of the LED chips 2 sealed inside is narrowed down, and the practically useful left and right viewing angles are secured. Then, since the protrusion base 71c of each convex lens-shaped protrusion 71a and the flat surface 71d between the protrusions 71a, which are rod-shaped constituting the respective light-emitting element portions 31, are the non-light-reflecting surface 71b, the lighting / lighting is performed. Good display contrast when light is off.

【0030】このような発光表示体を製造するには、図
8に示すように、棒状を呈する凸レンズ状突出部71a
の形成予定部11aを形成し、突出部71aの突出元部
71cとそれぞれの平坦面71dとを黒系の光無反射面
71bとするようにフィルム11の平板表面に境界部1
1bを形成するようスクリーン印刷で選択的に黒色塗装
を施し、しかる後、このフィルム11に真空成形加工を
施して突出部71aを形成してから、前記と同様の方法
によって製造することができる。尚、フィルム11の平
板表面のスクリーン印刷や凸レンズ状突出部71aの成
形加工は量産性を考慮すると、多数個分を一組とした方
法でもよいことは云うまでもない。
In order to manufacture such a light emitting display, as shown in FIG. 8, a convex lens-shaped protrusion 71a having a rod shape.
11a is formed on the flat surface of the film 11 so that the projection base portion 71c of the projection portion 71a and the respective flat surfaces 71d are black light non-reflective surfaces 71b.
It can be manufactured by the same method as described above after selectively black-painting by screen printing so as to form 1b, and then subjecting this film 11 to vacuum forming to form the protrusion 71a. Needless to say, screen printing of the flat surface of the film 11 and molding of the convex lens-like protrusions 71a may be carried out by a method in which a large number of them are combined into one set.

【0031】さらに、凸レンズ状突出部の形状は、前記
のような釣鐘状や棒状に限定されるものではなく、上下
方向や適当な方向の指向特性が得られるようにするなど
種々の設計変更可能なものであり、また、場合によって
は光拡散剤等を混入することもできる。また、実施例で
は円形の発光表示体での例を示したが角型等、その形状
は特に限定されるものでないことは云うまでもない。
Further, the shape of the convex lens-like protrusion is not limited to the bell shape or the rod shape as described above, and various design changes can be made such that directivity in the vertical direction or in an appropriate direction can be obtained. In addition, a light diffusing agent or the like can be mixed depending on the case. Further, in the embodiment, an example of a circular light emitting display is shown, but it goes without saying that the shape is not particularly limited, such as a square shape.

【0032】[0032]

【発明の効果】以上の説明から明らかなように、本発明
の発光表示体は、凸レンズ状の突出部の全面が外気に接
触した状態で使用できるので、この突出部にゴム弾性体
を介して密封された各LEDチップを点灯させた場合に
生じる熱が突出部の全表面より効率良く外気中に放熱さ
れ、また、LEDチップの点灯・消灯による温度変化に
よって生じる熱応力をこのゴム弾性体が吸収緩和し、表
示体自体の歪み、反り等が防止され、信頼性の向上した
発光表示体となる。また、各LEDチップの発した光が
それぞれゴム弾性体が充填された凸レンズ状の突出部内
を屈折して前面側に集光放出され、実用視野位置での視
認性が向上すると共に、各突出部の突出元部と各突出部
間の平坦面とが光無反射面となっているため、各LED
チップの点灯・消灯時の表示のコントラストが極めて良
好となり、実用視野位置で明るくて見易い視認性が向上
した発光表示体となる。また、本発明の製造方法によれ
ば、上記これらの効果を兼ね備えた発光表示体を簡単に
製造できるといった効果を奏する。
As is apparent from the above description, the light emitting display body of the present invention can be used in a state where the entire convex lens-shaped projection is in contact with the outside air, and therefore the projection is provided with a rubber elastic body. The heat generated when the sealed LED chips are turned on is radiated to the outside air more efficiently than the entire surface of the protruding portion, and the rubber elastic body prevents thermal stress caused by the temperature change caused by turning on / off the LED chips. Absorption is alleviated, distortion and warpage of the display body itself are prevented, and a light emitting display body with improved reliability is obtained. In addition, the light emitted from each LED chip is refracted in the convex lens-shaped protrusion filled with the rubber elastic body and is condensed and emitted to the front side, so that the visibility at the practical visual field position is improved and each protrusion is formed. Since the protrusion base and the flat surface between the protrusions are light non-reflective surfaces,
The display contrast when the chip is turned on and off is extremely good, and the light-emitting display is bright and easy to see at a practical visual field position. Further, according to the manufacturing method of the present invention, it is possible to easily manufacture a light emitting display having both of the above effects.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に係る発光表示体の概略平面
図。
FIG. 1 is a schematic plan view of a light emitting display body according to an embodiment of the present invention.

【図2】図1のA−A線に沿った同実施例の概略拡大断
面図。
FIG. 2 is a schematic enlarged cross-sectional view of the same embodiment taken along the line AA of FIG.

【図3】本発明の製造方法に用いられるフィルムの平面
図。
FIG. 3 is a plan view of a film used in the manufacturing method of the present invention.

【図4】図3のB−B線に沿ったフィルム成形体の概略
拡大断面図。
4 is a schematic enlarged cross-sectional view of the film molded body taken along the line BB of FIG.

【図5】フィルム成形体と表示体基板との重ね合わせ状
態を示す概略拡大断面図。
FIG. 5 is a schematic enlarged cross-sectional view showing a superposed state of a film molded body and a display substrate.

【図6】本発明の製造方法の最終段階を示した概略拡大
断面図。
FIG. 6 is a schematic enlarged cross-sectional view showing the final stage of the manufacturing method of the present invention.

【図7】本発明の他の実施例に係る発光表示体の概略平
面図。
FIG. 7 is a schematic plan view of a light emitting display body according to another embodiment of the present invention.

【図8】同実施例の発光表示体の製造に係るフィルムの
平面図。
FIG. 8 is a plan view of a film relating to the manufacture of the light emitting display body of the same example.

【図9】従来の発光表示体の概略断面図。FIG. 9 is a schematic cross-sectional view of a conventional light emitting display body.

【図10】従来の発光表示体に使用されるLEDランプ
の概略断面図。
FIG. 10 is a schematic sectional view of an LED lamp used in a conventional light emitting display.

【符号の説明】[Explanation of symbols]

1 表示体基板 2 LEDチップ 3,31 発光ドット 7,11 フィルム成形体 7a,71a 凸レンズ状突出部 7b,71b 光無反射面 7c,71c 突出元部 7d,71d 平坦面 10a,11a 突出部の形成予定部 8 ゴム弾性体 8a 未硬化のゴム弾性体樹脂液 1 Display substrate 2 LED chips 3,31 luminous dots 7,11 Film molding 7a, 71a convex lens-like protrusion 7b, 71b Light non-reflective surface 7c, 71c Projection base 7d, 71d flat surface 10a, 11a Projected portion for forming protrusion 8 rubber elastic body 8a Uncured rubber elastic resin liquid

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】凸レンズ状突出部を多数成形したフィルム
成形体の各突出部の突出元部及び各突出部間の平坦面を
それぞれ光無反射面とすると共に、表示体基板の表面に
多数配設されたLEDチップをそれぞれゴム弾性体を介
して上記各突出部に対応させて密封したことを特徴とす
る発光表示体。
1. A projection base of each projection and a flat surface between the projections of a film molding having a large number of convex lens-shaped projections formed as light non-reflective surfaces, and a large number of the projections are arranged on the surface of a display substrate. A light-emitting display body, characterized in that the provided LED chips are hermetically sealed via rubber elastic bodies so as to correspond to the respective projections.
【請求項2】表示体基板に多数のLEDチップを配設す
ると共に、各LEDチップの配設位置と対応して凸レン
ズ状突出部の形成予定部を設けた平板フィルムの前記突
出部の形成予定部内を一部含んでこのフィルム面を光無
反射面となるよう平板フィルム面に印刷を施し、しかる
後、前記突出部の形成予定部に成形加工を施して各突出
部を成形したフィルム成形体を形成し、該フィルム成形
体の各突出部を下向き配置して未硬化のゴム弾性体樹脂
液をそれぞれの突出部内に供給してから、該未硬化のゴ
ム弾性体樹脂液内に上記表示体基板のLEDチップ配設
面側を下向きにして対応する各LEDチップをそれぞれ
浸漬した後、上記未硬化のゴム弾性体樹脂液を硬化させ
て各LEDチップをゴム弾性体を介して対応する各突出
部に密封することを特徴とする発光表示体の製造方法。
2. A planner for forming the projection portion of a flat film, in which a large number of LED chips are arranged on a display substrate, and a projection lens-shaped projection portion is planned to be formed at a position corresponding to each LED chip. A film molded body in which each film is formed by printing on the flat film surface so that the film surface becomes a light non-reflecting surface including a part of the inside, and thereafter, the projecting portion to be formed is subjected to molding processing. And each protrusion of the film molded body is arranged downward to supply uncured rubber elastic resin liquid into each protrusion, and then the above-mentioned indicator is placed in the uncured rubber elastic resin liquid. After dipping each corresponding LED chip with the LED chip mounting surface side of the substrate facing downward, the uncured rubber elastic resin liquid is cured to cause each LED chip to protrude through the rubber elastic body. To be sealed in part Method for manufacturing a light-emitting display body, wherein.
JP3198445A 1991-07-12 1991-07-12 Light emitting display and method of manufacturing the same Expired - Lifetime JP2900000B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3198445A JP2900000B2 (en) 1991-07-12 1991-07-12 Light emitting display and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3198445A JP2900000B2 (en) 1991-07-12 1991-07-12 Light emitting display and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH0519705A true JPH0519705A (en) 1993-01-29
JP2900000B2 JP2900000B2 (en) 1999-06-02

Family

ID=16391214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3198445A Expired - Lifetime JP2900000B2 (en) 1991-07-12 1991-07-12 Light emitting display and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2900000B2 (en)

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