JP2010171130A - Lamp, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamp which can have lower reflection luminance at the time of non-lighting without lowering luminance at the time of lighting, and also has a sufficiently high contrast ratio of the luminance at the time of lighting to the luminance at the time of non-lighting, and to provide a method of manufacturing the lamp. <P>SOLUTION: The lamp 1 includes a light emitting element 5, a package molding 2 having a recessed part 21 formed on an upper surface 23 so as to store the light emitting element 5, and a molding material for sealing the light emitting element 5 stored in the recessed part 21, at least part of a side surface 22 of the package molding 2 and the upper surface 23 being low-reflectance parts having lower reflectance than an internal surface of the recessed part 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lamp used for a display, a backlight light source, a light sensor, various indicators, and the like, and a method for manufacturing the lamp.

  In recent years, R, G, and B ultra-high brightness semiconductor light emitting devices have been developed, and as light emitting devices that constitute lamps used in displays, backlight sources, various light sensors, indicators, etc. that can emit light in full color indoors or outdoors. It is starting to be used.

As a lamp using such a light emitting element, for example, there is a surface mount type light emitting diode (hereinafter also referred to as “LED”). In general, a surface-mount type LED has an LED element (light-emitting element) bonded to the bottom surface of a recess formed in a package molded body, and the electrode of the LED element and a lead electrode are electrically connected by a conductive material such as a wire. Thereafter, it is manufactured by sealing with a mold material having translucency.
The LED element constituting the LED emits light not only from the top surface but also from the side surface and the bottom surface. For this reason, conventionally, the reflectance in the concave portion of the package molded body is increased, and the light emitted from the side surface and the bottom surface of the LED element disposed in the concave portion is reflected in the concave portion so that it can be efficiently used. Thus, a technique for improving the luminous efficiency of the LED is used.

In addition, an LED used as a light source for a display or an optical sensor has a contrast ratio that is a ratio of luminance when light is emitted (when lit) and reflected luminance (dark luminance) when light is not emitted (when not lit). Is preferably large.
As a technique for increasing the contrast ratio of the LED, a method of forming a light absorption layer on the light emission observation surface side surface of the package molded body excluding the light emitting portion by using a screen printing method or a hot stamping method (Patent Document 1) There is. In addition, as a technique for increasing the contrast ratio of the LED, there is a method of increasing the contrast ratio by lowering the reflection luminance when not lit by molding a package molding using a material in which a black pigment is dispersed. .

Japanese Patent No. 3613041

However, in the technique described in Patent Document 1, the reflection brightness when not turned on cannot be sufficiently lowered depending on the viewing angle of the LED, and thus a sufficiently high contrast ratio cannot be obtained.
In addition, when a package molded body is molded using a material in which a black pigment is dispersed, the reflection luminance when not lit can be lowered, but the inside of the concave portion of the package molded body on which the LED element is mounted can also be reduced. Since the reflectance is low, the luminance at the time of lighting is lowered.

The present invention has been made in view of the above problems, and can reduce the reflected luminance when not lit without lowering the luminance when lit, and a sufficiently high contrast ratio between when lit and when not lit. An object of the present invention is to provide a lamp capable of obtaining the above.
It is another object of the present invention to provide a lamp manufacturing method capable of manufacturing a lamp capable of obtaining a high contrast ratio between lighting and non-lighting.

As a result of intensive studies to solve the above problems, the present inventor has completed the present invention. That is, the present invention relates to the following.
(1) It has a light emitting element, a package molded body in which a concave portion for accommodating the light emitting element is formed on an upper surface which is a light emission observation surface, and a molding material for sealing the light emitting element accommodated in the concave portion. The lamp is characterized in that at least a part of the side surface of the package molded body and the upper surface are a low reflectance part having a reflectance lower than that of the inner surface of the recess.
(2) A part of the side surface of the package molded body and a part of the upper surface are continuously cut to form a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side. The lamp according to (1), wherein the wall portion and the floor portion of the cathode mark are the low reflectance portion.
(3) The lamp according to (1) or (2), wherein the molded package is a light color, and the low reflectance portion is colored in a dark color.
(4) The lamp according to any one of (1) to (3), wherein the molded package is dark and at least a part of the inner surface of the recess is colored light.

(5) At least a part of the side surface of the light colored package molded body in which the concave portion for accommodating the light emitting element is formed on the upper surface which is the light emission observation surface and the upper surface are darker than the inner surface of the concave portion. A manufacturing method of a lamp, comprising: a coloring step of coloring in such a manner, a mounting step of mounting a light emitting element in the recess, and a sealing step of sealing the light emitting element with a molding material.
(6) At least part of the inner surface of the concave portion of the dark package molded body in which the concave portion for accommodating the light emitting element is formed on the upper surface which is the light emission observation surface is brighter than the side surface of the package molded body and the upper surface. A manufacturing method of a lamp, comprising: a coloring step of coloring to become a color; a mounting step of mounting a light emitting element in the recess; and a sealing step of sealing the light emitting element with a molding material.
(7) The package molded body cuts a part of the side surface of the package molded body and a part of the upper surface to form a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side. In the coloring step, the wall portion and the floor portion of the cathode mark are colored so as to be darker than the inner surface of the concave portion (5) A method for manufacturing the lamp according to claim 1.

(8) The lamp manufacturing method according to any one of (5) to (7), wherein the coloring step is performed using a pad printing method.
(9) The lamp manufacturing method according to any one of (5) to (8), wherein the coloring step is performed before the sealing step.
(10) The method for manufacturing a lamp according to any one of (5) to (9), wherein the coloring step is performed after the sealing step.

  According to the lamp of the present invention, since at least a part of the side surface of the package molded body and the upper surface are low-reflectance portions having a lower reflectance than the inner surface of the recess, the package molded body when not lit It is possible to prevent reflection on the side surface. Therefore, the lamp of the present invention can provide a sufficiently high contrast ratio between lighting and non-lighting, and is preferable to have excellent performance when used for a light source of a display or an optical sensor.

  Moreover, since the manufacturing method of the lamp of the present invention includes a coloring step of coloring at least a part of the side surface of the light-colored package molded body and the upper surface so as to be darker than the inner surface of the recess, A lamp with a sufficiently high contrast ratio between lighting and non-lighting that provides high brightness when turned on, prevents reflection from the side of the molded package when not lit, and provides low reflected brightness when not lit. Can be manufactured.

  The lamp manufacturing method of the present invention further includes a coloring step of coloring at least a part of the inner surface of the concave portion of the dark-colored package molded body so as to be lighter than the side surface and the upper surface of the package molded body. Therefore, high brightness can be obtained when lighting, reflection on the side of the molded package when not lighting can be prevented, and low reflection brightness can be obtained when not lighting, sufficient contrast ratio between lighting and non-lighting High lamps can be manufactured.

FIG. 1 is a schematic plan view schematically showing an example of the lamp of the present invention. 2 is a side view of the lamp shown in FIG. 1 as viewed from below in FIG. FIG. 3 is a side view of the lamp shown in FIG. 1 viewed from the left side in FIG. FIG. 4 is a schematic plan view for explaining the manufacturing method of the lamp shown in FIG. FIG. 5 is a view for explaining a manufacturing method of the lamp shown in FIG. 1, and FIG. 5 (a) is a schematic perspective view for explaining a coloring process using a pad printing method. b) is a perspective view of the pad as seen from the pattern transfer side. FIG. 6 is a diagram for explaining the manufacturing method of the lamp shown in FIG. 1, and is a schematic perspective view for explaining a coloring process using a pad printing method. FIG. 7 is a schematic plan view schematically showing another example of the lamp of the present invention. FIG. 8 is a schematic plan view schematically showing an example of the lamp of the present invention. FIG. 9 is a side view of the lamp shown in FIG. 8 as viewed from below in FIG. FIG. 10 is a view for explaining a manufacturing method of the lamp shown in FIG. 8, and FIG. 10 (a) is a schematic perspective view for explaining a coloring process using a pad printing method. b) is a perspective view of the pad as seen from the pattern transfer side. FIG. 11 is a schematic perspective view for explaining a manufacturing process of the lamp shown in FIG. 8 and for explaining a coloring process using a pad printing method. FIG. 12 is a photograph showing a part of the manufacturing process of the lamp of Example 1. FIG. 13 is a photograph of the lamp in the manufacturing process shown in FIG. 12 as seen from the lower side in FIG. 14 is a photograph of the lamp in the manufacturing process shown in FIG. 12 as viewed from the left side in FIG.

Hereinafter, the lamp of the present invention and the manufacturing method thereof will be described in detail.
“First Embodiment”
FIG. 1 is a schematic plan view schematically showing an example of the lamp of the present invention. 2 is a side view of the lamp shown in FIG. 1 viewed from the lower side in FIG. 1, and FIG. 3 is a side view of the lamp shown in FIG. 1 viewed from the left side in FIG.
1-3, the code | symbol 1 has shown the lamp | ramp. As shown in FIGS. 1 to 3, the lamp 1 electrically connects the three LED elements 5 a, 5 b, and 5 c (light emitting element) and the three LED elements 5 a, 5 b, and 5 c to the outside of the lamp 1. 3 pairs of lead electrodes 4 made of copper and the like, and a package molded body 2 molded above and below the lead electrodes 4 are provided.

  As shown in FIG. 1, a recess 21 for accommodating the LED element 5 is formed on the upper surface 23 that is a light emission observation surface of the package molded body 2. The shape of the recess 21 is a mortar shape having a substantially rectangular shape in plan view. Three pairs of lead electrodes 4 are exposed on the bottom 21a of the recess 21 of the package molded body 2 and the side and lower surfaces of the package molded body 2. As shown in FIG. 1, the three pairs of lead electrodes 4 are electrically insulated from each other by an insulating region 9. Each lead electrode 4 is divided in the left-right direction in FIG. 1 in the recess 21 and electrically insulated by the insulating region 9.

  The number of lead electrodes 4 is not particularly limited, and is a number corresponding to the number of LED elements 5 accommodated in the recesses 21. The lead electrode 4 is preferably excellent in electrical conductivity. Specifically, the lead electrode 4 is plated with a noble metal such as Au or Ag on a base metal such as Cu, Cu-based alloy, Fe-based alloy, or Ni. What formed the layer etc. can be used conveniently. By providing a noble metal plating layer on the surface of the lead electrode 4, light emitted from the bottom surface of the LED element 5 can be reflected by the surface of the lead electrode 4, and the light emitted from the LED element 5 can be efficiently used. Can be used well.

  As the package molding 2, for example, a thermoplastic resin such as polyamide, liquid crystal polymer, polycarbonate, polyphenylene sulfide, polybutylene terephthalate, a thermosetting resin such as epoxy resin or pozzoimide, or a ceramic is used. In the present embodiment, the material forming the package molded body 2 described above contains a white filler such as titanium oxide or zinc oxide to make the package molded body 2 white (light color), and the concave portion of the package molded body 2 What improved the reflectance in 21 is used.

  In the present embodiment, the cathode mark 3 is formed at one of the four corners of the upper surface 23 of the package molded body 2. The cathode mark 3 is formed by continuously cutting a part of the side surface 22 of the package molded body 2 and a part of the upper surface 23 so that the wall 31 and the upper surface 23 side exposed on the side surface 22 side of the package molded body 2 The floor portion 32 exposed to the surface is formed.

  In the present embodiment, as shown in FIGS. 1 to 3, a part of the side surface 22 and the upper surface 23 of the molded molded body 2, and the wall portion 31 and the floor portion 32 of the cathode mark 3 are colored in a dark color. Thus, the reflectance is lower than that of the inner surface of the recessed portion 21 of the white molded package 2. The color of the low reflectivity portion may be a dark color that can make the reflectivity lower than the inner surface of the recess 21, but the closer the color is to black, the higher the contrast ratio between lighting and non-lighting. Therefore, it is preferable.

  As shown in FIG. 1, the LED element 5 is bonded to the bottom 21 a of the recess 21 using a die bond agent such as silver paste. The number, color, type, and the like of the LED elements 5 are not particularly limited, and can be determined according to the use of the lamp. As the LED element 5, for example, a semiconductor such as InN, AlN, GaN, AlGaN, InGaN, AlInGaN, GaP, GaAs, AlInGaP, ZnSe, and SiC is formed as a light emitting layer on the substrate by MOCVD method, liquid phase method, etc. A material in which an electrode is formed by vapor deposition, CVD, sputtering, or the like is preferably used.

  In the present embodiment, in order to obtain a lamp capable of emitting light in full color, the LED element 5 includes three LED elements 5a, 5b, and 5c of red, blue, and green as shown in FIG. Each of the LED elements 5a, 5b, and 5c is provided with electrodes. As shown in FIG. 1, the electrodes formed on the LED elements 5a, 5b, and 5c and the three pairs of lead electrodes 4 are Au The wires 7 are electrically connected to each other.

  Further, the recess 21 of the package molded body 2 is filled with a molding material (not shown) for sealing the LED element 5 accommodated in the recess 21. As the molding material, a material that can protect the LED element 5, has high insulating properties, and has excellent translucency is preferably used. Specifically, it is preferable to use a translucent resin made of epoxy, silicone, modified acrylic or the like as the molding material. In addition, the resin constituting the molding material is converted into a colorant that cuts light from the LED element 5 and light to the LED element 5 as desired, a diffusing material that diffuses light, and further converted into desired light. A fluorescent substance etc. can be contained.

Next, a method for manufacturing the lamp 1 shown in FIGS. 1 to 3 will be described.
In the present embodiment, a case will be described as an example where each of the coloring process, the mounting process, and the sealing process is performed in a state where a plurality of package molded bodies 2 are arranged in a lead frame.
In order to manufacture the lamp 1 shown in FIG. 1 to FIG. 3, first, the upper and lower surfaces of the three pairs of lead electrodes 4 are provided with the recessed portions 21 where the lead electrodes 4 are exposed by injection molding or the like. Then, the molded package 2 shown in FIG. 4 having the cathode mark 3 is formed. 4A is a schematic plan view showing a state in which a plurality of package molded bodies 2 to be the lamps 1 are arranged on the lead frame 4a, and FIG. 4B is a diagram showing a plurality of packages shown in FIG. FIG. 4 is an enlarged plan view showing only one of the package molded bodies 2.

Next, at least a part of the side surface 22 of the package molded body 2 to be the low reflectance portion, the upper surface 23, and the wall of the cathode mark 3 so that the portion to be the low reflectance portion is darker than the inner surface of the recess 21. The portion 31 and the floor portion 32 are colored black using a pad printing method (coloring step).
The pad printing method is a method called tampo printing or octopus printing. In order to color at least a part of the side surface 22 of the package molded body 2, the upper surface 23, the wall portion 31 and the floor portion 32 of the cathode mark 3 in black using the pad printing method, first, FIG. ), An ink table 81 provided with an intaglio pattern 82 having a shape corresponding to the shape of the portion to be the low reflectance portion is prepared. Next, black ink 84 is put into the intaglio pattern 82 by a doctor, and the pattern is transferred from the intaglio pattern 82 to the soft pad 83 shown in FIGS. 5 (a) and 5 (b). Thereafter, as shown in FIG. 6, the pattern can be transferred from the pad 83 to a portion to be a low reflectance portion of the package molded body 2.
In this embodiment, since a soft pad 83 is used, as shown in FIG. 6, when the pad 83 is deformed, not only the upper surface 23 of the package molded body 2 but also the side surface 22 of the package molded body 2. At least a part of the wall and the wall 31 and floor 32 of the cathode mark 3 are also surely colored black.

  In addition, coloring of the part used as the low reflectance part by a pad printing method may be performed only once, and may be performed in multiple times. When coloring by the pad printing method is performed a plurality of times, the shape of the intaglio pattern 82 and the type of ink may be varied each time.

  In the present embodiment, the coloring process is performed using a pad 83 that is sufficiently larger than the size of the recesses 21 of the plurality of package molded bodies 2 in a state where the plurality of package molded bodies 2 are arranged on the lead frame 4a. Therefore, as shown in FIG. 4, adhesion of ink to the lead electrode 4 is prevented. That is, in the present embodiment, since the pad 83 is sufficiently larger than the size of the recess 21, the pattern is transferred from the pad 83 to the portion that becomes the low reflectance portion of the package molded body 2. At this time, the air in the concave portion 21 does not escape and is accommodated in the concave portion 21, and the contact between the pad 83 and the lead electrode 4 is hindered by the air in the concave portion 21, so that the ink adheres to the lead electrode 4. Is prevented. If ink adheres to the lead electrode 4, the electrical conductivity of the lead electrode 4 may be hindered.

Further, in the pad printing method, since the portion where the pad does not contact is not colored, the intaglio pattern 82 of the ink base 81 used in the present embodiment can be printed without bringing the pad into contact with the recess 21 of the package molded body 2. If it is, it may be solid. However, since the finish is clean, it is preferable to match the shape of the intaglio pattern 82 with the shape of the portion that becomes the low reflectance portion of the package molded body 2. Further, the size of the intaglio pattern 82 can be the same as or larger than the size of the portion that becomes the low reflectance portion.
In addition, when coloring by the pad printing method is performed a plurality of times, it suffices that all the portions that become the low reflectance portions are colored when the coloring is finished, and all the low reflectance portions are colored by one coloring. Since it is not necessary to completely color the portion to be colored, coloring may be performed using a plurality of ink stands 81 having an intaglio pattern corresponding to the shape of a part of the portion to be the low reflectance portion.

The pad 83 used in the pad printing method of the present embodiment is not particularly limited as long as it is used for normal pad printing, but not only the upper surface 23 of the package molded body 2, but also the side surface 22 of the package molded body 2, It is preferable to use a soft pad made of silicone resin or the like so that the wall portion 31 and the floor portion 32 of the cathode mark 3 can be easily and reliably colored.
The pad 83 used in the present embodiment is preferably of an antistatic type in order to improve transferability and prevent ink residue and stringing. Further, as shown in FIG. 5B, the pad 83 may have a convex shape whose sectional area gradually decreases toward the tip, but the shape of the pad 83 may be a kamaboko type or a round type. It is preferable that the tip is suitable for the shape and size of the package molded body 2. For example, in the present embodiment, as shown in FIG. 5A, a large pad 83 that can be colored at the same time with respect to the portions that become the low reflectance portions of the plurality of molded packages 2 is used as the pad 83. As 83, you may use the small thing which can be colored only with respect to the part used as the low-reflectance part of the one package molding 2. FIG. Further, the pad 83 has a plurality of convex portions corresponding to the portions that become the low reflectance portions of the package molded bodies 2, and the portions that become the low reflectance portions of the plurality of package molded bodies 2 can be colored simultaneously. You may use a big thing.

  The ink used in the pad printing of the present embodiment may be any ink for pad printing or screen printing, but has good adhesiveness in accordance with the material of the package molded body 2 to be colored. It is preferable to choose one. Further, as the ink, it is preferable to use an evaporation drying type or a two-component curable type ink from the viewpoint of ease of transfer in the pad printing method and good adhesion to the package molded body 2. As the pigment used in the ink, carbon black having high light heat resistance and excellent hiding power is preferably used. Further, when manufacturing a lamp that can be used outdoors, it is preferable to use an ink having high light and heat resistance.

After the coloring step is completed, the LED element 5 is mounted in the recess 21 of the package molded body 2 (mounting step). In the mounting process, first, the LED element 5 is bonded to the bottom 21a of the recess 21 using a die bond agent such as silver paste. Thereafter, the electrode of the LED element 5 and the lead electrode 4 are electrically connected using a wire 7 made of Au or the like.
After the mounting process is completed, the LED element 5 is sealed by botting a molding material in the recess 21 (sealing process).
Thereafter, the plurality of lamps 1 integrated by the lead frame 4a are divided into individual lamps.

In the lamp 1 of the present embodiment, a part of the side surface 22 and the upper surface 23 of the package molded body 2 are low-reflectance portions having a lower reflectance than the inner surface of the recess 21 for housing the LED element 5. Therefore, it is possible to prevent reflection on the side surface 22 of the package molded body 2 when not lit, and to reduce the reflected luminance when not lit, and when the lighting is sufficiently high without reducing the luminance when lit. A contrast ratio with the non-lighting state can be obtained.
Further, in the lamp 1 of the present embodiment, the wall 31 and the floor 32 of the cathode mark 3 are low-reflectance parts, so that the wall 31 and the floor 32 of the cathode mark 3 are not illuminated. Reflection can be prevented, and a higher contrast ratio can be obtained.

  Further, in the lamp 1 of the present embodiment, the package molded body 2 has a light color, and includes at least a part of the side surface 22 of the package molded body 2, the upper surface 23, the wall portion 31 and the floor portion 32 of the cathode mark 3. Since the low reflectance portion is a dark color, as in the case where a package molded body is molded using a material in which a black pigment is dispersed, without reducing the luminance at the time of lighting, The reflection luminance when not lit can be lowered.

Further, in the manufacturing method of the lamp 1 of the present embodiment, at least a part of the side surface 11 and the upper surface 23 of the light-color package molded body 2 are darker than the inner surface of the recess 21 for housing the LED element 5. In this way, a high luminance is obtained at the time of lighting, reflection on the side surface 22 of the package molded body 2 at the time of non-lighting can be prevented, and low reflection luminance can be obtained at the time of non-lighting. A lamp with a sufficiently high contrast ratio between time and non-lighting can be manufactured.
Moreover, in the manufacturing method of the lamp 1 of the present embodiment, the wall portion 31 and the floor portion 32 of the cathode mark 3 are colored so as to be darker than the inner surface of the recess 21 in the coloring step. The reflection of the mark 3 on the wall portion 31 and the floor portion 32 can be prevented, and the lamp 1 having an even higher contrast ratio can be manufactured.

Further, in the manufacturing method of the lamp 1 of the present embodiment, since coloring is performed using the pad printing method in the coloring step, not only the upper surface 23 of the package molded body 2 but also at least a part of the side surface 22 of the package molded body 2, the cathode The lamp 1 in which the wall portion 31 and the floor portion 32 of the mark 3 are colored can be easily and reliably manufactured.
On the other hand, in the conventional screen printing method and hot stamping method, it is difficult to color the side surface 22 of the package molded body 2 and the wall portion 31 and the floor portion 32 of the cathode mark 3, and a sufficient contrast ratio is obtained. It was difficult to produce the resulting lamp.

  Moreover, in the manufacturing method of the lamp 1 of the present embodiment, since the coloring process is performed before the sealing process, before the sealing agent (molding material) or the like adheres to the package molded body 2, At least a part of the side surface 11 and the upper surface 23 can be colored, and the sealant or the like adheres to the package molded body 2 so that the ink used in the coloring process is repelled and does not cause poor coloring. Reflective brightness is obtained when not lit.

In addition, the manufacturing method of the lamp | ramp 1 and the lamp | ramp 1 of this invention is not limited to embodiment mentioned above. For example, the coloring step can be performed before the mounting step as in the above-described example, but may be performed after the sealing step. In this case, since the inner surface of the recess 21 is not colored, sufficient brightness can be obtained at the time of lighting.
In the lamp 1 of the present embodiment, in order to improve productivity, each of the coloring process, the mounting process, and the sealing process is performed in a state where a large number of package molded bodies 2 are arranged on the lead frame 4a. It is preferable to manufacture a large number at the same time, but they may be manufactured one by one.

  Further, the lamp of the present invention is not limited to the above-described embodiment, and as shown in FIG. 7, at the two corners of the upper surface 23 of the package molded body 2 where the cathode mark 3 is not formed, Hemispherical dents 23a and 23a, which are burrs formed when the molded package 2 is molded by injection molding, may be formed.

When the lamp 10 shown in FIG. 7 is manufactured, the portion that becomes the low reflectance portion by the pad printing method in the coloring step may be colored only once, but is preferably performed twice. Even when the recesses 23a and 23a are formed on the upper surface 23 of the package molded body 2 as in the lamp 10 shown in FIG. 7, by increasing the amount of ink used for coloring, It is possible to reliably color all of the portions that become the low-reflectance portions by one-time coloring. However, when the amount of ink is increased, the ink may enter the inner surface of the recess 21 of the package molded body 2. For this reason, it is preferable to color the portion which becomes the low reflectance portion by the pad printing method twice.
In the case of performing the coloring by the pad printing method twice, for example, in the first coloring, all the portions that become the low reflectance portion are colored using a pattern corresponding to the shape of the portion that becomes the low reflectance portion, In the second coloring, it is possible to color only the recesses 23a and 23a that are difficult to be colored using a pattern corresponding to the shape of the recesses 23a and 23a. In this case, the recesses 23a and 23a can be more reliably colored without causing ink to enter the inner surface of the recess 21 of the package molded body 2.

“Second Embodiment”
FIG. 8 is a schematic plan view schematically showing an example of the lamp of the present invention. FIG. 9 is a side view of the lamp shown in FIG. 8 as viewed from below in FIG.
The lamp 1a shown in FIGS. 8 and 9 is different from the lamp 1 shown in FIG. 1 only in the package molded body 2a. Therefore, the lamp 1a shown in FIGS. 8 and 9 is the same as the lamp 1 shown in FIG. The same reference numerals are given to those and the description thereof is omitted.

  As the package molded body 2a, for example, a thermoplastic resin such as polyamide, liquid crystal polymer, polycarbonate, polyphenylene sulfide, and polybutylene terephthalate, thermosetting resin such as epoxy resin and pozzoimide, ceramic, etc., as in the lamp 1 shown in FIG. The thing which consists of is used. However, in the present embodiment, unlike the lamp 1 shown in FIG. 1, the material forming the package molded body 2a is made to contain a black filler such as carbon black so that the package molded body 2a is black (dark color). The reflectance of the package molded body 2a itself is reduced. Therefore, in this embodiment, as shown in FIGS. 8 and 9, the entire side surface 22 and the upper surface 23 of the package molded body 2a, and the wall portion 31 and the floor portion 32 of the cathode mark 3 are black. .

Further, in the present embodiment, the package molded body that has been blackened by brightly coloring the slope 21b of the recess 21 of the package molded body 2a and the insulating region 9 that electrically insulates the lead electrode 4 from each other. The high reflectance part has a reflectance higher than 2. The color of the high reflectivity portion may be a bright color that can have a reflectivity higher than that of the package molded body 2a. However, the closer the color is to white, the higher the contrast ratio between lighting and non-lighting. Since it becomes expensive, it is preferable.
In this embodiment, as shown in FIG. 8 and FIG. 9, the entire side surface 22 and the upper surface 23 of the package molded body 2a, and the wall portion 31 and the floor portion 32 of the cathode mark 3 are concave portions 21 colored lightly. The low-reflectance portion has a lower reflectance than the inner surface of the concave portion 21 composed of the slope 21 b and the insulating region 9 and the lead electrode 4.

Next, a method for manufacturing the lamp 1 shown in FIGS. 8 and 9 will be described.
In the present embodiment, a case will be described as an example where each of the coloring process, the mounting process, and the sealing process is performed in a state where a plurality of package molded bodies 2a are arranged on a lead frame.
To manufacture the lamp 1a shown in FIGS. 8 and 9, first, the package molded body 2a is formed in the same manner as in the case of manufacturing the lamp 1 shown in FIG.

Next, the inclined surface 21b of the recess 21 and the insulating region 9 that become the high reflectivity portion are colored white using a pad printing method so that the portion that becomes the high reflectivity portion is brighter than the package molded body 2a. (Coloring step).
In order to color the slope 21b of the recess 21 and the insulating region 9 in white using the pad printing method, first, as shown in FIG. 10A, a shape corresponding to the shape of the portion that becomes the high reflectance portion. An ink table 81a provided with an intaglio pattern 82a is prepared. Next, a white ink 84a is put into the intaglio pattern 82a by a doctor, and the pattern is transferred from the intaglio pattern 82a to the plurality of soft convex portions 83b of the pad 83a shown in FIGS. 10 (a) and 10 (b). In the present embodiment, the plurality of soft convex portions 83b correspond to one package molded body 2a. Then, as shown in FIG. 11, it can be performed by a method of transferring a pattern from each convex portion 83b of the pad 83a to a portion to be a high reflectance portion of each package molded body 2a.
In this embodiment, since the soft part is used as the convex part 83b of the pad 83a, as shown in FIG. 11, when each convex part 83b is deformed, the slope 21b of the concave part 21 of the package molded body 2a and The insulating region 9 is surely colored white.

The pad 83a used in the pad printing method of the present embodiment is not particularly limited as long as it is used for normal pad printing. However, the inclined surface 21b of the recess 21 and the insulating region 9 of the package molded body 2a can be easily and reliably formed. It is preferable to use a soft pad 83a made of silicone resin or the like so that it can be colored.
Further, as shown in FIGS. 10 (a) and 10 (b), the pad 83a may be one having a plurality of protrusions 83b whose sectional area gradually decreases toward the tip. The shape of 83b may be a kamaboko shape or a round shape, and it is preferable to use a tip whose tip is suitable for the shape and size of the package molded body 2a. For example, in the present embodiment, as shown in FIG. 10 (a), a pad 83a having a plurality of convex portions 83b corresponding to a portion to be a high reflectance portion of each package molded body 2a is used. Although the large thing which can be colored simultaneously with respect to the part used as the high reflectance part of the package molding 2a of this is used, it can color only only the part used as the high reflectance part of one package molding 2a as the pad 83a. You may use the small thing which has the one convex part 83b. Further, as the pad 83a, a pad having a large convex portion that can be colored simultaneously with respect to a portion that becomes a high reflectance portion of the plurality of package molded bodies 2a may be used.

  Further, as the pigment used in the ink in the present embodiment, titanium oxide, zinc oxide, barium sulfate and the like are preferably used.

  After the coloring process is completed, the LED element 5 is mounted in the recess 21 of the package molded body 2a (mounting process) in the same manner as in the case of manufacturing the lamp 1 shown in FIG. 1, and the LED element 5 is sealed (sealed). Stop process). Thereafter, similar to the case of manufacturing the lamp 1 shown in FIG. 1, the plurality of lamps 1a integrated by the lead frame 4a are divided into individual lamps 1a.

In the lamp 1a of the present embodiment, the side surface 22 and the upper surface 23 of the package molded body 2a are low-reflectance portions having a lower reflectance than the inner surface of the concave portion 21 for housing the LED element 5, so A contrast ratio between high lighting and non-lighting can be obtained.
Further, the lamp 1a according to the present embodiment is lighted because the package molded body 2a is dark and the high reflectance portion composed of the inclined surface 21b of the recess 21 and the insulating region 9 is colored light. The reflection brightness when not lit can be lowered without reducing the brightness at the time.

  Further, in the manufacturing method of the lamp 1a of the present embodiment, the slope 21b of the recess 21 and the insulating region 9 of the dark-colored package molded body 2a are lighter than the side surface 22 and the upper surface 23 of the package molded body 2a. Since it includes a coloring step for coloring, high brightness is obtained at the time of lighting, reflection on the side surface 22 of the package molded body 2a at the time of non-lighting can be prevented, and low reflection luminance can be obtained at the time of non-lighting. A lamp 1a having a sufficiently high contrast ratio with respect to the non-lighting state can be manufactured.

"Example 1"
The lamp 1 shown in FIG. 7 was manufactured by the following method.
That is, the recesses 21 where the lead electrodes 4 are exposed are formed on the upper surface 23 by injection molding on the upper and lower sides of three pairs of lead electrodes 4 made of a copper alloy C19400 (alloy 194) plated with silver on a lead frame (not shown). Each of the package moldings 2 made of polyphthalamide (Solvay Amodel) having cathode marks 3 at the edges was formed.
In the package molded body 2 obtained in this way, hemispherical recesses 23a and 23a were formed at two corners of the upper surface 23 where the cathode mark 3 was not formed.

Subsequently, at least a part of the side surface 22 of the package molded body 2 to be a low reflectance portion, the upper surface 23, and only the wall portion 31 and the floor portion 32 of the cathode mark 3 are colored black using a pad printing method (coloring). Process).
In the coloring process, KIPP150 (trade name: manufactured by Mino Group) is used as a pad printing device, and has a shape that matches the shape of the portion that becomes the low reflectance portion, and is more than the upper surface 23 of the package molded body 2. An ink platform having a large intaglio pattern was used. Also, a pad made of silicone was used, SP-700 (trade name: manufactured by Jujo Chemical) was used as the ink, and JA-960 (trade name: manufactured by Jujo Chemical) was used as the ink curing agent. In addition, the portion that becomes the low reflectance portion by the pad printing method was colored twice. The first time, an ink plate having an intaglio pattern corresponding to the shape of the portion that becomes the low reflectance portion is used to color all the portions that become the low reflectance portion, and the second time, the intaglio corresponding to the shape of the recesses 23a and 23a. Only the recesses 23a and 23a were colored again using an ink base having a pattern. Further, after coloring by the pad printing method, the ink was cured by heating at 150 ° C. for 30 minutes.

Photographs of the lamp 1 of Example 1 after the coloring step obtained in this way are shown in FIGS.
FIG. 12 is a photograph showing a part of the manufacturing process of the lamp of Example 1. 13 is a photograph of the lamp in the manufacturing process shown in FIG. 12 as seen from the lower side in FIG. 12, and FIG. 14 is a photograph of the lamp in the manufacturing process shown in FIG. 12 as seen from the left side in FIG.

After the coloring step was completed, the LED element 5 was mounted in the recess 21 of the package molded body 2 (mounting step). In the mounting process, first, three LED elements 5a, 5b, and 5c of red, blue, and green were bonded to the bottom 21a of the recess 21 using a die bonding agent made of silver paste. Thereafter, the electrode of the LED element 5 and the lead electrode 4 were electrically connected using a wire 7 made of Au.
Then, after the mounting process was completed, a molding material made of silicone resin was botted into the recess 21 to seal the LED element 5 (sealing process), whereby the lamp 1 shown in FIG. 7 was obtained.

"Example 2"
A black package molded body made of polyphthalamide (Solvay Amodel) was formed, and the slope of the concave portion of the package molded body and the insulating region that electrically insulated the lead electrode were colored using white resist as ink. Except for this, the lamp of Example 2 was manufactured in the same manner as Example 1.
“Comparative Example 1”
A lamp of Comparative Example 1 was manufactured in the same manner as Example 1 except that only the upper surface of the package molded body was colored black using a screen printing method.

"Contrast ratio"
In the state in which 200 lux of external light was incident on the lamps of Example 1, Example 2 and Comparative Example 1 obtained in this way, the luminance at the time of lighting as seen from an oblique angle of 15 ° with respect to the front surface, The reflection luminance (dark luminance) at the time of non-lighting was examined, and the contrast ratio when the reflection luminance at the time of non-lighting was set to 1 was obtained. The results are shown in Table 1.

  As shown in Table 1, Example 1 and Example 2 have a high contrast ratio compared to Comparative Example 1 because the reflection luminance when not turned on is lower than that of Comparative Example 1.

  DESCRIPTION OF SYMBOLS 1, 1a ... Lamp 2, 2a ... Package molded object, 3 ... Cathode mark, 4 ... Lead electrode, 4a ... Lead frame, 5, 5a, 5b, 5c ... LED element (light emitting element), 7 ... Wire, 9 ... Insulating region, 21 ... concave, 21a ... bottom, 21b ... slope, 22 ... side, 23 ... top, 31 ... wall, 32 ... floor, 81, 81a ... ink stand, 82, 82a ... intaglio pattern, 83, 83a ... pad, 83b ... convex part, 84, 84a ... ink.

Claims (10)

A light emitting element;
A package molded body in which a concave portion for accommodating the light emitting element is formed on the upper surface which is a light emission observation surface;
A mold material for sealing the light emitting element accommodated in the recess,
The lamp characterized in that at least a part of the side surface of the package molded body and the upper surface are low-reflectance portions having a lower reflectance than the inner surface of the recess. A cathode in which a part of the side surface of the package molded body and a part of the upper surface are continuously cut to form a wall portion exposed on the side surface side and a floor portion exposed on the upper surface side. Has a mark,
The lamp according to claim 1, wherein the wall portion and the floor portion of the cathode mark are the low reflectance portion. The package molding is light-colored,
The lamp according to claim 1 or 2, wherein the low reflectance part is colored in a dark color. The package molding is dark,
The lamp according to any one of claims 1 to 3, wherein at least a part of the inner surface of the recess is colored brightly. Colored so that at least a part of the side surface of the light-colored package molded body having a recess for accommodating the light emitting element formed on the upper surface, which is a light emission observation surface, and the upper surface are darker than the inner surface of the recess. A coloring process,
A mounting step of mounting a light emitting element in the recess;
And a sealing step of sealing the light emitting element with a molding material. At least a part of the inner surface of the concave portion of the dark-colored package molded body in which the concave portion for accommodating the light emitting element is formed on the upper surface which is the light emission observation surface is lighter than the side surface and the upper surface of the package molded body. A coloring process for coloring,
A mounting step of mounting a light emitting element in the recess;
And a sealing step of sealing the light emitting element with a molding material. The package molded body includes a wall portion exposed to the side surface side and a floor portion exposed to the upper surface side by continuously cutting a part of the side surface of the package molded body and a part of the upper surface. Has a cathode mark formed,
6. The lamp manufacturing method according to claim 5, wherein in the coloring step, the wall portion and the floor portion of the cathode mark are colored so as to be darker than the inner surface of the concave portion.   The method for manufacturing a lamp according to any one of claims 5 to 7, wherein in the coloring step, coloring is performed using a pad printing method.   The lamp manufacturing method according to claim 5, wherein the coloring step is performed before the sealing step. The method for manufacturing a lamp according to claim 5, wherein the coloring step is performed after the sealing step.