WO2010021408A1 - Procédé pour produire un moulage de résine thermiquement conducteur - Google Patents

Procédé pour produire un moulage de résine thermiquement conducteur Download PDF

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Publication number
WO2010021408A1
WO2010021408A1 PCT/JP2009/064903 JP2009064903W WO2010021408A1 WO 2010021408 A1 WO2010021408 A1 WO 2010021408A1 JP 2009064903 W JP2009064903 W JP 2009064903W WO 2010021408 A1 WO2010021408 A1 WO 2010021408A1
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Prior art keywords
mixture
mold
conductive resin
thermally conductive
molding cavity
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PCT/JP2009/064903
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English (en)
Japanese (ja)
Inventor
河合智之
今岡功
木下恭一
谷澤元治
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株式会社豊田自動織機
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Priority to JP2010525730A priority Critical patent/JPWO2010021408A1/ja
Publication of WO2010021408A1 publication Critical patent/WO2010021408A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/42—Casting under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive

Definitions

  • This invention relates to a method for producing a thermally conductive resin molding.
  • Patent Document In the prior art disclosed in Japanese Patent Application Laid-Open No. 2008-101227 (hereinafter abbreviated as “Patent Document”, particularly, see pages 4 to 6 and FIG. 1), an inorganic filler is added to the thermosetting resin as the binder resin.
  • a thermally conductive resin sheet having an insulating property to which is added is disclosed. This resin sheet is formed on a substrate by applying a mixture containing a thermosetting resin and an inorganic filler to the substrate surface by a doctor blade method.
  • Two types of fillers are used as the inorganic filler: an inorganic filler made of a flat plate powder and an inorganic filler made of a substantially spherical powder.
  • the inorganic filler When the inorganic filler is composed only of a flat powder, the inorganic filler is oriented parallel to the surface of the resin sheet. At this time, since a large amount of binder resin exists between the flat particles, the thermal conductivity in the thickness direction of the resin sheet is not so large. On the other hand, when the inorganic filler consists only of a substantially spherical powder, the inorganic filler is uniformly dispersed in the resin. At this time, since a large amount of binder resin is interposed between the substantially spherical particles, the thermal conductivity in the thickness direction of the resin sheet is not so large.
  • the flat particles are made of the resin sheet by the substantially spherical particles. Orientation parallel to the surface is impeded. Furthermore, since the tabular particles play a role of joining the substantially spherical particles, they form a heat conduction path in which inorganic fillers are connected in the thickness direction of the resin sheet. For this reason, it is supposed that the thermal conductivity in the thickness direction of the resin sheet is improved.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to greatly improve the thermal conductivity in an arbitrary direction such as the thickness direction of the resin molded body and to suppress an increase in cost.
  • the present invention provides a method for producing a thermally conductive resin molded body that can be used. The method for producing the thermally conductive resin molded body of the present invention for achieving the above-described object is as follows.
  • a method for producing a thermally conductive resin molded article comprising: a binder resin; and a thermally conductive inorganic filler powder containing particles having a flat shape and anisotropy in thermal conductivity and dispersed in the binder resin.
  • An exhaust process for exhausting the molding cavity of the mold An injection step of injecting the mixture into the molding cavity from the injection port;
  • a molded product is obtained through
  • the “flat shape” means that the thickness is thin, and for example, it can be said to be a shape in which particles such as a sphere or a lump are crushed in one direction.
  • “Flat shape” includes those referred to as plate, flake, and scale.
  • the inorganic filler powder dispersed in the binder resin contains particles having a flat shape and anisotropy in thermal conductivity (flat particles)
  • heat conduction is caused by the orientation of the inorganic filler powder in the binder resin.
  • the rate changes greatly.
  • the thermal conductivity in the thickness direction of the molded body is not so improved.
  • the flat particles are oriented in parallel with respect to the thickness direction, the thermal conductivity in the thickness direction of the compact is greatly improved.
  • the flat particles are oriented at random in the middle of parallel and perpendicular to the thickness direction, a heat conduction path is easily formed in the thickness direction of the molded body, and the thickness direction of the molded body The thermal conductivity of is improved.
  • the method for producing a thermally conductive resin molded body of the present invention after the molding cavity is exhausted, the mixture is injected into the molding cavity from the injection port and molded. Therefore, the flat particles contained in the inorganic filler powder are randomly oriented by the liquid flow when injected into the molding cavity. Since the binder resin is cured in this random orientation state, in the obtained resin molded body, the flat particles are randomly oriented in the resin molded body.
  • the method for producing a thermally conductive resin molded body of the present invention further includes a step of storing the molding die and a resin reservoir containing the mixture in an injection chamber before the exhausting step,
  • the exhausting step is a step of exhausting the molding cavity by exhausting the injection chamber,
  • the injection step is preferably a step of injecting the mixture into the molding cavity by increasing the pressure in the injection chamber after the injection port is immersed in the mixture in the resin reservoir. After the pressure of the molding cavity is evacuated, the injection port of the mold is immersed in the mixture and the pressure in the injection chamber is increased, so that the mixture can be reliably injected into the molding cavity.
  • the method for producing a thermally conductive resin molded body of the present invention may further include a step of removing the molded body from the mold after the curing step. Since the resin molded body is removed from the mold, the mold can be reused.
  • the inorganic filler powder may contain hexagonal boron nitride. Hexagonal boron nitride (hereinafter referred to as “h-BN”) has a layered crystal structure, has a flat particle shape, and has anisotropy in thermal conductivity due to the crystal structure. .
  • the thermal conductivity in the direction (a-axis direction) parallel to the flat surface of the h-BN particles is several tens of times the thermal conductivity in the direction (c-axis direction) perpendicular to the flat surface of the h-BN particles. . Utilizing this characteristic, the thermal conductivity of the resin molding can be improved by randomly orienting the flat surfaces of the h-BN particles in the resin molding.
  • the molded body may be a sheet-like thermally conductive resin sheet. If the thermally conductive resin molding is a thermally conductive resin sheet, it can be widely used for circuit boards and the like. The sheet shape is assumed to have a thickness of 10 to 1000 ⁇ m, for example.
  • the mixture contains a diluting solvent
  • the curing step is a step of curing the mixture while pressing the mold member from the outside of the mold.
  • the viscosity of the mixture increases with an increase in the content of the flat inorganic filler powder, but the addition of a diluting solvent can lower the viscosity of the mixture and facilitate injection.
  • the mold member is pressurized from the outside during curing, even if the diluted solvent in the mixture injected into the molding cavity evaporates and shrinks in volume, it can be compensated by reducing the volume of the resin sheet.
  • the mixture is injected after the molding cavity is evacuated to produce the resin molded body. Therefore, heat in any direction such as the thickness direction of the resin molded body is produced.
  • the conductivity can be greatly improved, and an increase in cost can be suppressed.
  • FIG. 1 is a schematic view schematically showing the main configuration of a vacuum injection apparatus used in the method for producing a thermally conductive resin molded body of the present invention.
  • FIG. 2 is a flowchart showing a manufacturing process of a heat conductive resin sheet which is an embodiment of the method for manufacturing a heat conductive resin molded body of the present invention.
  • 3A, 3B, 3C, and 3D are schematic views for explaining an injection process in the manufacturing process of the heat conductive resin sheet shown in FIG. 2, and (1-1) a mold and an injection chamber The resin reservoir is installed, (1-2) the mold is immersed in the mixture of the resin reservoir, (1-3) the mixture is injected into the molding cavity, and (1-4) the injection is completed.
  • FIG. 1 is a schematic view schematically showing the main configuration of a vacuum injection apparatus used in the method for producing a thermally conductive resin molded body of the present invention.
  • FIG. 2 is a flowchart showing a manufacturing process of a heat conductive resin sheet which is an embodiment of the
  • FIG. 4A is a schematic diagram schematically showing a cross-sectional configuration of a resin sheet obtained by the manufacturing process of the heat conductive resin sheet shown in FIG. 2.
  • FIG. 4B is a schematic diagram schematically showing a cross-sectional configuration of a resin sheet obtained by a coating method as a comparative example.
  • FIG. 5 shows an electron micrograph of the heat conductive resin sheet obtained by the manufacturing process of the heat conductive resin sheet shown in FIG. 6A and 6B show an X-ray diffraction method ( ⁇ -2 ⁇ method) of a heat conductive resin sheet obtained by the manufacturing process of the heat conductive resin sheet shown in FIG. 2 and a resin sheet obtained by a coating method as a comparative example. ) Shows the measurement results.
  • FIG. 5 shows an electron micrograph of the heat conductive resin sheet obtained by the manufacturing process of the heat conductive resin sheet shown in FIG. 6A and 6B show an X-ray diffraction method ( ⁇ -2 ⁇ method) of a heat conductive resin sheet obtained by the manufacturing process
  • FIG. 7 is a schematic view schematically showing the main configuration of a heating furnace used in another embodiment of the method for producing a thermally conductive resin molded body of the present invention.
  • FIG. 8 is a flowchart showing a manufacturing process of a heat conductive resin sheet, which is another embodiment of the method for manufacturing a heat conductive resin molded body of the present invention.
  • 9A and 9B are schematic views for explaining a heating step in the manufacturing process of the heat conductive resin sheet shown in FIG. 8, and (2-1) the mold into which the mixture is injected is placed in the heating furnace. It shows the state of installation and pressurization, (2-2) the state after curing by heating.
  • FIG. 10C are schematic diagrams for explaining a method for producing a thermally conductive resin molded body, which is another embodiment of the method for producing a thermally conductive resin molded body of the present invention.
  • FIG. 4 is a perspective view of a molding die, (b) a cross-sectional view showing an injection process into a molding cavity, and (c) a perspective view of an obtained resin molding.
  • FIG. 11A and FIG. 11B are schematic diagrams for explaining a method of manufacturing a thermally conductive resin molded body according to another embodiment, and FIG. 11A is a cross-sectional view illustrating an injection process into a molding cavity, and FIG. It is a perspective view of the obtained resin molding.
  • Drawing 12 is a mimetic diagram for explaining the manufacturing method of the heat conductive resin fabrication object concerning other embodiments.
  • a vacuum injection apparatus 10 used in the present embodiment includes a mold 12 having a pair of mold members 11 arranged facing each other with a predetermined gap, a binder resin 18 and inorganic filling.
  • the mold 12 includes a pair of mold members 11, a seal portion 15 that seals a peripheral portion of the mold member 11, and an injection port 16.
  • the mold member 11 is formed of a rectangular plate-like body, and is disposed to face each other with a constant gap interval t0.
  • the seal part 15 seals the peripheral part of the mold member 11 and partitions the molding cavity 17 together with the mold member 11.
  • the sealing portion 15 is provided with an inlet 16 for injecting the mixture P. That is, in the molding die 12, the inside of the gap in the molding die 12 is sealed from the outside except for the injection port 16, and the molding cavity 17 is formed, and the injection port 16 that connects the molding cavity 17 and the outside is formed. ing.
  • the injection chamber 14 is provided with an exhaust port 21 for evacuating the injection chamber 14, and the exhaust port 21 is connected to a vacuum pump (not shown) via a valve 22 for opening and closing the exhaust port 21.
  • a vacuum pump not shown
  • the manufacturing method of the heat conductive resin sheet using the vacuum injection apparatus 10 which has the above structures is demonstrated based on FIG. 2, FIG. 3A and FIG. 3B.
  • S101 the binder resin main component and the curing agent and the inorganic filler powder containing flat particles are sufficiently mixed by the mixing means.
  • S102 a liquid mixture P is obtained.
  • the molding cavity 17 is formed by having a pair of mold members 11 opposed to each other and sealing the periphery of the mold member 11 other than the injection port 16 by the seal portion 15.
  • a mold 12 is prepared.
  • the resin reservoir 13 and the mold 12 containing the mixture P are placed in the injection chamber 14, and the mold is placed above the resin reservoir 13. Twelve inlets 16 are arranged vertically downward. That is, the mold is arranged so that the thickness direction of the resin sheet is horizontal.
  • the valve 22 of the exhaust port 21 is opened and the vacuum pump is driven, whereby the injection chamber 14 is evacuated. At this time, the molding cavity 17 in the mold 12 is similarly evacuated through the inlet 16.
  • the mold 12 When the injection of the mixture P is completed, the mold 12 is moved upward, but the mixture P injected into the mold 12 is held inside the mold 12 by the atmospheric pressure and the viscosity of the uncured resin.
  • the mold 12 is taken out from the injection chamber 14, and the mixture P injected into the mold 12 is cured by a curing means (not shown). At this time, the direction of the molding die 12 remains with the injection work 16 directed downward in the vertical direction.
  • the mold is removed by removing at least the seal portion 15.
  • the resin sheet 23 as a resin molded body having a predetermined thickness is completed.
  • FIG. 4A (a) shows a cross-sectional configuration of the resin sheet 23 at this time, and only one mold member 11 of the mold member 11 is removed.
  • the inorganic filler powder 19 containing flat particles is randomly oriented in the binder resin 18, and a heat conduction path is easily formed in the thickness direction of the resin sheet 23. The thermal conductivity in the vertical direction is improved.
  • FIG. 4B (b) shows a cross-sectional structure of the resin sheet when the mixture P is applied to the surface of the mold member by the application method and cured as a comparative example. In this case, the inorganic filler powder 19 containing flat particles is oriented parallel to the sheet surface.
  • thermal conductivity in the thickness direction of the resin sheet of the comparative example is lower than the thermal conductivity in the thickness direction of the resin sheet 23.
  • thermal conductive resin sheet S1 A heat conductive resin sheet was produced according to the above procedure.
  • the maximum length of the used h-BN particles in the direction parallel to the flat surface is about 10 ⁇ m.
  • An epoxy resin and h-BN powder were blended so as to have a mass ratio of 70:30, and were sufficiently mixed together with a curing agent by a mixing means (not shown) to obtain a liquid mixture P.
  • This mixture P was placed in a resin reservoir 13 having a certain depth.
  • the mold member 11 of the mold 12 is made of glass (Matsunami Glass Industry Co., Ltd.) whose surface is covered with a Teflon seal (Chuko Kasei Kogyo Co., Ltd.), and the seal part 15 is molded with double-sided tape (Sumitomo 3M Co., Ltd.)
  • the cavity 17 was 76 mm ⁇ 26 mm ⁇ thickness 1 mm
  • the injection port 16 was a 10 mm ⁇ 1 mm rectangular shape formed on the 26 mm ⁇ 1 mm surface of the molding cavity 17.
  • the injection chamber was evacuated until the molding cavity 17 could be filled with the mixture P in the next injection process, and in the injection process, the injection chamber was returned to atmospheric pressure.
  • FIG. 5 is an electron micrograph of the sheet S1 obtained by the above manufacturing method.
  • the horizontal axis direction is the sheet surface direction parallel to the molding surface of the mold member
  • the vertical axis direction is the sheet thickness direction.
  • the flat h-BN particles in the epoxy resin 18 are in a state where the flat surfaces are oriented in random directions.
  • FIG. 6A and 6B show X of a sheet S1 and a comparative resin sheet S2 (abbreviated as “sheet S2”) prepared by a conventional application method using a mixture P having the same material and the same blending ratio as the sheet S1.
  • sheet S2 a comparative resin sheet S2
  • FIG. 6A (a) shows that the surface of the resin sheet is irradiated with X-rays at an angle ⁇ , and the diffracted light is at the position of angle 2 ⁇ while continuously changing the irradiation angle ( ⁇ ) and the detection angle (2 ⁇ ).
  • 6 is a graph showing the relationship between an angle 2 ⁇ when detected by a detector and the intensity of diffracted light.
  • the solid line indicates the characteristic of the sheet S1, and the broken line indicates the characteristic of the sheet S2.
  • the orientation of boron nitride in the resin can be determined.
  • the 6B (b) reads the diffraction intensities I (004) and I (100) from the characteristic graph of the sheet S1 and the sheet S2 in FIG. 6A (a), respectively, and calculates the diffraction intensity ratio I (004) / I (100). It is what I have sought.
  • the diffraction intensity ratio is 1.0, which corresponds to the case where the diffraction intensity ratio I (004) / I (100)> 0.4, and is flat with respect to the sheet surface direction. It was found that the h-BN particles were oriented in parallel.
  • the diffraction intensity ratio is 0.4, which corresponds to the case where the diffraction intensity ratio I (004) / I (100) ⁇ 0.4, and flat h-BN particles Was randomly oriented.
  • the flat h-BN particles are randomly oriented in the epoxy resin, so that heat conduction is performed in the thickness direction of the resin sheet 23. A path is easily formed. As a result, the thermal conductivity in the thickness direction of the resin sheet 23 is improved. According to the manufacturing method of the heat conductive resin sheet which concerns on this embodiment, there exist the following effects.
  • the injection port 16 of the mold 12 is immersed in the mixture P of the resin reservoir 13 and the pressure in the injection chamber 14 is increased. And the mixture P is injected into the molding cavity 17 from the injection port 16 to produce the resin sheet 23. Therefore, the flat h-BN particles are in a state in which the flat surfaces are randomly oriented due to the liquid flow of the mixture P when injected into the molding cavity 17. Since the resin sheet 23 is produced by being cured by heating in this random orientation state, in the obtained resin sheet 23, the flat h-BN particles are randomly oriented in the epoxy resin, and the thickness of the resin sheet 23 is increased.
  • a heat conduction path is easily formed in the vertical direction, and the thermal conductivity in the thickness direction of the resin sheet 23 is improved.
  • the molding cavity 17 in the molding die 12 is evacuated, and the pressure in the injection chamber 14 is increased to create a pressure difference between the pressure in the molding die 12 and the pressure in the injection chamber 14, and based on this pressure difference.
  • the mixture P is injected into the molding cavity 17 through the injection port 16. Therefore, the mixture P can be reliably injected into the mold 12. Moreover, since the injection is performed under vacuum, the generation of bubbles in the resin sheet 23 that contributes to the characteristic variation can be reduced.
  • h-BN particles are used as the inorganic filler powder, it can be used by taking advantage of the anisotropy in the thermal conductivity of the h-BN particles. That is, it is possible to improve the thermal conductivity in the thickness direction of the sheet by randomly orienting the flat surface of the h-BN particles with respect to the sheet surface of the thermally conductive resin sheet 23. Further, since the h-BN particles are insulating particles, the heat conductive resin sheet 23 can be used as an insulating member of an electronic device.
  • the raw material of the mixture Q in this embodiment is obtained by adding a dilution solvent to the raw material of the mixture P in the above embodiment.
  • the viscosity of the mixture Q can be reduced by adding a diluting solvent.
  • the vacuum injection apparatus 10 in the above embodiment can be used as it is.
  • FIG. 7 shows a state where the injection of the mixture Q into the mold 12 is completed and the mold 12 moved upward is installed in a heating furnace 31 as a curing means.
  • a heater 32 is installed in the heating furnace 31, and the set temperature and set time in the furnace can be controlled by control means (not shown).
  • the pair of mold members 11 are arranged so as to be pressurized by a pressing means (not shown) in a direction inside both sides.
  • thermosetting resin main component and the curing agent as the binder resin 18, the inorganic filler powder 19 containing flat particles, and the diluting solvent are sufficiently mixed by the mixing means.
  • a liquid mixture Q is obtained.
  • steps from S203 to S209 are the same as the steps of S103 to S109 (see FIG. 2) in the first embodiment except that the mixture Q is used instead of the mixture P, and the description thereof is omitted. To do.
  • the mold 12 is taken out from the injection chamber 14 and installed in the heating furnace 31 as a curing means.
  • mold member 11 is pressurized with a fixed pressure in the direction inside the both sides with a pressurizing means.
  • the clearance gap between the mold members 11 at this time is t1. Then, by heating for a predetermined time at a predetermined temperature in a pressurized state, the methyl ethyl ketone in the mixture Q evaporates and the mixture Q injected into the mold 12 is cured.
  • FIG. 9B (2-2) shows a state after curing, and the gap interval between the mold members 11 is t2 (t2 ⁇ t1). That is, when the gap interval t1 between the mold members 11 is reduced to t2, the volume shrinkage is compensated, and it is possible to prevent the occurrence of a problem associated with the volume shrinkage.
  • the mold member 11 is removed, and in S212, the resin sheet 33 as a resin molded body having a predetermined thickness t2 is completed.
  • an epoxy resin which is a thermosetting resin is suitably used as the binder resin 18, h-BN particles as the inorganic filler powder 19, and methyl ethyl ketone as the diluent solvent.
  • the molding die 40 of this embodiment is composed of a cylindrical inner mold member 41 and an outer mold member 42, and around the inner mold member 41.
  • the outer mold members 42 are arranged so as to face each other with a predetermined gap interval so as to surround them.
  • Seals 43 are provided at both opening end portions of the inner mold member 41 and the outer mold member 42, and a plurality of injection ports 44 for injecting the mixture P are provided at one opening end portion.
  • the molding die 40 is in a state where the inside of the gap in the molding die 40 is sealed except for the injection port 44 and a cylindrical gap space 45 having a rectangular cross section is formed.
  • the mold 40 is immersed in a resin reservoir 46 in which the mixture P is placed in the injection chamber, and the mixture P enters the gap space 45 in the mold 40 through the injection port 44. Do the injection.
  • the mold 40 is heated and cured in a heating furnace. Then, the inner mold member 41 and the outer mold member 42 are removed.
  • thermosetting epoxy resin is used as the binder resin and h-BN particles (hexagonal boron nitride) are used as the inorganic filler powder.
  • h-BN particles hexagonal boron nitride
  • the binder resin other unsaturated polyesters are also used.
  • Thermosetting resins such as resins, phenol resins, melamine resins, silicone resins, and polyimide resins, or thermoplastic resins such as synthetic rubber resins, acrylic resins, and olefin resins may be used.
  • the inorganic filler powder aluminum oxide (alumina), silicon carbide, graphite powder, or the like may be used.
  • a heat conductive resin sheet as an insulating member, it is desirable to use insulating inorganic filler powder.
  • only the h-BN particles are used as the inorganic filler powder, but a powder further including particles having a shape different from the flat particles may be used.
  • the particles having different shapes are preferably substantially spherical, but may be pulverized and polygonal.
  • the material include alumina, silica, silicon nitride, aluminum nitride, silicon carbide, boron nitride and the like.
  • methyl ethyl ketone is used as a diluent solvent.
  • other common organic solvents such as acetone and toluene may be used, and it is desirable to select in consideration of compatibility with the binder resin.
  • the viscosity of the mixture is preferably 1 to 500 Pa ⁇ s, more preferably 50 to 200 Pa ⁇ s.
  • how much pressure is applied to the mold member by the pressurizing means depends on the amount of the solvent, but the pressure applied to the mixture is 1 ⁇ 10. 5 Pa ⁇ 1000 ⁇ 10 5 It is desirable that the pressure is Pa or 1.5 to 10 Pa. 1000x10 5 If it exceeds Pa, the matrix resin may be damaged, which is not desirable.
  • a thermosetting epoxy resin is used as the binder resin and a heating furnace is used as the curing means to cure by heating.
  • the binder resin may be cured by natural drying without being heated.
  • curing by cooling may be performed as a curing means for the mixture in a high temperature state.
  • a photocurable resin when used as the binder resin and the mold member is formed of a transparent material, a photocuring method by light irradiation may be used as the curing means.
  • a photocuring method by light irradiation may be used as the curing means.
  • one mold member was not removed. However, all mold members may be removed or only the seal part may be removed.
  • the flat h-BN particles 19 have been described as being randomly oriented in the mixture P or Q injected into the mold 12 or 40.
  • the h-BN particles 19 are changed in the thickness direction of the resin sheet and the resin molded body sheet and the molded body. It is possible to orient it so that it may approach parallel more. As a result, the thermal conductivity in the thickness direction of the sheet and the molded body can be further improved.
  • the injection chamber after exhausting is pressurized and the mixture is injected into the molding cavity, but the method of injecting the mixture is not limited.
  • the flat particles are likely to be randomly oriented.
  • the mixture may be injected while the molding cavity is exhausted. That is, even if the exhaust process and the injection process are performed simultaneously in the manufacturing method of the present invention, the object of the present invention is achieved.
  • the molding cavity is exhausted from an opening (exhaust port) different from the injection port communicating with the molding cavity with the injection port immersed in the mixture.
  • the raw material viscosity is preferably 1 to 500 Pa ⁇ s, more preferably 1 to 200 Pa ⁇ s, and within this range, the flat particles are likely to be randomly oriented.
  • the injection chamber that is, the molding cavity
  • the pressure in the injection chamber is returned to atmospheric pressure
  • the pressure in the injection chamber may be adjusted so that the liquid level of the mixture filled in the molding cavity increases at 0.01 to 1 m / sec. If the degree of vacuum and the rising speed of the liquid level are in the above ranges, the flat particles are likely to be randomly oriented.
  • the cylindrical resin molded body 47 is formed using the molding die 40 including the inner mold member 41 and the outer mold member 42.
  • each mold member By devising the shape of each mold member, it is possible to form a resin molded body having an L shape, a U shape, a corrugated plate shape, or any other shape.
  • the material of the mold member is not particularly limited, but may be selected from glass, plastic, metal and the like according to the curing means of the binder resin. Further, if the mold member is released from the resin molded body after the curing step, a release agent may be applied to the surface of the mold member in advance.
  • There is no particular limitation on the material of the seal portion and a general seal material may be used.
  • the seal portion is preferably made of a rubber-based adhesive such as a silicone-based adhesive.
  • a rubber-based adhesive such as a silicone-based adhesive.
  • one injection port has such a size as to fit within a circle having a diameter in the range of 0.1 to 10 mm, further 0.2 to 0.5 mm.
  • a resin having a non-uniform thickness is obtained by using a molding die 50 including a flat mold member 51b and a mold member 51a partially protruding outward. It is also possible to form the molded body 52.
  • the resin sheet 23 is manufactured using the pair of mold members 11. However, at least a pair of mold members may be used. That is, as shown in FIG.
  • a plurality of resin sheets may be formed simultaneously using a mold 60 in which a plurality of mold members 61 are laminated at a predetermined interval.
  • a soft material such as silicone resin coated with polytetrafluoroethylene (PTFE) may be used.
  • PTFE polytetrafluoroethylene
  • the three molds used in the first embodiment are arranged at a predetermined interval.
  • a gap space 67 between adjacent molds may be used as a molding cavity. That is, it is also possible to use both surfaces of a flat plate-shaped mold member as a molding surface.

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention porte sur un procédé pour produire un moulage de résine thermiquement conducteur contenant une résine de liant (18), et une poudre de charge minérale thermiquement conductrice (19) dispersée dans la résine de liant (18), tout en contenant des particules plates possédant une anisotropie de conductivité thermique, dans lequel procédé, la conductivité thermique peut être considérablement améliorée dans une direction arbitraire, par exemple, la direction de l'épaisseur du moulage, et une augmentation du coût peut être limitée. Un moulage est obtenu par l'intermédiaire d'une étape pour préparer un mélange (P) par mélange d'une résine de liant non durcie (18) et d'une poudre de charge minérale (19), une étape pour évacuer de l'air dans la cavité de moulage (17) d'une matrice de moulage (12), une étape pour injecter le mélange (P) dans la cavité de moulage (17) à partir d'une ouverture d'injection (16) communiquant avec la cavité de moulage (17), et une étape pour durcir le mélange (P) injecté dans la cavité de moulage (17).
PCT/JP2009/064903 2008-08-21 2009-08-20 Procédé pour produire un moulage de résine thermiquement conducteur WO2010021408A1 (fr)

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JP2015195287A (ja) * 2014-03-31 2015-11-05 三菱化学株式会社 放熱シートおよび放熱シート用塗布液、並びにパワーデバイス装置

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JPH03150115A (ja) * 1989-11-06 1991-06-26 Aaku:Kk 真空注型方法及びその装置
JPH0474612A (ja) * 1990-07-17 1992-03-10 Kemitsukusu Mach Japan:Kk 合成樹脂液の真空注型方法とその装置
JP2000185328A (ja) * 1998-12-24 2000-07-04 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体とその製造方法、及び用途
JP2001062850A (ja) * 1999-08-26 2001-03-13 Tokai Rubber Ind Ltd 熱伝導性シートの製法およびそれによって得られた熱伝導性シート
JP2002086464A (ja) * 2000-09-12 2002-03-26 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2003062839A (ja) * 2001-08-28 2003-03-05 Matsushita Electric Works Ltd 人造大理石の製造方法
JP2003266453A (ja) * 2002-03-19 2003-09-24 Toshiba Corp エポキシ注型品の製造方法
JP2004256687A (ja) * 2003-02-26 2004-09-16 Polymatech Co Ltd 熱伝導性反応硬化型樹脂成形体及びその製造方法
JP2008036997A (ja) * 2006-08-08 2008-02-21 Mitsubishi Heavy Ind Ltd Ｒｔｍ成形装置

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JPS62164512A (ja) * 1986-01-16 1987-07-21 Nec Corp 注型成形方法
JPH03150115A (ja) * 1989-11-06 1991-06-26 Aaku:Kk 真空注型方法及びその装置
JPH0474612A (ja) * 1990-07-17 1992-03-10 Kemitsukusu Mach Japan:Kk 合成樹脂液の真空注型方法とその装置
JP2000185328A (ja) * 1998-12-24 2000-07-04 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体とその製造方法、及び用途
JP2001062850A (ja) * 1999-08-26 2001-03-13 Tokai Rubber Ind Ltd 熱伝導性シートの製法およびそれによって得られた熱伝導性シート
JP2002086464A (ja) * 2000-09-12 2002-03-26 Polymatech Co Ltd 熱伝導性成形体及びその製造方法
JP2003062839A (ja) * 2001-08-28 2003-03-05 Matsushita Electric Works Ltd 人造大理石の製造方法
JP2003266453A (ja) * 2002-03-19 2003-09-24 Toshiba Corp エポキシ注型品の製造方法
JP2004256687A (ja) * 2003-02-26 2004-09-16 Polymatech Co Ltd 熱伝導性反応硬化型樹脂成形体及びその製造方法
JP2008036997A (ja) * 2006-08-08 2008-02-21 Mitsubishi Heavy Ind Ltd Ｒｔｍ成形装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015195287A (ja) * 2014-03-31 2015-11-05 三菱化学株式会社 放熱シートおよび放熱シート用塗布液、並びにパワーデバイス装置

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