WO2010019264A3 - Chemical mechanical polisher having movable slurry dispensers and method - Google Patents
Chemical mechanical polisher having movable slurry dispensers and method Download PDFInfo
- Publication number
- WO2010019264A3 WO2010019264A3 PCT/US2009/004667 US2009004667W WO2010019264A3 WO 2010019264 A3 WO2010019264 A3 WO 2010019264A3 US 2009004667 W US2009004667 W US 2009004667W WO 2010019264 A3 WO2010019264 A3 WO 2010019264A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- slurry
- distal end
- movable
- chemical mechanical
- dispensing nozzle
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title abstract 8
- 239000000126 substance Substances 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000969 carrier Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980131752.9A CN102124545B (en) | 2008-08-14 | 2009-08-14 | Chemical mechanical polisher having movable slurry dispensers and method |
JP2011523002A JP5542818B2 (en) | 2008-08-14 | 2009-08-14 | Chemical mechanical polishing machine and method with movable slurry dispenser |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8899308P | 2008-08-14 | 2008-08-14 | |
US61/088,993 | 2008-08-14 | ||
US12/196,860 US8414357B2 (en) | 2008-08-22 | 2008-08-22 | Chemical mechanical polisher having movable slurry dispensers and method |
US12/196,860 | 2008-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010019264A2 WO2010019264A2 (en) | 2010-02-18 |
WO2010019264A3 true WO2010019264A3 (en) | 2010-05-20 |
Family
ID=41669537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/004667 WO2010019264A2 (en) | 2008-08-14 | 2009-08-14 | Chemical mechanical polisher having movable slurry dispensers and method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5542818B2 (en) |
KR (1) | KR20110065464A (en) |
CN (1) | CN102124545B (en) |
WO (1) | WO2010019264A2 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103223638B (en) * | 2013-04-28 | 2016-04-13 | 上海华力微电子有限公司 | Chemical-mechanical grinding device |
CN103286693A (en) * | 2013-05-31 | 2013-09-11 | 上海集成电路研发中心有限公司 | Grinding fluid distribution arm |
US20150059808A1 (en) * | 2013-08-30 | 2015-03-05 | Semes Co., Ltd. | Apparatus for processing substrate and method of cleaning same |
CN104637836B (en) * | 2013-11-14 | 2019-06-25 | 盛美半导体设备(上海)有限公司 | Wafer processing apparatus |
CN104625941B (en) * | 2013-11-14 | 2018-09-04 | 盛美半导体设备(上海)有限公司 | Wafer processing apparatus |
KR101637537B1 (en) * | 2014-07-01 | 2016-07-08 | 주식회사 케이씨텍 | Chemical mechanical polishing apparatus and method |
CN104308744A (en) * | 2014-08-26 | 2015-01-28 | 上海华力微电子有限公司 | Chemical mechanical grinding liquid supply device |
CN112091809B (en) * | 2014-10-03 | 2022-11-29 | 株式会社荏原制作所 | Processing assembly and processing method |
US10350728B2 (en) * | 2014-12-12 | 2019-07-16 | Applied Materials, Inc. | System and process for in situ byproduct removal and platen cooling during CMP |
KR101587894B1 (en) * | 2015-02-17 | 2016-01-25 | 주식회사 티에스시 | Slurry Supply Device |
KR101707450B1 (en) * | 2015-12-04 | 2017-02-16 | 주식회사 포스코 | Sample processing apparatus |
KR101681679B1 (en) * | 2016-03-31 | 2016-12-01 | 에이프로테크주식회사 | Apparatus for supplying slurry of wafer polishing apparatus |
JP6717691B2 (en) | 2016-07-06 | 2020-07-01 | 株式会社荏原製作所 | Substrate processing equipment |
JP7094983B2 (en) * | 2017-04-26 | 2022-07-04 | アクス テクノロジー エルエルシー | CMP machine with improved throughput and process flexibility |
KR101966952B1 (en) * | 2017-07-06 | 2019-04-18 | 주식회사 케이씨텍 | Slurry supply unit and apparatus for polishing substrate having the slurry supply device |
US11251047B2 (en) * | 2017-11-13 | 2022-02-15 | Applied Materials, Inc. | Clog detection in a multi-port fluid delivery system |
KR102037750B1 (en) * | 2018-02-09 | 2019-10-29 | 에스케이실트론 주식회사 | Slurry supplying unit and apparatur for polishing wafer including the same |
CN108857904B (en) * | 2018-06-25 | 2020-04-10 | 深圳市冠华珠宝有限公司 | Grinding machine with auxiliary agent spray holes |
JP7152279B2 (en) | 2018-11-30 | 2022-10-12 | 株式会社荏原製作所 | Polishing equipment |
CN110977622B (en) * | 2019-12-13 | 2021-04-02 | 大连理工大学 | Control method for multipoint variable-position automatic dropping of polishing solution |
KR20210081898A (en) * | 2019-12-24 | 2021-07-02 | 에스케이하이닉스 주식회사 | Apparatus of chemical mechanical polishing And Method of driving the same |
JP7493966B2 (en) * | 2020-03-06 | 2024-06-03 | 株式会社荏原製作所 | Polishing Equipment and Processing Systems |
CN111633498B (en) * | 2020-06-09 | 2022-03-29 | 南京鲲途机电科技有限公司 | Automatic ceramic grinding machine tool |
CN113245986B (en) * | 2021-06-01 | 2021-10-01 | 湖南工业职业技术学院 | Disc surface grinding device of continuous concrete mixer |
CN115734841A (en) * | 2021-06-11 | 2023-03-03 | 株式会社荏原制作所 | Grinding device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6482290B1 (en) * | 2001-08-10 | 2002-11-19 | Taiwan Semiconductor Manufacturing Co., Ltd | Sweeping slurry dispenser for chemical mechanical polishing |
US20060003671A1 (en) * | 2004-07-02 | 2006-01-05 | Stumpf John F | CMP apparatus and method |
US7052374B1 (en) * | 2005-03-01 | 2006-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multipurpose slurry delivery arm for chemical mechanical polishing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000006010A (en) * | 1998-06-26 | 2000-01-11 | Ebara Corp | Cmp device and its grinding liquid feeding method |
KR20010071353A (en) * | 1999-04-01 | 2001-07-28 | 롤페스 요하네스 게라투스 알베르투스 | Dual cmp pad conditioner |
US6390902B1 (en) * | 2001-06-06 | 2002-05-21 | United Microelectronics Corp. | Multi-conditioner arrangement of a CMP system |
US6722943B2 (en) * | 2001-08-24 | 2004-04-20 | Micron Technology, Inc. | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
JP2006147773A (en) * | 2004-11-18 | 2006-06-08 | Ebara Corp | Polishing apparatus and polishing method |
-
2009
- 2009-08-14 JP JP2011523002A patent/JP5542818B2/en not_active Expired - Fee Related
- 2009-08-14 WO PCT/US2009/004667 patent/WO2010019264A2/en active Application Filing
- 2009-08-14 KR KR1020117005938A patent/KR20110065464A/en not_active Application Discontinuation
- 2009-08-14 CN CN200980131752.9A patent/CN102124545B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6482290B1 (en) * | 2001-08-10 | 2002-11-19 | Taiwan Semiconductor Manufacturing Co., Ltd | Sweeping slurry dispenser for chemical mechanical polishing |
US20060003671A1 (en) * | 2004-07-02 | 2006-01-05 | Stumpf John F | CMP apparatus and method |
US7052374B1 (en) * | 2005-03-01 | 2006-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multipurpose slurry delivery arm for chemical mechanical polishing |
Also Published As
Publication number | Publication date |
---|---|
JP2011530422A (en) | 2011-12-22 |
JP5542818B2 (en) | 2014-07-09 |
KR20110065464A (en) | 2011-06-15 |
CN102124545A (en) | 2011-07-13 |
CN102124545B (en) | 2013-11-06 |
WO2010019264A2 (en) | 2010-02-18 |
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