WO2010018621A1 - Bonding device and maintenance method of bonding device - Google Patents

Bonding device and maintenance method of bonding device Download PDF

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Publication number
WO2010018621A1
WO2010018621A1 PCT/JP2008/064457 JP2008064457W WO2010018621A1 WO 2010018621 A1 WO2010018621 A1 WO 2010018621A1 JP 2008064457 W JP2008064457 W JP 2008064457W WO 2010018621 A1 WO2010018621 A1 WO 2010018621A1
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WO
WIPO (PCT)
Prior art keywords
chamber
gun
gate valve
vacuum chamber
drawer mechanism
Prior art date
Application number
PCT/JP2008/064457
Other languages
French (fr)
Japanese (ja)
Inventor
雅人 木ノ内
諭 田原
崇之 後藤
健介 井手
Original Assignee
三菱重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱重工業株式会社 filed Critical 三菱重工業株式会社
Priority to PCT/JP2008/064457 priority Critical patent/WO2010018621A1/en
Priority to JP2008544701A priority patent/JP4885235B2/en
Publication of WO2010018621A1 publication Critical patent/WO2010018621A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/06—Electron-beam welding or cutting within a vacuum chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0006—Electron-beam welding or cutting specially adapted for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/002—Devices involving relative movement between electronbeam and workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale

Definitions

  • the present invention relates to a bonding apparatus and a bonding apparatus maintenance method, and more particularly, to a bonding apparatus that discharges particles into a vacuum chamber and a bonding apparatus maintenance method that maintains the bonding apparatus.
  • MEMS Micro Electro Mechanical Systems
  • the MEMS include a micromachine, a pressure sensor, and a micro motor.
  • a room temperature bonding apparatus for manufacturing such MEMS by room temperature bonding.
  • the room-temperature bonding apparatus includes a vacuum chamber and an ion gun.
  • the MEMS is manufactured by bonding a substrate irradiated with an ion beam in the vacuum chamber.
  • Such a room temperature bonding apparatus is desired to more reliably irradiate the irradiation target with particles and to maintain the gun faster without increasing the pressure inside the vacuum chamber.
  • Japanese Patent Application Laid-Open No. 61-272375 discloses a thin film having a simple structure and high reliability without causing deterioration of withstand voltage performance due to exposure of the ion source to the atmosphere even when the vacuum vessel is opened for sample exchange or the like.
  • a forming apparatus is disclosed.
  • the thin film forming apparatus is a thin film forming apparatus comprising an ion source and a vacuum vessel, and a gate valve having a structure between the ion source and the vacuum vessel, with a packing on the ion source side and a sheet on the vacuum vessel side. It is characterized by providing.
  • Japanese Patent Publication No. 07-072340 discloses a vacuum deposition apparatus with high reliability, long life and stable film formation.
  • the vacuum deposition apparatus includes an internal space that can be evacuated, a charged particle beam generation source disposed in the internal space, a charged particle beam supply unit having a radiation hole that emits a charged particle beam, and the charged particle beam supply unit.
  • a vacuum vessel having an opening for introducing a charged particle beam that radiates more and having an internal space that can be evacuated independently of the internal space of the charged particle beam supply means; and disposed in the internal space of the vacuum vessel, An evaporation source with which the charged particle beam collides by giving a predetermined potential difference to the charged particle beam generation source; a sample holding means arranged so that an evaporation component from the evaporation source adheres; and the aperture portion Openable and closable valve means for connecting the radiation hole and the radiation hole, the internal space of the vacuum vessel and the charged particle beam when the valve means is opened.
  • the internal space of the supply means When the internal space of the supply means is communicated and closed, the internal space of the vacuum vessel is separated from the internal space of the charged particle beam supply means, and in the closed state, the internal space of the vacuum vessel is The charged particle beam supply means can be removed from the valve means while maintaining a vacuum state.
  • the subject of this invention is providing the joining apparatus which can irradiate particle
  • Another object of the present invention is to provide a joining apparatus maintenance method that can maintain a joining apparatus that can irradiate particles to an irradiation object more reliably and more quickly.
  • the bonding apparatus opens and closes a gun that discharges particles, a vacuum chamber in which an atmosphere in which the particles are discharged is generated, a drawer mechanism chamber, and the vacuum chamber and the drawer mechanism chamber And a gate valve.
  • the gun is movably supported through the gate valve.
  • Such a bonding apparatus can move the gun through the gate valve from the inside of the drawer mechanism chamber to the vicinity of the irradiation target disposed inside the vacuum chamber.
  • Such a joining apparatus moves the gun to the inside of the drawer mechanism chamber, and then closes the gate valve to take out the gun to the outside of the vacuum chamber without increasing the pressure inside the vacuum chamber. Can do. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
  • the bonding apparatus further includes a lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber.
  • the gun is secured to the lid.
  • Such a bonding apparatus is configured such that when the gun is disposed inside the vacuum chamber, the vacuum chamber is sealed with a lid so that the pressure inside the vacuum chamber is not increased. Can be boosted.
  • Such a bonding device can further remove the gate valve from the vacuum chamber without boosting the interior of the vacuum chamber when the gun is placed inside the vacuum chamber, or The drawer mechanism chamber can be removed from the gate valve.
  • the bonding apparatus includes another gun that discharges particles to the atmosphere generated in the vacuum chamber, the other drawing mechanism chamber, and the other that opens and closes between the vacuum chamber and the other drawing mechanism chamber. And a gate valve.
  • Other guns are movably supported through other gate valves for placement within other drawer mechanism chambers. That is, the bonding apparatus includes a plurality of drawer mechanism chambers in which a plurality of movable guns are respectively disposed, and a plurality of gate valves that open and close between the vacuum chamber and the plurality of drawer mechanism chambers. .
  • the plurality of guns move to the inside of the plurality of drawing mechanism chambers, respectively, and then close the plurality of gate valves, thereby increasing the pressure inside the vacuum chamber. It can be maintained faster.
  • the bonding apparatus further includes another gun that discharges particles to the atmosphere generated inside the vacuum chamber.
  • Other guns are movably supported through the gate valve so as to be placed inside the drawer mechanism chamber. That is, the bonding apparatus includes a plurality of guns that can be disposed in one drawer mechanism chamber. According to such a joining device, the plurality of guns are moved to the inside of the drawing mechanism chamber, and then maintained more quickly without increasing the pressure in the vacuum chamber by closing the gate valve. Can.
  • the other gun is preferably a hollow cathode that supplies the gun with the particles.
  • the drawer mechanism chamber includes a fixed part fixed to the vacuum chamber, a movable part movable with respect to the fixed part, and a bellows disposed between the fixed part and the movable part. .
  • the gun is preferably fixed to the movable part.
  • a joining apparatus maintenance method includes a step of moving a gun that emits particles from a vacuum chamber to a drawing mechanism chamber, and the vacuum chamber and the drawing mechanism when the gun is disposed inside the drawing mechanism chamber. Closing a gate valve disposed between the chamber and the chamber.
  • the gun arranged in the vicinity of the irradiation object arranged inside the vacuum chamber can be taken out of the vacuum chamber without increasing the pressure inside the vacuum chamber. it can.
  • grain to irradiation object more reliably can be maintained faster, without raising the inside of a vacuum chamber.
  • the inside of the drawer mechanism chamber is decompressed to open the gate valve.
  • the method further includes a step.
  • the gun is moved with the lid from the vacuum chamber to the drawer mechanism chamber.
  • the drawer mechanism chamber is preferable because it is not necessary to depressurize the inside of the drawer mechanism chamber when the lid seals the vacuum chamber.
  • the joining apparatus maintenance method further includes a step of attaching the drawer mechanism chamber to the gate valve. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber is not attached before this step. At this time, the floor area on which the joining device is arranged can be reduced by the amount of the drawing mechanism chamber.
  • the bonding apparatus maintenance method further includes a step of attaching the drawer mechanism chamber and the gate valve to the vacuum chamber. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber and the gate valve are not attached before this step. At this time, the floor area in which the bonding apparatus is disposed can be reduced by the amount of the drawing mechanism chamber and the gate valve.
  • the joining apparatus maintenance method according to the present invention preferably further comprises a step of releasing the particles using the gun while the gate valve is opened.
  • the joining device maintenance jig includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber. And a lid for sealing the vacuum chamber.
  • the gun is attached to a joining device fixed to the lid.
  • a joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber, a gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber, and a movable that supports the gun so as to be movable through the gate valve. And a part. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber.
  • Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber.
  • the gun can be taken out of the vacuum chamber without any trouble.
  • the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
  • the joining device maintenance jig includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber.
  • a lid for sealing the vacuum chamber and a gate valve are provided.
  • the gun is attached to a joining device fixed to the lid.
  • a joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber and a movable part that supports the gun so as to be movable through the gate valve.
  • the gate valve opens and closes between the vacuum chamber and the drawer mechanism chamber. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber.
  • Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber.
  • the gun can be taken out of the vacuum chamber without any trouble.
  • the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
  • the bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can maintain the gun that discharges the particles more quickly.
  • the bonding apparatus maintenance method according to the present invention the bonding apparatus that can irradiate the irradiation target more reliably with the particles can maintain the gun that discharges the particles more quickly.
  • FIG. 1 is a sectional view showing an embodiment of a joining apparatus according to the present invention.
  • FIG. 2 is a cross-sectional view showing a bonding apparatus when maintaining the ion gun.
  • FIG. 3 is a flowchart showing an embodiment of a joining apparatus maintenance method according to the present invention.
  • FIG. 4 is a cross-sectional view showing another embodiment of the bonding apparatus according to the present invention.
  • FIG. 5 is a cross-sectional view showing a drawing mechanism when performing normal temperature bonding.
  • FIG. 6 is a cross-sectional view showing a drawing mechanism when maintaining the ion gun.
  • FIG. 7 is a flowchart showing another embodiment of the joining apparatus maintenance method according to the present invention.
  • FIG. 8 is a sectional view showing still another embodiment of the bonding apparatus according to the present invention.
  • the bonding apparatus 1 includes a bonding chamber 2, a gate valve 3, a purge valve 5, a vacuum pump 6, an ion gun 7, and a hollow cathode 8.
  • the bonding chamber 2 is a container that isolates the interior from the environment.
  • the bonding chamber 2 includes an upper stage, a lower stage, and a pressure contact mechanism that are not shown.
  • the lower stage and the lower stage are respectively disposed inside the bonding chamber 2 and hold the substrate.
  • the pressure contact mechanism drives the lower stage and the lower stage so that the substrate held by the upper stage and the substrate held by the lower stage are pressed.
  • the gate valve 3 is interposed between the bonding chamber 2 and a load lock chamber (not shown), and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the load lock chamber.
  • the load lock chamber includes a lid, a vacuum pump, and a transfer device not shown.
  • the lid closes or opens the gate connecting the outside and the inside of the load lock chamber.
  • the vacuum pump exhausts gas from the inside of the load lock chamber, and generates a vacuum atmosphere inside the load lock chamber. As the vacuum atmosphere, an atmosphere of 1 ⁇ 10 -5 Pa is illustrated.
  • the transfer device is disposed inside the load lock chamber.
  • the transfer device transfers the substrate disposed inside the load lock chamber via the gate valve 3 to the inside of the bonding chamber 2 so that the substrate is held on the upper stage or the lower stage.
  • the transfer device transfers the substrate held on the upper stage or the lower stage through the gate valve 3 into the load lock chamber.
  • the purge valve 5 is arranged in the middle of a flow path connecting a gas supply source for storing nitrogen gas to the bonding chamber 2, and opens and closes the flow path.
  • the purge valve 5 supplies nitrogen gas from the gas supply source to the bonding chamber 2 by opening the flow path.
  • the purge valve 5 can also be disposed in the middle of a flow path that connects the environment in which the bonding apparatus 1 is disposed to the inside of the bonding chamber 2. At this time, the purge valve 5 supplies the atmosphere to the bonding chamber 2 by opening the flow path.
  • the vacuum pump 6 exhausts gas from the inside of the bonding chamber 2 and generates a vacuum atmosphere inside the bonding chamber 2.
  • the hollow cathode 8 accelerates and emits electrons using electric power supplied from the outside.
  • the ion gun 7 generates argon ions by using argon gas supplied from the outside and electrons emitted from the hollow cathode 8, and accelerates the argon ions to emit an argon ion beam.
  • Such an argon ion beam has a predetermined divergence angle.
  • the ion gun 7 is sufficiently close to the upper stage and the lower stage so that both the substrate supported by the upper stage and the substrate supported by the lower stage are simultaneously irradiated with the argon ion beam. Placed in position.
  • the joining chamber 2 includes a drawing mechanism 11 and a drawing mechanism 12.
  • the drawer mechanism 11 includes a drawer mechanism chamber 14, a gate valve 15, an intake valve 16, an exhaust valve 17, and a pressure gauge 18.
  • the drawer mechanism chamber 14 is a container that isolates the interior from the environment.
  • the gate valve 15 is interposed between the bonding chamber 2 and the drawing mechanism chamber 14, and closes or opens a gate that connects the inside of the bonding chamber 2 and the drawing mechanism chamber 14.
  • the intake valve 16 is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 14, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 14.
  • the exhaust valve 17 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 14, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 14.
  • the pressure gauge 18 measures the pressure inside the drawer mechanism chamber 14.
  • the drawer mechanism chamber 14 includes a fixed portion 21, a movable portion 22, and a bellows 23.
  • the fixed portion 21 forms a part of the partition wall of the drawer mechanism chamber 14 and is fixed to the gate valve 15.
  • the movable portion 22 forms a part of the partition wall of the drawer mechanism chamber 14 and is supported so as to be movable in parallel with the fixed portion 21.
  • the movable part 22 further supports the ion gun 7.
  • the bellows 23 forms a part of the partition wall of the drawer mechanism chamber 14 and is joined to the fixed portion 21 and the movable portion 22.
  • the bellows 23 isolates the inside of the drawer mechanism chamber 14 from the environment by being deformed when the movable part 22 is translated.
  • the drawer mechanism 11 further includes a stopper 24.
  • the stopper 24 is fixed to the bonding chamber 2 to form a collision surface.
  • the stopper 24 collides with the movable portion 22 so that the ion gun 7 is moved into the bonding chamber 2 by the atmospheric pressure.
  • the movement range of the movable part 22 is limited so as not to further translate in the internal direction. That is, the stopper 24 fixes the movable portion 22 so that the ion gun 7 is disposed at a predetermined position when the gate valve 15 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure.
  • the drawer mechanism 12 includes a drawer mechanism chamber 31, a gate valve 32, an intake valve 33, an exhaust valve 34, and a pressure gauge 35.
  • the drawer mechanism chamber 31 is a container that isolates the interior from the environment.
  • the gate valve 32 is interposed between the bonding chamber 2 and the drawing mechanism chamber 31, and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 31.
  • the intake valve 33 is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 31, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 31.
  • the exhaust valve 34 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 31, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 31.
  • the pressure gauge 35 measures the pressure inside the drawer mechanism chamber 31.
  • the drawer mechanism chamber 31 includes a fixed portion 36, a movable portion 37, and a bellows 38.
  • the fixed portion 36 forms a part of the partition wall of the drawer mechanism chamber 31 and is fixed to the gate valve 32.
  • the movable portion 37 forms a part of the partition wall of the drawer mechanism chamber 31 and is supported so as to be movable in parallel with the fixed portion 36.
  • the movable part 37 further supports the hollow cathode 8.
  • the bellows 38 forms a part of the partition wall of the drawer mechanism chamber 31 and is joined to the fixed portion 36 and the movable portion 37. The bellows 38 is deformed when the movable portion 37 is translated, thereby isolating the inside of the drawer mechanism chamber 31 from the environment.
  • the drawer mechanism 12 is provided with a stopper (not shown) in the same manner as the drawer mechanism 11.
  • the stopper is fixed to the bonding chamber 2 to form a collision surface.
  • the stopper is such that when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure, the collision surface collides with the movable portion 22 and the hollow cathode 8 is bonded to the bonding chamber 2 by the atmospheric pressure.
  • the moving range of the movable part 37 is limited so as not to further translate in the direction inside the. That is, the stopper fixes the movable portion 37 so that the hollow cathode 8 is disposed at a predetermined position when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure. .
  • the movable part 22 of the drawer mechanism 11 can be moved so that the entire ion gun 7 is arranged inside the drawer mechanism chamber 14 as shown in FIG.
  • the gate valve 15 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 14 are isolated. That is, when the ion gun 7 is moved from the bonding chamber 2 to the extraction mechanism chamber 14, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 14 without increasing the pressure of the bonding chamber 2. It can be removed from the bonding chamber 2 to the environment.
  • the movable portion 37 of the drawer mechanism 12 can be moved so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31 in the same manner as the movable portion 22 of the drawer mechanism 11.
  • the gate valve 32 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 31 are isolated. That is, when the hollow cathode 8 is moved from the bonding chamber 2 to the extraction mechanism chamber 31, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 31 without increasing the pressure of the bonding chamber 2. 8 can be removed from the bonding chamber 2 to the environment.
  • the bonding apparatus 1 is operated by a user in the state shown in FIG. 1 and executes a room temperature bonding method for bonding substrates at room temperature. That is, the bonding apparatus 1 bonds the substrates at room temperature with the gate valve 5 opened.
  • the user closes the gate valve 3, generates a vacuum atmosphere of a predetermined pressure inside the bonding chamber 2 using the vacuum pump 6, and generates an atmospheric pressure atmosphere inside the load lock chamber.
  • the user opens the lid of the load lock chamber, and places a plurality of substrates inside the load lock chamber.
  • the user closes the lid of the load lock chamber and creates a vacuum atmosphere inside the load lock chamber using a vacuum pump.
  • the user After opening the gate valve 3, the user uses the transfer device to place one of the substrates arranged inside the load lock chamber on the upper stage inside the bonding chamber 2, and then inside the load lock chamber. The other one of the substrates placed on is placed on the lower stage. The user closes the gate valve 3 and generates a vacuum atmosphere inside the bonding chamber 2 using the vacuum pump 6.
  • the user can place the substrate mounted on the upper stage and the substrate mounted on the lower stage between the substrate mounted on the upper stage and the substrate mounted on the lower stage while the substrate mounted on the upper stage is separated from the substrate mounted on the lower stage.
  • the ion gun 7 is directed to release the particles.
  • the particles irradiate the substrate to remove oxides and the like formed on the surface of the substrate and remove impurities attached to the surface of the substrate.
  • the user operates the pressure contact mechanism of the bonding chamber 2 to bring the substrate mounted on the upper stage into contact with the substrate mounted on the lower stage.
  • the substrate mounted on the upper stage and the substrate mounted on the lower stage are bonded by the contact to generate one bonded substrate.
  • the user opens the gate valve 3 after the bonded substrate is generated.
  • the user uses the transfer device to transfer the bonded substrate mounted on the lower stage into the load lock chamber. This series of operations is repeated until all the substrates initially loaded in the load lock chamber are bonded at room temperature.
  • the user closes the gate valve 3 when all the substrates initially loaded in the load lock chamber are bonded at room temperature, and generates an atmospheric pressure atmosphere in the load lock chamber.
  • the user opens the lid of the load lock chamber and takes out the plurality of bonded substrates bonded at room temperature from the load lock chamber.
  • the bonding apparatus 1 can more reliably irradiate the substrate with an argon ion beam, and can more reliably bond the substrates at room temperature.
  • FIG. 3 shows an embodiment of a joining apparatus maintenance method according to the present invention.
  • the bonding apparatus maintenance method is executed after the room temperature bonding method is completed.
  • the user moves the movable portion 22 of the extraction mechanism 11 so that the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S1).
  • the user closes the gate valve 15 after the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S2).
  • the user introduces atmosphere or nitrogen gas into the drawer mechanism chamber 14 to open the drawer mechanism chamber 14 to the atmosphere (step S 3).
  • the user After releasing the drawing mechanism chamber 14 to the atmosphere, the user removes the bellows 23 from the fixed portion 21 of the drawing mechanism chamber 14 and takes out the ion gun 7 from the inside of the drawing mechanism chamber 14 to the environment.
  • the user maintains the removed ion gun 7 (step S4). Examples of the maintenance include exchanging the electrode included in the ion gun 7 with another electrode and exchanging the orifice of the gas distributor included in the ion gun 7 with another orifice.
  • the user fixes the maintained ion gun 7 to the movable part 22 of the drawer mechanism chamber 14 and attaches the bellows 23 to the fixed part 21.
  • the user evacuates the inside of the drawer mechanism chamber 14 and generates a vacuum atmosphere inside the drawer mechanism chamber 14 (step S5).
  • the user moves the ion gun 7 to the bonding chamber 2 by opening the gate valve 15 and moving the movable part 22 of the drawing mechanism 11.
  • the user further fixes the movable portion 22 to the fixed portion 21 using the stopper 24 so that the ion gun 7 is disposed at a predetermined position in the bonding chamber 2 (step S6).
  • the hollow cathode 8 is maintained in the same manner as the ion gun 7. That is, after the room temperature bonding method is completed, the user first moves the movable portion 37 of the drawer mechanism 12 so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. The user closes the gate valve 32 after the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. After closing the gate valve 32, the user introduces atmosphere or nitrogen gas into the inside of the drawer mechanism chamber 31 to open the drawer mechanism chamber 31 to the atmosphere. After releasing the drawer mechanism chamber 31 to the atmosphere, the user removes the bellows 38 from the fixed portion 36 of the drawer mechanism chamber 31 and takes out the hollow cathode 8 from the inside of the drawer mechanism chamber 31 to the environment. The user maintains the removed hollow cathode 8. The maintenance is exemplified by replacing the electrode provided in the hollow cathode 8 with another electrode.
  • the user fixes the maintained hollow cathode 8 to the movable part 37 of the drawer mechanism chamber 31 and attaches the bellows 38 to the fixed part 36.
  • the user evacuates the inside of the drawer mechanism chamber 31 and generates a vacuum atmosphere inside the drawer mechanism chamber 31.
  • the user moves the hollow cathode 8 to the bonding chamber 2 by opening the gate valve 32 and moving the movable part 37 of the drawing mechanism 12.
  • the user further fixes the movable portion 37 to the fixed portion 36 using a stopper (not shown) so that the hollow cathode 8 is disposed at a predetermined position in the bonding chamber 2.
  • the bonding chamber 2 needs to be evacuated for a long time (for example, 1 week to 2 weeks) when a vacuum atmosphere is generated again after being opened to the atmosphere because moisture and oil adhere to the inner wall when opened to the atmosphere.
  • the bonding apparatus 1 can reduce downtime when maintaining the ion gun 7 or the hollow cathode 8 without increasing the pressure inside the bonding chamber 2.
  • the hollow cathode 8 can be maintained more quickly.
  • the drawer mechanism 11 of the joining apparatus 1 in the above-described embodiment is replaced with another drawer mechanism.
  • the drawing mechanism 41 includes a main body portion 42 and a joining device maintenance jig 43.
  • the main body portion 42 includes a flange 45, a lid 46, an ion gun connector 47, and a hollow cathode connector 48.
  • the flange 45 is joined to the opening formed in the joining chamber 2 to form a seal surface.
  • the lid 46 is formed in a plate shape and has a sealing surface. The inside of the bonding chamber 2 is isolated from the environment when the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45.
  • the lid 46 is further fixed to the ion gun 7 and the hollow cathode 8.
  • the ion gun connector 47 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment.
  • the hollow cathode connector 48 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .
  • the joining device maintenance jig 43 includes a drawing mechanism chamber 51, a gate valve 52, and a ball screw 53.
  • the drawer mechanism chamber 51 is a container that isolates the interior from the environment.
  • the drawer mechanism chamber 51 includes a fixed portion 55, a movable portion 56, a bellows 57, and a rod 58.
  • the fixed portion 55 forms a part of the partition wall of the drawer mechanism chamber 51 and is fixed to the gate valve 52.
  • the movable portion 56 forms a part of the partition wall of the drawer mechanism chamber 51 and is supported so as to be movable in parallel with the fixed portion 55.
  • the movable portion 56 further supports the ion gun 7.
  • the bellows 57 forms a part of the partition wall of the drawer mechanism chamber 51 and is joined to the fixed portion 55 and the movable portion 56.
  • the bellows 57 is deformed when the movable portion 56 is translated, thereby isolating the inside of the drawer mechanism chamber 51 from the environment.
  • the rod 58 is fixed to the movable part 56 and fixed to the lid 46.
  • the drawer mechanism chamber 51 further includes an opening 54.
  • the opening 54 includes an intake valve, an exhaust valve, and a pressure gauge.
  • the intake valve is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 51, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 51.
  • the exhaust valve is arranged in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 51, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 51.
  • the pressure gauge measures the pressure inside the drawer mechanism chamber 51.
  • the gate valve 52 has a sealing surface.
  • the gate valve 52 is fixed to the flange 45 so that its sealing surface is in close contact with the sealing surface of the flange 45.
  • the gate valve 52 is further formed with another sealing surface.
  • the gate valve 52 is fixed to the fixed portion 55 so that the seal surface is in close contact with the seal surface formed on the fixed portion 55. That is, the gate valve 52 is interposed between the bonding chamber 2 and the drawing mechanism chamber 51.
  • the gate valve 52 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 51.
  • the ball screw 53 includes a guide 61, a guide bearing 62, a screw shaft 65, a handle 63, and a nut 64.
  • the guide 61 is formed in a linear rail and is fixed to the fixed portion 55 of the drawer mechanism chamber 51.
  • the guide bearing 62 is fixed to the movable portion 56 of the drawer mechanism chamber 51, and is supported by the guide 61 so as to be able to move in parallel on a straight line.
  • the screw shaft 65 is formed with a male screw and is arranged so as to be parallel to the guide 61, and is supported by the fixed portion 55 of the drawer mechanism chamber 51 so as to be rotatable around the shaft of the male screw.
  • the handle 63 is a portion that is handled by the user and is used when the user rotates the screw shaft 65.
  • the nut 64 is formed with a female screw and is fixed to the movable portion 56 of the drawer mechanism chamber 51.
  • the nut 64 has a female screw fitted to the male screw of the screw shaft 65, and converts the rotation of the screw shaft 65 into a parallel movement of the guide bearing 62. That is, the ball screw 53 translates the movable portion 56 of the drawer mechanism chamber 51 when the handle 63 is rotated by the user.
  • the joining device maintenance jig 43 can be detached from the main body portion 42 from the state shown in FIG. That is, the gate valve 52 can be removed from the flange 45 and the rod 58 can be removed from the lid 46.
  • the main body portion 42 includes a fixing bolt 49 as shown in FIG.
  • the fixing bolt 49 is formed with a male screw and is fitted to a female screw formed on the flange 45, thereby fixing the lid 46 to the joining chamber 2 and isolating the joining chamber 2 from the environment.
  • the bonding apparatus maintenance jig 43 is removed from the main body portion 42, and the room temperature bonding method is executed in the same manner as the bonding apparatus 1 in the above-described embodiment. .
  • Such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.
  • the bonding apparatus maintenance jig 43 is movable in the drawer mechanism chamber 51 so that both the ion gun 7 and the hollow cathode 8 are arranged inside the drawer mechanism chamber 51. Portion 56 can be moved. At this time, the gate valve 52 can be closed and the bonding chamber 2 can be isolated from the drawer mechanism chamber 51.
  • FIG. 7 Another embodiment of the joining apparatus maintenance method according to the present invention is executed using a joining apparatus provided with a drawer mechanism 41.
  • the user first removes the fixing bolt 49 from the joining device in the state shown in FIG. 4 after the room temperature joining method using the joining device is completed (step S11).
  • the sealing surface of the lid 46 is pressed against the sealing surface of the flange 45 by atmospheric pressure, and the inside of the bonding chamber 2 is maintained in a vacuum atmosphere.
  • the user evacuates the inside of the drawing mechanism chamber 51 and generates a vacuum atmosphere inside the drawing mechanism chamber 51 (step S14).
  • the user moves the movable part 56 using the ball screw 53 and arranges the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step) S15).
  • the user closes the gate valve 52 after arranging the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step S16).
  • the user introduces air or nitrogen gas into the inside of the drawer mechanism chamber 51, and opens the drawer mechanism chamber 51 to the atmosphere (step S17).
  • the user After the extraction mechanism chamber 51 is opened to the atmosphere, the user, for example, removes the bellows 57 from the fixed portion 55 and removes the ion gun 7 and the hollow cathode 8 from the lid 46, so that the ion gun 7 enters the environment from the inside of the extraction mechanism chamber 51. And the hollow cathode 8 are taken out.
  • the user maintains the extracted ion gun 7 and hollow cathode 8 (step S18).
  • the electrode provided in the ion gun 7 is replaced with another electrode
  • the orifice of the gas distributor provided in the ion gun 7 is replaced with another orifice
  • the electrode provided in the hollow cathode 8 Exchanging with an electrode is illustrated.
  • the user attaches the maintained ion gun 7 and the hollow cathode 8 to the lid 46, attaches the bellows 57 to the fixed portion 55, and reassembles the drawer mechanism chamber 51.
  • the user evacuates the inside of the drawer mechanism chamber 51 and generates a vacuum atmosphere inside the drawer mechanism chamber 51 (step S19).
  • the user opens the gate valve 52 after the vacuum atmosphere is generated inside the drawer mechanism chamber 51 (step S20).
  • the gate valve 52 is opened, the user moves the movable portion 56 using the ball screw 53 so that the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45 (step S21).
  • the ion gun 7 and the hollow cathode 8 move together with the lid 46 and are arranged at predetermined positions in the bonding chamber 2.
  • the user After the joining chamber 2 is sealed with the lid 46, the user introduces air or nitrogen gas into the drawing mechanism chamber 51 and opens the drawing mechanism chamber 51 to the atmosphere (step S22). After the drawer mechanism chamber 51 is opened to the atmosphere, the user removes the joining device maintenance jig 43 from the main body portion 42 (step S23). That is, the user removes the fixed portion 42 from the gate valve 52, removes the rod 58 from the lid 46, and removes the gate valve 52 from the flange 45.
  • the user fixes the lid 46 to the flange 45 using the fixing bolt 49 after the joining device maintenance jig 43 is removed from the main body portion 42 (step S24).
  • the bonding apparatus can maintain the ion gun 7 or the hollow cathode 8 faster without increasing the pressure inside the bonding chamber 2.
  • the floor area where the bonding apparatus is arranged is further reduced by the amount of the bonding apparatus maintenance jig 43 when the bonding apparatus is executing the room temperature bonding method. be able to.
  • the main body portions of the plurality of bonding apparatuses 1 can be manufactured with respect to one bonding apparatus maintenance jig 43. At this time, the plurality of bonding apparatuses 1 can maintain the ion gun 7 by using one bonding apparatus maintenance jig 43, and the manufacturing cost of the apparatus can be reduced.
  • the drawer mechanism 41 in the above-described embodiment is replaced with another drawer mechanism.
  • the drawing mechanism 71 includes a drawing mechanism chamber 72, a gate valve 73, and a pneumatic cylinder 74, as shown in FIG.
  • the drawer mechanism chamber 72 is a container that isolates the interior from the environment.
  • the drawer mechanism chamber 72 includes a fixed portion 75, a movable portion 76, and a bellows 77.
  • the fixed portion 75 forms a part of the partition wall of the drawer mechanism chamber 72 and is fixed to the gate valve 73.
  • the movable portion 76 forms a part of the partition wall of the drawer mechanism chamber 72 and is supported so as to be movable in parallel with the fixed portion 75.
  • the movable part 76 further supports the ion gun 7.
  • the bellows 77 forms a part of the partition wall of the drawer mechanism chamber 72 and is joined to the fixed portion 75 and the movable portion 76.
  • the bellows 77 is deformed when the movable portion 76 is translated, thereby isolating the inside of the drawer mechanism chamber 72 from the environment.
  • the drawer mechanism chamber 72 further includes an ion gun connector 78 and a hollow cathode connector 79.
  • the ion gun connector 78 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment.
  • the hollow cathode connector 79 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .
  • the drawer mechanism chamber 72 further includes an intake valve, an exhaust valve, and a pressure gauge (not shown).
  • the intake valve is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 72, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 72.
  • the exhaust valve is disposed in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 72, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 72.
  • the pressure gauge measures the pressure inside the drawer mechanism chamber 72.
  • the gate valve 73 is interposed between the bonding chamber 2 and the drawing mechanism chamber 72.
  • the gate valve 73 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 72.
  • the pneumatic cylinder 74 includes a guide 81, a main body portion 82, and a rod 83.
  • the guide 81 is formed as a linear rail and is fixed to a fixed portion 75 of the drawer mechanism chamber 72.
  • the guide 81 supports the movable part 76 of the drawer mechanism chamber 72 on the guide 81 so as to be movable in parallel.
  • the main body portion 82 is fixed to the guide 81 and is fixed to the fixed portion 75 of the drawer mechanism chamber 72.
  • the main body portion 82 drives the rod 83 with respect to the guide 81 using the supplied air pressure.
  • the rod 83 is fixed to the movable part 76 of the drawer mechanism chamber 72. That is, the pneumatic cylinder 74 translates the movable portion 76 of the drawer mechanism chamber 72 by the user.
  • the extraction mechanism 71 can move the movable portion 76 of the extraction mechanism chamber 72 such that both the ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. At this time, the gate valve 73 can be closed, and the bonding chamber 2 can be isolated from the drawer mechanism chamber 72.
  • Such a joining apparatus performs the room temperature joining method in the state of FIG. 8 in the same manner as the joining apparatus 1 in the above-described embodiment. That is, such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.
  • the ion gun 7 and the hollow cathode 8 are maintained in the same manner as the joining apparatus 1 in the above-described embodiment. That is, after the room temperature bonding method is completed, the user first moves the movable portion 76 using the pneumatic cylinder 74 so that the entire ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. Let The user closes the gate valve 73 after the ion gun 7 and the hollow cathode 8 are entirely disposed inside the extraction mechanism chamber 72. After closing the gate valve 73, the user introduces air or nitrogen gas into the inside of the drawing mechanism chamber 72 to open the drawing mechanism chamber 72 to the atmosphere.
  • the user After releasing the drawing mechanism chamber 72 to the atmosphere, the user removes the bellows 77 from the fixed portion 75 of the drawing mechanism chamber 72 and takes out the ion gun 7 and the hollow cathode 8 from the inside of the drawing mechanism chamber 72 to the environment. The user maintains the removed ion gun 7 and hollow cathode 8.
  • the user fixes the maintained ion gun 7 and the hollow cathode 8 to the movable part 76 of the drawer mechanism chamber 72 and attaches the bellows 77 to the fixed part 75.
  • the user evacuates the inside of the drawing mechanism chamber 72 and generates a vacuum atmosphere inside the drawing mechanism chamber 72.
  • the user opens the gate valve 73 and moves the movable portion 76 of the drawing mechanism 71 using the pneumatic cylinder 74 to move the ion gun 7 and the hollow cathode 8 to the bonding chamber 2.
  • the user further fixes the movable portion 76 to the fixed portion 75 so that the ion gun 7 and the hollow cathode 8 are arranged at predetermined positions in the bonding chamber 2.
  • the bonding apparatus provided with the drawer mechanism 71 can be connected to the ion gun 7 without increasing the pressure in the bonding chamber 2 in the same manner as the bonding apparatus 1 in the above-described embodiment.
  • the hollow cathode 8 can be maintained more quickly.
  • the extraction mechanism chamber may include a hatch through which the ion gun 7 and the hollow cathode 8 can pass. At this time, the extraction mechanism chamber does not need to be disassembled when the ion gun 7 and the hollow cathode 8 are extracted from the extraction mechanism chamber, and the ion gun 7 and the hollow cathode 8 can be extracted more easily.
  • the bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can maintain the gun that discharges the particles more quickly.
  • the bonding apparatus maintenance method according to the present invention the bonding apparatus that can irradiate the irradiation target more reliably with the particles can maintain the gun that discharges the particles more quickly.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A bonding device comprises a gun for discharging particles, a vacuum chamber in which an atmosphere for discharging the particles is created, a draw-out mechanism chamber, and a gate valve for opening/closing between the vacuum chamber and the draw-out mechanism chamber. The gun is supported such that it can move through the gate valve. Such a bonding device can move the gun from the interior of the draw-out mechanism chamber to the vicinity of an irradiation object arranged in the vacuum chamber through the gate valve and can irradiate the object with the particles more surely. Such a bonding device can take out the gun to the outside of the vacuum chamber without boosting the pressure in the vacuum chamber by closing the gate valve after moving the gun into the draw-out mechanism chamber.

Description

接合装置および接合装置メンテナンス方法Bonding apparatus and bonding apparatus maintenance method
　本発明は、接合装置および接合装置メンテナンス方法に関し、特に、真空チャンバの内部に粒子を放出する接合装置およびその接合装置をメンテナンスする接合装置メンテナンス方法に関する。 The present invention relates to a bonding apparatus and a bonding apparatus maintenance method, and more particularly, to a bonding apparatus that discharges particles into a vacuum chamber and a bonding apparatus maintenance method that maintains the bonding apparatus.
　微細な電気部品や機械部品を集積化したＭＥＭＳ（Ｍｉｃｒｏ　Ｅｌｅｃｔｒｏ　Ｍｅｃｈａｎｉｃａｌ　Ｓｙｓｔｅｍｓ）が知られている。そのＭＥＭＳとしては、マイクロマシン、圧力センサ、超小型モーターなどが例示される。このようなＭＥＭＳを常温接合により作製する常温接合装置が知られている。その常温接合装置は、真空チャンバーとイオンガンとを備え、真空チャンバー内でイオンビームが照射された基板を接合することにより、そのＭＥＭＳを作製する。このような常温接合装置は、照射対象に粒子をより確実に照射することができ、かつ、真空チャンバの内部を昇圧させることなく、ガンをより速くメンテナンスすることが望まれている。 MEMS (Micro Electro Mechanical Systems) in which fine electrical parts and mechanical parts are integrated is known. Examples of the MEMS include a micromachine, a pressure sensor, and a micro motor. There is known a room temperature bonding apparatus for manufacturing such MEMS by room temperature bonding. The room-temperature bonding apparatus includes a vacuum chamber and an ion gun. The MEMS is manufactured by bonding a substrate irradiated with an ion beam in the vacuum chamber. Such a room temperature bonding apparatus is desired to more reliably irradiate the irradiation target with particles and to maintain the gun faster without increasing the pressure inside the vacuum chamber.
　特開昭６１－２７２３７５号公報には、真空容器をサンプル交換等のために開いてもイオン源を大気にさらすことによる耐電圧性能の劣化を起こせず、構造が簡単で、信頼性の高い薄膜形成装置が開示されている。その薄膜形成装置は、イオン源と、真空容器とからなる薄膜形成装置において、前記イオン源と前記真空容器の間に、パッキンをイオン源側にそしてシートを真空容器側にした構造のゲート・バルブを設けたことを特徴としている。 Japanese Patent Application Laid-Open No. 61-272375 discloses a thin film having a simple structure and high reliability without causing deterioration of withstand voltage performance due to exposure of the ion source to the atmosphere even when the vacuum vessel is opened for sample exchange or the like. A forming apparatus is disclosed. The thin film forming apparatus is a thin film forming apparatus comprising an ion source and a vacuum vessel, and a gate valve having a structure between the ion source and the vacuum vessel, with a packing on the ion source side and a sheet on the vacuum vessel side. It is characterized by providing.
　特公平０７－０７２３４０号公報には、信頼性が高く、長寿命で安定した成膜が可能な真空蒸着装置が開示されている。その真空蒸着装置は、排気可能な内部空間、該内部空間内に配置された荷電粒子ビーム発生源、及び荷電粒子ビームを放射する放射孔を有する荷電粒子ビーム供給手段と、前記荷電粒子ビーム供給手段より放射する荷電粒子ビームを導入する開孔部を有し、前記荷電粒子ビーム供給手段の内部空間と独立に排気可能な内部空間を有する真空容器と、前記真空容器の内部空間内に配置され、前記荷電粒子ビーム発生源に対し所定の電位差を与えることにより前記荷電粒子ビームが衝突する蒸発源と、前記蒸発源からの蒸発成分が付着するように配置された試料保持手段と、前記開孔部と前記放射孔とを気密を保って連接する開閉可能なバルブ手段であって、前記バルブ手段を開状態とするときには前記真空容器の内部空間と前記荷電粒子ビーム供給手段の内部空間とを連通させ、閉状態とするときには前記真空容器の内部空間と前記荷電粒子ビーム供給手段の内部空間とを遮断分離し、遮断分離した状態では、前記真空容器の内部空間の真空状態を保持したまま前記荷電粒子ビーム供給手段を前記バルブ手段から取り外すことができる前記バルブ手段とを有している。 Japanese Patent Publication No. 07-072340 discloses a vacuum deposition apparatus with high reliability, long life and stable film formation. The vacuum deposition apparatus includes an internal space that can be evacuated, a charged particle beam generation source disposed in the internal space, a charged particle beam supply unit having a radiation hole that emits a charged particle beam, and the charged particle beam supply unit. A vacuum vessel having an opening for introducing a charged particle beam that radiates more and having an internal space that can be evacuated independently of the internal space of the charged particle beam supply means; and disposed in the internal space of the vacuum vessel, An evaporation source with which the charged particle beam collides by giving a predetermined potential difference to the charged particle beam generation source; a sample holding means arranged so that an evaporation component from the evaporation source adheres; and the aperture portion Openable and closable valve means for connecting the radiation hole and the radiation hole, the internal space of the vacuum vessel and the charged particle beam when the valve means is opened. When the internal space of the supply means is communicated and closed, the internal space of the vacuum vessel is separated from the internal space of the charged particle beam supply means, and in the closed state, the internal space of the vacuum vessel is The charged particle beam supply means can be removed from the valve means while maintaining a vacuum state.
　本発明の課題は、照射対象に粒子をより確実に照射することができ、かつ、より速くメンテナンスすることができる接合装置を提供することにある。
　本発明の他の課題は、照射対象に粒子をより確実に照射することができる接合装置をより速くメンテナンスすることができ接合装置メンテナンス方法を提供することにある。 The subject of this invention is providing the joining apparatus which can irradiate particle | grains to irradiation object more reliably, and can maintain more quickly.
Another object of the present invention is to provide a joining apparatus maintenance method that can maintain a joining apparatus that can irradiate particles to an irradiation object more reliably and more quickly.
　本発明による接合装置は、粒子を放出するガンと、その粒子が放出される雰囲気が内部に生成される真空チャンバと、引出し機構チャンバと、その真空チャンバとその引出し機構チャンバとの間を開閉するゲートバルブとを備えている。そのガンは、そのゲートバルブを通って移動可能に支持される。このような接合装置は、そのゲートバルブを通ってその引出し機構チャンバの内部から真空チャンバの内部に配置される照射対象の近傍にガンを移動させることができる。このような接合装置は、ガンをその引出し機構チャンバの内部に移動させた後に、そのゲートバルブを閉鎖することにより、その真空チャンバの内部を昇圧させることなく、ガンを真空チャンバの外部に取り出すことができる。このため、接合装置は、照射対象に粒子をより確実に照射することができ、かつ、真空チャンバの内部を昇圧させることなく、ガンをより速くメンテナンスすることができる。 The bonding apparatus according to the present invention opens and closes a gun that discharges particles, a vacuum chamber in which an atmosphere in which the particles are discharged is generated, a drawer mechanism chamber, and the vacuum chamber and the drawer mechanism chamber And a gate valve. The gun is movably supported through the gate valve. Such a bonding apparatus can move the gun through the gate valve from the inside of the drawer mechanism chamber to the vicinity of the irradiation target disposed inside the vacuum chamber. Such a joining apparatus moves the gun to the inside of the drawer mechanism chamber, and then closes the gate valve to take out the gun to the outside of the vacuum chamber without increasing the pressure inside the vacuum chamber. Can do. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
　本発明による接合装置は、そのガンがその真空チャンバーの内部に配置されているときにその真空チャンバーを密封する蓋をさらに備えている。そのガンは、その蓋に固定されている。このような接合装置は、そのガンがその真空チャンバーの内部に配置されているときに、蓋によりその真空チャンバーを密封することにより、その真空チャンバの内部を昇圧させることなく、引出し機構チャンバの内部を昇圧させることができる。このような接合装置は、さらに、そのガンがその真空チャンバーの内部に配置されているときに、その真空チャンバの内部を昇圧させることなく、その真空チャンバーからゲートバルブを取り外すことができ、または、そのゲートバルブからその引出し機構チャンバを取り外すことができる。 The bonding apparatus according to the present invention further includes a lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber. The gun is secured to the lid. Such a bonding apparatus is configured such that when the gun is disposed inside the vacuum chamber, the vacuum chamber is sealed with a lid so that the pressure inside the vacuum chamber is not increased. Can be boosted. Such a bonding device can further remove the gate valve from the vacuum chamber without boosting the interior of the vacuum chamber when the gun is placed inside the vacuum chamber, or The drawer mechanism chamber can be removed from the gate valve.
　本発明による接合装置は、その真空チャンバの内部に生成される雰囲気に粒子を放出する他のガンと、他の引出し機構チャンバと、その真空チャンバとその他の引出し機構チャンバとの間を開閉する他のゲートバルブとをさらに備えている。その他のガンは、その他の引出し機構チャンバの内部に配置されるように、その他のゲートバルブを通って移動可能に支持される。すなわち、接合装置は、移動可能である複数のガンがそれぞれ配置される複数の引出し機構チャンバと、真空チャンバとその複数の引出し機構チャンバとの間をそれぞれ開閉する複数のゲートバルブとを備えている。このような接合装置によれば、その複数のガンは、その複数の引出し機構チャンバの内部にそれぞれ移動した後に、複数のゲートバルブを閉鎖することにより、その真空チャンバの内部を昇圧させることなく、より速くメンテナンスされることができる。 The bonding apparatus according to the present invention includes another gun that discharges particles to the atmosphere generated in the vacuum chamber, the other drawing mechanism chamber, and the other that opens and closes between the vacuum chamber and the other drawing mechanism chamber. And a gate valve. Other guns are movably supported through other gate valves for placement within other drawer mechanism chambers. That is, the bonding apparatus includes a plurality of drawer mechanism chambers in which a plurality of movable guns are respectively disposed, and a plurality of gate valves that open and close between the vacuum chamber and the plurality of drawer mechanism chambers. . According to such a bonding apparatus, the plurality of guns move to the inside of the plurality of drawing mechanism chambers, respectively, and then close the plurality of gate valves, thereby increasing the pressure inside the vacuum chamber. It can be maintained faster.
　本発明による接合装置は、その真空チャンバの内部に生成される雰囲気に粒子を放出する他のガンをさらに備えている。その他のガンは、その引出し機構チャンバの内部に配置されるように、そのゲートバルブを通って移動可能に支持される。すなわち、接合装置は、１つの引出し機構チャンバに配置され得る複数のガンを備えている。このような接合装置によれば、その複数のガンは、その引出し機構チャンバの内部にそれぞれ移動した後に、ゲートバルブを閉鎖することにより、その真空チャンバの内部を昇圧させることなく、より速くメンテナンスされることができる。 The bonding apparatus according to the present invention further includes another gun that discharges particles to the atmosphere generated inside the vacuum chamber. Other guns are movably supported through the gate valve so as to be placed inside the drawer mechanism chamber. That is, the bonding apparatus includes a plurality of guns that can be disposed in one drawer mechanism chamber. According to such a joining device, the plurality of guns are moved to the inside of the drawing mechanism chamber, and then maintained more quickly without increasing the pressure in the vacuum chamber by closing the gate valve. Can.
　その他のガンは、そのガンにその粒子を供給するホローカソードであることが好ましい。 The other gun is preferably a hollow cathode that supplies the gun with the particles.
　その引出し機構チャンバは、その真空チャンバに固定される固定部分と、その固定部分に対して移動可能である可動部分と、その固定部分とその可動部分との間に配置されるベローズを備えている。そのガンは、その可動部分に固定されていることが好ましい。 The drawer mechanism chamber includes a fixed part fixed to the vacuum chamber, a movable part movable with respect to the fixed part, and a bellows disposed between the fixed part and the movable part. . The gun is preferably fixed to the movable part.
　本発明による接合装置メンテナンス方法は、粒子を放出するガンを真空チャンバから引出し機構チャンバに移動するステップと、そのガンがその引出し機構チャンバの内部に配置されるときに、その真空チャンバとその引出し機構チャンバとの間に配置されるゲートバルブを閉鎖するステップとを備えている。このような接合装置メンテナンス方法によれば、真空チャンバの内部に配置される照射対象の近傍に配置されるガンは、その真空チャンバの内部を昇圧させることなく、真空チャンバの外部に取り出されることができる。このため、このような接合装置メンテナンス方法によれば、真空チャンバの内部を昇圧させることなく、照射対象に粒子をより確実に照射することができるガンをより速くメンテナンスすることができる。 A joining apparatus maintenance method according to the present invention includes a step of moving a gun that emits particles from a vacuum chamber to a drawing mechanism chamber, and the vacuum chamber and the drawing mechanism when the gun is disposed inside the drawing mechanism chamber. Closing a gate valve disposed between the chamber and the chamber. According to such a bonding apparatus maintenance method, the gun arranged in the vicinity of the irradiation object arranged inside the vacuum chamber can be taken out of the vacuum chamber without increasing the pressure inside the vacuum chamber. it can. For this reason, according to such a joining apparatus maintenance method, the gun which can irradiate a particle | grain to irradiation object more reliably can be maintained faster, without raising the inside of a vacuum chamber.
　本発明による接合装置メンテナンス方法は、その真空チャンバを密閉する蓋を介してそのガンがその真空チャンバの内部に支持されているときに、その引出し機構チャンバの内部を減圧してゲートバルブを開放するステップをさらに備えている。そのガンは、その蓋とともにその真空チャンバからその引出し機構チャンバーに移動される。このとき、その引出し機構チャンバーは、その蓋がその真空チャンバを密閉しているときに、その引出し機構チャンバの内部を減圧する必要がなく、好ましい。 In the joining apparatus maintenance method according to the present invention, when the gun is supported inside the vacuum chamber through a lid that seals the vacuum chamber, the inside of the drawer mechanism chamber is decompressed to open the gate valve. The method further includes a step. The gun is moved with the lid from the vacuum chamber to the drawer mechanism chamber. At this time, the drawer mechanism chamber is preferable because it is not necessary to depressurize the inside of the drawer mechanism chamber when the lid seals the vacuum chamber.
　本発明による接合装置メンテナンス方法は、その引出し機構チャンバをそのゲートバルブに取り付けるステップをさらに備えている。すなわち、その引出し機構チャンバーと真空チャンバーとを備えている接合装置は、このステップの前に、その引出し機構チャンバが取り付けられていない。このとき、接合装置が配置される床面積は、その引出し機構チャンバーの分だけ低減されることができる。 The joining apparatus maintenance method according to the present invention further includes a step of attaching the drawer mechanism chamber to the gate valve. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber is not attached before this step. At this time, the floor area on which the joining device is arranged can be reduced by the amount of the drawing mechanism chamber.
　本発明による接合装置メンテナンス方法は、その引出し機構チャンバとそのゲートバルブとをその真空チャンバに取り付けるステップをさらに備えている。すなわち、その引出し機構チャンバーと真空チャンバーとを備えている接合装置は、このステップの前に、その引出し機構チャンバとそのゲートバルブとが取り付けられていない。このとき、接合装置が配置される床面積は、その引出し機構チャンバーとそのゲートバルブとの分だけ、低減されることができる。 The bonding apparatus maintenance method according to the present invention further includes a step of attaching the drawer mechanism chamber and the gate valve to the vacuum chamber. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber and the gate valve are not attached before this step. At this time, the floor area in which the bonding apparatus is disposed can be reduced by the amount of the drawing mechanism chamber and the gate valve.
　本発明による接合装置メンテナンス方法は、そのゲートバルブを開放したまま、そのガンを用いてその粒子を放出するステップをさらに備えていることが好ましい。 The joining apparatus maintenance method according to the present invention preferably further comprises a step of releasing the particles using the gun while the gate valve is opened.
　本発明による接合装置メンテナンス用治具は、粒子を放出するガンと、その粒子が放出される雰囲気が内部に生成される真空チャンバと、そのガンがその真空チャンバの内部に配置されているときにその真空チャンバを密封する蓋とを備えている。そのガンは、その蓋に固定されている接合装置に取り付けられる。本発明による接合装置メンテナンス用治具は、引出し機構チャンバと、その真空チャンバとその引出し機構チャンバとの間を開閉するゲートバルブと、そのゲートバルブを通るように移動可能にそのガンを支持する可動部分とを備えている。このような接合装置は、真空チャンバの内部に配置される照射対象の近傍にガンを配置させることができる。このような接合装置メンテナンス用治具は、接合装置に取り付けられることにより、ガンをその引出し機構チャンバの内部に移動させた後に、そのゲートバルブを閉鎖することにより、その真空チャンバの内部を昇圧させることなく、ガンを真空チャンバの外部に取り出すことができる。このため、接合装置は、照射対象に粒子をより確実に照射することができ、かつ、真空チャンバの内部を昇圧させることなく、ガンをより速くメンテナンスすることができる。 The joining device maintenance jig according to the present invention includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber. And a lid for sealing the vacuum chamber. The gun is attached to a joining device fixed to the lid. A joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber, a gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber, and a movable that supports the gun so as to be movable through the gate valve. And a part. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber. Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber. The gun can be taken out of the vacuum chamber without any trouble. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
　本発明による接合装置メンテナンス用治具は、粒子を放出するガンと、その粒子が放出される雰囲気が内部に生成される真空チャンバと、そのガンがその真空チャンバの内部に配置されているときにその真空チャンバを密封する蓋と、ゲートバルブとを備えている。そのガンは、その蓋に固定されている接合装置に取り付けられる。本発明による接合装置メンテナンス用治具は、引出し機構チャンバと、そのゲートバルブを通るように移動可能にそのガンを支持する可動部分とを備えている。そのゲートバルブは、その真空チャンバとその引出し機構チャンバとの間を開閉する。このような接合装置は、真空チャンバの内部に配置される照射対象の近傍にガンを配置させることができる。このような接合装置メンテナンス用治具は、接合装置に取り付けられることにより、ガンをその引出し機構チャンバの内部に移動させた後に、そのゲートバルブを閉鎖することにより、その真空チャンバの内部を昇圧させることなく、ガンを真空チャンバの外部に取り出すことができる。このため、接合装置は、照射対象に粒子をより確実に照射することができ、かつ、真空チャンバの内部を昇圧させることなく、ガンをより速くメンテナンスすることができる。 The joining device maintenance jig according to the present invention includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber. A lid for sealing the vacuum chamber and a gate valve are provided. The gun is attached to a joining device fixed to the lid. A joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber and a movable part that supports the gun so as to be movable through the gate valve. The gate valve opens and closes between the vacuum chamber and the drawer mechanism chamber. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber. Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber. The gun can be taken out of the vacuum chamber without any trouble. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.
　本発明による接合装置は、照射対象に粒子をより確実に照射することができ、かつ、その粒子を放出するガンをより速くメンテナンスすることができる。
　本発明による接合装置メンテナンス方法によれば、照射対象に粒子をより確実に照射することができる接合装置は、その粒子を放出するガンをより速くメンテナンスすることができる。 The bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can maintain the gun that discharges the particles more quickly.
According to the bonding apparatus maintenance method according to the present invention, the bonding apparatus that can irradiate the irradiation target more reliably with the particles can maintain the gun that discharges the particles more quickly.
図１は、本発明による接合装置の実施の形態を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a joining apparatus according to the present invention. 図２は、イオンガンをメンテナンスするときの接合装置を示す断面図である。FIG. 2 is a cross-sectional view showing a bonding apparatus when maintaining the ion gun. 図３は、本発明による接合装置メンテナンス方法の実施の形態を示すフローチャートである。FIG. 3 is a flowchart showing an embodiment of a joining apparatus maintenance method according to the present invention. 図４は、本発明による接合装置の実施の他の形態を示す断面図である。FIG. 4 is a cross-sectional view showing another embodiment of the bonding apparatus according to the present invention. 図５は、常温接合するときの引出し機構を示す断面図である。FIG. 5 is a cross-sectional view showing a drawing mechanism when performing normal temperature bonding. 図６は、イオンガンをメンテナンスするときの引出し機構を示す断面図である。FIG. 6 is a cross-sectional view showing a drawing mechanism when maintaining the ion gun. 図７は、本発明による接合装置メンテナンス方法の実施の他の形態を示すフローチャートである。FIG. 7 is a flowchart showing another embodiment of the joining apparatus maintenance method according to the present invention. 図８は、本発明による接合装置の実施のさらに他の形態を示す断面図である。FIG. 8 is a sectional view showing still another embodiment of the bonding apparatus according to the present invention.
　図面を参照して、本発明による接合装置の実施の形態を記載する。その接合装置１は、図１に示されているように、接合チャンバー２とゲートバルブ３とパージ用バルブ５と真空ポンプ６とイオンガン７とホローカソード８とを備えている。接合チャンバー２は、内部を環境から隔離する容器である。接合チャンバー２は、図示されていない上側ステージと下側ステージと圧接機構とを備えている。その下側ステージと下側ステージとは、それぞれ、接合チャンバー２の内部に配置され、基板を保持する。その圧接機構は、その上側ステージにより保持される基板とその下側ステージにより保持される基板とが圧接されるように、その下側ステージと下側ステージとを駆動する。 Embodiments of a joining apparatus according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the bonding apparatus 1 includes a bonding chamber 2, a gate valve 3, a purge valve 5, a vacuum pump 6, an ion gun 7, and a hollow cathode 8. The bonding chamber 2 is a container that isolates the interior from the environment. The bonding chamber 2 includes an upper stage, a lower stage, and a pressure contact mechanism that are not shown. The lower stage and the lower stage are respectively disposed inside the bonding chamber 2 and hold the substrate. The pressure contact mechanism drives the lower stage and the lower stage so that the substrate held by the upper stage and the substrate held by the lower stage are pressed.
　ゲートバルブ３は、接合チャンバー２と図示されていないロードロックチャンバーとの間に介設され、接合チャンバー２の内部とそのロードロックチャンバーの内部とを接続するゲートを閉鎖し、または、開放する。そのロードロックチャンバーは、図示されていない蓋と真空ポンプと搬送装置とを備えている。その蓋は、そのロードロックチャンバーの外部と内部とを接続するゲートを閉鎖し、または、開放する。その真空ポンプは、そのロードロックチャンバーの内部から気体を排気し、そのロードロックチャンバーの内部に真空雰囲気を生成する。その真空雰囲気としては、１×１０－５Ｐａの雰囲気が例示される。その搬送装置は、そのロードロックチャンバーの内部に配置されている。その搬送装置は、その上側ステージまたは下側ステージに基板が保持されるように、ゲートバルブ３を介してそのロードロックチャンバーの内部に配置された基板を接合チャンバー２の内部に搬送する。その搬送装置は、ゲートバルブ３を介して、その上側ステージまたは下側ステージに保持される基板をそのロードロックチャンバーの内部に搬送する。 The gate valve 3 is interposed between the bonding chamber 2 and a load lock chamber (not shown), and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the load lock chamber. The load lock chamber includes a lid, a vacuum pump, and a transfer device not shown. The lid closes or opens the gate connecting the outside and the inside of the load lock chamber. The vacuum pump exhausts gas from the inside of the load lock chamber, and generates a vacuum atmosphere inside the load lock chamber. As the vacuum atmosphere, an atmosphere of 1 × 10 -5 Pa is illustrated. The transfer device is disposed inside the load lock chamber. The transfer device transfers the substrate disposed inside the load lock chamber via the gate valve 3 to the inside of the bonding chamber 2 so that the substrate is held on the upper stage or the lower stage. The transfer device transfers the substrate held on the upper stage or the lower stage through the gate valve 3 into the load lock chamber.
　パージ用バルブ５は、窒素ガスを貯蔵するガス供給源を接合チャンバー２に接続する流路の途中に配置され、その流路を開閉する。パージ用バルブ５は、その流路を開放することにより窒素ガスをガス供給源から接合チャンバー２に供給する。なお、パージ用バルブ５は、接合装置１が配置される環境を接合チャンバー２の内部に接続する流路の途中に配置されることもできる。このとき、パージ用バルブ５は、その流路を開放することにより大気を接合チャンバー２に供給する。真空ポンプ６は、接合チャンバー２の内部から気体を排気して、接合チャンバー２の内部に真空雰囲気を生成する。 The purge valve 5 is arranged in the middle of a flow path connecting a gas supply source for storing nitrogen gas to the bonding chamber 2, and opens and closes the flow path. The purge valve 5 supplies nitrogen gas from the gas supply source to the bonding chamber 2 by opening the flow path. The purge valve 5 can also be disposed in the middle of a flow path that connects the environment in which the bonding apparatus 1 is disposed to the inside of the bonding chamber 2. At this time, the purge valve 5 supplies the atmosphere to the bonding chamber 2 by opening the flow path. The vacuum pump 6 exhausts gas from the inside of the bonding chamber 2 and generates a vacuum atmosphere inside the bonding chamber 2.
　ホローカソード８は、外部から供給される電力を用いて、電子を加速して放出する。イオンガン７は、外部から供給されるアルゴンガスとホローカソード８により放出される電子とを用いて、アルゴンイオンを生成し、そのアルゴンイオンを加速してアルゴンイオンビーム放出する。このようなアルゴンイオンビームは、所定の広がり角を有している。イオンガン７は、その上側ステージに支持される基板とその下側ステージに支持される基板との両方にそのアルゴンイオンビームが同時に照射されるように、その上側ステージと下側ステージとに十分に近い位置に配置されている。 The hollow cathode 8 accelerates and emits electrons using electric power supplied from the outside. The ion gun 7 generates argon ions by using argon gas supplied from the outside and electrons emitted from the hollow cathode 8, and accelerates the argon ions to emit an argon ion beam. Such an argon ion beam has a predetermined divergence angle. The ion gun 7 is sufficiently close to the upper stage and the lower stage so that both the substrate supported by the upper stage and the substrate supported by the lower stage are simultaneously irradiated with the argon ion beam. Placed in position.
　接合チャンバー２は、引出し機構１１と引出し機構１２とを備えている。引出し機構１１は、引出し機構チャンバ１４とゲートバルブ１５と吸気弁１６と排気弁１７と圧力ゲージ１８とを備えている。引出し機構チャンバ１４は、内部を環境から隔離する容器である。ゲートバルブ１５は、接合チャンバ２と引出し機構チャンバ１４との間に介設され、接合チャンバー２の内部と引出し機構チャンバ１４の内部とを接続するゲートを閉鎖し、または、開放する。吸気弁１６は、環境を引出し機構チャンバ１４に接続する流路の途中に配置され、その流路の開度が変更されて大気を引出し機構チャンバ１４に供給する。排気弁１７は、図示されていない真空ポンプを引出し機構チャンバ１４に接続する流路の途中に配置され、その流路の開度が変更されて引出し機構チャンバ１４の内部に真空雰囲気を生成する。圧力ゲージ１８は、引出し機構チャンバ１４の内部の圧力を測定する。 The joining chamber 2 includes a drawing mechanism 11 and a drawing mechanism 12. The drawer mechanism 11 includes a drawer mechanism chamber 14, a gate valve 15, an intake valve 16, an exhaust valve 17, and a pressure gauge 18. The drawer mechanism chamber 14 is a container that isolates the interior from the environment. The gate valve 15 is interposed between the bonding chamber 2 and the drawing mechanism chamber 14, and closes or opens a gate that connects the inside of the bonding chamber 2 and the drawing mechanism chamber 14. The intake valve 16 is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 14, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 14. The exhaust valve 17 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 14, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 14. The pressure gauge 18 measures the pressure inside the drawer mechanism chamber 14.
　引出し機構チャンバ１４は、固定部分２１と可動部分２２とベローズ２３とを備えている。固定部分２１は、引出し機構チャンバ１４の隔壁の一部を形成し、ゲートバルブ１５に固定されている。可動部分２２は、引出し機構チャンバ１４の隔壁の一部を形成し、固定部分２１に対して平行移動可能に支持されている。可動部分２２は、さらに、イオンガン７を支持している。ベローズ２３は、引出し機構チャンバ１４の隔壁の一部を形成し、固定部分２１と可動部分２２とに接合されている。ベローズ２３は、可動部分２２が平行移動したときに、変形することにより引出し機構チャンバ１４の内部を環境から隔離する。 The drawer mechanism chamber 14 includes a fixed portion 21, a movable portion 22, and a bellows 23. The fixed portion 21 forms a part of the partition wall of the drawer mechanism chamber 14 and is fixed to the gate valve 15. The movable portion 22 forms a part of the partition wall of the drawer mechanism chamber 14 and is supported so as to be movable in parallel with the fixed portion 21. The movable part 22 further supports the ion gun 7. The bellows 23 forms a part of the partition wall of the drawer mechanism chamber 14 and is joined to the fixed portion 21 and the movable portion 22. The bellows 23 isolates the inside of the drawer mechanism chamber 14 from the environment by being deformed when the movable part 22 is translated.
　引出し機構１１は、さらに、ストッパ２４を備えている。ストッパ２４は、接合チャンバー２に固定され、衝突面が形成されている。ストッパ２４は、ゲートバルブ１５が開放され、かつ、接合チャンバ２の内部の圧力が大気圧より低いときに、その衝突面が可動部分２２に衝突して、大気圧によりイオンガン７が接合チャンバ２の内部の方向にさらに平行移動しないように、可動部分２２の移動範囲を制限している。すなわち、ストッパ２４は、ゲートバルブ１５が開放され、かつ、接合チャンバ２の内部の圧力が大気圧より低いときに、イオンガン７が所定の位置に配置されるように、可動部分２２を固定する。 The drawer mechanism 11 further includes a stopper 24. The stopper 24 is fixed to the bonding chamber 2 to form a collision surface. When the gate valve 15 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure, the stopper 24 collides with the movable portion 22 so that the ion gun 7 is moved into the bonding chamber 2 by the atmospheric pressure. The movement range of the movable part 22 is limited so as not to further translate in the internal direction. That is, the stopper 24 fixes the movable portion 22 so that the ion gun 7 is disposed at a predetermined position when the gate valve 15 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure.
　引出し機構１２は、引出し機構チャンバ３１とゲートバルブ３２と吸気弁３３と排気弁３４と圧力ゲージ３５とを備えている。引出し機構チャンバ３１は、内部を環境から隔離する容器である。ゲートバルブ３２は、接合チャンバ２と引出し機構チャンバ３１との間に介設され、接合チャンバー２の内部と引出し機構チャンバ３１の内部とを接続するゲートを閉鎖し、または、開放する。吸気弁３３は、環境を引出し機構チャンバ３１に接続する流路の途中に配置され、その流路の開度が変更されて大気を引出し機構チャンバ３１に供給する。排気弁３４は、図示されていない真空ポンプを引出し機構チャンバ３１に接続する流路の途中に配置され、その流路の開度が変更されて引出し機構チャンバ３１の内部に真空雰囲気を生成する。圧力ゲージ３５は、引出し機構チャンバ３１の内部の圧力を測定する。 The drawer mechanism 12 includes a drawer mechanism chamber 31, a gate valve 32, an intake valve 33, an exhaust valve 34, and a pressure gauge 35. The drawer mechanism chamber 31 is a container that isolates the interior from the environment. The gate valve 32 is interposed between the bonding chamber 2 and the drawing mechanism chamber 31, and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 31. The intake valve 33 is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 31, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 31. The exhaust valve 34 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 31, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 31. The pressure gauge 35 measures the pressure inside the drawer mechanism chamber 31.
　引出し機構チャンバ３１は、固定部分３６と可動部分３７とベローズ３８とを備えている。固定部分３６は、引出し機構チャンバ３１の隔壁の一部を形成し、ゲートバルブ３２に固定されている。可動部分３７は、引出し機構チャンバ３１の隔壁の一部を形成し、固定部分３６に対して平行移動可能に支持されている。可動部分３７は、さらに、ホローカソード８を支持している。ベローズ３８は、引出し機構チャンバ３１の隔壁の一部を形成し、固定部分３６と可動部分３７とに接合されている。ベローズ３８は、可動部分３７が平行移動したときに、変形することにより引出し機構チャンバ３１の内部を環境から隔離する。 The drawer mechanism chamber 31 includes a fixed portion 36, a movable portion 37, and a bellows 38. The fixed portion 36 forms a part of the partition wall of the drawer mechanism chamber 31 and is fixed to the gate valve 32. The movable portion 37 forms a part of the partition wall of the drawer mechanism chamber 31 and is supported so as to be movable in parallel with the fixed portion 36. The movable part 37 further supports the hollow cathode 8. The bellows 38 forms a part of the partition wall of the drawer mechanism chamber 31 and is joined to the fixed portion 36 and the movable portion 37. The bellows 38 is deformed when the movable portion 37 is translated, thereby isolating the inside of the drawer mechanism chamber 31 from the environment.
　引出し機構１２は、引出し機構１１と同様にして、さらに、図示されていないストッパを備えている。そのストッパは、接合チャンバー２に固定され、衝突面が形成されている。そのストッパは、ゲートバルブ３２が開放され、かつ、接合チャンバ２の内部の圧力が大気圧より低いときに、その衝突面が可動部分２２に衝突して、大気圧によりホローカソード８が接合チャンバ２の内部の方向にさらに平行移動しないように、可動部分３７の移動範囲を制限している。すなわち、そのストッパは、ゲートバルブ３２が開放され、かつ、接合チャンバ２の内部の圧力が大気圧より低いときに、ホローカソード８が所定の位置に配置されるように、可動部分３７を固定する。 The drawer mechanism 12 is provided with a stopper (not shown) in the same manner as the drawer mechanism 11. The stopper is fixed to the bonding chamber 2 to form a collision surface. The stopper is such that when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure, the collision surface collides with the movable portion 22 and the hollow cathode 8 is bonded to the bonding chamber 2 by the atmospheric pressure. The moving range of the movable part 37 is limited so as not to further translate in the direction inside the. That is, the stopper fixes the movable portion 37 so that the hollow cathode 8 is disposed at a predetermined position when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure. .
　引出し機構１１の可動部分２２は、図２に示されているように、イオンガン７の全体が引出し機構チャンバ１４の内部に配置されるように、移動させることができる。このとき、ゲートバルブ１５は、接合チャンバ２の内部と引出し機構チャンバ１４の内部とが隔離するように、閉鎖されることができる。すなわち、接合装置１は、イオンガン７が接合チャンバ２から引出し機構チャンバ１４に移動されたときに、接合チャンバ２を昇圧することなく、引出し機構チャンバ１４の内部を昇圧することができ、イオンガン７を接合チャンバ２から環境に取り出すことができる。 The movable part 22 of the drawer mechanism 11 can be moved so that the entire ion gun 7 is arranged inside the drawer mechanism chamber 14 as shown in FIG. At this time, the gate valve 15 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 14 are isolated. That is, when the ion gun 7 is moved from the bonding chamber 2 to the extraction mechanism chamber 14, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 14 without increasing the pressure of the bonding chamber 2. It can be removed from the bonding chamber 2 to the environment.
　引出し機構１２の可動部分３７は、引出し機構１１の可動部分２２と同様にして、ホローカソード８の全体が引出し機構チャンバ３１の内部に配置されるように、移動させることができる。このとき、ゲートバルブ３２は、接合チャンバ２の内部と引出し機構チャンバ３１の内部とが隔離するように、閉鎖されることができる。すなわち、接合装置１は、ホローカソード８が接合チャンバ２から引出し機構チャンバ３１に移動されたときに、接合チャンバ２を昇圧することなく、引出し機構チャンバ３１の内部を昇圧することができ、ホローカソード８を接合チャンバ２から環境に取り出すことができる。 The movable portion 37 of the drawer mechanism 12 can be moved so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31 in the same manner as the movable portion 22 of the drawer mechanism 11. At this time, the gate valve 32 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 31 are isolated. That is, when the hollow cathode 8 is moved from the bonding chamber 2 to the extraction mechanism chamber 31, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 31 without increasing the pressure of the bonding chamber 2. 8 can be removed from the bonding chamber 2 to the environment.
　接合装置１は、図１の状態で、ユーザに操作されて、基板を常温接合する常温接合方法を実行する。すなわち、接合装置１は、ゲートバルブ５が開放された状態で、基板を常温接合する。ユーザは、まず、ゲートバルブ３を閉鎖して、真空ポンプ６を用いて接合チャンバー２の内部に所定圧力の真空雰囲気を生成し、そのロードロックチャンバーの内部に大気圧雰囲気を生成する。ユーザは、そのロードロックチャンバーの蓋を開けて、複数の基板をそのロードロックチャンバーの内部に配置する。ユーザは、そのロードロックチャンバーの蓋を閉めて、真空ポンプを用いてそのロードロックチャンバーの内部に真空雰囲気を生成する。 The bonding apparatus 1 is operated by a user in the state shown in FIG. 1 and executes a room temperature bonding method for bonding substrates at room temperature. That is, the bonding apparatus 1 bonds the substrates at room temperature with the gate valve 5 opened. First, the user closes the gate valve 3, generates a vacuum atmosphere of a predetermined pressure inside the bonding chamber 2 using the vacuum pump 6, and generates an atmospheric pressure atmosphere inside the load lock chamber. The user opens the lid of the load lock chamber, and places a plurality of substrates inside the load lock chamber. The user closes the lid of the load lock chamber and creates a vacuum atmosphere inside the load lock chamber using a vacuum pump.
　ユーザは、ゲートバルブ３を開放した後に、搬送装置を用いて、そのロードロックチャンバーの内部に配置された基板の１枚を接合チャンバー２の内部の上側ステージに配置し、そのロードロックチャンバーの内部に配置された基板の他の１枚をその下側ステージに配置する。ユーザは、ゲートバルブ３を閉鎖して、真空ポンプ６を用いて接合チャンバー２の内部に真空雰囲気を生成する。 After opening the gate valve 3, the user uses the transfer device to place one of the substrates arranged inside the load lock chamber on the upper stage inside the bonding chamber 2, and then inside the load lock chamber. The other one of the substrates placed on is placed on the lower stage. The user closes the gate valve 3 and generates a vacuum atmosphere inside the bonding chamber 2 using the vacuum pump 6.
　ユーザは、その上側ステージに搭載された基板とその下側ステージに搭載された基板とが離れた状態で、その上側ステージに搭載された基板とその下側ステージに搭載された基板との間にイオンガン７を向けて粒子を放出する。その粒子は、その基板に照射され、その基板の表面に形成される酸化物等を除去し、その基板の表面に付着している不純物を除去する。 The user can place the substrate mounted on the upper stage and the substrate mounted on the lower stage between the substrate mounted on the upper stage and the substrate mounted on the lower stage while the substrate mounted on the upper stage is separated from the substrate mounted on the lower stage. The ion gun 7 is directed to release the particles. The particles irradiate the substrate to remove oxides and the like formed on the surface of the substrate and remove impurities attached to the surface of the substrate.
　ユーザは、接合チャンバー２の圧接機構を操作して、その上側ステージに搭載された基板をその下側ステージに搭載された基板に接触させる。その上側ステージに搭載された基板とその下側ステージに搭載された基板とは、その接触により接合され、１枚の接合基板が生成される。 The user operates the pressure contact mechanism of the bonding chamber 2 to bring the substrate mounted on the upper stage into contact with the substrate mounted on the lower stage. The substrate mounted on the upper stage and the substrate mounted on the lower stage are bonded by the contact to generate one bonded substrate.
　ユーザは、接合基板が生成された後に、ゲートバルブ３を開放する。ユーザは、その搬送装置を用いて、その下側ステージに搭載されている接合基板をそのロードロックチャンバーの内部に搬送する。この一連の動作は、そのロードロックチャンバーの内部に初期的に装填された基板がすべて常温接合されるまで繰り返し実行される。 The user opens the gate valve 3 after the bonded substrate is generated. The user uses the transfer device to transfer the bonded substrate mounted on the lower stage into the load lock chamber. This series of operations is repeated until all the substrates initially loaded in the load lock chamber are bonded at room temperature.
　ユーザは、そのロードロックチャンバーの内部に初期的に装填された基板がすべて常温接合されると、ゲートバルブ３を閉鎖して、そのロードロックチャンバーの内部に大気圧雰囲気を生成する。ユーザは、そのロードロックチャンバーの蓋を開けて、常温接合された複数の接合基板をそのロードロックチャンバーから取り出す。 The user closes the gate valve 3 when all the substrates initially loaded in the load lock chamber are bonded at room temperature, and generates an atmospheric pressure atmosphere in the load lock chamber. The user opens the lid of the load lock chamber and takes out the plurality of bonded substrates bonded at room temperature from the load lock chamber.
　イオンビームは、電荷を帯びているために、一般に、広がりながら放出される。このため、対向する２枚の基板のうちの対向する２つの表面にイオンビームを照射するためには、その２枚の基板の近傍からその２つの表面にむけてイオンビームを照射する必要がある。接合装置１は、基板の比較的近傍にイオンガン７が配置されていることから、基板にアルゴンイオンビームをより確実に照射することができ、基板をより確実に常温接合することができる。 Since the ion beam is charged, it is generally emitted while spreading. For this reason, in order to irradiate two opposing surfaces of two opposing substrates with an ion beam, it is necessary to irradiate the ion beams from the vicinity of the two substrates toward the two surfaces. . Since the ion gun 7 is disposed relatively near the substrate, the bonding apparatus 1 can more reliably irradiate the substrate with an argon ion beam, and can more reliably bond the substrates at room temperature.
　図３は、本発明による接合装置メンテナンス方法の実施の形態を示している。その接合装置メンテナンス方法は、常温接合方法が完了した後に実行される。ユーザは、まず、イオンガン７の全体が引出し機構チャンバ１４の内部に配置されるように、引出し機構１１の可動部分２２を移動させる（ステップＳ１）。ユーザは、イオンガン７の全体が引出し機構チャンバ１４の内部に配置された後に、ゲートバルブ１５を閉鎖する（ステップＳ２）。ユーザは、ゲートバルブ１５を閉鎖した後に、引出し機構チャンバ１４の内部に大気または窒素ガスを導入し、引出し機構チャンバ１４を大気開放する（ステップＳ３）。ユーザは、引出し機構チャンバ１４を大気開放した後に、引出し機構チャンバ１４の固定部分２１からベローズ２３をはずして、引出し機構チャンバ１４の内部から環境にイオンガン７を取り出す。ユーザは、その取り外したイオンガン７をメンテナンスする（ステップＳ４）。そのメンテナンスとしては、イオンガン７が備える電極を他の電極に交換すること、イオンガン７が備えるガスディストリビュータのオリフィスを他のオリフィスに交換することが例示される。 FIG. 3 shows an embodiment of a joining apparatus maintenance method according to the present invention. The bonding apparatus maintenance method is executed after the room temperature bonding method is completed. First, the user moves the movable portion 22 of the extraction mechanism 11 so that the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S1). The user closes the gate valve 15 after the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S2). After closing the gate valve 15, the user introduces atmosphere or nitrogen gas into the drawer mechanism chamber 14 to open the drawer mechanism chamber 14 to the atmosphere (step S 3). After releasing the drawing mechanism chamber 14 to the atmosphere, the user removes the bellows 23 from the fixed portion 21 of the drawing mechanism chamber 14 and takes out the ion gun 7 from the inside of the drawing mechanism chamber 14 to the environment. The user maintains the removed ion gun 7 (step S4). Examples of the maintenance include exchanging the electrode included in the ion gun 7 with another electrode and exchanging the orifice of the gas distributor included in the ion gun 7 with another orifice.
　ユーザは、メンテナンスされたイオンガン７を引出し機構チャンバ１４の可動部分２２に固定し、ベローズ２３を固定部分２１に取り付ける。ユーザは、引出し機構チャンバ１４の内部を排気し、引出し機構チャンバ１４の内部に真空雰囲気を生成する（ステップＳ５）。ユーザは、ゲートバルブ１５を開放し、引出し機構１１の可動部分２２を移動させることにより、イオンガン７を接合チャンバ２に移動させる。ユーザは、さらに、イオンガン７が接合チャンバ２の所定の位置に配置されるように、ストッパ２４を用いて可動部分２２を固定部分２１に固定する（ステップＳ６）。 The user fixes the maintained ion gun 7 to the movable part 22 of the drawer mechanism chamber 14 and attaches the bellows 23 to the fixed part 21. The user evacuates the inside of the drawer mechanism chamber 14 and generates a vacuum atmosphere inside the drawer mechanism chamber 14 (step S5). The user moves the ion gun 7 to the bonding chamber 2 by opening the gate valve 15 and moving the movable part 22 of the drawing mechanism 11. The user further fixes the movable portion 22 to the fixed portion 21 using the stopper 24 so that the ion gun 7 is disposed at a predetermined position in the bonding chamber 2 (step S6).
　ホローカソード８は、イオンガン７と同様にして、メンテナンスされる。すなわち、ユーザは、常温接合方法が完了した後に、まず、ホローカソード８の全体が引出し機構チャンバ３１の内部に配置されるように、引出し機構１２の可動部分３７を移動させる。ユーザは、ホローカソード８の全体が引出し機構チャンバ３１の内部に配置された後に、ゲートバルブ３２を閉鎖する。ユーザは、ゲートバルブ３２を閉鎖した後に、引出し機構チャンバ３１の内部に大気または窒素ガスを導入し、引出し機構チャンバ３１を大気開放する。ユーザは、引出し機構チャンバ３１を大気開放した後に、引出し機構チャンバ３１の固定部分３６からベローズ３８をはずして、引出し機構チャンバ３１の内部から環境にホローカソード８を取り出す。ユーザは、その取り外したホローカソード８をメンテナンスする。そのメンテナンスとしては、ホローカソード８が備える電極を他の電極に交換することが例示される。 The hollow cathode 8 is maintained in the same manner as the ion gun 7. That is, after the room temperature bonding method is completed, the user first moves the movable portion 37 of the drawer mechanism 12 so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. The user closes the gate valve 32 after the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. After closing the gate valve 32, the user introduces atmosphere or nitrogen gas into the inside of the drawer mechanism chamber 31 to open the drawer mechanism chamber 31 to the atmosphere. After releasing the drawer mechanism chamber 31 to the atmosphere, the user removes the bellows 38 from the fixed portion 36 of the drawer mechanism chamber 31 and takes out the hollow cathode 8 from the inside of the drawer mechanism chamber 31 to the environment. The user maintains the removed hollow cathode 8. The maintenance is exemplified by replacing the electrode provided in the hollow cathode 8 with another electrode.
　ユーザは、メンテナンスされたホローカソード８を引出し機構チャンバ３１の可動部分３７に固定し、ベローズ３８を固定部分３６に取り付ける。ユーザは、引出し機構チャンバ３１の内部を排気し、引出し機構チャンバ３１の内部に真空雰囲気を生成する。ユーザは、ゲートバルブ３２を開放し、引出し機構１２の可動部分３７を移動させることにより、ホローカソード８を接合チャンバ２に移動させる。ユーザは、さらに、ホローカソード８が接合チャンバ２の所定の位置に配置されるように、図示されていないストッパを用いて可動部分３７を固定部分３６に固定する。 The user fixes the maintained hollow cathode 8 to the movable part 37 of the drawer mechanism chamber 31 and attaches the bellows 38 to the fixed part 36. The user evacuates the inside of the drawer mechanism chamber 31 and generates a vacuum atmosphere inside the drawer mechanism chamber 31. The user moves the hollow cathode 8 to the bonding chamber 2 by opening the gate valve 32 and moving the movable part 37 of the drawing mechanism 12. The user further fixes the movable portion 37 to the fixed portion 36 using a stopper (not shown) so that the hollow cathode 8 is disposed at a predetermined position in the bonding chamber 2.
　接合チャンバ２は、大気開放すると内壁に水分・油分が付着するために、大気開放した後に再度内部に真空雰囲気を生成するときに長時間（たとえば、１週間～２週間）排気する必要がある。このような接合装置メンテナンス方法によれば、接合装置１は、接合チャンバ２の内部を昇圧させることなく、イオンガン７またはホローカソード８をメンテナンスするときのダウンタイムを低減することができ、イオンガン７またはホローカソード８をより速くメンテナンスすることができる。 The bonding chamber 2 needs to be evacuated for a long time (for example, 1 week to 2 weeks) when a vacuum atmosphere is generated again after being opened to the atmosphere because moisture and oil adhere to the inner wall when opened to the atmosphere. According to such a bonding apparatus maintenance method, the bonding apparatus 1 can reduce downtime when maintaining the ion gun 7 or the hollow cathode 8 without increasing the pressure inside the bonding chamber 2. The hollow cathode 8 can be maintained more quickly.
　本発明による接合装置の実施の他の形態は、既述の実施の形態における接合装置１の引出し機構１１が他の引出し機構に置換されている。その引出し機構４１は、図４に示されているように、本体部分４２と接合装置メンテナンス用治具４３とを備えている。本体部分４２は、フランジ４５と蓋４６とイオンガン用コネクタ４７とホローカソード用コネクタ４８とを備えている。フランジ４５は、接合チャンバ２形成された開口部に接合されており、シール面が形成されている。蓋４６は、板状に形成され、シール面が形成されている。接合チャンバ２は、蓋４６のシール面がフランジ４５のシール面に密着することにより、内部が環境から隔離される。蓋４６は、さらに、イオンガン７とホローカソード８とに固定されている。イオンガン用コネクタ４７は、蓋４６に配置され、接合チャンバ２の内部を環境と隔離したまま、環境に配置された外部装置とイオンガン７とを配管と配線とにより接続するときに利用される。ホローカソード用コネクタ４８は、蓋４６に配置され、接合チャンバ２の内部を環境と隔離したまま、環境に配置された外部装置とホローカソード８とを配管と配線とにより接続するときに利用される。 In another embodiment of the joining apparatus according to the present invention, the drawer mechanism 11 of the joining apparatus 1 in the above-described embodiment is replaced with another drawer mechanism. As shown in FIG. 4, the drawing mechanism 41 includes a main body portion 42 and a joining device maintenance jig 43. The main body portion 42 includes a flange 45, a lid 46, an ion gun connector 47, and a hollow cathode connector 48. The flange 45 is joined to the opening formed in the joining chamber 2 to form a seal surface. The lid 46 is formed in a plate shape and has a sealing surface. The inside of the bonding chamber 2 is isolated from the environment when the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45. The lid 46 is further fixed to the ion gun 7 and the hollow cathode 8. The ion gun connector 47 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. The hollow cathode connector 48 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .
　接合装置メンテナンス用治具４３は、引出し機構チャンバ５１とゲートバルブ５２とボール螺子５３とを備えている。引出し機構チャンバ５１は、内部を環境から隔離する容器である。引出し機構チャンバ５１は、固定部分５５と可動部分５６とベローズ５７とロッド５８とを備えている。固定部分５５は、引出し機構チャンバ５１の隔壁の一部を形成し、ゲートバルブ５２に固定されている。可動部分５６は、引出し機構チャンバ５１の隔壁の一部を形成し、固定部分５５に対して平行移動可能に支持されている。可動部分５６は、さらに、イオンガン７を支持している。ベローズ５７は、引出し機構チャンバ５１の隔壁の一部を形成し、固定部分５５と可動部分５６とに接合されている。ベローズ５７は、可動部分５６が平行移動したときに、変形することにより引出し機構チャンバ５１の内部を環境から隔離する。ロッド５８は、可動部分５６に固定され、蓋４６に固定されている。 The joining device maintenance jig 43 includes a drawing mechanism chamber 51, a gate valve 52, and a ball screw 53. The drawer mechanism chamber 51 is a container that isolates the interior from the environment. The drawer mechanism chamber 51 includes a fixed portion 55, a movable portion 56, a bellows 57, and a rod 58. The fixed portion 55 forms a part of the partition wall of the drawer mechanism chamber 51 and is fixed to the gate valve 52. The movable portion 56 forms a part of the partition wall of the drawer mechanism chamber 51 and is supported so as to be movable in parallel with the fixed portion 55. The movable portion 56 further supports the ion gun 7. The bellows 57 forms a part of the partition wall of the drawer mechanism chamber 51 and is joined to the fixed portion 55 and the movable portion 56. The bellows 57 is deformed when the movable portion 56 is translated, thereby isolating the inside of the drawer mechanism chamber 51 from the environment. The rod 58 is fixed to the movable part 56 and fixed to the lid 46.
　引出し機構チャンバ５１は、さらに、開口５４を備えている。開口５４は、吸気弁と排気弁と圧力ゲージとを備えている。その吸気弁は、環境を引出し機構チャンバ５１に接続する流路の途中に配置され、その流路の開度が変更されて大気を引出し機構チャンバ５１に供給する。その排気弁は、真空ポンプを引出し機構チャンバ５１に接続する流路の途中に配置され、その流路の開度が変更されて引出し機構チャンバ５１の内部に真空雰囲気を生成する。その圧力ゲージは、引出し機構チャンバ５１の内部の圧力を測定する。 The drawer mechanism chamber 51 further includes an opening 54. The opening 54 includes an intake valve, an exhaust valve, and a pressure gauge. The intake valve is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 51, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 51. The exhaust valve is arranged in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 51, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 51. The pressure gauge measures the pressure inside the drawer mechanism chamber 51.
　ゲートバルブ５２は、シール面が形成されている。ゲートバルブ５２は、そのシール面がフランジ４５のシール面に密着するように、フランジ４５に固定されている。ゲートバルブ５２は、さらに、他のシール面が形成されている。ゲートバルブ５２は、そのシール面が固定部分５５に形成されるシール面に密着するように、固定部分５５に固定されている。すなわち、ゲートバルブ５２は、接合チャンバ２と引出し機構チャンバ５１との間に介設されている。ゲートバルブ５２は、接合チャンバー２の内部と引出し機構チャンバ５１の内部とを接続するゲートを閉鎖し、または、開放する。 The gate valve 52 has a sealing surface. The gate valve 52 is fixed to the flange 45 so that its sealing surface is in close contact with the sealing surface of the flange 45. The gate valve 52 is further formed with another sealing surface. The gate valve 52 is fixed to the fixed portion 55 so that the seal surface is in close contact with the seal surface formed on the fixed portion 55. That is, the gate valve 52 is interposed between the bonding chamber 2 and the drawing mechanism chamber 51. The gate valve 52 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 51.
　ボール螺子５３は、ガイド６１と案内軸受け６２と螺子軸６５とハンドル６３とナット６４とを備えている。ガイド６１は、直線状のレールに形成され、引出し機構チャンバ５１の固定部分５５に固定されている。案内軸受け６２は、引出し機構チャンバ５１の可動部分５６に固定され、直線上を平行移動可能にガイド６１に支持されている。螺子軸６５は、雄ねじが形成され、ガイド６１に平行になるように配置され、その雄ねじの軸を中心に回転可能に引出し機構チャンバ５１の固定部分５５に支持されている。ハンドル６３は、ユーザが手で握って扱う部分であり、ユーザが螺子軸６５を回転させるときに利用される。ナット６４は、雌ねじが形成され、引出し機構チャンバ５１の可動部分５６に固定されている。ナット６４は、その雌ねじが螺子軸６５の雄ねじにはめられ、螺子軸６５の回転を案内軸受け６２の平行移動に変換する。すなわち、ボール螺子５３は、ユーザによりハンドル６３が回転されることにより、引出し機構チャンバ５１の可動部分５６を平行移動させる。 The ball screw 53 includes a guide 61, a guide bearing 62, a screw shaft 65, a handle 63, and a nut 64. The guide 61 is formed in a linear rail and is fixed to the fixed portion 55 of the drawer mechanism chamber 51. The guide bearing 62 is fixed to the movable portion 56 of the drawer mechanism chamber 51, and is supported by the guide 61 so as to be able to move in parallel on a straight line. The screw shaft 65 is formed with a male screw and is arranged so as to be parallel to the guide 61, and is supported by the fixed portion 55 of the drawer mechanism chamber 51 so as to be rotatable around the shaft of the male screw. The handle 63 is a portion that is handled by the user and is used when the user rotates the screw shaft 65. The nut 64 is formed with a female screw and is fixed to the movable portion 56 of the drawer mechanism chamber 51. The nut 64 has a female screw fitted to the male screw of the screw shaft 65, and converts the rotation of the screw shaft 65 into a parallel movement of the guide bearing 62. That is, the ball screw 53 translates the movable portion 56 of the drawer mechanism chamber 51 when the handle 63 is rotated by the user.
　接合装置メンテナンス用治具４３は、図４の状態から本体部分４２から取り外すことができる。すなわち、ゲートバルブ５２は、フランジ４５から取り外すことができ、ロッド５８は、蓋４６から取り外すことができる。このとき、本体部分４２は、図５に示されているように、固定ボルト４９を備えている。固定ボルト４９は、雄ねじが形成され、フランジ４５に形成されている雌ねじに嵌め合わされることにより、蓋４６を接合チャンバ２に固定し、接合チャンバ２を環境から隔離する。 The joining device maintenance jig 43 can be detached from the main body portion 42 from the state shown in FIG. That is, the gate valve 52 can be removed from the flange 45 and the rod 58 can be removed from the lid 46. At this time, the main body portion 42 includes a fixing bolt 49 as shown in FIG. The fixing bolt 49 is formed with a male screw and is fitted to a female screw formed on the flange 45, thereby fixing the lid 46 to the joining chamber 2 and isolating the joining chamber 2 from the environment.
　このような接合装置は、接合装置メンテナンス用治具４３が本体部分４２から取り外された図５の状態で、既述の実施の形態における接合装置１と同様にして、常温接合方法が実行される。このような接合装置は、接合装置１と同様にして、基板にアルゴンイオンビームをより確実に照射することができ、基板をより確実に常温接合することができる。 In such a bonding apparatus, the bonding apparatus maintenance jig 43 is removed from the main body portion 42, and the room temperature bonding method is executed in the same manner as the bonding apparatus 1 in the above-described embodiment. . Such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.
　接合装置メンテナンス用治具４３は、さらに、図６に示されているように、イオンガン７とホローカソード８との両方が引出し機構チャンバ５１の内部に配置されるように、引出し機構チャンバ５１の可動部分５６を移動することができる。このとき、ゲートバルブ５２は、閉鎖することができ、接合チャンバ２を引出し機構チャンバ５１から隔離することができる。 Further, as shown in FIG. 6, the bonding apparatus maintenance jig 43 is movable in the drawer mechanism chamber 51 so that both the ion gun 7 and the hollow cathode 8 are arranged inside the drawer mechanism chamber 51. Portion 56 can be moved. At this time, the gate valve 52 can be closed and the bonding chamber 2 can be isolated from the drawer mechanism chamber 51.
　本発明による接合装置メンテナンス方法の実施の他の形態は、引出し機構４１を備えた接合装置を用いて実行される。その接合装置は、ユーザは、図７に示されているように、その接合装置による常温接合方法が完了した後に、まず、図４の状態の接合装置から固定ボルト４９を取り外す（ステップＳ１１）。このとき、蓋４６は、大気圧によりシール面がフランジ４５のシール面に押し付けられ、接合チャンバ２は、内部が真空雰囲気に維持される。 Another embodiment of the joining apparatus maintenance method according to the present invention is executed using a joining apparatus provided with a drawer mechanism 41. As shown in FIG. 7, the user first removes the fixing bolt 49 from the joining device in the state shown in FIG. 4 after the room temperature joining method using the joining device is completed (step S11). At this time, the sealing surface of the lid 46 is pressed against the sealing surface of the flange 45 by atmospheric pressure, and the inside of the bonding chamber 2 is maintained in a vacuum atmosphere.
　ユーザは、次いで、接合装置メンテナンス用治具４３を本体部分４２に取り付ける。すなわち、ユーザは、まず、ゲートバルブ５２のシール面が本体部分４２のフランジ４５のシール面に密着するように、ゲートバルブ５２をフランジ４５に固定する（ステップＳ１２）。ユーザは、さらに、ゲートバルブ５２を開放し、ロッド５８を蓋４６に固定する。ユーザは、ゲートバルブ５２のシール面が引出し機構チャンバー５１の固定部分４２のシール面に密着するように、固定部分４２をゲートバルブ５２に固定する（ステップＳ１３）。 The user then attaches the joining device maintenance jig 43 to the main body portion 42. That is, the user first fixes the gate valve 52 to the flange 45 so that the seal surface of the gate valve 52 is in close contact with the seal surface of the flange 45 of the main body portion 42 (step S12). The user further opens the gate valve 52 and fixes the rod 58 to the lid 46. The user fixes the fixed portion 42 to the gate valve 52 so that the seal surface of the gate valve 52 is in close contact with the seal surface of the fixed portion 42 of the drawer mechanism chamber 51 (step S13).
　ユーザは、接合装置メンテナンス用治具４３を本体部分４２に取り付けた後に、引出し機構チャンバー５１の内部を排気し、引出し機構チャンバー５１の内部に真空雰囲気を生成する（ステップＳ１４）。ユーザは、引出し機構チャンバー５１の内部に真空雰囲気を生成した後に、ボール螺子５３を用いて、可動部分５６を移動させ、イオンガン７とホローカソード８とを引出し機構チャンバー５１の内部に配置する（ステップＳ１５）。ユーザは、イオンガン７とホローカソード８とを引出し機構チャンバー５１の内部に配置した後に、ゲートバルブ５２を閉鎖する（ステップＳ１６）。ユーザは、ゲートバルブ５２を閉鎖した後に、引出し機構チャンバー５１の内部に大気または窒素ガスを導入し、引出し機構チャンバー５１を大気開放する（ステップＳ１７）。 After attaching the joining device maintenance jig 43 to the main body portion 42, the user evacuates the inside of the drawing mechanism chamber 51 and generates a vacuum atmosphere inside the drawing mechanism chamber 51 (step S14). After generating a vacuum atmosphere inside the extraction mechanism chamber 51, the user moves the movable part 56 using the ball screw 53 and arranges the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step) S15). The user closes the gate valve 52 after arranging the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step S16). After closing the gate valve 52, the user introduces air or nitrogen gas into the inside of the drawer mechanism chamber 51, and opens the drawer mechanism chamber 51 to the atmosphere (step S17).
　ユーザは、引出し機構チャンバー５１が大気開放された後に、たとえば、ベローズ５７を固定部分５５から取り外して、蓋４６からイオンガン７とホローカソード８とを取り外し、引出し機構チャンバー５１の内部から環境にイオンガン７とホローカソード８とを取り出す。ユーザは、その取り出されたイオンガン７とホローカソード８とをメンテナンスする（ステップＳ１８）。そのメンテナンスとしては、イオンガン７が備える電極を他の電極に交換すること、イオンガン７が備えるガスディストリビュータのオリフィスを他のオリフィスに交換すること、そのメンテナンスとしては、ホローカソード８が備える電極を他の電極に交換することが例示される。 After the extraction mechanism chamber 51 is opened to the atmosphere, the user, for example, removes the bellows 57 from the fixed portion 55 and removes the ion gun 7 and the hollow cathode 8 from the lid 46, so that the ion gun 7 enters the environment from the inside of the extraction mechanism chamber 51. And the hollow cathode 8 are taken out. The user maintains the extracted ion gun 7 and hollow cathode 8 (step S18). As the maintenance, the electrode provided in the ion gun 7 is replaced with another electrode, the orifice of the gas distributor provided in the ion gun 7 is replaced with another orifice, and as the maintenance, the electrode provided in the hollow cathode 8 is replaced with another electrode. Exchanging with an electrode is illustrated.
　ユーザは、メンテナンスされたイオンガン７とホローカソード８とを蓋４６に取り付け、ベローズ５７を固定部分５５に取り付けて、引出し機構チャンバ５１を組み立てなおす。ユーザは、引出し機構チャンバ５１を組み立てた後に、引出し機構チャンバ５１の内部を排気し、引出し機構チャンバ５１の内部に真空雰囲気を生成する（ステップＳ１９）。ユーザは、引出し機構チャンバ５１の内部に真空雰囲気が生成された後に、ゲートバルブ５２を開放する（ステップＳ２０）。ユーザは、ゲートバルブ５２が開放された後に、蓋４６のシール面がフランジ４５のシール面に密着するように、ボール螺子５３を用いて可動部分５６を移動させる（ステップＳ２１）。このとき、イオンガン７とホローカソード８とは、蓋４６とともに移動して、接合チャンバー２の所定の位置に配置される。 The user attaches the maintained ion gun 7 and the hollow cathode 8 to the lid 46, attaches the bellows 57 to the fixed portion 55, and reassembles the drawer mechanism chamber 51. After assembling the drawer mechanism chamber 51, the user evacuates the inside of the drawer mechanism chamber 51 and generates a vacuum atmosphere inside the drawer mechanism chamber 51 (step S19). The user opens the gate valve 52 after the vacuum atmosphere is generated inside the drawer mechanism chamber 51 (step S20). After the gate valve 52 is opened, the user moves the movable portion 56 using the ball screw 53 so that the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45 (step S21). At this time, the ion gun 7 and the hollow cathode 8 move together with the lid 46 and are arranged at predetermined positions in the bonding chamber 2.
　ユーザは、接合チャンバ２が蓋４６で密閉された後に、引出し機構チャンバー５１の内部に大気または窒素ガスを導入し、引出し機構チャンバー５１を大気開放する（ステップＳ２２）。ユーザは、引出し機構チャンバー５１が大気開放された後に、接合装置メンテナンス用治具４３を本体部分４２から取り外す（ステップＳ２３）。すなわち、ユーザは、固定部分４２をゲートバルブ５２から取り外し、ロッド５８を蓋４６から取り外し、ゲートバルブ５２をフランジ４５から取り外す。 After the joining chamber 2 is sealed with the lid 46, the user introduces air or nitrogen gas into the drawing mechanism chamber 51 and opens the drawing mechanism chamber 51 to the atmosphere (step S22). After the drawer mechanism chamber 51 is opened to the atmosphere, the user removes the joining device maintenance jig 43 from the main body portion 42 (step S23). That is, the user removes the fixed portion 42 from the gate valve 52, removes the rod 58 from the lid 46, and removes the gate valve 52 from the flange 45.
　ユーザは、接合装置メンテナンス用治具４３が本体部分４２から取り外された後に、固定ボルト４９を用いて、蓋４６をフランジ４５に固定する（ステップＳ２４）。 The user fixes the lid 46 to the flange 45 using the fixing bolt 49 after the joining device maintenance jig 43 is removed from the main body portion 42 (step S24).
　このような接合装置メンテナンス方法によれば、接合装置は、接合チャンバ２の内部を昇圧させることなく、イオンガン７またはホローカソード８をより速くメンテナンスすることができる。このような接合装置メンテナンス方法によれば、さらに、接合装置が配置される床面積は、接合装置が常温接合方法を実行しているときに、接合装置メンテナンス用治具４３の分だけ低減されることができる。このような接合装置メンテナンス方法によれば、さらに、１つの接合装置メンテナンス用治具４３に対して、複数の接合装置１の本体部分を作製することができる。このとき、その複数の接合装置１は、１つの接合装置メンテナンス用治具４３を使い回して、イオンガン７をメンテナンスすることができ、装置の製造コストを低減することができる。 According to such a bonding apparatus maintenance method, the bonding apparatus can maintain the ion gun 7 or the hollow cathode 8 faster without increasing the pressure inside the bonding chamber 2. According to such a bonding apparatus maintenance method, the floor area where the bonding apparatus is arranged is further reduced by the amount of the bonding apparatus maintenance jig 43 when the bonding apparatus is executing the room temperature bonding method. be able to. According to such a bonding apparatus maintenance method, the main body portions of the plurality of bonding apparatuses 1 can be manufactured with respect to one bonding apparatus maintenance jig 43. At this time, the plurality of bonding apparatuses 1 can maintain the ion gun 7 by using one bonding apparatus maintenance jig 43, and the manufacturing cost of the apparatus can be reduced.
　本発明による接合装置の実施にさらに他の形態は、既述の実施の形態における引出し機構４１が他の引出し機構に置換されている。その引出し機構７１は、図８に示されているように、引出し機構チャンバ７２とゲートバルブ７３と空圧シリンダ７４とを備えている。引出し機構チャンバ７２は、内部を環境から隔離する容器である。引出し機構チャンバ７２は、固定部分７５と可動部分７６とベローズ７７とを備えている。固定部分７５は、引出し機構チャンバ７２の隔壁の一部を形成し、ゲートバルブ７３に固定されている。可動部分７６は、引出し機構チャンバ７２の隔壁の一部を形成し、固定部分７５に対して平行移動可能に支持されている。可動部分７６は、さらに、イオンガン７を支持している。ベローズ７７は、引出し機構チャンバ７２の隔壁の一部を形成し、固定部分７５と可動部分７６とに接合されている。ベローズ７７は、可動部分７６が平行移動したときに、変形することにより引出し機構チャンバ７２の内部を環境から隔離する。 In another embodiment of the bonding apparatus according to the present invention, the drawer mechanism 41 in the above-described embodiment is replaced with another drawer mechanism. The drawing mechanism 71 includes a drawing mechanism chamber 72, a gate valve 73, and a pneumatic cylinder 74, as shown in FIG. The drawer mechanism chamber 72 is a container that isolates the interior from the environment. The drawer mechanism chamber 72 includes a fixed portion 75, a movable portion 76, and a bellows 77. The fixed portion 75 forms a part of the partition wall of the drawer mechanism chamber 72 and is fixed to the gate valve 73. The movable portion 76 forms a part of the partition wall of the drawer mechanism chamber 72 and is supported so as to be movable in parallel with the fixed portion 75. The movable part 76 further supports the ion gun 7. The bellows 77 forms a part of the partition wall of the drawer mechanism chamber 72 and is joined to the fixed portion 75 and the movable portion 76. The bellows 77 is deformed when the movable portion 76 is translated, thereby isolating the inside of the drawer mechanism chamber 72 from the environment.
　引出し機構チャンバ７２は、さらに、イオンガン用コネクタ７８とホローカソード用コネクタ７９とを備えている。イオンガン用コネクタ７８は、蓋４６に配置され、接合チャンバ２の内部を環境と隔離したまま、環境に配置された外部装置とイオンガン７とを配管と配線とにより接続するときに利用される。ホローカソード用コネクタ７９は、蓋４６に配置され、接合チャンバ２の内部を環境と隔離したまま、環境に配置された外部装置とホローカソード８とを配管と配線とにより接続するときに利用される。 The drawer mechanism chamber 72 further includes an ion gun connector 78 and a hollow cathode connector 79. The ion gun connector 78 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. The hollow cathode connector 79 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .
　引出し機構チャンバ７２は、さらに、図示されていない吸気弁と排気弁と圧力ゲージとを備えている。その吸気弁は、環境を引出し機構チャンバ７２に接続する流路の途中に配置され、その流路の開度が変更されて大気を引出し機構チャンバ７２に供給する。その排気弁は、真空ポンプを引出し機構チャンバ７２に接続する流路の途中に配置され、その流路の開度が変更されて引出し機構チャンバ７２の内部に真空雰囲気を生成する。その圧力ゲージは、引出し機構チャンバ７２の内部の圧力を測定する。 The drawer mechanism chamber 72 further includes an intake valve, an exhaust valve, and a pressure gauge (not shown). The intake valve is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 72, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 72. The exhaust valve is disposed in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 72, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 72. The pressure gauge measures the pressure inside the drawer mechanism chamber 72.
　ゲートバルブ７３は、接合チャンバ２と引出し機構チャンバ７２との間に介設されている。ゲートバルブ７３は、接合チャンバー２の内部と引出し機構チャンバ７２の内部とを接続するゲートを閉鎖し、または、開放する。 The gate valve 73 is interposed between the bonding chamber 2 and the drawing mechanism chamber 72. The gate valve 73 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 72.
　空圧シリンダ７４は、ガイド８１と本体部分８２とロッド８３とを備えている。ガイド８１は、直線状のレールに形成され、引出し機構チャンバ７２の固定部分７５に固定されている。ガイド８１は、引出し機構チャンバ７２の可動部分７６を平行移動可能にガイド８１に支持している。本体部分８２は、ガイド８１に固定され、引出し機構チャンバ７２の固定部分７５に固定されている。本体部分８２は、供給される空圧を用いて、ガイド８１に対してロッド８３を駆動する。ロッド８３は、引出し機構チャンバ７２の可動部分７６に固定されている。すなわち、空圧シリンダ７４は、ユーザにより、引出し機構チャンバ７２の可動部分７６を平行移動させる。 The pneumatic cylinder 74 includes a guide 81, a main body portion 82, and a rod 83. The guide 81 is formed as a linear rail and is fixed to a fixed portion 75 of the drawer mechanism chamber 72. The guide 81 supports the movable part 76 of the drawer mechanism chamber 72 on the guide 81 so as to be movable in parallel. The main body portion 82 is fixed to the guide 81 and is fixed to the fixed portion 75 of the drawer mechanism chamber 72. The main body portion 82 drives the rod 83 with respect to the guide 81 using the supplied air pressure. The rod 83 is fixed to the movable part 76 of the drawer mechanism chamber 72. That is, the pneumatic cylinder 74 translates the movable portion 76 of the drawer mechanism chamber 72 by the user.
　引出し機構７１は、イオンガン７とホローカソード８との両方が引出し機構チャンバ７２の内部に配置されるように、引出し機構チャンバ７２の可動部分７６を移動することができる。このとき、ゲートバルブ７３は、閉鎖することができ、接合チャンバ２を引出し機構チャンバ７２から隔離することができる。 The extraction mechanism 71 can move the movable portion 76 of the extraction mechanism chamber 72 such that both the ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. At this time, the gate valve 73 can be closed, and the bonding chamber 2 can be isolated from the drawer mechanism chamber 72.
　このような接合装置は、図８の状態で、既述の実施の形態における接合装置１と同様にして、常温接合方法が実行される。すなわち、このような接合装置は、接合装置１と同様にして、基板にアルゴンイオンビームをより確実に照射することができ、基板をより確実に常温接合することができる。 Such a joining apparatus performs the room temperature joining method in the state of FIG. 8 in the same manner as the joining apparatus 1 in the above-described embodiment. That is, such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.
　このような接合装置は、既述の実施の形態における接合装置１と同様にして、イオンガン７とホローカソード８とがメンテナンスされる。すなわち、ユーザは、常温接合方法が完了した後に、まず、イオンガン７とホローカソード８との全体が引出し機構チャンバ７２の内部に配置されるように、空圧シリンダ７４を用いて可動部分７６を移動させる。ユーザは、イオンガン７とホローカソード８との全体が引出し機構チャンバ７２の内部に配置された後に、ゲートバルブ７３を閉鎖する。ユーザは、ゲートバルブ７３を閉鎖した後に、引出し機構チャンバ７２の内部に大気または窒素ガスを導入し、引出し機構チャンバ７２を大気開放する。ユーザは、引出し機構チャンバ７２を大気開放した後に、引出し機構チャンバ７２の固定部分７５からベローズ７７をはずして、引出し機構チャンバ７２の内部から環境にイオンガン７とホローカソード８とを取り出す。ユーザは、その取り外したイオンガン７とホローカソード８とをメンテナンスする。 In such a joining apparatus, the ion gun 7 and the hollow cathode 8 are maintained in the same manner as the joining apparatus 1 in the above-described embodiment. That is, after the room temperature bonding method is completed, the user first moves the movable portion 76 using the pneumatic cylinder 74 so that the entire ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. Let The user closes the gate valve 73 after the ion gun 7 and the hollow cathode 8 are entirely disposed inside the extraction mechanism chamber 72. After closing the gate valve 73, the user introduces air or nitrogen gas into the inside of the drawing mechanism chamber 72 to open the drawing mechanism chamber 72 to the atmosphere. After releasing the drawing mechanism chamber 72 to the atmosphere, the user removes the bellows 77 from the fixed portion 75 of the drawing mechanism chamber 72 and takes out the ion gun 7 and the hollow cathode 8 from the inside of the drawing mechanism chamber 72 to the environment. The user maintains the removed ion gun 7 and hollow cathode 8.
　ユーザは、メンテナンスされたイオンガン７とホローカソード８とを引出し機構チャンバ７２の可動部分７６に固定し、ベローズ７７を固定部分７５に取り付ける。ユーザは、引出し機構チャンバ７２の内部を排気し、引出し機構チャンバ７２の内部に真空雰囲気を生成する。ユーザは、ゲートバルブ７３を開放し、空圧シリンダ７４を用いて引出し機構７１の可動部分７６を移動させることにより、イオンガン７とホローカソード８とを接合チャンバ２に移動させる。ユーザは、さらに、イオンガン７とホローカソード８とが接合チャンバ２の所定の位置に配置されるように、可動部分７６を固定部分７５に固定する。 The user fixes the maintained ion gun 7 and the hollow cathode 8 to the movable part 76 of the drawer mechanism chamber 72 and attaches the bellows 77 to the fixed part 75. The user evacuates the inside of the drawing mechanism chamber 72 and generates a vacuum atmosphere inside the drawing mechanism chamber 72. The user opens the gate valve 73 and moves the movable portion 76 of the drawing mechanism 71 using the pneumatic cylinder 74 to move the ion gun 7 and the hollow cathode 8 to the bonding chamber 2. The user further fixes the movable portion 76 to the fixed portion 75 so that the ion gun 7 and the hollow cathode 8 are arranged at predetermined positions in the bonding chamber 2.
　このような接合装置メンテナンス方法によれば、引出し機構７１を備えた接合装置は、既述の実施の形態における接合装置１と同様にして、接合チャンバ２の内部を昇圧させることなく、イオンガン７とホローカソード８とをより速くメンテナンスすることができる。 According to such a bonding apparatus maintenance method, the bonding apparatus provided with the drawer mechanism 71 can be connected to the ion gun 7 without increasing the pressure in the bonding chamber 2 in the same manner as the bonding apparatus 1 in the above-described embodiment. The hollow cathode 8 can be maintained more quickly.
　なお、引出し機構チャンバは、イオンガン７とホローカソード８とが通過可能であるハッチを備えることもできる。このとき、引出し機構チャンバは、イオンガン７とホローカソード８とを引出し機構チャンバから取り出すときに分解される必要がなく、イオンガン７とホローカソード８とをより容易に取り出すことができる。 Note that the extraction mechanism chamber may include a hatch through which the ion gun 7 and the hollow cathode 8 can pass. At this time, the extraction mechanism chamber does not need to be disassembled when the ion gun 7 and the hollow cathode 8 are extracted from the extraction mechanism chamber, and the ion gun 7 and the hollow cathode 8 can be extracted more easily.
　本発明による接合装置は、照射対象に粒子をより確実に照射することができ、かつ、その粒子を放出するガンをより速くメンテナンスすることができる。
　本発明による接合装置メンテナンス方法によれば、照射対象に粒子をより確実に照射することができる接合装置は、その粒子を放出するガンをより速くメンテナンスすることができる。 The bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can maintain the gun that discharges the particles more quickly.
According to the bonding apparatus maintenance method according to the present invention, the bonding apparatus that can irradiate the irradiation target more reliably with the particles can maintain the gun that discharges the particles more quickly.

Claims (13)

  1. 　粒子を放出するガンと、
    　前記粒子が放出される雰囲気が内部に生成される真空チャンバと、
    　引出し機構チャンバと、
    　前記真空チャンバと前記引出し機構チャンバとの間を開閉するゲートバルブとを具備し、
    　前記ガンは、前記ゲートバルブを通って移動可能に支持される
    　接合装置。     A gun that emits particles,
    A vacuum chamber in which an atmosphere from which the particles are released is generated;
    A drawer mechanism chamber;
    A gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber;
    The gun is supported so as to be movable through the gate valve.
  2. 　請求の範囲１において、
    　前記ガンが前記真空チャンバーの内部に配置されているときに前記真空チャンバーを密封する蓋を更に具備し、
    　前記ガンは、前記蓋に固定されている
    　接合装置。     In claim 1,
    A lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber;
    The gun is fixed to the lid.
  3. 　請求の範囲１または請求の範囲２のいずれかにおいて、
    　前記真空チャンバの内部に生成される雰囲気に粒子を放出する他のガンと、
    　他の引出し機構チャンバと、
    　前記真空チャンバと前記他の引出し機構チャンバとの間を開閉する他のゲートバルブとを更に具備し、
    　前記他のガンは、前記他の引出し機構チャンバの内部に配置されるように、前記他のゲートバルブを通って移動可能に支持される
    　接合装置。     In either Claim 1 or Claim 2,
    Other guns that emit particles into the atmosphere generated inside the vacuum chamber;
    Other drawer mechanism chambers;
    And further comprising another gate valve for opening and closing between the vacuum chamber and the other drawer mechanism chamber,
    The other gun is movably supported through the other gate valve so as to be disposed inside the other drawer mechanism chamber.
  4. 　請求の範囲１または請求の範囲２のいずれかにおいて、
    　前記真空チャンバの内部に生成される雰囲気に粒子を放出する他のガンを更に具備し、
    　前記他のガンは、前記引出し機構チャンバの内部に配置されるように、前記ゲートバルブを通って移動可能に支持される
    　接合装置。     In either Claim 1 or Claim 2,
    Further comprising another gun for releasing particles into the atmosphere created inside the vacuum chamber;
    The other gun is movably supported through the gate valve so as to be arranged inside the drawer mechanism chamber.
  5. 　請求の範囲３または請求の範囲４のいずれかにおいて、
    　前記他のガンは、前記ガンに前記粒子を供給するホローカソードである
    　接合装置。     In either claim 3 or claim 4,
    The other gun is a hollow cathode that supplies the particles to the gun.
  6. 　請求の範囲１～請求の範囲５のいずれかにおいて、
    　前記引出し機構チャンバは、
    　前記真空チャンバに固定される固定部分と、
    　前記固定部分に対して移動可能である可動部分と、
    　前記固定部分と前記可動部分との間に配置されるベローズを備え、
    　前記ガンは、前記可動部分に固定されている
    　接合装置。     In any one of claims 1 to 5,
    The drawer mechanism chamber includes:
    A fixed portion fixed to the vacuum chamber;
    A movable part movable relative to the fixed part;
    Comprising a bellows disposed between the fixed part and the movable part;
    The gun is fixed to the movable part.
  7. 　粒子を放出するガンを真空チャンバから引出し機構チャンバーに移動するステップと、
    　前記ガンが前記引出し機構チャンバーの内部に配置されるときに、前記真空チャンバと前記引出し機構チャンバーとの間に配置されるゲートバルブを閉鎖するステップ
    　とを具備する接合装置メンテナンス方法。     Moving the gun emitting particles from the vacuum chamber to the extraction mechanism chamber;
    And closing a gate valve disposed between the vacuum chamber and the drawer mechanism chamber when the gun is disposed inside the drawer mechanism chamber.
  8. 　請求の範囲７において、
    　前記真空チャンバを密閉する蓋を介して前記ガンが前記真空チャンバの内部に支持されているときに、前記引出し機構チャンバの内部を減圧してゲートバルブを開放するステップを更に具備し、
    　前記ガンは、前記蓋とともに前記真空チャンバから前記引出し機構チャンバーに移動される
    　接合装置メンテナンス方法。     In claim 7,
    When the gun is supported inside the vacuum chamber through a lid that seals the vacuum chamber, further comprising the step of reducing the pressure inside the drawer mechanism chamber and opening the gate valve;
    The gun is moved together with the lid from the vacuum chamber to the drawer mechanism chamber.
  9. 　請求の範囲７において、
    　前記引出し機構チャンバを前記ゲートバルブに取り付けるステップ
    　を更に具備する接合装置メンテナンス方法。     In claim 7,
    A joining apparatus maintenance method, further comprising: attaching the drawer mechanism chamber to the gate valve.
  10. 　請求の範囲７において、
    　前記引出し機構チャンバと前記ゲートバルブとを前記真空チャンバに取り付けるステップ
    　を更に具備する接合装置メンテナンス方法。     In claim 7,
    A joining apparatus maintenance method, further comprising: attaching the drawing mechanism chamber and the gate valve to the vacuum chamber.
  11. 　請求の範囲７において、
    　前記ゲートバルブを開放したまま、前記ガンを用いて前記粒子を放出するステップ
    　を更に具備する接合装置メンテナンス方法。     In claim 7,
    A joining apparatus maintenance method, further comprising: releasing the particles using the gun while the gate valve is opened.
  12. 　粒子を放出するガンと、
    　前記粒子が放出される雰囲気が内部に生成される真空チャンバと、
    　前記ガンが前記真空チャンバーの内部に配置されているときに前記真空チャンバーを密封する蓋とを具備し、
    　前記ガンは、前記蓋に固定されている
    　接合装置
    　に取り付けられる接合装置メンテナンス用治具であり、
    　引出し機構チャンバと、
    　前記真空チャンバと前記引出し機構チャンバとの間を開閉するゲートバルブと、
    　前記ゲートバルブを通るように移動可能に前記ガンを支持する可動部分
    　とを具備する接合装置メンテナンス用治具。     A gun that emits particles,
    A vacuum chamber in which an atmosphere from which the particles are released is generated;
    A lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber;
    The gun is a joining device maintenance jig attached to the joining device fixed to the lid,
    A drawer mechanism chamber;
    A gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber;
    A joining apparatus maintenance jig comprising: a movable part that supports the gun so as to be movable so as to pass through the gate valve.
  13. 　粒子を放出するガンと、
    　前記粒子が放出される雰囲気が内部に生成される真空チャンバと、
    　前記ガンが前記真空チャンバーの内部に配置されているときに前記真空チャンバーを密封する蓋と、
    　ゲートバルブとを具備し、
    　前記ガンは、前記蓋に固定されている
    　接合装置
    　に取り付けられる接合装置メンテナンス用治具であり、
    　引出し機構チャンバと、
    　前記ゲートバルブを通るように移動可能に前記ガンを支持する可動部分とを具備し、
    　前記ゲートバルブは、前記真空チャンバと前記引出し機構チャンバとの間を開閉する
    　接合装置メンテナンス用治具。     A gun that emits particles,
    A vacuum chamber in which an atmosphere from which the particles are released is generated;
    A lid that seals the vacuum chamber when the gun is disposed within the vacuum chamber;
    A gate valve,
    The gun is a joining device maintenance jig attached to the joining device fixed to the lid,
    A drawer mechanism chamber;
    A movable part that supports the gun movably through the gate valve;
    The gate valve opens and closes between the vacuum chamber and the drawer mechanism chamber.
PCT/JP2008/064457 2008-08-12 2008-08-12 Bonding device and maintenance method of bonding device WO2010018621A1 (en)

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US8985175B2 (en) 2008-01-09 2015-03-24 Mitsubishi Heavy Industries, Ltd. Room temperature bonding machine and room temperature bonding method
CN104717823A (en) * 2015-03-30 2015-06-17 同方威视技术股份有限公司 Insulating and sealing structure and electronic curtain accelerator
KR20180114896A (en) * 2016-02-16 2018-10-19 에베 그룹 에. 탈너 게엠베하 Method and apparatus for bonding substrates
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US20220293436A1 (en) * 2021-03-11 2022-09-15 Taiwan Semiconductor Manufacturing Company Limited Semiconductor substrate bonding tool and methods of operation

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US8985175B2 (en) 2008-01-09 2015-03-24 Mitsubishi Heavy Industries, Ltd. Room temperature bonding machine and room temperature bonding method
CN104717823A (en) * 2015-03-30 2015-06-17 同方威视技术股份有限公司 Insulating and sealing structure and electronic curtain accelerator
KR102701964B1 (en) * 2016-02-16 2024-09-02 에베 그룹 에. 탈너 게엠베하 Method and device for bonding substrates
CN109075037A (en) * 2016-02-16 2018-12-21 Ev 集团 E·索尔纳有限责任公司 Method and apparatus for bonded substrate
JP2019509627A (en) * 2016-02-16 2019-04-04 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Method and apparatus for bonding substrates
KR20180114896A (en) * 2016-02-16 2018-10-19 에베 그룹 에. 탈너 게엠베하 Method and apparatus for bonding substrates
KR102580005B1 (en) * 2016-02-16 2023-09-18 에베 그룹 에. 탈너 게엠베하 Method and device for bonding substrates
US10755930B2 (en) 2016-02-16 2020-08-25 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
US10755929B2 (en) 2016-02-16 2020-08-25 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
US11101132B2 (en) 2016-02-16 2021-08-24 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
CN109075037B (en) * 2016-02-16 2023-11-07 Ev 集团 E·索尔纳有限责任公司 Method and apparatus for bonding substrates
KR20230137479A (en) * 2016-02-16 2023-10-04 에베 그룹 에. 탈너 게엠베하 Method and device for bonding substrates
KR102494914B1 (en) * 2016-02-16 2023-02-01 에베 그룹 에. 탈너 게엠베하 Method and apparatus for bonding substrates
KR20230022259A (en) * 2016-02-16 2023-02-14 에베 그룹 에. 탈너 게엠베하 Method and device for bonding substrates
US11742205B2 (en) 2016-02-16 2023-08-29 Ev Group E. Thallner Gmbh Method and device for bonding of substrates
WO2020004023A1 (en) * 2018-06-25 2020-01-02 東京エレクトロン株式会社 Maintenance device
JP7169786B2 (en) 2018-06-25 2022-11-11 東京エレクトロン株式会社 maintenance equipment
JP2020004746A (en) * 2018-06-25 2020-01-09 東京エレクトロン株式会社 Maintenance device
US20220293436A1 (en) * 2021-03-11 2022-09-15 Taiwan Semiconductor Manufacturing Company Limited Semiconductor substrate bonding tool and methods of operation
US11862482B2 (en) * 2021-03-11 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor substrate bonding tool and methods of operation

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