JPWO2010018621A1 - Bonding apparatus and bonding apparatus maintenance method - Google Patents

Abstract

A gun for discharging particles, a vacuum chamber in which an atmosphere in which the particles are discharged is generated, a drawing mechanism chamber, and a gate valve for opening and closing between the vacuum chamber and the drawing mechanism chamber . The gun is movably supported through the gate valve. Such a bonding apparatus can move the gun through the gate valve to the vicinity of the irradiation object arranged in the vacuum chamber from the inside of the extraction mechanism chamber, and more reliably irradiate the irradiation object with particles. can do. Such a joining apparatus further moves the gun to the inside of the drawer mechanism chamber, and then closes the gate valve to increase the pressure inside the vacuum chamber without increasing the pressure inside the vacuum chamber. It can be taken out.

Description

  The present invention relates to a bonding apparatus and a bonding apparatus maintenance method, and more particularly to a bonding apparatus that discharges particles into a vacuum chamber and a bonding apparatus maintenance method that maintains the bonding apparatus.

  A MEMS (Micro Electro Mechanical Systems) in which fine electrical parts and mechanical parts are integrated is known. Examples of the MEMS include a micromachine, a pressure sensor, and a micro motor. There is known a room temperature bonding apparatus for manufacturing such MEMS by room temperature bonding. The room-temperature bonding apparatus includes a vacuum chamber and an ion gun. The MEMS is manufactured by bonding a substrate irradiated with an ion beam in the vacuum chamber. Such a room temperature bonding apparatus is desired to more reliably irradiate the irradiation target with particles and to maintain the gun faster without increasing the pressure inside the vacuum chamber.

  Japanese Patent Application Laid-Open No. 61-272375 discloses a thin film having a simple structure and high reliability without causing deterioration of withstand voltage performance due to exposure of the ion source to the atmosphere even when the vacuum vessel is opened for sample exchange or the like. A forming apparatus is disclosed. The thin film forming apparatus is a thin film forming apparatus comprising an ion source and a vacuum vessel. A gate valve having a structure between the ion source and the vacuum vessel, with a packing on the ion source side and a sheet on the vacuum vessel side It is characterized by providing.

  Japanese Examined Patent Publication No. 07-072340 discloses a vacuum deposition apparatus with high reliability, long life, and stable film formation. The vacuum deposition apparatus includes an internal space that can be evacuated, a charged particle beam generation source disposed in the internal space, a charged particle beam supply unit having a radiation hole that emits a charged particle beam, and the charged particle beam supply unit. A vacuum vessel having an opening for introducing a charged particle beam that radiates more and having an internal space that can be evacuated independently of the internal space of the charged particle beam supply means; and disposed in the internal space of the vacuum vessel, An evaporation source with which the charged particle beam collides by giving a predetermined potential difference to the charged particle beam generation source; a sample holding means arranged so that an evaporation component from the evaporation source adheres; and the aperture portion Openable and closable valve means for connecting the radiation hole and the radiation hole, the internal space of the vacuum vessel and the charged particle beam when the valve means is opened. When the internal space of the supply means is communicated and closed, the internal space of the vacuum vessel is separated from the internal space of the charged particle beam supply means, and in the closed state, the internal space of the vacuum vessel is The charged particle beam supply means can be removed from the valve means while maintaining a vacuum state.

The subject of this invention is providing the joining apparatus which can irradiate a particle | grain to irradiation object more reliably, and can be maintained more rapidly.
Another object of the present invention is to provide a joining apparatus maintenance method that can maintain a joining apparatus that can irradiate particles to an irradiation object more reliably and more quickly.

  The bonding apparatus according to the present invention opens and closes a gun that discharges particles, a vacuum chamber in which an atmosphere in which the particles are discharged is generated, a drawer mechanism chamber, and the vacuum chamber and the drawer mechanism chamber And a gate valve. The gun is movably supported through the gate valve. Such a bonding apparatus can move the gun through the gate valve from the inside of the drawer mechanism chamber to the vicinity of the irradiation target disposed inside the vacuum chamber. Such a joining apparatus moves the gun to the inside of the drawer mechanism chamber, and then closes the gate valve to take out the gun to the outside of the vacuum chamber without increasing the pressure inside the vacuum chamber. Can do. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.

  The joining apparatus according to the present invention further includes a lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber. The gun is secured to the lid. Such a bonding apparatus is configured such that when the gun is disposed inside the vacuum chamber, the vacuum chamber is sealed with a lid so that the pressure inside the vacuum chamber is not increased. Can be boosted. Such a bonding device can further remove the gate valve from the vacuum chamber without boosting the interior of the vacuum chamber when the gun is placed inside the vacuum chamber, or The drawer mechanism chamber can be removed from the gate valve.

  The bonding apparatus according to the present invention includes another gun that discharges particles to the atmosphere generated in the vacuum chamber, the other drawing mechanism chamber, and the other that opens and closes between the vacuum chamber and the other drawing mechanism chamber. And a gate valve. Other guns are movably supported through other gate valves for placement within other drawer mechanism chambers. That is, the bonding apparatus includes a plurality of drawer mechanism chambers in which a plurality of movable guns are respectively disposed, and a plurality of gate valves that open and close between the vacuum chamber and the plurality of drawer mechanism chambers. . According to such a bonding apparatus, the plurality of guns move to the inside of the plurality of drawing mechanism chambers, respectively, and then close the plurality of gate valves, thereby increasing the pressure inside the vacuum chamber. It can be maintained faster.

  The bonding apparatus according to the present invention further includes another gun that emits particles into the atmosphere created inside the vacuum chamber. Other guns are movably supported through the gate valve so as to be placed inside the drawer mechanism chamber. That is, the bonding apparatus includes a plurality of guns that can be disposed in one drawer mechanism chamber. According to such a joining device, the plurality of guns are moved to the inside of the drawing mechanism chamber, and then maintained more quickly without increasing the pressure in the vacuum chamber by closing the gate valve. Can.

  The other gun is preferably a hollow cathode that supplies the gun with its particles.

  The drawer mechanism chamber includes a fixed part fixed to the vacuum chamber, a movable part movable with respect to the fixed part, and a bellows disposed between the fixed part and the movable part. . The gun is preferably fixed to the movable part.

  A joining apparatus maintenance method according to the present invention includes a step of moving a gun that emits particles from a vacuum chamber to a drawing mechanism chamber, and the vacuum chamber and the drawing mechanism when the gun is disposed inside the drawing mechanism chamber. Closing a gate valve disposed between the chamber and the chamber. According to such a bonding apparatus maintenance method, the gun arranged in the vicinity of the irradiation object arranged inside the vacuum chamber can be taken out of the vacuum chamber without increasing the pressure inside the vacuum chamber. it can. For this reason, according to such a joining apparatus maintenance method, the gun which can irradiate a particle | grain to irradiation object more reliably can be maintained faster, without raising the inside of a vacuum chamber.

  In the joining apparatus maintenance method according to the present invention, when the gun is supported inside the vacuum chamber through a lid that seals the vacuum chamber, the inside of the drawer mechanism chamber is decompressed to open the gate valve. The method further includes a step. The gun is moved with the lid from the vacuum chamber to the drawer mechanism chamber. At this time, the drawer mechanism chamber is preferable because it is not necessary to depressurize the inside of the drawer mechanism chamber when the lid seals the vacuum chamber.

  The joining apparatus maintenance method according to the present invention further includes the step of attaching the drawer mechanism chamber to the gate valve. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber is not attached before this step. At this time, the floor area on which the joining device is arranged can be reduced by the amount of the drawing mechanism chamber.

  The joining apparatus maintenance method according to the present invention further includes the step of attaching the drawer mechanism chamber and the gate valve to the vacuum chamber. That is, in the bonding apparatus including the drawing mechanism chamber and the vacuum chamber, the drawing mechanism chamber and the gate valve are not attached before this step. At this time, the floor area in which the bonding apparatus is disposed can be reduced by the amount of the drawing mechanism chamber and the gate valve.

  The bonding apparatus maintenance method according to the present invention preferably further includes a step of discharging the particles using the gun while the gate valve is opened.

  The joining device maintenance jig according to the present invention includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber. And a lid for sealing the vacuum chamber. The gun is attached to a joining device fixed to the lid. A joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber, a gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber, and a movable that supports the gun so as to be movable through the gate valve. And a part. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber. Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber. The gun can be taken out of the vacuum chamber without any trouble. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.

  The joining device maintenance jig according to the present invention includes a gun that emits particles, a vacuum chamber in which an atmosphere from which the particles are released is generated, and a gun that is disposed inside the vacuum chamber. A lid for sealing the vacuum chamber and a gate valve are provided. The gun is attached to a joining device fixed to the lid. A joining apparatus maintenance jig according to the present invention includes a drawer mechanism chamber and a movable part that supports the gun so as to be movable through the gate valve. The gate valve opens and closes between the vacuum chamber and the drawer mechanism chamber. In such a bonding apparatus, a gun can be disposed in the vicinity of an irradiation target disposed inside the vacuum chamber. Such a joining device maintenance jig is attached to the joining device, and after moving the gun to the inside of the drawer mechanism chamber, the gate valve is closed to increase the pressure inside the vacuum chamber. The gun can be taken out of the vacuum chamber without any trouble. For this reason, the bonding apparatus can more reliably irradiate the irradiation target with particles, and can maintain the gun faster without increasing the pressure inside the vacuum chamber.

The bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can more quickly maintain the gun that discharges the particles.
According to the joining apparatus maintenance method according to the present invention, the joining apparatus that can irradiate the irradiation target with the particles more reliably can maintain the gun that releases the particles more quickly.

FIG. 1 is a sectional view showing an embodiment of a joining apparatus according to the present invention. FIG. 2 is a cross-sectional view showing a bonding apparatus when maintaining the ion gun. FIG. 3 is a flowchart showing an embodiment of a joining apparatus maintenance method according to the present invention. FIG. 4 is a cross-sectional view showing another embodiment of the bonding apparatus according to the present invention. FIG. 5 is a cross-sectional view showing a drawing mechanism when performing normal temperature bonding. FIG. 6 is a cross-sectional view showing a drawing mechanism when maintaining the ion gun. FIG. 7 is a flowchart showing another embodiment of the joining apparatus maintenance method according to the present invention. FIG. 8 is a sectional view showing still another embodiment of the bonding apparatus according to the present invention.

  Embodiments of a joining apparatus according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the bonding apparatus 1 includes a bonding chamber 2, a gate valve 3, a purge valve 5, a vacuum pump 6, an ion gun 7, and a hollow cathode 8. The bonding chamber 2 is a container that isolates the interior from the environment. The bonding chamber 2 includes an upper stage, a lower stage, and a pressure contact mechanism that are not shown. The lower stage and the lower stage are respectively disposed inside the bonding chamber 2 and hold the substrate. The pressure contact mechanism drives the lower stage and the lower stage so that the substrate held by the upper stage and the substrate held by the lower stage are pressed.

The gate valve 3 is interposed between the bonding chamber 2 and a load lock chamber (not shown), and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the load lock chamber. The load lock chamber includes a lid, a vacuum pump, and a transfer device not shown. The lid closes or opens the gate connecting the outside and the inside of the load lock chamber. The vacuum pump exhausts gas from the inside of the load lock chamber, and generates a vacuum atmosphere inside the load lock chamber. As the vacuum atmosphere, an atmosphere of 1 × 10 ⁻⁵ Pa is exemplified. The transfer device is disposed inside the load lock chamber. The transfer device transfers the substrate disposed inside the load lock chamber via the gate valve 3 to the inside of the bonding chamber 2 so that the substrate is held on the upper stage or the lower stage. The transfer device transfers the substrate held by the upper stage or the lower stage through the gate valve 3 into the load lock chamber.

  The purge valve 5 is arranged in the middle of a flow path connecting a gas supply source for storing nitrogen gas to the bonding chamber 2 and opens and closes the flow path. The purge valve 5 supplies nitrogen gas from the gas supply source to the bonding chamber 2 by opening the flow path. The purge valve 5 can also be disposed in the middle of a flow path that connects the environment in which the bonding apparatus 1 is disposed to the inside of the bonding chamber 2. At this time, the purge valve 5 supplies the atmosphere to the bonding chamber 2 by opening the flow path. The vacuum pump 6 exhausts gas from the inside of the bonding chamber 2 and generates a vacuum atmosphere inside the bonding chamber 2.

  The hollow cathode 8 accelerates and emits electrons using electric power supplied from the outside. The ion gun 7 generates argon ions by using argon gas supplied from the outside and electrons emitted from the hollow cathode 8, and accelerates the argon ions to emit an argon ion beam. Such an argon ion beam has a predetermined divergence angle. The ion gun 7 is sufficiently close to the upper stage and the lower stage so that both the substrate supported by the upper stage and the substrate supported by the lower stage are simultaneously irradiated with the argon ion beam. Placed in position.

  The bonding chamber 2 includes a drawing mechanism 11 and a drawing mechanism 12. The drawer mechanism 11 includes a drawer mechanism chamber 14, a gate valve 15, an intake valve 16, an exhaust valve 17, and a pressure gauge 18. The drawer mechanism chamber 14 is a container that isolates the interior from the environment. The gate valve 15 is interposed between the bonding chamber 2 and the drawing mechanism chamber 14, and closes or opens a gate that connects the inside of the bonding chamber 2 and the drawing mechanism chamber 14. The intake valve 16 is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 14, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 14. The exhaust valve 17 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 14, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 14. The pressure gauge 18 measures the pressure inside the drawer mechanism chamber 14.

  The drawer mechanism chamber 14 includes a fixed portion 21, a movable portion 22, and a bellows 23. The fixed portion 21 forms a part of the partition wall of the drawer mechanism chamber 14 and is fixed to the gate valve 15. The movable portion 22 forms a part of the partition wall of the drawer mechanism chamber 14 and is supported so as to be movable in parallel with the fixed portion 21. The movable part 22 further supports the ion gun 7. The bellows 23 forms a part of the partition wall of the drawer mechanism chamber 14 and is joined to the fixed portion 21 and the movable portion 22. The bellows 23 isolates the inside of the drawer mechanism chamber 14 from the environment by being deformed when the movable part 22 is translated.

  The drawer mechanism 11 further includes a stopper 24. The stopper 24 is fixed to the bonding chamber 2 to form a collision surface. When the gate valve 15 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure, the stopper 24 collides with the movable portion 22 so that the ion gun 7 is moved into the bonding chamber 2 by the atmospheric pressure. The movement range of the movable part 22 is limited so as not to further translate in the internal direction. That is, the stopper 24 fixes the movable portion 22 so that the ion gun 7 is disposed at a predetermined position when the gate valve 15 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure.

  The drawer mechanism 12 includes a drawer mechanism chamber 31, a gate valve 32, an intake valve 33, an exhaust valve 34, and a pressure gauge 35. The drawer mechanism chamber 31 is a container that isolates the interior from the environment. The gate valve 32 is interposed between the bonding chamber 2 and the drawing mechanism chamber 31, and closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 31. The intake valve 33 is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 31, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 31. The exhaust valve 34 is arranged in the middle of a flow path connecting a vacuum pump (not shown) to the drawing mechanism chamber 31, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 31. The pressure gauge 35 measures the pressure inside the drawer mechanism chamber 31.

  The drawer mechanism chamber 31 includes a fixed portion 36, a movable portion 37, and a bellows 38. The fixed portion 36 forms a part of the partition wall of the drawer mechanism chamber 31 and is fixed to the gate valve 32. The movable portion 37 forms a part of the partition wall of the drawer mechanism chamber 31 and is supported so as to be movable in parallel with the fixed portion 36. The movable part 37 further supports the hollow cathode 8. The bellows 38 forms a part of the partition wall of the drawer mechanism chamber 31 and is joined to the fixed portion 36 and the movable portion 37. The bellows 38 is deformed when the movable portion 37 is translated, thereby isolating the inside of the drawer mechanism chamber 31 from the environment.

  The drawer mechanism 12 is further provided with a stopper (not shown) in the same manner as the drawer mechanism 11. The stopper is fixed to the bonding chamber 2 to form a collision surface. The stopper is such that when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure, the collision surface collides with the movable portion 22 and the hollow cathode 8 is bonded to the bonding chamber 2 by the atmospheric pressure. The moving range of the movable part 37 is limited so as not to further translate in the direction inside the. That is, the stopper fixes the movable portion 37 so that the hollow cathode 8 is disposed at a predetermined position when the gate valve 32 is opened and the pressure inside the bonding chamber 2 is lower than the atmospheric pressure. .

  The movable part 22 of the extraction mechanism 11 can be moved so that the entire ion gun 7 is located inside the extraction mechanism chamber 14 as shown in FIG. At this time, the gate valve 15 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 14 are isolated. That is, when the ion gun 7 is moved from the bonding chamber 2 to the extraction mechanism chamber 14, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 14 without increasing the pressure of the bonding chamber 2. It can be removed from the bonding chamber 2 to the environment.

  The movable portion 37 of the drawer mechanism 12 can be moved so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31 in the same manner as the movable portion 22 of the drawer mechanism 11. At this time, the gate valve 32 can be closed so that the inside of the joining chamber 2 and the inside of the drawer mechanism chamber 31 are isolated. That is, when the hollow cathode 8 is moved from the bonding chamber 2 to the extraction mechanism chamber 31, the bonding apparatus 1 can increase the pressure inside the extraction mechanism chamber 31 without increasing the pressure of the bonding chamber 2. 8 can be removed from the bonding chamber 2 to the environment.

  In the state of FIG. 1, the bonding apparatus 1 is operated by a user to execute a room temperature bonding method for bonding substrates at room temperature. That is, the bonding apparatus 1 bonds the substrates at room temperature with the gate valve 5 opened. First, the user closes the gate valve 3, generates a vacuum atmosphere of a predetermined pressure inside the bonding chamber 2 using the vacuum pump 6, and generates an atmospheric pressure atmosphere inside the load lock chamber. The user opens the lid of the load lock chamber, and places a plurality of substrates inside the load lock chamber. The user closes the lid of the load lock chamber and creates a vacuum atmosphere inside the load lock chamber using a vacuum pump.

  After opening the gate valve 3, the user uses the transfer device to place one of the substrates arranged inside the load lock chamber on the upper stage inside the bonding chamber 2, and then inside the load lock chamber. The other one of the substrates placed on is placed on the lower stage. The user closes the gate valve 3 and generates a vacuum atmosphere inside the bonding chamber 2 using the vacuum pump 6.

  The user can place the substrate mounted on the upper stage and the substrate mounted on the lower stage between the substrate mounted on the upper stage and the substrate mounted on the lower stage while the substrate mounted on the upper stage is separated from the substrate mounted on the lower stage. The ion gun 7 is directed to release the particles. The particles irradiate the substrate to remove oxides and the like formed on the surface of the substrate and remove impurities attached to the surface of the substrate.

  The user operates the pressure contact mechanism of the bonding chamber 2 to bring the substrate mounted on the upper stage into contact with the substrate mounted on the lower stage. The substrate mounted on the upper stage and the substrate mounted on the lower stage are bonded by the contact to generate one bonded substrate.

  The user opens the gate valve 3 after the bonded substrate is generated. The user uses the transfer device to transfer the bonded substrate mounted on the lower stage into the load lock chamber. This series of operations is repeated until all the substrates initially loaded in the load lock chamber are bonded at room temperature.

  When all the substrates initially loaded in the load lock chamber are bonded at room temperature, the user closes the gate valve 3 to generate an atmospheric pressure atmosphere in the load lock chamber. The user opens the lid of the load lock chamber and takes out the plurality of bonded substrates bonded at room temperature from the load lock chamber.

  Since the ion beam is charged, it is generally emitted while spreading. For this reason, in order to irradiate two opposing surfaces of two opposing substrates with an ion beam, it is necessary to irradiate the ion beams from the vicinity of the two substrates toward the two surfaces. . Since the ion gun 7 is disposed relatively near the substrate, the bonding apparatus 1 can more reliably irradiate the substrate with an argon ion beam, and can more reliably bond the substrates at room temperature.

  FIG. 3 shows an embodiment of a joining apparatus maintenance method according to the present invention. The bonding apparatus maintenance method is executed after the room temperature bonding method is completed. First, the user moves the movable portion 22 of the extraction mechanism 11 so that the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S1). The user closes the gate valve 15 after the entire ion gun 7 is disposed inside the extraction mechanism chamber 14 (step S2). After closing the gate valve 15, the user introduces atmosphere or nitrogen gas into the drawer mechanism chamber 14 to open the drawer mechanism chamber 14 to the atmosphere (step S 3). After releasing the drawing mechanism chamber 14 to the atmosphere, the user removes the bellows 23 from the fixed portion 21 of the drawing mechanism chamber 14 and takes out the ion gun 7 from the inside of the drawing mechanism chamber 14 to the environment. The user maintains the removed ion gun 7 (step S4). Examples of the maintenance include exchanging the electrode included in the ion gun 7 with another electrode and exchanging the orifice of the gas distributor included in the ion gun 7 with another orifice.

  The user fixes the maintained ion gun 7 to the movable part 22 of the drawer mechanism chamber 14 and attaches the bellows 23 to the fixed part 21. The user evacuates the inside of the drawer mechanism chamber 14 and generates a vacuum atmosphere inside the drawer mechanism chamber 14 (step S5). The user moves the ion gun 7 to the bonding chamber 2 by opening the gate valve 15 and moving the movable part 22 of the drawing mechanism 11. The user further fixes the movable portion 22 to the fixed portion 21 using the stopper 24 so that the ion gun 7 is disposed at a predetermined position in the bonding chamber 2 (step S6).

  The hollow cathode 8 is maintained in the same manner as the ion gun 7. That is, after the room temperature bonding method is completed, the user first moves the movable portion 37 of the drawer mechanism 12 so that the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. The user closes the gate valve 32 after the entire hollow cathode 8 is disposed inside the drawer mechanism chamber 31. After closing the gate valve 32, the user introduces atmosphere or nitrogen gas into the inside of the drawer mechanism chamber 31 to open the drawer mechanism chamber 31 to the atmosphere. After releasing the drawer mechanism chamber 31 to the atmosphere, the user removes the bellows 38 from the fixed portion 36 of the drawer mechanism chamber 31 and takes out the hollow cathode 8 from the inside of the drawer mechanism chamber 31 to the environment. The user maintains the removed hollow cathode 8. The maintenance is exemplified by replacing the electrode provided in the hollow cathode 8 with another electrode.

  The user fixes the maintained hollow cathode 8 to the movable portion 37 of the drawer mechanism chamber 31 and attaches the bellows 38 to the fixed portion 36. The user evacuates the inside of the drawer mechanism chamber 31 and generates a vacuum atmosphere inside the drawer mechanism chamber 31. The user moves the hollow cathode 8 to the bonding chamber 2 by opening the gate valve 32 and moving the movable part 37 of the drawing mechanism 12. The user further fixes the movable portion 37 to the fixed portion 36 using a stopper (not shown) so that the hollow cathode 8 is disposed at a predetermined position in the bonding chamber 2.

  When the bonding chamber 2 is opened to the atmosphere, moisture and oil components adhere to the inner wall. Therefore, when the vacuum atmosphere is generated again after the opening to the atmosphere, it is necessary to exhaust the bonding chamber 2 for a long time (for example, one week to two weeks). According to such a bonding apparatus maintenance method, the bonding apparatus 1 can reduce downtime when maintaining the ion gun 7 or the hollow cathode 8 without increasing the pressure inside the bonding chamber 2. The hollow cathode 8 can be maintained more quickly.

  In another embodiment of the joining apparatus according to the present invention, the drawer mechanism 11 of the joining apparatus 1 in the above-described embodiment is replaced with another drawer mechanism. As shown in FIG. 4, the drawing mechanism 41 includes a main body portion 42 and a joining device maintenance jig 43. The main body portion 42 includes a flange 45, a lid 46, an ion gun connector 47, and a hollow cathode connector 48. The flange 45 is joined to the opening formed in the joining chamber 2 to form a seal surface. The lid 46 is formed in a plate shape and has a sealing surface. The inside of the bonding chamber 2 is isolated from the environment when the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45. The lid 46 is further fixed to the ion gun 7 and the hollow cathode 8. The ion gun connector 47 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. The hollow cathode connector 48 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .

  The joining device maintenance jig 43 includes a drawing mechanism chamber 51, a gate valve 52, and a ball screw 53. The drawer mechanism chamber 51 is a container that isolates the interior from the environment. The drawer mechanism chamber 51 includes a fixed portion 55, a movable portion 56, a bellows 57, and a rod 58. The fixed portion 55 forms a part of the partition wall of the drawer mechanism chamber 51 and is fixed to the gate valve 52. The movable portion 56 forms a part of the partition wall of the drawer mechanism chamber 51 and is supported so as to be movable in parallel with the fixed portion 55. The movable portion 56 further supports the ion gun 7. The bellows 57 forms a part of the partition wall of the drawer mechanism chamber 51 and is joined to the fixed portion 55 and the movable portion 56. The bellows 57 is deformed when the movable portion 56 is translated, thereby isolating the inside of the drawer mechanism chamber 51 from the environment. The rod 58 is fixed to the movable part 56 and fixed to the lid 46.

  The drawer mechanism chamber 51 further includes an opening 54. The opening 54 includes an intake valve, an exhaust valve, and a pressure gauge. The intake valve is disposed in the middle of the flow path connecting the environment to the extraction mechanism chamber 51, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 51. The exhaust valve is arranged in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 51, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 51. The pressure gauge measures the pressure inside the drawer mechanism chamber 51.

  The gate valve 52 has a sealing surface. The gate valve 52 is fixed to the flange 45 so that its sealing surface is in close contact with the sealing surface of the flange 45. The gate valve 52 is further formed with another sealing surface. The gate valve 52 is fixed to the fixed portion 55 so that the seal surface is in close contact with the seal surface formed on the fixed portion 55. That is, the gate valve 52 is interposed between the bonding chamber 2 and the drawing mechanism chamber 51. The gate valve 52 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 51.

  The ball screw 53 includes a guide 61, a guide bearing 62, a screw shaft 65, a handle 63, and a nut 64. The guide 61 is formed in a linear rail and is fixed to the fixed portion 55 of the drawer mechanism chamber 51. The guide bearing 62 is fixed to the movable portion 56 of the drawer mechanism chamber 51, and is supported by the guide 61 so as to be able to translate on a straight line. The screw shaft 65 is formed with a male screw and is arranged so as to be parallel to the guide 61, and is supported by the fixed portion 55 of the drawer mechanism chamber 51 so as to be rotatable around the shaft of the male screw. The handle 63 is a portion that is handled by the user and is used when the user rotates the screw shaft 65. The nut 64 is formed with a female screw and is fixed to the movable portion 56 of the drawer mechanism chamber 51. The nut 64 has a female screw fitted to the male screw of the screw shaft 65, and converts the rotation of the screw shaft 65 into a parallel movement of the guide bearing 62. That is, the ball screw 53 translates the movable portion 56 of the drawer mechanism chamber 51 when the handle 63 is rotated by the user.

  The joining device maintenance jig 43 can be detached from the main body portion 42 from the state shown in FIG. That is, the gate valve 52 can be removed from the flange 45 and the rod 58 can be removed from the lid 46. At this time, the main body portion 42 includes a fixing bolt 49 as shown in FIG. The fixing bolt 49 is formed with a male screw and is fitted to a female screw formed on the flange 45, thereby fixing the lid 46 to the joining chamber 2 and isolating the joining chamber 2 from the environment.

  In such a bonding apparatus, the bonding apparatus maintenance jig 43 is removed from the main body portion 42, and the room temperature bonding method is executed in the same manner as the bonding apparatus 1 in the above-described embodiment. . Such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.

  Further, as shown in FIG. 6, the bonding apparatus maintenance jig 43 is movable in the drawer mechanism chamber 51 so that both the ion gun 7 and the hollow cathode 8 are arranged inside the drawer mechanism chamber 51. Portion 56 can be moved. At this time, the gate valve 52 can be closed and the bonding chamber 2 can be isolated from the drawer mechanism chamber 51.

  Another embodiment of the joining apparatus maintenance method according to the present invention is executed using a joining apparatus provided with a drawer mechanism 41. As shown in FIG. 7, the user first removes the fixing bolt 49 from the joining device in the state shown in FIG. 4 after the room temperature joining method using the joining device is completed (step S11). At this time, the sealing surface of the lid 46 is pressed against the sealing surface of the flange 45 by atmospheric pressure, and the inside of the bonding chamber 2 is maintained in a vacuum atmosphere.

  Next, the user attaches the joining device maintenance jig 43 to the main body portion 42. That is, the user first fixes the gate valve 52 to the flange 45 so that the seal surface of the gate valve 52 is in close contact with the seal surface of the flange 45 of the main body portion 42 (step S12). The user further opens the gate valve 52 and fixes the rod 58 to the lid 46. The user fixes the fixed portion 42 to the gate valve 52 so that the seal surface of the gate valve 52 is in close contact with the seal surface of the fixed portion 42 of the drawer mechanism chamber 51 (step S13).

  After attaching the joining device maintenance jig 43 to the main body portion 42, the user evacuates the inside of the drawing mechanism chamber 51 and generates a vacuum atmosphere inside the drawing mechanism chamber 51 (step S14). After generating a vacuum atmosphere inside the extraction mechanism chamber 51, the user moves the movable part 56 using the ball screw 53 and arranges the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step) S15). The user closes the gate valve 52 after arranging the ion gun 7 and the hollow cathode 8 inside the extraction mechanism chamber 51 (step S16). After closing the gate valve 52, the user introduces air or nitrogen gas into the inside of the drawer mechanism chamber 51, and opens the drawer mechanism chamber 51 to the atmosphere (step S17).

  After the extraction mechanism chamber 51 is opened to the atmosphere, for example, the user removes the bellows 57 from the fixed portion 55, removes the ion gun 7 and the hollow cathode 8 from the lid 46, and removes the ion gun 7 from the inside of the extraction mechanism chamber 51 to the environment. And the hollow cathode 8 are taken out. The user maintains the extracted ion gun 7 and hollow cathode 8 (step S18). As the maintenance, the electrode provided in the ion gun 7 is replaced with another electrode, the orifice of the gas distributor provided in the ion gun 7 is replaced with another orifice, and as the maintenance, the electrode provided in the hollow cathode 8 is replaced with another electrode. Exchanging with an electrode is illustrated.

  The user attaches the maintained ion gun 7 and the hollow cathode 8 to the lid 46, attaches the bellows 57 to the fixed portion 55, and reassembles the drawer mechanism chamber 51. After assembling the drawer mechanism chamber 51, the user evacuates the inside of the drawer mechanism chamber 51 and generates a vacuum atmosphere inside the drawer mechanism chamber 51 (step S19). The user opens the gate valve 52 after the vacuum atmosphere is generated inside the drawer mechanism chamber 51 (step S20). After the gate valve 52 is opened, the user moves the movable portion 56 using the ball screw 53 so that the sealing surface of the lid 46 is in close contact with the sealing surface of the flange 45 (step S21). At this time, the ion gun 7 and the hollow cathode 8 move together with the lid 46 and are arranged at predetermined positions in the bonding chamber 2.

  After the bonding chamber 2 is sealed with the lid 46, the user introduces air or nitrogen gas into the drawing mechanism chamber 51 and opens the drawing mechanism chamber 51 to the atmosphere (step S22). After the drawer mechanism chamber 51 is opened to the atmosphere, the user removes the joining device maintenance jig 43 from the main body portion 42 (step S23). That is, the user removes the fixed portion 42 from the gate valve 52, removes the rod 58 from the lid 46, and removes the gate valve 52 from the flange 45.

  After the joining device maintenance jig 43 is removed from the main body portion 42, the user fixes the lid 46 to the flange 45 using the fixing bolt 49 (step S24).

  According to such a bonding apparatus maintenance method, the bonding apparatus can maintain the ion gun 7 or the hollow cathode 8 faster without increasing the pressure inside the bonding chamber 2. According to such a bonding apparatus maintenance method, the floor area where the bonding apparatus is arranged is further reduced by the amount of the bonding apparatus maintenance jig 43 when the bonding apparatus is executing the room temperature bonding method. be able to. According to such a bonding apparatus maintenance method, the main body portions of the plurality of bonding apparatuses 1 can be manufactured with respect to one bonding apparatus maintenance jig 43. At this time, the plurality of bonding apparatuses 1 can maintain the ion gun 7 by using one bonding apparatus maintenance jig 43, and the manufacturing cost of the apparatus can be reduced.

  In another embodiment of the bonding apparatus according to the present invention, the drawer mechanism 41 in the above-described embodiment is replaced with another drawer mechanism. The drawing mechanism 71 includes a drawing mechanism chamber 72, a gate valve 73, and a pneumatic cylinder 74, as shown in FIG. The drawer mechanism chamber 72 is a container that isolates the interior from the environment. The drawer mechanism chamber 72 includes a fixed portion 75, a movable portion 76, and a bellows 77. The fixed portion 75 forms a part of the partition wall of the drawer mechanism chamber 72 and is fixed to the gate valve 73. The movable portion 76 forms a part of the partition wall of the drawer mechanism chamber 72 and is supported so as to be movable in parallel with the fixed portion 75. The movable part 76 further supports the ion gun 7. The bellows 77 forms a part of the partition wall of the drawer mechanism chamber 72 and is joined to the fixed portion 75 and the movable portion 76. The bellows 77 is deformed when the movable portion 76 is translated, thereby isolating the inside of the drawer mechanism chamber 72 from the environment.

  The drawing mechanism chamber 72 further includes an ion gun connector 78 and a hollow cathode connector 79. The ion gun connector 78 is disposed on the lid 46 and is used when an external device disposed in the environment and the ion gun 7 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. The hollow cathode connector 79 is disposed on the lid 46 and is used when an external device disposed in the environment and the hollow cathode 8 are connected by piping and wiring while the inside of the bonding chamber 2 is isolated from the environment. .

  The drawer mechanism chamber 72 further includes an intake valve, an exhaust valve, and a pressure gauge (not shown). The intake valve is arranged in the middle of the flow path connecting the environment to the extraction mechanism chamber 72, and the opening degree of the flow path is changed to supply the atmosphere to the extraction mechanism chamber 72. The exhaust valve is disposed in the middle of the flow path connecting the vacuum pump to the drawing mechanism chamber 72, and the opening degree of the flow path is changed to generate a vacuum atmosphere inside the drawing mechanism chamber 72. The pressure gauge measures the pressure inside the drawer mechanism chamber 72.

  The gate valve 73 is interposed between the bonding chamber 2 and the drawing mechanism chamber 72. The gate valve 73 closes or opens a gate connecting the inside of the bonding chamber 2 and the inside of the drawing mechanism chamber 72.

  The pneumatic cylinder 74 includes a guide 81, a main body portion 82, and a rod 83. The guide 81 is formed as a linear rail and is fixed to a fixed portion 75 of the drawer mechanism chamber 72. The guide 81 supports the movable part 76 of the drawer mechanism chamber 72 on the guide 81 so as to be movable in parallel. The main body portion 82 is fixed to the guide 81 and is fixed to the fixed portion 75 of the drawer mechanism chamber 72. The main body portion 82 drives the rod 83 with respect to the guide 81 using the supplied air pressure. The rod 83 is fixed to the movable part 76 of the drawer mechanism chamber 72. That is, the pneumatic cylinder 74 translates the movable portion 76 of the drawer mechanism chamber 72 by the user.

  The extraction mechanism 71 can move the movable portion 76 of the extraction mechanism chamber 72 such that both the ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. At this time, the gate valve 73 can be closed, and the bonding chamber 2 can be isolated from the drawer mechanism chamber 72.

  In such a bonding apparatus, the room temperature bonding method is executed in the state of FIG. 8 in the same manner as the bonding apparatus 1 in the above-described embodiment. That is, such a bonding apparatus can irradiate the substrate with an argon ion beam more reliably in the same manner as the bonding apparatus 1, and can more reliably bond the substrate at room temperature.

  In such a joining apparatus, the ion gun 7 and the hollow cathode 8 are maintained in the same manner as the joining apparatus 1 in the above-described embodiment. That is, after the room temperature bonding method is completed, the user first moves the movable portion 76 using the pneumatic cylinder 74 so that the entire ion gun 7 and the hollow cathode 8 are disposed inside the extraction mechanism chamber 72. Let The user closes the gate valve 73 after the ion gun 7 and the hollow cathode 8 are entirely disposed inside the extraction mechanism chamber 72. After closing the gate valve 73, the user introduces air or nitrogen gas into the inside of the drawing mechanism chamber 72 to open the drawing mechanism chamber 72 to the atmosphere. After releasing the drawing mechanism chamber 72 to the atmosphere, the user removes the bellows 77 from the fixed portion 75 of the drawing mechanism chamber 72 and takes out the ion gun 7 and the hollow cathode 8 from the inside of the drawing mechanism chamber 72 to the environment. The user maintains the removed ion gun 7 and hollow cathode 8.

  The user fixes the maintained ion gun 7 and the hollow cathode 8 to the movable part 76 of the extraction mechanism chamber 72 and attaches the bellows 77 to the fixed part 75. The user evacuates the inside of the drawing mechanism chamber 72 and generates a vacuum atmosphere inside the drawing mechanism chamber 72. The user opens the gate valve 73 and moves the movable portion 76 of the drawing mechanism 71 using the pneumatic cylinder 74 to move the ion gun 7 and the hollow cathode 8 to the bonding chamber 2. The user further fixes the movable portion 76 to the fixed portion 75 so that the ion gun 7 and the hollow cathode 8 are arranged at predetermined positions in the bonding chamber 2.

  According to such a bonding apparatus maintenance method, the bonding apparatus provided with the drawer mechanism 71 can be connected to the ion gun 7 without increasing the pressure in the bonding chamber 2 in the same manner as the bonding apparatus 1 in the above-described embodiment. The hollow cathode 8 can be maintained more quickly.

  Note that the extraction mechanism chamber may include a hatch through which the ion gun 7 and the hollow cathode 8 can pass. At this time, the extraction mechanism chamber does not need to be disassembled when the ion gun 7 and the hollow cathode 8 are extracted from the extraction mechanism chamber, and the ion gun 7 and the hollow cathode 8 can be extracted more easily.

The bonding apparatus according to the present invention can more reliably irradiate the irradiation target with the particles, and can more quickly maintain the gun that discharges the particles.
According to the joining apparatus maintenance method according to the present invention, the joining apparatus that can irradiate the irradiation target with the particles more reliably can maintain the gun that releases the particles more quickly.

Claims (13)

A gun that emits particles,
A vacuum chamber in which an atmosphere from which the particles are released is generated;
A drawer mechanism chamber;
A gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber;
The gun is supported so as to be movable through the gate valve. In claim 1,
A lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber;
The gun is fixed to the lid. In either Claim 1 or Claim 2,
Other guns that emit particles into the atmosphere generated inside the vacuum chamber;
Other drawer mechanism chambers;
And further comprising another gate valve for opening and closing between the vacuum chamber and the other drawer mechanism chamber,
The other gun is supported movably through the other gate valve so as to be disposed inside the other drawer mechanism chamber. In either Claim 1 or Claim 2,
Further comprising another gun for releasing particles into the atmosphere created inside the vacuum chamber;
The other gun is movably supported through the gate valve so as to be disposed inside the drawer mechanism chamber. In either claim 3 or claim 4,
The other gun is a hollow cathode that supplies the particles to the gun. In any one of claims 1 to 5,
The drawer mechanism chamber includes:
A fixed portion fixed to the vacuum chamber;
A movable part movable relative to the fixed part;
Comprising a bellows disposed between the fixed part and the movable part;
The gun is fixed to the movable part. Moving the gun emitting particles from the vacuum chamber to the extraction mechanism chamber;
Closing a gate valve disposed between the vacuum chamber and the drawer mechanism chamber when the gun is disposed inside the drawer mechanism chamber. In claim 7,
When the gun is supported inside the vacuum chamber through a lid that seals the vacuum chamber, further comprising the step of reducing the pressure inside the drawer mechanism chamber and opening the gate valve;
The gun is moved together with the lid from the vacuum chamber to the drawer mechanism chamber. In claim 7,
A joining apparatus maintenance method, further comprising: attaching the drawer mechanism chamber to the gate valve. In claim 7,
A joining apparatus maintenance method, further comprising: attaching the drawing mechanism chamber and the gate valve to the vacuum chamber. In claim 7,
A joining apparatus maintenance method, further comprising: releasing the particles using the gun while the gate valve is opened. A gun that emits particles,
A vacuum chamber in which an atmosphere from which the particles are released is generated;
A lid for sealing the vacuum chamber when the gun is disposed inside the vacuum chamber;
The gun is a joining device maintenance jig attached to the joining device fixed to the lid,
A drawer mechanism chamber;
A gate valve that opens and closes between the vacuum chamber and the drawer mechanism chamber;
A joining apparatus maintenance jig comprising: a movable part that supports the gun so as to be movable so as to pass through the gate valve. A gun that emits particles,
A vacuum chamber in which an atmosphere from which the particles are released is generated;
A lid that seals the vacuum chamber when the gun is disposed within the vacuum chamber;
A gate valve,
The gun is a joining device maintenance jig attached to the joining device fixed to the lid,
A drawer mechanism chamber;
A movable part that supports the gun movably through the gate valve;
The gate valve opens and closes between the vacuum chamber and the drawer mechanism chamber.

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