WO2010016306A1 - 超音波ボンディング用アルミニウムリボン - Google Patents
超音波ボンディング用アルミニウムリボン Download PDFInfo
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- WO2010016306A1 WO2010016306A1 PCT/JP2009/058545 JP2009058545W WO2010016306A1 WO 2010016306 A1 WO2010016306 A1 WO 2010016306A1 JP 2009058545 W JP2009058545 W JP 2009058545W WO 2010016306 A1 WO2010016306 A1 WO 2010016306A1
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- ribbon
- aluminum
- bonding
- mass
- ultrasonic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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Definitions
- the present invention relates to an aluminum ribbon for connecting a semiconductor element and a substrate side lead portion by ultrasonic bonding in an electronic component and a semiconductor package.
- a tape having a substantially rectangular cross section The bonding method using the conductor (hereinafter referred to as “ribbon”) is widely used.
- This method is an application of an ultrasonic wire bonding method using an aluminum conductive wire, and a load and ultrasonic vibration are applied to the aluminum ribbon to form a nanometer (nm) naturally formed on the surface of the aluminum ribbon.
- This practical aluminum ribbon has been produced by the following general thin tape processing method as follows.
- a thin plate material made of an aluminum alloy that has been roll-rolled into a thin plate in advance is cut into a predetermined width and length by a cutting device such as a rotary cutter or a press machine.
- a thin plate material made of an aluminum alloy is further rolled into a thin tape shape and finally formed into an aluminum ribbon having a predetermined shape.
- the second method is to remove both ends of the tape-shaped material (a ratio of the width to the thickness is about 25) made of an aluminum alloy roll-rolled to a final ultra-thin tape state by slitting or a press machine. This is formed as an aluminum ribbon having a final predetermined width shape.
- an aluminum ribbon made of an aluminum alloy having a purity of 99% by mass or more, the additive element and the balance being made of aluminum is softer than a general 99.99% by mass aluminum (Al) plate to be ultrasonically bonded. Therefore, horns and burrs are likely to appear on the cut or sheared surface of the aluminum ribbon, which remains on the ribbon end surface and catches on the guide or tool during bonding, or flakes and adheres to the surface of the roll and adheres to the surface of the bonding ribbon. Unevenness may occur. For this reason, the aluminum ribbon was ultrasonically bonded while being kept in the rolling state, but it requires a large amount of energy at the time of bonding, so the bonding conditions become unstable and the bonding strength is low. It was.
- Patent Document 1 discloses “a current path member formed in a substantially plate shape as an outer shape”.
- the shape of the connection strap may be other than a rectangular shape as in the above-described substantially plate shape or substantially band shape.
- these various shapes may be applied or used in appropriate combination.
- the connection strap described in Patent Document 1 has a bonding condition in which the connection portion has a planar shape and the position and size of the microscopic portion that contacts in the initial stage of bonding are not constant, so that the bonding strength is not stable. It does not solve the instability.
- Patent Document 2 discloses a bonding ribbon having an external characteristic that a plurality of convex portions whose top portions are substantially on the same plane are provided on one surface on the joining side. This is considered to be because friction between the ribbon and the adherend tends to occur by reducing the top area of the plurality of convex portions, and the oxide film formed on the surface can be easily broken. In this method, since initial plastic flow is easily generated, it is considered that stable bonding strength can be secured by a relatively small load and ultrasonic energy as compared with a ribbon having a flat bonding surface.
- the aluminum ribbon for ultrasonic bonding of the present invention is an aluminum ribbon for ultrasonic bonding composed of an aluminum alloy having a purity of 99% by mass or more, wherein the additive element and the balance are aluminum.
- the ribbon has an ultrathin tape structure rolled after multi-stage drawing, the average value of the crystal grain size in the cross section of the ribbon is 5 to 200 micrometers ( ⁇ m), and the ultrathin
- the surface of the tape is characterized by a mirror finish with a surface roughness of R z ⁇ 2 micrometers ( ⁇ m).
- the additive element is a total of 5 to 700 ppm by mass of at least one of nickel (Ni), silicon (Si), magnesium (Mg), and copper (Cu).
- the additive element is 10 to 300 ppm by mass of nickel (Ni).
- the balance of aluminum is aluminum (Al) having a purity of 99.99% by mass or more and impurities of less than 0.01% by mass, and the balance of aluminum is aluminum having a purity of 99.999% by mass or more (Al ) And less than 0.001% by mass of impurities.
- the inventors of the present invention have made the present invention by paying attention to the influence of the crystal structure of the aluminum ribbon on the bonding mechanism during ultrasonic bonding.
- the internal crystal structure of the ultra-thin tape that has been rolled after multi-stage drawing is a processed fiber structure, the crystal grain size is 1 micrometer ( ⁇ m) or less, and the crystal grains of the aluminum ribbon are observed with a normal microscope. I can't do it. Even if this ultra-thin tape is subjected to low-temperature heat treatment for strain removal, the processed fiber structure does not change.
- an aluminum ribbon with such a crystal structure is to be bonded to a bonding pad by micro vibrations using ultrasonic waves, the aluminum ribbon is hard as it is rolled and requires a lot of energy during bonding, but its bonding strength is high. Low. This is because the transmission speed of ultrasonic waves in the processed fiber structure is high, but the material is too hard to promote the deformation of the joint interface.
- the ultra-thin tape that has been rolled and rolled after this multi-stage drawing is heat-treated at an appropriate temperature, it can be tempered to a hardness at which the joining interface of the aluminum ribbon is sufficiently plastically deformed by the energy during bonding.
- it can be tempered to a hardness at which the joining interface of the aluminum ribbon is sufficiently plastically deformed by the energy during bonding.
- by homogenizing the crystal grain size microscopic defects such as internal strain are eliminated, and the transmission of ultrasonic waves and load becomes uniform, resulting in joint strength variations at each joint (joint strength variation is reliability This produces an effect of reducing the bonding strength after the test (HAST).
- HAST bonding strength after the test
- the present inventors have found, reproduced, and confirmed the control of the crystal structure and the optimum grain size region in the aluminum ribbon. In such a crystal structure, it can be said that the balance between the deformation of the bonding interface due to the load contributing to the bonding strength and the removal of the surface oxide film at the bonding interface by the
- the heat treatment conditions that bring about a region in which the crystal grain size develops uniformly are not uniformly determined depending on the material and shape of the aluminum ribbon.
- a general aluminum ribbon composed of an aluminum alloy having a purity of 99% by mass or more in which the additive element and the balance are made of aluminum
- the temperature is 250 to 400 ° C. for 30 to 90 minutes.
- Time is a measure for precipitating the crystal grain size in the aluminum ribbon of the present invention.
- the heat treatment temperature tends to be lower and the heat treatment time tends to be shorter.
- the general heat treatment temperature is The heat treatment time is 10 to 60 minutes at 200 to 250 ° C.
- the heat treatment atmosphere is sufficient in the air.
- the heat treatment temperature is 180 ° C. or less
- the crystal structure of an aluminum ribbon made of an aluminum alloy having a purity of 99% by mass or more remains a processed fiber structure even over time, and the average crystal grain size in the cross section of the aluminum ribbon Since the value does not become coarse up to 5 micrometers ( ⁇ m), it is not preferable.
- the ribbon itself has a high hardness, and the plastic deformation at the joint interface is insufficient.
- the unrecrystallized portion remains, so that the recrystallized portion and the non-recrystallized portion at the ribbon interface at the time of ultrasonic bonding Variations in the thickness of the material cause variations in bonding strength.
- the thickness of the aluminum ribbon is preferably in the range of 10 micrometers ( ⁇ m) to 1 mm from the viewpoint of the optimum balance between the ultrasonic wave and the load.
- the aspect ratio (width direction / thickness direction) of the crystal grain size is 0.5 to 10 in the present invention. Those having better bonding strength in the range can be obtained, and even when the aluminum ribbon is cut after the second ultrasonic bonding of the aluminum ribbon, a more stable one can be obtained.
- the aspect ratio is measured by measuring the crystal grain size in the width direction / thickness direction as seen from the length direction of the ribbon.
- the ratio of the width to the preferred thickness of the aluminum ribbon is in the range of 7-16.
- the width and thickness of typical aluminum ribbons are as shown in Table 1 below.
- an aluminum ribbon forms an oxide film having a surface layer of aluminum having a thickness of about 1 nanometer (nm) even at room temperature due to oxygen in the atmosphere.
- this oxide film is thin and has nothing to do with the bonding strength.
- the amount of aluminum oxide increases as the surface area increases. Since aluminum oxide does not contribute to the bonding, the bonding strength at the time of ultrasonic bonding may vary due to a change in the amount of oxide at the bonding interface.
- the inventors of the present invention have made the surface of the aluminum ribbon a mirror surface, and by reducing the amount of oxide surface unevenness at the bonding interface, the average value of the crystal grain size of the aluminum ribbon is 5 to 200 micrometers ( ⁇ m). It was found that the bonding strength can be stabilized with a low output of ultrasonic waves within the above range.
- the aluminum ribbon is more desirable as it has a mirror surface because the surface area on which the oxide is formed decreases, but the rough indication is that the surface roughness is R z ⁇ 2 micrometers ( ⁇ m).
- the average value of the crystal grain size of the aluminum ribbon is in the range of 5 to 200 micrometers ( ⁇ m), and the surface roughness is R z ⁇ 2 micron. This is because, if it is a meter ( ⁇ m), an Al alloy having a purity of 99% by mass or more is soft, so that microvoids can be avoided and a stable bonding strength can be obtained. More preferably, the surface roughness is R z ⁇ 1.6 micrometers ( ⁇ m).
- the structure of the aluminum ribbon in the present invention is an aluminum alloy having a total purity of 99% by mass or more, and the additive element and the balance are made of aluminum.
- Elements that can be accepted as additive elements include nickel (Ni), silicon (Si), magnesium (Mg), copper (Cu), boron (B), indium (In), lithium (Li), beryllium (Be), Examples include calcium (Ca), strontium (Sr), yttrium (Y), lanthanum (La), cerium (Ce), neodymium (Nd), and bismuth (Bi).
- Additive elements having a strong effect on the crystal grain size of the aluminum ribbon are nickel (Ni), silicon (Si), magnesium (Mg), and copper (Cu).
- the crystal grain size can be increased at a heat treatment temperature of 200 to 400 ° C. It can be developed uniformly.
- the remaining aluminum in the aluminum alloy having a purity of 99% by mass or more contains unavoidable impurities.
- the inevitable impurities are as small as possible.
- aluminum (Al) having a purity of 99.99% by mass or more is preferably used as a master alloy.
- aluminum (Al) has a purity of 99.99% by mass or more, the average value of the crystal grain size is 5 to 200 micrometers at a heat treatment temperature of 200 to 400 ° C., regardless of the type and amount of the combination of the above additive elements. It develops uniformly within the range of ( ⁇ m). Of course, aluminum (Al) having a purity of 99.999% by mass or more is more preferable as a mother alloy.
- the alloy composition shown in Table 2 (aluminum (Al) having a purity of 99.999% by mass was used as the preparation raw material, but aluminum (Al) having a purity of 99.99% by mass had similar results) and wire.
- Bonding ribbons of Examples 1 to 20 and Comparative Examples 1 to 5 shown in Table 2 were prepared using a diameter bonding wire as a starting material. These bonding ribbons are one-step heat-treated using a rolling device (not shown) and heat-treated at a predetermined temperature shown in Table 2.
- Examples 1 to 20 and Comparative Examples 1 to 5 of the present invention thus obtained were ultrasonically bonded to an Al plate (thickness 5 mm) having a purity of 99.99% by mass under the conditions of the following number and size. Then, HAST (High Acceleration Life Test) was performed to examine the bonding strength. The determination results are also shown in Table 2.
- the conditions for ultrasonic bonding are as follows.
- the ribbon length of the bonding ribbon shown in Table 1 was 10 mm, and the height of the ribbon was 0.6 mm.
- Ultrasonic bonding was performed on an aluminum (Al) plate (thickness 5 mm) having a purity of 99.99 mass% using a fully automatic ribbon bonder 3600R type manufactured by Orthodyne.
- the bonding conditions were such that the load and supersonic conditions were adjusted so that the crushing width was 1.2 times the ribbon width at a frequency of 80 kHz.
- the pitch interval was 0.6 mm.
- the number was 50 each. Bonding tools and bonding guides are orthodyne matched to each ribbon size. Electronics Co.) was used. In contrast to the examples that had been subjected to the predetermined heat treatment, those that were not heat-treated and those that were heat-treated at 380 ° C. were used as comparative examples.
- HAST Highly Accelerated Life Test
- HAST is a test standardized by IEC 68-2-66 as an environmental test.
- PC-442R8D manufactured by Hirayama Seisakusho, it was allowed to stand for 96 hours at 85 ° C. and a humidity of 85% Rh.
- the evaluation was characterized by the value obtained by dividing the bond strength (gf) after the initial HAST by the bond strength (gf) immediately after bonding (before HAST).
- the shear strength used was a bond tester PC4000 type manufactured by DAGE.
- the shear test height was 10 micrometers ( ⁇ m), and the shear rate was 150 micrometers ( ⁇ m) / sec.
- the average value of the crystal grain size was calculated as follows.
- the ribbon of Al ribbon embedded in the resin is exposed by polishing, the cross section of the ribbon is exposed by chemical etching, the cross section is crystallized, observed with SEM ( ⁇ 500 times), photographed, and a straight line 3 in the thickness direction of the observed photograph A value obtained by dividing the ribbon thickness ( ⁇ m) by the number of crystals through which the straight lines pass was obtained, and the average value of the three was taken as the average particle diameter.
- the aluminum ribbons of the examples and comparative examples have contact surfaces in which the contact surfaces with the electrodes are arranged such that a plurality of bonding wires are arranged at equal intervals. It was joined with.
- the joints of Examples 1 to 20 showed uniform joint marks on the entire joint surface.
- Comparative Example 5 almost no joint marks were observed.
- the joining marks at the joining portions of Comparative Examples 1 to 4 were uneven and insufficient.
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Abstract
Description
この方法は、アルミニウムの導電性ワイヤを用いる超音波ワイヤボンディング方法を応用したもので、アルミニウムリボンに荷重および超音波振動を加えて、アルミニウムリボンの表面に自然に形成された1ナノメートル(nm)程度の酸化膜を破ってアルミニウム(Al)等の金属原子を表面に露出させ、アルミニウム(Al)やニッケル(Ni)等のボンディングパッドとアルミニウムリボンとの界面に塑性流動を発生させて互いに密着する新生面を漸増させながら原子間結合させることにより接合する。
第一の方法は、予め薄肉の板状にロール圧延されたアルミニウム合金からなる薄板材を、例えばロータリーカッターのような切断装置やプレス機械によって、所定の幅と長さに切り出し、この切り出されたアルミニウム合金からなる薄板材をさらに薄テープ状に圧延加工し、最終的に所定の形状のアルミニウムリボンとして成形されるものである。
第二の方法は、最終的な極薄のテープ状態までロール圧延したアルミニウム合金からなるテープ状素材(厚さに対する幅の比は25程度)の両端耳部をスリッター加工やプレス機械などによって取り除き、最終的な所定幅形状のアルミニウムリボンとして成形するものである。
このためボンディングリボンのボンディング条件を安定させ、安定したボンディング強度(接合強度)を得ようとして、様々な形状のボンディングリボンが考えられた(特許文献1、特許文献2参照)。
このようにボンディングリボンの外形的な形状を変化させる従来のやり方では、微視的部分の同一個所を何万回も同一条件で接合することが困難で、接合強度が高くかつ安定したものを得ることができなかった。
今回、本発明者らはアルミニウムリボンにおける結晶組織の制御および最適粒径サイズ領域を見出し、再現・確認した。このような結晶組織では、接合強度に寄与する荷重による接合界面の変形、および超音波による接合界面での表面酸化膜を除去するバランスが良いといえる。
熱処理温度が180℃以下の場合は、時間をかけても純度99質量%以上のアルミニウム合金からなるアルミニウムリボンの結晶組織が加工繊維組織のままであり、アルミニウムリボンの断面内における結晶粒径の平均値が5マイクロメートル(μm)まで粗大化しないので好ましくない。この本領域では、リボン自体の硬さが高く、接合界面の塑性変形が不十分となる。また、平均値が5マイクロメートル(μm)未満となるこのような熱処理条件下では、未再結晶部が残存してしまうため、超音波ボンディング時のリボン界面における再結晶部と未再結晶部との変形がばらつき、接合強度のバラツキの原因となる。
また、一般的に、アルミニウムリボンの厚さは、超音波と荷重の最適なバランスの観点から、好ましくは10マイクロメートル(μm)~1mmの範囲である。
アルミニウムリボンは鏡面であればあるほど酸化物を形成する表面積が減少するので望ましいが、その目安は表面粗さがRz≦2マイクロメートル(μm)である。アルミニウムリボンの超音波ボンディングでは10~120Hzの高周波が使用されるので、アルミニウムリボンの結晶粒径の平均値が5~200マイクロメートル(μm)の範囲内で、表面粗さがRz≦2マイクロメートル(μm)であれば、純度99質量%以上のAl合金は軟らかいのでマイクロボイドを避けることができ、安定したボンディング強度が得られるからである。より好ましくは表面粗さがRz≦1.6マイクロメートル(μm)である。
添加元素として許容され得る元素には、ニッケル(Ni)、シリコン(Si)、マグネシウム(Mg)、銅(Cu)、ホウ素(B)、インジウム(In)、リチウム(Li)、ベリリウム(Be)、カルシウム(Ca)、ストロンチウム(Sr)、イットリウム(Y)、ランタン(La)、セリウム(Ce)、ネオジウム(Nd)、ビスマス(Bi)などの元素を挙げることができる。アルミニウムリボンの結晶粒径に対して効き目の強い添加元素はニッケル(Ni)、シリコン(Si)、マグネシウム(Mg)および銅(Cu)である。純度99質量%以上のアルミニウム合金であれば、これらの許容され得る添加元素の内の少なくとも1種を合計で5~700質量ppm含んでいれば、200~400℃の熱処理温度で結晶粒径が均一に発達させることができる。
純度99質量%以上のアルミニウム合金における残部のアルミニウムには不可避的不純物が含まれる。しかし、不可避的不純物がアルミニウム(Al)元素に及ぼす影響は定かでないので、不可避的不純物はできるだけ少ないことが好ましい。アルミニウムリボンの結晶粒径が均一に発達する領域を安定的にもたらすには、母合金として純度99.99質量%以上のアルミニウム(Al)であることが好ましい。純度99.99質量%以上のアルミニウム(Al)であれば、上記の添加元素の組み合わせの種類や量によらず、200~400℃の熱処理温度で結晶粒径の平均値が5~200マイクロメートル(μm)の範囲内で均一に発達する。母合金として純度99.999質量%以上のアルミニウム(Al)であれば、より好ましいのはもちろんである。
また、丸線から極薄テープまで圧延するときは、ロール圧延は一段階ないし二段階でなされることが好ましい。圧延回数が三段階以上でおこなわれたアルミニウム(Al)リボンをボンディングした場合、接合強度が安定しない現象が見られたからである。このボンディング時の接合強度のバラツキは、圧延組織が更にしごかれる結果、組織内部のひずみが大きくなり、圧延後の熱処理によっても結晶粒が粗大化しない部分が発生し、結晶粒径が不均一になるためと考えられる。このため一段階で圧延した場合が最も接合強度のバラツキが少ない結果が得られた。
表2に示す合金組成(調合原料のアルミニウムは純度99.999質量%のアルミニウム(Al)を用いたが、純度99.99質量%のアルミニウム(Al)も同様な結果であった。)および線径のボンディングワイヤを出発材料として用い、表2に示すボンディングリボンの実施例1~20および比較例1~5を準備した。これらのボンディングリボンは圧延装置(図示しない)を用いて一段階熱処理をし、表2に示す所定の温度で熱処理をしたものである。
表1に示すボンディングリボンのリボン長は10mmとし、リボンの高さを0.6mmにした。
オーソダイン社製全自動リボンボンダ3600R型にて、純度99.99質量%のアルミニウム(Al)板(厚さ5mm)上に超音波ボンディングを実施した。ボンディング条件は、80kHzの周波数で、潰れ幅がリボン幅の1.2倍になるよう荷重および超音条件を調整した。ピッチ間隔は、0.6mmにした。個数は各々50個とした。ボンディングツールおよびボンディングガイドは、各リボンサイズに合致したオーソダイン(Orthodyne
Electronics Co.)社製のものを使用した。
所定の熱処理をした実施例に対し、熱処理をしないものおよび380℃の熱処理をしたものを比較例とした。
平山製作所製HAST装置(PC-442R8D)にて、85℃ラ湿度85%Rhで96時間放置した。評価は初期のHAST後の接合強度(gf)をボンディング直後(HAST前)の接合強度(gf)で除した値を特性とした。
結晶粒径の平均値は、次ぎのようにして算出した。
樹脂に埋め込んだAlリボンを、研磨によりリボン断面を露出させ、ケミカルエッチングにより断面の結晶出しを行い、SEM(×500倍)にて観察し写真に撮り、観察写真の厚さ方向に直線を3本引き、各直線が通る結晶の数でリボン厚さ(μm)を除した値を求め、3本の平均値を平均粒径とした。
シェア試験後にアルミニウムリボンを溶解・はく離して接合個所を観察したところ、実施例1~20の接合個所は接合面全体が均質な接合痕を呈していた。一方、比較例5はほとんど接合痕がみられなかった。また、比較例1~4の接合個所の接合痕は不均一で不十分なものであった。
Claims (5)
- 添加元素および残部がアルミニウムからなる純度99質量%以上のアルミニウム合金から構成されている超音波ボンディング用アルミニウムリボンであって、このリボンは、多段伸線後ロール圧延された極薄テープ構造であり、このリボンの断面内における結晶粒径の平均値が5~200マイクロメートル(μm)であり、かつ、この極薄テープの表面は、表面粗さがRz≦2マイクロメートル(μm)の鏡面仕上げがされていることを特徴とする超音波ボンディング用アルミニウムリボン。
- 添加元素が、ニッケル(Ni)、シリコン(Si)、マグネシウム(Mg)および銅(Cu)のうちの少なくとも1種を合計で5~700質量ppmからなるものである請求項1に記載の超音波ボンディング用アルミニウムリボン。
- 添加元素が10~300質量ppmのニッケル(Ni)である請求項1に記載の超音波ボンディング用アルミニウムリボン。
- 残部のアルミニウムが、純度99.99質量%以上のアルミニウム(Al)と0.01質量%未満の不純物である請求項1に記載の超音波ボンディング用アルミニウムリボン。
- 残部のアルミニウムが、純度99.999質量%以上のアルミニウム(Al)と0.001質量%未満の不純物である請求項1に記載の超音波ボンディング用アルミニウムリボン。
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CN110557903A (zh) * | 2019-09-05 | 2019-12-10 | 深圳市星河电路股份有限公司 | 一种pcb超高金线邦定值加工方法 |
JP2022025955A (ja) * | 2020-07-30 | 2022-02-10 | 住友化学株式会社 | アルミニウム部材およびその製造方法 |
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- 2009-05-01 CN CN2009801000218A patent/CN101828257B/zh active Active
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US20110121458A1 (en) * | 2009-09-30 | 2011-05-26 | Infineon Technologies Ag | Bonding Connection Between a Bonding Wire and a Power Semiconductor Chip |
US8541892B2 (en) * | 2009-09-30 | 2013-09-24 | Infineon Technologies Ag | Bonding connection between a bonding wire and a power semiconductor chip |
Also Published As
Publication number | Publication date |
---|---|
JP2010040763A (ja) | 2010-02-18 |
EP2315240A1 (en) | 2011-04-27 |
JP4212641B1 (ja) | 2009-01-21 |
CN101828257A (zh) | 2010-09-08 |
MY150372A (en) | 2013-12-31 |
CN101828257B (zh) | 2011-11-16 |
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