SG179071A1 - Aluminum ribbon for ultrasonic bonding - Google Patents

Aluminum ribbon for ultrasonic bonding

Info

Publication number
SG179071A1
SG179071A1 SG2012016788A SG2012016788A SG179071A1 SG 179071 A1 SG179071 A1 SG 179071A1 SG 2012016788 A SG2012016788 A SG 2012016788A SG 2012016788 A SG2012016788 A SG 2012016788A SG 179071 A1 SG179071 A1 SG 179071A1
Authority
SG
Singapore
Prior art keywords
ribbon
ultrasonic bonding
aluminum
err
solvent
Prior art date
Application number
SG2012016788A
Inventor
Michitaka Mikami
Teruo Kikuchi
Shinichiro Nakashima
Yuichi Hirata
Masaharu Nakamura
Keisuke Kimura
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG179071A1 publication Critical patent/SG179071A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/4383—Reworking
    • H01L2224/43847—Reworking with a mechanical process, e.g. with flattening of the connector
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/0102—Calcium [Ca]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01049—Indium [In]
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    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Chemical & Material Sciences (AREA)
  • Wire Bonding (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)

Abstract

Aluminum Ribbon for Ultrasonic Bonding[Problem to be solved] The invention provides a bonding ribbon which can guarantee a uniform fusing over the entire joint area throughout hundreds of thousands of continuous ultrasonic bonding cycles and which can realize an improved bonding strength and which also can avoid being broken while it is looped.[Solution] The aluminum ribbon for ultrasonic bonding is formed of an aluminum alloy with aluminum content of 99 mass % or higher, and this ribbon is characterized in that it is in a shape of an extremely thin tape which is obtained by rolling a wire taken from a multi-stage wire drawing, that an average grain size within the cross section of this ribbon is 5 — 200 micrometers ([err]m), that the surface(s) of this extremely thin tape is mirror-finished to an extent that the surface roughness R[err] is 2 micrometers ([err]m) or smaller, and that the ribbon has been subjected to an immersion treatment or a gas-exposure treatment wherein the liquid or gas comprises a substance having a vapor pressure higher than water such as a water-soluble hydrocarbons solvent, an alcoholic solvent, a ketone solvent, or an ether type solvent.[Selected Drawing] None
SG2012016788A 2010-09-09 2010-09-09 Aluminum ribbon for ultrasonic bonding SG179071A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/065461 WO2012032629A1 (en) 2010-09-09 2010-09-09 Aluminum ribbon for ultrasonic bonding

Publications (1)

Publication Number Publication Date
SG179071A1 true SG179071A1 (en) 2012-04-27

Family

ID=45810253

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012016788A SG179071A1 (en) 2010-09-09 2010-09-09 Aluminum ribbon for ultrasonic bonding

Country Status (4)

Country Link
US (1) US20130164559A1 (en)
CN (1) CN102549731B (en)
SG (1) SG179071A1 (en)
WO (1) WO2012032629A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112015006049T5 (en) * 2015-01-26 2017-10-12 Mitsubishi Electric Corporation SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
JP7108533B2 (en) * 2018-12-27 2022-07-28 三洋電機株式会社 secondary battery
CN114237159B (en) * 2022-02-24 2022-07-12 深圳市大族封测科技股份有限公司 Welding arc automatic generation method and device, computer equipment and storage medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302811A (en) * 1994-05-10 1995-11-14 Hitachi Ltd Large current aluminum wire and semiconductor module using the aluminum wire
JP4516761B2 (en) * 2004-01-20 2010-08-04 富士フイルム株式会社 Aluminum plate embossing roll
JP2007065387A (en) * 2005-08-31 2007-03-15 Fujifilm Holdings Corp Infrared sensitive lithographic printing original plate
JP2007335782A (en) * 2006-06-19 2007-12-27 Fuji Electric Fa Components & Systems Co Ltd Semiconductor device module and manufacturing method thereof
CN101240420A (en) * 2007-02-07 2008-08-13 日产自动车株式会社 Surface-modified metal member and method of modifying metal surface
CN101971037A (en) * 2008-03-14 2011-02-09 富士胶片株式会社 Probe guard
JP4212641B1 (en) * 2008-08-05 2009-01-21 田中電子工業株式会社 Aluminum ribbon for ultrasonic bonding

Also Published As

Publication number Publication date
WO2012032629A1 (en) 2012-03-15
CN102549731A (en) 2012-07-04
CN102549731B (en) 2014-12-31
US20130164559A1 (en) 2013-06-27

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