WO2010013985A3 - 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 - Google Patents
박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 Download PDFInfo
- Publication number
- WO2010013985A3 WO2010013985A3 PCT/KR2009/004321 KR2009004321W WO2010013985A3 WO 2010013985 A3 WO2010013985 A3 WO 2010013985A3 KR 2009004321 W KR2009004321 W KR 2009004321W WO 2010013985 A3 WO2010013985 A3 WO 2010013985A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin
- manufacturing
- film transistor
- array substrate
- transistor array
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 10
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000010409 thin film Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/056,971 US8173457B2 (en) | 2008-08-01 | 2009-08-03 | Method and apparatus for manufacturing thin-film transistor array substrate |
CN2009801375863A CN102171605B (zh) | 2008-08-01 | 2009-08-03 | 用于制造薄膜晶体管阵列基板的方法和装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080075662A KR101499651B1 (ko) | 2008-08-01 | 2008-08-01 | 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 |
KR10-2008-0075662 | 2008-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010013985A2 WO2010013985A2 (ko) | 2010-02-04 |
WO2010013985A3 true WO2010013985A3 (ko) | 2010-06-10 |
Family
ID=41610878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/004321 WO2010013985A2 (ko) | 2008-08-01 | 2009-08-03 | 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8173457B2 (ko) |
KR (1) | KR101499651B1 (ko) |
CN (1) | CN102171605B (ko) |
TW (1) | TWI487032B (ko) |
WO (1) | WO2010013985A2 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050089381A (ko) * | 2004-03-04 | 2005-09-08 | 삼성에스디아이 주식회사 | 액티브 매트릭스형 표시 장치의 제조방법 |
KR101232736B1 (ko) * | 2009-10-01 | 2013-02-13 | 엘지디스플레이 주식회사 | 어레이 기판 |
US10028394B2 (en) * | 2012-12-17 | 2018-07-17 | Intel Corporation | Electrical interconnect formed through buildup process |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US8927069B1 (en) | 2013-10-02 | 2015-01-06 | Eritek, Inc. | Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
CN107073642B (zh) | 2014-07-14 | 2020-07-28 | 康宁股份有限公司 | 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法 |
HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
WO2018064409A1 (en) | 2016-09-30 | 2018-04-05 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
WO2018081031A1 (en) * | 2016-10-24 | 2018-05-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US20180118602A1 (en) * | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100557499B1 (ko) * | 2002-12-31 | 2006-03-07 | 엘지.필립스 엘시디 주식회사 | 패턴형성방법 및 이를 이용한 액정표시소자와 그 제조방법 |
KR20060108945A (ko) * | 2005-04-13 | 2006-10-18 | 삼성에스디아이 주식회사 | 박막 트랜지스터의 제조방법 및 이에 의해 제조된 박막트랜지스터 |
KR20080062647A (ko) * | 2006-12-29 | 2008-07-03 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그의 제조방법 |
KR20080064531A (ko) * | 2007-01-05 | 2008-07-09 | 삼성전자주식회사 | 게이트 구동회로 및 이를 포함하는 액정 표시 장치, 박막트랜지스터 기판의 제조 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050105422A (ko) * | 2004-05-01 | 2005-11-04 | 엘지.필립스 엘시디 주식회사 | 액정표시패널 및 그 제조 방법 |
KR101112547B1 (ko) * | 2005-01-18 | 2012-03-13 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 박막 트랜지스터 표시판의제조 방법 |
KR101211345B1 (ko) * | 2005-12-14 | 2012-12-11 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
-
2008
- 2008-08-01 KR KR1020080075662A patent/KR101499651B1/ko active IP Right Grant
-
2009
- 2009-07-31 TW TW098126000A patent/TWI487032B/zh not_active IP Right Cessation
- 2009-08-03 WO PCT/KR2009/004321 patent/WO2010013985A2/ko active Application Filing
- 2009-08-03 US US13/056,971 patent/US8173457B2/en not_active Expired - Fee Related
- 2009-08-03 CN CN2009801375863A patent/CN102171605B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100557499B1 (ko) * | 2002-12-31 | 2006-03-07 | 엘지.필립스 엘시디 주식회사 | 패턴형성방법 및 이를 이용한 액정표시소자와 그 제조방법 |
KR20060108945A (ko) * | 2005-04-13 | 2006-10-18 | 삼성에스디아이 주식회사 | 박막 트랜지스터의 제조방법 및 이에 의해 제조된 박막트랜지스터 |
KR20080062647A (ko) * | 2006-12-29 | 2008-07-03 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그의 제조방법 |
KR20080064531A (ko) * | 2007-01-05 | 2008-07-09 | 삼성전자주식회사 | 게이트 구동회로 및 이를 포함하는 액정 표시 장치, 박막트랜지스터 기판의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW201007852A (en) | 2010-02-16 |
CN102171605B (zh) | 2013-07-31 |
US20110143470A1 (en) | 2011-06-16 |
WO2010013985A2 (ko) | 2010-02-04 |
TWI487032B (zh) | 2015-06-01 |
CN102171605A (zh) | 2011-08-31 |
US8173457B2 (en) | 2012-05-08 |
KR20100013914A (ko) | 2010-02-10 |
KR101499651B1 (ko) | 2015-03-06 |
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