WO2010001772A1 - 反射防止構造を有する光学部品および前記光学部品の製造方法 - Google Patents
反射防止構造を有する光学部品および前記光学部品の製造方法 Download PDFInfo
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- WO2010001772A1 WO2010001772A1 PCT/JP2009/061441 JP2009061441W WO2010001772A1 WO 2010001772 A1 WO2010001772 A1 WO 2010001772A1 JP 2009061441 W JP2009061441 W JP 2009061441W WO 2010001772 A1 WO2010001772 A1 WO 2010001772A1
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- optical component
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- resist layer
- antireflection structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0018—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for preventing ghost images
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
- B29C2043/525—Heating or cooling at predetermined points for local melting, curing or bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0031—Refractive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0016—Lenses
- B29L2011/005—Fresnel lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/005—Arrays characterized by the distribution or form of lenses arranged along a single direction only, e.g. lenticular sheets
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
Definitions
- the present invention relates to an optical component such as a lens or a diffraction grating, and more particularly to an optical component in which a fine concavo-convex antireflection structure is formed on a light incident surface and a manufacturing method thereof.
- the incident surface is formed by laminating a plurality of thin films having different refractive indexes, or fine irregularities on the incident surface as described in Patent Documents 1 to 3 below. There is what formed.
- the anti-reflection structure with fine irregularities has the advantage that the light wavelength band that can prevent reflection can be broadened and the light transmittance can be increased compared to the case where a plurality of thin films are stacked.
- a manufacturing method for forming an antireflection structure having a fine concavo-convex pattern on an incident surface of an optical component forms a resist layer on a mold surface, and partially exposes and develops the resist layer according to the concavo-convex pattern. Part of the resist layer. Then, the incident surface of the optical component is etched or milled at the portion where the resist layer has been removed to form a transfer pattern having fine irregularities on the surface of the mold. When an optical component is formed using this mold, the antireflection structure is formed by transferring the transfer pattern onto the incident surface of the optical component.
- the present invention solves the above-described conventional problems, and prevents formation of a defect portion or the like at a boundary portion of a plurality of regions when an antireflection structure is formed on a light incident surface. Finally, it is an object of the present invention to provide an optical component that can keep the reflectance of light on the incident surface constantly high and a method for manufacturing the same.
- the present invention provides an optical component in which an antireflection structure is formed on a surface on which light enters or exits.
- the surface is divided into a plurality of regions, and in each of the regions, a plurality of protrusions and a plurality of groove portions extending in parallel and linearly are alternately repeated and adjacent to each other. In the region, the extending direction of the protruding portion and the groove portion is different by 90 degrees.
- the antireflection structure is different by 90 degrees at the boundary between adjacent regions and at the boundary between adjacent regions and the portion where the protrusions extending in the direction different by 90 degrees are connected. And a portion where the groove portions extending in the direction to be connected are connected.
- each of the areas is a rectangle.
- the optical component manufacturing method of the present invention includes a step of forming an uneven transfer pattern on the surface of a mold, and transferring the transfer pattern to the light incident surface of the optical component when forming the optical component with the mold.
- Forming an uneven antireflection structure The antireflection structure to which the transfer pattern is transferred is divided into a plurality of regions, and in each of the regions, a plurality of protrusions and a plurality of grooves extending in parallel and linearly are alternately formed, In the adjacent regions, the extending direction of the protruding portion and the groove portion is different by 90 degrees.
- a resist layer is formed on the surface of the mold, the resist layer is exposed to an electron beam and developed to leave a part of the resist layer, and the resist layer is not present.
- the transfer pattern is formed by removing the surface of the mold at a portion.
- the resist layer is irradiated with the electron beam in the region unit, and the resist layer is exposed in the region unit.
- the method for manufacturing an optical component according to the present invention is a method in which an optical material is pressed with the mold to form the optical component, or a molten optical material is supplied into the mold and cooled to form the optical component. It is.
- the light incident surface or light exit surface is a quadrangle, preferably divided into a plurality of square regions, and linear and parallel protrusions and grooves are formed in each region.
- the direction of the protrusion and the groove is orthogonal. For this reason, even if a slight error occurs in the arrangement pitch between the regions, it is possible to prevent the occurrence of a wide defect portion or the like at the boundary portion between adjacent regions.
- the directions of the protrusions and the grooves in the adjacent regions are 90 degrees different from each other. Therefore, the optical component is always stable regardless of the polarization direction of the light incident on the incident surface and the light emitted from the output surface. An antireflection effect can be exhibited. In addition, since it is difficult to form a large defect portion or the like at the boundary surface between adjacent regions, it is possible to suppress a decrease in the antireflection efficiency due to a deviation in the arrangement pitch of the regions.
- the method for manufacturing an optical component according to the present invention can form the fine pitch protrusions and grooves with high accuracy using an electron beam. Further, it is possible to manufacture an optical component that can suppress a decrease in the antireflection efficiency on the incident surface and the exit surface even if the pitch of the region is deviated.
- FIG. 1 is a plan view showing a part of an antireflection structure formed on an optical component according to an embodiment of the present invention
- FIG. 2 is an enlarged plan view showing the antireflection structure shown in FIG.
- FIG. 3 is an explanatory view showing a step of exposing the resist layer with an electron beam.
- 4 is a plan view showing an antireflection structure of an optical component of a comparative example
- FIG. 5 is an enlarged plan view of the comparative example shown in FIG. 6 (A) and 6 (B) are explanatory views showing the problems of the comparative example
- FIG. 7 is an explanatory view showing advantages of the embodiment of the present invention.
- FIG. 1 is a plan view showing a part of an antireflection structure formed on an optical component according to an embodiment of the present invention
- FIG. 2 is an enlarged plan view showing the antireflection structure shown in FIG.
- FIG. 3 is an explanatory view showing a step of exposing the resist layer with an electron beam.
- 4 is
- FIG. 8 is a diagram showing the result of measuring the antireflection rate of the antireflection structure of the comparative example
- FIG. 9 is a diagram showing the result of measuring the antireflection rate of the antireflection structure of the embodiment of the present invention. .
- the antireflection structure 1 shown in FIGS. 1 and 2 is formed on the light incident surface or light exit surface of the optical component.
- Optical components include lenses, diffraction gratings, prisms, beam splitters, and transparent covers provided in the light passage area of cases containing light emitting elements and light receiving elements, all of which are substantially transparent with high light transmittance. It is made of an optical material.
- the optical component is formed by pressing heated glass with a mold, and in this case, a transfer pattern having fine irregularities formed on the surface of the mold is used as an incident surface or an emission surface of the optical component.
- the antireflection structure 1 is formed by being transferred to a surface.
- the optical component is formed by being injected into a mold in which an organic optical material is melted.
- a transfer pattern having fine irregularities formed on the surface of the mold is an optical component.
- the antireflection structure 1 is formed by being transferred to the entrance surface and the exit surface.
- the antireflection structure 1 includes a first region 2 having ridges and grooves extending in parallel in the X direction, and a second region having ridges and grooves extending in parallel in the Y direction. 3 are alternately arranged in both the X direction and the Y direction.
- the first region 2 and the third region 3 are each quadrangular, preferably square.
- FIG. 2 shows an enlarged view of the structure and arrangement of the two first regions 2A and 2B and the two second regions 3A and 3B adjacent thereto.
- a boundary between the first region 2A and the second region 3A and a boundary between the first region 2B and the second region 3B and extending in the Y direction are indicated by B1.
- a boundary between the first region 2A and the second region 3B and a boundary between the first region 2B and the second region 3A and extending in the X direction are indicated by B2. .
- a plurality of protrusions 11x and a plurality of grooves 12x extend linearly in the X direction.
- the protrusions 11x and the grooves 12x are alternately arranged in the Y direction, the plurality of protrusions 11x are parallel to each other, the plurality of grooves 12x are parallel to each other, and the protrusions 11x and the grooves 12x are also parallel to each other. They are parallel to each other.
- a plurality of protrusions 11y and a plurality of grooves 12y extend linearly in the Y direction.
- the protrusions 11y and the grooves 12y are alternately arranged in the X direction.
- the plurality of protruding portions 11y are parallel to each other, the plurality of groove portions 12y are parallel to each other, and the protruding portion 11y and the groove portion 12y are also parallel to each other.
- Both the width of the protrusions 11x and 11y and the width of the grooves 12x and 12y are about 100 to 500 nm. Moreover, the depth dimension of the groove parts 12x and 12y is comparable to the width dimension of the protrusion parts 11x and 11y.
- the length of one side of the first regions 2A and 2B is about 200 to 400 ⁇ m.
- FIG. 3 shows a step of exposing a strip-shaped pattern to the partition region 21 corresponding to the first region 2 of the resist layer 20.
- the electron beam 23 is intermittently irradiated from the beam gun of the electron beam exposure apparatus, and a minute spot is formed on the resist layer 20 to be exposed.
- a minute spot is sequentially moved in the X direction and the Y direction in the partitioned area 21 corresponding to the first area 2, and the scanning of the electron beam 23 forms a belt-like photosensitive portion 24 x. Is done.
- the plurality of strip-shaped photosensitive portions 24x are parallel to each other and extend linearly in the X direction.
- a strip-shaped non-photosensitive portion 25x is formed between the photosensitive portion 24x and the photosensitive portion 24x.
- the plurality of strip-shaped non-photosensitive portions 25x are also parallel to each other and extend linearly in the X direction.
- an XY table holding a mold in the electron beam exposure apparatus after the photosensitive portion 24x and the non-photosensitive portion 25x are formed in the partitioned area 21 corresponding to the first area 2. Is moved in the X direction or the Y direction, and the irradiation region of the electron beam 23 is moved by one region pitch. Then, a strip-shaped pattern corresponding to the second region 3 is similarly exposed to the partitioned region 31 adjacent to the partitioned region 21 that has already been exposed. In the adjacent partition region 31, the photosensitive portion and the non-photosensitive portion are formed so as to extend linearly in the Y direction.
- the process proceeds to the development step.
- the resist layer is for positive use, the resist layer of the photosensitive portion 24x is removed, and the resist layer of the non-photosensitive portion 25x is left.
- the surface of the mold is etched or milled at the portion where the resist layer has been removed to remove the surface of the mold in a band-shaped region.
- An optical component is formed by press-molding the optical material or injection molding the optical material using the mold described above, and at the light incident surface and light exit surface of the optical component, FIGS.
- the antireflection structure 101 of the comparative example shown in FIGS. 4 and 5 is divided into a plurality of regions 103.
- the region 103 has a quadrangular shape and is formed with the same area as the first region 2 and the second region 3 of the embodiment.
- the regions 103 are alternately arranged in the X direction and the Y direction.
- a boundary line extending in the Y direction at the boundary between adjacent regions 103 is indicated by B ⁇ b> 11
- a boundary line extending in the X direction is indicated by B ⁇ b> 12.
- the ridges 111y and the grooves 112y are alternately formed in the X direction.
- the ridges 111y and the grooves 112y are directed in the Y direction. It extends linearly and is formed parallel to each other.
- the comparative example is formed by the same manufacturing method as in the above embodiment. That is, a resist layer is formed on the surface of the mold, and an electron beam is irradiated onto a partition region divided by the surface of the resist layer, thereby forming a photosensitive portion and a non-photosensitive portion extending in the Y direction.
- the XY table is moved to perform further exposure, and after forming the photosensitive part and the non-photosensitive part in all adjacent divided areas, the resist layer is developed.
- the antireflection structure 101 shown in FIGS. 4 and 5 is formed.
- the width dimensions of the protrusion 111y and the groove 112y of the antireflection structure of the comparative example are the same as the protrusions 11x and 11y and the grooves 12x and 12y of the embodiment.
- the boundary of the region of the embodiment is adjacent to that of the comparative example. It is difficult to form a defect in the part. That is, as shown in FIG. 5, in the comparative example, when the arrangement pitch between the regions 103 and 103 adjacent to each other in the X direction is deviated, the protrusion 111y is formed on the boundary line B11 extending in the Y direction. Defects 130 having a width dimension D wider than the pitch P are likely to be formed.
- 6A and 6B are sectional views showing a state in which the resist layer 120 formed on the surface of the mold is exposed and developed. 6A and 6B, the resist layer 120 is exposed to the electron beam 23 and the non-photosensitive portion 125 to which the electron beam is not irradiated are formed, and then the resist layer of the photosensitive portion 124 is developed by development. The removed state is shown.
- the arrangement pitch between the divided areas where the minute spots are scanned by irradiating the electron beam is set with high accuracy, and the photosensitive part 124 and the non-photosensitive part 125 are constant between the adjacent areas. It is formed at a pitch P of FIG. In this case, it is difficult for a defect of the resist layer to be formed at the boundary between adjacent partition regions.
- FIG. 6B shows a state in which an error of about 1/5 of the pitch P of the photosensitive portion 124 is generated in the area arrangement pitch of the divided areas adjacent in the X direction, and both the divided areas are close to each other.
- the adjacent photosensitive portion 124a and the photosensitive portion 124b are too close to each other at the boundary between the adjacent partition regions, and the width dimension of the non-photosensitive portion 126 sandwiched between the photosensitive portion 124a and the photosensitive portion 124b is normal.
- the defect portion 130 having the width dimension D is formed on the boundary line B11-B11 of the adjacent region 103. That is, the defect portion 130 larger than the pitch P is formed only when the area arrangement pitch of the partitioned areas exposed by the electron beam is slightly close to 1/5 ⁇ P.
- FIG. 7 shows a state in which, in the embodiment of the present invention, when the resist layer 20 is exposed to an electron beam, the partition region adjacent in the X direction approaches about 1/5 ⁇ P as in FIG. Yes.
- a photosensitive portion 24 y and a non-photosensitive portion 25 y extending in the Y direction are formed in the right partition region 31, and a photosensitive portion 24 x and a non-photosensitive portion 25 x extending in the X direction are formed in the left partition region 21. .
- the width dimension Wa of the non-photosensitive part 36 located on the leftmost side of the partitioned area 31 becomes the dimension W0 of the other non-photosensitive part 25y. Smaller than.
- the non-photosensitive portion 25x extending in the X direction is continuous with the non-photosensitive portion 36, the non-photosensitive portion 36 of the width dimension Wa is not dropped when developed, as shown in FIG. 6B. Defects with width dimension D are difficult to form.
- the protrusion 11x extending in the X direction and the protrusion 11y extending in the Y direction may be connected on the boundary line B1 between the first region 2A and the second region 3A. Even in this case, it is difficult to form a large defect portion on the boundary line B1 as on the boundary line B11 shown in FIG. Further, on the boundary line B1 between the first region 2B and the second region 3B shown in FIG. 2, the groove portion 12x extending in the X direction and the groove portion 12y extending in the Y direction are connected to each other and communicated with each other. Even at the boundary line B1, it is difficult to form a large defect portion like the boundary line B11 shown in FIG.
- a large defect is present at the boundary of the region by mixing a portion where the ridges extending in the direction orthogonal to each other and a portion where the groove portions extending in the direction orthogonal to each other are connected. Can be prevented.
- FIG. 8 shows the measurement result of the reflectance of the antireflection structure 101 formed in the comparative example
- FIG. 9 shows the measurement result of the reflectance of the antireflection structure 1 of the above embodiment.
- the sections 2, 3 and 103 are squares of 300 ⁇ m ⁇ 300 ⁇ m.
- the width of the protrusion is 300 nm
- the width of the bottom of the groove is 200
- the depth of the groove is 300 nm.
- Each antireflection structure was formed on the surface of a Si wafer, ultraviolet rays were irradiated perpendicularly to each antireflection structure, and the reflectivity was measured with a reflectometer in a reflection direction having an angle of 5 degrees with respect to the irradiation direction.
- linearly polarized ultraviolet rays were used.
- the wavelength was in the range of 400 nm to 700 nm.
- the horizontal axis represents the wavelength of the irradiated ultraviolet light, and the vertical axis represents the reflectance.
- FIG. 9 shows the measurement results of the embodiment. Also in the embodiment, irradiation was performed while changing the polarization direction to 0 degrees, 45 degrees, and 90 degrees with respect to the Y axis, but the reflectivity at each angle was substantially the same.
- FIG. 1 The top view which shows a part of reflection preventing structure of the optical component of embodiment of this invention
- FIG. 1 An enlarged plan view in which a part of the antireflection structure shown in FIG. 1 is enlarged
- Explanatory drawing which shows the process of exposing a resist layer with an electron beam in the manufacturing process of an antireflection structure
- FIG. 4 is an enlarged plan view of a part of the antireflection structure shown in FIG.
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Abstract
Description
前記反射防止構造は、前記面が複数の領域に区分され、それぞれの前記領域に、平行で直線状に延びる複数の突条部と複数の溝部とが交互に繰り返されて形成され、隣り合う前記領域で、前記突条部および前記溝部の延びる方向が90度相違していることを特徴とするものである。
例えば、それぞれの前記領域が四角形である。
前記転写パターンを転写した前記反射防止構造は、複数の領域に区分され、それぞれの前記領域に、平行で直線状に延びる複数の突条部と複数の溝部とが交互に繰り返されて形成され、隣り合う前記領域で、前記突条部および前記溝部の延びる方向が90度相違していることを特徴とするものである。
光学部品を形成する型のうちの入射面や出射面を転写する型表面にレジスト層を形成し、電子線露光装置を使用して、レジスト層を部分的に露光する。図3は、レジスト層20の第1の領域2に相当する区画領域21に、帯状のパターンを露光する工程を示している。電子線露光装置のビームガンから電子線23が間欠的に照射されて、レジスト層20に微小スポットが形成されて露光される。
2,2A,2B,3,3A,3B 領域
11x,11y 突条部
12x,12y 溝部
20 レジスト層
21,31 区画領域
24x,24y 感光部
25x,25y 非感光部
36 非感光部
Claims (9)
- 光が入射しまたは出射する面に反射防止構造が形成された光学部品において、
前記反射防止構造は、前記面が複数の領域に区分され、それぞれの前記領域に、平行で直線状に延びる複数の突条部と複数の溝部とが交互に繰り返されて形成され、隣り合う前記領域で、前記突条部および前記溝部の延びる方向が90度相違していることを特徴とする光学部品。 - 前記反射防止構造は、隣り合う前記領域の境界部において、90度相違する方向に延びる前記突条部どうしが繋がっている部分と、隣り合う前記領域の境界部において、90度相違する方向に延びる前記溝部どうしが繋がっている部分とを含んでいる請求項1記載の光学部品。
- それぞれの前記領域が四角形である請求項1または2記載の光学部品。
- 型の表面に、凹凸の転写パターンを形成する工程と、前記型で光学部品を形成する際に光学部品の光の入射面に前記転写パターンを転写して凹凸状の反射防止構造を形成する工程とを有し、
前記転写パターンを転写した前記反射防止構造は、複数の領域に区分され、それぞれの前記領域に、平行で直線状に延びる複数の突条部と複数の溝部とが交互に繰り返されて形成され、隣り合う前記領域で、前記突条部および前記溝部の延びる方向が90度相違していることを特徴とする光学部品の製造方法。 - 前記反射防止構造は、隣り合う前記領域の境界部において、90度相違する方向に延びる前記突条部どうしが繋がっている部分と、隣り合う前記領域の境界部において、90度相違する方向に延びる前記溝部どうしが繋がっている部分とを含んでいる請求項4記載の光学部品の製造方法。
- 前記型の表面にレジスト層を形成し、前記レジスト層を電子線で露光し現像して一部の前記レジスト層を残し、レジスト層が存在していない部分で前記型の表面を除去して前記転写パターンを形成する請求項4または5記載の光学部品の製造方法。
- 前記レジスト層に、前記領域単位で前記電子線を照射し、前記領域単位で前記レジスト層を露光する請求項6記載の光学部品の製造方法。
- 前記型で光学材料をプレスして前記光学部品を形成する請求項4ないし7のいずれかに記載の光学部品の製造方法。
- 前記型内に溶融した光学材料を供給し、冷却して前記光学部品を形成する請求項4ないし7のいずれかに記載の光学部品の製造方法。
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JP2010519008A JP5211165B2 (ja) | 2008-07-04 | 2009-06-24 | 反射防止構造を有する光学部品および前記光学部品の製造方法 |
CN200980125741XA CN102084273B (zh) | 2008-07-04 | 2009-06-24 | 具有防反射构造的光学部件及上述光学部件的制造方法 |
US12/972,076 US20110090569A1 (en) | 2008-07-04 | 2010-12-17 | Optical component having antireflection structure and method of manufacturing optical component |
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JP2015515196A (ja) * | 2012-03-29 | 2015-05-21 | 中▲興▼通▲訊▼股▲フン▼有限公司 | 基地局の省電力方法及び装置 |
JP2015225113A (ja) * | 2014-05-26 | 2015-12-14 | リコー光学株式会社 | 光学素子、成形型、製造方法及び光学装置 |
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CN112673287B (zh) * | 2018-09-07 | 2023-05-09 | 善洁科技有限公司 | 用于能量分布的图案、所述图案的制造方法和包括所述图案的制品 |
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US20110090569A1 (en) | 2011-04-21 |
JPWO2010001772A1 (ja) | 2011-12-22 |
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