WO2009152915A3 - Verfahren zur galvanischen kupferbeschichtung und vorrichtung zur durchführung eines solchen verfahrens - Google Patents

Verfahren zur galvanischen kupferbeschichtung und vorrichtung zur durchführung eines solchen verfahrens Download PDF

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Publication number
WO2009152915A3
WO2009152915A3 PCT/EP2009/003655 EP2009003655W WO2009152915A3 WO 2009152915 A3 WO2009152915 A3 WO 2009152915A3 EP 2009003655 W EP2009003655 W EP 2009003655W WO 2009152915 A3 WO2009152915 A3 WO 2009152915A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
carrying
type
copper electroplating
sulphuric
Prior art date
Application number
PCT/EP2009/003655
Other languages
English (en)
French (fr)
Other versions
WO2009152915A2 (de
Inventor
Matthias Kurrle
Original Assignee
Ipt - International Plating Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ipt - International Plating Technologies Gmbh filed Critical Ipt - International Plating Technologies Gmbh
Priority to DE112009001255T priority Critical patent/DE112009001255A5/de
Publication of WO2009152915A2 publication Critical patent/WO2009152915A2/de
Publication of WO2009152915A3 publication Critical patent/WO2009152915A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Bei einem Verfahren zur galvanischen Kupferbeschichtung eines Werkstücks (50), insbesondere eines Druckzylinders (50), wird einem schwefelsauren Kupferbad (30, 32, 34) zur Zuführung von Kupfer Kupfercarbonat (74, 79) zugeführt. Ein elektrolytisches Bad (30, 32, 34) enthält in Lösung Kupfer und Schwefelsäure, und in das elektrolytische Bad ist Kupfercarbonat zugegeben. Verwendung von Kupfercarbonat (74, 79) zur Zuführung von Kupfer in einem schwefelsauren Kupferbad für eine galvanische Kupferbeschichtung. Eine Galvanisiervorrichtung (10) zur Durchführung eines solchen Verfahrens ist gezeigt.
PCT/EP2009/003655 2008-05-28 2009-05-22 Verfahren zur galvanischen kupferbeschichtung und vorrichtung zur durchführung eines solchen verfahrens WO2009152915A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112009001255T DE112009001255A5 (de) 2008-05-28 2009-05-22 Verfahren zur galvanischen Kupferbeschichtung und Vorrichtung zur Durchführung eines solchen Verfahrens

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008026985 2008-05-28
DE102008026985.9 2008-05-28

Publications (2)

Publication Number Publication Date
WO2009152915A2 WO2009152915A2 (de) 2009-12-23
WO2009152915A3 true WO2009152915A3 (de) 2010-03-11

Family

ID=41213451

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/003655 WO2009152915A2 (de) 2008-05-28 2009-05-22 Verfahren zur galvanischen kupferbeschichtung und vorrichtung zur durchführung eines solchen verfahrens

Country Status (2)

Country Link
DE (2) DE102009023124A1 (de)
WO (1) WO2009152915A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080105A1 (de) 2011-07-29 2013-01-31 Wacker Chemie Ag Verfahren zur Reinigung von polykristallinen Siliciumbruchstücken
CN104264208B (zh) * 2014-09-30 2017-05-24 任晓东 一种千斤顶电镀装置的冷却机构
CN104233439B (zh) * 2014-09-30 2016-10-05 任晓东 一种千斤顶的电镀装置
EP3467157B1 (de) 2017-10-09 2020-04-15 IPT - International Plating Technologies GmbH Zusammensetzung zur nachdosierung eines metalls

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164456A (en) * 1978-06-15 1979-08-14 Dart Industries Inc. Electrolytic process
US4428802A (en) * 1980-09-19 1984-01-31 Kabushiki Kaisha Suwa Seikosha Palladium-nickel alloy electroplating and solutions therefor
EP0181430A1 (de) * 1984-11-13 1986-05-21 Olin Corporation Systeme zur Herstellung einer elektroplattierten und/oder bearbeiteten Metallfolie
US5186811A (en) * 1991-04-18 1993-02-16 Nippon Cmk Corp. Method of manufacturing printed wiring boards
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
US20010017266A1 (en) * 1998-06-19 2001-08-30 Gerald Maresch Process and apparatus for preparing and replenishing an electrolyte in an electrolyte bath
US6458262B1 (en) * 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
EP1887108A1 (de) * 2005-05-25 2008-02-13 Think Laboratory Co., Ltd. Verkupferungsverfahren und -vorrichtung für tiefdruckzylinder

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164456A (en) * 1978-06-15 1979-08-14 Dart Industries Inc. Electrolytic process
US4428802A (en) * 1980-09-19 1984-01-31 Kabushiki Kaisha Suwa Seikosha Palladium-nickel alloy electroplating and solutions therefor
EP0181430A1 (de) * 1984-11-13 1986-05-21 Olin Corporation Systeme zur Herstellung einer elektroplattierten und/oder bearbeiteten Metallfolie
US5186811A (en) * 1991-04-18 1993-02-16 Nippon Cmk Corp. Method of manufacturing printed wiring boards
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
US20010017266A1 (en) * 1998-06-19 2001-08-30 Gerald Maresch Process and apparatus for preparing and replenishing an electrolyte in an electrolyte bath
US6458262B1 (en) * 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
EP1887108A1 (de) * 2005-05-25 2008-02-13 Think Laboratory Co., Ltd. Verkupferungsverfahren und -vorrichtung für tiefdruckzylinder

Also Published As

Publication number Publication date
DE112009001255A5 (de) 2011-04-28
DE102009023124A1 (de) 2009-12-03
WO2009152915A2 (de) 2009-12-23

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