WO2009145247A1 - Ledランプ - Google Patents
Ledランプ Download PDFInfo
- Publication number
- WO2009145247A1 WO2009145247A1 PCT/JP2009/059752 JP2009059752W WO2009145247A1 WO 2009145247 A1 WO2009145247 A1 WO 2009145247A1 JP 2009059752 W JP2009059752 W JP 2009059752W WO 2009145247 A1 WO2009145247 A1 WO 2009145247A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- led lamp
- axial direction
- light
- substrate
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an LED lamp.
- FIG. 20 shows a cross-sectional view of an example of a conventional LED lamp (see Patent Document 1).
- the LED lamp X is used, for example, as an alternative to a fluorescent lamp attached to a general fluorescent lamp luminaire.
- the LED lamp X includes a cylindrical translucent cover 93, a substrate 91, an LED module 92, and a terminal 94.
- the substrate 91 and the LED module 92 are accommodated in the translucent cover 93.
- the substrate 91 is a long rectangular flat plate extending in the axial direction x of the LED module 92.
- a plurality of LED modules 92 are mounted on the substrate 91.
- the terminal 94 is configured to be able to be fitted into the insertion port of the socket of the fluorescent lamp lighting device.
- the general fluorescent lamp illuminator is a luminaire widely used mainly for indoor general illumination. For example, in Japan, a commercial 100V or 200V power supply is used, and a straight tube fluorescent lamp defined in JIS C7617 is used. A lighting fixture to which a lamp or a ring-shaped fluorescent lamp specified in JIS C7618 is attached.
- the LED lamp X when viewed in the axial direction x, since the LED module 92 is arranged to face the same direction, it can only irradiate light in one direction. For this reason, when the LED lamp X is used, there is a problem in that there is a portion where light is not sufficiently irradiated and does not become bright in a certain direction.
- the present invention has been conceived under the circumstances described above, and an object thereof is to provide an LED lamp capable of making the light irradiation range wider in an axial view.
- the present invention takes the following technical means.
- the LED lamp provided by the present invention extends in the axial direction, includes a plurality of LED chips, and a main irradiation direction of light emitted from each of the LED chips is a diameter that is perpendicular to the axial direction.
- the main illumination directions of the plurality of LED chips are different from each other when viewed in the axial direction.
- the plurality of LED chips are supported, and a metal support member disposed further inward in the radial direction with respect to the plurality of LED chips is further provided.
- a reflective surface formed to be away from the LED chip.
- a metal reflection member having the reflection surface is provided, and the reflection member and the metal support member are connected to each other.
- two or more LED chips having different main irradiation directions from each other among the plurality of LED chips have one or more multiple light source units arranged at the same place in the axial direction.
- a plurality of the multi-light source portions spaced apart from each other in the axial direction are provided.
- FIG. 5 is a perspective view showing a process of mounting an LED module on an original plate in the manufacturing process of the LED lamp shown in FIG. 4.
- FIG. 1 It is a perspective view which shows the process of cut
- FIG. 1 It is a front view which shows the LED lamp based on 4th Embodiment of this invention. It is sectional drawing which follows the XII-XII line
- FIG. 1 is a perspective view of a main part of the LED lamp A1 of the present embodiment.
- 2 is a cross-sectional view taken along line II-II in FIG.
- the LED lamp A1 is used as an alternative to a fluorescent lamp, for example.
- the LED lamp A1 includes a cylindrical translucent cover 3, a metal support member 20, substrates 10A, 10B, and 10C, an LED module 30, and a reflection member 40.
- the metal support member 20, the substrates 10 ⁇ / b> A, 10 ⁇ / b> B, 10 ⁇ / b> C, and the LED module 30 are accommodated in the cylindrical translucent cover 3.
- the metal support member 20 shown in FIGS. 1 and 2 is made of, for example, Al and has an elongated shape.
- the metal support member 20 may be annular.
- the metal support member 20 includes a cylindrical portion 21, leg portions 22A, 22B, and 22C, and plate portions 23A, 23B, and 23C.
- the cylindrical portion 21 extends in a certain direction. In the present embodiment, the direction in which the cylindrical portion 21 extends through the center of the cylindrical portion 21 is the axial direction referred to in the present invention.
- the leg portions 22A, 22B and 22C have a flat plate shape extending in the axial direction x.
- the leg portions 22A, 22B, and 22C extend radially from the center of the cylindrical portion 21 in the radial direction perpendicular to the axial direction x when viewed in the axial direction x.
- the leg portions 22A, 22B, and 22C form an angle of 120 degrees with each other.
- the plate portions 23A, 23B, and 23C are disposed outward in the radial direction with respect to the leg portions 22A, 22B, and 22C, respectively.
- the plate portions 23A, 23B, and 23C are orthogonal to the leg portions 22A, 22B, and 22C, respectively.
- the substrates 10A, 10B, and 10C are fixed to the radially outer portions of the plate portions 23A, 23B, and 23C, respectively.
- the substrates 10A, 10B, and 10C are made of, for example, glass epoxy and are long rectangular flat plates. These substrates include a metal wiring layer (not shown), a through hole, and the like that are formed on the front surface (upper side in the figure for the substrate 10A) and the rear surface (lower side in the figure for the substrate 10A) and are separated from each other. Note that Al covered with an insulating film may be used for the substrates 10A, 10B, and 10C.
- a plurality of LED modules 30 are arranged on the respective substrates 10A, 10B, and 10C while being separated from each other along the axial direction x.
- the LED module 30 is mounted on the outer surface in the radial direction of the substrates 10 ⁇ / b> A, 10 ⁇ / b> B, and 10 ⁇ / b> C.
- the LED module 30 includes an LED chip (light emitting diode), leads, wires, and a resin package that are spaced apart from each other.
- the LED chip has a structure in which an n-type semiconductor layer and a p-type semiconductor layer and an active layer sandwiched between them are laminated.
- the LED chip can emit blue light.
- a phosphor is mixed in the resin package. Depending on the type of the phosphor, the LED modules can emit light having different color temperatures.
- the phosphor is, for example, a yellow light emitter that emits yellow light when excited by blue light.
- the LED module 30 can emit white light by blue light from the LED chip and yellow light from the yellow phosphor.
- the phosphor may be a mixed phosphor instead of a yellow phosphor.
- This mixed phosphor includes a red phosphor that emits red light when excited by blue light, and a green phosphor that emits green light when excited by blue light.
- the LED module 30 can emit white light by blue light from the LED chip, red light and green light from the mixed phosphor. At this time, the LED module 30 can emit white light having higher color rendering properties than the case where the yellow phosphor is mixed in the resin package.
- the LED module 30 can emit white light such as white light (bulb color) with a color temperature of 3000K and white light (daylight color) with a color temperature of 6700K. It has become.
- the LED module 30 is arranged so as to be able to irradiate light from the center of the cylindrical portion 21 outward in the radial direction.
- the LED module 30 mounted on the substrate 10A is arranged so that light can be irradiated upward in FIG.
- the LED modules 30 mounted on the substrates 10B and 10C are arranged so as to be able to irradiate light in a diagonally downward right direction and a diagonally downward left direction in FIG.
- the direction in which the LED module 30 emits light is indicated by arrows.
- These directions are the main irradiation directions of light emitted from the LED chip in the present invention.
- the main irradiation direction of the light emitted from the LED chip in the present invention refers to a direction toward the center of the range in which the light from the LED module 30 is irradiated in the axial direction x.
- the reflection member 40 is connected to both ends of the plate portions 23A, 23B, and 23C.
- the angles formed by the reflecting member 40 and the plate portions 23A, 23B, and 23C are about 150 degrees, respectively.
- the reflecting member 40 is made of Al, for example.
- the reflection member 40 includes a reflection surface 41.
- the reflection surface 41 is for irradiating the light emitted from the LED module 30 in the radial direction. As well represented in FIG. 2, the reflective surface 41 moves away from the LED module 30 in a direction perpendicular to this direction as it moves away from the cylindrical portion 21 in the radial direction passing through the LED module 30. It is formed as follows.
- the reflecting surface 41 is a flat surface, but may be a concave surface or the like.
- the translucent cover 3 is made of a transparent material. Therefore, the translucent cover 3 can transmit light from the LED module 30.
- the light irradiation range of the LED lamp A1 in the axial direction x is widened.
- Heat generated in the LED chip can be released from the metal support member 20 to the outside of the LED lamp A1. Thereby, it becomes possible to promote the heat dissipation of LED lamp A1.
- a part of the light emitted from the LED module 30 is reflected by the reflecting surface 41 and radiates outward in the radial direction. Thereby, it becomes possible to improve the brightness
- the heat generated in the LED chip can be released to the outside of the LED lamp A1 also in the reflecting member 40. Thereby, it becomes possible to further promote the heat radiation of the LED lamp A1.
- FIG. 3 shows an LED lamp according to the second embodiment of the present invention.
- the LED lamp A2 of the present embodiment has a configuration in which a tape light 60 mounting the LED module 30 is wound around a cylindrical round bar 50.
- the LED lamp A2 can irradiate light over the entire circumferential direction when viewed in the axial direction x.
- the LED lamp according to the present invention is not limited to the embodiment described above.
- the specific configuration of each part of the LED lamp according to the present invention can be varied in design in various ways.
- a plurality of LED modules may be provided on both sides of a single substrate. At this time, it is not necessary to prepare a plurality of the substrates in order to manufacture one LED lamp. Therefore, it becomes possible to suppress the manufacturing cost of the LED lamp.
- the LED lamp A3 of the present embodiment includes a plurality of light emitting modules 1, a metal support member 20, a translucent cover 3, a bracket 4, and a base 5. This LED lamp A3 is attached to an illuminating device (not shown) corresponding to the annular fluorescent lamp.
- the light emitting module 1 is formed of a cylindrical body in which a plurality of substrates 10 are long-side connected.
- the substrate 10 is made of, for example, glass epoxy resin and is formed in a long rectangular shape. Adjacent substrates 10 have their long sides connected via thin portions.
- a plurality of LED modules 30 are mounted on each of the substrates 10 at an equal interval along the longitudinal direction so as to face outward.
- the LED module 30 is obtained by sealing an LED chip (not shown) connected to a metal lead (not shown) with a translucent resin (not shown). These LED modules 30 are connected to a wiring pattern (not shown) formed on the substrate 10.
- the plurality of light emitting modules 1 are attached to the metal support member 20.
- the light emitting module 1 including five substrates 10 is attached to the metal support member 20 as an example.
- a wiring pattern (not shown) that is electrically connected to the substrate 10 is formed on the metal support member 20 and the bracket 4.
- the power source power from the base 5 is supplied to the LED module 30 through the bracket 4, the metal support member 20, and the substrate 10.
- the light emitting module 1 is accommodated in the translucent cover 3.
- the light emitting module 1 and the metal support member 20 are viewed integrally, they have a substantially hexagonal cross-sectional shape. Therefore, according to the plurality of light emitting modules 1, light from LED chips (not shown) built in the LED module 30 is irradiated in various directions in which each substrate 10 faces.
- the metal support member 20 is made of, for example, Al, and is bonded to the substrate 10 which is both ends of the light emitting module 1.
- the metal support member 20 is provided with a plurality of convex portions 24. These convex portions 24 are exposed in the center direction from the translucent cover 3 and the bracket 4. According to such a metal support member 20, the heat generated by the LED module 30 is efficiently transmitted to the metal support member 20 through the substrate 10. Since the metal support member 20 has a large contact area with the outside air due to the plurality of convex portions 24 exposed to the outside, the metal support member 20 can quickly dissipate heat.
- the main body part and the convex part of the heat radiating member may be formed of different metal materials, and a Peltier element may be provided at these joint parts to enhance the heat radiation effect.
- the translucent cover 3 is made of, for example, glass or polycarbonate resin, and transmits light from the light emitting module 1 outward and protects the light emitting module 1 accommodated therein.
- An opening is provided on the inner peripheral side of the translucent cover 3.
- a base 5 is provided at one location of the translucent cover 3, and a power connector of a lighting device (not shown) is connected to the base 5.
- the bracket 4 is formed in an annular shape and is attached to the inner peripheral side opening of the translucent cover 3.
- a metal support member 20 is joined to the bracket 4.
- the bracket 4 the plurality of light emitting modules 1 are arranged in a ring shape at a predetermined interval inside the translucent cover 3. Further, the bracket 4 is electrically connected to the base 5 and functions as a power feeding path for the plurality of light emitting modules 1.
- a rectangular original plate 100 capable of taking a plurality of substrates 10 is prepared, and a plurality of continuous rectangular regions Cr such that a plurality of substrates 10 are connected in a long side to the original plate 100.
- the boundary of the rectangular portion Sr corresponding to the substrate 10 is indicated by a one-dot chain line, and the outer edge of the entire continuous rectangular region Cr is indicated by a broken line.
- a plurality of LED modules 30 are mounted so as to be arranged at equal intervals along the longitudinal direction for each rectangular portion Sr.
- a groove is formed in the original plate 100 along the boundary line L1 between the rectangular portions Sr indicated by the alternate long and short dash line, for example, by processing using a dicing saw or a laser.
- the original plate 100 is cut along a cutting line L2 indicated by a broken line corresponding to the outer edge thereof.
- the continuous rectangular region Cr is cut out from the original plate 100.
- Each continuous rectangular region Cr has a form in which a plurality of rectangular portions Sr are connected through thin portions of grooves along the plurality of boundary lines L1.
- region Cr cut out from the original plate 100 is bend
- substrate 10 to the outward is obtained.
- the cylindrical light emitting module 1 is formed by bending the continuous rectangular region Cr at the boundary of the rectangular portion Sr.
- the cylindrical light emitting module 1 can be completed simply by cutting out the continuous rectangular region Cr from the rectangular original plate 100 and bending the continuous rectangular region Cr along the groove. Therefore, for example, it is possible to prevent the generation of extra residual pieces as much as possible as compared with the case of cutting a curved substrate from a rectangular original plate, and it is possible to easily improve productivity and yield.
- one or more of the light emitting modules of the above-described embodiments may be accommodated in a straight tubular translucent cover and attached to a lighting device (not shown) corresponding to a straight tube fluorescent lamp.
- a cutting line may be set at the boundary between the adjacent long rectangular areas without leaving an interval between them. In this way, it is possible to cut out a substrate having a longer side connection shape from the entire original plate.
- the LED chip may be directly mounted on the substrate.
- FIGS. 11 to 13 show an LED lamp according to a fourth embodiment of the present invention.
- the LED lamp A4 shown in FIGS. 11 to 13 includes a metal support member 20, substrates 10A, 10B, and 10C, a plurality of LED modules 30, a plurality of screws 70, a plurality of nuts 80, and a plurality of Peltier elements 80. Yes.
- This LED lamp A4 is, for example, attached to a general fluorescent lamp luminaire as an alternative to a straight tube fluorescent lamp while being accommodated in a straight tubular translucent cover (not shown). It has a shape extending elongated along the direction x. Furthermore, as shown in FIG.
- the LED lamp A4 is configured to have a 120 ° rotationally symmetric shape with respect to an axis (not shown) extending along the axial direction x.
- FIG. 11 shows the height direction z of the substrate 10A in addition to the axial direction x
- FIGS. 12 and 13 show the width direction y and the height direction z of the substrate 10A. Yes.
- the metal support member 20 is made of, for example, Al, includes side plate portions 25A, 25B, and 25C, a joint portion 28, and a cylindrical portion 29, and is formed in a tubular shape that extends long along the axial direction x.
- the side plate portion 25A has a constant width in the width direction y, a constant thickness of about 1 to 2 mm in the height direction z, and is formed to extend long along the axial direction x.
- One end edge in the width direction y of the side plate portion 25A is connected to the side plate portion 25B through a bent portion 26a.
- the angle formed by the side plate portion 25A and the side plate portion 25B is 60 °.
- the other end edge in the width direction y of the side plate portion 25A is connected to the side plate portion 25C through a bent portion 26b.
- the angle formed by the side plate portion 25A and the side plate portion 25C is 60 °.
- the side plate portions 25B and 14 each have a shape obtained by rotating the side plate portion 25A by 120 ° in different directions. Furthermore, the end edge of the side plate portion 25B and the end edge of the side plate portion 25C are welded at the joint portion 28. Peltier elements 80 are attached to the inner surfaces near both ends in the axial direction x of the side plate portions 25A, 25B, and 25C. A plurality of punch holes 27 are formed in the side plate portions 25A, 25B, and 25C.
- the plurality of punch holes 27 are formed so as to penetrate the side plate portions 25A, 25B, and 25C in the thickness direction, respectively.
- the plurality of punch holes 27 are formed so that, for example, five punch holes 27 are arranged along the width direction of the side plate portions 25A, 25B, and 25C.
- the cylindrical portion 29 is a portion formed in an annular shape when viewed in the axial direction x, and is provided at both ends in the axial direction x of the metal support member 20.
- a cylindrical base (not shown) is attached to the cylindrical portion 29.
- the substrates 10A, 10B, and 10C are made of, for example, glass epoxy, and are formed in a long rectangular shape having a certain width and extending in the axial direction x.
- the substrate 10A is fixed to the outer surface of the side plate portion 25A using three screws 70 and three nuts 80.
- the substrate 10B is fixed to the outer surface of the side plate portion 25B using three screws 70 and three nuts 80.
- the substrate 10C is fixed to the outer surface of the side plate portion 25C using three screws 70 and three nuts 80.
- two of the three screws 70 for fixing the substrate 10C fix both ends in the axial direction x of the substrate 10C, and one fixes the center in the axial direction x of the substrate 10C. is doing.
- the two screws 70 for fixing both ends and the screw 70 for fixing the center are spaced apart in the width direction of the substrate 10C, which is a preferable form for fixing the substrate 10C to the side plate portion 25C. .
- the substrates 10A and 22 are preferably fixed to the side plate portions 25A and 13, respectively. As shown in FIG. 12, each screw 70 passes through the punch hole 27.
- Each LED module 30 includes an LED element 31, metal leads 32 and 33 spaced apart from each other, wires 34, and a resin package 35.
- a plurality of LED modules 30 are mounted on each of the substrates 10A, 10B, and 10C so as to be aligned along the axial direction x. In the following description, the LED module 30 mounted on the substrate 10A is assumed.
- the LED element 31 has a structure in which, for example, an n-type semiconductor layer and a p-type semiconductor layer and an active layer sandwiched between them are laminated.
- the LED element 31 can emit blue light.
- the LED element 31 is mounted on a lead 32 disposed on one side in the width direction y of the substrate 10A. Furthermore, the upper surface of the LED element 31 is connected to a lead 33 disposed on the other side in the width direction of the substrate 10 ⁇ / b> A via a wire 34.
- Resin package 35 is for protecting LED element 31 and wire 34.
- the resin package 35 is formed using, for example, an epoxy resin having translucency with respect to the light from the LED element 31.
- a fluorescent material that emits yellow light when excited by blue light is mixed in the resin package 35, white light can be emitted from the LED module 30.
- a metal plate 10 having a thickness of 1 to 2 mm, a constant width in the width direction y, and extending in the axial direction x is prepared.
- This metal plate 10 is made of, for example, Al.
- a plurality of punch holes 27 are formed in the metal plate 10 so as to have a uniform distribution.
- the number of punch holes arranged along the width direction y is, for example, fifteen. Note that punch holes 27 are not formed near both ends of the metal plate 10 in the axial direction x. Such punch holes 27 can be easily formed using, for example, a punch press apparatus.
- a step of forming the metal support member 20 from the metal plate 10 is performed.
- the metal plate 10 is bent 60 ° along two imaginary lines extending along the axial direction x shown in FIG. 14 to form the side plate portions 25A, 25B, and 25C.
- the edges of the side plate portions 25B and 14 corresponding to both ends in the width direction y of the original metal plate 10 are joined together to form a triangular tubular metal support member 20 as shown in FIG.
- the joining of the end edges of the side plate portions 25B and 14 is performed, for example, by welding.
- a cylindrical portion 29 having an annular shape when viewed in the axial direction x is formed at one end of the metal support member 20.
- the cylindrical portion 29 is formed by pushing a circular rod into one end portion of the metal support member 20 along the axial direction x as viewed in the axial direction x. Furthermore, as shown in FIG. 17, a cylindrical portion 29 is also formed at the other end portion of the metal support member 20. Through the above steps, the metal support member 20 in the LED lamp A4 is completed.
- Peltier element 80 a process of installing a Peltier element 80 is performed as shown in FIG.
- six Peltier elements 80 are inserted into the metal support member 20 from the cylindrical portion 29, and two Peltier elements 80 are bonded to appropriate positions on the inner surfaces of the side plate portions 25A, 25B, 25C, for example.
- the Peltier element 80 may be installed before the metal plate 10 is bent.
- a step of attaching the substrate 10A to the side plate portion 25A is performed.
- a plurality of LED modules 30 are previously installed on the substrate 10A.
- three screws 70 are inserted into the substrate 10 ⁇ / b> A, and these screws 70 are inserted through the punch holes 27.
- a nut 80 is attached to the tip of the screw 70 to fix the substrate 10A to the side plate portion 25A.
- One of the screws 70 is inserted into the center of the substrate 10A in the axial direction x on one end side in the width direction y, and the other two are substrates in the axial direction x on the other end side in the width direction y.
- 10A is inserted into both ends.
- the LED lamp A4 shown in FIGS. 11 to 13 is completed by performing the process of attaching the substrate 10B to the side plate portion 25B and the substrate 10C to the side plate portion 25C.
- the LED modules 30 mounted on the substrates 10A, 10B, and 10C are configured to emit light in different directions. For this reason, the LED lamp A4 can emit light closer to a fluorescent lamp, and can be preferably used as an alternative to a tubular fluorescent lamp.
- the weight is relatively light. Furthermore, since the plurality of punch holes 27 are formed in the side plate portions 25A, 25B, and 25C, the LED lamp A4 is lighter.
- the metal support member 20 since the metal support member 20 has a plurality of punch holes 27 and is hollow, it preferably functions as a heat dissipation member for cooling the heat generated by the plurality of LED modules 30.
- the Peltier elements 80 are installed on the inner surfaces of the side plate portions 25A, 25B, and 25C, the substrates 10A, 10B, and 10C are more effectively cooled. Therefore, the LED lamp A4 can supply stable lighting that is unlikely to break down without excessively increasing the temperatures of the substrates 10A, 10B, and 10C and the LED module 30.
- the cylindrical part 29 is formed in the both ends in the axial direction x of the metal support member 20, it is easy to attach the cylindrical base used in the general fluorescent lamp lighting fixture. For this reason, the LED lamp A4 is easy to use as an alternative to a straight tube fluorescent lamp.
- the metal support member 20 can be easily formed by bending the metal plate 10 and welding both ends thereof, the manufacturing process is simplified and the manufacturing cost can be reduced. .
- the pre-formed punch holes 27 are used, so that the mounting operation can be performed more easily. It has become.
- the LED lamp according to the present invention is not limited to the embodiment described above.
- the specific configuration of each part of the LED lamp according to the present invention can be varied in design in various ways.
- the metal support member 20 has a substantially triangular tubular shape, but may have a more polygonal rectangular tubular shape such as a square tube.
- the LED lamp A4 is configured as an alternative to a straight tube fluorescent lamp.
- a plurality of LED lamps having relatively short metal support members 20 may be arranged in an annular shape.
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (6)
- 軸方向に延びており、
複数のLEDチップを備えており、
各々の上記LEDチップから出射される光の主照射方向が、上記軸方向と直角である径方向の外方を向いており、
上記軸方向視において上記複数のLEDチップの上記主照射方向は互いに異なっている、LEDランプ。 - 上記複数のLEDチップを支持しており、上記複数のLEDチップに対して上記径方向の内方に配置された金属支持部材をさらに有している、請求項1に記載のLEDランプ。
- 上記径方向のうち上記LEDチップのうちの一つを通るものである第1の方向に遠ざかるにつれて、上記第1の方向と直角である第2の方向において、上記LEDチップと遠ざかるように形成された反射面を有する、請求項2に記載のLEDランプ。
- 上記反射面を備えた金属製の反射部材を有し、
この反射部材と上記金属支持部材とが連結されている、請求項3に記載のLEDランプ。 - 上記複数のLEDチップのうち互いに上記主照射方向が異なる2以上のLEDチップが上記軸方向において同一箇所に配置されている1以上の多光源部を有する、請求項1に記載のLEDランプ。
- 上記軸方向において互いに離間した複数の上記多光源部を有する、請求項5に記載のLEDランプ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010514528A JP5401454B2 (ja) | 2008-05-29 | 2009-05-28 | Ledランプ |
US12/995,038 US20110073883A1 (en) | 2008-05-29 | 2009-05-28 | Led lamp |
CN2009801192701A CN102047028A (zh) | 2008-05-29 | 2009-05-28 | Led灯 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-140320 | 2008-05-29 | ||
JP2008140320 | 2008-05-29 | ||
JP2008-225957 | 2008-09-03 | ||
JP2008225957 | 2008-09-03 | ||
JP2008-229939 | 2008-09-08 | ||
JP2008229939 | 2008-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009145247A1 true WO2009145247A1 (ja) | 2009-12-03 |
Family
ID=41377117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/059752 WO2009145247A1 (ja) | 2008-05-29 | 2009-05-28 | Ledランプ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110073883A1 (ja) |
JP (1) | JP5401454B2 (ja) |
CN (1) | CN102047028A (ja) |
TW (1) | TW201013096A (ja) |
WO (1) | WO2009145247A1 (ja) |
Cited By (7)
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JP2012043561A (ja) * | 2010-08-16 | 2012-03-01 | Ibuki Kogyo Kk | 照明灯、およびその取付構造 |
WO2012053204A1 (ja) * | 2010-10-22 | 2012-04-26 | パナソニック株式会社 | ランプ及び照明装置 |
JP2012120477A (ja) * | 2010-12-08 | 2012-06-28 | Showa Denko Kk | 植物栽培用の照明装置および植物栽培装置 |
WO2012117018A1 (de) * | 2011-03-03 | 2012-09-07 | Osram Ag | Leuchtvorrichtung |
CN103474324A (zh) * | 2013-09-11 | 2013-12-25 | 海宁市美裕晟电子有限公司 | 一种紧凑型荧光灯 |
JP2014032850A (ja) * | 2012-08-03 | 2014-02-20 | Mec:Kk | Led照明装置 |
JP2015204782A (ja) * | 2014-04-21 | 2015-11-19 | 世紀 内山 | Led放射器 |
Families Citing this family (7)
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---|---|---|---|---|
JP2012142410A (ja) | 2010-12-28 | 2012-07-26 | Rohm Co Ltd | 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置 |
JP5657591B2 (ja) * | 2011-03-23 | 2015-01-21 | 株式会社東芝 | 半導体発光装置およびその製造方法 |
DE102011017195A1 (de) | 2011-04-15 | 2012-10-18 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
CN103374737A (zh) * | 2012-04-27 | 2013-10-30 | 库特勒自动化系统(苏州)有限公司 | 太阳能电池电镀装置 |
CN103256500A (zh) * | 2013-04-10 | 2013-08-21 | 达亮电子(苏州)有限公司 | 发光二极管灯管 |
CN104180215B (zh) * | 2013-05-22 | 2017-03-15 | 赛尔富电子有限公司 | 一种led灯具 |
US20160369950A1 (en) * | 2015-06-19 | 2016-12-22 | Jason Arlen Yeager | Tube-style light bulb having light emitting diodes |
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US7556406B2 (en) * | 2003-03-31 | 2009-07-07 | Lumination Llc | Led light with active cooling |
US7014337B2 (en) * | 2004-02-02 | 2006-03-21 | Chia Yi Chen | Light device having changeable light members |
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- 2009-05-28 JP JP2010514528A patent/JP5401454B2/ja not_active Expired - Fee Related
- 2009-05-28 WO PCT/JP2009/059752 patent/WO2009145247A1/ja active Application Filing
- 2009-05-28 US US12/995,038 patent/US20110073883A1/en not_active Abandoned
- 2009-06-01 TW TW098117997A patent/TW201013096A/zh unknown
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JP2012043561A (ja) * | 2010-08-16 | 2012-03-01 | Ibuki Kogyo Kk | 照明灯、およびその取付構造 |
WO2012053204A1 (ja) * | 2010-10-22 | 2012-04-26 | パナソニック株式会社 | ランプ及び照明装置 |
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JP2014032850A (ja) * | 2012-08-03 | 2014-02-20 | Mec:Kk | Led照明装置 |
CN103474324A (zh) * | 2013-09-11 | 2013-12-25 | 海宁市美裕晟电子有限公司 | 一种紧凑型荧光灯 |
JP2015204782A (ja) * | 2014-04-21 | 2015-11-19 | 世紀 内山 | Led放射器 |
Also Published As
Publication number | Publication date |
---|---|
CN102047028A (zh) | 2011-05-04 |
JPWO2009145247A1 (ja) | 2011-10-13 |
US20110073883A1 (en) | 2011-03-31 |
JP5401454B2 (ja) | 2014-01-29 |
TW201013096A (en) | 2010-04-01 |
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