WO2009129689A1 - 管形led照明装置 - Google Patents

管形led照明装置 Download PDF

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Publication number
WO2009129689A1
WO2009129689A1 PCT/CN2009/000279 CN2009000279W WO2009129689A1 WO 2009129689 A1 WO2009129689 A1 WO 2009129689A1 CN 2009000279 W CN2009000279 W CN 2009000279W WO 2009129689 A1 WO2009129689 A1 WO 2009129689A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
glass tube
type element
tubular type
tubular
Prior art date
Application number
PCT/CN2009/000279
Other languages
English (en)
French (fr)
Inventor
陈宗烈
Original Assignee
Chen Zonglie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Zonglie filed Critical Chen Zonglie
Priority to JP2011505347A priority Critical patent/JP5372139B2/ja
Priority to KR1020107026235A priority patent/KR101375388B1/ko
Priority to EP09734445.1A priority patent/EP2278856B1/en
Publication of WO2009129689A1 publication Critical patent/WO2009129689A1/zh
Priority to US12/910,180 priority patent/US8038322B2/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/005—Reflectors for light sources with an elongated shape to cooperate with linear light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/357—Driver circuits specially adapted for retrofit LED light sources
    • H05B45/3578—Emulating the electrical or functional characteristics of discharge lamps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to LED lighting, and more particularly to an LED, and an illumination device comprising the same. Background technique
  • LED photonics is a core issue in fixed lighting technology.
  • the light emitted by the active layer of the LED escapes into the environment through a complex path in the chip, and at each step of its travel, absorption in the substrate, semiconductor layer, electrode and resin cap causes some photons to be lost.
  • the basic method used in high-brightness LEDs today is to use a thick transparent substrate and increase the number of photon escape pyramids. In a rectangular configuration, open up to 6 pyramids, or simply remove the absorptive substrate.
  • the photon extraction efficiency is improved; the typical active layer thickness of the high-brightness LED is 0.3 ⁇ 1 ⁇ , further reducing the thickness of the active layer to 0.3 ⁇ , and introducing a multi-quantum well heterostructure to improve its performance, the external quantum efficiency can only Reached 20%.
  • the heat sink components introduced are mostly made of metal materials, which is difficult to be compatible between light extraction and good heat conduction.
  • LEDs are not considered for compatibility with white light general illumination and original general illumination sources, especially for the compatibility and interchangeability of conventional tubular fluorescent lamps used in large areas. Summary of the invention
  • a tubular type element LED comprising: a primitive glass tube capable of transmitting light, the elementary glass tube having two sealed ends, and respectively provided with a power plug and a power socket; at least one LED emitting light a substrate disposed in the cell glass tube, one side of the LED light-emitting substrate is mounted with a plurality of LED chips for emitting light, and is powered by the power plug and the power socket; and a plurality of fixing brackets, It fixes the at least one LED light-emitting substrate in the inner cavity of the cell glass tube.
  • the tubular type element LED further includes a reflector attached to an inner surface or an outer surface of the primitive glass tube to reflect light emitted by the at least one LED light emitting substrate to the outside of the primitive glass tube .
  • the elementary glass tube is one of a polycrystalline alumina tube, a quartz glass tube, a bai glass tube, a borosilicate glass tube, a glass ceramic tube and a common soda lime glass tube. .
  • the power plug and the power socket are matched with each other, and two or more of the tubular type element LEDs may be connected to each other through the power plug and the power socket .
  • the power plug and the power socket are matched single-pin plugs and single-hole jacks, or matched double-pin plugs and two-hole jacks.
  • the shape of the elementary glass tube is one of a cylindrical shape, an arcuate cylindrical shape, an elliptical cylindrical shape, an arcuate elliptical cylindrical shape, a polygonal prism shape, and an arcuate polygonal prism shape.
  • the diameter of the primitive glass tube is 0.5 mm to 26.5 mm, and the wall thickness is 0.15 mn! ⁇ 1.5mm, length 7mm ⁇ 480mm.
  • the LED light-emitting substrate has a length of 6 mm to 470 mm, a width of 0.25 mm to 24 mm, and a thickness of 0.1 mm to 1.5 mm.
  • the LED light-emitting substrate is composed of a translucent polycrystalline alumina plate or a quartz glass plate.
  • the LED chip is a microcrystalline LED chip.
  • the diameter of the microcrystalline LED chip is 10 ⁇ m to 50 ⁇ m.
  • the reflector is a film-type metal reflector plated on an inner surface or an outer surface of the cell tube wall, or the reflector is inlaid in the The plate metal reflector of the inner surface or the outer surface of the wall of the primitive glass tube, or the reflector is a dielectric film.
  • the metal reflector is made of aluminum;
  • the dielectric film is a film made of zinc sulfide and magnesium fluoride, or a film made of silicon monoxide and magnesium fluoride.
  • the reflector is attached to one half of an inner surface or an outer surface of the elementary glass tube.
  • the tubular type element LED includes two LED light emitting substrates.
  • the two LED light-emitting substrates are symmetrically arranged along the axis of the elementary glass tube, and the extending planes of one side of the two LED light-emitting substrate mounting chips are larger than each other. An angle of 90°.
  • the tubular type element LED includes three LED light emitting substrates.
  • the planes of the three LED light-emitting substrates respectively intersect to form a triangular prism, and one side of the three LED light-emitting substrate mounting chips is located on the outer surface of the triangular prism.
  • each of the two LED light-emitting substrates is symmetrical to each other with respect to a plane in which the third LED light-emitting substrate is located.
  • the plurality of fixing brackets are made of metal.
  • the metal from which the plurality of fixing brackets are formed is surface-polished aluminum.
  • the cell glass tube is filled with 100 Torr to 3 atm of dry nitrogen or an inert gas.
  • tubular type element LED of the present invention a part of the heat generated by the operation of the light-emitting substrate chip transmits heat to the support and the reflector through the metal lead, and a part of the heat is radiated by the good thermal conductivity of the PCA board, and the high-density nitrogen gas in the elementary glass tube is emitted.
  • the inert gas is heat exchanged and convected, through the metal reflector, the bracket, the glass wall heat exchange, and finally diffused through the glass wall to the air outside the tube, and the transparency of the elementary glass tube also increases the radiant heat. Too much.
  • the tubular type element LED according to the present invention starts from heat conduction, heat exchange, heat dissipation and photon escaping, not only improves the internal quantum efficiency of the chip, but also increases the external quantum efficiency by 200%; the single tube type element LED
  • the input power is also increased from 3 ⁇ 5W of the existing high-power white LED to a maximum power of 15 ⁇ 20W.
  • a plurality of tubular element LEDs according to the present invention can be combined with each other to form a lamp tube, which can adopt a mode adopted by a general illumination light source, especially a conventional tubular fluorescent lamp used in a large area. Both use and interchangeability.
  • Figure 1 is a perspective view of a first embodiment of a tubular-type cell LED in accordance with the present invention.
  • Fig. 2 is a cross-sectional view in the A-A direction of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 3 is a cross-sectional view in the B-B direction of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 4 is a schematic illustration of an LED lighting substrate of a first embodiment of a tubular-type cell LED in accordance with the present invention.
  • Fig. 5 is an enlarged view of the LED lighting substrate of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 6A is a front elevational view of an end power supply plug and power outlet of a first embodiment of a tubular base LED in accordance with the present invention
  • Figure 6B is a side view of a first embodiment of a tubular base LED in accordance with the present invention
  • Fig. 6C is a cross-sectional view taken along line BB of the end power socket of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 7 is a cross-sectional view in the B-B direction of the reflector of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 8 is a cross-sectional view in the A-A direction of the reflector of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 9 is a schematic illustration of a two-part reflector of a tubular-type cell LED in accordance with the present invention.
  • Figure 10 is a schematic illustration of a second embodiment of a tubular-type cell LED (arc-shaped tubular cell LED) in accordance with the present invention.
  • Fig. 11 is a schematic view showing an example of a lighting device (straight pipe) composed of a tubular type element LED according to a first embodiment of the present invention.
  • Fig. 12 is a view showing another example of a lighting device (annular lamp) constructed of a tubular type element LED according to a second embodiment of the present invention. detailed description
  • tubular-type LED of the present invention is a tubular-type high power, high-illuminance white LED. The structure thereof will be described below with reference to the drawings.
  • the "primary" LED refers to N (N ⁇ l) LED microchips which can be combined with each other to form a luminous whole in a "cell" in which a glass tube is used as an outer carrier. This particular whole is referred to in the present invention as a “tubular” LED, or simply a “primitive” LED.
  • Figure 1 is a perspective view of a first embodiment of a tubular-type cell LED in accordance with the present invention.
  • Figure 2 is a cross-sectional view in the A-A direction of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 3 is a cross-sectional view taken along the line B-B of the first embodiment of the tubular type element LED according to the present invention.
  • the tubular element LED includes a primitive glass tube 1, a reflector 2, an LED light-emitting substrate 3, a power plug 4, a power outlet 4', and a plurality of fixed brackets 5.
  • the elementary glass tube 1 is controlled by a translucent polycrystalline alumina (PCA) tube, a quartz glass tube, a glass tube, a borosilicate glass tube, a glass-ceramic tube, or a common soda lime glass.
  • the elemental glass tube 1 preferably has a diameter of 0.5 mn! ⁇ 26.5mm, wall thickness 0.15mm ⁇ 1.5mm, length 7mm ⁇ 480mm, inner circle and port (both ends of the inner circle are ground into a taper) Grinding and polishing, geometric size specification, smooth and transparent.
  • the tubular type element LED of the present invention may further include a reflector 2 for reflecting light emitted from the LED light-emitting substrate 3.
  • the reflector 2 for reflecting the light emitted from the LED light-emitting substrate 3 will be specifically described below with reference to Figs.
  • Figure 7 is a cross-sectional view in the B-B direction of the reflector of the first embodiment of the tubular type element LED according to the present invention.
  • Figure 8 is a cross-sectional view in the A-A direction of the reflector of the first embodiment of the tubular type element LED according to the present invention.
  • the reflector 2 is aluminum plated on a certain area of the inner wall of the elementary glass tube 1 (may also be other metal having good light reflecting characteristics, for example, silver).
  • the layer may also be a metal reflector formed by lining a metal plate on the inner wall of the elementary glass tube 1.
  • a dielectric film may be plated on a certain area of the inner wall of the cell glass tube 1, and the dielectric film may reflect visible light and transmit infrared light.
  • the dielectric film may be a film composed of zinc sulfide and magnesium fluoride, or may be a film composed of silicon monoxide and magnesium fluoride.
  • the reflector 2 can reflect light emitted from the LED light-emitting substrate 3. Therefore, the reflector is preferably disposed on a half cylindrical surface of the inner wall of the elementary glass tube 1 to achieve a good reflection effect. Of course, the reflector 2 can also have the same reflection effect on the outer wall of the elementary glass tube 1 as when it is located on the inner wall of the elementary glass tube 1.
  • the metal reflector formed of the metal plate is in close contact with the inner wall of the elementary glass tube 1 to achieve a good heat conduction effect.
  • FIGS. 7 and 8 only show the reflector 2 formed as a whole
  • the metal reflector 2 composed of the metal plate can be designed to be B if it is considered to be the best effect of heat dissipation from the LED chip PN junction.
  • Figure 9 is a schematic illustration of a two-part reflector 2 of a tubular-type cell LED in accordance with the present invention.
  • the reflector 2 can be divided into two in the conductive function.
  • the reflector 2 is not absolutely necessary for the tubular element LED. Since the tubular type element LED uses three or more LED light-emitting substrates 3 in order to obtain a uniform luminous flux around the tubular-type element LED, the reflector 2 may not be used.
  • the LED light-emitting substrate 3 will be specifically described below with reference to Figs.
  • Figure 4 is a schematic illustration of an LED lighting substrate of a first embodiment of a tubular-type cell LED in accordance with the present invention.
  • Figure 5 is an enlarged view of the LED light-emitting substrate of the first embodiment of the tubular type element LED according to the present invention.
  • the LED light-emitting substrate 3 has a strip shape and is composed of a highly thermally conductive translucent PCA alumina plate or a quartz glass plate 3-1.
  • the strip type LED light-emitting substrate 3 may preferably be 6 nm long! ⁇ 470mm, Width 0.25mm ⁇ 24mm, Thickness 0.1mm ⁇ 1.5mm Translucent PCA Alumina is pressed and sintered, or it can be pressed from fused silica glass of similar size.
  • one surface of the LED light-emitting board 3 is integrally mounted with N LED chips 3-2, and the chip body is composed of a micro-crystal LED chip of an AlInGaN blue light system.
  • the PN junctions of the LED chips 3-2 are first connected in parallel by a lead and then connected in series to form an anode lead terminal 3-3 and a cathode lead terminal 3-4.
  • the LED light-emitting substrate 3 it may be arranged in such a way that each N (N> 1 ) microcrystalline chips are connected in parallel and four such groups are connected in series. Microcrystalline chip.
  • the LED light-emitting substrate 3 also has a suitable combination of two kinds of ion-type phosphors 3-5 that emit broadband: SrGa 2 S4 : Eu 2 + SrS : Eu 2 .
  • the former converts blue light into green light emission of about 535 nm, and the latter converts blue light into red light emission of about 615 nm.
  • the LED light-emitting board 3 is a PCA alumina plate capable of transmitting 95% or more of visible light.
  • the LED chip can be a chip of an appropriate size to emit light of any color, and the phosphor can also be other combinations.
  • At least one LED light-emitting substrate 3 is placed in a tubular type element LED according to the present invention. As shown in Fig. 2, two LED light-emitting substrates 3 are placed in the cell glass tube 1. Preferably, the two LED light-emitting substrates 3 are symmetrically arranged along the axis of the elementary glass tube 1. The extending planes of the two LED light-emitting substrates 3 on one side of the chip form a certain angle with each other, preferably >90 The angle of °.
  • the two LED light-emitting substrates 3 shown in Fig. 2 are merely examples.
  • an LED light-emitting substrate can be placed only in the cell glass tube 1.
  • three LED light-emitting substrates 3 can be placed in the cell glass tube 1.
  • the three LED light-emitting substrates may be arranged in any manner,
  • the planes in which the three LED light-emitting substrates are located intersect to form a triangular prism, and one side of the three LED light-emitting substrate-mounting chips is located on the outer surface of the triangular prism.
  • each of the two LED light-emitting substrates is symmetrical to each other with respect to a plane in which the third LED light-emitting substrate is located.
  • the orientation of one side of the three LED light-emitting substrate-mounting chips may be any orientation.
  • one of the three LED light-emitting substrates is mounted on the side of the adjacent LED light-emitting substrate on which the chip is not mounted.
  • the tubular type element LED may not use the reflector 2.
  • the LED light-emitting substrate 3 is fixed to the primitive glass tube by a plurality of one ends. 1 or a plurality of fixing brackets 5 supported on the reflector 2, the fixing bracket 5 may be made of metal, preferably made of surface-polished aluminum to have a good light reflecting effect.
  • the fixing bracket 5 since the fixing bracket 5 is made of metal, the fixing bracket 5 can be used to supply power to the LED lighting substrate 3.
  • the plurality of fixing brackets 5 can be divided into a plurality of positive electrode holders 5-1 and a plurality of negative electrode holders 5-2.
  • the positive electrode holder 5-1 or the negative electrode holder 5-2 may be connected to the power source plug of the tubular type element LED and the positive electrode or the negative electrode of the power socket through the reflector 2. Since the reflector 2 is a unitary body, it can only serve as a conductor for connecting the positive electrode or a conductor for connecting the negative electrode.
  • the negative electrode holder 5-2 is fixed on the inner wall of the elementary glass tube 1 and insulated from the reflector 2, And connected to the negative pole of the power plug 4 and the power outlet 4 through a wire insulated from the reflector 2.
  • the positive electrode holder 5- 1 and the negative electrode holder 5- 2 serve as power supply leads for the anode lead terminal 3-3 and the cathode lead terminal 3-4 of the microchip on the LED light-emitting substrate 3, respectively.
  • the positive electrode holder 5- 1 and the negative electrode holder 5-2 can be interchanged. That is, the negative electrode holder 5-2 is connected to the negative electrode of the power plug 4 and the power socket 4' through the reflector 2, and the positive electrode holder 5-1 is fixed on the inner wall of the elementary glass tube 1 and insulated from the reflector 2. .
  • the PN junction can be in good contact with the metal reflector through the fixing bracket 5, thereby transferring the heat generated by the PN junction to the tightness.
  • the metal reflector 2 of the half glass wall to which the elementary glass tube 1 is attached is diverged by heat conduction.
  • the two comb members 2a and 2b of the reflector 2 are insulated from each other by a low-voltage O DC 12V (the minimum insulation distance).
  • the insulating material 2c is included so that the combs 2a and 2b of the reflector 2 are respectively connected to the plurality of positive electrode holders 5-1 and the negative electrode holders 5-2 of the holder 5 shown in Fig. 1 at the closest distance.
  • 6A is an end power supply of a first embodiment of a tubular type element LED according to the present invention.
  • 6B is a front cross-sectional view of the end power plug of the first embodiment of the tubular base LED according to the present invention
  • FIG. 6C is a cross section of the tubular type LED according to the present invention.
  • the two sealed ends of the elementary glass tube 1 are sintered by glass frit pressing or glass-ceramic pressing.
  • the two ends are respectively provided with a power plug 4 and a power socket 4', wherein the power plug 4 is a power input terminal, and the power socket 4' is a power output terminal.
  • the power plug 4 and the power outlet 4' may be made of any conductive material such as metal.
  • the power plug 4 and the power socket 4' may be embossed terminals, and the convex end is a square-shaped guideline 4-1 and a circular cross-section.
  • the double-pin plug of the round pin 4-2 has a concave end which is a square hole 4'-1 and a circular hole 4'-2.
  • the power plug 4 and the power outlet 4' may be any structure suitable for plugging in each other, in addition to the two-pin plug and the two-hole socket. Therefore, the power plug 4 and the power socket 4' having the same specifications are matched with each other and can be plugged into each other.
  • the two ends of the tube-type element LED of the same specification can be connected by plugging to form a tubular whole composed of any single element, which is extremely convenient for use with the lamp holder of the existing straight tube fluorescent lamp system. .
  • one pin and one hole are positive electrodes, and the other pin and the other hole are negative electrodes, thereby supplying power to the LED light-emitting substrate 3.
  • the power plug and the power outlet may also be a single-pin power plug and a single-hole power outlet. That is, when the single-pin power plug is positive, the single-hole power outlet is negative, or when the single-pin power plug is negative, the single-hole power outlet is positive.
  • the power plug and the power outlet are of a double-pin and two-hole structure or a single-pin and single-hole structure, when the power plug 4 and the power socket 4' of the same plug structure are plugged into each other, electrical connections can be made between them.
  • the square-shaped pins and holes and the circular-section pins and holes in the above-described power plug and power socket are merely examples, and the pins and holes in the power plug and the power socket may be of any shape as long as they are easily plugged.
  • the case where power is supplied from the power plug 4 and the power socket 4 to the LED light-emitting board 3 through the metal fixing bracket 5 and the metal reflector 2 has been discussed above.
  • a person skilled in the art can construct a circuit for supplying power from the power plug 4 and the power outlet 4' to the LED lighting substrate 3 in other manners. As shown in FIG. 1, the power plug 4 and the metal fixing bracket 5 of the power socket 4' can be connected by wires to supply power to the LED light-emitting board 3.
  • the power plug 4 and the power socket 4' can be connected to the metal fixing bracket 5 by arranging a metal wire or a transparent wire on the elementary glass tube 1 or the reflector 2, thereby passing the metal fixing bracket. 5 Power is supplied to the LED light-emitting board 3. Of course, it is also possible to directly connect the power plug 4 and the power socket 4' to the LED light-emitting substrate 3.
  • the power plug 4 and the power socket 4' and the end portion and the elementary glass tube 1 are hermetically sealed by metallization brazing or low melting glass.
  • the following two steps are performed during the hermetic sealing process, step 1) one of heating the entire device to 150 ° C in a vacuum to remove moisture and other gases adsorbed in the cell glass tube 1 , and step 2) Fill the cell glass tube 1 with 100 Torr to 3 atm dry nitrogen or an inert gas (for example, argon gas, helium gas, etc.).
  • nitrogen is charged because the cost of using nitrogen in the art is the lowest.
  • Nitrogen is generally obtained from liquid nitrogen, which is very dry and has a moisture content of less than 10 parts per million, which ensures that the water vapor content inside the package is less than 5000 ppm (five thousandths).
  • a dew point (6000 ppm, or six thousandths) below 0 G C ensures that any water that has been condensed exists in the form of ice, and will never cause the internal components of the elementary glass tube 1 caused by liquid water. And the failure of the line.
  • the microcrystalline LED chip 3-2 is directly mounted on the LED light-emitting substrate 3 made of PCA alumina which has good heat conductivity and can transmit more than 95% of visible light, and a part of heat generated by the LED chip 3-2 is passed through the fixing bracket 5 and the reflector. 2 conduction. Another part of the heat is radiated by the good thermal conductivity of the LED light-emitting substrate 3 of the PCA, and is convectively exchanged with the high-density nitrogen gas or other inert gas in the elementary glass tube 1, and is exchanged by the reflector 2, the fixed bracket 5, and the glass wall. The heat is finally diffused through the glass wall into the air outside the elementary glass tube 1. In addition, the transparency of the elementary glass tube 1 also increases the radiant heat permeability.
  • the microcrystalline LED chip has a diameter of only about ⁇ , but the side length is 40 ⁇ , compared with the diameter of the millimeter-scale chip, its peripheral length is more than 100 times longer, which provides a good lateral escape of the active layer photons. path.
  • the photons generated by the active layer of about 16 ⁇ m 2 around the chip are directly exposed without a barrier, because the width of the chip ⁇ 0.4 1!1 is transparent to visible light, and the external quantum efficiency is improved by nearly 200%. Photons that escape from any of the many microcrystalline LED chips can be directly emitted into the outer layer space through the primitive glass tube of the tubular element LED or reflected by the reflector 2 in the elementary glass tube 1. Move the outer space in one direction.
  • the present invention starts from the heat conduction, heat exchange, heat dissipation and photon escaping of the LED chip, not only improves the internal quantum efficiency of the chip, but also increases the external quantum efficiency by 200%; the input power of a single primitive It is also increased from 3 ⁇ 5W of the existing high-power white LED to a maximum power of 15 ⁇ 20W.
  • FIG. 10 is a schematic illustration of another embodiment of a tubular-type cell LED (arc-shaped cell-type cell LED) in accordance with the present invention.
  • the tubular element LED can be designed as an arc tube.
  • the structure of the curved tubular type element LED of the present embodiment is the same as that of the tubular type element LED of FIG. 1 to 3 except that the elementary glass tube 1, the reflector 2, and the LED light emitting substrate 3 are formed in an arc shape.
  • the central angle of the arcuate tubular element LED may be any angle, preferably less than 180 degrees.
  • the tubular type element LED including components such as the elementary glass tube 1, the reflector 2, the LED light emitting substrate 3, etc.
  • the tubular type element LED including components such as the elementary glass tube 1, the reflector 2, the LED light emitting substrate 3, etc. can be formed as Any shape, for example, is one of a cylindrical shape, an arcuate cylindrical shape, an elliptical cylindrical shape, an arcuate elliptical cylindrical shape, a polygonal prism shape, and an arcuate polygonal prism shape.
  • a plurality of tubular element LEDs can be assembled to form an illumination
  • a device such as a light tube.
  • An embodiment of a lamp tube composed of a plurality of tubular type element LEDs of the present invention will now be described with reference to Figs.
  • Fig. 11 is a view showing an example of a lighting device (straight tube lamp) composed of a tubular type unit LED according to a first embodiment of the present invention.
  • the straight tube lamp is composed of three tube-type element LEDs 10-1 to 10-3 of the first embodiment.
  • an adapter plug 10-4 At the right end of the straight pipe is an adapter plug 10-4, one end of the adapter plug is inserted into the socket of the tubular type element LED 10-3, and the other end of the adapter plug can be inserted into the lamp holder (not shown)
  • the socket, tubular head LED 10- 1 head can be inserted into the socket at the other end of the lamp holder.
  • an adapter plug can be mounted on both sides of the straight tube lamp, so that even if the size of the illumination device composed of a plurality of tubular element LEDs does not match the size of the lamp holder, the adapter plug can be used.
  • the lighting device is assembled to the light stand.
  • the straight tube can be constructed from any number of tubular element LEDs of the first embodiment. Depending on the size of the tubular element LED, the straight tube thus constructed is compatible with prior art fluorescent light fixtures.
  • Fig. 12 is a view showing another example of a lighting device (annular lamp) constructed of a tubular type unit LED according to a second embodiment of the present invention.
  • the toroidal bulb is composed of three arc-shaped tubular element LEDs 1 1- 1 to 1 1-3 of the second embodiment.
  • One end of each of the arc-shaped tubular elements LEDs 1 1- 1 and 1 1-3 of the ring-shaped lamp tube is plugged with the adapter plug 1 1-4, and the one end of the adapter plug exposed to the outside is 1 1 -41 can be inserted into the socket of the lamp holder (not shown).
  • the toroidal bulb can be constructed from any number of arcuate tubular element LEDs of the second embodiment. Depending on the size of the curved tubular element LED, the circular tube thus constructed can be compatible with prior art fluorescent light fixtures.
  • the lamp tube composed of a plurality of tubular type element LEDs of the present invention has good compatibility with conventional lamps.
  • the tube of various shapes can be conveniently constructed by using the tubular element LEDs of various shapes of the present invention.
  • the interconnection of the tubular type element LED of the first embodiment and the tubular type element LED of the second embodiment and other shaped tubular type element LEDs can form the prior art.
  • a lamp of any shape, such as a spiral tube, a U-shaped tube, or a butterfly tube, can be constructed from the tubular element LED of the present invention.
  • a lamp tube such as a circular ring or a polygon.
  • the adapter plug can not only assemble the lighting device to the lamp holder, but also, when the plurality of tubular element LEDs to be plugged in When the plug and the socket do not match each other, the adapter type plugs can also be used to connect the tubular type element LEDs whose plugs and sockets do not match each other.
  • the present invention can also be realized as a tubular LED which cannot be used as a primitive. Gp, the tubular LED has a power plug or a power outlet at one end and cannot be plugged into another tubular LED. Except for this, the structure of the tubular LED is the same as that of the tubular type LED of the first embodiment and the second embodiment.
  • the above embodiments of the present invention are merely exemplary, and various modifications and changes can be made without departing from the spirit of the invention.

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  • Physics & Mathematics (AREA)
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  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

Figure imgf000003_0001
技术领域
本发明涉及 LED照明， 尤其涉及一种 LED、 以及由该 LED组 成的照明装置。 背景技术
LED光子学是固定照明技术的核心问题。 LED有源层发射的光 通过在芯片中复杂的路径逸出到环境中，在其行程的每一步中，衬底、 半导体层、 电极和树脂帽中的吸收使一些光子损失。现在高亮度发光 二极管中应用的基本方法是采用加厚的透明衬底，并增加光子逸出角 锥的数目， 在矩型配置下， 开放多至 6个角锥， 或者干脆去掉吸收型 衬底， 使光子引出效率得到改善； 高亮度 LED典型的有源层厚度在 0.3〜1μπι， 进一步把有源层厚度降到 0.3μπι， 并引入多量子阱异质 结构改善其性能， 外量子效率仅能够达到 20%。 其次， 作为大功率 固定白光照明芯片结点散热问题难以解决，现在引入的散热器件大部 分为金属材料制成， 在光引出和良好导热散热之间难以很好的兼容。 再次， LED 作为白光普通照明与原有普通照明光源所采用的模式没 有考虑其兼容性，尤其是与大面积使用的传统管型荧光灯的兼用和互 换性。 发明内容
为了克服现有技术的缺陷， 本发明的目的是提供一种管型基元
LED。
一种管型基元 LED, 其包括： 基元玻管， 其能够透射光， 所述 基元玻管具有两个被密封的端部，并且分别设置有电源插头和电源插 座；至少一个 LED发光基板，其被安置在所述基元玻管内，所述 LED 发光基板的一面贴装多个用于发光的 LED芯片， 并且通过所述电源 插头和所述电源插座供电； 以及多个固定支架， 其将所述至少一个 LED发光基板固定在所述基元玻管的内腔中。 所述的管型基元 LED还包括反射体， 其附在所述基元玻管的内 表面或外表面上以将所述至少一个 LED发光基板发出的光反射到所 述基元玻管外部。
在所述的管型基元 LED中， 所述基元玻管是多晶氧化铝管、 石 英玻璃管、 拜可玻璃管、 硼硅玻璃管、 微晶玻璃管和普通钠钙玻璃管 之一。
在所述的管型基元 LED中， 所述电源插头和所述电源插座互相 匹配， 两个或两个以上的所述管型基元 LED可以通过所述电源插头 和所述电源插座彼此连接。
在所述的管型基元 LED中， 电源插头和电源插座是相互匹配的 单针插头和单孔插座， 或者是相互匹配的双针插头和双孔插座。
在所述的管型基元 LED中， 基元玻管的形状是圆柱形、 弧形圆 柱形、 椭圆柱形、 弧形椭圆柱形、 多棱柱形、 和弧形多棱柱形之一。
在所述的管型基元 LED 中， 所述的基元玻管直径为 0.5mm〜 26.5mm, 壁厚 0.15mn！〜 1.5mm， 长度 7mm〜480mm。
在所述的管型基元 LED 中， 所述的 LED 发光基板长 6mm〜 470mm , 宽 0.25mm〜24mm， 厚 0.1mm〜 1.5mm。
在所述的管型基元 LED中， 所述 LED发光基板由半透明多晶氧 化铝板或石英玻璃板构成。
在所述的管型基元 LED中， 所述 LED芯片是微晶 LED芯片。 在所述的管型基元 LED中， 所述微晶 LED芯片的直径是 10 μ m〜50 μ m。
在所述的管型基元 LED中， 所述反射体是镀在所述基元玻管管 壁的内表面或外表面的膜式金属反射体，或者所述反射体是镶 ¼在所 述基元玻管管壁的内表面或外表面的板式金属反射体， 或者， 所述反 射体是介质膜。
在所述的管型基元 LED中， 所述金属反射体由铝构成； 所述介 质膜是硫化锌和氟化镁构成的膜， 或是一氧化硅和氟化镁构成的膜。
在所述的管型基元 LED中， 所述基元玻管的内表面或外表面的 一半附有所述反射体。 在所述的管型基元 LED中， 所述管型基元 LED包括两个 LED 发光基板。
在所述的管型基元 LED中，所述两个 LED发光基板沿着所述基 元玻管的轴线对称地布置， 所述两个 LED 发光基板贴装芯片的一面 的延伸平面互相构成大于 90° 的夹角。
在所述的管型基元 LED中， 所述管型基元 LED包括三个 LED 发光基板。
在所述的管型基元 LED中，所述三个 LED发光基板各自所在的 平面相交构成一个三角柱， 并且所述三个 LED发光基板贴装芯片的 一面位于所述三角柱的外表面。 .
在所述的管型基元 LED中， 在所述三个 LED发光基板中， 每两 个 LED发光基板相对于第三个 LED发光基板所在的平面彼此对称。
在所述的管型基元 LED中， 所述多个固定支架由金属制成。 在所述的管型基元 LED中， 制成所述多个固定支架的金属为经 过表面抛光的铝。
在所述的管型基元 LED中，所述基元玻管内充入 100Torr〜3atm 的干燥氮气或惰性气体。
根据本发明的管型基元 LED , 发光基板芯片工作时产生的热一 部分通过金属引线向支架和反射体传导热， 一部分通过 PCA板良好 的导热性能散发出来，与基元玻管内的高密度氮气或惰性气体进行热 交换发生对流， 通过金属反射体、 支架、 玻壁换热， 最后穿过玻壁发 散到管外的空气中， 再者基元玻管的透明性也增加了辐射热的透过 性。 因此， 根据本发明的管型基元 LED从导热、 换热、 散热和光子 逸出着手，不仅使芯片的内量子效率提升，而且使外量子效率有 200% 的提高； 单只管型基元 LED的输入功率也由现有大功率白光 LED的 3〜5W提高到最大功率 15〜20W。
而且， 多个根据本发明的管型基元 LED能够彼此结合构成一只 灯管， 该灯管可以采用普通照明光源所采用的模式， 尤其是与大面积 使用的传统管型荧光灯有很好的兼用性和互换性。 附图说明
图 1是根据本发明的管型基元 LED的第一实施例的立体图。 图 2是根据本发明的管型基元 LED的第一实施例的 A-A方向的 剖视图。
图 3是根据本发明的管型基元 LED的第一实施例的 B-B方向的 剖视图。
图 4是根据本发明的管型基元 LED的第一实施例的 LED发光基 板的示意图。
图 5是根据本发明的管型基元 LED的第一实施例的 LED发光基 板的放大示图。
图 6A是根据本发明的管型基元 LED的第一实施例的端部电源 · 插头和电源插座的正面示图； 图 6B 是根据本发明的管型基元 LED 的第一实施例的端部电源插头的 B-B方向剖视图； 图 6C是根据本发 明的管型基元 LED 的第一实施例的端部电源插座的 B-B 方向剖视 图。
图 7 是根据本发明的管型基元 LED 的第一实施例的反射体的 B-B方向的剖视图。
图 8 是根据本发明的管型基元 LED 的第一实施例的反射体的 A-A方向的剖视图。
图 9是根据本发明的管型基元 LED的由两部分构成的反射体的 示意图。
图 10是根据本发明的管型基元 LED的第二实施例的示意图（弧 形管型基元 LED ) 。
图 1 1 是根据本发明第一实施例的管型基元 LED构成的照明装 置 （直管） 的一个示例示意图。
图 12是根据本发明第二实施例的管型基元 LED构成的照明装 置 （环形灯管） 的另一个示例示意图。 具体实施方式
以下将参照附图来描述本发明的实施例。 在附图中相同的标号 表示相同的部件。
【第一实施例】
本发明的管型基元 LED的一个优选实施例是一种管型基元大功率高照 度白光 LED。 以下参照附图来描述其结构。
在本发明中， "基元" LED指的是 N ( N ^ l ) 个 LED微晶芯片 能够在一个玻璃管作外包载体的"基元"内相互结合组成一个能够发 光的整体。 这个特定的整体在本发明中被称之为一个 "管形基元" LED , 或简称之 "基元" LED。
图 1是根据本发明的管型基元 LED的第一实施例的立体图。 图 2是根据本发明的管型基元 LED的第一实施例的 A-A方向的剖视图。 图 3是根据本发明的管型基元 LED的第一实施例的 B-B方向的剖视 图。
如图 2和 3所示， 管型基元 LED包括基元玻管 1、 反射体 2、 LED发光基板 3、 电源插头 4、 电源插座 4 ' 、 和多个固定支架 5。
具体地讲， 基元玻管 1 由半透明多晶氧化铝 （PCA ) 管、 石英 玻璃管、 拜可玻璃管、 硼硅玻璃管、 微晶玻璃管或普通钠钙玻璃管制 作。 例如， 所述的基元玻管 1 直径优选地为 0.5mn！〜 26.5mm， 壁厚 0.15mm〜1 .5mm， 长度 7mm〜480mm， 内圆及端口 （内圆两端头打 磨成锥口） 打磨抛光加工， 几何尺寸规范， 光洁透明。
优选地， 本发明的管型基元 LED还可以包括一个用于反射 LED 发光基板 3发出的光的反射体 2。
以下将参照图 7和 8来具体描述用于反射 LED发光基板 3发出 的光的反射体 2。
图 7 是根据本发明的管型基元 LED 的第一实施例的反射体的 B-B方向的剖视图。 图 8是根据本发明的管型基元 LED的第一实施 例的反射体的 A-A方向的剖视图。
如图 8所示， 在本发明的优选实施例中， 反射体 2为在基元玻 管 1 的内壁一定区域上镀的铝 （也可以是其它有良好反光特性的金 属， 例如， 银） 反射层， 还可以是在基元玻管 1 内壁镶衬金属板而构 成的金属反射体。 另外， 可以在基元玻管 1 的内壁一定区域上镀介质膜， 介质膜 可以反射可见光， 透射红外光。 例如， 介质膜可以是硫化锌和氟化镁 构成的膜， 也可以是一氧化硅和氟化镁构成的膜。
反射体 2可以对从所述 LED发光基板 3发出的光进行反射。 因 此，所述反射体优选的布置在所述基元玻管 1 内壁的半个圆柱面以起 到良好的反射效果。 当然， 反射体 2也可以在所述基元玻管 1的外壁 上， 所起到的反射效果与位于基元玻管 1 的内壁时相同。
另外， 所述的金属板构成的金属反射体紧贴基元玻管 1 内壁以 达到良好的导热效果。
当然， 虽然图 7和图 8仅仅示出了形成为一个整体的反射体 2， 但是， 如果从 LED芯片 PN结散热的最佳效果考虑， 可以将金属板 构成的金属反射体 2设计成由 B— B轴向两片多凹凸几乎完全对插到 头的梳状件。 图 9是根据本发明的管型基元 LED的由两部分构成的 反射体 2的示意图。 这样反射体 2就可在导电功能上一分为二了。
需要注意的是， 反射体 2对于管型基元 LED并非绝对必要。 由 于管型基元 LED使用三个或更多 LED发光基板 3通常是为了在管型 基元 LED的周围获得均匀的光通量， 所以可以不使用反射体 2。
以下将参照图 4和 5来具体描述 LED发光基板 3。
图 4是根据本发明的管型基元 LED的第一实施例的 LED发光基 板的示意图。图 5是根据本发明的管型基元 LED的第一实施例的 LED 发光基板的放大示图。
如图 4所示， LED发光基板 3为条形， 由高导热半透明 PCA氧 化铝板或石英玻璃板 3- 1构成。 例如， 所述的条型 LED发光基板 3可优 选地由长 6mn！〜 470mm，宽 0.25mm〜24mm，厚 0.1mm〜1.5mm半透明 PCA 氧化铝压制烧结而成， 或者可由类似尺寸的熔融石英玻璃压制而成。
如图 5所示， LED发光基板 3的一面集成贴装 N个 LED芯片 3-2， 所述的芯片主体由 AlInGaN蓝光体系的微晶 LED芯片构成。 通过引 线将 LED芯片 3-2的 PN结先分别并联再串联，从而形成阳极引线端 3-3和阴极引线端 3-4。例如，在 LED发光基板 3上，可以以每 N( N> 1 ) 个微晶芯片并联为一组并且四个这样的组串联在一起的方式来布置 微晶芯片。
LED发光基板 3还具有宽带发射的两种离子型荧光粉 3-5 的适 当组合： SrGa2 S4 : Eu2+SrS : Eu2。 前一种把蓝光转换为 535nm 左右 的绿光发射， 后一种把蓝光转换为 615nm左右的红光发射。 适当搭 配直接发射绿光和红光的芯片,可得到高显色指数， Ra (显色指数） 最高可达到 99。 优选地是， 所述 LED发光基板 3是能够透过 95%以 上可见光的 PCA氧化铝板。
当然， 本领域技术人员能够了解， 所述 LED芯片可以是适当尺 寸的发出任意颜色光的芯片， 并且所述荧光粉也可以是其它组合。
根据本发明的一个管型基元 LED内至少放置一个 LED发光基板 3。 如图 2所示， 在所述基元玻管 1 内放置两个 LED发光基板 3。 优 选地是， 两个 LED发光基板 3沿着所述基元玻管 1 的轴线对称地布 置， 两个 LED发光基板 3贴装芯片的一面的延伸平面互相构成一定 的夹角， 优选为〉90° 的夹角。
另外， 图 2所示的两个 LED发光基板 3仅仅是示例。 在一个未 图示的例子中， 可以仅在基元玻管 1 内放置一个 LED发光基板。 在 另一个未图示的例子中， 可以在基元玻管 1 内放置三个 LED发光基 板 3。 可以以任意方式布置所述三个 LED发光基板，
在一个优选实施例中， 三个 LED发光基板各自所在的平面相交 构成一个三角柱， 并且三个 LED发光基板贴装芯片的一面位于所述 三角柱的外表面。
在另一个优选实施例中， 每两个 LED 发光基板相对于第三个 LED发光基板所在的平面彼此对称。 三个 LED发光基板贴装芯片的 一面的朝向可以是任意朝向， 优选地是， 三个 LED发光基板中每一 个 LED发光基板贴装芯片的一面朝向相邻 LED发光基板未贴装芯片 的一面。
当然， 如果必要， 可以在基元玻管 1 内放置四个或更多 LED发 光基板。 需要注意的是， 在使用三个或更多 LED发光基板的情况下， 所述管型基元 LED可以不使用反射体 2。
如图 2和 3所示， LED发光基板 3 由多个一端固定在基元玻管 1或反射体 2上的多个固定支架 5支撑， 固定支架 5可由金属制成， 优选地由表面抛光的铝制成以具有良好的光反射效果。 在本实施例 中， 由于固定支架 5由金属制成，所以固定支架 5可以被用来向 LED 发光基板 3供电。 具体地讲， 如图 2和 3所示， 多个固定支架 5可分 为多个正极支架 5- 1和多个负极支架 5-2。 在反射体 2 由金属制成的 情况下， 正极支架 5- 1或负极支架 5-2可通过反射体 2连接到管型基 元 LED的电源插头和电源插座的正极或负极。 由于反射体 2是一个 整体， 因此它只能作为连接正极的导体或连接负极的导体。
例如， 当正极支架 5- 1 通过反射体 2与电源插头和电源插座的 正极相连接时， 负极支架 5-2固定在所述基元玻管 1的内壁上并与反 射体 2之间绝缘， 并且通过与反射体 2绝缘的导线连接到电源插头 4 和电源插座 4，的负极。 同时， 正极支架 5- 1和负极支架 5- 2分别作为 LED发光基板 3上的微晶芯片的阳极引线端 3-3和阴极引线端 3-4的 电源引线。 当然， 在上述结构中， 正极支架 5- 1和负极支架 5-2可以 互换。 即， 负极支架 5-2通过反射体 2与电源插头 4和电源插座 4' 的负极连接，而正极支架 5- 1固定在所述基元玻管 1的内壁上并与反 射体 2之间绝缘。
无论是正极支架 5- 1还是负极支架 5-2与反射体 2相接触， PN 结均可通过固定支架 5 与所述的金属反射体多点良好接触， 从而将 PN结发出的热量传输给紧贴基元玻管 1的半个玻壁的金属反射体 2， 通过热传导发散出去。
而且， 在另一优选实施例中， 如图 9所示， 反射体 2 的两片梳 状件 2a和 2b互为凹凸相接部位维持一个低压 O DC 12V )最小绝缘 距离的绝缘间隔 （也可以包含绝缘材料） 2c， 以便反射体 2的梳状件 2a和 2b分别与图 1所示支架 5的多根正极支架 5- 1和负极支架 5-2 在最近距离连接。 这样， 可比上述仅仅正极支架 5- 1或负极支架 5-2 与反射体 2导电连接的方式达到更好的热传导效果。
以下将参照图 6A— 6C来具体描述管型基元 LED的第一实施例 的端部电源插头和电源插座。
图 6A是根据本发明的管型基元 LED的第一实施例的端部电源 插头和电源插座的正面示图， 图 6B 是根据本发明的管型基元 LED 的第一实施例的端部电源插头的 B-B方向剖视图， 图 6C是根据本发 明的管型基元 LED 的第一实施例的端部电源插座的 B- B 方向剖视 图。
如图 1和 2所示， 所述基元玻管 1 的两个密封端部， 并且由玻 璃熔料压制或微晶玻璃压制后烧结而成。两个端部分别设置有电源插 头 4和电源插座 4'， 其中， 电源插头 4是电源输入端， 电源插座 4' 是电源输出端。 所述电源插头 4和电源插座 4 ' 可以由金属之类的任 何导电材料制成。 在本发明的优选实施例中， 如图 6B和 6C所示， 电源插头 4 和电源插座 4'可以是凹凸引出端子， 凸端为一截面为方 形的方针 4- 1和一截面为圆形的圆针 4-2的双针插头， 凹端为一截面 为方形的方孔 4'- 1和一截面为圆形的圆孔 4'-2的双孔插座。 显而易 见， 除了所述的双针插头和双孔插座以外， 电源插头 4和电源插座 4' 可以是任何适合相互插接的结构。 因此， 具有相同规格的电源插头 4 和电源插座 4'相互匹配， 并且可相互插接。 这样制成的同一规格的 管型基元 LED的两端可以通过插接方式连接而构成一个由任意个基 元构成的管状整体，极其方便与现有直管荧光灯体系的灯棚灯具架兼 容使用。
在上述双针和双孔结构的电源插头和电源插座中， 一针和一孔 为正极， 另一针和另一孔为负极， 这样来为 LED发光基板 3供电。
另外， 尽管附图示出了双针电源插头和双孔电源插座， 但是， 所述电源插头和电源插座还可以是单针电源插头和单孔电源插座。 即， 当单针电源插头为正极时， 单孔电源插座为负极， 或者当单针电 源插头为负极时， 单孔电源插座为正极。
无论电源插头和电源插座是双针和双孔结构或者是单针和单孔 结构， 当相同插接结构的电源插头 4 和电源插座 4'相互插接时， 它 们之间可以进行电连接。
另外， 上述电源插头和电源插座中的方形截面的针和孔以及圆 形截面的针和孔仅仅是示例， 只要便于插接， 电源插头和电源插座中 的针和孔可以是任意形状。 上面己经讨论过从所述电源插头 4和电源插座 4，通过金属固定 支架 5和金属反射体 2来向 LED发光基板 3供电的情况。 本领域技 术人员可以以其它方式构成从所述电源插头 4和电源插座 4 ' 向所述 LED发光基板 3供电的电路。 如图 1所示， 可以通过导线将所述电 源插头 4和电源插座 4 ' 所述金属固定支架 5相连接， 从而向 LED 发光基板 3供电。另外， 还可以通过把金属导线或透明导线布置在基 元玻管 1上或反射体 2上来将所述电源插头 4和电源插座 4 ' 与所述 金属固定支架 5相连接， 从而通过金属固定支架 5 向 LED发光基板 3供电。 当然， 还可以直接将电源插头 4和电源插座 4 ' 与所述 LED 发光基板 3相连接。
优选地是， 所述电源插头 4和电源插座 4 ' 以及端部与基元玻管 1均采用金属化钎焊或低熔点玻璃气密性封接。 优选地是， 在所述气 密性封接过程中进行以下两个步骤， 步骤 1 ) 有一个在真空中加热整 体器件到 150°C以去除吸附在基元玻管 1 内水气和其他气体， 和步骤 2 ) 在基元玻管 1 内充入 100Torr〜3atm干燥氮气或惰性气体 （例如， 氩气、 氖气等） 。 优先地是， 充入氮气， 因为在本领域中使用氮气的 成本最低。 氮气一般从液氮中得到， 这种氮非常干燥， 水气含量小于 百万分之十， 能确保封装内部水气含量小于 5000ppm (千分之五） 。 这样低于 0GC的露点 （6000ppm， 即千分之六） ， 就保证了凝结的任 何水都是以冰的形式存在的， 绝对不会引起液态水所造成基元玻管 1 内元器件和线路的故障。
微晶 LED芯片 3-2直接安装在导热良好可透过 95%以上可见光 的 PCA氧化铝制成的 LED发光基板 3上， LED芯片 3-2工作时产 生的一部分热量通过固定支架 5和反射体 2传导。另一部分热量通过 PCA的 LED发光基板 3 良好的导热性能散发出来， 与基元玻管 1 内 的高密度氮气或其他惰性气体进行热交换发生对流， 通过反射体 2、 固定支架 5、玻壁换热，最后穿过玻壁发散到基元玻管 1外的空气中。 另外， 基元玻管 1 的透明性也增加了辐射热的透过性。
微晶 LED芯片这种良好的热应力释放导致介电电场的减弱， 提 升了芯片的内量子效率。 而微晶 LED芯片的集成陈列贴装使芯片周 边面积增加。 另外， 微晶 LED 芯片由于直径仅约 ΙΟμηι , 但边长达 40μπι， 与直径毫米级芯片相比较， 其周边长度有 100倍以上的延长， 为有源层光子的侧向逸出提供了良好的路径。 芯片周边约 16μιη2有 源层产生的光子是毫无遮栏的直射出来， 因为芯片的宽度< 0.4 1!1对 可见光视同是透明的，外量子效率的提高达到近 200%。众多微晶 LED 芯片无论从哪一个方向逸出的光子， 要么直接透过管型基元 LED的 基元玻管 1射向外层空间，要么被基元玻管 1 内的反射体 2反射， 换 一个方向投向外层空间。
综上所述,本发明由于从 LED芯片导热、 换热、 散热和光子逸出 着手， 不仅使芯片的内量子效率提升， 而且使外量子效率有 200%的 提高； 单只基元的输入功率也由现有大功率白光 LED的 3〜5W提高 到最大功率 15〜20W。
【第二实施例】
' 虽然在以上叙述中描述了管型基元 LED的一个优选实施例， 但是， 本领域技术人员能够理解， 还可以将上述管型基元 LED 形成为其它形状。 图 10是根据本发明的管型基元 LED的另一个实施例的示意图（弧形 管型基元 LED ) 。
在本实施例中， 如图 10所示， 可以将管型基元 LED设计为弧 形管。 除了将基元玻管 1、 反射体 2、 LED发光基板 3制成为弧形以 外， 本实施例的弧形管型基元 LED 的结构与图 1一 3 中的管型基元 LED的结构相同。所述弧形管型基元 LED的中心角可以为任意角度， 优选地为小于 180度。
显然，本领域技术人员能够理解，除了本实施例的弧形管型基元 LED 以外， 包含诸如基元玻管 1、 反射体 2、 LED发光基板 3等部件的管 型基元 LED可以形成为任何形状， 例如， 是圆柱形、 弧形圆柱形、 椭圆柱形、 弧形椭圆柱形、 多棱柱形、 和弧形多棱柱形之一。
【第三实施例】
在本发明中， 多个管型基元 LED能够装配在一起形成一个照明
u 装置， 例如灯管。下面参照图 1 1和 12描述由多个本发明的管型基元 LED构成的灯管的实施例。
图 11 是由据本发明第一实施例的管型基元 LED构成的照明装 置 （直管灯） 的一个示例示意图。
如图 1 1 所示， 直管灯由三个第一实施例的管型基元 LED 10- 1 至 10-3和构成。 在该直管右端是一个转接插头 10-4， 该转接插头的 一端插入管型基元 LED 10-3的插座中， 该转接插头的另一端可插入 灯架 （未示出） 一端的插座， 管型基元 LED 10- 1的 头可插入灯架 另一端的插座。当然，可以在所述直管灯的两侧安装转接插头，这样， 即使由多个管型基元 LED组成的照明装置的尺寸与灯架的尺寸不匹 配， 也可以通过转接插头将这样的照明装置装配到灯架上。
本领域技术人员能够理解， 该直管可以由任意数量个第一实施 例的管型基元 LED 构成。 根据管型基元 LED 的尺寸不同， 这样构 成的直管可以与现有技术荧光灯架兼容。
【第四实施例】
图 12是由据本发明第二实施例的管型基元 LED构成的照明装 置 （环形灯管） 的另一个示例示意图。
如图 12 所示， 圆环形灯管由三个第二实施例的弧形管型基元 LED 1 1- 1至 1 1-3构成。 在该环形灯管的弧形管型基元 LED 1 1- 1和 1 1-3各有一端与转接插头 1 1-4插接在一起， 图中该转接插头暴露在 外的一端 1 1-41可插入灯架 （未示出） 的插座。
本领域技术人员能够理解， 该圆环形灯管可以由任意数量个第 二实施例的弧形管型基元 LED 构成。 根据弧形管型基元 LED 的尺 寸不同， 这样构成的圆环形灯管可以与现有技术荧光灯架兼容。
因此， 本发明的由多个管型基元 LED构成的灯管具有与传统灯 具良好的兼容性。 而且， 本领域技术人员根据上述描述可以理解， 利 用本发明的各种形状的管型基元 LED , 可以方便的构成各种形状的 灯管。 例如， 用第一实施例的管型基元 LED和第二实施例的管型基 元 LED以及其它形状管型基元 LED的互相连接可以形成现有技术的 任何形状的灯管， 例如螺旋灯管， U形灯管， 蝶形灯管， 均可由本发 明的管型基元 LED构成。 而且， 还可以形成楠圆环形、 多边形之类 的灯管。
通过对第四和第五实施例的描述， 本领域技术人员能够理解， 所述转接插头不但能够使照明装置装配到灯架上， 而且， 当要被插接 的多个管型基元 LED的插头和插座彼此不匹配时， 也可以用转接插 头使这些插头和插座彼此不匹配的管型基元 LED连接到一起。
【第五实施例】
本发明还可以被实现为不能作为基元的管型 LED。 gp， 所述管 型 LED仅一端具有电源插头或电源插座， 不能够和另一管型 LED相 互插接。 除此之外， 所述管型 LED的结构与第一实施例和第二实施 例的管型基元 LED相同。 本发明的以上实施例仅仅是示例性的， 在不脱离本发明的精神 的情况下， 可以进行各种修改和变型。

Claims

权 利 要 求
1. 一种管型基元 LED, 其包括：
基元玻管 （1) ， 其能够透射光， 所述基元玻管具有两个被密封 的端部， 并且分别设置有电源插头 （4) 和电源插座 （4') ；
至少一个 LED发光基板 （3) ， 其被安置在所述基元玻管 （1) 内， 所述 LED发光基板 （3) 的一面贴装多个用于发光的 LED芯片 (3-2) ， 并且通过所述电源插头 （4) 和所述电源插座 （4') 供电； 以及
多个固定支架 （5) ， 其将所述至少一个 LED发光基板 （3) 固 定在所述基元玻管 （1) 的内腔中。
2. 如权利要求 1所述的管型基元 LED, 其特征在于， 还包括反 射体 （2) ， 其附在所述基元玻管 （1) 的内表面或外表面上以将所述 至少一个 LED发光基板 （3) 发出的光反射到所述基元玻管 （1) 外 部。
3. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述基元 玻管 （1) 是多晶氧化铝管、 石英玻璃管、 拜可玻璃管、 硼硅玻璃管、 微晶玻璃管和普通钠钙玻璃管之一。
4. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述电源 插头 （4) 和所述电源插座 （4') 互相匹配， 两个或两个以上的所述 管型基元 LED可以通过所述电源插头 （4) 和所述电源插座 （4') 彼 此连接。
5. 如权利要求 4所述的管型基元 LED, 其特征在于， 所述电源 插头 （4) 和所述电源插座 （4') 是相互匹配的单针插头和单孔插座， 或者是相互匹配的双针 （4-1， 4-2) 插头和双孔 （4，-1， 4'-2) 插座。
6. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述基元 玻管 （1) 的形状是圆柱形、 弧形圆柱形、 椭圆柱形、 弧形椭圆柱形、 多棱柱形、 和弧形多棱柱形之一。
7. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述的 基元玻管 （1) 直径为 0.5mm〜26.5mm， 壁厚 0.15mm〜 1.5mm， 长 度 7mm〜 480mm
8. 如权利要求 7所述的管型基元 LED,其特征在于，所述的 LED 发光基板 （3) 长 6mm〜470mm， 宽 0.25mn！〜 24mm， 厚 O.lmn！〜 1.5mm0
9. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述 LED 发光基板 （3) 由半透明多晶氧化铝板或石英玻璃板构成。
10.如权利要求 1所述的管型基元 LED,其特征在于，所述 LED 芯片 （3-2) 是微晶 LED芯片。
11. 如权利要求 10所述的管型基元 LED, 其特征在于， 所述微 晶 LED芯片的直径是 10μ ηι〜50μ m。
12. 如权利要求 2所述的管型基元 LED, 其特征在于， 所述反 射体 （2) 是镀在所述基元玻管 （1) 管壁的内表面或外表面的膜式金 属反射体， 或者是镶衬在所述基元玻管 （1) 管壁的内表面或外表面 的板式金属反射体， 或者， 所述反射体 （2) 是介质膜。
13 如权利要求 12所述的管型基元 LED, 其特征在于， 所述金 属反射体由铝构成； 所述介质膜是硫化锌和氟化镁构成的膜， 或者是 一氧化硅和氟化镁构成的膜。
14. 如权利要求 2所述的管型基元 LED, 其特征在于， 所述基 元玻管 （1) 的内表面或外表面的一半附有所述反射体 （2) 。
15. 如权利要求 2所述的管型基元 LED, 其特征在于， 所述反 射体 （2) 是由相互插入并保持绝缘的两个梳状金属件 （2a，2b) 构成 的。
16. 如权利要求 1或 2所述的管型基元 LED, 其特征在于， 所 述管型基元 LED包括两个 LED发光基板 （3) 。
17. 如权利要求 16所述的管型基元 LED, 其特征在于， 所述两 个 LED发光基板 （3) 沿着所述基元玻管 （1) 的轴线对称地布置， 所 述两个 LED发光基板 （3) 贴装所述 LED芯片 （3-2) 的一面的延伸 平面互相构成大于 90° 的夹角。
18. 如权利要求 1或 2所述的管型基元 LED, 其特征在于， 所 述管型基元 LED包括三个 LED发光基板 （3) 。
19. 如权利要求 18所述的管型基元 LED, 其特征在于， 所述三 个 LED发光基板 （3)各自所在的平面相交构成一个三角柱， 并且所 述三个 LED发光基板贴装芯片的一面位于所述三角柱的外表面。
20. 如权利要求 18所述的管型基元 LED, 其特征在于， 在所述 三个 LED发光基板（3)中，每两个 LED发光基板相对于第三个 LED 发光基板所在的平面彼此对称。
21. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述多 个固定支架 （5) 由金属制成。
22. 如权利要求 21所述的管型基元 LED, 其特征在于， 制成所 述多个固定支架 （5) 的金属为经过表面抛光的铝。
23. 如权利要求 1所述的管型基元 LED, 其特征在于， 所述基元 玻管 （1) 内充入 100Torr〜3atm的干燥氮气或惰性气体。
PCT/CN2009/000279 2008-04-24 2009-03-16 管形led照明装置 WO2009129689A1 (zh)

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EP09734445.1A EP2278856B1 (en) 2008-04-24 2009-03-16 Tubular led lighting device
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