WO2009115147A1 - Dispositif capteur et procédé de fabrication d'un dispositif capteur - Google Patents

Dispositif capteur et procédé de fabrication d'un dispositif capteur Download PDF

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Publication number
WO2009115147A1
WO2009115147A1 PCT/EP2008/066313 EP2008066313W WO2009115147A1 WO 2009115147 A1 WO2009115147 A1 WO 2009115147A1 EP 2008066313 W EP2008066313 W EP 2008066313W WO 2009115147 A1 WO2009115147 A1 WO 2009115147A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
sensor device
evaluation
recess
outer housing
Prior art date
Application number
PCT/EP2008/066313
Other languages
German (de)
English (en)
Inventor
Christian Ohl
Juergen Kurle
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009115147A1 publication Critical patent/WO2009115147A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings

Definitions

  • the invention is based on a sensor device according to the preamble of claim 1.
  • Such sensor devices are well known.
  • the document DE 10 2005 040 781 A1 discloses a sensor device with a housing, a sensor element, an evaluation element and a carrier element, wherein the sensor element and the carrier element are attached to the housing and the evaluation element to the carrier element.
  • the evaluation element is electrically connected to the sensor element via bonding wires, wherein for the production of the bonding wire connection, an additional manufacturing step is needed and wherein bonding wire connections are relatively sensitive to mechanical shocks and temperature fluctuations.
  • an elastic protective cover for protecting the evaluation element and / or the sensor element from mechanical shocks of the housing is not provided.
  • the sensor device according to the invention and the method according to the invention for producing a sensor device according to the independent claims have the advantage over the prior art that the evaluation element is significantly better protected by the protective medium from mechanical influences, such as shocks or vibrations, and at the same time a comparatively robust electrically conductive Connection is made between the evaluation and the sensor element in a simpler and space-compact manner on the carrier element, so that additional manufacturing steps for the manufacture of an electrically conductive connection between the evaluation and the sensor element can be saved. Furthermore, a passivation of the evaluation element is realized by the protective medium at the same time, so that a further production step for producing Passivation is saving position and the evaluation is protected from corrosion.
  • the arrangement of the protective medium between the evaluation and the outer housing preferably allows the use of a mold housing as the outer housing, since the evaluation is protected solely by the protective medium from corrosion and mechanical shocks.
  • the evaluation element, the support element and / or the sensor element is at least partially or completely enveloped by the protective medium, very particularly preferably by the variable shaping of the protective medium, an outer housing with an arbitrary housing shape or any housing structure, in particular a comparatively inexpensive standard housing, is usable.
  • a particularly cost-effective production of the sensor device is possible in that the protective medium for producing the outer housing is molded directly with the second material of the outer housing.
  • the protective medium comprises an elastic and / or a compressible first material, wherein preferably the outer housing comprises a second material, which is less elastic than the first material is formed.
  • the protection of the evaluation element from mechanical shocks and shocks is significantly increased by an elastic and / or compressible first material, wherein the evaluation is protected by the less elastic second material of the outer housing against irreversible and direct external force effects.
  • the sensor device has an inner housing made of a third material, which at least partially surrounds the evaluation element and / or the carrier element, wherein preferably the third material is less elastic than the first material. Due to the inner housing, the protection of the evaluation element against corrosion or mechanical influences is increased in a particularly advantageous manner.
  • a tensile force of the compressible first material in the case of deformation of the first material as a result of mechanical influences, such as shocks or vibrations, does not act directly on the sensor element, but preferably on the inner housing.
  • the evaluation element is thus particularly preferably protected in at least one direction by three material layers, wherein the elastic material layer of the first material is arranged between two material layers of the less elastic second and third materials. The achievable Re protection against mechanical shocks and shocks, as well as against corrosion is thus increased in comparison to the prior art in a considerable way.
  • the protective medium has a first recess
  • the outer housing has a second recess and / or the inner housing has a third recess, wherein the first, the second and / or the third recess preferably above or in the region of a pressure-sensitive Area of the sensor element are arranged.
  • at least one subarea of the sensor element can be reached from outside the housing in a particularly advantageous manner, wherein, for example, an external pressure reaches the pressure-sensitive region of the sensor element through the first, second, and / or third recesses, wherein at the same time the evaluation element, which in particular evaluates electrical signals of the sensor element is provided by the protective medium has a maximum protection against the outside atmosphere outside the outer casing and thus against corrosion.
  • the evaluation element is electrically conductively connected to the sensor element, in particular via the carrier element, and / or that the outer housing has a channel.
  • the carrier element functions particularly advantageously both for mechanically fixing the evaluation element and the sensor element, as well as for producing an electrically conductive connection between the evaluation element and the sensor element, wherein compared to the prior art significantly less space is required and wherein the carrier element preferably a printed circuit board, at least one conductor track and / or a board comprises, which are rigid and / or flexible.
  • Such an electrically conductive connection is substantially more durable and resistant to mechanical vibrations, temperature fluctuations and / or corrosion than a bonding wire connection proposed in the prior art.
  • the sensor device has at least one contact element, in particular a connection pin, wherein the at least one contact element is electrically conductively connected to the carrier element, the evaluation element and / or the sensor element in an electrically conductive manner.
  • the evaluation element and / or the sensor element are particularly electrically contactable from the outside, so that, for example, a data transfer with the evaluation element and / or the sensor element and / or a power supply of the evaluation element and / or the sensor element from outside the outer housing are made possible.
  • Preference is given by a direct electrically conductive contact between the carrier element and the Contact element a further contacting process in the manufacture of the sensor device can be saved.
  • the outer housing particularly preferably comprises a plug socket for the contact element, so that a plug, in particular a low-cost standard plug, can be used for contacting the evaluation element and / or the sensor element and very particularly preferably latched to the outer housing.
  • the sensor element comprises a micromechanical component, preferably a pressure sensor, and / or the evaluation element comprises an electrical, an electronic and / or a further microelectronic component.
  • the evaluation element comprises a microelectronic component, which is provided for reading and / or for driving the sensor element, wherein the sensor element very particularly preferably comprises a pressure sensor, which external pressure through the first, second and / or third Recess detected and generates a signal in response to the measured pressure and passes on to the sensor element and / or to the contact element.
  • the sensor element is at least partially enclosed by an elastic and / or a compressible fourth material, wherein the fourth material is preferably designed to be more elastic than the second and / or the third material.
  • the fourth material is particularly preferably enveloped or covered by the fourth material, so that a production step for at least partial passivation of the sensor element can be saved.
  • Another object of the present invention is a method for producing a sensor device, wherein in a first method step, the evaluation element, the sensor element and / or the carrier element is coated with the protective medium and wherein in a second process step, the protective medium is at least partially covered with the second material ,
  • the first and / or the second method step comprises a standard MoId process, which is comparatively easy to control and inexpensive.
  • the protective medium with the first recess and / or with the channel and / or in the second method step the second material is provided with the second recess, so that Particularly advantageous already in the manufacturing process of the outer housing of the channel, in particular for introducing a pressure to the sensor element, is formed.
  • the evaluation element and / or at least partially the support element is coated with the third material and / or that in a fourth process step, the sensor element is at least partially enveloped with the fourth material, wherein the third method step is preferably carried out prior to the first and / or before the second method step and / or that in the second method step a slide is sprayed over to form the channel.
  • the fourth method step allows the use of a sensor element without passivation layer, since parts of the sensor element or electrical connections of the sensor element are protected by the fourth material from corrosion.
  • a channel is particularly advantageously formed directly on the outer housing, so that the sensor device or the sensor element is protected, for example, from jet water or pressure due to entrapped, frozen water in the region of the pressure-sensitive area of the sensor element.
  • Figure 1 is a schematic side view of a sensor device according to a first
  • Figure 2 is a schematic side view of a sensor device according to a second embodiment of the present invention.
  • Figure 3 is a schematic side view of a sensor device according to a third
  • FIG. 1 shows a schematic side view of a sensor device 1 according to an exemplary first embodiment of the present invention, the sensor device 1 having an outer housing 2 and a carrier element 3, wherein on the carrier element 3, a sensor element 4 and an evaluation element 5 are arranged and Furthermore, between the evaluation element 5 and the outer housing 2, a protective medium 6 for protecting the evaluation element 5 against corrosion and against external mechanical influences sen, such as shocks or shocks, is arranged.
  • the protective medium 6 comprises an elastic and compressible first material 6 ', wherein the outer housing 2 comprises a second material 2', which is less elastic than the first material 6 'is formed.
  • the sensor device 1 has an inner housing 7 made of a third material T, which at least partially encloses the evaluation element 5 and the carrier element 3, and wherein the third material T is less elastic than the first material 6 '.
  • the protective medium 6 has a first recess 8 ', the outer housing 2 a second recess 8 "and the inner housing 7 has a third recess 8'", wherein the first, the second and the third recess 8 ', 8 ", 8'” respectively are arranged above a pressure-sensitive region 9 of the sensor element 4, so that the sensor element 4 or at least one TeN region of the sensor element 4 is open to the outside or accessible from outside the outer housing 2.
  • the sensor element 4 comprises a pressure sensor, wherein a pressure to be measured passes through the first, second and third recesses 8 ', 8 ", 8'” into the pressure-sensitive region of the sensor element 4.
  • the evaluation element 5 is electrically conductively connected to the sensor element 4 via the carrier element 3, the sensor device 1 furthermore having at least one contact element 10, in particular a connection pin, wherein the at least one contact element 10 is electrically conductively connected to the carrier element 3.
  • the evaluation element 5 comprises a microelectronic component for controlling and reading out the sensor element 4, wherein the evaluation element 5 can be contacted electrically via the contact element 10 from the outside.
  • the sensor element 4 is at least partially enclosed by an elastic and compressible fourth material 11 ', the fourth material 11' being made more elastic than the second and the third material 2 ', T and the fourth material 11' being a passivation layer for a partial region of the sensor element 1 functions.
  • FIG. 2 shows a schematic side view of a sensor device 1 according to a second embodiment of the present invention, wherein the second embodiment of the first embodiment illustrated in FIG. 1 is identical, the sensor device being illustrated in FIG. tion 1 no fourth material 11 ', which surrounds the sensor element 4. Rather, the sensor element 4 is partially enveloped by the protective medium 6, so that the protective medium 6 thus also represents a corrosion protection for a portion of the sensor element 4. Furthermore, the protective medium 6 also covers the third recess 6 '", so that the evaluation element 5, the carrier element 3, and the inner housing 7 are substantially completely enveloped by the protective medium 6 and thus protected against mechanical influences and corrosion.
  • FIG. 3 shows a schematic side view of a sensor device 1 according to a third embodiment of the present invention, the third embodiment being identical to the second embodiment illustrated in FIG. 2, wherein the first recess 6 'is designed as a channel 8.
  • a curved or a bent pressure inlet opening is realized to the pressure-sensitive region of the sensor element 4, so that perpendicular to the main extension plane of the sensor element, the outer housing 2 is closed despite the first recess 8 '.
  • a channel 8 is produced particularly advantageously by the encapsulation of, for example, a slide 31 contained in a housing tool in the second method step of the method according to the invention for producing a sensor device.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention prévoit un dispositif capteur (1), comportant un boîtier extérieur (2) et un élément support (3), un élément capteur (4) et un élément d'évaluation (5) étant disposés sur l'élément support, un milieu de protection (6) étant en outre disposé entre l'élément d'évaluation et le boîtier extérieur.
PCT/EP2008/066313 2008-03-20 2008-11-27 Dispositif capteur et procédé de fabrication d'un dispositif capteur WO2009115147A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008000786.2 2008-03-20
DE200810000786 DE102008000786A1 (de) 2008-03-20 2008-03-20 Sensorvorrichtung und Verfahren zur Herstellung einer Sensorvorrichtung

Publications (1)

Publication Number Publication Date
WO2009115147A1 true WO2009115147A1 (fr) 2009-09-24

Family

ID=40418871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/066313 WO2009115147A1 (fr) 2008-03-20 2008-11-27 Dispositif capteur et procédé de fabrication d'un dispositif capteur

Country Status (2)

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DE (1) DE102008000786A1 (fr)
WO (1) WO2009115147A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015122218A1 (de) * 2015-12-18 2017-06-22 Sensata Germany GmbH Drucksensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4413527A (en) * 1981-04-14 1983-11-08 Nippondenso Co., Ltd. Semiconductor pressure sensor
US4838089A (en) * 1986-05-07 1989-06-13 Nippondenso Co., Ltd. Semiconductor pressure sensor
DE19754616A1 (de) * 1996-12-09 1998-06-10 Denso Corp Halbleitersensorbauelement
DE102004016394A1 (de) * 2003-04-03 2004-10-21 Denso Corp., Kariya Halbleiterdrucksensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005040781A1 (de) 2005-08-29 2007-03-22 Robert Bosch Gmbh Gehäuse zum Aufbau von Multichip-Sensoren, bestehend aus integrierten Schaltkreisen und mikromechanischen Sensoren

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4413527A (en) * 1981-04-14 1983-11-08 Nippondenso Co., Ltd. Semiconductor pressure sensor
US4838089A (en) * 1986-05-07 1989-06-13 Nippondenso Co., Ltd. Semiconductor pressure sensor
DE19754616A1 (de) * 1996-12-09 1998-06-10 Denso Corp Halbleitersensorbauelement
DE102004016394A1 (de) * 2003-04-03 2004-10-21 Denso Corp., Kariya Halbleiterdrucksensor

Also Published As

Publication number Publication date
DE102008000786A1 (de) 2009-09-24

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