WO2009087767A1 - Capteur de pression et procédé pour sa fabrication - Google Patents

Capteur de pression et procédé pour sa fabrication Download PDF

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Publication number
WO2009087767A1
WO2009087767A1 PCT/JP2008/050169 JP2008050169W WO2009087767A1 WO 2009087767 A1 WO2009087767 A1 WO 2009087767A1 JP 2008050169 W JP2008050169 W JP 2008050169W WO 2009087767 A1 WO2009087767 A1 WO 2009087767A1
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WO
WIPO (PCT)
Prior art keywords
pin
lead pin
connector
terminal block
lead
Prior art date
Application number
PCT/JP2008/050169
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuo Kurosawa
Kazuya Takimoto
Takuro Ishikawa
Ryusuke Suzuki
Original Assignee
Saginomiya Seisakusho, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saginomiya Seisakusho, Inc. filed Critical Saginomiya Seisakusho, Inc.
Priority to PCT/JP2008/050169 priority Critical patent/WO2009087767A1/fr
Publication of WO2009087767A1 publication Critical patent/WO2009087767A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means

Definitions

  • the present invention relates to a pressure sensor having a semiconductor pressure sensing element and a manufacturing method thereof.
  • a semiconductor pressure sensor using a semiconductor element as a pressure sensing element is known.
  • a one-chip semiconductor pressure sensor in which a pressure detection element and a signal processing circuit are integrated on the same silicon chip has been developed.
  • a pressure sensor in which the electric wire is directly connected to a connector pin (contact pin) has been proposed in order to improve the reliability of connection with an electric wire connected to an external device and to reduce the cost.
  • FIG. 9 is a cross-sectional view showing the configuration of the pressure sensor proposed above.
  • a pressure sensor 10 includes a sensor main body (pressure detection element) 11, a resin terminal block (connector housing) 12, a lid 13, and a cylindrical caulking plate 14 that mechanically couples them. ing.
  • the sensor body 11 includes a metal element housing 15, a glass pedestal 16 hermetically fixed to the central opening of the element housing 15, and a plurality of lead pins 17 hermetically attached to the glass pedestal 16 in a penetrating manner. It comprises an oil filling pipe 18 and a sensor chip mount member 19 and a pressure detection sensor chip 20 fixed to the sensor chip mount member 19 through glass.
  • the sensor chip 20 is formed by etching the center of the back surface of a silicon substrate to form a diaphragm (silicon diaphragm), and a plurality of pressure detecting elements (piezoresistive elements) forming a bridge circuit are formed on the silicon diaphragm portion.
  • Electronic circuits such as an amplifier circuit, a linear correction circuit, a temperature correction circuit, and a correction data holding circuit that are formed and process the output signal of the bridge circuit are integrated by a semiconductor circuit integration technique.
  • the metal part (bonding pad) of the sensor chip 20 and the plurality of lead pins 17 are connected by wire bonding.
  • a metal diaphragm 21 and a diaphragm protective cover 22 having a communication hole covering the metal diaphragm 21 are hermetically fixed to the opening edge of the central opening of the element housing 15 by welding their outer peripheral edges. ing.
  • a liquid seal chamber 23 in which a pressure transmission medium such as silicon oil is enclosed is formed by the central opening of the element housing 15, the glass pedestal 16, and the metal diaphragm 21.
  • the oil filling pipe 18 made of stainless steel is used as a filling port for filling the liquid sealing chamber 23 with oil, and after the oil filling is completed, the tip of the outer pipe is crushed and closely adhered, and the portion is welded. Thereby, the oil is sealed in the liquid sealing chamber 23.
  • the height of the outer peripheral portion of the glass pedestal 16 is formed higher than the center portion, and a ring-shaped metal member 24 is fitted inside the outer peripheral portion, and an opening is provided at the end thereof.
  • a metal plate (shield plate) 25 is electrically and mechanically connected.
  • the ring-shaped metal member 24 is connected to the zero potential of the sensor chip.
  • a joint part 30 is coupled to the lid body 13, and the joint part 30 is configured to be attached to a part to be measured by a coupling screw part 31.
  • the pressure of the fluid is transmitted to the metal diaphragm 21 through the fluid introduction passage 32. Since the metal diaphragm 21 is very thin, the pressure is accurately transmitted to the oil without lowering the pressure. Due to this pressure, the silicon diaphragm of the sensor chip 20 is deformed, and the electric signal detected by the piezoresistive element is processed by the electronic circuit.
  • a plurality (three in this embodiment) of metal connector pins 27 are inserted into the terminal block 12 and fixed by a fixing material (adhesive) 28.
  • the plurality of lead pins 17 and the plurality of connector pins 27 are electrically connected by a connecting member 26 made of a flexible printed circuit (FPC).
  • FPC flexible printed circuit
  • the connection between the plurality of lead pins 17 and the connection member 26 and the connection between the connection member 26 and the plurality of connector pins 27 are performed by laser spot welding.
  • the lead pin 17 is provided with a power supply potential of the sensor chip 20, a zero potential, an output terminal, and a plurality of lead pins respectively connected to one or a plurality of test points, of which the power supply potential, zero
  • the potential and the pin of the output terminal are connected to the corresponding connector pin 27 by the connecting material 26.
  • the core wires 51 of the three electric wires 50 connected to the plurality of connector pins 27 and an external device are respectively joined by ultrasonic welding at the ultrasonic welding portion 52.
  • the sealing material is enclosed in the space 41 inside the waterproof case 40 made of resin, the joint part is molded, and the joint part is protected and waterproofed.
  • a protrusion 42 for preventing the electric wire 50 from falling is provided inside the waterproof case 40.
  • Patent Document 2 International Publication No. 2007/004400 Pamphlet Japanese Patent Laid-Open No. 2004-163321 issued by the Japan Patent Office
  • the purpose of the connector pin is to transmit an electrical signal to the outside. Therefore, an external force is always applied to the connector pin of Patent Document 2.
  • the welded part In the method in which the end of the lead pin and the end of the connector pin are abutted on the same straight line and the abutted part is directly connected by laser spot welding, the welded part must be abutted securely. External force applied to the pin is also applied to the lead pin from the welded portion.
  • the lead pin also has a function of maintaining the airtightness inside the pressure detection element, but there is a possibility that the airtightness may not be maintained by the external force.
  • the connector pin In the conventional pressure sensor, the connector pin is often processed by insert molding at the time of molding the resin terminal block. That is, a connector pin is installed at a predetermined position on a mold for resin molding before resin injection, and then the resin is injected to integrally mold the terminal block. However, in this method, the molding process of the terminal block is complicated.
  • an object of the present invention is to provide a pressure sensor and a method for manufacturing the same that can connect the connector pin and the lead pin with a simpler structure, high accuracy, and stability.
  • the pressure sensor of the present invention is a pressure sensor in which a sensor body having a semiconductor pressure sensing element and a resin terminal block are fixed to each other.
  • a lead pin connected to the semiconductor pressure sensing element is provided to protrude, and the terminal block includes a lead pin insertion portion into which the lead pin is inserted, a lead pin insertion hole formed in a connector pin, and the lead pin insertion portion.
  • a guide portion for positioning the connector pin so that the centers of the lead pins that pass through the connector pin are fixed, and the connector pin set to the guide portion is fixed by thermocompression bonding. It is joined by laser welding with the lead pin inserted into the lead pin insertion hole of the connector pin. .
  • the connector pin is L-shaped, a hole for inserting the lead pin is formed in the horizontal portion, and a fixing portion in which a protrusion provided on the terminal block is fitted in the vertical portion. A hole is formed, and is fixed to the terminal block by thermocompression bonding of the protruding portion fitted in the fixing hole. Further, a recess for preventing damage due to laser welding is provided on the connector pin side of the lead pin insertion portion provided on the terminal block, and a tapered portion is provided on the sensor main body side. Is.
  • the pressure sensor manufacturing method of the present invention is a pressure sensor manufacturing method in which a sensor body having a semiconductor pressure sensing element and a resin terminal block are fixed, and has a plurality of L shapes.
  • the second step of fixing the connector pin to the terminal block, the terminal block to which the connector pin is fixed, and the sensor main body portion, and the lead pin protruding from the sensor main body portion is inserted into the lead pin insertion portion.
  • a third step of assembling the connector pin a fourth step of laser welding the connector pin and the lead pin with the lead pin inserted into the lead pin insertion portion of the connector pin, and fixing the sensor body portion and the terminal block And a sixth step of separating the connector pin member into individual connector pins. Furthermore, a seventh step of thermally welding the electric wire to the connector pin, an eighth step of inserting a waterproof case that covers a welded portion between the connector pin and the electric wire, and enclosing a sealing material in the waterproof case; It is what has.
  • the lead pin and the connector pin are accurately positioned and joined, and the lead pin insertion portion provided in the terminal block and the center of the lead pin insertion hole provided in the connector pin are provided. Therefore, when the connector pins and the lead pins are laser-joined, uniform joining is possible. And since uniform joining can be performed, electrical connection can be reliably performed and a problem is eliminated. In addition, there is no problem even in long-term use (in terms of durability). Further, the connection structure of the terminal block, the connector pin, and the lead pin can be simplified and miniaturized by fixing the connector pin to the terminal block by thermocompression bonding and directly welding the lead pin and the connector pin by laser.
  • the lead pin insertion part provided in the terminal block, no damage such as burning due to laser welding occurred in the terminal block, and since the lower part of the lead pin insertion part was tapered, the lead pin insertion The sex can be improved. Furthermore, because the connector pins are fixed to the terminal block by thermocompression bonding and the connector pins are thin and L-shaped, even if an external force is applied to the connector pins, No force is applied, and the airtightness inside the pressure detection element can be kept good. Furthermore, since the three connector pins are connected, it is possible to set the connector pins with a single insertion operation, thereby improving workability.
  • the pressure sensor of the present invention since a simple structure is used, a flexible substrate or the like is not used as a bonding method, and a structure in which a lead pin and a connector pin are bonded is configured so that direct bonding can be easily and appropriately performed.
  • the problem here is how to properly connect the fixed lead pins and connector pins. Since the lead pins are joined in the state of being inserted into the holes of the connector pins, the positioning is important. In particular, since the lead pins have a small diameter, a structure with high positioning accuracy is required. Further, the beam diameter of laser welding used in the present invention is small, and the above positioning is an important point.
  • the pressure sensor of the present invention has the following structure.
  • the connector pins are fixed to the resin terminal block by thermocompression bonding.
  • a guide portion for positioning the lead pin and the connector pin is provided in the lead pin insertion portion provided on the resin terminal block.
  • the connector pin and the lead pin are joined by laser welding.
  • the lead pin insertion portion of the terminal block has a structure in which a recess is provided in the lower portion of the joint portion so that damage due to heat of laser welding for joining the lead pin and the connector pin does not occur.
  • the lead pin is tapered so that the diameter increases toward the surface (sensor body side) where the lead pin is inserted.
  • FIG. 1A is a cross-sectional view showing the configuration of the first embodiment of the pressure sensor of the present invention
  • FIG. 1B is an enlarged view showing a part of the cross-sectional view
  • FIG. 2 is a perspective view showing a part of the pressure sensor of the present invention shown in FIG.
  • FIG. 3 is a diagram showing the configuration of the connector pins in the pressure sensor of the present invention.
  • FIG. 4 is a perspective view showing the configuration of the terminal block in the pressure sensor of the present invention.
  • FIG. 5 is a diagram showing an example of the manufacturing process of the first embodiment of the pressure sensor of the present invention.
  • FIG. 6 is a view for explaining the state of the terminal block and the connector pin in the manufacturing process. In these drawings, the same components as those in FIG.
  • 60 is a connector pin in the pressure sensor of the present invention
  • 70 is a terminal block 70 in the pressure sensor of the present invention.
  • the connector pin 60 and the terminal block 70 having different structures from the connector pin 27 and the terminal block 12 in FIG. 9 are employed.
  • reference numeral 35 in FIG. 1 denotes an insulating resin material (silicone adhesive) injected in order to improve the electrical insulation between the lead pin 17 and the housing element 15.
  • the connector pin 60 of the present invention has an L-shape with a thin plate thickness, and a lead pin insertion hole (lead pin insertion hole) 61 is formed in the horizontal portion.
  • the resin terminal block 70 has a lead pin insertion portion 71 into which the lead pin 17 is inserted, and is inserted into the lead pin insertion hole 61 of the connector pin 60 and the lead pin insertion portion 71.
  • a guide portion 72 for setting the connector pin 60 is provided so that the centers of the lead pins 17 coincide.
  • a fixing hole 62 is formed to be fitted to a protrusion 73 provided on the rising portion of the terminal block 70, and the connector pin 60 is positioned using the guide portion 72. Then, the connector pin 60 is fixed to the terminal block 70 by heating and crimping the protrusion 73 of the terminal block 70 protruding through the fixing hole 62.
  • the terminal block 70 to which the connector pin 60 is fixed When the terminal block 70 to which the connector pin 60 is fixed is combined with the sensor body 11, the three lead pins 17 protruding from the glass pedestal 16 are respectively formed on the corresponding connector pins 60.
  • the lead pin 17 is inserted into the lead pin insertion hole 61, and the tip of the lead pin 17 protrudes from the connector pin 60 as shown in FIG. In this state, the tip of the lead pin 17 and the connector pin 60 are laser welded. Thereby, the lead pin 17 and the connector pin 60 can be firmly connected without using FPC.
  • the lead pin insertion portion 71 formed on the terminal block 70 has a concave portion with a large diameter at the upper portion (connector pin 60 side). This prevents the terminal block 70 from being damaged by heat generated during laser welding.
  • the lower portion (on the sensor body 11 side) where the lead pin 17 is inserted is tapered so that the diameter increases toward the sensor body 11 so that the lead pin 17 can be easily inserted.
  • FIG. 3A and 3B are diagrams showing the structure of the connector pin, where FIG. 3A is a front view, FIG. 3B is a right side view, and FIG. 3C is a top view.
  • the three connector pins 60-1 to 60-3 are used.
  • the three connector pins are The terminal carrier part 63 is combined and integrated. (The connector pin in this state is referred to as a connector pin member.)
  • the terminal carrier portion 63 is cut off, so that the three independent connector pins 60-1 to 60-3.
  • the connector pin is formed by press working or the like. As shown in FIG. 3, the connector pins 60-1 to 60-3 are L-shaped with a small plate thickness, and are integrated by the terminal carrier part 63 via the thin part 64 at the upper part of the vertical part. Has been. Then, in the vicinity of the center of the vertical portion of each of the connector pins 60-1 to 60-3, fixing holes 62-1 to 62 to which projections for heat welding provided on the terminal block 70 are fitted, respectively. ⁇ 3 is formed, and the width of the vertical portion is formed such that the width of the portion below the vicinity of the fixing hole 62 is wider than the width of the upper portion thereof. In addition, lead pin insertion holes 61-1 to 61-3 into which the tip portions of the corresponding lead pins 17 are respectively inserted are formed in the horizontal portions of the connector pins 60-1 to 60-3.
  • a lead pin insertion portion 71 into which the lead pin 17 is inserted is provided on the inner bottom surface of the resin terminal block 70. Further, the connector pin 60 is positioned so that the center of the lead pin insertion hole 61 of the connector pin 60 and the center of the lead pin insertion portion 71, that is, the center of the lead pin 17 passing through the lead pin insertion portion 71 coincide.
  • a guide part 72 is formed. Further, guide portions 72 corresponding to shapes having different widths of the vertical portions of the connector pins 60-1 to 60-3 are also provided on the inner side surface where the vertical portions of the connector pins 60 abut.
  • the projecting portions 73-1 to 73-1 having a substantially rectangular shape corresponding to the fixing holes 62-1 to 62-3 formed in the vertical portions of the connector pins 60-1 to 60-3, respectively. 73-3 is provided. Further, a hole 74 for injecting the silicon adhesive 35 and the like is also provided on the inner bottom surface.
  • FIG. 5 is a diagram showing an example of the manufacturing process of the pressure sensor of the present invention.
  • the sensor main body 11 assembled by a conventionally known method and the joint 30 (lid 13) are joined by welding.
  • the connector pin 60 is thermocompression bonded to the terminal block 70.
  • the connector pin 60 shown in FIG. 3 is positioned on the terminal block 70 shown in FIG. 4 using the guide portion described above.
  • FIG. 6A shows a state where the connector pins 60 are set on the terminal block 70.
  • the protrusion 73 is heat-welded. In this way, the connector pin 60 is fixed to the terminal block.
  • the terminal block 70 to which the connector pin 60 is fixed in the step (1) -b is incorporated into the sensor main body 11 to which the joint portion 30 (lid 13) is joined in the step (1) -a. . That is, the lead pin 17 protruding from the sensor main body 11 is incorporated into the lead pin insertion portion 71 of the terminal block 70 in alignment. As a result, as shown in FIG. 1B, the tip of the lead pin 17 protrudes above the connector pin 60 through the lead pin insertion portion 71 of the terminal block 70 and the lead pin insertion hole 61 of the connector pin 60. To do.
  • step (3) the sensor body 11 and the terminal block 70 are firmly fixed by inserting the assembly product in the step (2) into the caulking plate 14 and bending the end portion thereof.
  • step (4) the lead pin and the connector pin are joined by laser welding in a state where the lead pin penetrates the lead pin insertion hole of the connector pin as described above.
  • FIG. 6C is a diagram showing this state.
  • the laser welder uses, for example, a YAG type, and its beam diameter is small. Although the lead pin has a small diameter, as described above, accurate positioning can be performed, so that reliable bonding can be performed.
  • step (5) an insulating resin material (silicone adhesive 35) is poured into the entire space between the glass pedestal 16 and the terminal block 70 from the hole 74 of the terminal block 70, and heated to cure. Process. Thereby, the electrical insulation between the lead pin 17 and the element housing 15 can be enhanced.
  • step (6) a withstand voltage test is performed.
  • step (7) the terminal carrier part 63 of the connector pin member is cut off, and the characteristics are confirmed using each connector pin. As described above, the terminal carrier portion 63 can be separated by bending the thin portion 64 provided on the connector pin member.
  • FIG. 6D is a diagram illustrating a state after the terminal carrier portion 63 has been cut off.
  • step (8) the electric wires 50 respectively corresponding to the connector pins 60 are welded, and the waterproof case 40 is inserted.
  • the connector pin 60 and the core wire 51 of the electric wire 50 are welded by, for example, ultrasonic welding.
  • the waterproof case 40 is inserted into the terminal block 70.
  • an adhesive epoxy system
  • step (9) an adhesive is injected into the space 41 inside the waterproof case 40 from above the waterproof case 40 and cured. Thereby, a pressure sensor is completed.
  • a silicon adhesive and an epoxy adhesive are used.
  • the functions required of the adhesive are moisture resistance and water resistance after the thermal environmental test. Conventionally, O-rings and square rings have been used. Since the silicon-based adhesive shown in the first embodiment is soft to some extent, it can be replaced because it can absorb the distortion caused by the thermal expansion coefficient with the surface of the element housing (made of SUS). However, in order to completely fix the electric wire, a mold resin (sealing material) such as an epoxy adhesive is required from above the silicon adhesive because of the structure of the wire drawing type.
  • FIG. 7 is a cross-sectional view showing the configuration of the second embodiment of the pressure sensor of the present invention.
  • FIG. 8 is a diagram showing an example of the manufacturing process of the second embodiment of the pressure sensor of the present invention.
  • the insulating resin material silicone adhesive 35
  • 70 is provided with a polyester film 36. By sticking the polyester film 36 to the housing surface in this way, the electrical insulation between the lead pin 17 and the element housing 15 can be enhanced.
  • the silicon-based adhesive 35 is used. It becomes possible to cope with only one type of epoxy adhesive.
  • the polyester film 36 is affixed to the surface of the housing element 15 at a stage prior to the header-joint welding process of the process (1) -a.
  • the other steps are the same as those shown in FIG. 5, but the step of silicon bond injection and curing in step (5) after the terminal welding in step (4) is omitted in this embodiment.
  • an epoxy-type adhesive agent is inject
  • the film 36 is not limited to a polyester film but may be a polyimide film.
  • an acrylic adhesive can be used in addition to the epoxy adhesive.
  • the number of manufacturing steps can be reduced, and a simpler configuration can be achieved.
  • connection structure of the terminal block, connector pin, and lead pin in the pressure sensor is simplified and miniaturized by fixing the connector pin to the terminal block by thermocompression bonding and directly welding the lead pin and the connector pin by laser. be able to.

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  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne une structure de connexion d'une broche conductrice et d'une broche de connecteur dans un capteur de pression, à l'aide d'un élément de détection de pression à semi-conducteur, laquelle structure peut être simple et hautement fiable. Dans une broche de connecteur en forme de L (60), un trou d'insertion de broche conductrice (61) est formée dans une partie horizontale, et il est positionné de telle sorte que son centre correspond au centre d'une partie d'insertion de conducteur (71) formée dans un socle terminal (70). La broche de connecteur (60) est fixée au socle terminal (70) par compression thermique. Lorsqu'un corps principal de capteur (11) et le socle terminal (70) sont combinés de telle sorte qu'une broche conductrice (17) correspond à la partie d'insertion de broche conductrice (71), la broche conductrice (17) traverse la partie d'insertion de broche conductrice (71) et est insérée dans le trou d'insertion de broche conductrice (61). La broche conductrice (17) et la broche de connecteur (60) sont soudées par laser l'une à l'autre dans cet état.
PCT/JP2008/050169 2008-01-10 2008-01-10 Capteur de pression et procédé pour sa fabrication WO2009087767A1 (fr)

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PCT/JP2008/050169 WO2009087767A1 (fr) 2008-01-10 2008-01-10 Capteur de pression et procédé pour sa fabrication

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PCT/JP2008/050169 WO2009087767A1 (fr) 2008-01-10 2008-01-10 Capteur de pression et procédé pour sa fabrication

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
JP2012122395A (ja) * 2010-12-08 2012-06-28 Denso Corp インジェクタ
JPWO2013058116A1 (ja) * 2011-10-17 2015-04-02 日産自動車株式会社 端子台
CN106662493A (zh) * 2014-06-17 2017-05-10 株式会社鹭宫制作所 传感器单元及具备该传感器单元的压力检测装置
JP2019158638A (ja) * 2018-03-14 2019-09-19 日本電産トーソク株式会社 圧力センサー
EP3049784B1 (fr) * 2013-09-26 2020-08-19 Rosemount Inc. Ensemble de détection de pression de fluide de traitement pour émetteurs de pression soumis à une pression de travail élevée
EP3608646B1 (fr) * 2017-04-07 2021-07-21 Saginomiya Seisakusho, Inc. Capteur de pression

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012122395A (ja) * 2010-12-08 2012-06-28 Denso Corp インジェクタ
CN109524806A (zh) * 2011-10-17 2019-03-26 日产自动车株式会社 端子座
JPWO2013058116A1 (ja) * 2011-10-17 2015-04-02 日産自動車株式会社 端子台
US9543671B2 (en) 2011-10-17 2017-01-10 Nissan Motor Co., Ltd. Terminal block
EP3049784B1 (fr) * 2013-09-26 2020-08-19 Rosemount Inc. Ensemble de détection de pression de fluide de traitement pour émetteurs de pression soumis à une pression de travail élevée
EP3159670A4 (fr) * 2014-06-17 2018-02-21 Saginomiya Seisakusho, Inc. Unité de capteur et dispositif de détection de pression le contenant
JP2018136349A (ja) * 2014-06-17 2018-08-30 株式会社鷺宮製作所 センサユニット、および、それを備える圧力検出装置
KR101945923B1 (ko) * 2014-06-17 2019-02-08 가부시키가이샤 사기노미야세이사쿠쇼 센서칩을 구비하는 센서유닛, 및 그것을 구비하는 압력검출장치
US20170131169A1 (en) * 2014-06-17 2017-05-11 Saginomiya Seisakusho, Inc. Sensor unit having a sensor chip and pressure detection device containing same
US10514314B2 (en) 2014-06-17 2019-12-24 Saginomiya Seisakusho, Inc. Sensor unit having a sensor chip and pressure detection device containing same
CN106662493B (zh) * 2014-06-17 2020-02-28 株式会社鹭宫制作所 传感器单元及压力检测装置
CN106662493A (zh) * 2014-06-17 2017-05-10 株式会社鹭宫制作所 传感器单元及具备该传感器单元的压力检测装置
EP4235134A3 (fr) * 2014-06-17 2023-11-08 Saginomiya Seisakusho, Inc. Dispositif de détection de pression comprenant une unité de capteur
EP3608646B1 (fr) * 2017-04-07 2021-07-21 Saginomiya Seisakusho, Inc. Capteur de pression
US11131594B2 (en) * 2017-04-07 2021-09-28 Saginomiya Seisakusho, Inc. Pressure sensor with a potential adjustment member
JP2019158638A (ja) * 2018-03-14 2019-09-19 日本電産トーソク株式会社 圧力センサー
JP7004596B2 (ja) 2018-03-14 2022-02-04 日本電産トーソク株式会社 圧力センサー

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