WO2009078231A1 - レーザーダイシング装置及びダイシング方法 - Google Patents

レーザーダイシング装置及びダイシング方法 Download PDF

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Publication number
WO2009078231A1
WO2009078231A1 PCT/JP2008/070406 JP2008070406W WO2009078231A1 WO 2009078231 A1 WO2009078231 A1 WO 2009078231A1 JP 2008070406 W JP2008070406 W JP 2008070406W WO 2009078231 A1 WO2009078231 A1 WO 2009078231A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
wafer
dicing
laser
condensing lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070406
Other languages
English (en)
French (fr)
Inventor
Ryosuke Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2009546186A priority Critical patent/JP5131564B2/ja
Priority to US12/809,352 priority patent/US8299397B2/en
Priority to KR1020107013418A priority patent/KR101485451B1/ko
Publication of WO2009078231A1 publication Critical patent/WO2009078231A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane in at least three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)

Abstract

　ウェーハ表面の段差による影響を受けずに高精度なダイシングを行い、且つ、アブレーション起因のパーティクル発生を防止することを可能にする。 　レーザー光をウェーハ（Ｗ）に照射することで改質層をウェーハＷに形成するレーザーダイシング装置（１０）は、レーザー光を集光するコンデンスレンズ（２６）と、レーザー発振装置（２１）により照射されたレーザー光に基づいてウェーハ（Ｗ）の表面の凹凸形状を測定する非点収差式光学測定部（２９）と、コンデンスレンズ（２６）を移動させてレーザー光の集光点の位置を調節するアクチュエータ（２７）と、アクチュエータ（２７）を制御する制御部（５０）とを備える。制御部（５０）は、レーザー光の位置に応じて、非点収差式光学測定部（２９）により測定された凹凸形状に基づいた制御と、コンデンスレンズ（２６）の位置を一定に維持する制御とを切り替える。
PCT/JP2008/070406 2007-12-19 2008-11-10 レーザーダイシング装置及びダイシング方法 Ceased WO2009078231A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009546186A JP5131564B2 (ja) 2007-12-19 2008-11-10 レーザーダイシング装置及びダイシング方法
US12/809,352 US8299397B2 (en) 2007-12-19 2008-11-10 Laser dicing apparatus and dicing method
KR1020107013418A KR101485451B1 (ko) 2007-12-19 2008-11-10 레이저 다이싱 장치 및 다이싱 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007327249 2007-12-19
JP2007-327249 2007-12-19

Publications (1)

Publication Number Publication Date
WO2009078231A1 true WO2009078231A1 (ja) 2009-06-25

Family

ID=40795350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070406 Ceased WO2009078231A1 (ja) 2007-12-19 2008-11-10 レーザーダイシング装置及びダイシング方法

Country Status (4)

Country Link
US (1) US8299397B2 (ja)
JP (1) JP5131564B2 (ja)
KR (1) KR101485451B1 (ja)
WO (1) WO2009078231A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110226747A1 (en) * 2010-03-16 2011-09-22 Disco Corporation Workpiece dividing method
US20120268939A1 (en) * 2010-01-20 2012-10-25 Moshe Finarov Method of laser processing
JP2015201529A (ja) * 2014-04-07 2015-11-12 株式会社ディスコ 加工方法
JP2017034123A (ja) * 2015-08-03 2017-02-09 株式会社ディスコ 密着度合検出方法
JP2019055427A (ja) * 2017-09-22 2019-04-11 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2019161232A (ja) * 2019-04-22 2019-09-19 株式会社東京精密 レーザ加工システム
JP2020146695A (ja) * 2019-03-11 2020-09-17 株式会社東京精密 レーザー加工装置及びレーザー加工方法
WO2024202744A1 (ja) * 2023-03-27 2024-10-03 パナソニックＩｐマネジメント株式会社 レーザ加工における被加工物の検査方法及び検査装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012222426B4 (de) 2012-12-06 2015-01-08 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauelement
JP6797481B2 (ja) 2017-03-01 2020-12-09 株式会社ディスコ 半導体インゴットの検査方法、検査装置及びレーザー加工装置
DE102019205847B4 (de) * 2019-04-24 2025-06-18 Infineon Technologies Ag Verfahren und Vorrichtung zur Erzeugung mindestens einer Modifikation in einem Festkörper

Citations (1)

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JP2006122982A (ja) * 2004-10-29 2006-05-18 Tokyo Electron Ltd レーザー処理装置及びレーザー処理方法

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US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
JP2005175147A (ja) 2003-12-10 2005-06-30 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びダイシング方法
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
TWI255749B (en) * 2004-12-14 2006-06-01 Cleavage Entpr Co Ltd High-power solid-state laser dicing apparatus for a gallium nitride wafer and dicing method thereof
US20080220590A1 (en) * 2007-03-06 2008-09-11 Texas Instruments Incorporated Thin wafer dicing using UV laser
JP5043630B2 (ja) * 2007-12-18 2012-10-10 株式会社ディスコ レーザー加工機
JP5231136B2 (ja) * 2008-08-22 2013-07-10 株式会社ディスコ 光デバイスウエーハの加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006122982A (ja) * 2004-10-29 2006-05-18 Tokyo Electron Ltd レーザー処理装置及びレーザー処理方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120268939A1 (en) * 2010-01-20 2012-10-25 Moshe Finarov Method of laser processing
US20110226747A1 (en) * 2010-03-16 2011-09-22 Disco Corporation Workpiece dividing method
JP2015201529A (ja) * 2014-04-07 2015-11-12 株式会社ディスコ 加工方法
JP2017034123A (ja) * 2015-08-03 2017-02-09 株式会社ディスコ 密着度合検出方法
CN106409710A (zh) * 2015-08-03 2017-02-15 株式会社迪思科 密接程度检测方法
JP2019055427A (ja) * 2017-09-22 2019-04-11 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2020146695A (ja) * 2019-03-11 2020-09-17 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP7308396B2 (ja) 2019-03-11 2023-07-14 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2019161232A (ja) * 2019-04-22 2019-09-19 株式会社東京精密 レーザ加工システム
WO2024202744A1 (ja) * 2023-03-27 2024-10-03 パナソニックＩｐマネジメント株式会社 レーザ加工における被加工物の検査方法及び検査装置

Also Published As

Publication number Publication date
KR20100102120A (ko) 2010-09-20
JPWO2009078231A1 (ja) 2011-04-28
US20110163079A1 (en) 2011-07-07
JP5131564B2 (ja) 2013-01-30
KR101485451B1 (ko) 2015-01-23
US8299397B2 (en) 2012-10-30

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