WO2009078126A1 - 真空内溶接処理装置 - Google Patents

真空内溶接処理装置 Download PDF

Info

Publication number
WO2009078126A1
WO2009078126A1 PCT/JP2008/003447 JP2008003447W WO2009078126A1 WO 2009078126 A1 WO2009078126 A1 WO 2009078126A1 JP 2008003447 W JP2008003447 W JP 2008003447W WO 2009078126 A1 WO2009078126 A1 WO 2009078126A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum chamber
welding
treatment apparatus
moving
vacuum
Prior art date
Application number
PCT/JP2008/003447
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kazuhisa Momose
Original Assignee
Akim Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007322690A external-priority patent/JP4130218B1/ja
Priority claimed from JP2008130371A external-priority patent/JP5467257B2/ja
Application filed by Akim Corporation filed Critical Akim Corporation
Publication of WO2009078126A1 publication Critical patent/WO2009078126A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/06—Resistance welding; Severing by resistance heating using roller electrodes
    • B23K11/061—Resistance welding; Severing by resistance heating using roller electrodes for welding rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/0006—Resistance welding; Severing by resistance heating the welding zone being shielded against the influence of the surrounding atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B23K11/0033—Welding locally a thin plate to a large piece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/06—Resistance welding; Severing by resistance heating using roller electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/36—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2008/003447 2007-12-14 2008-11-25 真空内溶接処理装置 WO2009078126A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-322690 2007-12-14
JP2007322690A JP4130218B1 (ja) 2007-12-14 2007-12-14 真空内溶接処理装置
JP2008130371A JP5467257B2 (ja) 2008-05-19 2008-05-19 真空内溶接処理装置
JP2008-130371 2008-05-19

Publications (1)

Publication Number Publication Date
WO2009078126A1 true WO2009078126A1 (ja) 2009-06-25

Family

ID=40795250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003447 WO2009078126A1 (ja) 2007-12-14 2008-11-25 真空内溶接処理装置

Country Status (2)

Country Link
TW (1) TWI414392B (zh)
WO (1) WO2009078126A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013086162A (ja) * 2011-10-21 2013-05-13 Akim Kk 溶接方法および装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056474B (zh) * 2013-01-08 2014-11-26 浙江新劲空调设备有限公司 真空焊接装置以及真空焊接控制装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05245649A (ja) * 1992-03-10 1993-09-24 Kobe Steel Ltd 真空シーム溶接装置
JPH0919772A (ja) * 1995-07-04 1997-01-21 Origin Electric Co Ltd パラレルシーム接合装置およびパラレルシーム接合方法
JP2002359311A (ja) * 2001-06-01 2002-12-13 Origin Electric Co Ltd シーム接合方法及び装置
JP2003046011A (ja) * 2001-07-31 2003-02-14 Nippon Avionics Co Ltd シーム溶接装置
JP2003053550A (ja) * 2001-08-20 2003-02-26 Nippon Dempa Kogyo Co Ltd 水晶振動子のシーム溶接装置
JP2005005543A (ja) * 2003-06-13 2005-01-06 Nippon Avionics Co Ltd 真空チャンバ内の位置決め機構
JP2006114710A (ja) * 2004-10-15 2006-04-27 Nippon Avionics Co Ltd パッケージの封止方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631711A (en) * 2002-08-29 2006-09-16 Nippon Light Metal Co Method of joining members, method of joining metallic members, radiation member, process for manufacturing the same, jig for the manufacturing and heat sink

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05245649A (ja) * 1992-03-10 1993-09-24 Kobe Steel Ltd 真空シーム溶接装置
JPH0919772A (ja) * 1995-07-04 1997-01-21 Origin Electric Co Ltd パラレルシーム接合装置およびパラレルシーム接合方法
JP2002359311A (ja) * 2001-06-01 2002-12-13 Origin Electric Co Ltd シーム接合方法及び装置
JP2003046011A (ja) * 2001-07-31 2003-02-14 Nippon Avionics Co Ltd シーム溶接装置
JP2003053550A (ja) * 2001-08-20 2003-02-26 Nippon Dempa Kogyo Co Ltd 水晶振動子のシーム溶接装置
JP2005005543A (ja) * 2003-06-13 2005-01-06 Nippon Avionics Co Ltd 真空チャンバ内の位置決め機構
JP2006114710A (ja) * 2004-10-15 2006-04-27 Nippon Avionics Co Ltd パッケージの封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013086162A (ja) * 2011-10-21 2013-05-13 Akim Kk 溶接方法および装置

Also Published As

Publication number Publication date
TW200932414A (en) 2009-08-01
TWI414392B (zh) 2013-11-11

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